A wall repair compound useful for filling and repairing cracks, holes, and other imperfections in a wall surface includes a conventional filler material, a conventional binder material, and a dust reducing additive which reduces the quantity of airborne
dust particles generated when sanding the hardened
joint compound. Airborne dust reducing additives include oils, surfactants, solvents, waxes, and other
petroleum derivatives. The additive can be added to conventional ready-mixed joint compounds and to setting type joint compounds. A method of reducing the quantity of airborne dust generated when sanding a fully hardened
joint compound includes mixing a sufficient quantity of the dust reducing additive with the
joint compound prior to when the joint compound has been applied to the wall.