Current sensor

Abstract

An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one or more magnetic field sensing elements, with the first surface being proximate to the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit in a flip-chap arrangement. The current sensor can also include an electromagnetic shield disposed between the current conductor portion and the magnetic field sensing elements.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is a Continuation-in-Part application of and claims the benefit under 35 U.S.C. §120 of U.S. application Ser. No. 11 / 401,160 filed on Apr. 10, 2006, which is a Continuation-in-Part application of and claims the benefit under 35 U.S.C. § 120 of U.S. application Ser. No. 11 / 336,602 filed on Jan. 20, 2006, which is a Continuation-in-Part application of and claims the benefit under 35 U.S.C. §120 of U.S. application Ser. No. 11 / 144,970 filed on Jun. 3, 2005, which is a Continuation-in-Part application of and claims the benefit under 35 U.S.C. §120 of U.S. application Ser. No. 11 / 140,250 filed on May 27, 2005 (now U.S. Pat. No. 6,995,315, issued Feb. 7, 2006), which is a Continuation-in-Part application of and claims the benefit under 35 U.S.C. §120 of U.S. application Ser. No. 10 / 649,450 filed on Aug. 26, 2003, which applications are incorporated herein by reference in their entirety.STATEMENT REGARDING FEDERALLY SPONSORED ...

AI Technical Summary

Benefits of technology

[0010] In accordance with another aspect of the present invention, a current sensor includes a lead frame having a plurality of leads, and a substrate having first and second opposing surfaces. One or more magnetic field transducers are disposed on the first surface of the substrate. The current sensor also includes an electromagnetic shield disposed proximate to the one or more magnetic field transducers. The electromagnetic shield has at least one feature selected to reduce an eddy current induced in the electromagnetic shield.

Problems solved by technology

Such devices tend to be undesirably large, both in terms of height and circuit board area.

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