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Current sensor

a current sensor and current sensor technology, applied in the field of miniatures, can solve the problems of undesired device size, height and circuit board area, and achieve the effect of reducing eddy curren

Inactive Publication Date: 2006-10-05
ALLEGRO MICROSYSTEMS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0010] In accordance with another aspect of the present invention, a current sensor includes a lead frame having a plurality of leads, and a substrate having first and second opposing surfaces. One or more magnetic field transducers are disposed on the first surface of the substrate. The current sensor also includes an electromagnetic shield disposed proximate to the one or more magnetic field transducers. The electromagnetic shield has at least one feature selected to reduce an eddy current induced in the electromagnetic shield.

Problems solved by technology

Such devices tend to be undesirably large, both in terms of height and circuit board area.

Method used

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Embodiment Construction

[0039] Referring to FIG. 1, an exemplary current sensor 10 in accordance with the present invention includes a lead frame 12 having a plurality of leads 12a-12h. The leads 12a and 12b are coupled to the leads 12c and 12d to form a current path, or current conductor with a narrow portion 14 having a width w1. The current sensor 10 also includes a substrate 16 having a first surface 16a and a second, opposing surface 16b. The substrate 16 has a magnetic field transducer 18 which, in some embodiments, can be a Hall effect element 18, diffused into the first surface 16a, or otherwise disposed on the first surface 16a. The substrate 16 can be comprised of a semiconductor material, e.g., silicon, or, in an alternate embodiment, the substrate 16 can be comprised of an insulating material.

[0040] The substrate 16 is disposed above the lead frame 12 so that the first surface 16a is proximate to the current conductor portion 14 and the second surface 16b is distal from the current conductor p...

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Abstract

An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one or more magnetic field sensing elements, with the first surface being proximate to the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit in a flip-chap arrangement. The current sensor can also include an electromagnetic shield disposed between the current conductor portion and the magnetic field sensing elements.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is a Continuation-in-Part application of and claims the benefit under 35 U.S.C. §120 of U.S. application Ser. No. 11 / 401,160 filed on Apr. 10, 2006, which is a Continuation-in-Part application of and claims the benefit under 35 U.S.C. § 120 of U.S. application Ser. No. 11 / 336,602 filed on Jan. 20, 2006, which is a Continuation-in-Part application of and claims the benefit under 35 U.S.C. §120 of U.S. application Ser. No. 11 / 144,970 filed on Jun. 3, 2005, which is a Continuation-in-Part application of and claims the benefit under 35 U.S.C. §120 of U.S. application Ser. No. 11 / 140,250 filed on May 27, 2005 (now U.S. Pat. No. 6,995,315, issued Feb. 7, 2006), which is a Continuation-in-Part application of and claims the benefit under 35 U.S.C. §120 of U.S. application Ser. No. 10 / 649,450 filed on Aug. 26, 2003, which applications are incorporated herein by reference in their entirety.STATEMENT REGARDING FEDERALLY SPONSORED ...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L23/495
CPCG01R1/18G01R15/202H01L2924/1306G01R15/207H01L23/552H01L24/36H01L24/40H01L24/73H01L24/91H01L2224/48247H01L2224/73221H01L2924/01013H01L2924/01015H01L2924/01029H01L2924/01033H01L2924/01074H01L2924/01079H01L2924/01082H01L2924/01322H01L2924/14H01L2924/3025H01L24/48H01L2924/01005H01L2924/01006H01L2924/01024H01L2924/01047H01L2924/014H01L2924/00H01L2224/40095H01L2924/181H01L2224/40245H01L2224/4826H01L2224/73215H01L2924/00014H01L2224/37147H01L24/37H01L24/41H01L2224/3769H01L2224/37686H01L2924/00012H01L2224/45099H01L2224/45015H01L2924/207H01L2224/84G01R15/20H10N52/00
Inventor TAYLOR, WILLIAMPDOOGUE, MICHAEL C.SHARMA, NIRMALGAGNON, JAYMANGTANI, VIJAY
Owner ALLEGRO MICROSYSTEMS INC
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