Refrigeration assembly and refrigerator

By employing the bidirectional temperature control characteristics of semiconductor cooling chips and the design of heat insulation plates in the refrigerator, the problems of low space utilization and high energy consumption in existing refrigerator defrosting technology have been solved, achieving efficient defrosting and improved energy efficiency ratio.

CN224188842UActive Publication Date: 2026-05-01NINGBO FOTILE KITCHEN WARE CO LTD
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Patent Information

Application Number
CN202521087132.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-05-29
Publication Date
2026-05-01
Estimated Expiration
2035-05-29

AI Technical Summary

Technical Problem

Existing refrigerator defrosting technologies suffer from problems such as low space utilization, inflexible temperature control, high energy consumption, and heat load interference. In particular, microwave defrosting and electric heating element defrosting require additional heat dissipation and insulation devices, which increase costs and affect the refrigeration temperature.

Method used

It utilizes the bidirectional temperature control characteristics of semiconductor cooling chips, using the heating side to provide heat to the defrosting chamber for defrosting, and the cooling side to recover cold energy from the cold air duct. Combined with heat insulation plates and controllers to control the operation of semiconductor cooling chips, it forms an independent defrosting chamber and cold storage chamber structure.

Benefits of technology

It improves the refrigerator's energy efficiency ratio, simplifies the structural design, reduces the heat load, and achieves flexible temperature control and an efficient defrosting process.

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Abstract

According to the refrigeration assembly and the refrigerator, the refrigeration assembly comprises a refrigeration inner container, an air duct assembly, a refrigeration evaporator and a semiconductor chilling plate, the refrigeration inner container is provided with a first refrigeration chamber, an unfreezing chamber and a second refrigeration chamber, and the unfreezing chamber is arranged between the first refrigeration chamber and the second refrigeration chamber; a return air inlet and a first air outlet are formed in the part, where the first refrigerating chamber is located, of the refrigerating liner, and a second air outlet is formed in the part, where the second refrigerating chamber is located, of the refrigerating liner; the air duct assembly is provided with a refrigeration air duct communicating with the air return opening, the first air outlet and the second air outlet. The semiconductor chilling plate is arranged at the position, where the unfreezing chamber is located, of the refrigerating inner container and provided with a heating face and a refrigerating face, the heating face faces the unfreezing chamber and is used for providing heat for the unfreezing chamber, and the refrigerating face faces the refrigerating air channel and is used for providing cold for the refrigerating air channel. In this way, the heat load of the refrigeration assembly can be reduced, and the effect of improving the energy efficiency ratio of the refrigerator with the refrigeration assembly is achieved.
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