Display panel, display module and display device

Abstract

This application discloses a display panel, a display module, and a display device. The display panel includes a display area and a non-display area, with the non-display area surrounding the outer periphery of the display area. The display panel also includes a substrate, a light-shielding layer, a driving circuit layer, a light-emitting device layer, and an encapsulation layer. The substrate has a first side and a second side disposed opposite to each other along a direction perpendicular to its thickness. The light-shielding layer is disposed on the first side of the substrate and is located in the non-display area. The driving circuit layer is disposed on the side of the light-shielding layer away from the substrate and includes metal traces located in the non-display area. The orthographic projection of the metal traces onto the substrate is located within the orthographic projection of the light-shielding layer onto the substrate. The light-emitting device layer is disposed on the side of the driving circuit layer away from the substrate and includes a plurality of spaced-apart light-emitting units located in the display area. The encapsulation layer is disposed on the side of the light-emitting device layer away from the substrate, thereby improving the performance of the display panel.

Description

Technical Field

[0001] This application belongs to the field of display technology, and in particular relates to a display panel, display module and display device. Background Technology

[0002] Organic light-emitting diode (OLED) and flat panel display devices based on light-emitting diode (LED) technologies are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body and wide range of applications, becoming the mainstream of display devices.

[0003] However, the performance of current OLED display products needs to be improved. Utility Model Content

[0004] The purpose of this application is to provide a display panel, display module, and display device that can improve the performance of the display panel.

[0005] The first aspect of this application provides a display panel, which includes a display area and a non-display area. The non-display area is arranged around the outer periphery of the display area. The display panel also includes a substrate, a light-shielding layer, a driving circuit layer, a light-emitting device layer, and an encapsulation layer. The substrate has a first side and a second side arranged opposite to each other along a direction perpendicular to its thickness. The light-shielding layer is disposed on the first side of the substrate and is located in the non-display area. The driving circuit layer is disposed on the side of the light-shielding layer away from the substrate and includes metal traces located in the non-display area. The orthographic projection of the metal traces onto the substrate is located within the orthographic projection of the light-shielding layer onto the substrate. The light-emitting device layer is disposed on the side of the driving circuit layer away from the substrate and includes a plurality of spaced-apart light-emitting units located in the display area. The encapsulation layer is disposed on the side of the light-emitting device layer away from the substrate.

[0006] In some embodiments, the display panel further includes a planarization layer disposed between the substrate and the driving circuit layer, and the planarization layer covers the light-shielding layer.

[0007] Preferably, the orthographic projection of the light-shielding layer onto the substrate lies within the orthographic projection of the planarization layer onto the substrate.

[0008] In some embodiments, the thickness of the planarization layer is greater than or equal to 8 μm and less than or equal to 10 μm.

[0009] In some embodiments, the light-shielding layer is arranged around the outer periphery of the display area.

[0010] In some embodiments, the thickness of the light-shielding layer is greater than or equal to 1 μm and less than or equal to 3 μm.

[0011] In some embodiments, the light transmittance of the light-shielding layer is less than or equal to 10. -4 .

[0012] In some embodiments, the orthographic projection of the light-shielding layer onto the substrate coincides with the orthographic projection of the non-display area onto the substrate.

[0013] In some embodiments, the substrate includes a first substrate sublayer and a second substrate sublayer, a light-shielding layer is disposed on one side of the second substrate sublayer, and the first substrate sublayer is disposed on the side of the second substrate sublayer opposite to the light-shielding layer.

[0014] Secondly, embodiments of this application also provide a display module, including a buffer layer and a display panel of any of the above embodiments, wherein the buffer layer is disposed on the second side of the substrate.

[0015] Thirdly, embodiments of this application also provide a display device, including a display module as described in any of the above embodiments or a display panel as described in any of the above embodiments.

[0016] This application provides a display panel, a display module, and a display device. A light-shielding layer is disposed between a substrate and a driving circuit layer, and the light-shielding layer is located in a non-display area. The driving circuit layer includes metal traces located in the non-display area, and the orthographic projection of the metal traces onto the substrate lies within the orthographic projection of the light-shielding layer onto the substrate. By blocking light from the second side of the display panel from illuminating the metal traces, the light-shielding layer prevents light reflection or refraction from occurring on the surface of the metal traces. This prevents reflected or refracted light from entering the light-emitting device layer and causing uneven display, thereby improving the display stability of the display panel. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A cross-sectional schematic diagram of a display panel provided in some embodiments of this application;

[0019] Figure 2 A cross-sectional schematic diagram of the display area of ​​a display panel provided in some embodiments of this application;

[0020] Figure 3 A cross-sectional schematic diagram of a display panel provided for other embodiments of this application;

[0021] Figure 4 This is a partial cross-sectional schematic diagram of a display panel provided in some embodiments of this application;

[0022] Figure 5 This is a partial cross-sectional schematic diagram of a display module provided in some embodiments of this application;

[0023] Figure 6 A cross-sectional schematic diagram of a display panel provided for some embodiments of this application;

[0024] Figure 7 This is a cross-sectional schematic diagram of a display panel provided in some embodiments of this application.

[0025] Explanation of reference numerals in the attached figures:

[0026] 1000, Display module; 100, Display panel; S1, First side; S2, Second side; AA, Display area; NA, Non-display area; 11, Substrate; 111, First substrate sublayer; 112, Second substrate sublayer; 12, Driving circuit layer; 121, Metal trace; 20, Light-emitting device layer; 21, Light-emitting unit; 22, Pixel definition layer; 221, Pixel limiting part; 222, Pixel opening; 30, Encapsulation layer; 31, First encapsulation sublayer; 32, Second encapsulation sublayer; 33, Third encapsulation sublayer; 40, Optical adhesive layer; 50, Light-shielding layer; 51, First light-shielding sublayer; 52, Second light-shielding sublayer; 53, Groove structure; 531, Groove; 60, Planarization layer; 61, First planarization part; 62, Second planarization part; 200, Cover plate; 300, Buffer layer; 310, Support part; 320, Buffer part; 500, Support layer. Detailed Implementation

[0027] The embodiments of this application will be described in further detail below with reference to the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to illustrate the principles of this application by way of example, but should not be used to limit the scope of this application, that is, this application is not limited to the described embodiments.

[0028] In the description of this application, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationships, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. "Vertical" is not vertical in the strict sense, but within the allowable tolerance range. "Parallel" is not parallel in the strict sense, but within the allowable tolerance range.

[0029] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0030] The directional terms used in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of this application. It should also be noted in the description of this application that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0031] With the rapid development of the display industry, consumers have increasingly higher requirements for the bezel design of display panels, demanding narrow bezels. However, as bezels become narrower, some film layers on the backlight side of the display panel cannot completely block the traces of the driving circuit layer located on the bezel. Ambient light incident from the backlight side of the display panel is easily reflected or refracted on the metal traces. These reflected or refracted lights interfere with the normal light in the display area, easily causing display unevenness (mura) and reducing the display stability of the display panel.

[0032] This application provides a display module, which can be an organic light-emitting diode (OLED) display module, or other types of display modules, such as micro light-emitting diode (Micro-LED) or quantum light-emitting diode (QLED) display modules.

[0033] Figure 1 A cross-sectional schematic diagram of a display panel provided in some embodiments of this application; Figure 2 This is a cross-sectional schematic diagram of the display area of ​​a display panel provided in some embodiments of this application.

[0034] Please refer to the following: Figure 1 and Figure 2The first aspect of this application provides a display panel 100, which includes a display area AA and a non-display area NA. The non-display area NA is arranged around the outer periphery of the display area AA. The display panel 100 also includes a substrate 11, a light-shielding layer 50, a driving circuit layer 12, a light-emitting device layer 20, and an encapsulation layer 30. The substrate 11 has a first side S1 and a second side S2 arranged opposite to each other along a direction perpendicular to its own thickness. The light-shielding layer 50 is disposed on the first side S1 of the substrate 11 and is located in the non-display area NA. The driving circuit layer 12 is disposed on the side of the light-shielding layer 50 away from the substrate 11. The driving circuit layer 12 includes a metal trace 121 located in the non-display area NA. The orthographic projection of the metal trace 121 onto the substrate 11 is located within the orthographic projection of the light-shielding layer 50 onto the substrate 11. The light-emitting device layer 20 is disposed on the side of the driving circuit layer 12 away from the substrate 11 and includes a plurality of spaced-apart light-emitting units 21 located in the display area AA. The encapsulation layer 30 is disposed on the side of the light-emitting device layer 20 away from the substrate 11.

[0035] The display area AA is the area in the display panel 100 that can actively emit light or display images; it is the portion of the screen output that the user directly observes. The non-display area NA is the area in the display panel 100 that does not participate in image display; it is mainly distributed around the outer periphery of the display area AA, forming a ring shape.

[0036] The substrate 11 can be a rigid substrate made of materials such as glass or plastic, or a flexible substrate made of materials such as polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide (PI), polycarbonate (PC), or cellulose acetate propionate (CAP). The first side S1 of the substrate 11 faces the side of the display panel 100 from which light is ultimately emitted and perceived by the human eye, i.e., the side from which the user directly observes the screen image. The second side S2 faces the side of the display panel 100 away from the user's viewing direction, i.e., the surface opposite to the first side S1.

[0037] The driving circuit layer 12 contains a driving circuit for controlling the light emission of the light-emitting device layer 20. The driving circuit layer 12 is generally composed of inorganic film layers such as a metal layer, a semiconductor layer (active layer), and an insulating layer 127. By patterning these inorganic film layers, a driving circuit for controlling the light emission of the light-emitting device layer 20 can be formed. There are various ways to implement the specific circuit structure, which will not be described in detail here.

[0038] The light-emitting device layer 20 may include a plurality of spaced-apart light-emitting units 21, which may include light-emitting units 21 of different colors. For example, it may include blue light-emitting units 21, red light-emitting units 21, and green light-emitting units 21 arranged at intervals. In addition, each pixel unit may also have four or more light-emitting units 21, in addition to the above three colors of light-emitting units 21, plus light-emitting units 21 of other colors such as white. Each light-emitting unit 21 includes a first electrode, a light-emitting layer, and a second electrode stacked in sequence, with the first electrode disposed on the substrate 10. The light-emitting layer includes a light-emitting material layer, a hole transport layer, and an electron transport layer, etc. When the first electrode 211 and the second electrode are energized, electrons and holes migrate from the electron transport layer and the hole transport layer to the light-emitting material layer, respectively, and meet in the light-emitting material layer to form excitons that excite the light-emitting molecules, thereby generating visible light to achieve the purpose of display. One of the first electrode and the second electrode can serve as the anode of the light-emitting layer and the other as the cathode of the light-emitting layer. In this embodiment, the first electrode is used as the anode of the light-emitting layer and the second electrode is used as the cathode of the light-emitting layer for illuminating purposes.

[0039] The light-emitting device layer 20 may further include a pixel definition layer 22, which includes a pixel limiting portion 221 and a pixel opening 222 formed by the pixel limiting portion 221, with the light-emitting unit 21 located within the pixel opening 222. The pixel limiting layer can reduce crosstalk between the light-emitting units 21 and improve the display effect of the display panel 100.

[0040] An encapsulation layer 30 is disposed on the side of the light-emitting device layer 20 facing away from the substrate 10. The encapsulation layer 30 may include a first encapsulation sub-layer 31, a second encapsulation sub-layer 32, and a third encapsulation sub-layer 33 sequentially disposed along a direction away from the substrate 10. The first and third encapsulation sub-layers 31 may include inorganic materials such as silicon oxide, silicon nitride, or silicon oxynitride, while the second encapsulation sub-layer 32 may include organic materials. The first encapsulation sub-layer 31 protects each light-emitting unit 21 from the influence of the external environment (such as air and water), preventing air and moisture from penetrating into the display panel 100 and extending the lifespan and stability of the light-emitting unit 21. The first encapsulation sub-layer 31 also prevents impurities and harmful substances from entering the display panel 100, thereby ensuring the performance and quality of the display panel 100. The organic material of the second encapsulation sub-layer 32 has unique flexibility and good adhesion. Compared with inorganic materials, organic materials can better adapt to the minute deformations that the display panel 100 may undergo under different environments, and will not experience cracking due to panel bending or thermal expansion and contraction. The combination of multiple encapsulation film layers, namely the first encapsulation sublayer 31, the second encapsulation sublayer 32, and the third encapsulation sublayer 33, further improves the encapsulation effect of the display panel 100.

[0041] A light-shielding layer 50 can be first formed on the first side S1 of the substrate 11, corresponding to the non-display area NA, and then the driving circuit layer 12 can be formed. The metal traces 121 of the driving circuit layer 12 located in the non-display area NA may include GIP (Gate In Panel) traces. In narrow-bezel display devices, some film layers (e.g., buffer layer 300) on the second side S2 of the display panel 100 cannot completely cover the GIP traces. When strong external light shines from the second side S2 onto the not completely blocked GIP traces, the trace surface will reflect light. This reflected light may penetrate other film layers of the display panel 100 and interfere with the normal light in the display area AA. The reflected light may affect the electric field distribution or signal transmission inside the display panel 100. For example, the light reflected by the metal traces 121 may generate additional photogenerated carriers inside the display panel 100, interfering with the normal operation of the driving circuit and causing abnormal fluctuations in the driving voltage or current of the pixels. This abnormal fluctuation will cause uneven distribution of brightness and color in the AA area of ​​the screen display, forming a visible mura (scar). Since the GIP traces are usually distributed along the Gate signal transmission direction (G direction), the resulting mura will also show a regular distribution along the G direction.

[0042] The light-shielding layer 50 is disposed on the first side S1 of the substrate 11 (i.e., the side closer to the user's observation area) and is located only in the non-display area NA. The light-shielding layer 50 does not cover the display area AA, thus avoiding affecting the light output of the display area AA. The light-shielding layer 50 can be fabricated using a PVD process. PVD (Physical Vapor Deposition) is a technique that transfers material from a solid source to the surface of a substrate through physical processes (such as evaporation, sputtering, etc.) to form a thin film.

[0043] The essence of PVD (Polyvinyl Dioxide) technology is to transform a solid target material (coating material) into gaseous particles (atoms, molecules, or ions) through energy excitation in a vacuum environment. These particles are transported in the gas phase and deposited onto the surface of a substrate (such as the substrate 11 or film layer of the display panel 100), condensing to form a thin film. The entire process does not involve chemical reactions; the transfer of materials and film formation are achieved solely through changes in physical states. PVD-prepared films have high purity and good density, and their thickness (from a few nm to several μm) and properties (such as resistivity, transmittance, and hardness) can be precisely controlled through process parameters (such as vacuum level, power, and temperature).

[0044] The orthographic projection of the metal traces 121 (such as GIP traces) located in the non-display area NA of the driving circuit layer 12 onto the substrate 11 falls entirely within the orthographic projection range of the light-shielding layer 50 onto the substrate 11. That is, viewed from the second side S2 direction of the substrate 11, the metal traces 121 are completely covered by the light-shielding layer 50, and there is no exposed area.

[0045] Since the metal trace 121 is completely covered by the light-shielding layer 50, ambient light incident from the second side S2 is blocked by the light-shielding layer 50 and cannot reach the surface of the metal trace 121. This avoids reflection or refraction of light on the trace and solves the G-direction Mura problem caused by insufficient shielding by the film layer (such as SCF). After the reflected light is blocked, the metal trace 121 will not generate additional photogenerated carriers due to illumination. The electric field distribution and signal transmission (such as gate drive signal) of the driving circuit remain stable, and the driving voltage and current of the pixel will not fluctuate abnormally.

[0046] In summary, the embodiments of this application use the light-shielding layer 50 to block the light from the second side S2 of the display panel 100 from shining onto the metal trace 121, preventing light reflection or refraction from occurring on the surface of the metal trace 121. This prevents reflected or refracted light from entering the light-emitting device layer 20 and causing uneven display, thereby improving the display stability of the display panel 100.

[0047] Figure 3 This is a cross-sectional schematic diagram of a display panel provided for other embodiments of this application.

[0048] like Figure 3 As shown, in some embodiments, the light-shielding layer 50 may include a first light-shielding sub-layer 51 and a second light-shielding sub-layer 52 sequentially disposed along a direction away from the substrate 11. The first light-shielding sub-layer 51 and the second light-shielding sub-layer 52 are made of different materials. The first light-shielding sub-layer 51 may be a metal light-shielding layer 50 (such as a chromium or nickel alloy), and the second light-shielding sub-layer 52 may be a black organic light-shielding layer 50 (such as black photoresist). The first light-shielding sub-layer 51 is prepared by a PVD process and is used to reflect ambient light; the second light-shielding sub-layer 52 is prepared by a coating process and is used to absorb residual light not reflected by the metal layer. Together, they ensure that the overall OD value of the light-shielding layer 50 is ≥5 (transmittance ≤10). -5 ).

[0049] The composite structure of the first light-shielding sub-layer 51 and the second light-shielding sub-layer 52 combines the high reflectivity of metallic materials and the high absorption rate of organic materials. Compared with the single-material light-shielding layer 50, it can further improve the light-shielding performance at the same thickness, and is especially suitable for strong light environments (such as outdoor display devices). At the same time, the metal layer can enhance the adhesion between the light-shielding layer 50 and the substrate 11 and reduce the risk of peeling.

[0050] In some embodiments, the first encapsulation sublayer 31 and the third encapsulation sublayer 33 of the encapsulation layer 30 extend toward the non-display area NA, covering the edge region of the light-shielding layer 50, and forming a tightly fitted sealed structure with the light-shielding layer 50; by utilizing the high barrier properties of the inorganic material (such as silicon nitride) of the encapsulation layer 30, moisture and oxygen are further prevented from intruding into the light-shielding layer 50 from the edge of the non-display area NA, avoiding degradation of the light-shielding material (such as the organic layer) due to moisture, and extending the effective period of the light-shielding performance.

[0051] Figure 4 This is a partial cross-sectional schematic diagram of a display panel provided in some embodiments of this application. For example... Figure 4 As shown, in some embodiments, the light-shielding layer 50 has a groove structure 53 near the edge of the display area AA. The groove structure 53 includes multiple spaced grooves 531 arranged in a sawtooth or corrugated pattern, and the groove structure 53 is located on the side of the light-shielding layer 50 facing away from the substrate 11. The groove structure 53 can be fabricated using a nanoimprint lithography process. The groove structure 53 can reduce diffuse reflection caused by direct light at the edge of the light-shielding layer 50 near the display area AA, prevent stray light from intruding into the sub-pixels at the edge of the display area AA, and further reduce the Mura phenomenon.

[0052] Figure 5 This is a partial cross-sectional schematic diagram of a display module provided in some embodiments of this application.

[0053] like Figure 5 As shown, optionally, a cover plate 200 can be provided on the side of the encapsulation layer 30 facing away from the substrate 11. In this embodiment, the cover plate 200 can be a curved cover plate 200, adapted to the curved shape of the display panel 100. The cover plate 200 has a physical protective function, which can resist scratches and impacts during daily use and protect the display panel 100 from external damage. In terms of bonding process, the curved cover plate 200 is tightly bonded to the display panel 100, which helps to reduce optical interference caused by air layer and improve the clarity and contrast of the displayed image.

[0054] like Figure 1 As shown, in some embodiments, the display panel 100 further includes a planarization layer 60, which is disposed between the substrate 11 and the driving circuit layer 12, and the planarization layer 60 covers the light-shielding layer 50.

[0055] Since there is a step (i.e. "step difference") between the light-shielding layer 50 and the substrate 11 in the direction perpendicular to the substrate 11, the planarization layer 60 fills the unevenness between the surface of the light-shielding layer 50 and the surface of the substrate 11 by coating a fluid material (such as organic resin), and finally forms a smooth and flat surface, providing a uniform substrate for the subsequent fabrication of the driving circuit layer 12.

[0056] The planarization layer 60 fills the step gaps to keep the substrate of the drive circuit layer 12 highly flat, ensuring that the line width and thickness of the metal traces 121 are consistent, and reducing the risk of abnormal circuit signal transmission (such as voltage loss caused by uneven resistance).

[0057] Preferably, the orthographic projection of the light-shielding layer 50 onto the substrate 11 lies within the orthographic projection of the planarization layer 60 onto the substrate 11.

[0058] The edge of the light-shielding layer 50 may be flush with the edge of the planarization layer 60, or the edge of the planarization layer 60 may extend beyond the edge of the light-shielding layer 50.

[0059] If the planarization layer 60 does not completely cover the edge of the light-shielding layer 50, the steps at the edge of the light-shielding layer 50 may be exposed. When the orthographic projection of the light-shielding layer 50 is completely contained by the planarization layer 60, the planarization layer 60 can fully fill the steps at the edge of the light-shielding layer 50, ensuring that the substrate (surface of the planarization layer 60) of the entire driving circuit layer 12 is completely flat, avoiding problems such as thin film breakage and short circuit of the driving circuit layer 12 due to local uncovering.

[0060] In some embodiments, the thickness of the planarization layer 60 is greater than or equal to 8 μm and less than or equal to 10 μm.

[0061] The thickness of planarization layer 60 refers to the thickness of the portion of planarization layer 60 that does not cover the light-shielding layer 50.

[0062] Figure 6 This is a cross-sectional schematic diagram of a display panel provided in some embodiments of this application. For example... Figure 6 As shown, the planarization layer 60 can be divided into two parts: a first planarization portion 61 and a second planarization portion 62. The orthographic projection of the first planarization portion 61 onto the substrate 11 does not overlap with the orthographic projection of the light-shielding layer 50 onto the substrate 11, while the orthographic projection of the light-shielding layer 50 onto the substrate 11 at least partially overlaps with the orthographic projection of the second planarization portion 62 onto the substrate 11. That is, the first planarization portion 61 is located directly above the substrate 11 and does not overlap with the light-shielding layer 50, while the second planarization portion 62 is located directly above the light-shielding layer 50. The thickness of the planarization layer 60 refers to the dimension of the first planarization portion along the direction perpendicular to the substrate 11.

[0063] The thickness of the planarization layer 60 can be any thickness from 8μm to 10μm, for example, the thickness of the planarization layer 60 can be 8μm, 8.5μm, 9μm, 9.5μm, 10μm, etc.

[0064] If the thickness of the planarization layer 60 is less than 8μm, insufficient filling may lead to local voids or thinning, affecting flatness; if the thickness of the planarization layer 60 exceeds 10μm, it will result in the overall thickness of the display panel 100 being too thick, making it difficult to achieve the thinning design of the display panel 100.

[0065] The planarization layer 60 in this embodiment has a thickness of 8μm-10μm, which can ensure the flatness of the planarization layer 60 without excessively occupying the space of the display panel 100, thus facilitating the thinning design of the display panel 100.

[0066] In some embodiments, the light-shielding layer 50 is formed using a conductive black material. A via is provided in the planarization layer 60 in a direction perpendicular to the substrate 11. The light-shielding layer 50 is connected to the ground terminal of the driving circuit layer 12 through the via. The light-shielding layer 50 forms a continuous conductive network in the non-display area NA, covering all metal traces 121 areas, thereby improving the electrostatic protection level, reducing the impact of electrostatic discharge on the performance of the display panel 100, and without affecting the optical performance of the light-shielding layer 50.

[0067] In some embodiments, the light-shielding layer 50 is arranged around the outer periphery of the display area AA.

[0068] Metal traces 121, such as GIP, are generally distributed throughout the non-display area NA. For example, metal traces 121 are present at the top, bottom, and sides of the display panel 100. If the light-shielding layer 50 is only partially provided and does not surround the outer perimeter of the display area AA, the uncovered areas may still experience reflected light due to the exposure of the metal traces 121, affecting the display effect.

[0069] The surround design of the light-shielding layer 50 in this embodiment ensures that all metal traces 121 in the frame area are covered by the light-shielding layer 50. Regardless of which direction the ambient light enters from the second side S2 (such as strong front light or side sunlight), it can be completely blocked, thus eliminating the problem of uneven display caused by local light leakage in space.

[0070] In some embodiments, the thickness of the light-shielding layer 50 is greater than or equal to 1 μm and less than or equal to 3 μm.

[0071] The thickness of the light-shielding layer 50 can be any thickness from 1μm to 3μm, for example, the thickness of the light-shielding layer 50 can be 1μm, 1.2μm, 1.5μm, 2μm, 2.5μm or 3μm, etc.

[0072] The thickness of the light-shielding layer 50 refers to the dimension of the light-shielding layer 50 along the direction perpendicular to the substrate 11. If the thickness of the light-shielding layer 50 is less than 1 μm, uneven material coating may cause local light transmission (such as pinhole defects), reducing the light-shielding effect; if the thickness of the light-shielding layer 50 exceeds 3 μm, although the light-shielding performance is further improved, it will increase the filling pressure of the subsequent planarization layer 60 (a thicker planarization layer 60 is required to eliminate step differences), and it is not convenient for the thinning design of the display panel 100.

[0073] The thickness of the light-shielding layer 50 in this embodiment is moderate, which can ensure the light-shielding effect of the light-shielding layer 50 without taking up too much space in the display panel 100, thus facilitating the thinning design of the display panel 100.

[0074] In some embodiments, the light transmittance of the light-shielding layer 50 is less than or equal to 10. -4 .

[0075] Transmittance is a physical indicator that measures the ability of a material or object to allow light to pass through it. It describes the proportion of light that remains after passing through a medium.

[0076] In some embodiments, the orthographic projection of the light-shielding layer 50 onto the substrate 11 coincides with the orthographic projection of the non-display area NA onto the substrate 11. Transmittance is often used in conjunction with optical density (OD value). The OD value is another expression of a material's light-shielding ability, and the two are inversely proportional. The higher the OD value, the lower the transmittance and the stronger the light-shielding effect.

[0077] Transmittance can be measured using equipment such as a spectrophotometer, transmittance meter, or haze meter. For example, when using a spectrophotometer for detection, the bonding state between the light-shielding layer 50 and the substrate 11 can be simulated to simulate an actual use scenario, or the film layer can be peeled off separately for detection. The sample is placed on the sample stage, the detection wavelength range is selected, and the spectrophotometer automatically measures the transmitted light intensity at different wavelengths and calculates the transmittance, generating a spectral transmittance curve or average value.

[0078] The light transmittance of the light-blocking layer 50 is "less than or equal to 10" -4 "(i.e., ≤0.01%)" is the core indicator for measuring its light-blocking performance, meaning that no more than 0.01% of light can penetrate the light-blocking layer. This extremely low transmittance corresponds to an optical density (OD value) typically ≥4. When transmittance = 10... -4 When OD=4), it means that the light-blocking layer 50 has a very strong ability to absorb or block light.

[0079] The core function of the light-shielding layer 50 is to prevent ambient light (such as strong light or sunlight) from the second side S2 from shining onto the metal traces 121 (such as GIP traces) in the non-display area NA. When the light transmittance is ≤10... -4 At that time, the amount of light that penetrates the light-shielding layer 50 to reach the metal trace 121 is almost negligible, which fundamentally avoids the reflection or refraction of light on the trace.

[0080] This directly eliminates problems such as interference between reflected light and normal light in the display area AA, and interference of photogenerated carriers with the driving signal, ensuring stable pixel driving voltage and current, completely solving the G-direction Mura phenomenon, and further improving the display stability of the display panel 100.

[0081] Figure 7 This is a cross-sectional schematic diagram of a display panel provided in some embodiments of this application.

[0082] like Figure 7As shown, in some embodiments, the substrate 11 includes a first substrate sublayer 111 and a second substrate sublayer 112, a light-shielding layer 50 is disposed on one side of the second substrate sublayer 112, and the first substrate sublayer 111 is disposed on the side of the second substrate sublayer 112 opposite to the light-shielding layer 50.

[0083] The first substrate sublayer 111 is located below the second substrate sublayer 112. The first substrate sublayer 111 and the second substrate sublayer 112 can be made of different materials or the same materials. For example, the first substrate sublayer 111 uses a rigid material to enhance support, while the second substrate sublayer 112 uses a flexible material to improve adhesion. For example, the first substrate sublayer 111 uses glass or a high-strength polymer to provide overall rigidity, while the second substrate sublayer 112 uses polyimide (PI) to improve adhesion to the light-shielding layer 50, ensuring that the substrate 11 is not easily deformed and avoiding brittleness caused by an excessively hard single-layer material.

[0084] Alternatively, both the first substrate sublayer 111 and the second substrate sublayer 112 can be made of polyimide material. The thickness of a single-layer PI is usually limited by the process (e.g., excessive coating thickness can easily lead to uneven curing), while double-layer PI can achieve a controllable total thickness and stable performance through stacking. This can not only meet the support strength requirements of the substrate 11, but also have better bending resistance than a single-layer PI of the same thickness (the stress distribution of the double-layer structure is more uniform, which can reduce the risk of local fracture).

[0085] The second substrate sublayer 112 (the PI layer in direct contact with the light-shielding layer 50) can have its interfacial adhesion to the light-shielding layer 50 improved through surface modification (such as plasma treatment or coating with an adhesion promoter). Due to the good chemical compatibility between PI and the light-shielding layer 50 (such as a black organic light-shielding material), the risk of interlayer delamination can be reduced, ensuring that the light-shielding layer 50 does not detach during long-term use. The smooth surface of the double-layer PI (especially the second substrate sublayer 112) can prevent pinholes and bubbles caused by uneven substrates during the coating of the light-shielding layer 50, ensuring uniform thickness of the light-shielding layer 50 and thus ensuring a light transmittance ≤10%. -4 The design indicators have been consistently met.

[0086] When the substrate 11 is made of polyimide, the light-shielding layer 50 can be formed using polyimide resin doped with carbon black particles. By coating a light-shielding layer 50 with the same composition (polyimide) as the substrate 11, the mechanical and thermal properties of the light-shielding layer 50 are highly matched with those of the substrate 11. When the flexible panel is repeatedly bent (such as in a folding screen), it can deform synchronously with the substrate 11 without cracking, thus preventing local light transmission problems caused by easy breakage of the wall surface during bending, and ensuring stable light-shielding effect in the folded state.

[0087] like Figure 5As shown, in a second aspect, this application embodiment also provides a display module 1000, including a buffer layer 300 and a display panel 100 of any of the above embodiments, wherein the buffer layer 300 is disposed on the second side S2 of the substrate 11.

[0088] The buffer layer 300 may include a support portion 310 and a buffer portion 320, with the support portion 310 disposed between the display panel 100 and the buffer portion 320. The support portion 310 is directly attached to the second side S2 of the substrate 11, and the support portion 310 may be made of copper foil, which has rigidity and conductivity.

[0089] The buffer section 320 can be made of materials such as foam or silicone. For example, polyurethane foam is lightweight and has excellent cushioning performance. Its porous structure allows it to absorb energy through the compression and rebound of its pores when subjected to external forces, thus effectively buffering stress. Silicone has good elasticity and flexibility, and its Shore hardness range is relatively wide. When faced with external impact, silicone can effectively absorb and disperse stress through its own elastic deformation.

[0090] The buffer portion 320 has high elasticity and deformation capability, which can absorb external impact force (such as drop or squeeze) and reduce the direct transmission of external force to the substrate 11 of the display panel 100, so as to prevent the substrate 11, the light shielding layer 50 or the driving circuit layer 12 from cracking or peeling due to mechanical stress.

[0091] The rigidity of the support portion 310 enhances the overall structural strength of the display panel 100, especially in narrow bezel designs, preventing the panel edges from bending and deforming due to insufficient support, and protecting the metal traces 121 (such as GIP traces) in the non-display area NA from mechanical damage. If the display module 1000 requires grounding or electrostatic protection, the copper foil can serve as a conductive path to conduct static electricity to the outside, protecting the sensitive drive circuit layer 12 from electrostatic breakdown and improving the electrical reliability of the module.

[0092] Optionally, the outer edge of the buffer layer 300 extends beyond the outer edge of the display panel 100, and the orthographic projection of the display panel 100 onto the substrate 11 lies within the orthographic projection of the buffer layer 300 onto the substrate 11. In other words, the area of ​​the buffer layer 300 is larger than the area of ​​the display panel 100, which can further ensure the support and buffering effect of the buffer layer 300 on the display panel.

[0093] To achieve a narrow bezel for the display panel 100, the buffer layer 300 does not completely cover the metal traces 121 of the driving circuit layer 12 in the non-display area NA. The light-shielding layer 50 of this embodiment can precisely compensate for this deficiency, blocking the metal traces 121 not covered by the buffer layer 300, thereby preventing light reflection or refraction on the surface of the metal traces 121. The reflected or refracted light entering the light-emitting device layer 20 would cause uneven display, thus improving the display stability of the display panel 100.

[0094] In some embodiments, the display module 1000 further includes an optical adhesive layer 40 disposed between the display panel 100 and the cover plate 200.

[0095] An optical adhesive layer 40 is disposed on the side of the polarizing layer opposite to the display panel 100. The optical adhesive layer 40 firmly bonds the display panel 100 and the cover plate 200 together, forming a stable structure for the entire display module 1000. It fills the tiny gaps between them, ensuring a tight fit and preventing loosening of components due to external impacts or long-term use, thereby improving the reliability and durability of the display module 1000. The optical adhesive can have an optical refractive index that matches that of the display panel 100 and the cover plate 200, effectively reducing light reflection at the interface between different media. When light is emitted from the display panel 100, passes through the optical adhesive layer 40, and reaches the cover plate 200, the reflection of light is significantly reduced due to the refractive index transition of the optical adhesive layer 40. More light can pass through the cover plate 200 and reach the human eye, thereby improving the screen's transmittance and making the image appear brighter and clearer.

[0096] In some embodiments, the display module 1000 further includes a support layer 500 disposed between the display panel 100 and the buffer layer 300.

[0097] The support layer 500 is located between the display panel 100 and the buffer layer 300. It is typically made of a material with a certain strength and rigidity, such as high-strength plastic, thin metal sheet, or composite material. The support layer 500 directly supports the display panel 100 and works in conjunction with the buffer layer 300 to provide a stable structure for the display module 1000. The support layer 500 effectively improves the overall structural strength of the display module 1000, allowing it to maintain a stable shape and structure under external forces. For example, in mobile devices such as mobile phones and tablets, the support layer 500 ensures that the display module 1000 can withstand a certain degree of external force without damage during daily use, such as when held, placed, or accidentally dropped, thereby extending the lifespan of the display module 1000. Because the support layer 500 directly contacts and supports the display panel 100, it prevents the display panel 100 from cracking or pixel damage due to excessive localized stress. Especially for some thin and light display panels 100, the support layer 500 plays a more important role in preventing damage during assembly and use, ensuring the normal display function of the display panel 100, and improving display quality.

[0098] Thirdly, this application also provides a display device, including a display module 1000 as described in any of the above embodiments or a display panel 100 as described in any of the above embodiments. Since this display device employs all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated upon here.

[0099] The display device can be any device with display function, such as mobile devices such as mobile phones, tablets, laptops, handheld computers, in-vehicle electronic devices, wearable devices, ultra-mobile personal computers (UMPCs), netbooks, or personal digital assistants (PDAs), as well as non-mobile devices such as personal computers (PCs), televisions (TVs), ATMs, or self-service machines.

[0100] While the embodiments disclosed in this application are as described above, the content is merely for the purpose of facilitating understanding of this application and is not intended to limit the invention. Any person skilled in the art to which this application pertains may make any modifications and changes in form and detail of the implementation without departing from the spirit and scope disclosed in this application; however, the scope of protection of this application shall still be determined by the scope defined in the appended claims.

[0101] The above description is merely a specific embodiment of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, substitutions for other connection methods described above can be made by referring to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application.

Claims

1. A display panel, characterized in that, The display panel includes a display area and a non-display area, wherein the non-display area is arranged around the outer periphery of the display area, and the display panel further includes: A substrate having a first side and a second side disposed opposite to each other along a direction perpendicular to its own thickness; A light-shielding layer is disposed on a first side of the substrate and is located in the non-display area; A driving circuit layer is disposed on the side of the light-shielding layer away from the substrate. The driving circuit layer includes metal traces located in the non-display area. The orthographic projection of the metal traces on the substrate is located within the orthographic projection of the light-shielding layer on the substrate. A light-emitting device layer is disposed on the side of the driving circuit layer away from the substrate. The light-emitting device layer includes a plurality of spaced-apart light-emitting units located in the display area. An encapsulation layer is disposed on the side of the light-emitting device layer opposite to the substrate.

2. The display panel according to claim 1, characterized in that, The display panel further includes a planarization layer disposed between the substrate and the driving circuit layer, and the planarization layer covers the light-shielding layer.

3. The display panel according to claim 2, characterized in that, The light-shielding layer's orthogonal projection onto the substrate lies within the planarization layer's orthogonal projection onto the substrate.

4. The display panel according to claim 2, characterized in that, The thickness of the planarization layer is greater than or equal to 8 μm and less than or equal to 10 μm.

5. The display panel according to claim 1, characterized in that, The light-shielding layer is arranged around the outer periphery of the display area.

6. The display panel according to claim 1, characterized in that, The thickness of the light-shielding layer is greater than or equal to 1 μm and less than or equal to 3 μm.

7. The display panel according to claim 1, characterized in that, The light transmittance of the light-shielding layer is less than or equal to 10. -4 .

8. The display panel according to claim 1, characterized in that, The orthographic projection of the light-shielding layer onto the substrate coincides with the orthographic projection of the non-display area onto the substrate.

9. The display panel according to claim 1, characterized in that, The substrate includes a first substrate sublayer and a second substrate sublayer, the light-shielding layer is disposed on one side of the second substrate sublayer, and the first substrate sublayer is disposed on the side of the second substrate sublayer opposite to the light-shielding layer.

10. A display module, characterized in that, include: Buffer layer; And the display panel according to any one of claims 1-9, wherein the buffer layer is disposed on the second side of the substrate.

11. A display device, characterized in that, It includes the display module as described in claim 10, or the display panel as described in any one of claims 1-9.

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