Temporary fixing material for electronic components
The temporary fixing member with a filler-rich release layer effectively addresses residue issues, ensuring residue-free peeling and simplified cleaning, enhancing manufacturing efficiency and reducing environmental burden.
JP7763280B2Active Publication Date: 2025-10-31FURUKAWA ELECTRIC CO LTD
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Patent Information
- Application Number
- JP2024016828
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2024-02-07
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2044-02-07
AI Technical Summary
Technical Problem
Existing temporary fixing materials for electronic components leave residues on the support after peeling, requiring complex cleaning processes and increasing environmental load.
Method used
A temporary fixing member with a release layer containing a specific filler content and properties, including a cross-sectional area ratio of 8.0% to 92% filler, transmittance of 60% or less at 380 nm, and a 5% weight loss temperature of 250°C or higher, allows for residue-free peeling without solvent cleaning.
Benefits of technology
The solution reduces residues on the support, simplifies the cleaning process, and maintains release performance even at high temperatures, thereby reducing environmental impact and improving manufacturing efficiency.
✦ Generated by Eureka AI based on patent content.
Abstract
To provide an electronic component temporary fixing member capable of reducing residue of the electronic component temporary fixing member on a support when the support is released from the electronic component temporary fixing member.SOLUTION: This electronic component temporary fixing member comprises: a core material; a release layer provided on a first surface of the core material; and an adhesive layer provided on a second surface facing the first surface of the core material. The release layer contains a filler. The electronic component temporary fixing member has a site where the area ratio of the filler in a cross-section of the release layer in a direction perpendicular to the first surface is 8.0% or more and 92% or less.SELECTED DRAWING: None
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