Substrate processing apparatus and substrate processing method

The substrate processing apparatus and method improve etching uniformity by using a flow rate adjustment unit and control unit to optimize processing liquid flow rates, addressing non-uniformity issues in conventional systems.

JP7763711B2Active Publication Date: 2025-11-04TOKYO ELECTRON LTD
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Patent Information

Application Number
JP2022068571
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-04-19
Publication Date
2025-11-04
Estimated Expiration
2042-04-19

AI Technical Summary

Technical Problem

Existing substrate processing systems face challenges in achieving uniformity during the etching process of multiple substrates, particularly when using conventional techniques that alternately adjust the flow rate of processing solutions.

Method used

A substrate processing apparatus and method that includes a flow rate adjustment unit and control unit to individually control the flow rate of processing liquid at multiple locations within a processing tank, using etching information to optimize the etching process for each substrate, thereby improving uniformity.

Benefits of technology

The apparatus and method enhance the uniformity of the etching process across multiple substrates by adjusting flow rates based on acquired etching information, ensuring consistent etching results.

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Abstract

To improve uniformity of an etching processing in technique for collectively etching a plurality of substrates.SOLUTION: A substrate processing apparatus according to an embodiment of the present disclosure, comprises: a processing tank; a flow speed adjustment portion; and a control portion. The processing tank performs an etching processing by implanting a plurality of substrates into processing liquid. The flow speed adjustment portion adjusts a flow speed at a plurality of locations of the processing liquid in the processing tank. The control portion controls each portion. In addition, the control portion includes: an acquisition portion; and an adjustment portion. The acquisition portion acquires information in which the flow speed of the processing liquid at a plurality of locations in the processing tank and the etching amount of the plurality of locations of the substrate are made to correspond to each other. The adjustment portion adjusts the flow speed of the processing liquid at the plurality of locations in the processing tank on the basis of the information acquired by the acquisition portion.SELECTED DRAWING: Figure 4
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