Display panel, display device, and method for manufacturing a display panel

Abstract

To provide: a display panel for improving the use performance of an OLED display product; a display device; and a method for manufacturing the display panel.SOLUTION: A display panel 10 comprises: a display region 11; a hole region 13; and a transition region 12 located between the display region 11 and the hole region 13. The display panel 10 further comprises: a substrate 100; a pixel defining layer 300 located on a side of the substrate 100, the pixel defining layer 300 comprising a pixel regulation layer 310 in which a pixel opening is formed by being enclosed by the pixel regulation layer; a light-emitting unit 610 located within the pixel opening and including a light-emitting layer 600; and an inorganic encapsulation layer located on a side facing away from the substrate 100, of the light-emitting unit 610. The inorganic encapsulation layer comprises a hole configured to avoid cutting damage. An orthographic projection to the substrate 100, of the hole region 13 is located within the orthographic projection to the substrate 100 of the hole that avoids cutting damage.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] This application claims the priority of Chinese Patent Application No. 202311017132.0, titled "Display Panel, Display Device, and Manufacturing Method of Display Panel", filed on August 10, 2023, and Chinese Patent Application No. 202410646170.0, titled "Display Panel, Display Device, and Manufacturing Method of Display Panel", filed on May 21, 2024, and all the contents of the said applications are incorporated herein by reference.

[0002] This application relates to the field of displays, and particularly to display panels, display devices, and manufacturing methods of display panels.

Background Art

[0003] Flat display devices based on technologies such as Organic Light Emitting Diode (OLED) and Light Emitting Diode (LED) have advantages such as high image quality, power saving, thin body, and wide application range. Therefore, they have been widely applied to various consumer electronic products such as mobile phones, televisions, notebook computers, and desktop computers, and have become the main display devices.

[0004] However, it is necessary to improve the usage performance of current OLED display products.

Summary of the Invention

[0005] Embodiments of this application provide a display panel, a display device, and a manufacturing method of a display panel for improving the usage performance of OLED display products.

[0006] An embodiment of the first aspect of this application provides a display panel comprising a display area, a hole area, and a transition area located between the display area and the hole area, further comprising a substrate, a pixel definition layer located on the substrate side, including a pixel definition layer that surrounds and forms a pixel aperture, a light-emitting layer including a light-emitting unit located within the pixel aperture, and an inorganic package layer located on the side of the light-emitting unit away from the substrate, wherein the inorganic package layer includes holes to avoid damage by cutting, and the orthographic projection of the hole area onto the substrate is located within the orthographic projection of the holes onto the substrate to avoid damage by cutting, providing a display panel.

[0007] According to an embodiment of the first aspect of this application, the inorganic package layer comprises a first package layer and a third package layer, the third package layer being located away from the substrate of the first package layer, and holes to avoid damage by cutting are provided in the first package layer and / or the third package layer.

[0008] According to an embodiment of the first aspect of this application, the display panel further comprises a second package layer located between the first package layer and the third package layer, the second package layer comprising an organic material.

[0009] According to any of the above embodiments of the first aspect of this application, the inorganic package layer has a barrier groove formed in the transition region.

[0010] According to any of the above embodiments of the first aspect of this application, the blocking groove forms an annular shape surrounding the hole region.

[0011] According to any of the above embodiments of the first aspect of this application, the barrier groove is provided in the first package layer, and the hole to avoid damage by cutting is provided in the third package layer.

[0012] According to any of the above embodiments of the first aspect of this application, the barrier groove is provided through the first package layer along the thickness direction of the display panel.

[0013] According to any of the above embodiments of the first aspect of this application, the hole to avoid damage by cutting is provided through the third package layer along the thickness direction of the display panel.

[0014] According to any of the above embodiments of the first aspect of this application, the display panel is an isolation structure located on a substrate, further comprising an isolation structure including a first isolation portion located in a display area and a second isolation portion located in a transition area, wherein the second isolation portion is provided at a distance from the hole area, and the blocking groove is located on the side of the second isolation portion away from the substrate.

[0015] According to any of the above embodiments of the first aspect of this application, the display panel further comprises a first insulating layer located on a substrate and having a first cutout, the first cutout being located in a transition region and spaced apart from the display region, and the first cutout extending from the transition region to the boundary between the hole region and the transition region.

[0016] According to any of the above embodiments of the first aspect of this application, the first cutout is provided through the first insulating layer along the thickness direction of the display panel.

[0017] According to any of the above embodiments of the first aspect of this application, the first weight-reducing portion is annular in shape, surrounding the hole region.

[0018] According to any of the above embodiments of the first aspect of this application, the hole for avoiding damage by cutting is located in the transition region.

[0019] According to any of the embodiments described above of the first aspect of this application, the orthographic projection of the first cutout onto the substrate and the orthographic projection of the hole to avoid damage by cutting onto the substrate overlap at least partially.

[0020] According to any of the embodiments described above of the first aspect of this application, the orthographic projection of the first cutout onto the substrate is located within the orthographic projection of the hole onto the substrate that avoids damage by cutting.

[0021] According to any of the above embodiments of the first aspect of the present application, a third cutout portion located in the transition region is provided in the first insulating layer, and the third cutout portion is provided so as to surround the first cutout portion and be spaced apart from the first cutout portion.

[0022] According to any of the above embodiments of the first aspect of the present application, the plurality of third cutout portions are provided at intervals.

[0023] According to any of the above embodiments of the first aspect of the present application, the third cutout portion surrounds the hole region and forms an annular shape.

[0024] An embodiment of the second aspect of the present application provides a display panel including a display region, a hole region, and a transition region located between the display region and the hole region, the display panel further including a substrate, a pixel definition layer including a pixel regulation layer located on the substrate side and surrounding to form a pixel aperture, a light-emitting layer including a light-emitting unit located within the pixel aperture, and an inorganic package layer located on a side of the light-emitting unit away from the substrate and having a cutoff groove formed in the transition region.

[0025] According to an embodiment of the second aspect of the present application, the inorganic package layer includes a first package layer and a third package layer, the third package layer is located on a side of the first package layer away from the substrate, and the cutoff groove is formed in the first package layer and / or the third package layer.

[0026] According to an embodiment of the second aspect of the present application, the cutoff groove surrounds the hole region and forms an annular shape.

[0027] According to an embodiment of the second aspect of the present application, there are a plurality of cutoff grooves.

[0028] According to any of the above embodiments of the second aspect of the present application, the inorganic package layer includes a hole for avoiding damage caused by cutting located in the hole region, and a positive projection of the hole region on the substrate is located within a positive projection of the hole for avoiding damage caused by cutting on the substrate.

[0029] According to the embodiment of the second aspect of the present application, the blocking groove is formed in the first package layer, and the hole for avoiding damage caused by cutting is formed in the third package layer.

[0030] According to the embodiment of the second aspect of the present application, the blocking groove penetrates the first package layer.

[0031] According to any of the above embodiments of the second aspect of the present application, the display panel is located on the substrate, and further includes an isolation structure including a first isolation portion located in the display area and a second isolation portion located in the transition area. The second isolation portion is provided at a distance from the hole area, and the blocking groove is located on the side of the second isolation portion away from the substrate.

[0032] According to any of the above embodiments of the second aspect of the present application, the display panel is located on the substrate, and further includes a first insulating layer in which a first cutout portion is formed. The first cutout portion is located in the transition area and is provided at a distance from the display area, and the first cutout portion extends from the transition area to the boundary between the hole area and the transition area.

[0033] According to any of the above embodiments of the second aspect of the present application, the first cutout portion is formed to penetrate the first insulating layer along the thickness direction of the display panel.

[0034] According to any of the above embodiments of the second aspect of the present application, the first cutout portion surrounds the hole area and forms an annular shape.

[0035] According to any of the above embodiments of the second aspect of the present application, the hole for avoiding damage caused by cutting is located in the transition area.

[0036] According to any of the above embodiments of the second aspect of the present application, the orthographic projection of the first cutout portion on the substrate and the orthographic projection of the hole for avoiding damage caused by cutting on the substrate at least partially overlap.

[0037] According to any of the embodiments described above of the second aspect of this application, the orthographic projection of the first cutout onto the substrate is located within the orthographic projection of the hole onto the substrate to avoid damage by cutting.

[0038] An embodiment of a third aspect of this application provides a display panel comprising a display area, a hole area, and a transition area located between the display area and the hole area, the display panel comprising a substrate, a first insulating layer located on the substrate, having a first cutout located in the transition area and spaced apart from the display area, the first cutout comprising a first insulating layer extending from the transition area to the boundary between the hole area and the transition area, a pixel definition layer including a pixel aperture pixel regulating layer located on the side of the first insulating layer away from the substrate and surrounding it, thereby forming a pixel aperture, and a light-emitting layer including a light-emitting unit located within the pixel aperture.

[0039] According to an embodiment of a third aspect of this application, the display panel further comprises a first package layer located away from the substrate of the light-emitting unit and including a first portion located in a display area, a second package layer located away from the substrate of the first package layer, and a third package layer located away from the substrate of the second package layer, wherein at least one of the first package layer and the third package layer is provided with a cut-off groove or a hole to avoid damage by cutting.

[0040] According to any of the above embodiments of the third aspect of this application, the second package layer is located in the display area.

[0041] According to any of the above embodiments of a third aspect of the present application, the display panel further comprises an isolation structure located on the substrate side, the isolation structure including a first isolation portion located in a display area and a second isolation portion located in a transition area, the second isolation portion being spaced apart from the hole area, the first package layer further includes a second portion located in the transition area, at least a portion of the second portion being located within the first cutout, the second portion being blocked by the second isolation portion and forming a plurality of subsections, the blocking grooves located in the isolation structure being formed between adjacent subsections.

[0042] According to any of the above embodiments of a third aspect of this application, the subsection includes a first thin-walled portion located on at least one side of the second isolation portion.

[0043] According to any of the above embodiments of a third aspect of this application, the pixel defining layer includes a second pixel restricting layer located within a first cutout, and the second isolation portion is located on the side of the second pixel restricting layer away from the substrate.

[0044] According to any of the above embodiments of a third aspect of this application, the isolation structure includes a first isolation portion located in the display area, and a first isolation opening is formed by being surrounded by the first isolation portion.

[0045] According to any of the above embodiments of a third aspect of this application, the pixel definition layer includes a first pixel restriction layer located in a display area, and the pixel aperture includes a first pixel aperture formed by being surrounded by the first pixel restriction layer, the first pixel aperture is in communication with a first isolation aperture.

[0046] According to any of the above embodiments of a third aspect of this application, the display panel further includes a barrier located away from the substrate of the first insulating layer, the barrier being provided between the first pixel restricting layer and the first cutout, and forming an annular shape surrounding the transition region.

[0047] According to any of the above embodiments of the third aspect of this application, there are two or more barriers.

[0048] According to any of the above embodiments of a third aspect of this application, the light-emitting unit includes a first light-emitting unit located in a first isolation opening.

[0049] According to any of the above embodiments of a third aspect of the present application, the display panel further includes a first electrode layer located away from the substrate of the light-emitting layer, the first electrode layer includes a first electrode located in a first isolation opening.

[0050] According to any of the above embodiments of a third aspect of this application, the light-emitting layer includes a second light-emitting unit located on the side facing the hole region of the second isolation portion.

[0051] According to any of the above embodiments of a third aspect of this application, the pixel regulating layer further includes an extension connected to the first pixel regulating layer, at least a portion of which is located on a surface away from the substrate of the barrier.

[0052] According to any of the above embodiments of the third aspect of this application, the extension extends to the transition region.

[0053] According to any of the above embodiments of the third aspect of this application, the extended portion is provided at a distance from the second pixel restricting layer.

[0054] According to any of the above embodiments of the third aspect of this application, the third package layer includes holes to avoid damage caused by cuts located in the hole region.

[0055] According to any of the embodiments described above of the third aspect of this application, the orthographic projection of the first cutout onto the substrate and the orthographic projection of the hole to avoid damage by cutting onto the substrate overlap at least partially.

[0056] According to any of the above embodiments of the third aspect of this application, the orthographic projection of the first cutout onto the substrate is located within the orthographic projection of the hole onto the substrate to avoid damage by cutting.

[0057] According to any of the above embodiments of the third aspect of this application, the first cutout is provided through the first insulating layer along the thickness direction of the display panel.

[0058] According to any of the above embodiments of a third aspect of this application, the first cutout includes an upper surface and a lower surface that are opposite to each other along the thickness direction of the display panel, the upper surface is located away from the substrate of the lower surface, and the cutout has a first opening located on the upper surface and a second opening located on the lower surface, wherein the orthographic projection of the second opening onto the substrate is located within the orthographic projection of the first opening onto the substrate.

[0059] According to any of the above embodiments of the third aspect of this application, a third cutout is provided in the first insulating layer, located in a transition region, and the third cutout surrounds the first cutout and is spaced apart from it.

[0060] According to any of the embodiments of the third aspect of this application, the plurality of third cutouts are provided at intervals.

[0061] A fourth embodiment of this application provides a display device comprising the display panel described in any of the embodiments described above.

[0062] An embodiment of a fifth aspect of this application is a method for manufacturing a display panel including a display area, a hole area, and a transition area located between the display area and the hole area, wherein a first insulating layer is manufactured on a substrate, a first cutout is provided in the first insulating layer, the first cutout is located in the transition area and is spaced apart from the display area, and the first cutout extends from the transition area to the boundary between the hole area and the transition area, a pixel definition layer is manufactured on the substrate, the pixel definition layer includes a pixel restriction layer, and is surrounded by the pixel restriction layer to form a pixel aperture, and an emitting layer is manufactured on the side of the pixel definition layer away from the substrate, The present invention provides a manufacturing method comprising: a light-emitting layer including a light-emitting unit located within a pixel aperture; an inorganic package layer being manufactured on the side of the pixel definition layer away from the substrate, the inorganic package layer including a hole located in the hole region to avoid damage by cutting, the orthographic projection of the hole region onto the substrate being located within the orthographic projection of the hole to avoid damage by cutting; or the inorganic package layer including a barrier groove located in the transition region; and removing the film layer structure of the hole region by cutting along a cut line located inside the hole to avoid damage by cutting, thereby forming an opening corresponding to the hole region.

[0063] According to the embodiment of the present application, the display panel comprises a display area, a hole area, and a transition area located between the display area and the hole area. The display panel further comprises a substrate, a pixel definition layer located on the substrate side which includes a pixel regulating layer that surrounds and forms a pixel aperture, a light-emitting layer including a light-emitting unit located within the pixel aperture, and an inorganic package layer located on the side of the light-emitting unit away from the substrate. The inorganic package layer includes holes to avoid damage by cutting. The orthographic projection of the hole area onto the substrate is such that the holes to avoid damage by cutting are opened in the inorganic package layer located within the orthographic projection of the holes to avoid damage by cutting, thereby reducing the thickness of the film layer at the cut line position of the display panel and reducing the difficulty of cutting the hole area. Furthermore, the orthographic projection of the hole area onto the substrate is such that the holes to avoid damage by cutting are located within the orthographic projection of the holes to avoid damage by cutting, reducing the impact of cutting the hole area on the inorganic package layer, and avoiding the problem of cracks occurring in the inorganic package layer and extending to the display area when the inorganic package layer is cut. [Brief explanation of the drawing]

[0064] [Figure 1] This is a schematic top view of a display panel according to an embodiment of the present application. [Figure 2] This is a cross-sectional view at point AA in Figure 1. [Figure 3] This is a cross-sectional view of another embodiment at location AA in Figure 1. [Figure 4] This is a cross-sectional view of yet another embodiment at location AA in Figure 1. [Figure 5] This is a magnified view of a portion of Figure 4. [Figure 6] This is a cross-sectional view of yet another embodiment at location AA in Figure 1. [Figure 7] This is a cross-sectional view of yet another embodiment at location AA in Figure 1, before cutting. [Figure 8] This is a cross-sectional view of yet another embodiment at location AA in Figure 1, before cutting. [Figure 9]This is a flowchart of the method for manufacturing a display panel according to an embodiment of this application. [Figure 10] This is a partial plan view of a display panel according to an embodiment of the present application. [Figure 11] This is a cross-sectional view of yet another embodiment at location AA in Figure 1. [Figure 12] This is a cross-sectional view of yet another embodiment at location AA in Figure 1. [Figure 13] This is a cross-sectional view of yet another embodiment at location AA in Figure 1. [Figure 14] This is a cross-sectional view of yet another embodiment at location AA in Figure 1. [Figure 15] This is a partial cross-sectional view of the display area of ​​a display panel according to an embodiment of this application. [Figure 16] This is a flowchart of the method for manufacturing a display panel according to an embodiment of this application. [Modes for carrying out the invention]

[0065] Embodiments of this application provide a display panel, which may be an organic light-emitting diode (OLED) display panel.

[0066] Referring to Figures 1 and 2, Figure 1 is a schematic top view of a display panel according to an embodiment of the present application, and Figure 2 is a cross-sectional view at location AA in Figure 1.

[0067] As shown in Figures 1 and 2, an embodiment of the first aspect of this application provides a display panel 10, the display panel 10 comprising a display area 11, a transition area 12, and a hole area 13, wherein the display area 11 is provided surrounding the transition area 12, and the transition area 12 is provided surrounding the hole area 13, and the display panel 10 further comprises a substrate 100, a first insulating layer 200, and a pixel definition layer 300, wherein the first insulating layer 200 is located on the substrate 100, and the first insulating layer 2 A first cutout portion 210 is provided in 00, the first cutout portion 210 is located in the transition region 12 and is provided at a distance from the display region 11, the first cutout portion 210 extends from the transition region 12 to the boundary between the hole region 13 and the transition region 12, the pixel definition layer 300 is located on the side of the first insulating layer 200 away from the substrate 100, and the pixel definition layer 300 includes a pixel restricting layer 310 and a pixel aperture 320 formed surrounded by the pixel restricting layer 310.

[0068] Optionally, the boundary is the cut edge of the hole area 13 of the display panel 10, and the display panel 10 is cut at the boundary to form the hole area 13.

[0069] According to the display panel 10 of the embodiment of this application, the display panel 10 includes a display area 11, a transition area 12, and a hole area 13, wherein the display area 11 surrounds the transition area 12, and the transition area 12 surrounds the hole area 13. The display area 11 is used to realize the light emission display of the display panel 10, and the area below the display panel in the hole area 13 is used to provide a photosensitive assembly. The display panel 10 further includes a substrate 100, a first insulating layer 200, and a pixel definition layer 300. The pixel definition layer 300 includes a pixel restriction layer 310 and a pixel aperture 320 formed by the pixel restriction layer 310, and the pixel aperture 320 is used to provide a light emission unit. A first cutout 210 is formed in the first insulating layer 200 located between the pixel definition layer 300 and the substrate 100. The first cutout 210 is located in the transition region 12 and is spaced apart from the display region 11. This reduces the thickness of the brittle film layer located in the first cutout 210 of the display panel 10, or causes the brittle film layer to be missing. When cutting into the substrate 100 at the location of the first cutout 210, cracks are less likely to form in the first insulating layer 200, and any cracks that do form are less likely to extend toward the display region 11, thereby improving the performance of the OLED display panel 10.

[0070] Optionally, the display panel 10 includes an array layer, and the first insulating layer 200 includes an interlayer insulating layer located within the array layer. For example, the array layer includes a metal layer, the metal layer includes a first metal layer, a second metal layer, and a third metal layer arranged in a lamination, and the first insulating layer 200 includes an interlayer insulating layer located between adjacent metal layers.

[0071] For example, the array layer includes an active layer and a gate layer, and the first insulating layer 200 includes an inter-gate insulating layer between the active layer and the gate layer.

[0072] Optionally, the first insulating layer 200 includes a planarization layer located toward the substrate 100 side of the pixel definition layer 300.

[0073] In some optional embodiments, the pixel censorship layer 310 includes a first pixel censorship layer 311 located in the display area 11, the pixel aperture 320 includes a first pixel aperture 321 formed by being surrounded by the first pixel censorship layer 311, and the display panel 10 further includes a barrier 400 located on the side of the first insulating layer 200 away from the substrate 100, the barrier 400 being provided between the first pixel censorship layer 311 and the first cutout 210 and forming an annular shape surrounding the transition area 12.

[0074] In these optional embodiments, the first pixel restricting layer 311 is located in the display area 11 and restricts the light-emitting area of ​​the display area 11, that is, the first pixel aperture 321 is formed by being surrounded by the first pixel restricting layer 311, so that the display panel 10 emits light at the first pixel aperture 321. The barrier 400 is provided between the first pixel restricting layer 311 and the first cutout 210, and the barrier 400 prevents some of the film layer from being in the display area 11 and blocks it at the location of the barrier 400, thereby improving the problem of water and oxygen intrusion caused by water vapor entering the display area 11 from the transition area 12.

[0075] As an option, multiple barriers 400 are provided at intervals, which further extends the water and oxygen intrusion pathway and improves the poor intrusion of water and oxygen caused by water vapor entering the display area 11 from the transition area 12.

[0076] In some optional embodiments, the display panel 10 further includes an isolation structure 500 and a light-emitting layer 600, wherein the isolation structure 500 is located on the side of the pixel regulating layer 310 away from the substrate 100, and the isolation structure 500 includes a first isolation portion 510 located on the side of the transition region 12 of the barrier 400, which is surrounded by the first isolation portion 510 to form a first isolation opening 511, each first pixel opening 321 located within each first isolation opening 511, and the light-emitting layer 600 is located on the side of the pixel regulating layer 310 away from the substrate 100, and the light-emitting layer 600 includes a first light-emitting unit 610 located in the first isolation opening 511.

[0077] In these optional embodiments, the first isolation portion 510 is provided in the display area 11, and a plurality of first isolation openings 511 are formed by being surrounded by the first isolation portion 510, thereby blocking the light-emitting layer 600 and forming first light-emitting units 610 that are broken apart from each other. This reduces carrier crosstalk within the light-emitting layer 600, improves the display effect of the display panel 10, and eliminates the need to use precision masks to manufacture the first light-emitting units 610, thereby reducing the development and use of precision masks and lowering manufacturing costs.

[0078] As an option, by etching a portion of the light-emitting layer 600 in the transition region 12 to form a hollow section, the thickness of the film layer in the transition region 12 of the display panel 10 can be further reduced, thereby lowering the difficulty of cutting.

[0079] As shown in Figure 2, in some optional embodiments, the display panel 10 further includes a first electrode layer 700, the first electrode layer 700 located away from the substrate 100 of the light-emitting layer 600, and the first electrode layer 700 includes a first electrode 710 located in the first isolation opening 511.

[0080] In these optional embodiments, the first electrode layer 700 is separated by the first isolation portion 510 to form spaced-apart first electrodes 710, each first electrode 710 located in the first isolation opening 511, and the spaced-apart first electrodes 710 are electrically connected by the first isolation portion 510 to form a full-surface electrode.

[0081] Optionally, the portion of the first electrode layer 700 in the transition region 12 can be etched to further reduce the thickness of the film layer in the transition region 12 of the display panel 10, thereby reducing the difficulty of cutting.

[0082] In some optional embodiments, the display panel 10 further includes a first package layer 810, the first package layer 810 located on the side of the first electrode layer 700 away from the substrate 100, and the first package layer 810 includes a first portion 811 located in the display area 11.

[0083] In these optional embodiments, the first package layer 810 can package the first electrode layer 700 and the light-emitting layer 600 to reduce erosion of the first electrode layer 700 and the light-emitting layer 600 by water and oxygen. The first portion 811 of the first package layer 810 is located in the display area 11 to improve the packaging performance in the display area 11 of the display panel 10.

[0084] Optionally, the portion of the first package layer 810 in the transition region 12 can be etched to further reduce the thickness of the film layer in the transition region 12 of the display panel 10, thereby reducing the difficulty of cutting.

[0085] In some optional embodiments, the display panel 10 further includes a second package layer 820, the second package layer 820 located on the side of the first package layer 810 away from the substrate 100 and on the side of the barrier 400 away from the transition region 12.

[0086] In these optional embodiments, the display panel 10 can be further improved in terms of packaging performance by being multilayer packaged using a first package layer 810 and a second package layer 820. By being blocked at the location of the barrier 400 of the second package layer 820, the entire second package layer 820 is located in the display area 11, which improves the intrusion of water and oxygen caused by water vapor entering the display area 11 from the transition area 12.

[0087] In some optional embodiments, the display panel 10 further includes a third package layer 830, the third package layer 830 located on the side of the second package layer 820 away from the substrate 100, the third package layer 830 includes a second cutout 833 located in the transition region 12, or the third package layer 830 is located in the display region 11 and the transition region 12.

[0088] In these optional embodiments, the display panel 10 is packaged in three layers using a first package layer 810, a second package layer 820, and a third package layer 830, which further improves the packaging performance of the display panel 10. The third package layer 830 has a second cutout 833 in the transition region 12, which reduces the thickness of the brittle film layer of the display panel 10 at the location of the second cutout 833 in the transition region 12. When the substrate 100 is cut at the location of the second cutout 833, cracks are less likely to form in the third package layer 830, and any cracks that do form are less likely to extend toward the display region 11.

[0089] As an option, the first package layer 810 contains an inorganic material, and the first package layer 810 is packaged using an inorganic material, and the first package layer 810 using an inorganic material has good density and good packaging performance.

[0090] Optionally, the second package layer 820 may contain an organic material, and the second package layer 820 can be packaged using the organic material to further improve the packaging performance of the package layer.

[0091] Optionally, the third package layer 830 may contain an inorganic material, and the first package layer 810, the second package layer 820, and the third package layer 830 may be packaged using an inorganic material, an organic material, and an inorganic material, respectively, to form a TFE (Thin Film Encapsulation) thin film package structure and further improve the packaging performance of the package layers.

[0092] In some optional embodiments, the first portion 811 is located on the side of the first isolation portion 510 that is away from the transition region 12, near the edge of the transition region 12.

[0093] In these optional embodiments, the first package layer 810 is blocked by the first isolation portion 510, preventing the first package layer 810 from continuously extending to the transition region 12. This further reduces the thickness of the film layer in the transition region 12 of the display panel 10, reducing the difficulty of cutting. Furthermore, when cutting into the substrate 100 at the transition region 12, cracks are less likely to form in the first package layer 810, and any cracks that do form are less likely to extend toward the display region 11.

[0094] In some optional embodiments, the third package layer 830 includes a second cutout 833 located in the transition region 12, and the orthographic projection of the first cutout 210 onto the substrate 100 and the orthographic projection of the second cutout 833 onto the substrate 100 overlap at least partially.

[0095] In these optional embodiments, the orthographic projections of the first cutout 210 and the second cutout 833 onto the substrate 100 overlap at least partially, allowing the first cutout 210 and the second cutout 833 to communicate at least partially, and the display panel 10 having a smaller thickness at the overlapping position, making it easier to cut at the overlapping position of the display panel 10, and making it less likely for cracks to form in the third package layer 830 and the first insulating layer 200, and making it less likely for cracks to extend toward the display area 11.

[0096] In some optional embodiments, the orthographic projection of the first cutout 210 onto the substrate 100 lies within the orthographic projection of the second cutout 833 onto the substrate 100.

[0097] In these optional embodiments, the orthographic projection area of ​​the second cutout 833 is larger than the orthographic projection area of ​​the first cutout 210. Therefore, when cutting the substrate 100 within the first cutout 210, the thickness is smaller, the difficulty of cutting is lower, and because the area of ​​the second cutout 833 is larger, cracks are less likely to form in the third package layer 830 and are less likely to extend toward the display area 11.

[0098] In some optional embodiments, the first weight-reducing portion 210 is provided extending through the first insulating layer 200 along the thickness direction of the display panel 10.

[0099] In these optional embodiments, the first cutout portion 210 is provided penetrating the first insulating layer 200, further reducing the thickness of the first insulating layer 200 at the location of the first cutout portion 210, reducing the difficulty of cutting the substrate 100 at the location of the first cutout portion 210, and making it less likely for cracks to occur in the first insulating layer 200 and less likely for them to extend toward the display area 11, thereby improving the light emission reliability of the display panel 10.

[0100] Referring to Figure 3, Figure 3 is a cross-sectional view of another embodiment at location AA in Figure 1.

[0101] As shown in Figure 3, in some optional embodiments, a third cutout 220 located in the transition region 12 is provided in the first insulating layer 200, and the third cutout 220 is provided surrounding the first cutout 210 with a gap between them.

[0102] In these optional embodiments, the third cutout portion 220 is provided so as to surround the first cutout portion 210, and when other film layers are provided on the first insulating layer 200, the installation of the third cutout portion 220 increases the entry paths for water and oxygen, making it more difficult for water and oxygen to enter the display area 11 through the transition region 12, thereby ensuring the reliability of the display panel 10.

[0103] As an option, multiple third cutouts 220 are provided at intervals. By providing multiple third cutouts 220, the number of pathways for water and oxygen to enter can be increased.

[0104] Referring together to Figures 4 and 5, Figure 4 is a cross-sectional view of another embodiment at location AA in Figure 1, and Figure 5 is a partially enlarged view of Figure 4.

[0105] As shown in Figures 4 and 5, in some optional embodiments, the pixel restricting layer 310 includes a second pixel restricting layer 312 located within the first cutout 210, the isolation structure 500 includes a second isolation portion 520 located within the second pixel restricting layer 312, the second isolation portion 520 is spaced apart from the hole region 13, and the light-emitting layer 600 includes a second light-emitting unit 620 located on the side of the second isolation portion 520 facing the hole region 13.

[0106] In these optional embodiments, a second pixel restricting layer 312 and a second isolation portion 520 are provided within the first cutout portion 210, and a second light-emitting unit 620 is provided on the side of the second isolation portion 520 facing the hole region 13. This brings the film layer structure within the first cutout portion 210 closer to the film layer structure used for cutting in related technologies, allowing the substrate 100 to be cut using conventional cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0107] Optionally, the first electrode layer 700 includes a second electrode 720 on the side facing the hole region 13 of the second isolation portion 520. By providing the second electrode 720 on the side facing the hole region 13 of the second isolation portion 520, the film layer structure within the first cutout portion 210 is brought closer to the film layer structure used for cutting in related technologies. This allows the substrate 100 to be cut using conventional cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0108] In some optional embodiments, the first package layer 810 includes a second portion 812 located in the transition region 12, and at least a portion of the second portion 812 is located within the first cutout 210.

[0109] In these optional embodiments, by providing the second portion 812 of the first package layer 810 within the first cutout 210, the film layer structure within the first cutout 210 is brought closer to the film layer structure used for cutting in the related technology, allowing the substrate 100 to be cut using a conventional cutting device and known device parameters, thereby reducing the difficulty of cutting.

[0110] In some optional embodiments, the second portion 812 includes the first thin-walled portions 813 located on both sides of the second isolation portion 520.

[0111] In these optional embodiments, the second portion 812 has first thin-walled portions 813 formed on both sides of the second isolation portion 520, that is, the second portion 812 is thinner on both sides of the second isolation portion 520, and when the substrate 100 is cut on the side of the second isolation portion 520 toward the hole region 13, any resulting cracks are easily broken at the first thin-walled portions 813 and are less likely to continue extending toward the display region 11.

[0112] As an option, the second portion 812 and the first portion 811 are spaced apart, and when the substrate 100 is cut at the second portion 812 of the first weight-reducing portion 210, cracks that occur in the second portion 812 cannot extend to the first portion 811, thereby ensuring the display reliability of the display panel 10.

[0113] Optionally, the third package layer 830 includes a third portion 831 located in the display area 11 and a fourth portion 832 located in the transition area 12, wherein at least a portion of the fourth portion 832 is located in the first cutout 210. By providing the fourth portion 832 of the third package layer 830 within the first cutout 210, the film layer structure in the first manufacturing groove is brought closer to the film layer structure used for cutting in related technologies, allowing the substrate 100 to be cut using conventional cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0114] Optionally, the fourth portion 832 includes second thin-walled portions 834 located on both sides of the second isolation portion 520, i.e., the thickness of the fourth portion 832 on both sides located on the second isolation portion 520 is thin, and when the substrate 100 is cut on the side of the second isolation portion 520 toward the hole region 13, any resulting cracks are more likely to break at the second thin-walled portions 834 and less likely to continue extending toward the display region 11.

[0115] As shown in Figure 4, optionally, the isolation structure 500 includes a first layer 501, and each first electrode 710 is electrically connected to the first layer 501. The spaced-apart first electrodes 710 are electrically connected via the first layer 501 to form a full-surface electrode, which allows the first electrodes 710 and the first layer 501 to overlap more easily and improves the overlap efficiency of the first electrodes 710.

[0116] In some optional embodiments, the isolation structure 500 further includes a second layer 502 located on the side of the first layer 501 away from the substrate 100, such that the orthographic projection of the first layer 501 onto the substrate 100 lies within the orthographic projection of the second layer 502 onto the substrate 100.

[0117] In these optional embodiments, the first layer 501 and the second layer 502 are provided to form an isolation structure 500, and the orthographic projection of the first layer 501, which is provided in close proximity to the substrate 100, onto the substrate 100 lies within the orthographic projection of the second layer 502 onto the substrate 100, the area of ​​the second layer 502 is larger than the area of ​​the first layer 501, and the second layer 502 covers the surface of the first layer 501 adjacent to the second layer 502, in which case the first layer 501 is recessed relative to the second layer 502 in the direction away from the pixel aperture 320. When manufacturing the light-emitting layer 600, the light-emitting layer 600 creates a large step at the edge of the isolation structure 500, and the first layer 501 is recessed inward relative to the second layer 502, making it difficult for the light-emitting layer 600 to connect at the edge of the isolation structure 500, which causes breakage, and the light-emitting layer 600 breaks, forming a broken first light-emitting unit 610 and a second light-emitting unit 620. Also, when manufacturing the first package layer 810 and the third package layer 830, the second portion 812 has thin first thin-walled portions 813 formed on both sides of the second layer 502, and the fourth portion 832 has thin second thin-walled portions 834 formed on both sides of the second layer 502.

[0118] Optionally, if the fourth portion 832 is broken at the location of the barrier 400 and the substrate 100 is cut at the fourth portion 832 in the first weight-reducing portion 210, the crack that occurs in the fourth portion 832 cannot extend to the third portion 831, thereby ensuring the display reliability of the display panel 10.

[0119] Referring to Figure 2, in some optional embodiments, the first cutout 210 includes a first opening 211 and a second opening 212 that are opposite each other along the thickness direction of the display panel 10, the first opening 211 being located away from the substrate 100 of the second opening 212, and the orthographic projection of the second opening 212 onto the substrate 100 being located within the orthographic projection of the first opening 211 onto the substrate 100.

[0120] In these optional embodiments, since the area of ​​the first opening 211 of the first cutout portion 210 is larger than the area of ​​the second opening 212, the first cutout portion 210 is completely exposed toward the side away from the substrate 100, making it easier to cut the substrate 100 with the first cutout portion 210 and reducing the possibility of cutting the first insulating layer 200, making it less likely for cracks to occur in the first insulating layer 200 and less likely for them to extend toward the display area 11.

[0121] Referring to Figure 6, Figure 6 is a cross-sectional view of yet another embodiment at location AA in Figure 1.

[0122] As shown in Figure 6, optionally, the substrate 100 includes a base layer 110 and a protective film 120, the protective film 120 being located on the base layer 110, and a fourth groove 121 being formed in the protective film 120, the fourth groove 121 being in communication with the first cutout 210. By forming the fourth groove 121 in the protective film 120, the film thickness in the transition region 12 of the display panel 10 becomes even thinner, reducing the difficulty of cutting the transition region 12, and the thickness of the display panel 10 is reduced at the location of the fourth groove 121, thereby reducing the possibility of cracks occurring.

[0123] Optionally, the display panel 10 further includes a pixel electrode exposed from a first pixel aperture 321, wherein one of the pixel electrode and the first electrode 710 is used as the anode of the first light-emitting unit 610, and the other is used as the cathode of the first light-emitting unit 610. In the embodiments of this application, the case in which the pixel electrode is used as the anode of the first light-emitting unit 610 and the first electrode 710 is used as the cathode of the first light-emitting unit 610 is described as an example.

[0124] Referring to Figures 7 and 8, Figure 7 is a pre-cut cross-sectional view of yet another embodiment at location AA in Figure 1, and Figure 8 is a pre-cut cross-sectional view of yet another embodiment at location AA in Figure 1.

[0125] As shown in Figures 7 and 8, Figures 7 and 8 are masters of the display panel 10 before cutting to form the hole region 13. Using the masters in Figures 7 and 8 as an example, the display panel 10 of the embodiment of this application is formed by making an annular cut along the boundary between the transition region 12 and the hole region 13 of the display panel 10.

[0126] The structural design in this embodiment can be applied to other display panels 10, and can be specifically selected according to the actual situation, but this application does not specifically limit it.

[0127] Embodiments of a second aspect of this application further provide a display device including a display panel 10 according to any of the embodiments of the first aspect described above. Since the display device according to the embodiment of the second aspect of this application includes a display panel 10 according to any of the embodiments of the first aspect described above, the display device according to the embodiment of the second aspect of this application has the beneficial effects of the display panel 10 according to any of the embodiments of the first aspect described above, and such effects are omitted here.

[0128] The display devices in the embodiments of this application include, but are not limited to, devices having display functions such as mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, gate controls, smart landline phones, and consoles.

[0129] A third embodiment of this application further provides a method for manufacturing a display panel 10, the display panel 10 may be the display panel 10 according to any of the first embodiments described above, and referring to Figures 1 to 8 together, and then to Figure 9, Figure 9 is a flowchart of the method for manufacturing a display panel according to an embodiment of this application. The manufacturing method includes the following steps.

[0130] Step S01: A first insulating layer is manufactured on the substrate, and a first manufacturing groove is created in the first insulating layer. The first manufacturing groove is located in the transition region and the pore region and is spaced apart from the display region.

[0131] Step S02: A pixel definition layer is manufactured on the side of the first insulating layer away from the substrate, and the pixel definition layer includes a pixel regulating layer and a pixel aperture formed surrounded by the pixel regulating layer.

[0132] Step S03: An annular cut is made in the substrate within the first manufacturing groove to form a first cutout and an opening located in the hole region, the first cutout extending from the transition region to the boundary between the hole region and the transition region.

[0133] According to the manufacturing method of the third embodiment of this application, in step S01, a first insulating layer 200 is manufactured on the substrate 100, and a first manufacturing groove is formed in the transition region 12 of the first insulating layer 200, with a gap between the first manufacturing groove and the display region 11. Next, in step S02, a pixel aperture 320 is manufactured, which is surrounded by the pixel regulating layer 310 of the pixel definition layer 300, and a light-emitting unit is installed to realize the light-emitting display of the display panel 10. Finally, in step S03, an annular cut is made in the substrate 100 within the first manufacturing groove to form an opening in the hole region 13 of the display panel 10, and a photosensitive assembly is installed in the hole region 13 to ensure the photosensitive effect of the photosensitive assembly. Because the film layer of the display panel 10 located in the first manufacturing groove is thin, when the substrate 100 is cut in the first manufacturing groove, cracks are less likely to form in the first insulating layer 200, and the cracks are less likely to extend toward the display area 11, thereby improving the performance of the OLED display panel 10.

[0134] In some optional embodiments, the pixel censorship layer 310 includes a first pixel censorship layer 311 located in the display area 11 and a second pixel censorship layer 312 located in the transition area 12, wherein the second pixel censorship layer 312 is annular and spaced apart from the first pixel censorship layer 311, and at least a portion of the second pixel censorship layer 312 is provided in the first manufacturing groove, and prior to step S03, the method further includes the following steps: manufacturing an isolation structure 500 on the side of the pixel definition layer 300 away from the substrate 100, wherein the isolation structure 500 includes a first isolation portion 510 located in the first pixel censorship layer 311 and two spaced-apart second isolation portions 520 located in the second pixel censorship layer 312.

[0135] In step S03, the method further includes the following steps: making an annular cut in the substrate 100 between the two second isolation portions 520.

[0136] In these optional embodiments, the first isolation portion 510 is provided in the display area 11, and the first isolation portion 510 is surrounded to form a plurality of first isolation openings 511, thereby blocking the light-emitting layer 600 and forming first light-emitting units 610 that are broken apart from each other. This reduces carrier crosstalk within the light-emitting layer 600, improves the display effect of the display panel 10, and eliminates the need to use a precision mask to manufacture the first light-emitting units 610, thereby reducing the development and use of precision masks and lowering manufacturing costs. The two second isolation portions 520 are provided spaced apart in the second pixel regulating layer 312, and when cutting the substrate 100, an annular cut is made in the substrate 100 between the two second isolation portions 520, reducing the possibility of cutting the first insulating layer 200, making it less likely for cracks to occur in the first insulating layer 200, and making it less likely for cracks to extend toward the display area 11.

[0137] In some optional embodiments, the display panel 10 further includes a second light-emitting unit 620 located on the side of the second isolation portion 520 facing the hole region 13, and in the step of making an annular cut in the substrate 100 within the first manufacturing groove, the method further includes the following steps: making an annular cut in the substrate 100 with the second light-emitting unit 620.

[0138] In these optional embodiments, the light-emitting layer 600 is broken at the location of the second isolation structure 500 to form a second light-emitting unit 620, thereby bringing the film layer structure between the two second isolation sections 520 closer to the film layer structure used for cutting in the related technology. When cutting the substrate 100 with the second light-emitting unit 620, the substrate 100 can be cut using conventional cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0139] In some optional embodiments, the display panel 10 further includes a second electrode 720 located on the side of the second isolation portion 520 toward the hole region 13, and in step S03, the method further includes: making an annular cut with respect to the substrate 100 with the second electrode 720.

[0140] In these optional embodiments, the first electrode layer 700 is broken at the location of the second isolation structure 500 to form the second electrode 720, thereby bringing the film layer structure between the two second isolation sections 520 closer to the film layer structure used for cutting in the related technology. When cutting the substrate 100 with the second electrode 720, the substrate 100 can be cut using conventional cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0141] In some optional embodiments, prior to step S03, the method further includes: manufacturing a first package material layer on the side of the pixel definition layer 300 away from the substrate 100; patterning the first package material layer to obtain a first portion 811 located in the display area 11 and a second portion 812 located in the transition area 12 and the hole area 13, wherein at least a portion of the second portion 812 is located within the first cutout 210.

[0142] In step S03, the method further includes: making an annular cut in the substrate 100 in the second portion 812.

[0143] In these optional embodiments, by providing a second portion 812 of the first package layer 810 within the first manufacturing groove, the film layer structure within the first manufacturing groove is brought closer to the film layer structure used for cutting in related technologies, allowing the substrate 100 to be cut using conventional cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0144] In some optional embodiments, prior to step S03, the method further includes: manufacturing a third package material layer on the side of the second portion 812 away from the substrate 100; patterning the third package material layer to obtain a third portion 831 located in the display area 11 and a fourth portion 832 located in the transition area 12 and the pore area 13, wherein at least a portion of the fourth portion 832 is located within the first cutout 210.

[0145] In step S03, the method further includes: making an annular cut in the substrate 100 in the fourth portion 832.

[0146] In these optional embodiments, by providing a fourth portion 832 of the third package layer 830 within the first manufacturing groove, the film layer structure within the first manufacturing groove is brought closer to the film layer structure used for cutting in the related technology, allowing the substrate 100 to be cut using a conventional cutting device and known device parameters, thereby reducing the difficulty of cutting.

[0147] Optionally, after the step of manufacturing a first package material layer on the side of the pixel definition layer 300 away from the substrate 100, the method further includes: manufacturing a second package material layer on the side of the first package material layer away from the substrate 100.

[0148] A third package material layer is manufactured on the side of the second package material layer away from the substrate 100, and a patterning process is performed on the third package material layer to cut off at least a portion of the third package material layer in the transition region 12 and the pore region 13 to obtain a third package layer 830, the third package layer 830 including a second cutout 833 located in the transition region 12. In these optional embodiments, after manufacturing the third package material layer, the third package material layer is cut in the transition region 12 and the pore region 13 to remove the third package material in the transition region 12 and the pore region 13 to form a second cutout 833, reducing the thickness of the brittle film layer of the display panel 10 in the area of ​​the second cutout 833 in the transition region 12 and the pore region 13, and when the substrate 100 is cut in the second cutout 833, cracks are less likely to form in the third package layer 830, and cracks are less likely to extend toward the display region 11.

[0149] The hole 833 that avoids damage caused by the cut described below is the second weight-reducing portion 833 described above.

[0150] Referring to Figures 1, 2, and 15, Figure 15 is a partial cross-sectional view of the display area of ​​a display panel according to an embodiment of this application.

[0151] As shown in Figures 1, 2 and 15, an embodiment of the present application provides a display panel 10 which includes a display area 11, a transition area 12 and a hole area 13, the display area 11 is provided so as to surround the transition area 12, the transition area 12 is provided so as to surround the hole area 13, the display panel 10 further includes a substrate 100, a first insulating layer 200 and a pixel definition layer 300, the first insulating layer 200 is located on the substrate 100 and a first cutout 210 is provided in the first insulating layer 200 The first cutout portion 210 is located in the transition region 12 and is provided at a distance from the display region 11, the first cutout portion 210 extends from the transition region 12 to the boundary between the hole region 13 and the transition region 12, the pixel definition layer 300 is located on the side of the first insulating layer 200 away from the substrate 100, the pixel definition layer 300 includes a pixel restricting layer 310 and a pixel aperture 320 formed by being surrounded by the pixel restricting layer 310, and the light-emitting layer 600 includes a light-emitting unit located within the pixel aperture 320.

[0152] Optionally, the boundary is the cut edge of the hole area 13 of the display panel 10, and the display panel 10 is cut at the boundary to form the hole area 13.

[0153] According to the display panel 10 of the embodiment of this application, the display panel 10 includes a display area 11, a transition area 12, and a hole area 13, wherein the display area 11 surrounds the transition area 12, and the transition area 12 surrounds the hole area 13. The display area 11 is used to realize the light emission display of the display panel 10, and the area below the display panel in the hole area 13 is used to provide a photosensitive assembly. The display panel 10 further includes a substrate 100, a first insulating layer 200, and a pixel definition layer 300. The pixel definition layer 300 includes a pixel restriction layer 310 and a pixel aperture 320 formed by the pixel restriction layer 310, and the pixel aperture 320 is used to provide a light emission unit. A first cutout 210 is formed in the first insulating layer 200 located between the pixel definition layer 300 and the substrate 100. The first cutout 210 is located in the transition region 12 and is spaced apart from the display region 11. This reduces the thickness of the brittle film layer located in the first cutout 210 of the display panel 10, or causes the brittle film layer to be missing. When the substrate 100 is cut at the first cutout 210, cracks are less likely to form in the first insulating layer 200, and cracks are less likely to extend toward the display region 11, thereby improving the performance of the OLED display panel 10.

[0154] As shown in Figure 15, optionally, the display panel 10 includes an array layer provided on the substrate 100, and the first insulating layer 200 includes an interlayer insulating layer located within the array layer. For example, the array layer includes a metal layer, the metal layer includes a first metal layer, a second metal layer, and a third metal layer provided in a stack, and the first insulating layer 200 includes an interlayer insulating layer located between adjacent metal layers. The display panel 10 includes a pixel driving circuit, the pixel driving circuit includes a transistor and a storage capacitor. The transistor includes a semiconductor, gate, source, and drain. The storage capacitor includes a first electrode plate and a second electrode plate. As an example, the gate and the first electrode plate may be located in the first metal layer, the second electrode plate in the second metal layer, and the source and drain in the third metal layer.

[0155] For example, the array layer includes an active layer and a gate layer, the gate layer being the first metal layer described above. Optionally, the first insulating layer 200 includes an inter-gate insulating layer between the active layer and the gate layer.

[0156] Optionally, the first insulating layer 200 includes a planarization layer located on the side of the pixel definition layer 300 facing the substrate 100.

[0157] In some optional embodiments, the display panel 10 further includes a first package layer 810, the first package layer 810 located on the side of the pixel definition layer 300 away from the substrate 100, and the first package layer 810 includes a first portion 811 located in the display area 11.

[0158] In these optional embodiments, the first packaging layer 810 can package the first electrode layer 700 and the light-emitting layer 600 to reduce erosion of the first electrode layer 700 and the light-emitting layer 600 by water and oxygen. The first portion 811 of the first packaging layer 810 is located in the display area 11 to improve the packaging performance in the display area 11 of the display panel 10.

[0159] Optionally, the portion of the first package layer 810 in the transition region 12 can be etched to further reduce the thickness of the film layer in the transition region 12 of the display panel 10, thereby reducing the difficulty of cutting. In some optional embodiments, the display panel 10 further includes a second package layer 820, the second package layer 820 located on the side of the first package layer 810 away from the substrate 100 and on the side of the barrier 400 away from the transition region 12.

[0160] In these optional embodiments, the display panel 10 can be further improved in terms of packaging performance by being multilayer packaged using a first package layer 810 and a second package layer 820. By blocking the second package layer 820 at the location of the barrier 400, the entirety of the second package layer 820 is located in the display area 11, thereby improving the problem of water and oxygen intrusion caused by water vapor entering the display area 11 from the transition area 12.

[0161] In some optional embodiments, the display panel 10 further includes a third package layer 830 located on the side of the second package layer 820 away from the substrate 100, and at least one of the first package layer 810 and the third package layer 830 is provided with a cut-off groove 840 or a hole 833 to avoid damage by cutting.

[0162] In these optional embodiments, the display panel 10 can be packaged in three layers using a first package layer 810, a second package layer 820, and a third package layer 830, further improving the packaging performance of the display panel 10. When the hole region 13 is cut, the impact of cutting the hole region 13 on the first package layer 810 and / or the third package layer 830 can be reduced, and the problem of the first package layer 810 and / or the third package layer 830 being cut, causing cracks to occur in the first package layer 810 and / or the third package layer 830, and the cracks extending to the display region 11 can be avoided. The blocking groove 840 blocks the first package layer 810 and / or the third package layer 830 in multiple parts, and if the part close to the hole region 13 is cut and cracks occur, the crack extension path is blocked by the blocking groove 840, thus preventing the cracks from extending to the display region 11.

[0163] As an option, the first package layer 810 contains an inorganic material, and the first package layer 810, which uses an inorganic material, has good density and good packaging performance.

[0164] Optionally, the second package layer 820 may contain an organic material, and the second package layer 820 can be packaged using the organic material to further improve the packaging performance of the package layer.

[0165] Optionally, the third package layer 830 may contain an inorganic material, and the first package layer 810, the second package layer 820, and the third package layer 830 may be packaged using an inorganic material, an organic material, and an inorganic material, respectively, to form a TFE (Thin Film Encapsulation) thin film package structure, thereby further improving the packaging performance of the package layers.

[0166] As shown in Figure 4, optionally, the isolation structure 500 includes a second isolation section 520 located in the transition region, with the second isolation section 520 and the hole region 13 spaced apart. Spaced apart means that the second isolation section 520 and the hole region 13 are separated by a certain distance.

[0167] As an option, the second isolation portion 520 is located in the first cutout portion 210, and the second isolation portion 520 is located within the first cutout portion 210 of the transition region 12, thereby blocking the film layer of the transition region 12 and reducing the extension of cracks into the display region 11 caused by cutting the film layer of the transition region 12.

[0168] For reference, related technical proposals for isolation structures (also called barrier structures, etc.) are described in the following patents / patent applications: PCT / CN2023 / 134518, China Patent Application 202310759370.2, China Patent Application 202311117143.6, China Patent Application 202310771071.0, China Patent Application 202310740412.8, China Patent Application 202310707209.0, China Patent Application 202310771124.9, China Patent Application 202310855866.X, China Patent Application 202311017132.0, China Patent Application 202311124847.6, and China Patent Application 202311091555.7.

[0169] In some optional embodiments, the first packaging layer 810 includes a second portion 812 located in the transition region 12, and at least a portion of the second portion 812 is located within the first cutout 210.

[0170] In these optional embodiments, by providing the second portion 812 of the first package layer 810 within the first cutout 210, the film layer structure within the first cutout 210 is brought closer to the film layer structure used for cutting in the related technology, allowing the substrate 100 to be cut using a conventional cutting device and known device parameters, thereby reducing the difficulty of cutting.

[0171] Optionally, the second portion 812 may have two or more subsections that are separated and broken apart by the second isolation portion 520, with isolation grooves 840 located in the isolation structure 500 between adjacent subsections, so that when the transition region 12 is cut, a crack may occur in the second portion 812 and adjacent subsections are separated by the isolation grooves 840, preventing the crack from extending and spreading between multiple subsections, and reducing the possibility of the crack in the second portion 812 spreading into the display region 11.

[0172] In some optional embodiments, the subsection of the second portion 812 includes a first thin-walled portion 813 located on at least one side of the second isolation portion 520.

[0173] In these optional embodiments, the subsection of the second portion 812 has a first thin-walled portion 813 formed on at least one side of the second isolation portion 520, i.e., the thickness of the second portion 812 is thin on at least one side of the second isolation portion 520, and when the substrate 100 is cut on the side of the second isolation portion 520 toward the hole region 13, any cracks that occur are easily broken at the first thin-walled portion 813, making it less likely for the cracks to continue extending toward the display region 11.

[0174] Optionally, the second portion 812 and the first portion 811 are spaced apart, and when the substrate 100 is cut into the second portion 812 of the first cutout 210, cracks that occur in the second portion 812 cannot extend to the first portion 811, thus ensuring the display reliability of the display panel 10. In some optional embodiments, the third package layer 830 includes holes 833 located in the transition region 12 to avoid damage from cuts, and the orthographic projection of the first cutout 210 onto the substrate 100 and the orthographic projection of the holes 833 to avoid damage from cuts onto the substrate 100 overlap at least partially.

[0175] In these optional embodiments, the orthographic projections of the first cutout 210 and the holes 833 that avoid damage by cutting onto the substrate 100 overlap at least partially, so that the first cutout 210 and the holes 833 that avoid damage by cutting are at least partially in communication, the display panel 10 has a smaller thickness at the overlapping position, the display panel 10 is easier to cut at the overlapping position, and cracks are less likely to form in the third package layer 830 and the first insulating layer 200, and cracks are less likely to extend toward the display area 11.

[0176] In some optional embodiments, the orthographic projection of the first cutout 210 onto the substrate 100 is located within the orthographic projection of the hole 833 onto the substrate 100, which avoids damage from cutting.

[0177] In these optional embodiments, the orthographic area of ​​the holes 833 that avoid damage by cutting is larger than the orthographic area of ​​the first cutout portion 210. Therefore, when cutting the substrate 100 within the first cutout portion 210, the thickness is small, the difficulty of cutting is low, and the area of ​​the holes 833 that avoid damage by cutting is large, making it less likely for cracks to form in the third package layer 830, and less likely for cracks to extend toward the display area 11.

[0178] In some optional embodiments, the first weight-reducing portion 210 is provided extending through the first insulating layer 200 along the thickness direction of the display panel 10.

[0179] In these optional embodiments, the first cutout portion 210 is provided through the first insulating layer 200, further reducing the thickness of the first insulating layer 200 located at the first cutout portion 210, reducing the difficulty of cutting the substrate 100 located at the first cutout portion 210, and making it less likely for cracks to occur in the first insulating layer 200 when the substrate 100 is cut at the location of the first cutout portion 210, and making it less likely for cracks to extend toward the display area 11, thereby improving the light emission reliability of the display panel 10.

[0180] As shown in Figure 3, in some optional embodiments, a third cutout 220 located in the transition region 12 is provided in the first insulating layer 200, and the third cutout 220 is provided surrounding the first cutout 210 with a gap between them.

[0181] In these optional embodiments, the third cutout portion 220 is provided so as to surround the first cutout portion 210, and when other film layers are provided on the first insulating layer 200, the installation of the third cutout portion 220 increases the entry paths for water and oxygen, making it more difficult for water and oxygen to enter the display area 11 through the transition region 12, thereby ensuring the reliability of the display panel 10.

[0182] As an option, multiple third cutouts 220 are provided at intervals. By providing multiple third cutouts 220, the number of pathways for water and oxygen to enter can be increased.

[0183] Optionally, the third packaging layer 830 and / or the first packaging layer 810 may be provided to cover the side and bottom walls of the third cutout 220, thereby increasing the side length of the extension path of the third packaging layer 830 and / or the first packaging layer 810, and further increasing the entry paths for moisture and oxygen.

[0184] As shown in Figures 4 and 5, optionally, the pixel definition layer 300 includes a second pixel restriction layer 312 located within the first cutout 210, and the second isolation portion 520 is located within the second pixel restriction layer 312. By retaining the second pixel restriction layer 312 within the first cutout 210, the film layer structure within the first cutout 210 is brought closer to the film layer structure used for cutting in related technologies, allowing the substrate 100 to be cut using conventional cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0185] In some optional embodiments, the pixel definition layer 300 further includes a first pixel restriction layer 311 located in the display area 11, and the pixel aperture 320 includes a first pixel aperture 321 formed by being surrounded by the first pixel restriction layer 311.

[0186] Optionally, the display panel 10 further includes a barrier 400, which is located on the side of the first insulating layer 200 away from the substrate 100, and is provided between the first pixel restricting layer 311 and the first cutout 210, forming an annular shape surrounding the transition region 12.

[0187] In these optional embodiments, the first pixel restricting layer 311 is located in the display area 11 and restricts the light-emitting area of ​​the display area 11, that is, the first pixel aperture 321 is formed surrounded by the first pixel restricting layer 311 so that the display panel 10 emits light from the first pixel aperture 321. The barrier 400 is provided between the first pixel restricting layer 311 and the first cutout 210, and the barrier 400 blocks a portion of the film layer from being in the display area 11 at the location of the barrier 400, thereby improving the problem of water and oxygen intrusion caused by water vapor entering the display area 11 from the transition area 12.

[0188] As shown in Figure 3, optionally, there are two or more barriers 400, and multiple barriers 400 are provided at intervals. By providing multiple barriers 400, the water and oxygen intrusion paths can be further extended, improving the poor water and oxygen intrusion caused by water vapor entering the display area 11 from the transition area 12.

[0189] In some optional embodiments, the isolation structure 500 is located on the side of the pixel regulating layer 310 away from the substrate 100, and the isolation structure 500 includes a first isolation portion 510 located on the side of the barrier 400 away from the transition region 12, and a first isolation opening 511 is formed surrounded by the first isolation portion 510, and the first pixel opening 321 communicates with the first isolation opening 511.

[0190] As shown in Figures 4 and 5, optionally, the light-emitting unit includes a first light-emitting unit 610 located in the first isolation opening 511.

[0191] In these optional embodiments, the first isolation portion 510 is provided in the display area 11, and by being surrounded by the first isolation portion 510, a plurality of first isolation openings 511 are formed, thereby blocking the light-emitting layer 600 and forming first light-emitting units 610 that are broken apart from each other. This reduces carrier crosstalk within the light-emitting layer 600, improves the display effect of the display panel 10, and eliminates the need to use precision masks to manufacture the first light-emitting units 610, thereby reducing the development and use of precision masks and lowering manufacturing costs.

[0192] As an option, by etching a portion of the light-emitting layer 600 in the transition region 12 to form a hollow section, the thickness of the film layer in the transition region 12 of the display panel 10 can be further reduced, thereby lowering the difficulty of cutting.

[0193] In some optional embodiments, the display panel 10 further includes a first electrode layer 700 located on the side of the light-emitting layer 600 away from the substrate 100, the first electrode layer 700 including a first electrode 710 located in the first isolation opening 511.

[0194] In these optional embodiments, the first electrode layer 700 is separated by the first isolation portion 510 to form spaced-apart first electrodes 710, each first electrode 710 located in the first isolation opening 511, and the spaced-apart first electrodes 710 are electrically connected by the first isolation portion 510 to form a full-surface electrode.

[0195] Optionally, the portion of the first electrode layer 700 in the transition region 12 can be etched to further reduce the thickness of the film layer in the transition region 12 of the display panel 10, thereby reducing the difficulty of cutting.

[0196] Optionally, the light-emitting layer 600 includes a second light-emitting unit 620 located on the side of the second isolation portion 520 facing the hole region 13.

[0197] In these optional embodiments, a second pixel restricting layer 312 and a second isolation portion 520 are provided within the first cutout portion 210, and a second light-emitting unit 620 is provided on the side of the second isolation portion 520 facing the hole region 13. This brings the film layer structure within the first cutout portion 210 closer to the film layer structure used for cutting in related technologies, allowing the substrate 100 to be cut using conventional cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0198] Optionally, the first electrode layer 700 includes a second electrode 720 on the side facing the hole region 13 of the second isolation portion 520. By providing the second electrode 720 on the side facing the hole region 13 of the second isolation portion 520, the film layer structure within the first cutout portion 210 is brought closer to the film layer structure used for cutting in related technologies. This allows the substrate 100 to be cut using conventional cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0199] Optionally, the third package layer 830 includes a third portion 831 located in the display area 11 and a fourth portion 832 located in the transition area 12, wherein at least a portion of the fourth portion 832 is located in the first cutout 210. By providing the fourth portion 832 of the third package layer 830 within the first cutout 210, the film layer structure in the first manufacturing groove is brought closer to the film layer structure used for cutting in related technologies, allowing the substrate 100 to be cut using conventional cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0200] Optionally, the fourth portion 832 includes second thin-walled portions 834 located on both sides of the second isolation portion 520, i.e., the fourth portion 832 is thinner in the portions located on both sides of the second isolation portion 520, so that when the substrate 100 is cut on the side of the second isolation portion 520 toward the hole region 13, any resulting cracks are more likely to break at the second thin-walled portions 834 and less likely to continue extending toward the display region 11.

[0201] As shown in Figure 4, optionally, the isolation structure 500 includes a first layer 501, and each first electrode 710 is electrically connected to the first layer 501. The spaced-apart first electrodes 710 are electrically connected via the first layer 501 to form a full-surface electrode, which allows the first electrodes 710 and the first layer 501 to overlap more easily and improves the overlap efficiency of the first electrodes 710.

[0202] In some optional embodiments, the isolation structure 500 further includes a second layer 502 located on the side of the first layer 501 away from the substrate 100, such that the orthographic projection of the first layer 501 onto the substrate 100 lies within the orthographic projection of the second layer 502 onto the substrate 100.

[0203] In these optional embodiments, the first layer 501 and the second layer 502 are provided to form an isolation structure 500, and the orthographic projection of the first layer 501, which is provided in close proximity to the substrate 100, onto the substrate 100 lies within the orthographic projection of the second layer 502 onto the substrate 100, the area of ​​the second layer 502 is larger than the area of ​​the first layer 501, and the second layer 502 covers the surface of the first layer 501 adjacent to the second layer 502, in which case the first layer 501 is recessed relative to the second layer 502 in the direction away from the pixel aperture 320. When manufacturing the light-emitting layer 600, the light-emitting layer 600 creates a large step at the edge of the isolation structure 500, and the first layer 501 is recessed inward relative to the second layer 502, making it difficult for the light-emitting layer 600 to connect at the edge of the isolation structure 500, which causes breakage, and the light-emitting layer 600 breaks, forming a broken first light-emitting unit 610 and a second light-emitting unit 620. Also, when manufacturing the first package layer 810 and the third package layer 830, the second portion 812 has thin first thin-walled portions 813 formed on both sides of the second layer 502, and the fourth portion 832 has thin second thin-walled portions 834 formed on both sides of the second layer 502.

[0204] Optionally, if the fourth portion 832 is broken at the location of the barrier 400 and the substrate 100 is cut at the fourth portion 832 in the first weight-reducing portion 210, the crack that occurs in the fourth portion 832 cannot extend to the third portion 831, thereby ensuring the display reliability of the display panel 10.

[0205] Referring to Figure 2, in some optional embodiments, the first cutout 210 includes a first opening 211 and a second opening 212 that are opposite each other along the thickness direction of the display panel 10, the first opening 211 being located away from the substrate 100 of the second opening 212, and the orthographic projection of the second opening 212 onto the substrate 100 being located within the orthographic projection of the first opening 211 onto the substrate 100.

[0206] In these optional embodiments, since the area of ​​the first opening 211 of the first cutout portion 210 is larger than the area of ​​the second opening 212, the first cutout portion 210 is fully exposed toward the side away from the substrate 100, making it easier to cut the substrate 100 with the first cutout portion 210 and reducing the possibility of cutting the first insulating layer 200, making it less likely for cracks to occur in the first insulating layer 200, and less likely for cracks to extend toward the display area 11.

[0207] As shown in Figure 6, optionally, the substrate 100 includes a base layer 110 and a protective film 120, the protective film 120 being located on the base layer 110, and a fourth groove 121 being formed in the protective film 120, the fourth groove 121 being in communication with the first cutout 210. By forming the fourth groove 121 in the protective film 120, the film thickness in the transition region 12 of the display panel 10 becomes even thinner, reducing the difficulty of cutting the transition region 12, and the thickness of the display panel 10 becomes thinner at the location of the fourth groove 121, reducing the possibility of cracks occurring.

[0208] Optionally, the display panel 10 further includes a pixel electrode exposed from a first pixel aperture 321, wherein one of the pixel electrode and the first electrode 710 is used as the anode of the first light-emitting unit 610, and the other is used as the cathode of the first light-emitting unit 610. In the embodiments of this application, the case in which the pixel electrode is used as the anode of the first light-emitting unit 610 and the first electrode 710 is used as the cathode of the first light-emitting unit 610 is described as an example.

[0209] As shown in Figures 7 and 8, Figures 7 and 8 are masters of the display panel 10 before cutting to form the hole region 13. Using the masters in Figures 7 and 8 as an example, the display panel 10 of the embodiment of this application is formed by making an annular cut along the boundary between the transition region 12 and the hole region 13 of the display panel 10. The drawings do not show cut lines, the boundary between the transition region 12 and the hole region 13 is treated as the cut line boundary, and other boundaries are separated by a certain width from the boundary.

[0210] Referring to Figures 12 and 4, Figure 12 is a cross-sectional view of yet another embodiment in AA in Figure 1, and Figure 4 is a cross-sectional view of yet another embodiment in AA in Figure 1.

[0211] As shown in Figure 12, optionally, the pixel regulating layer 310 further includes an extension 313 connected to the first pixel regulating layer 311, where at least a portion of the extension 313 is located on the surface of the barrier 400 away from the substrate 100, raising the portion of the subsequent third package layer 830 in the barrier 400, easing the gradient of the third package layer 830, and improving the package performance of the third package layer 830.

[0212] As shown in Figure 4, optionally, the extended portion 313 can extend to the transition region 12, further increasing the entry paths for water and oxygen in the extended portion 313 and reducing the entry of water and oxygen into the display region 11.

[0213] As an option, the extended portion 313 and the second pixel restricting layer 312 are provided with a gap between them, which makes it less likely for cracks generated when the second pixel restricting layer 312 is cut to extend toward the extended portion 313.

[0214] Referring to Figures 2 and 10, Figure 10 is a partial top view of a display panel according to an embodiment of the present application.

[0215] As shown in Figures 2 and 10, embodiments of the present application provide a display panel 10 comprising a display area 11, a hole area 13, and a transition area 12 located between the display area 11 and the hole area 13, further comprising a substrate 100, a pixel definition layer 300, an emissive layer 600, and an inorganic package layer, wherein the pixel definition layer 300 is located on the substrate 100 side and comprises a pixel restriction layer 310 and a pixel aperture 320 formed surrounded by the pixel restriction layer 310, the emissive layer 600 comprises an emissive unit located within the pixel aperture 320, the inorganic package layer is located on the side of the emissive unit away from the substrate 100, and the inorganic package layer includes a hole 833 that avoids damage by cutting, at least a portion of which is located in the hole area 13, and the orthographic projection of the hole area 13 onto the substrate 100 is located within the orthographic projection of the hole 833 onto the substrate 100.

[0216] According to the display panel 10 of the embodiment of this application, the display panel 10 includes a display area 11, a transition area 12, and a hole area 13, wherein the display area 11 surrounds the transition area 12, and the transition area 12 surrounds the hole area 13. The display area 11 is used to realize the light-emitting display of the display panel 10, and the area below the display panel in the hole area 13 is used to provide a photosensitive assembly. The display panel 10 further includes a substrate 100, a pixel definition layer 300, and a first package layer 810. The pixel definition layer 300 includes a pixel restriction layer 310 and a pixel aperture 320 formed by being surrounded by the pixel restriction layer 310, and the pixel aperture 320 is used to provide a light-emitting unit. The first package layer 810 packages the first electrode layer 700 and the light-emitting layer 600 and reduces erosion of the first electrode layer 700 and the light-emitting layer 600 by water and oxygen. The first portion 811 of the first packaging layer 810 is located in the display area 11, improving the packaging performance in the display area 11 of the display panel 10. Holes 833 are provided in the inorganic packaging layer to avoid damage from cutting, reducing the thickness of the film layer at the cut line position of the display panel 10 and lowering the difficulty of cutting the hole area 13. Furthermore, the orthographic projection of the hole area 13 onto the substrate 100 is located within the orthographic projection of the holes 833 onto the substrate 100 to avoid damage from cutting, reducing the impact of cutting the hole area 13 on the inorganic packaging layer and avoiding the problem of cracks occurring in the inorganic packaging layer and extending to the display area 11 when the inorganic packaging layer is cut.

[0217] Optionally, the inorganic package layer includes a first package layer 810 and a third package layer 830, the third package layer 830 being located on the side of the first package layer 810 away from the substrate 100, and holes 833 to avoid damage by cutting are provided in the first package layer 810 and / or the third package layer 830, thereby reducing the impact of cutting the hole region 13 on the first package layer 810 and / or the third package layer 830, and avoiding the problem of cracks occurring in the first package layer 810 and / or the third package layer 830 and extending to the display area 11 when the first package layer 810 and / or the third package layer 830 are cut.

[0218] Referring to Figure 14, Figure 14 is a cross-sectional view of yet another embodiment at location AA in Figure 1.

[0219] As shown in Figure 14, optionally, the inorganic package layer includes a blocking groove 840 located in the transition region 12. The blocking groove 840 blocks the inorganic package layer in multiple parts, and if a portion close to the hole region 13 is cut and a crack occurs, the crack's extension path is blocked by the blocking groove 840, preventing the crack from extending to the display region 11.

[0220] Optionally, the barrier groove 840 forms an annular shape surrounding the hole region 13, and the barrier groove 840 further prevents the inorganic package layer from being blocked on the periphery of the hole region 13, thereby preventing the crack from extending to the display region 11.

[0221] Optionally, a barrier groove 840 is provided in the first packaging layer 810, and a hole 833 to avoid damage from cutting is provided in the third packaging layer 830. When the hole region 13 is cut, the impact of cutting the hole region 13 on the third packaging layer 830 is reduced, and since the third packaging layer 830 is cut, the problem of cracks occurring in the third packaging layer 830 and extending to the display area 11 can be avoided. The barrier groove 840 blocks the first packaging layer 810 in multiple parts, and if a part close to the hole region 13 is cut and cracks occur, the crack extension path is blocked by the barrier groove 840, thus preventing the cracks from extending to the display area 11.

[0222] Optionally, a barrier groove 840 is provided that penetrates the first packaging layer 810 along the thickness direction of the display panel 10, so that the first packaging layer 810 is completely blocked by the barrier groove 840, further preventing cracks from extending into the display area 11 in the first packaging layer 810.

[0223] As an option, a hole 833 to avoid damage from cutting is provided through the third package layer 830 along the thickness direction of the display panel 10, so that the portion of the third package layer 830 that avoids damage from cutting is completely hollowed out, further avoiding the problem of cracks occurring in the third package layer 830 when the third package layer 830 is cut during cutting.

[0224] As shown in Figures 13 and 14, optionally, the display panel 10 further includes an isolation structure 500 located on the substrate 100, the isolation structure 500 including a second isolation portion 520 located in the transition region 12, the second isolation portion 520 being spaced apart from the hole region 13, and the blocking groove 840 being located on the side of the second isolation portion 520 away from the substrate 100. The second isolation portion 520 blocks the inorganic package layer to form the blocking groove 840, which blocks the inorganic package layer in multiple parts, and if a crack occurs when a portion close to the hole region 13 is cut, the crack's extension path is blocked by the blocking groove 840, preventing the crack from extending to the display region 11.

[0225] In some optional embodiments, the display panel 10 further includes a first insulating layer 200 located on the substrate 100, the first insulating layer 200 having a first cutout 210, the first cutout 210 being located in a transition region 12 and spaced apart from the display region 11, and the first cutout 210 extending from the transition region 12 to the boundary between the hole region 13 and the transition region 12.

[0226] In these optional embodiments, a first cutout 210 is formed in the first insulating layer 200 located between the pixel definition layer 300 and the substrate 100, and the first cutout 210 is located in the transition region 12 and spaced apart from the display region 11, thereby reducing the thickness of the brittle film layer located in the first cutout 210 of the display panel 10 or causing the brittle film layer to be absent. When the substrate 100 is cut at the first cutout 210, cracks are less likely to form in the first insulating layer 200, and cracks are less likely to extend toward the display region 11, thus improving the performance of the OLED display panel 10.

[0227] Optionally, a first cutout 210 is provided that penetrates the first insulating layer 200 along the thickness direction of the display panel 10, so that the first insulating layer 200 is completely blocked by the first cutout 210, further preventing cracks from extending into the display area 11 in the first insulating layer 200.

[0228] Optionally, the first cutout portion 210 forms an annular shape surrounding the hole region 13, and the first cutout portion 210 completely blocks the first insulating layer 200 on the periphery of the hole region 13, further preventing cracks in the first insulating layer 200 from extending to the display region 11.

[0229] As an option, the holes 833 that avoid damage from cutting are located in the transition region 12, and when the transition region 12 is cut, the inorganic package layer where the holes 833 that avoid damage from cutting are located is cut, thus avoiding the problem of cracking in the inorganic package layer.

[0230] Optionally, the third cutout portion 220 forms an annular shape surrounding the hole region 13, and the third cutout portion 220 further prevents the first insulating layer 200 from being blocked again on the periphery of the hole region 13, thereby preventing cracks in the first insulating layer 200 from extending to the display region 11.

[0231] As shown in Figures 13 and 14, an embodiment of the present application provides a display panel 10 which includes a display area 11, a hole area 13, and a transition area 12 located between the display area 11 and the hole area 13. The display panel 10 further includes a substrate 100, a first insulating layer 200, a pixel definition layer 300, an emissive layer 600, and an inorganic packaging layer. The first insulating layer 200 is located on the substrate 100, and a first cutout 210 is provided in the first insulating layer 200. The first cutout 210 is located in the transition area 12 and is spaced apart from the display area 11. The first cutout 210 extends from the transition area 12 to the boundary between the hole area 13 and the transition area 12. The pixel definition layer 300 is located on one side of the substrate 100 and includes a pixel restriction layer 310 and a pixel aperture 320 formed by being surrounded by the pixel restriction layer 310; the light-emitting layer 600 includes a light-emitting unit located within the pixel aperture 320; and the inorganic package layer is located on the side of the pixel definition layer 300 away from the substrate 100 and includes a blocking groove 840 located in the transition region 12.

[0232] According to the display panel 10 of the embodiment of this application, the display panel 10 includes a display area 11, a transition area 12, and a hole area 13, wherein the display area 11 surrounds the transition area 12, and the transition area 12 surrounds the hole area 13. The display area 11 is used to realize the light emission display of the display panel 10, and the area below the display panel in the hole area 13 is used to provide a photosensitive assembly. The display panel 10 further includes a substrate 100, a first insulating layer 200, a pixel definition layer 300, and a first package layer 810. The pixel definition layer 300 includes a pixel restriction layer 310 and a pixel aperture 320 formed by the pixel restriction layer 310, the pixel aperture 320 being used to provide a light emission unit. A first cutout 210 is formed in the first insulating layer 200 located between the pixel definition layer 300 and the substrate 100. The first cutout 210 is located in the transition region 12 and spaced apart from the display region 11, thereby reducing the thickness of the brittle film layer located in the first cutout 210 of the display panel 10 or causing the brittle film layer to be absent. When the substrate 100 is cut at the first cutout 210, cracks are less likely to form in the first insulating layer 200, and cracks are less likely to extend toward the display region 11, thus improving the performance of the OLED display panel 10. The first packaging layer 810 packages the first electrode layer 700 and the light-emitting layer 600, reducing erosion of the first electrode layer 700 and the light-emitting layer 600 by water and oxygen. The first portion 811 of the first packaging layer 810 is located in the display region 11, improving the packaging performance of the display panel 10 in the display region 11. The blocking groove 840 blocks the inorganic package layer in multiple sections, and if a crack occurs when a section close to the hole area 13 is cut, the crack's extension path is blocked by the blocking groove 840, preventing the crack from extending to the display area 11.

[0233] Optionally, the inorganic packaging layer includes a first packaging layer 810 and a third packaging layer 830, and the barrier groove 840 is provided in the first packaging layer 810 and / or the third packaging layer 830. The barrier groove 840 blocks the first packaging layer 810 and / or the third packaging layer 830 in multiple parts, and if a portion close to the hole region 13 is cut and a crack occurs, the crack's extension path is blocked by the barrier groove 840, preventing the crack from extending to the display region 11. Optionally, by providing the barrier groove 840 surrounding the hole region 13, any cracks that occur on the periphery side of the hole region 13 in the inorganic packaging layer are less likely to extend to the display region 11.

[0234] Optionally, there may be multiple blocking grooves 840, which can further prevent cracks from extending into the display area 11.

[0235] Optionally, a barrier groove 840 is provided in the first packaging layer 810, and a hole 833 to avoid damage from cutting is provided in the third packaging layer 830. When the hole region 13 is cut, the impact of cutting the hole region 13 on the third packaging layer 830 is reduced, and the problem of cracks occurring in the third packaging layer 830 and extending to the display area 11 due to the cutting of the third packaging layer 830 can be avoided. The barrier groove 840 blocks the first packaging layer 810 in multiple parts, and if a part close to the hole region 13 is cut and cracks occur, the crack extension path is blocked by the barrier groove 840, preventing the crack from extending to the display area 11.

[0236] The structural design in this embodiment can be applied to other display panels 10, and specifically, can be selected according to the actual situation, but this application does not specifically restrict that.

[0237] Embodiments of this application further provide a display device including a display panel 10 according to any of the embodiments described above. Since the display device according to the embodiments of this application includes a display panel 10 according to any of the embodiments described above, the display device according to the embodiments of this application has the beneficial effects of the display panel 10 according to any of the embodiments described above, and such effects are omitted here.

[0238] The display devices in the embodiments of this application include, but are not limited to, devices having display functions such as mobile phones, personal digital assistants (PDAs), tablet computers, e-readers, televisions, gate controls, smart landline phones, and consoles.

[0239] The embodiments of this application further provide a method for manufacturing a display panel 10, the display panel 10 may be any of the above embodiments, and referring to Figures 1 to 15 together, and then to Figure 16, Figure 16 is a flowchart of the method for manufacturing a display panel according to the embodiments of this application. The display panel 10 includes a display area 11, a hole area 13, and a transition area 12 located between the display area 11 and the hole area 13. The manufacturing method includes the following.

[0240] Step S1: A first insulating layer is manufactured on the substrate, and a first cutout is made in the first insulating layer. The first cutout is located in the transition region and is spaced apart from the display region, and the first cutout extends from the transition region to the boundary between the hole region and the transition region.

[0241] Step S2: A pixel definition layer is manufactured on the substrate, the pixel definition layer including a pixel regulating layer and a pixel aperture formed surrounded by the pixel regulating layer.

[0242] Step S3: A light-emitting layer is manufactured on the side away from the substrate of the pixel definition layer, including a light-emitting unit located within the pixel aperture.

[0243] Step S4: An inorganic package layer is manufactured on the side of the pixel definition layer away from the substrate, the inorganic package layer includes holes that avoid damage by cutting, at least a portion of which are located in the hole region, the orthographic projection of the hole region onto the substrate is located within the orthographic projection of the holes onto the substrate that avoid damage by cutting, or the inorganic package layer includes a barrier groove located in the transition region.

[0244] Step S5: Cut along the cut line located inside the hole to avoid damage from cutting, remove the membrane layer structure in the hole area, and form an opening corresponding to the hole area.

[0245] According to the manufacturing method of the embodiment of this application, a first insulating layer 200 is manufactured in step S1. A pixel definition layer 300 is manufactured in step S2. A light-emitting layer 600 is manufactured in step S3. An inorganic package layer is manufactured in step S4. A hole region 13 is cut in step S5. The pixel definition layer 300 includes a pixel regulating layer 310, and a pixel aperture 320 is formed surrounded by the pixel regulating layer 310, and the pixel aperture 320 is used to provide a light-emitting unit. A first cutout 210 is opened in the first insulating layer 200 located between the pixel definition layer 300 and the substrate 100, and the first cutout 210 is located in the transition region 12 and spaced apart from the display region 11, thereby reducing the thickness of the brittle film layer located in the first cutout 210 of the display panel 10 or causing the brittle film layer to be absent. When the substrate 100 is cut at the first cutout 210, cracks are less likely to form in the first insulating layer 200, and the cracks are less likely to extend toward the display area 11, thereby improving the usability of the OLED display panel 10. The first packaging layer 810 packages the first electrode layer 700 and the light-emitting layer 600, reducing erosion of the first electrode layer 700 and the light-emitting layer 600 by water and oxygen. The first portion 811 of the first packaging layer 810 is located in the display area 11, improving the packaging performance of the display panel 10 in the display area 11. Holes 833 are provided in the inorganic packaging layer to avoid damage by cutting, reducing the thickness of the film layer at the cut line position of the display panel 10 and reducing the difficulty of cutting in the hole area 13. Furthermore, the orthographic projection of the hole region 13 onto the substrate 100 is located within the orthographic projection of the hole 833 onto the substrate 100, which avoids damage from cutting. When cutting the hole region 13, the impact of cutting the hole region 13 on the inorganic package layer is reduced, and the problem of cracks occurring in the inorganic package layer and extending to the display area 11 due to the cutting of the inorganic package layer can be avoided. The blocking groove 840 blocks the inorganic package layer in multiple parts, and if a part close to the hole region 13 is cut and a crack occurs, the crack's extension path is blocked by the blocking groove 840, preventing the crack from extending to the display area 11.

[0246] The embodiments of this application further provide a method for manufacturing a display panel 10, the display panel 10 may be any of the above embodiments, and referring to Figures 1 to 15 together, and then to Figure 9, Figure 9 is a flowchart of a method for manufacturing another display panel according to the embodiments of this application. The manufacturing method includes the following:

[0247] Step S01: A first insulating layer is manufactured on the substrate, and a first manufacturing groove is created in the first insulating layer. The first manufacturing groove is located in the transition region and the pore region and is spaced apart from the display region.

[0248] Step S02: A pixel definition layer is manufactured on the side of the first insulating layer away from the substrate, and the pixel definition layer includes a pixel regulating layer and a pixel aperture formed surrounded by the pixel regulating layer.

[0249] Step S03: An annular cut is made in the substrate within the first manufacturing groove to form a first weight-reducing portion and an opening located in the hole region, the first weight-reducing portion extending from the transition region to the boundary between the hole region and the transition region.

[0250] In the manufacturing method of the embodiment of this application, a first insulating layer 200 is manufactured on the substrate 100 in step S01, and a first manufacturing groove is formed in the transition region 12 of the first insulating layer 200, with a gap between the first manufacturing groove and the display region 11. Next, in step S02, a pixel aperture 320 is manufactured, which is surrounded by the pixel regulating layer 310 of the pixel definition layer 300, and a light-emitting unit is installed to realize the light-emitting display of the display panel 10. Finally, in step S03, an opening is formed in the hole region 13 of the display panel 10 by cutting the substrate 100 in an annular shape within the first manufacturing groove, and a photosensitive assembly is installed in the hole region 13 to ensure the photosensitive effect of the photosensitive assembly. Because the thickness of the film layer of the display panel 10 is small in the first manufacturing groove, when the substrate 100 is cut in the first manufacturing groove, cracks are less likely to form in the first insulating layer 200, and cracks are less likely to extend toward the display region 11, thus improving the usability of the OLED display panel 10.

[0251] In some optional embodiments, the pixel defining layer 310 includes a first pixel defining layer 311 located in the display area 11 and a second pixel defining layer 312 located in the transition area 12, wherein the second pixel defining layer 312 is annular and spaced apart from the first pixel defining layer 311, and at least a portion of the second pixel defining layer 312 is provided in the first manufacturing groove, and prior to step S03, the method further includes: manufacturing an isolation structure 500 on the side of the pixel defining layer 300 away from the substrate 100, wherein the isolation structure 500 includes a first isolation portion 510 located in the first pixel defining layer 311 and two spaced-apart second isolation portions 520 located in the second pixel defining layer 312.

[0252] In step S03, the method further includes: making an annular cut in the substrate 100 between the two second isolation portions 520.

[0253] In these optional embodiments, the first isolation portion 510 is provided in the display area 11 and is formed surrounding a plurality of first isolation openings 511, thereby blocking the light-emitting layer 600 and forming first light-emitting units 610 that are broken apart from each other. This reduces carrier crosstalk within the light-emitting layer 600, improves the display effect of the display panel 10, and eliminates the need to use a precision mask to manufacture the first light-emitting units 610, thereby reducing the development and use of precision masks and lowering manufacturing costs. The two second isolation portions 520 are provided spaced apart in the second pixel regulating layer 312, and when cutting the substrate 100, an annular cut is made in the substrate 100 between the two second isolation portions 520, reducing the possibility of cutting the first insulating layer 200, making it less likely for cracks to occur in the first insulating layer 200 and less likely for them to extend toward the display area 11.

[0254] In some optional embodiments, the display panel 10 further includes a second light-emitting unit 620 located on the side of the second isolation portion 520 facing the hole region 13, and in the step of making an annular cut in the substrate 100 within the first manufacturing groove, the method further includes: making an annular cut in the substrate 100 with the second light-emitting unit 620.

[0255] In these optional embodiments, the light-emitting layer 600 is broken at the location of the second isolation structure 500 to form a second light-emitting unit 620, thereby bringing the film layer structure between the two second isolation sections 520 closer to the film layer structure used for cutting in the related technology. When cutting the substrate 100 with the second light-emitting unit 620, the substrate 100 can be cut using conventional cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0256] In some optional embodiments, the display panel 10 further includes a second electrode 720 located on the side of the second isolation portion 520 toward the hole region 13, and in step S03, the method further includes: making an annular cut with respect to the substrate 100 with the second electrode 720.

[0257] In these optional embodiments, the first electrode layer 700 is broken at the location of the second isolation structure 500 to form the second electrode 720, thereby bringing the film layer structure between the two second isolation sections 520 closer to the film layer structure used for cutting in the related technology. When cutting the substrate 100 with the second electrode 720, the substrate 100 can be cut using conventional cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0258] In some optional embodiments, prior to step S03, the method further includes: manufacturing a first package material layer on the side of the pixel definition layer 300 away from the substrate 100; patterning the first package material layer to obtain a first portion 811 located in the display area 11 and a second portion 812 located in the transition area 12 and the hole area 13, at least a portion of which is located within the first cutout 210.

[0259] In step S03, the method further includes: making an annular cut in the substrate 100 in the second portion 812.

[0260] In these optional embodiments, by providing a second portion 812 of the first package layer 810 within the first manufacturing groove, the film layer structure within the first manufacturing groove is brought closer to the film layer structure used for cutting in related technologies, allowing the substrate 100 to be cut using conventional cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0261] In some optional embodiments, prior to step S03, the method further includes: manufacturing a third package material layer on the side of the second portion 812 away from the substrate 100; patterning the third package material layer to obtain a third portion 831 located in the display area 11 and a fourth portion 832 located in the transition area 12 and the pore area 13, wherein at least a portion of the fourth portion 832 is located within the first cutout 210.

[0262] In step S03, the method further includes: making an annular cut in the substrate 100 in the fourth portion 832.

[0263] In these optional embodiments, by providing a fourth portion 832 of the third package layer 830 within the first manufacturing groove, the film layer structure within the first manufacturing groove is brought closer to the film layer structure used for cutting in the related technology, allowing the substrate 100 to be cut using a conventional cutting device and known device parameters, thereby reducing the difficulty of cutting.

[0264] Optionally, before step S03, the method further includes: removing the second part.

[0265] In these optional embodiments, removing the second portion 812 reduces the thickness of the film layer in the transition region 12, making it easier to cut. Furthermore, removing the second portion 812 avoids the problem of cracks occurring in the second portion 812 due to cutting and extending toward the display region 11.

[0266] Optionally, after the step of manufacturing a first package material layer on the side of the pixel definition layer 300 away from the substrate 100, the method further includes: manufacturing a second package material layer on the side of the first package material layer away from the substrate 100; manufacturing a third package material layer on the side of the second package material layer away from the substrate 100; performing a patterning process on the third package material layer to cut off at least a portion of the third package material layer in the transition region 12 and the pore region 13 to obtain a third package layer 830, the third package layer 830 including a hole 833 located in the transition region 12 to avoid damage from the cut. In these optional embodiments, after manufacturing the third package material layer, the third package material layer is cut in the transition region 12 and the perforated region 13 to remove the third package material in the transition region 12 and the perforated region 13, forming holes 833 to avoid damage from cutting. This reduces the thickness of the brittle film layer of the display panel 10 at the locations of the holes 833 to avoid damage from cutting in the transition region 12 and the perforated region 13. When the substrate 100 is cut in the holes 833 to avoid damage from cutting, cracks are less likely to form in the third package layer 830, and any cracks that do form are less likely to extend toward the display region 11. [Explanation of symbols]

[0267] 10 Display panel, 11 Display area, 12 Transition area, 13 Hole area, 100 Substrate, 110 Underlay, 120 Protective film, 121 Fourth groove, 200 First insulating layer, 210 First cutout, 211 First opening, 212 Second opening, 220 Third cutout, 300 Pixel definition layer, 310 Pixel restriction layer, 311 First pixel restriction layer, 312 Second pixel restriction layer, 313 Extension, 320 Pixel opening, 321 First pixel opening, 400 Barrier, 500 Isolation structure, 501 First layer, 502 Second layer, 510 First isolation part, 511 First isolation opening, 520 Second isolation part, 600 Light-emitting layer, 610 First light-emitting unit, 620 Second light-emitting unit, 700 710 First electrode layer, 720 Second electrode, 810 First package layer, 811 First section, 812 Second section, 813 First thin-walled section, 820 Second package layer, 830 Third package layer, 831 Third section, 832 Fourth section, 833 Cut avoidance section, 834 Second thin-walled section, 840 Cut-off groove.

Claims

1. A display panel comprising a display area, a perforated area, and a transition area located between the display area and the perforated area, circuit board and A first insulating layer located on the substrate, A pixel definition layer located on the side of the first insulating layer away from the substrate, the pixel definition layer includes a pixel regulating layer that surrounds and forms a pixel aperture, A light-emitting layer including a light-emitting unit located within the pixel aperture, The light-emitting unit comprises an inorganic package layer located on the side away from the substrate, The inorganic package layer includes a first package layer and a third package layer, wherein the third package layer is located on the side of the first package layer away from the substrate. The display panel further includes a barrier located on the side of the first insulating layer away from the substrate, The pixel restricting layer extends to the surface of the barrier that is separated from the substrate and contacts the third package layer. A display panel characterized by the following features.

2. The first insulating layer has a first cutout portion located in the transition region and spaced apart from the display region, the first cutout portion extending from the transition region to the boundary between the hole region and the transition region. The display panel according to feature 1.

3. A first package layer located on the side of the light-emitting unit away from the substrate and located in the first portion of the display area, A second package layer located on the side of the first package layer away from the substrate, The present invention further comprises a third package layer located on the side of the second package layer away from the substrate, The display panel according to feature 2.

4. An isolation structure located on one side of the substrate, further comprising an isolation structure including a first isolation portion located in the display area, A first isolation aperture is formed by being surrounded by the first isolation portion, the pixel definition layer includes a first pixel restriction layer located in the display area, the pixel aperture includes a first pixel aperture formed by being surrounded by the first pixel restriction layer, and the first pixel aperture communicates with the first isolation aperture. The light-emitting unit includes a first light-emitting unit located in the first isolation opening, The display panel further includes a first electrode layer located on the side of the light-emitting layer away from the substrate, the first electrode layer having first electrodes spaced apart from each other, each of the first electrodes located in the first isolation opening, and the spaced-apart first electrodes are electrically connected by the first isolation portion. The display panel according to feature 2.

5. The first isolation portion includes a first layer, each of the first electrodes is electrically connected to the first layer, and the first electrodes that are spaced apart from each other are electrically connected through the first layer. The display panel according to feature 4.

6. The barrier is provided between the first isolation portion and the first cutout portion and is annular in shape surrounding the transition region, there are two or more barriers, the pixel restricting layer further includes an extended portion connected to the first pixel restricting layer, at least a portion of the extended portion is located on the surface of the barrier away from the substrate, and the extended portion extends to the transition region. The display panel according to feature 4.

7. The extended portion is provided in a non-continuous manner in the transition region. The display panel according to feature 6.

8. The isolation structure further includes a second isolation portion located in the transition region, The second isolation portion is provided at a distance from the hole region, and the first package layer further includes a second portion located in the transition region, at least a portion of the second portion located within the first cutout, and the second portion is blocked by the second isolation portion, forming a plurality of subsections, with blocking grooves located in the isolation structure formed between adjacent subsections. The subsection includes a first thin-walled portion located on at least one side of the second isolation portion, The pixel definition layer includes a second pixel regulating layer located within the first cutout, and the second isolation portion is located on the side of the second pixel regulating layer away from the substrate. The light-emitting unit includes a second light-emitting unit located on the side of the second isolation portion facing the hole region, The display panel according to feature 4.

9. The third package layer includes a relief hole located in the transition region, the orthographic projection of the hole region onto the substrate is located within the orthographic projection of the relief hole onto the substrate, the orthographic projection of the first cutout onto the substrate and the orthographic projection of the relief hole onto the substrate at least partially overlap, and the first cutout is provided penetrating the first insulating layer along the thickness direction of the display panel. The first weight-reducing portion includes a first opening and a second opening provided opposite to each other along the thickness direction of the display panel, wherein the first opening is located on the side of the second opening away from the substrate, and the orthographic projection of the second opening onto the substrate is located within the orthographic projection of the first opening onto the substrate. The first insulating layer has a third cutout in the transition region, and the third cutout surrounds the first cutout and is provided with a gap between them. Multiple of the aforementioned third weight-reducing portions are provided at intervals. The display panel according to feature 3.

10. A display panel comprising a display area, a perforated area, and a transition area located between the display area and the perforated area, circuit board and A first insulating layer located on the substrate, A pixel definition layer located on the side of the first insulating layer away from the substrate, the pixel definition layer includes a pixel regulating layer that surrounds and forms a pixel aperture, A light-emitting layer including a light-emitting unit located within the pixel aperture, An isolation structure located on one side of the substrate and located in the display area, An inorganic package layer located on the side of the light-emitting unit away from the substrate, comprising a first package layer and a third package layer, wherein the third package layer is located on the side of the first package layer away from the substrate, A second package layer located between the first package layer and the third package layer, The first insulating layer further comprises a barrier located on the side away from the substrate, At least a portion of the second package layer and the pixel definition layer are in contact between the isolation structure and the barrier. A display panel characterized by the following features.

11. A display panel comprising the display panel according to any one of claims 1 to 10, A display device characterized by the following features.

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