Shingled interconnect failure detection device, system and method

Abstract

A shingled interconnect failure detection device (1) comprises: an energy supply including a detection connection terminal (2) extending therefrom, the detection connection terminal (2) being connectable to a shingled component (11) to be detected; and a controller connected to the energy supply and controlling and measuring the energy supply of the energy supply to the shingled component (11) to be detected and the feedback of the shingled component (11) to be detected, so as to detect whether the shingled interconnect has failed. A shingled interconnect failure detection system and method are also provided. The detection device, system and method of the present invention can greatly shorten the evaluation cycle of failure detection, and the reliability evaluation is convenient and accurate.

Description

Technical Field

[0001] The present invention relates to a solar crystalline silicon shingled component packaging application performance testing device, system and method, and in particular to a shingled interconnection failure detection device, system and method. Background Art

[0002] With the accelerated consumption of conventional fossil energy such as coal, oil, and natural gas, the ecological environment is deteriorating, and the greenhouse gas emissions are leading to increasingly severe global climate change. The sustainable development of human society has been seriously threatened. Considering the limited stock of non-renewable energy and the serious environmental pollution caused by conventional fossil energy, countries around the world have formulated their own energy development strategies to cope with the limited resources of conventional fossil energy and the environmental problems caused by its development and utilization. Under this world trend, solar energy has become one of the most important renewable energy sources with its reliability, safety, extensiveness, longevity, environmental protection, and sufficient resources, and is expected to become the main pillar of global electricity supply in the future.

[0003] In the context of vigorously promoting and using solar green energy, researchers have found that shingled module technology can significantly increase module power. Shingled technology uses special graphic design to re-cut the entire solar cell into small graphics, and then use conductive glue to glue two adjacent pieces together to make a module. Shingled technology can reduce module losses and increase module output power by optimizing the module structure and reducing interconnection strips.

[0004] First, shingled modules use the electrical principle of low current and low loss (the power loss of photovoltaic modules is directly proportional to the square of the working current) to greatly reduce the power loss of the modules. Secondly, shingled modules generate electricity by laying more cells in the cell module, and the energy density per unit area is higher. In addition, conductive adhesives are used to replace the photovoltaic ribbons used in conventional modules. Photovoltaic ribbons show a higher series resistance in the entire cell, and the resistance of the circuit formed by conductive adhesives is much smaller than that of the method using ribbons. Compared with conventional photovoltaic modules, shingled modules have higher conversion efficiency and less risk of fragmentation at the interconnection points between cells after cutting.

[0005] At present, shingled modules use conductive adhesives to interconnect the cut cells. The conductive adhesive is mainly composed of a conductive phase and an adhesive phase and completes the current transmission between the interconnected cells. Among them, the conductive phase is mainly composed of precious metals, such as pure silver particles or silver-coated copper particles. The shape and distribution of the particles are based on the optimal electrical conduction loss. At present, flaky combined silver powder with a D50<10um level is mostly used. The adhesive phase is mainly composed of weather-resistant polymer resin polymers. Usually, acrylic resin, silicone resin, epoxy resin, etc. are selected according to the bonding strength and weathering stability. In order to make the conductive adhesive bonding achieve low contact resistance and volume resistivity, have high adhesion and maintain long-term excellent weathering resistance, the general conductive adhesive manufacturer appropriately designs the conductive phase and the adhesive phase, so as to ensure the stability of the performance of the shingled module in the initial stage of environmental corrosion testing and long-term outdoor actual application conditions. At present, the shingled module is a brand-new product that has not been widely used in the market. The reliability evaluation and identification of the product itself mainly adopts international standards such as IEC-61215 and IEC-61730. The testing is not fundamentally different from conventional PV panels and cannot effectively and accurately detect 100% of failures.

[0006] In the process, lasers and other methods are used to cut standard-sized crystalline silicon cells into equal parts, and the cells are cut into small pieces. Then, conductive glue is applied to the back silver or front silver of the cells to interconnect the pieces and package them into shingled modules. Compared with the traditional metal welding ribbon alloying interconnection, the bonding strength of the glued stacking in the front core process is weak. For the shingled module process and finished product quality inspection, there is currently no fast and effective method to identify connecting welds with bonding or conductive defects. Usually, under normal process conditions, the bonding strength of the shingled module is mainly judged by the bonding strength between the sheets, that is, the shear tension, and the uniformity of the electrical conduction of the shingled module is judged by electroluminescence EL. This online quality inspection cannot effectively characterize the current transmission carrying capacity of the conductive glue-bonded battery, nor can it detect the weather resistance of long-term outdoor use. It can only be used as an initial state performance evaluation, and the ability to identify microstructural defects is limited.

[0007] In order to detect whether the long-term outdoor weather resistance has failed, environmental tests are usually carried out according to the relevant test standards of the International Electrotechnical Commission IEC. These tests take a long time to complete, which is difficult to judge the quality assessment of large-scale production, and is not conducive to the guarantee of process processing performance and the reliability verification of material introduction and finished products.

[0008] Therefore, in order to solve the above problems, an improved shingled interconnect failure detection device, system and method are urgently needed. Summary of the invention

[0009] In order to overcome the above problems in the prior art, the present invention provides a shingled interconnect failure detection device, system and method. The specific contents are as follows.

[0010] (1) A shingled interconnect failure detection device, comprising:

[0011] An energy supplier, including a detection connection terminal extending therefrom, the detection connection terminal being connectable to a shingled assembly to be detected;

[0012] The controller is connected to the energy supplier and controls and measures the energy supply of the energy supplier to the shingled assembly to be tested and the feedback of the shingled assembly to be tested, so as to detect whether the shingled interconnection fails.

[0013] (2) The shingled interconnect failure detection device as described in item (1), wherein the controller comprises:

[0014] a measuring module for measuring the energy supply of the energy supplier to the shingled assembly to be tested and the feedback of the shingled assembly to be tested, and

[0015] A comparison module connected to the measurement module for communication compares the feedback measurement result obtained by the measurement module with a reference value pre-stored in the comparison module, and determines whether the shingled interconnection fails based on the comparison result.

[0016] (3) The shingled interconnect failure detection device as described in item (1) or (2), wherein the energy supplier has a safety protector with an automatic overload protection function.

[0017] (4) The shingled interconnect failure detection device as described in item (1) or (2), wherein the energy supplier is detachable.

[0018] (5) The shingled interconnect failure detection device as described in item (1) or (2), wherein the shingled interconnect failure detection device further comprises an environment detection module connected to the controller for detecting the surrounding environment.

[0019] (6) The shingled interconnect failure detection device as described in item (5), wherein the environmental detection module includes a temperature sensor and a humidity sensor.

[0020] (7) The shingled interconnect failure detection device as described in item (1) or (2), wherein the shingled interconnect failure detection device also has an interactive interface.

[0021] (8) The shingled interconnect failure detection device as described in item (1) or (2), wherein the energy supply includes a DC regulated power supply.

[0022] (9) The shingled interconnect failure detection device as described in item (8), wherein the DC regulated power supply is rechargeable.

[0023] (10) The shingled interconnect failure detection device as described in item (8), wherein the shingled interconnect failure detection device is portable.

[0024] (11) A shingled interconnect failure detection device as described in item (1) or (2), wherein the detection connection terminal can be rolled into the device.

[0025] (12) The shingled interconnect failure detection device as described in item (2), wherein the measurement result includes time nodes, which include the turn-on nodes of the shingled components and the holding time of the maximum current allowed to pass.

[0026] (13) The shingled interconnect failure detection device as described in item (1) or (2), wherein the test environment of the detection device is: temperature 10-30°C, humidity 50±10%.

[0027] (14) The shingled interconnect failure detection device as described in item (8), wherein the loading voltage range of the DC regulated power supply is 0 to 1000 V and the current range is 0 to 100 A.

[0028] (15) The shingled interconnect failure detection device as described in item (1) or (2), wherein the detection connection terminal is connected to the battery string of the shingled assembly to be detected.

[0029] (16) A shingled interconnect failure detection system, comprising the shingled interconnect failure detection device described in any one of (1) to (15) above, further comprising:

[0030] A test bench for carrying the shingled assembly to be tested;

[0031] An environmental control device is arranged around the test bench to control the test environment conditions.

[0032] (17) The shingled interconnect failure detection system of item (16), wherein the detection station is configured to be at least partially insulated.

[0033] (18) The shingled interconnect failure detection system as described in item (16) or (17), wherein the detection station comprises:

[0034] A clamping device, used to fix the shingled assembly to be tested on the testing table;

[0035] Insulation components are provided at separate areas of the shingled assembly.

[0036] (19) The shingled interconnect failure detection system as described in item (18), wherein the insulating component includes a raising fixture or an insulating layer.

[0037] (20) The shingled interconnect failure detection system as described in item (16), wherein the environmental control device is capable of controlling temperature and humidity.

[0038] (21) In the shingled interconnect failure detection system as described in item (20), the environmental control device controls the temperature to 10-30°C and the humidity to 50±10%

[0039] (22) A method for detecting shingled interconnect failure, comprising:

[0040] A slicing step, separating the shingle assembly into slicing pieces at the shingle welds;

[0041] An insulating step of insulating the separated areas by using insulating components;

[0042] A detection step is to use the shingled interconnection failure detection device described in any one of items (1) to (15) to detect whether the shingled interconnection of the shingled assembly placed on the detection table has failed.

[0043] (23) The method for detecting shingled interconnect failure as described in item (22), wherein, in the detection step, an energy supply is provided to the shingled assembly by an energy supply device;

[0044] Under the control of the controller, the measuring module measures the energy supply of the energy supplier to the shingled assembly to be tested and the feedback of the shingled assembly to be tested, and the comparison module connected to the measuring module for communication compares the feedback measurement result obtained by the measuring module with the reference value pre-stored in the comparison module, and determines whether the shingled interconnection fails based on the comparison result.

[0045] (24) A method for detecting shingled interconnect failure as described in item (23), wherein the energy supply is a DC regulated power supply that applies a maximum current allowed to pass through the shingled component.

[0046] (25) A method for detecting shingled interconnect failure as described in item (23), wherein the feedback measurement result is a hold time measured by a measurement module of a controller.

[0047] (26) A method for detecting shingled interconnect failure as described in item (23), wherein the feedback measurement result is the retention time of the maximum current passing through the local area measured by the measurement module of the controller.

[0048] (27) A method for detecting shingled interconnect failure as described in item (22) or (23), wherein the slicing step is performed by physical mechanical manual or automatic separation.

[0049] (28) A method for detecting failure of shingled interconnects as described in item (22) or (23), wherein the insulating step is to set a heightening fixture or insert an insulating layer in the separated area.

[0050] The shingled interconnect failure detection device proposed in the present invention overcomes the aforementioned problems existing in the prior art, can greatly shorten the evaluation cycle of failure detection, and the reliability evaluation is very convenient and accurate. Specifically, the present invention can objectively and impartially evaluate the strength of the conductive adhesive bonding interface overcurrent capability in the conductive shingled assembly, can accurately characterize whether the conductive adhesive bonding overcurrent failure will occur in a relatively short time, and can freely set stricter conditions for the conductive adhesive product performance itself to meet the most stringent test condition requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 is a schematic diagram of a shingled interconnect failure detection device according to the present invention.

[0052] Figure 2 It is a working schematic diagram of the shingled interconnect failure detection system according to the present invention.

[0053] Figure 3 It is a manufacturing flow chart of shingled modules.

[0054] Figure 4 It is a flow chart of a detection method using a shingled interconnect failure detection device according to the present invention.

[0055] The reference numerals in the figure respectively represent: 1. Shingled interconnect failure detection equipment; 2. Detection connection terminal; 3. Interactive interface; 4. Elevation fixture; 5. Inspection table; 11. Shingled module; 12. Shingled module end lead; 13. Battery cell connection weld; 14. Local area. DETAILED DESCRIPTION

[0056] The technical solution of the present invention is further described below in the form of specific embodiments in conjunction with the accompanying drawings, but the present invention is not limited to these embodiments.

[0057] In this field, shingled small pieces are bonded and interconnected by conductive glue to form shingled components. Shingled cells can be single crystal cells or polycrystalline cells, or future mainstream high-efficiency cells, such as heterojunctions. The overlap of the sheets is preferably 0.1 mm to 3 mm, and the shingled cells and glue bonding modes can be used for front silver + conductive glue + back silver, front silver + conductive glue + aluminum back field, no front silver (front silver with auxiliary grid) + conductive glue + no back silver (with aluminum auxiliary grid / aluminum back field), etc. The conductive glue can be acrylic resin, silicone resin, epoxy resin, etc. commonly used on the market. The current output of the shingled battery is led out by the tin-coated copper strip end lead to the auxiliary loading current, or other process equipment that can be electrically conductively connected is used. The preparation of the shingled component can be done by dispensing, spraying or silk-screening. After the complete shingled component is completed, a connecting weld is formed between two adjacent shingled cell sheets.

[0058] The present invention is dedicated to the detection of shingled interconnect failure of shingled components, and adopts a detection method of local area forward overcurrent to effectively characterize the overcurrent capacity of the conductive adhesive body and its bonding interface of front silver and back silver. In the present invention, a local area forward current is loaded at both ends of the positive and negative electrodes of the shingled component, and a set current is continuously loaded to record the time of maintaining connectivity. The strength of the conductive adhesive bonding interface and the ability to achieve electrical conduction are comprehensively evaluated based on the magnitude of the local area forward current loaded and the duration of the connection. It can also accurately determine whether overcurrent heating can reproduce the conductive adhesive bonding failure, and can evaluate whether the conductive adhesive is bonded to the front silver and back silver in the shortest time. Compared with the long cycle of long-term environmental weathering tests, there is a certain probability of failure recurrence, which can effectively and accurately detect whether the local area forward overcurrent will fail.

[0059] Follow the steps below Figure 1 The shingled interconnect failure detection device 1 according to the present invention is described in detail.

[0060] The shingled interconnection failure detection device 1 according to the present invention includes an energy supply, preferably a detachable DC regulated power supply, including a detection connection terminal 2 extending therefrom, the detection connection terminal 2 can be connected to the shingled assembly 11 to be detected, more specifically, connected to the shingled battery string to be detected, and the detection connection terminal 2 can be rolled into the device to facilitate carrying the device. The device also includes a controller for detecting whether the shingled interconnection has failed. The controller is connected to the energy supply, controls and measures the energy supply of the energy supply to the shingled assembly to be detected and the feedback of the shingled assembly to be detected, and can control the output current and voltage of the DC regulated power supply. The energy supply of the shingled interconnection failure detection device 1 may include a DC regulated power supply, and its loading voltage range is preferably 0 to 1000V, and its current range is preferably 0 to 100A. The DC regulated power supply has a positive electrode and a negative electrode, which is used to connect to the shingled assembly 11 to be detected through the detection connection terminal 2 via a power connection line. After the complete shingled assembly 11 is manufactured, a connecting weld 13 is formed between two adjacent shingled battery cells (see Figure 2 ). Select the middle weld. If the shingled assembly is an even number of strings, take the middle weld. If the shingled assembly is an odd number of strings, take the middle weld to the right or left. For example, for a standard 6-inch shingled battery, a physical mechanical manual or automatic separation method is used, and the steel silicon sheet with a thickness of preferably 0.05mm is used to directly separate the slices from the shingled welds of the previous and next slices. During detection, the selected middle weld is used to set the overcurrent local area 14 in the standard weld area. The detection connection terminal 2 of the shingled interconnection failure detection device 1 is connected to the local area 14 to allow current to flow through the local area 14.

[0061] The controller has a built-in measurement module for measuring the energy supply of the energy supplier to the shingled component 11 to be detected and the feedback of the shingled component to be detected, and the feedback includes time nodes, and the time nodes include the conduction time node of the component 11, the maximum current holding time allowed to pass through the component 11, etc. In addition, the controller also has a built-in comparison module connected to the measurement module for communication, which is used to compare the measured time node with the reference value pre-stored in the comparison module, and judge whether the shingled interconnection fails by comparing the result. For example, when the positive and negative poles of the shingled component are loaded with a local area forward current and the set current is continuously loaded, if the measured time node is higher than the pre-set reference value, the shingled interconnection is considered normal, otherwise the shingled interconnection is considered to be failed. The shingled interconnection failure detection device 1 also has an interactive interface 3, which can display voltage, current and time nodes. At the same time, the interactive interface 3 can also display the above-mentioned result of judging whether the shingled interconnection fails. The detection connection terminal 2 is used to electrically connect the positive and negative poles of the DC regulated power supply to the component end leads 12 at both ends of the shingled component 11. In order to prevent the separated areas from physically contacting each other and causing electrical connection, a heightening fixture 4 is provided in the local area 14 , ie, the separated area, or an insulating layer is inserted in the separated area.

[0062] Preferably, the shingled interconnect failure detection device 1 further comprises an environment detection module connected to the controller for detecting the surrounding environment, and the temperature and humidity are detected by a temperature sensor and a humidity sensor arranged in the environment detection module.

[0063] The shingled interconnection failure detection device 1 according to the present invention is portable, and the DC regulated power supply is rechargeable.

[0064] Regarding the forward overcurrent test environment of the local area 14, an operating environment under normal temperature conditions may be adopted, preferably a temperature of 10 to 30°C and a humidity of 50±10%.

[0065] The present invention also provides a shingled interconnect failure detection system, comprising the aforementioned shingled interconnect failure detection device 1, a test bench 5 and an environmental control device, wherein the test bench 5 is used to carry the shingled assembly 11 to be tested. During the detection process, the shingled assembly 11 is placed on the test bench 5. At the same time, in order to ensure the safety of the test, the test bench 5 is configured to be at least partially insulated. The test bench 5 includes: a clamping device for fixing the shingled assembly 11 to be tested on the test bench 5; and an insulating component arranged in a separated area of ​​the shingled assembly 11. The insulating component includes a heightening fixture 4 or an insulating layer. The environmental control device is used to set the test environment conditions, and the test environment conditions include temperature and humidity. The environmental control device controls the temperature to 10-30°C and the humidity to 50±10%.

[0066] The following reference Figure 3The shingled battery manufacturing method and the shingled interconnection failure detection method are described in detail. The shingled battery can be manufactured as follows:

[0067] The first step is the cutting step. Use laser cutting and other methods to cut the shingled battery into 1 to n pieces, and test the heat affected zone, cutting depth, cutting line width and other indicators of the shingled pieces formed by cutting. If it is judged as unqualified after online inspection, it is considered an NG piece. The laser cutting and slicing process can support the use of lasers with smaller band energy. The mass production process can regularly test the forward and reverse leakage of the cut shingled pieces to ensure that the laser cutting meets the reliability requirements of subsequent products.

[0068] The second step is to remove NG pieces. The shingled pieces after the cracking are inspected by CCD visual inspection. After screening, the NG pieces with poor appearance are automatically removed online, and the relative position coordinate information is output to the transfer robot or motion module to realize the loading of the pieces to the printing platform or dispensing platform.

[0069] The third step is the gluing step. The conductive glue is applied to the shingled pieces by printing or dispensing. After gluing, the online glue line detection is performed to remove the NG pieces with missing and uneven glue lines. The conductive glue is carried by the screen or loaded by the sealed syringe, and the gluing operation is completed at a certain rate by the printing machine or high-precision dispensing equipment.

[0070] The fourth step is the stacking step. The stacking robot or motion module picks up the qualified laminated battery pieces after the test and performs effective stacking according to the predetermined stacking width. The stacking accuracy preferably meets x, y + / - 150um and theta = + / - 0.05°, where x represents the stacking gradient, y represents the stacking overlap, and theta represents the stacking rotation angle.

[0071] The fifth step is the end lead welding step. The stacking is completed in a string according to the number of interconnected shingled components that meet a certain current and voltage output, and the complete shingled components are automatically punched and cut through the online end leads for welding to meet the current extraction or power-on clamping. The end lead welding can be carried out after the shingled components are completed or before the current shingled components are completed during the stacking process. The end leads 12 can be coated with different materials (such as a design combination of elements such as tin, lead, bismuth, silver, and indium).

[0072] After the above steps, a complete shingled assembly 11 is manufactured, and the shingled interconnection failure detection device 1 according to the present invention can be used to detect whether the shingled interconnection has failed. Figure 4 , the detection method according to the present invention is carried out as follows.

[0073] Separation and segmentation step. As mentioned above, after the complete component 11 is manufactured, the middle weld is selected to set the local current area 14, and the current passes through the local area 14 within a standard weld area. For example, for a standard 6-inch side-length shingled battery, a physical mechanical manual or automatic separation method is used, and the steel silicon sheet with a thickness of preferably 0.05mm is used to directly separate the slices from the upper and lower stacking welds. After curing at room temperature, the high modulus conductive glue needs to be externally heated to make the conductive glue itself form a higher elastic body, so that the local area can be effectively separated and segmented by mechanical or manual methods.

[0074] Insulation step. To prevent the conductive glue, front silver and back silver from contacting and conducting electricity under gravity, which will eventually affect the current value passing through the local area 14, a heightening fixture is set or an insulating layer is inserted into the separated area so that the separated areas cannot be physically in contact. For the junction between the separated area and the unseparated area (i.e., the local area 14), considering that the crystalline silicon cell itself is brittle and easy to break, it can be covered in the local area 14 by setting a target length.

[0075] Detection steps. The shingled component 11 is placed on the detection table 5, and the detection connection terminal 2 of the shingled interconnect failure detection device effectively connects the positive and negative terminal leads 12 of the component 11, and the connection part meets the maximum current value. The energy supply of the shingled interconnect failure detection device has a safety protector with an automatic overload protection function to ensure that there are safety protection facilities during the power-on process and has an automatic overload protection function. And it has a time recording function after power-on, recording the screenable time nodes, such as the node when the component 11 is turned on, the maximum current holding time allowed to pass through the component 11, etc. The power-on sequence of the energy supply of the shingled interconnect failure detection device is mainly to first turn on the component 11, pass a small current to the component 11, and pass a large current to the component 11. The holding time is measured by the measurement module during the power-on process. Afterwards, the comparison module compares the measured on-off current size and holding time with the preset reference value. When a local area forward current is loaded at both ends of the positive and negative poles of the shingled component and the set current is continuously loaded, if the measured time node is higher than the preset reference value, the shingled interconnection is considered normal, otherwise the shingled interconnection is considered to be failed. The above-mentioned time nodes and the values ​​of battery, voltage, time node and comparison results are all displayed on the interactive interface 3 of the DC regulated power supply. The ability of the conductive glue to pass a large current during bonding is evaluated by the size of the on-off current and the length of time it is maintained, and when a certain large current that is preset in the local area 14 is passed (generally, it can be set to be more than 5 times the normal working current density, and the current density is calculated by the set current and the size of the local area 14), a "circuit break" occurs, that is, the working interface window of the power supply 1 shows a state of no current passing. According to the characteristics of the conductive glue, products with poor quality performance show that the current value is too small and the time it is maintained is too short. When the "circuit break" phenomenon occurs during the power-on process, reselect and adjust the power-on voltage value, and continue to increase the voltage value at both ends of the component 11. When the conductive adhesive is "broken" due to quality differences, it mainly manifests as a defect in the interface connection. The high-voltage mode is used to re-establish a path in the "broken" state. Eventually, a path will be formed locally in a local area, and then failure may occur according to the size of the current passing through, such as the appearance of physical burn points.

[0076] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications, supplements or alternatives to the specific embodiments described, but will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.

Claims

1. A shingled interconnect failure detection device (1), characterized in that: include: An energy supplier, comprising a detection connection terminal (2) extending therefrom, wherein the detection connection terminal (2) is capable of being connected to a shingled assembly (11) to be detected; A controller is connected to the energy supplier and controls and measures the energy supply of the energy supplier to the shingled assembly (11) to be tested and the feedback of the shingled assembly (11) to be tested, so as to detect whether the shingled interconnection fails. Among them, the controller is configured to load a local area forward current at both ends of the positive and negative poles of the shingled assembly and continuously load a set current to record the time of maintaining connectivity. The conductive adhesive's ability to pass large currents during bonding is evaluated based on the size of the local area forward current and the length of time the connectivity is maintained. The large current is more than 5 times the current density of the shingled assembly during normal operation.

2. The shingled interconnect failure detection device (1) according to claim 1, characterized in that: The controller comprises: A measurement module for measuring the energy supply of the energy supplier to the shingled assembly (11) to be tested and the feedback of the shingled assembly (11) to be tested, and A comparison module connected to the measurement module for communication compares the feedback measurement result obtained by the measurement module with a reference value pre-stored in the comparison module, and determines whether the shingled interconnection fails based on the comparison result.

3. The shingled interconnect failure detection device (1) according to claim 1 or 2, characterized in that: The energy supplier is provided with a safety protector with an automatic overload protection function.

4. The shingled interconnect failure detection device (1) according to claim 1 or 2, characterized in that: The energy supplier is detachable.

5. The shingled interconnect failure detection device (1) according to claim 1 or 2, characterized in that: The shingled interconnect failure detection device further includes an environment detection module connected to the controller for detecting the surrounding environment.

6. The shingled interconnect failure detection device (1) according to claim 5, characterized in that: The environment detection module includes a temperature sensor and a humidity sensor.

7. The shingled interconnect failure detection device (1) according to claim 1 or 2, characterized in that: The shingled interconnect failure detection device also has an interactive interface (3).

8. The shingled interconnect failure detection device (1) according to claim 1 or 2, characterized in that: The energy supplier includes a DC regulated power supply.

9. The shingled interconnect failure detection device (1) according to claim 8, characterized in that: The DC regulated power supply is rechargeable.

10. The shingled interconnect failure detection device (1) according to claim 8, characterized in that: The shingled interconnect failure detection device is portable.

11. The shingled interconnect failure detection device (1) according to claim 1 or 2, characterized in that: The detection connection end can be rolled into the device.

12. The shingled interconnect failure detection device (1) according to claim 2, characterized in that: The measurement results include time nodes, which include the turn-on nodes of the shingled component (11) and the holding time of the maximum current allowed to pass.

13. The shingled interconnect failure detection device (1) according to claim 1 or 2, characterized in that: The test environment of the detection equipment is: temperature 10~30℃, humidity 50±10%.

14. The shingled interconnect failure detection device (1) according to claim 8, characterized in that: The loading voltage range of the DC regulated power supply is 0-1000V, and the current range is 0-100A.

15. The shingled interconnect failure detection device (1) according to claim 1 or 2, characterized in that: The detection connection terminal (2) is connected to the battery string of the shingled assembly to be detected.

16. A shingled interconnect failure detection system, characterized in that: The shingled interconnect failure detection device (1) according to any one of claims 1 to 15, further comprising: A testing platform (5) for carrying a shingled assembly (11) to be tested; An environmental control device is arranged around the test bench to control the test environment conditions.

17. The shingled interconnect failure detection system according to claim 16, wherein: The test station (5) is configured to be at least partially insulated.

18. The shingled interconnect failure detection system according to claim 16 or 17, characterized in that: The test bench (5) comprises: A clamping device, used for fixing the shingled assembly (11) to be tested on the testing table (5); An insulating component is provided in a separated area of ​​the shingled assembly (11).

19. The shingled interconnect failure detection system according to claim 18, characterized in that: The insulating component comprises a raising fixture (4) or an insulating layer.

20. The shingled interconnect failure detection system according to claim 16, wherein: The environmental control device is capable of controlling temperature and humidity.

21. The shingled interconnect failure detection system according to claim 20, wherein the environmental control device controls the temperature to 10-30°C and the humidity to 50±10%.

22. A method for detecting shingled interconnect failure, characterized in that: include: A slicing step, separating the shingle assembly (11) into slicing pieces at the shingle welds; An insulating step of insulating the separated areas by using insulating components; A detection step, using the shingled interconnection failure detection device (1) according to any one of claims 1 to 15 to detect whether the shingled interconnection of the shingled assembly (11) placed on the detection table (5) has failed, the detection step comprising: A local area forward current is loaded at both ends of the positive and negative electrodes of the shingled assembly and a set current is continuously loaded to record the time the connection is maintained. The ability of the conductive adhesive to pass a large current during bonding is evaluated based on the size of the local area forward current and the length of time the connection is maintained. The large current is more than 5 times the current density of the normal operation of the shingled assembly.

23. The method for detecting shingled interconnect failure according to claim 22, characterized in that: In the detection step, an energy supplier provides energy to the shingled assembly (11); Under the control of the controller, the measuring module measures the energy supply of the energy supplier to the shingled assembly (11) to be tested and the feedback of the shingled assembly (11) to be tested, and the comparison module connected to the measuring module for communication compares the feedback measurement result obtained by the measuring module with the reference value pre-stored in the comparison module, and determines whether the shingled interconnection fails based on the comparison result.

24. The method for detecting shingled interconnect failure according to claim 23, characterized in that: The energy supply is a DC regulated power supply that applies a maximum current allowed to pass through the shingled assembly (11).

25. The method for detecting shingled interconnect failure according to claim 23, characterized in that: The feedback measurement result is the holding time measured by the measurement module of the controller.

26. The method for detecting shingled interconnect failure according to claim 24, characterized in that: The feedback measurement result is the retention time of the maximum current passing through the local area (14) measured by the measurement module of the controller.

27. The method for detecting shingled interconnect failure according to claim 22 or 23, characterized in that: The slicing step adopts a physical mechanical manual or automatic separation method.

28. The method for detecting shingled interconnect failure according to claim 22 or 23, characterized in that: The insulating step is to set a heightening fixture or insert an insulating layer into the separated area.

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