Magnetic field sensor package with integrated passive components

By integrating passive components in semiconductor chips and electrically coupled with integrated circuits and magnetic field sensors, the shortcomings in existing magnetic field sensor packages in terms of size and temperature stability are solved, and a smaller package size and stable operation in high temperature environments are achieved.

CN111863788BActive Publication Date: 2025-03-25INFINEON TECHNOLOGIES AG
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Patent Information

Application Number
CN202010326510.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2019-04-24
Filing Date
2020-04-23
Publication Date
2025-03-25
Estimated Expiration
2040-04-23

AI Technical Summary

Technical Problem

Existing magnetic field sensor packages have shortcomings in size and temperature stability, especially in high temperature environments where additional cooling measures are required, while the layout of integrated circuits is limited due to the complex chip carrier structure.

Method used

By integrating at least one passive component, such as a capacitor, in a semiconductor chip, and electrically coupling the integrated circuit and magnetic field sensor with these passive components, the package size is reduced and temperature stability is improved.

Benefits of technology

The magnetic field sensor package is reduced in size, able to operate in high temperature environments without additional cooling, and simplifies the structural design of the chip carrier.

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Abstract

The present disclosure relates to a magnetic field sensor package with integrated passive components. The magnetic field sensor package includes a chip carrier, a magnetic field sensor arranged on the chip carrier, an integrated circuit arranged on the chip carrier, and at least one integrated passive component, the magnetic field sensor being designed to acquire a magnetic field, the integrated circuit being designed to logically process a sensor signal provided by the magnetic field sensor, and the at least one integrated passive component being electrically coupled to at least one of the magnetic field sensor or the integrated circuit.
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