367results about "Magnetic sensor packaging" patented technology

The three-axis Hall magnetic sensing chip comprises a magnet gathering body, a first Hall element group and a second Hall element group, the first Hall element group and the second Hall element group are arranged in a plane at intervals, the magnet gathering body is arranged on Hall elements, and the orthographic projection of the magnet gathering body on a Hall plane has a first direction symmetry axis and a second direction symmetry axis which are orthogonal. The first Hall element group comprises two first Hall elements which are connected in a contrast difference mode, wherein the magnetic induction centers of the two first Hall elements are located on a first-direction symmetric axis and are symmetrically arranged relative to a second-direction symmetric axis. The second Hall element group comprises two second Hall elements which are located on the same side of the first direction symmetry axis and are symmetrically arranged relative to the second direction symmetry axis, and the magnetic induction centers of the two second Hall elements are perpendicular to the connecting line between the orthogonal intersection points of the first direction symmetry axis and the second direction symmetry axis; the magnetism gathering body is located on one side of the connecting line of the two magnetic induction centers. According to the invention, a high inter-axis signal rejection ratio is realized, and the Z-axis signal can be directly output.

A force sensor has a sensing system including a target piece and a sensing element, configured to provide changes of a magnetic field, being generated by motion of the target piece. The sensing element senses these changes and provides a signal representative of the position of the target piece. An integrated circuit with processing means can process signals from the sensing element. A semiconductor package includes at least the integrated circuit. A flexible piece includes the target, and it is attached to the semiconductor package. The attachment area between the flexible piece and the semiconductor package does not extend beyond the top projection, or outline, of the semiconductor package. The flexible piece receives a force stimulus, so that upon exerting a force on the flexible piece, the displacement of the target piece with respect to the surface of the semiconductor package can be sensed by the sensing element.

Electronic device uses a sensor to determine whether an accessory device covers a housing or the housing and a display. When the electronic device determines, based on the sensor, the housing and display are covered by the accessory device, the electronic device may deactivate the display. Further, when the electronic device determines, based on the sensor, the housing is covered by multiple sections of the accessory device, the electronic device may permit a processor to run at a higher temperature limit, as opposed to a single section covering the housing. In this regard, the accessory device functions as a thermal buffer to absorb thermal energy from the processor(s) running at the higher temperature limit. Additionally, based on the position of the accessory device relative to the electronic device, the electronic device may further activate applications, animations, production information (e.g., regarding the accessory device), or a combination thereof.

An electronic device may include: a magnetic sensor configured to identify the intensity of a magnetic field; a wireless communication circuit; a processor; and memory electrically connected to the magnetic sensor, the wireless communication circuit, and the processor, and storing instructions. The processor may be configured so that the electronic device: uses the magnetic sensor to identify a plurality of intensities of the magnetic field during a first period; identifies, on the basis of the plurality of intensities, whether a reference intensity has been updated; identifies a first state of the electronic device when the reference intensity has been updated, the first state being identified on the basis of a comparison result between the latest intensity among the plurality of intensities and the updated reference intensity; and performs a function according to the identified first state. Various other embodiments identified through the specification are possible.

The invention discloses a zero magnetic shielding device and a use method thereof, and the device comprises a magnetic shielding cylinder which is composed of a shielding cylinder body and a shielding cover detachably connected with the shielding cylinder body. And the non-magnetic multifunctional test frame is arranged in the magnetic shielding cylinder and consists of an arc-shaped seat, a lifting mechanism, a test bedplate, a track, a storage rack, a Helmholtz coil and a folding nylon magnetic sensing assembly. When the magnetic flux and residual magnetism switching test is carried out on the object to be tested in the magnetic shielding cylinder, the non-magnetic multifunctional test frame does not need to be replaced, the efficiency of the magnetic flux and residual magnetism switching test on the object to be tested in the magnetic shielding cylinder is improved, and the advantage of convenient switching test is achieved. And the method has the advantages of high measurement precision and wide application range.

A current sensor has: a bus bar extending in a first direction; a magnetic shield having a portion that faces the bus bar along a third direction; a magnetic sensor facing the bus bar along the third direction on an opposite side of the bus bar to a side on which the magnetic shield is placed; and a case molded integrally with part of the bus bar. The magnetic shield has: a U-shaped portion that has a bottom wall including a portion that faces the bus bar along the third direction and also has two side walls, facing each other in the second direction, that is erected in the third direction from ends of the bottom wall in a second direction; an attachment portion that is adjoined to the U-shaped portion and is fixed to the case; and a link portion that links the U-shaped portion and attachment portion together.

The invention discloses a highly packaged magnetic sensing chip based on an NV color center, and the chip comprises a packaging housing (1) which is provided with a packaging pedestal and chip pins. The chip is characterized in that the chip also comprises an NV color center diamond (2) which is arranged on the packaging base; the laser diode bare chip (3) is arranged on the packaging base, and the light-emitting side of the laser diode bare chip faces the NV color center diamond; the microwave transmission microstrip line (4) is arranged between the interior and the edge of the packaging base and is electrically connected with the chip pins; the first photoelectric detector assembly (5) is arranged on the NV color center diamond and used for collecting fluorescence signals.

The invention relates to the technical field of TMR sensors, and particularly discloses a TMR sensor convenient to overhaul, which comprises a base, a mounting mechanism is mounted on the back surface of the base through bolts, a clamping frame is fixedly mounted on the front surface of the base, a sensor body is inserted into the clamping frame, and elastic limiting mechanisms are fixedly mounted in the middles of the two sides of the clamping frame. The sensor body is installed in the clamping frame through an elastic limiting mechanism, the bottom of the sensor body is fixedly connected with a detection probe, the rotating disc is rotated by twisting the adjusting handrail, the torsional spring is tightened, the arc-shaped limiting clamp faces outwards, then the sensor body is inserted into the clamping frame, and the adjusting handrail is loosened. During disassembly, the adjusting knob handle is twisted to enable the arc-shaped limiting clamps to be separated, the arc-shaped limiting clamps and the like are arranged in a concentric circle mode, it is ensured that the sensor body is stably disassembled and assembled, and the device can rapidly and stably complete disassembly and assembly.

The present invention discloses a DC magnetic field testing device for a magnetic field coil, comprising a device main body, a display component provided on the front end surface of the device main body, a control button provided on the front end surface of the device main body, a charging port provided on the bottom of the device main body, a probe cable fixedly connected to the top of the device main body, a Hall probe fixedly connected to the other end of the probe cable, a rectangular block fixedly connected to the outer surface of the Hall probe, a protective tube fixedly connected to the right side surface of the device main body, a storage component fixedly connected to the back of the device main body, and a charging component provided on the bottom of the device main body; the DC magnetic field testing device for a magnetic field coil can more intuitively display the remaining power of the device by providing the display component, and can issue an alarm when the power is too low to remind the user to charge; the protective component provided can protect the Hall probe after use to prevent damage to the probe.

Various embodiments disclosed herein comprise systems and methods to arrange magnetic field sensors. In some examples a magnetic field detection system comprises a sensor holder and magnetometers. The sensor holder mounts the magnetometers proximate to a magnetic field source that generates a magnetic field. The magnetometers measure the magnetic field in multiple directions. A first portion of the magnetometers measures a normal component of the magnetic field and a first tangential component of the magnetic field, and a second portion of the magnetometers measures the normal component of the magnetic field and a second tangential component of the magnetic field. The sensor holder distributes the first portion of the magnetometers and the second portion of the magnetometers, so the tangential components measured by neighboring ones of the magnetometers mounted to the sensor holder are orthogonal.

A metal detecting system using search-coil type sensor includes sensor modules that detect respective objects which move around the corresponding sensor modules, each sensor module having one or more sensors that include respective housings having respective inner spaces, respective cores formed to be inserted into the inner spaces of the housings, and respective coils which are each wound around a portion of an outer circumferential surface of each of the housings, the portion corresponding to a position of each of the cores; imaging units that image the respective objects that move around the corresponding sensor modules and image respective persons possessing the respective objects; impedance matching units that are connected to a plurality of the sensor modules, respectively, and perform impedance matching; and amplifiers that are connected to the impedance matching units, respectively, and amplify a fine current and voltage generated during approach of the objects to the sensor modules.

In described examples, an integrated circuit (IC) written on a substrate that includes a substrate surface includes a magnetic concentrator, a Hall sensor, a primary coil, and a secondary coil. The Hall sensor at least partially overlaps the magnetic concentrator. The primary coil at least partially overlaps the magnetic concentrator. The secondary coil at least partially overlaps the magnetic concentrator and the primary coil, and surrounds the Hall sensor.

There is provided a current sensor including: a conductor having a first terminal portion for inputting a current and a second terminal portion for outputting the current which are arranged on one side in a first axial direction, the second terminal portion being separated from the first terminal portion in a second axial direction intersecting the first axial direction, a turn portion which is arranged on another side in the first axial direction, a first body portion which connects one end of the turn portion and the first terminal portion, and a second body portion which is separated from the first body portion in the second axial direction, to connect another end of the turn portion and the second terminal portion; a magnetic sensor which is arranged on the conductor or near the conductor; and a package.

Apparatuses, systems, and methods are provided for a magnetic sensing device including one or more linear magnetic sensors, such as Hall sensors. In some embodiments, the magnetic sensing device includes a housing, a substantially cylindrical shield mechanically coupled to the housing, a magnet disposed within a cavity defined by the substantially cylindrical shield, wherein the magnet defines a countersunk cavity, and / or a printed circuit board assembly (PCBA) disposed proximate a first end of the magnet opposite a second end of the magnet proximate an end of the housing proximate a measured medium.

A magnetometer system having a magneto-inductive sensor configured to provide satellite attitude determination, magnetic noise identification, and magnetic field information; electronics operably coupled to the sensor configured to protect against electrostatic discharge and measure temperature of the sensor for thermal calibration; and an aluminum chassis supporting and protecting the sensor.

The present invention discloses a stacked die assembly. A sensor device (1) includes: a lead frame (9); first / second semiconductor dies (2a) having first / second sensor structures (4a, 14a) at first / second sensor positions (L1, L2), and a plurality of first / second bonding pads (7a, 7b) electrically connected to the lead frame (9); the semiconductor die has a square or rectangle with a geometric center (6a); the sensor positions (L1, L2) are offset from the geometric center; the second die (2b) is stacked on top of the first die (2a) and is rotated by a non-zero angle and optionally also offset or displaced (DX, DY) relative to the first die (2a) such that the vertical projections of the first sensor position (L1) and the second sensor position (L2) coincide.

The present disclosure provides a measuring device for a magnetic flux conductor assembly of a torque sensor, the measuring device comprising: a support assembly; the fixing assembly is arranged on the supporting assembly; the motor is arranged on the supporting assembly, and a magnet is arranged on a motor shaft of the motor; the magnetic flux measuring assembly is arranged on the fixing assembly; and the magnetic flux conductor assembly is detachably arranged on the fixing assembly so as to measure the hysteresis performance of the magnetic flux conductor assembly through the magnetic flux measurement assembly.

A sensor package is proposed, including a tunneling magnetoresistance (TMR) sensor chip and a buffer layer having a modulus of elasticity of less than 1 GPa at a temperature of 20° C. The buffer layer is fitted on and / or under the TMR sensor chip.

The invention relates to a Wiegand sensor arrangement (100) comprising: a Wiegand sensor (3) with a Wiegand wire (3.2), a sensor coil (3.3) surrounding the Wiegand wire (3.2), a first field conducting element (3.4) arranged at a first end (3.2.1) of the Wiegand wire (3.2), and a second field conducting element (3.5) arranged at a second end (3.2.2) of the Wiegand wire (3.2) opposite the first end (3.2.1), as well as a printed circuit board (2) on which the Wiegand sensor (3) is arranged, wherein the first field conducting element (3.4) and the second field conducting element (3.5) each have a fastening section (3.4.4, 3.5.4), wherein the Wiegand sensor (3) is connected to the printed circuit board (2) via the fastening section (3.4.4) of the first field conducting element (3.4) and the fastening section (3.5.4) of the second field conducting element (3.5) is fastened to the circuit board (2), wherein the fastening section (3.4.4) of the first field conducting element (3.4) and the fastening section (3.5.4) of the second field conducting element (3.5) are designed such that between the sensor coil (3.3) and the printed circuit board (2) there is an installation space (6) which is laterally delimited by the fastening section (3.4.4) of the first field conducting element (3.4) and the fastening section (3.5.4) of the second field conducting element (3.5), and wherein at least one component (4, 5) is arranged on the printed circuit board (2) in the installation space (6).

In a magnetic sensor having a structure in which a magnetic sensor module is housed in a housing, damage to a magnetosensitive element during assembly is prevented. A magnetic sensor (S) is provided with a housing (2, 3), a magnetic sensor module (1) housed in the housing (2, 3), and an insulating dummy substrate (4). A magnetic sensor module (1) is provided with: an insulating substrate (10); a sensor chip (100) mounted on the upper surface (11) of the substrate (10); a terminal electrode (72) provided on the upper surface (11) of the substrate (10); a wiring pattern (82) provided on the lower surface (12) of the substrate (10); a first via conductor (V12) that is provided through the substrate (10) and connects one end of the wiring pattern (82) and the terminal electrode (72); and a second via conductor (V32) that is provided through the substrate (10) and connects the other end of the wiring pattern (82) and the sensor chip (100). The dummy substrate (4) is disposed between the inner wall of the frame (2, 3) and the lower surface (12) of the substrate (10).

A sensor device contains a magnetic field sensor chip having a front face, a rear face and a side surface connecting the front face and the rear face. The magnetic field sensor chip has a sensor element which is arranged on the front face and is configured to detect a magnetic field component running parallel to the front face. The magnetic field sensor chip furthermore has multiple first contact pads arranged on the front face, wherein all of the first contact pads arranged on the front face are arranged at an edge of the magnetic field sensor chip lying between the front face and the side surface.

A thermally insulated container (10) includes an inner container (11) and an outer container (14) surrounding the inner container (11) via a void (15). The inner container (11) and the outer container (14) contain a fiber reinforced plastic prepared by impregnating a base material with a resin. The inner container (11) includes a first tubular container (13) and a second tubular container (22) having internal accommodation spaces (23, 24) to reserve a refrigerant (16), and a refrigerant inlet tube (12) for introduction of the refrigerant (16). The accommodation space (24) is in communication with the accommodation space (23). The base materials in predetermined areas of the second tubular container (22) and the outer container (14) contain woven fabrics and unidirectional fiber sheets. The outer container (14) surrounds the second tubular container (22) such that the unidirectional fiber sheets in the respective predetermined areas are opposed to each other.

Various embodiments disclosed herein comprise systems and methods to conform magnetic field sensors to a target geometry. In some examples, an apparatus is configured to conform to a target geometry. The apparatus comprises a sensor mount and a sensor array. The sensor mount comprises a flexible state for a first environmental condition and a rigid state for a second environmental condition. The sensor mount transitions from the flexible state to the rigid state when the first environmental condition transitions to the second environmental condition. The sensor mount transitions from the rigid state to the flexible state when the second environmental condition transitions to the first environmental condition. The sensor array is coupled to the sensor mount.

A force sensor comprises a sensing system including a magnet and a sensing element, configured to provide changes of a magnetic field, being generated by motion of the magnet. The sensing element senses these changes and provides a signal representative of the position of the magnet. An integrated circuit with processing means can process signals from the sensing element. A semiconductor package includes at least the integrated circuit. A flexible piece comprises the target, and it is attached to the semiconductor package, where the attachment area between the flexible piece and the semiconductor package does not extend beyond the top projection, or outline, of the semiconductor package. The flexible piece receives a force stimulus, so that upon exerting a force on the flexible piece, the displacement of the magnet with respect to the surface of the semiconductor package can be sensed by the sensing element.

A user computing device includes one or more first sensors that output one or more first signals based on a magnetic field measured via the one or more first sensors and one or more processors configured to execute instructions to perform operations. The operations include detecting whether the user computing device is receiving a charge from a charging device. When the user computing device is not receiving the charge, the operations include determining, based on the one or more first signals output by the one or more first sensors, whether the user computing device is proximate to the charging device, and when the user computing device is determined, based on the one or more first signals output by the one or more first sensors, to be proximate to the charging device, providing an output indicating the user computing device is not receiving the charge.

Magnetic field sensor and method of manufacturing a magnetic field sensor This magnetic field sensor comprises a sensor head, the sensor head having a printed circuit board terminal portion (18) of a printed circuit board (12) as well as a Hall element (22) and a ring magnet (16) on the printed circuit board terminal portion (18). The ring magnet (16) surrounds the printed circuit board end portion (18), and the Hall element (22) is partially arranged inside the ring magnet (16). The printed circuit board end portion (18), comprising the ring magnet (16) and the Hall element (22), is arranged in an encapsulation housing (14) made as an injection-molded plastic part. The encapsulation housing (14) permanently fixes the ring magnet (16) relative to the Hall element (22). (See Figure 7 for abbreviations.)

The invention relates to a current measuring arrangement (10) for detecting an electric current in at least one current conductor (1), comprising a magnetic flux conductor arrangement (20) which includes at least one magnetic flux conductor (24) at least partially enclosing the at least one current conductor (1), and at least one magnetic field sensor (12) which is arranged on a circuit carrier (3) in an air gap (LS) of the at least one magnetic flux conductor (24) and is designed to detect magnetic field lines of a magnetic field caused by the electric current flow in the at least one current conductor (1) in the at least one magnetic flux conductor (24), wherein the magnetic flux conductor arrangement (20) with the at least one magnetic flux conductor (24) is designed in multiple parts with a base body (20A) which is connected to the circuit carrier (3) and forms at least one receiving space (22) for the at least one current conductor (1), and a cover (20B).which is connected to the base body (20A) and covers the at least one receiving space (22) for the at least one current conductor (1), and a method for mounting such a current measuring arrangement (10).

In order to provide measuring devices (16) built from identical modules and adapted for different measuring geometries for the contactless measurement of a material parameter, in particular a load, in a test object with stable signal transmission quality even under harsh operating conditions, the invention provides a measuring device (22) for the contactless acquisition of a material parameter on a test object (12), comprising a sensor (18, 18a-18d) for distance-dependent contactless acquisition of the material parameter and a carrier part (20) to which the sensor (18, 18a-18d) can be attached, as well as a connecting device (26) for mechanically and electrically connecting the sensor (18, 18a-18d) and the carrier part (20) in order to transmit a signal, wherein the connecting device (26) is designed such that the sensor (18, 18a-18d) can be variably selected and attached to the carrier part along at least one axis. can be.