270results about "Magnetic sensor packaging" patented technology

The three-axis Hall magnetic sensing chip comprises a magnet gathering body, a first Hall element group and a second Hall element group, the first Hall element group and the second Hall element group are arranged in a plane at intervals, the magnet gathering body is arranged on Hall elements, and the orthographic projection of the magnet gathering body on a Hall plane has a first direction symmetry axis and a second direction symmetry axis which are orthogonal. The first Hall element group comprises two first Hall elements which are connected in a contrast difference mode, wherein the magnetic induction centers of the two first Hall elements are located on a first-direction symmetric axis and are symmetrically arranged relative to a second-direction symmetric axis. The second Hall element group comprises two second Hall elements which are located on the same side of the first direction symmetry axis and are symmetrically arranged relative to the second direction symmetry axis, and the magnetic induction centers of the two second Hall elements are perpendicular to the connecting line between the orthogonal intersection points of the first direction symmetry axis and the second direction symmetry axis; the magnetism gathering body is located on one side of the connecting line of the two magnetic induction centers. According to the invention, a high inter-axis signal rejection ratio is realized, and the Z-axis signal can be directly output.

A force sensor has a sensing system including a target piece and a sensing element, configured to provide changes of a magnetic field, being generated by motion of the target piece. The sensing element senses these changes and provides a signal representative of the position of the target piece. An integrated circuit with processing means can process signals from the sensing element. A semiconductor package includes at least the integrated circuit. A flexible piece includes the target, and it is attached to the semiconductor package. The attachment area between the flexible piece and the semiconductor package does not extend beyond the top projection, or outline, of the semiconductor package. The flexible piece receives a force stimulus, so that upon exerting a force on the flexible piece, the displacement of the target piece with respect to the surface of the semiconductor package can be sensed by the sensing element.

Electronic device uses a sensor to determine whether an accessory device covers a housing or the housing and a display. When the electronic device determines, based on the sensor, the housing and display are covered by the accessory device, the electronic device may deactivate the display. Further, when the electronic device determines, based on the sensor, the housing is covered by multiple sections of the accessory device, the electronic device may permit a processor to run at a higher temperature limit, as opposed to a single section covering the housing. In this regard, the accessory device functions as a thermal buffer to absorb thermal energy from the processor(s) running at the higher temperature limit. Additionally, based on the position of the accessory device relative to the electronic device, the electronic device may further activate applications, animations, production information (e.g., regarding the accessory device), or a combination thereof.

An electronic device may include: a magnetic sensor configured to identify the intensity of a magnetic field; a wireless communication circuit; a processor; and memory electrically connected to the magnetic sensor, the wireless communication circuit, and the processor, and storing instructions. The processor may be configured so that the electronic device: uses the magnetic sensor to identify a plurality of intensities of the magnetic field during a first period; identifies, on the basis of the plurality of intensities, whether a reference intensity has been updated; identifies a first state of the electronic device when the reference intensity has been updated, the first state being identified on the basis of a comparison result between the latest intensity among the plurality of intensities and the updated reference intensity; and performs a function according to the identified first state. Various other embodiments identified through the specification are possible.

The invention discloses a zero magnetic shielding device and a use method thereof, and the device comprises a magnetic shielding cylinder which is composed of a shielding cylinder body and a shielding cover detachably connected with the shielding cylinder body. And the non-magnetic multifunctional test frame is arranged in the magnetic shielding cylinder and consists of an arc-shaped seat, a lifting mechanism, a test bedplate, a track, a storage rack, a Helmholtz coil and a folding nylon magnetic sensing assembly. When the magnetic flux and residual magnetism switching test is carried out on the object to be tested in the magnetic shielding cylinder, the non-magnetic multifunctional test frame does not need to be replaced, the efficiency of the magnetic flux and residual magnetism switching test on the object to be tested in the magnetic shielding cylinder is improved, and the advantage of convenient switching test is achieved. And the method has the advantages of high measurement precision and wide application range.

The invention discloses a highly packaged magnetic sensing chip based on an NV color center, and the chip comprises a packaging housing (1) which is provided with a packaging pedestal and chip pins. The chip is characterized in that the chip also comprises an NV color center diamond (2) which is arranged on the packaging base; the laser diode bare chip (3) is arranged on the packaging base, and the light-emitting side of the laser diode bare chip faces the NV color center diamond; the microwave transmission microstrip line (4) is arranged between the interior and the edge of the packaging base and is electrically connected with the chip pins; the first photoelectric detector assembly (5) is arranged on the NV color center diamond and used for collecting fluorescence signals.

The present invention discloses a DC magnetic field testing device for a magnetic field coil, comprising a device main body, a display component provided on the front end surface of the device main body, a control button provided on the front end surface of the device main body, a charging port provided on the bottom of the device main body, a probe cable fixedly connected to the top of the device main body, a Hall probe fixedly connected to the other end of the probe cable, a rectangular block fixedly connected to the outer surface of the Hall probe, a protective tube fixedly connected to the right side surface of the device main body, a storage component fixedly connected to the back of the device main body, and a charging component provided on the bottom of the device main body; the DC magnetic field testing device for a magnetic field coil can more intuitively display the remaining power of the device by providing the display component, and can issue an alarm when the power is too low to remind the user to charge; the protective component provided can protect the Hall probe after use to prevent damage to the probe.

A metal detecting system using search-coil type sensor includes sensor modules that detect respective objects which move around the corresponding sensor modules, each sensor module having one or more sensors that include respective housings having respective inner spaces, respective cores formed to be inserted into the inner spaces of the housings, and respective coils which are each wound around a portion of an outer circumferential surface of each of the housings, the portion corresponding to a position of each of the cores; imaging units that image the respective objects that move around the corresponding sensor modules and image respective persons possessing the respective objects; impedance matching units that are connected to a plurality of the sensor modules, respectively, and perform impedance matching; and amplifiers that are connected to the impedance matching units, respectively, and amplify a fine current and voltage generated during approach of the objects to the sensor modules.

In described examples, an integrated circuit (IC) written on a substrate that includes a substrate surface includes a magnetic concentrator, a Hall sensor, a primary coil, and a secondary coil. The Hall sensor at least partially overlaps the magnetic concentrator. The primary coil at least partially overlaps the magnetic concentrator. The secondary coil at least partially overlaps the magnetic concentrator and the primary coil, and surrounds the Hall sensor.

There is provided a current sensor including: a conductor having a first terminal portion for inputting a current and a second terminal portion for outputting the current which are arranged on one side in a first axial direction, the second terminal portion being separated from the first terminal portion in a second axial direction intersecting the first axial direction, a turn portion which is arranged on another side in the first axial direction, a first body portion which connects one end of the turn portion and the first terminal portion, and a second body portion which is separated from the first body portion in the second axial direction, to connect another end of the turn portion and the second terminal portion; a magnetic sensor which is arranged on the conductor or near the conductor; and a package.

Apparatuses, systems, and methods are provided for a magnetic sensing device including one or more linear magnetic sensors, such as Hall sensors. In some embodiments, the magnetic sensing device includes a housing, a substantially cylindrical shield mechanically coupled to the housing, a magnet disposed within a cavity defined by the substantially cylindrical shield, wherein the magnet defines a countersunk cavity, and / or a printed circuit board assembly (PCBA) disposed proximate a first end of the magnet opposite a second end of the magnet proximate an end of the housing proximate a measured medium.

A magnetometer system having a magneto-inductive sensor configured to provide satellite attitude determination, magnetic noise identification, and magnetic field information; electronics operably coupled to the sensor configured to protect against electrostatic discharge and measure temperature of the sensor for thermal calibration; and an aluminum chassis supporting and protecting the sensor.

The present invention discloses a stacked die assembly. A sensor device (1) includes: a lead frame (9); first / second semiconductor dies (2a) having first / second sensor structures (4a, 14a) at first / second sensor positions (L1, L2), and a plurality of first / second bonding pads (7a, 7b) electrically connected to the lead frame (9); the semiconductor die has a square or rectangle with a geometric center (6a); the sensor positions (L1, L2) are offset from the geometric center; the second die (2b) is stacked on top of the first die (2a) and is rotated by a non-zero angle and optionally also offset or displaced (DX, DY) relative to the first die (2a) such that the vertical projections of the first sensor position (L1) and the second sensor position (L2) coincide.

A sensor package is proposed, including a tunneling magnetoresistance (TMR) sensor chip and a buffer layer having a modulus of elasticity of less than 1 GPa at a temperature of 20° C. The buffer layer is fitted on and / or under the TMR sensor chip.

The invention relates to a Wiegand sensor arrangement (100) comprising: a Wiegand sensor (3) with a Wiegand wire (3.2), a sensor coil (3.3) surrounding the Wiegand wire (3.2), a first field conducting element (3.4) arranged at a first end (3.2.1) of the Wiegand wire (3.2), and a second field conducting element (3.5) arranged at a second end (3.2.2) of the Wiegand wire (3.2) opposite the first end (3.2.1), as well as a printed circuit board (2) on which the Wiegand sensor (3) is arranged, wherein the first field conducting element (3.4) and the second field conducting element (3.5) each have a fastening section (3.4.4, 3.5.4), wherein the Wiegand sensor (3) is connected to the printed circuit board (2) via the fastening section (3.4.4) of the first field conducting element (3.4) and the fastening section (3.5.4) of the second field conducting element (3.5) is fastened to the circuit board (2), wherein the fastening section (3.4.4) of the first field conducting element (3.4) and the fastening section (3.5.4) of the second field conducting element (3.5) are designed such that between the sensor coil (3.3) and the printed circuit board (2) there is an installation space (6) which is laterally delimited by the fastening section (3.4.4) of the first field conducting element (3.4) and the fastening section (3.5.4) of the second field conducting element (3.5), and wherein at least one component (4, 5) is arranged on the printed circuit board (2) in the installation space (6).

In a magnetic sensor having a structure in which a magnetic sensor module is housed in a housing, damage to a magnetosensitive element during assembly is prevented. A magnetic sensor (S) is provided with a housing (2, 3), a magnetic sensor module (1) housed in the housing (2, 3), and an insulating dummy substrate (4). A magnetic sensor module (1) is provided with: an insulating substrate (10); a sensor chip (100) mounted on the upper surface (11) of the substrate (10); a terminal electrode (72) provided on the upper surface (11) of the substrate (10); a wiring pattern (82) provided on the lower surface (12) of the substrate (10); a first via conductor (V12) that is provided through the substrate (10) and connects one end of the wiring pattern (82) and the terminal electrode (72); and a second via conductor (V32) that is provided through the substrate (10) and connects the other end of the wiring pattern (82) and the sensor chip (100). The dummy substrate (4) is disposed between the inner wall of the frame (2, 3) and the lower surface (12) of the substrate (10).

A sensor device contains a magnetic field sensor chip having a front face, a rear face and a side surface connecting the front face and the rear face. The magnetic field sensor chip has a sensor element which is arranged on the front face and is configured to detect a magnetic field component running parallel to the front face. The magnetic field sensor chip furthermore has multiple first contact pads arranged on the front face, wherein all of the first contact pads arranged on the front face are arranged at an edge of the magnetic field sensor chip lying between the front face and the side surface.

A thermally insulated container (10) includes an inner container (11) and an outer container (14) surrounding the inner container (11) via a void (15). The inner container (11) and the outer container (14) contain a fiber reinforced plastic prepared by impregnating a base material with a resin. The inner container (11) includes a first tubular container (13) and a second tubular container (22) having internal accommodation spaces (23, 24) to reserve a refrigerant (16), and a refrigerant inlet tube (12) for introduction of the refrigerant (16). The accommodation space (24) is in communication with the accommodation space (23). The base materials in predetermined areas of the second tubular container (22) and the outer container (14) contain woven fabrics and unidirectional fiber sheets. The outer container (14) surrounds the second tubular container (22) such that the unidirectional fiber sheets in the respective predetermined areas are opposed to each other.

Various embodiments disclosed herein comprise systems and methods to conform magnetic field sensors to a target geometry. In some examples, an apparatus is configured to conform to a target geometry. The apparatus comprises a sensor mount and a sensor array. The sensor mount comprises a flexible state for a first environmental condition and a rigid state for a second environmental condition. The sensor mount transitions from the flexible state to the rigid state when the first environmental condition transitions to the second environmental condition. The sensor mount transitions from the rigid state to the flexible state when the second environmental condition transitions to the first environmental condition. The sensor array is coupled to the sensor mount.

A force sensor comprises a sensing system including a magnet and a sensing element, configured to provide changes of a magnetic field, being generated by motion of the magnet. The sensing element senses these changes and provides a signal representative of the position of the magnet. An integrated circuit with processing means can process signals from the sensing element. A semiconductor package includes at least the integrated circuit. A flexible piece comprises the target, and it is attached to the semiconductor package, where the attachment area between the flexible piece and the semiconductor package does not extend beyond the top projection, or outline, of the semiconductor package. The flexible piece receives a force stimulus, so that upon exerting a force on the flexible piece, the displacement of the magnet with respect to the surface of the semiconductor package can be sensed by the sensing element.

A user computing device includes one or more first sensors that output one or more first signals based on a magnetic field measured via the one or more first sensors and one or more processors configured to execute instructions to perform operations. The operations include detecting whether the user computing device is receiving a charge from a charging device. When the user computing device is not receiving the charge, the operations include determining, based on the one or more first signals output by the one or more first sensors, whether the user computing device is proximate to the charging device, and when the user computing device is determined, based on the one or more first signals output by the one or more first sensors, to be proximate to the charging device, providing an output indicating the user computing device is not receiving the charge.

Magnetic field sensor and method of manufacturing a magnetic field sensor This magnetic field sensor comprises a sensor head, the sensor head having a printed circuit board terminal portion (18) of a printed circuit board (12) as well as a Hall element (22) and a ring magnet (16) on the printed circuit board terminal portion (18). The ring magnet (16) surrounds the printed circuit board end portion (18), and the Hall element (22) is partially arranged inside the ring magnet (16). The printed circuit board end portion (18), comprising the ring magnet (16) and the Hall element (22), is arranged in an encapsulation housing (14) made as an injection-molded plastic part. The encapsulation housing (14) permanently fixes the ring magnet (16) relative to the Hall element (22). (See Figure 7 for abbreviations.)

The embodiment of the invention relates to a sensor device with a semiconductor substrate trench and a corresponding manufacturing method. The invention relates to a sensor arrangement comprising a magnetic field sensor chip. The magnetic field sensor chip includes a semiconductor substrate having a first surface and a second surface opposite the first surface; a sensor element arranged on the first surface, said sensor element being designed to detect a magnetic field present at the location of the sensor element; and at least one trench extending from at least one of the two surfaces into the semiconductor substrate. The sensor element is laterally spaced from the at least one trench.

The invention provides a high-temperature superconducting weak magnetic detection device and system, and the device comprises a Dewar which is internally provided with a refrigerant; the reading circuit module comprises a reading circuit board and a shielding shell; an annular cavity is formed in the shielding shell, and the reading circuit board is arranged in the shielding shell; the embedded structure is inserted into the Dewar, an installation position of an SQUID chip is arranged on the embedded structure, and a lead channel is arranged on the side wall of the embedded structure; and the heat insulation structure is fixed and filled in the upper end opening of the embedded structure. According to the high-temperature superconducting weak magnetic detection device and system, connectors and fasteners do not need to be disassembled and assembled frequently in the refrigerant filling process, and operation is convenient; electrostatic point discharge is not easy to generate, and the electrostatic damage rate of the high-temperature SQUID is reduced; the high-temperature SQUID does not need to be exposed in the air in the refrigerant filling process, performance degradation of the SQUID is avoided, and the service life and the performance stability of the SQUID are further ensured; the fault rate of the system is reduced in practical application, and the reliability and stability of the system are improved.

Disclosed are methods and devices for detecting retained surgical items or other objects having a magnetic signature within a corpus of a patient. The device can comprise a handle, a shaft extending from the handle, and a distal sensing portion positioned distally of the shaft. The distal sensing portion can comprise one or more gradiometers comprising a plurality of magnetometers. The device can further comprise one or more output components configured to generate a user output to alert a user of a detected object.

In an example, a Hall sensor can include an IC die formed on a lead frame that is configured to conduct a current, the IC die being configured to sense a magnetic field resulting from the current. The Hall sensor can include at least one magnetic permeability material film formed on the IC die. The Hall sensor can include at least one permalloy material layer formed on the respective at least one magnetic permeability material film, the at least one magnetic permeability material film and the at least one permalloy material layer combining to provide a magnetic concentrator providing concentration of the magnetic field.

This electric current sensor 10 allows a U-shaped magnetic shield to be fixed to a case with high positional accuracy without affecting an external magnetic field attenuation function of the U-shaped magnetic shield. The electric current sensor comprises: a bus bar 10 that extends in a first direction; a magnetic shield 30 that has a portion facing the bus bar 10 along a third direction; a magnetic sensor 20 that faces the bus bar along the third direction, on the side of the bus bar opposite the side where the magnetic shield is disposed; and a case 40 in which a part of the busbar 10 is integrally formed. The magnetic shield 30 has: a U-shaped part 31 having a bottom wall section 31B that includes a portion facing the bus bar 10 along the third direction, and two side wall sections 31W, 31W that rise along the third direction from the end sections of the bottom wall section 31B in a second direction and are disposed opposite to each other in the second direction; an attachment section 32 that is connected to the U-shaped part 31 and is fixed to the case; and a connecting section 33 that connects that U-shaped part 31 and the attachment section 32.

This application relates to a position detection device, comprising: a first Hall element; a second Hall element; a differential amplifier configured to generate a differential voltage by differentially amplifying a first Hall voltage generated by the first Hall element and a second Hall voltage generated by the second Hall element; a summing amplifier configured to generate a summed voltage by summing the first Hall voltage and the second Hall voltage; a comparator configured to compare a reference voltage with the differential voltage to generate an error voltage; and a current converter configured to generate a bias current supplied to the first Hall element and the second Hall element based on the error voltage, wherein the device is configured to detect the position of a detected object based on the summed voltage.

Measuring device (22) for the contactless detection of a material parameter on a test object (12), with a measuring sensor (18, 18a-18d) for the distance-dependent contactless detection of the material parameter and a carrier part (20) to which the measuring sensor (18, 18a-18d) can be attached, as well as a connecting device (26) for the mechanical and electrical connection of the measuring sensor (18, 18a-18d) and the carrier part (20) in order to transmit a signal, wherein the connecting device (26) is designed such that the measuring sensor (18, 18a-18d) can be attached to the carrier part in a variably selectable manner along at least one axis.