A single-rotation nozzle for cleaning particles on wafer surface
By designing a single-rotating nozzle for chip manufacturing, the problem of difficult cleaning of particles on the wafer surface is solved by using inert gas rotation and acceleration to match the liquid flow, and the effect of efficient cleaning and yield improvement is achieved.
CN111952209BActive Publication Date: 2025-03-25KINGSEMI CO LTD
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Patent Information
- Application Number
- CN201910397869.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2019-05-14
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2039-05-14
AI Technical Summary
Technical Problem
In the chip manufacturing process, especially from processes below 90 nanometers, particulate matter contamination on the silicon wafer is difficult to clean, resulting in a decrease in yield. Especially in the 3D process, wafer surface cleaning technology requires complexity and increased difficulty.
Method used
A single-rotating nozzle is designed to achieve efficient cleaning of the wafer surface through the structure of the inner core, shell and plug of the nozzle, using the rotation and acceleration of the inert gas, and the flow rate of the cleaning chemical liquid.
Benefits of technology
This device can efficiently clean the particulate matter on the wafer surface while not causing major damage to the wafer, thereby improving the yield of the wafer process.
✦ Generated by Eureka AI based on patent content.
Abstract
The present invention belongs to the field of wafer cleaning, specifically, a single-rotation nozzle for cleaning particles on the surface of a wafer, a liquid channel is provided on the inner core of the nozzle, liquid enters from one end of the liquid channel and is ejected from a liquid spray port located at the other end; one end of the inner core of the nozzle is inserted into a nozzle housing, one end of the nozzle housing is connected to the inner core of the nozzle, and the other end is internally connected to a nozzle inner plug, which is located between the nozzle housing and the inner core of the nozzle; there is space for inert gas to flow between the inner plug of the nozzle and the inner core of the nozzle, and between the inner plug of the nozzle and the outer shell of the nozzle, an inert gas inlet connected to the two spaces is provided on the outer shell of the nozzle, and an air distribution hole is provided on the inner plug of the nozzle, the two spaces are connected through the air distribution hole, and the inert gas in the two spaces converges on the inner side of the air distribution hole. The present invention can reduce the damage to the wafer and clean the wafer efficiently by changing the rotation direction and acceleration of the inert gas and coordinating the flow rate of the cleaning chemical liquid.
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