Heat conduction structure and manufacturing method thereof, and mobile device
By setting the first heat conduction layer and the second heat conduction layer in the heat conduction structure and optimizing their thickness and distribution, the problem of difficulty in dissipating heat in high-power components in thin and thin mobile devices is solved, and efficient heat conduction and heat dissipation effects are achieved.
CN112382620BActive Publication Date: 2025-03-28CTRON ADVANCED MATERIAL CO LTD
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Patent Information
- Application Number
- CN202010584446.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2019-06-28
- Filing Date
- 2020-06-24
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2040-06-24
AI Technical Summary
Technical Problem
现有技术难以开发出适用于高功率元件或装置的高效热传导结构,尤其是在轻薄化移动装置中散热需求增加的情况下。
Method used
A heat conduction structure is designed, including a thermal conduction unit, a first heat conduction layer, a metal microstructure, a second heat conduction layer and a working fluid. By providing the first and second heat conduction layers on both sides of the metal microstructure, and making their thickness and greater at the heat source end than the cooling end, the hydrophilicity of the metal microstructure and the circulation efficiency of the working fluid are increased.
Benefits of technology
It realizes efficient heat conduction and heat dissipation, is suitable for thin and light mobile devices, extends the life of the heat conduction structure and improves product trust.
✦ Generated by Eureka AI based on patent content.
Abstract
The name of the present invention is heat conduction structure and its manufacturing method and mobile device. The present invention discloses a heat conduction structure, which includes a heat conduction unit, a first heat conduction layer, a metal microstructure, a second heat conduction layer and a working fluid. The heat conduction unit forms a closed cavity, which has a relative bottom surface and a top surface in the closed cavity, and the opposite ends of the heat conduction unit serve as a heat source end and a cooling end respectively. The first heat conduction layer is arranged on the bottom surface and / or the top surface of the closed cavity. The metal microstructure is arranged on the first heat conduction layer. The second heat conduction layer is arranged on the side of the metal microstructure away from the first heat conduction layer. The working fluid is arranged in the closed cavity of the heat conduction unit. Among them, the sum of the thickness of the first heat conduction layer and the second heat conduction layer adjacent to the heat source end is greater than the sum of the thickness away from the heat source end. The present invention also discloses a manufacturing method and a mobile device.
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