A device that mixes or multiplies frequencies

Abstract

Disclosed is a device for mixing or multiplying frequencies, comprising: a metal shell, the metal shell comprising a box body and a cover body, the box body and the cover body being buckled together to define a metal cavity; at least one frequency conversion unit, the at least one frequency conversion unit comprising: a microstrip line, the microstrip line being located in the metal cavity; and a channel structure, the channel structure comprising a radio frequency signal input channel, a local oscillator signal input channel, and a signal output channel passing through the metal shell and coupled with the microstrip line respectively, at least one of the radio frequency signal input channel and the local oscillator signal input channel being introduced perpendicular to the plane where the microstrip line is located. The device can avoid the problem of poor integration caused by the radio frequency signal input channel, the local oscillator signal input channel, and the signal output channel existing in the same plane.

Description

Technical Field

[0001] The present disclosure relates to the field of communication technology, and in particular to a device for mixing or multiplying frequencies. Background Art

[0002] In recent years, terahertz wave technology, as an important research field, has received more and more attention at home and abroad. However, no matter in which aspect and in which frequency band terahertz waves are applied, they are inseparable from the reception of terahertz waves. For the most commonly used receiver based on superheterodyne system, the mixer that realizes frequency down-conversion is one of the key components. In solid-state terahertz radar and communication systems, since the low-noise amplifier is difficult to realize, the mixer becomes the first stage of the receiving end, so the performance of the mixer is directly related to the performance of the entire receiver system. At the same time, since it is difficult to realize a high-performance local oscillator source in the same frequency band, the use of subharmonic mixing technology is an effective way to solve this problem.

[0003] As system performance requirements increase, the requirements for receiver indicators are also increasing. In order to improve integration or imaging resolution, multi-channel integration of receivers is a key issue. Since the mainstream terahertz mixers currently use metal cavity materials such as copper or aluminum, which can achieve a good channel spacing distance, they are still spliced ​​in a single-channel independent form. However, due to the limitations of metal cavity machining requirements, it is difficult to reduce the multi-channel spacing to improve the overall integration. Summary of the invention

[0004] An object of the present disclosure is to solve at least one aspect of the above-mentioned problems and defects in the prior art.

[0005] According to an embodiment of the present disclosure, a device for mixing or multiplying frequencies is provided, comprising:

[0006] A metal shell, the metal shell comprising a box body and a cover body, the box body and the cover body are buckled together to define a metal cavity;

[0007] At least one frequency conversion unit, the at least one frequency conversion unit comprising:

[0008] a microstrip line, the microstrip line being located in the metal cavity; and

[0009] A channel structure, the channel structure comprising a radio frequency signal input channel, a local oscillator signal input channel and a signal output channel which pass through the metal shell and are respectively coupled to the microstrip line, at least one of the radio frequency signal input channel and the local oscillator signal input channel being introduced perpendicular to the plane where the microstrip line is located.

[0010] In some exemplary embodiments, the signal output channel is led out parallel to the plane where the microstrip line is located.

[0011] In some exemplary embodiments, the radio frequency signal input channel and the local oscillator signal input channel of the frequency conversion unit are both introduced perpendicularly to the plane where the microstrip line is located.

[0012] In some exemplary embodiments, the introduction directions of the radio frequency signal input channel and the local oscillator signal input channel of the frequency conversion unit are opposite.

[0013] In some exemplary embodiments, the radio frequency signal input channel adopts an H-plane probe transition structure, and the local oscillator signal input channel adopts an H-plane probe transition structure.

[0014] In some exemplary embodiments, when there are multiple frequency conversion units, the multiple frequency conversion units are divided into one or two groups, and the frequency conversion units in each group are arranged in one row or two rows along a direction perpendicular to the length direction of the microstrip line.

[0015] In some exemplary embodiments, when each group of the frequency conversion units is arranged in two rows along a direction perpendicular to the length direction of the microstrip line, the frequency conversion units in the two rows are aligned or staggered one by one in the length direction of the microstrip line.

[0016] In some exemplary embodiments, when the plurality of frequency conversion units are divided into two groups, the two groups of frequency conversion units are respectively disposed in the box body and the cover body and are mirror-symmetrical.

[0017] In some exemplary embodiments, the input signal channels of each row of the channel structures are parallel to each other and the ports are aligned. The input signal channels of each row of the channel structures are parallel to each other and the ports are aligned.

[0018] In some exemplary embodiments, one of the RF signal input channel and the local oscillator signal input channel is introduced parallel to the plane where the microstrip line is located and is coupled to the microstrip line through a turn, and the other of the RF signal input channel and the local oscillator signal input channel is introduced perpendicular to the plane where the microstrip line is located.

[0019] In some exemplary embodiments, the turning angle is 90°.

[0020] In some exemplary embodiments, the RF signal input channel adopts an E-plane probe transition structure, and the local oscillator signal input channel adopts an H-plane probe transition structure; or

[0021] The radio frequency signal input channel adopts an H-plane probe transition structure, and the local oscillator signal input channel adopts an E-plane probe transition structure.

[0022] In some exemplary embodiments, when there are multiple frequency conversion units, the multiple frequency conversion units are divided into one group or two groups, and the frequency conversion units in each group are arranged in a row along a direction perpendicular to the length direction of the microstrip line.

[0023] In some exemplary embodiments, when the plurality of frequency conversion units are divided into two groups, the two groups of frequency conversion units are respectively disposed in the box body and the cover body and are mirror-symmetrical.

[0024] In some exemplary embodiments, the input signal channels of the frequency conversion units in each row are parallel to each other and the ports are aligned. The input signal channels of the frequency conversion units in each row are parallel to each other and the ports are aligned.

[0025] In some exemplary embodiments, when there are multiple frequency conversion units, the local oscillator signal input channels of the multiple frequency conversion units are aggregated into one port through a power divider.

[0026] The device for mixing or multiplying frequencies according to the various embodiments of the present disclosure can avoid the problem of poor integration caused by the existence of a radio frequency signal input channel, a local oscillator signal input channel, and a signal output channel on the same plane. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A schematic diagram showing a terahertz mixer with a single frequency conversion unit according to an exemplary embodiment of the present disclosure is shown.

[0028] Figure 2 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to another exemplary embodiment of the present disclosure is shown.

[0029] Figure 3 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to yet another exemplary embodiment of the present disclosure is shown.

[0030] Figure 4 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to yet another exemplary embodiment of the present disclosure is shown.

[0031] Figure 5 A schematic diagram showing a terahertz mixer with a single frequency conversion unit according to another exemplary embodiment of the present disclosure is shown.

[0032] Figure 6 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to yet another exemplary embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0033] Although the present disclosure will be fully described with reference to the accompanying drawings containing preferred embodiments of the present disclosure, it should be understood before this description that a person of ordinary skill in the art can modify the invention described herein while obtaining the technical effects of the present disclosure. Therefore, it should be understood that the above description is a broad disclosure to a person of ordinary skill in the art, and its content is not intended to limit the exemplary embodiments described in the present disclosure.

[0034] In addition, in the detailed description below, for ease of explanation, many specific details are set forth to provide a comprehensive understanding of the disclosed embodiments. However, it is apparent that one or more embodiments may be implemented without these specific details. In other cases, known structures and devices are embodied in a schematic manner to simplify the accompanying drawings.

[0035] According to the overall inventive concept of the present disclosure, there is provided a device for mixing or multiplying frequencies, comprising: a metal shell, the metal shell comprising a box body and a cover body, the box body and the cover body being buckled together to define a metal cavity; at least one frequency conversion unit, the at least one frequency conversion unit comprising: a microstrip line, the microstrip line being located in the metal cavity; and a channel structure, the channel structure comprising a radio frequency signal input channel, a local oscillator signal input channel, and a signal output channel that pass through the metal shell and are respectively coupled to the microstrip line, at least one of the radio frequency signal input channel and the local oscillator signal input channel is introduced perpendicular to the plane where the microstrip line is located.

[0036] The terahertz mixer according to the present disclosure is a radio frequency transition microstrip line mixer, which mainly includes a metal shell, which includes a box body and a cover body connected to the box body, for example, by screws, and when the box body and the cover body are buckled together, a metal cavity can be defined in the metal shell. In addition, a band port standard flange structure is also provided on the metal shell. In order to facilitate the connection between the cover body and the box body, the terahertz mixer is also provided with alignment pins, etc.

[0037] Figure 1 A schematic diagram showing a terahertz mixer with a single frequency conversion unit according to an exemplary embodiment of the present disclosure is shown. Figure 2 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to another exemplary embodiment of the present disclosure is shown. Figure 3 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to yet another exemplary embodiment of the present disclosure is shown. Figure 4 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to yet another exemplary embodiment of the present disclosure is shown.

[0038] like Figure 1 and Figure 2As shown, the frequency conversion unit of the terahertz mixer includes a microstrip line 107 and a channel structure, and the microstrip line 107 is located in a metal cavity. The channel structure includes a radio frequency signal input channel 101, a local oscillator signal input channel 102 and a signal output channel respectively coupled to the microstrip line 107, and a portion of the microstrip line 107 extends into the metal cavity where the radio frequency signal input channel 101 and the local oscillator signal input channel 102 are located, so as to form an antenna 104 for receiving the radio frequency input signal and the local oscillator input signal. Among them, the composition and size parameters of other parts in the mixer can refer to the prior art, or other documents or patents.

[0039] The specific contents of this solution are described below in conjunction with more specific examples. It should be understood that the dimensions and proportions in the figures are only for illustration and have nothing to do with the actual structure.

[0040] like Figures 1 to 4 As shown, the RF signal input channel 101 and the local oscillator signal input channel 102 of the mixer according to the present disclosure are both introduced perpendicular to the plane where the microstrip line 107 is located. Here, the RF signal input channel 101 is transmitted perpendicular to the paper surface and inward, and the local oscillator signal input channel 102 is transmitted perpendicular to the paper surface and outward, and the signal output channel (in this embodiment, the intermediate frequency signal output channel) is led out parallel to the plane where the microstrip line 107 is located. The terahertz mixer changes the leading direction of the RF signal input channel 101 and the local oscillator signal input channel 102 from the direction parallel to the plane where the microstrip line 107 is located to the direction perpendicular to the plane where the microstrip line 107 is located, thereby avoiding the problem of poor integration caused by the RF signal input channel 101, the local oscillator signal input channel 102 and the signal output channel existing in the same plane, and while ensuring the basic high-frequency characteristics of the mixer, reduces the complexity and processing cost of multi-channel integration, improves the flexibility of the mixer integration method, and provides favorable conditions for further system integration.

[0041] The working process of the above mixer includes: the terahertz signal to be received is transmitted to the antenna 104 of the microstrip line 107 through the RF signal input channel 101 in the waveguide-transition-microstrip line structure of the H-plane probe; the local oscillator signal entering from the local oscillator signal input channel 102 is mixed with the RF signal in the gallium arsenide Schottky diode 109 after passing through the microstrip transition structure 107 of the duplexer and the local oscillator low-pass filter 106, and the RF signal is mixed with the second harmonic of the local oscillator, and the intermediate frequency signal after difference is reached through the intermediate frequency filter 108. The intermediate frequency signal output port 103 is then transmitted to the load through the SMA connector or other connectors such as 2.92mm. In order to avoid the DC bias caused by the inconsistency of the Schottky diode 109 pair, the ground wire 105 connected to the metal cavity is led out from the microstrip line 107, which can be applied to the nearest metal cavity through conductive silver glue, or can be welded to the nearest metal cavity through gold wire binding.

[0042] In such Figures 1 to 4 In the exemplary embodiment, the RF signal input channel 101 and the local oscillator signal input channel 102 are perpendicular to the plane where the microstrip line 107 is located, and can be machined by wire cutting in the cover or box of the metal cavity. The SMA connector 201 (or other connectors such as 2.92mm) is a through-wall structure, and the extension direction of its metal needle is parallel to the microstrip line 107, and can be welded to the intermediate frequency output port 103 of the microstrip line 107 through conductive glue, or a Rogers board can be used to achieve intermediate frequency transition welding.

[0043] In an exemplary embodiment of the present disclosure, Figures 1 to 4 As shown, the introduction directions of the RF signal input channel 101 and the local oscillator signal input channel 102 of the frequency conversion unit are opposite to avoid interference between the RF signal input channel 101 and the local oscillator signal input channel 102 and the components associated therewith in spatial position, and at the same time, the overall length of the microstrip line 107 can be shortened to improve the integration of the mixer. However, it should be noted that in some other embodiments of the present disclosure, the introduction directions of the RF signal input channel 101 and the local oscillator signal input channel 102 of the frequency conversion unit may also be the same. In addition, in some other embodiments of the present disclosure, the introduction directions of the RF signal input channel 101 and the local oscillator signal input channel 102 of the frequency conversion unit may also be non-parallel.

[0044] In an exemplary embodiment, Figures 2 to 4 As shown, when there are multiple frequency conversion units, the multiple frequency conversion units are arranged in a row along a direction perpendicular to the length direction of the microstrip line 107 (such as Figure 2 as shown) or two rows (as Figure 3 and Figure 4 shown).

[0045] In an exemplary embodiment, Figure 3 As shown, a plurality of frequency conversion units are arranged in two rows along a direction perpendicular to the length direction of the microstrip line 107 , and the frequency conversion units in the two rows are aligned one by one in the length direction of the microstrip line 107 .

[0046] In an exemplary embodiment, Figure 4 As shown, a plurality of frequency conversion units are arranged in two rows along a direction perpendicular to the length direction of the microstrip line 107 , and the frequency conversion units in the two rows are staggered one by one in the length direction of the microstrip line 107 .

[0047] In an exemplary embodiment, Figures 1 to 4As shown, the RF signal input channel 101 adopts an H-plane probe transition structure, and the local oscillator signal input channel 102 adopts an H-plane probe transition structure. In actual use, the H-plane probe transition structure needs to be optimized to reduce return loss and optimize the output characteristics of the intermediate frequency signal.

[0048] In an exemplary embodiment, Figures 2 to 4 As shown, the RF signal input channels 101 of each row of frequency conversion units are parallel to each other and their ports are aligned, and the local oscillator signal input channels 102 are parallel to each other and their ports are aligned, so as to ensure the consistency of the signal received by the receiver and the input local oscillator signal.

[0049] In the above embodiment, since the RF signal input channel 101 and the local oscillator signal input channel 102 are introduced into the plane where the microstrip line 107 is located, the spacing between the channels is shortened and the integration is improved. In actual use, the size of the connector may be too large to be further reduced, and a customized connector at the intermediate frequency output end may be used to achieve the purpose of small size.

[0050] Figure 5 A schematic diagram showing a terahertz mixer with a single frequency conversion unit according to another exemplary embodiment of the present disclosure is shown. Figure 6 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to yet another exemplary embodiment of the present disclosure is shown.

[0051] In an exemplary embodiment of the present disclosure, Figure 5 and Figure 6 As shown, the RF signal input channel 101 of the frequency conversion unit is introduced parallel to the length direction of the microstrip line 107, and is coupled to the microstrip line 107 through a 90° turn. The local oscillator signal input channel 102 of the frequency conversion unit is introduced perpendicular to the plane where the microstrip line 107 is located, and the signal output channel is led out parallel to the plane where the microstrip line 107 is located. In this way, the problem of poor integration caused by the RF signal input channel 101, the local oscillator signal input channel 102 and the signal output channel existing in the same plane is avoided, and while ensuring the basic high-frequency characteristics of the mixer, the complexity and processing cost of multi-channel integration are reduced, the flexibility of the mixer integration method is improved, and favorable conditions are provided for further system integration.

[0052] The working process of the above mixer includes: the terahertz signal to be received is transmitted to the antenna 104 of the microstrip line 107 through the RF signal input channel 101 in the waveguide-transition-microstrip line structure of the E-plane probe; the local oscillator signal entering from the local oscillator signal input channel 102 is mixed with the RF signal in the gallium arsenide Schottky diode 109 after passing through the microstrip transition structure 107 of the duplexer and the local oscillator low-pass filter 106, and the RF signal is mixed with the second harmonic of the local oscillator, and the intermediate frequency signal after difference is reached through the intermediate frequency filter 108. The intermediate frequency signal output port 103 is then transmitted to the load through the SMA connector or other connectors such as 2.92mm. In order to avoid the DC bias caused by the inconsistency of the Schottky diode 109 pair, the grounding wire structure 105 connected to the metal cavity is led out from the microstrip line 107, which can be applied to the nearest metal cavity through conductive silver glue, or can be welded to the nearest metal cavity through gold wire binding.

[0053] In such Figure 5 and Figure 6 In the exemplary embodiment, the RF signal input channel 101 is parallel to the length direction of the microstrip line 107, and the local oscillator signal input channel 102 is perpendicular to the plane where the microstrip line 107 is located. Both the RF signal input channel 101 and the local oscillator signal input channel 102 can be machined by wire cutting in the cover or box body forming the metal cavity. The SMA connector 201 (or other connectors such as 2.92mm) is a through-wall structure, and the extension direction of its metal needle is parallel to the microstrip line, and can be welded to the intermediate frequency output port 103 of the microstrip line 107 through conductive glue, or a Rogers board can be used to achieve intermediate frequency transition welding.

[0054] It should be noted that, those skilled in the art should understand that in some other embodiments of the present disclosure, the local oscillator signal input channel 102 of the frequency conversion unit can also be introduced parallel to the length direction of the microstrip line 107 and coupled to the microstrip line through a 90° turn, and the RF signal input channel 101 of the frequency conversion unit can be introduced perpendicular to the plane where the microstrip line 107 is located, and the signal output channel can be led out parallel to the plane where the microstrip line 107 is located.

[0055] In an exemplary embodiment of the present disclosure, Figure 5 and Figure 6 As shown, the RF signal input channel 101 of the frequency conversion unit is introduced in parallel to the length direction of the microstrip line 107, and is coupled to the microstrip line 107 through a 90° turn to reduce the overall arrangement direction size of the single frequency conversion unit. It should be noted that those skilled in the art should understand that in some other embodiments of the present disclosure, the RF signal input channel 101 of the frequency conversion unit can also be introduced in other directions, and the turning angle can also be other angles, such as 45°, 60°, etc.

[0056] In an exemplary embodiment, Figure 6 As shown, when there are multiple frequency conversion units, the multiple frequency conversion units are arranged in a row along a direction perpendicular to the length direction of the microstrip line 107.

[0057] In an exemplary embodiment, the RF signal input channel 101 adopts an E-plane probe transition structure, and the local oscillator signal input channel 102 adopts an H-plane probe transition structure; in some other embodiments of the present disclosure, the RF signal input channel 101 adopts an H-plane probe transition structure, and the local oscillator signal input channel 102 adopts an E-plane probe transition structure. In actual use, it is necessary to optimize the design of the probe transition structure to reduce the return loss and optimize the output characteristics of the intermediate frequency signal.

[0058] In an exemplary embodiment, Figure 6 As shown, the RF signal input channels 101 of each row of frequency conversion units are parallel to each other and their ports are aligned, and the local oscillator signal input channels 102 are parallel to each other and their ports are aligned, so as to ensure the consistency of signal reception and input local oscillator signals of the multi-channel receiver.

[0059] In the above exemplary embodiment, when there are multiple frequency conversion units, the multiple frequency conversion units are divided into two groups, and the two groups of frequency conversion units are respectively arranged in the box body and the cover body, and are mirror-symmetrical. Specifically, the microstrip line assembly position I of the frequency conversion unit located in the cover body corresponds to the air cavity position II on the microstrip line of the frequency conversion unit located in the box body; the air cavity position II on the microstrip line of the frequency conversion unit located in the cover body corresponds to the microstrip line assembly position I of the frequency conversion unit located in the box body. In this way, the intermediate frequency signals of the upper and lower adjacent channels are led out in opposite directions, so as to be led out from the box body and the cover body respectively.

[0060] In an exemplary embodiment, markings A-A'-B'-B are made at corresponding positions of the box body and the cover body to avoid incorrect fastening.

[0061] It should be noted that, when there are multiple frequency conversion units, the multiple frequency conversion units may form a group, and the frequency conversion units in the group may all be arranged on the box body, or may all be arranged on the cover body.

[0062] In an exemplary embodiment, the local oscillator signal input channels 102 of multiple frequency conversion units can be gathered into one port through a power divider (one to four, one to eight, etc.), and then the signal is input through the local oscillator source to achieve simultaneous operation of the mixer.

[0063] It should be noted that the microstrip line 107 may be a microstrip line structure based on a quartz substrate, a microstrip line structure based on sapphire, a common microstrip line structure, a suspended microstrip line structure, a monolithic integrated microstrip line circuit based on gallium arsenide (GaAs), or a monolithic integrated microstrip line circuit based on indium phosphide (InP). In addition, the material of the metal shell 100 includes but is not limited to alloy metals such as aluminum or brass, and semiconductor materials such as silicon, gallium arsenide, and indium phosphide. The metal cavity defined by the metal shell 100 may be a shielded cavity structure with a metal inner wall processed by a micro-machining (MEMS) process, or a shielded cavity structure with a metal inner wall processed by a micro-coaxial process.

[0064] In addition, in an exemplary embodiment of the present disclosure, the antenna 104 can be integrated with the RF signal input channel 101 and processed together, and the size of the antenna 104 can be optimized according to the channel spacing to ensure the system's requirements for receiver parameters.

[0065] In addition, those skilled in the art should understand that the harmonic type of the mixer is not limited, and can be a single-ended, single-balanced, double-balanced, triple-balanced or I / Q passive mixer. Multiple local oscillator signal input channels of the mixer can be collected into one channel through a power divider (one to four, or one to eight, etc.), and then through the local oscillator source input signal, the mixer can work simultaneously.

[0066] The terahertz mixer changes the lead-out direction of at least one of the RF signal input channel and the local oscillator signal input channel from a direction parallel to the plane where the microstrip line 107 is located to a direction perpendicular to the plane where the microstrip line 107 is located, thereby avoiding the problem of poor integration caused by the RF signal input channel, the local oscillator signal input channel and the signal output channel existing in the same plane, and while ensuring the basic high-frequency characteristics of the mixer, reduces the complexity and processing cost of multi-channel integration, improves the flexibility of the mixer integration method, and provides favorable conditions for further system integration. In addition, the terahertz mixer can realize single-row and double-row multi-channel integration methods, and its specific arrangement method can be adjusted according to system requirements. In addition, although the above embodiments are all described by taking the mixer as an example, those skilled in the art should understand that in some other embodiments of the present disclosure, the device can also be applied to the frequency multiplier.

[0067] Those skilled in the art can understand that the embodiments described above are exemplary and can be improved by those skilled in the art. The structures described in various embodiments can be freely combined without causing conflicts in structure or principle.

[0068] After describing the preferred embodiments of the present disclosure in detail, those skilled in the art can clearly understand that various changes and modifications can be made without departing from the scope and spirit of the appended claims, and the present disclosure is not limited to the implementation methods of the exemplary embodiments listed in the specification.

Claims

1. A device for mixing or multiplying frequencies, comprising: A metal shell, the metal shell comprising a box body and a cover body, the box body and the cover body are buckled together to define a metal cavity; At least one frequency conversion unit, the at least one frequency conversion unit comprising: a microstrip line, the microstrip line being located in the metal cavity; and a channel structure, the channel structure comprising a radio frequency signal input channel, a local oscillator signal input channel and a signal output channel passing through the metal shell and respectively coupled to the microstrip line, The signal output channel is led out parallel to the plane where the microstrip line is located, one of the RF signal input channel and the local oscillator signal input channel is introduced parallel to the plane where the microstrip line is located and coupled to the microstrip line through a turn, and the other of the RF signal input channel and the local oscillator signal input channel is introduced perpendicular to the plane where the microstrip line is located.

2. The device according to claim 1, wherein: The turning angle is 90°.

3. The device according to claim 2, wherein: The RF signal input channel adopts an E-plane probe transition structure, and the local oscillator signal input channel adopts an H-plane probe transition structure; or The radio frequency signal input channel adopts an H-plane probe transition structure, and the local oscillator signal input channel adopts an E-plane probe transition structure.

4. The device according to claim 3, wherein: When there are multiple frequency conversion units, the multiple frequency conversion units are divided into one group or two groups, and the frequency conversion units in each group are arranged in a row along a direction perpendicular to the length direction of the microstrip line.

5. The device according to claim 3, wherein: When the plurality of frequency conversion units are divided into two groups, the two groups of frequency conversion units are respectively arranged in the box body and the cover body and are mirror-symmetrical.

6. The device according to any one of claims 2 to 5, wherein: The input signal channels of the frequency conversion units in each row are parallel to each other and the ports are aligned.

7. The device according to claim 1, wherein: When there are multiple frequency conversion units, the local oscillator signal input channels of the multiple frequency conversion units are collected into one port through a power divider.

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