Package heat sink and heat dissipation package device
By setting up bumps or groove structures on the lower surface of the package heat dissipation plate, and setting up rubber-retaining convex edges and cutting channels on the upper surface, the problems of overflowing glue and heat sink falling off during plastic sealing are solved, and a more efficient heat dissipation and a more stable packaging structure are achieved.
Patent Information
- Application Number
- CN202110718547.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-06-28
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2041-06-28
AI Technical Summary
When the existing BGA packaging structure is plastically sealed, the plastic sealing material is prone to overflowing the upper surface of the heat sink, affecting the heat dissipation efficiency and product appearance. At the same time, the bonding force between the heat sink and the plastic seal is small, which easily leads to the heat sink falling off.
A packaged heat dissipation plate is designed, and a bump structure or groove structure is provided on the lower surface of the lower side to enhance the contact area with the plastic seal body, and a first rubber convex edge and a cutting path are provided on the upper surface to prevent the plastic seal from crawling and overflowing.
Effectively prevent the plastic sealing material from overflowing onto the upper surface of the heat sink during plastic sealing, enhance the bonding force between the heat sink and the plastic sealing body, prevent the heat sink from falling off, and ensure the heat dissipation efficiency and the clean appearance of the product.