processing device

Abstract

The present application provides a processing device capable of automatically moving a movable unit to a desired position at the time of maintenance. The processing device processes an object to be processed, and has a movable unit capable of moving, an input unit, a display unit, and a control unit that controls the movable unit, the input unit, and the display unit. The control unit has a storage section that stores a name of maintenance and position information showing a position of the movable unit at the time of performing the maintenance. The display unit displays a selection key for selecting the maintenance. When the selection key is selected, the control unit moves the movable unit to the position shown by the position information. The name of the maintenance and the position information stored in the storage section can be changed by operating the input unit.

Description

Technical Field

[0001] This invention relates to a processing apparatus for processing workpieces. Background Technology

[0002] In the manufacturing process of device chips, wafers containing devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integrations) are formed in multiple regions divided by predetermined dicing lines (spacers) arranged in a grid pattern. By dicing the wafer along the predetermined dicing lines, multiple device chips, each containing a device, can be obtained. These device chips are used in various electronic devices such as mobile phones and personal computers.

[0003] In wafer dicing, for example, a cutting device is used. The cutting device includes: a holding table that holds the workpiece; and a cutting unit that is equipped with an annular cutting tool for cutting the workpiece. By rotating the cutting tool mounted on the cutting unit, the workpiece is cut and diced.

[0004] Furthermore, in recent years, with the miniaturization of electronic devices, there is a demand for thinner chip designs. Therefore, wafer thinning processes are sometimes performed before wafer dicing. In wafer thinning, grinding or polishing equipment is used. Grinding equipment uses multiple grinding wheels to grind the workpiece, while polishing equipment uses polishing pads to polish the workpiece.

[0005] The aforementioned cutting, grinding, and lapping devices have a touch panel that functions as a user interface. An operation screen for operating the processing device is displayed on the touch panel, allowing the operator to input processing conditions and other information into the device via the touch panel (see Patent Document 1).

[0006] Patent Document 1: Japanese Patent Application Publication No. 2009-117776

[0007] In the operation of the processing equipment, in addition to processing the workpiece, maintenance of the processing equipment is also performed. For example, maintenance such as checking, cleaning, and replacing parts of the various structural elements of the processing equipment at a prescribed frequency is carried out. Moreover, when performing maintenance, the first step is to arrange the movable structural elements (movable units) included in the processing equipment in the prescribed positions.

[0008] For example, an operator might perform the following task: while referring to the operation screen displayed on the touch panel, move the movable unit to the designated maintenance position. Sometimes, due to operational errors or other human factors, the movable unit may move to a position different from the intended maintenance location. In this case, the movable unit may come into contact with other structural elements and be damaged, or proper maintenance may not be possible.

[0009] Therefore, systems that automatically perform maintenance with particularly high frequency are sometimes pre-assembled in processing equipment. For example, an operation screen is displayed on a touch panel, including selection keys for performing prescribed maintenance. Moreover, when the operator selects a selection key, a series of processes, including the movement of movable units, are automatically performed to execute the maintenance. As a result, adverse situations caused by operator errors are less likely to occur.

[0010] However, manufacturers of machining equipment often choose to assemble only systems for automating maintenance, which is typically considered to be performed more frequently. Therefore, when users perform separate maintenance not pre-registered in the machining equipment, the operator must manually move the movable units, increasing the risk of operational errors. Summary of the Invention

[0011] The present invention was made in view of the above-mentioned problems, and its object is to provide a processing apparatus that can automatically move the movable unit to a desired position during maintenance.

[0012] According to one aspect of the present invention, a processing apparatus is provided for processing a workpiece, wherein the processing apparatus comprises: a movable unit capable of movement; an input unit; a display unit; and a control unit for controlling the movable unit, the input unit, and the display unit. The control unit has a storage section storing a name of maintenance and position information indicating the position of the movable unit when the maintenance is performed. The display unit displays a selection key for selecting the maintenance. When the selection key is selected, the control unit moves the movable unit to the position indicated by the position information. The name of the maintenance stored in the storage section and the position information can be changed by operating the input unit.

[0013] Furthermore, preferably, when the name and location information of the maintenance are not stored in the storage unit, the display unit displays a blank bar as the selection key; when the name and location information of the maintenance are stored in the storage unit, the display unit displays a display bar showing the name of the maintenance as the selection key. Additionally, preferably, the movable unit is a holding table for holding the workpiece or a processing unit for processing the workpiece.

[0014] In one aspect of the processing apparatus of the present invention, when a selection key for selecting maintenance is selected, the movable unit moves to the position indicated by the position information stored in the storage unit. Furthermore, the position information stored in the storage unit can be changed by operating the input unit. Therefore, the user of the processing apparatus can automatically set the position of the movable unit during maintenance by operating the input unit. Thus, even when performing maintenance not pre-registered in the processing apparatus, the movable unit can automatically move to the position desired by the user. Attached Figure Description

[0015] Figure 1 This is a perspective view showing the processing device.

[0016] Figure 2 This is a block diagram showing the control unit.

[0017] Figure 3 This is an image showing the operation screen.

[0018] Figure 4 This is a flowchart illustrating the actions of the control unit during maintenance.

[0019] Figure 5 This is a flowchart illustrating the actions of the control unit during maintenance allocation.

[0020] Label Explanation

[0021] 11: Workpiece; 13: Wafer; 15: Wire strip (dicing strip); 17: Frame; 2: Processing device; 4: Base; 4a: Opening; 4b: Opening; 6: Box carrier stage (box lift); 8: Box; 10: Detector (sensor); 12: Moving mechanism; 12a: Moving worktable; 14: Dustproof and drip-proof cover; 16: Holding worktable (chuck worktable); 16a: Holding surface; 18: Fixture; 20: Guide rail; 22: First support structure; 24: Track; 26: Moving mechanism (lifting mechanism); 28: Conveying unit (conveying mechanism); 28a: Holding part (holding mechanism); 30: Track; 32: Moving mechanism (lifting mechanism); 34: Conveying unit (conveying mechanism); 36: Second support structure; 38a, 38b: Moving mechanism; 40a, 40b: Processing unit; 42: Cutting 44: Cutting tool; 46: Housing; 48: Spindle; 50: Imaging unit (camera); 52: Cleaning unit; 54: Rotary table; 56: Nozzle; 58: Input unit (input section, input device); 60: Display unit (display section, display device); 60a: Display area; 62: Touch panel; 64: Notification unit (notification section); 66: Control unit (control section); 68: Processing section; 70: Storage section; 80: Y-axis guide rail; 82: Y-axis moving plate; 84: Y-axis ball screw; 86: Z-axis guide rail; 88: Z-axis moving plate; 90: Z-axis ball screw; 92: Z-axis pulse motor; 100: Operation screen (maintenance screen); 102, 102a~102f: Selection key (maintenance execution key); 104: Selection key (confirm key); 106: Selection key (end key). Detailed Implementation

[0022] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. First, an example of the structure of the processing apparatus of this embodiment will be described. Figure 1 This is a perspective view showing the machining apparatus 2. The machining apparatus 2 is a cutting device that performs cutting operations on the workpiece 11. Additionally, in Figure 1 In this diagram, the X-axis (machining feed direction, first horizontal direction, forward / backward direction) and Y-axis (indexing feed direction, second horizontal direction, left / right direction) are perpendicular to each other. Additionally, the Z-axis (vertical direction, up / down direction, height direction) is perpendicular to both the X-axis and Y-axis.

[0023] The processing device 2 has a base 4, which supports or houses the various structural elements constituting the processing device 2. A rectangular opening 4a is formed at the front corner of the base 4, and a rectangular opening 4b extending along the X-axis is formed on the side of the opening 4a.

[0024] A box-mounted platform (box lifter) 6 is provided inside the opening 4a. This box-mounted platform 6 holds boxes 8 capable of holding multiple workpieces 11. The box-mounted platform 6 has a lifting mechanism (not shown) that moves up and down along the Z-axis. Additionally, in... Figure 1 In the middle, the outline of box 8 is shown with a double-dotted line.

[0025] The box 8 contains multiple workpieces 11 processed by the processing apparatus 2. For example, the workpiece 11 has a disk-shaped wafer 13 formed of a semiconductor material such as silicon. The wafer 13 is divided into multiple regions by multiple dicing lines (spacers) arranged in a grid pattern in an intersecting manner. In addition, ICs, LSIs, and other devices are formed on the front side of the regions divided by the dicing lines. When the wafer 13 is cut along the dicing lines by the processing apparatus 2, multiple device chips, each having a device, can be obtained.

[0026] A circular strip (dicing strip) 15, made of resin or the like and with a diameter larger than that of the wafer 13, is attached to the back side of the wafer 13. A ring-shaped frame 17, made of metal or the like, is attached to the outer periphery of the strip 15. A circular opening, larger in diameter than the wafer 13, is provided in the center of the frame 17, and the wafer 13 is attached to the center of the strip 15 such that it is positioned inside the opening of the frame 17. Thus, the wafer 13 is supported by the frame 17 via the strip 15. That is, Figure 1 The workpiece 11 shown is a frame unit comprising a wafer 13, a strip 15, and a frame 17.

[0027] However, there are no restrictions on the type, material, shape, structure, or size of the workpiece 11 processed by the processing apparatus 2. For example, the workpiece 11 may also have a wafer 13 formed of semiconductors other than silicon (GaAs, InP, GaN, SiC, etc.), glass, ceramics, resin, metal, etc. Furthermore, there are no restrictions on the type, number, shape, structure, size, or arrangement of devices formed on the wafer 13, and it is also possible to have no devices formed on the wafer 13.

[0028] Alternatively, the wafer 13 may not be supported by the frame 17, and the tape 15 may not be attached to the wafer 13. In addition, the workpiece 11 may also be a resin-encapsulated substrate such as a CSP (Chip Size Package) substrate or a QFN (Quad Flat Non-leaded package) substrate.

[0029] Inside the opening 4a, a pair of detectors (sensors) 10 are provided to detect the workpiece 11 stored in the box 8. For example, the detector 10 is a reflective photoelectric sensor having a light-emitting part (light-emitting element) that illuminates light toward the box 8 and a light-receiving part (light-receiving element) that receives reflected light.

[0030] When the workpiece 11 is stored in the box 8, the light irradiated from the detector 10 is reflected off the side of the workpiece 11 (the side of the frame 17) and then incident on the detector 10. On the other hand, when the workpiece 11 is not stored in the box 8, the light irradiated from the detector 10 will not be reflected off the workpiece 11. Therefore, it is possible to determine whether the workpiece 11 is stored in the box 8 based on the amount of light received by the detector 10.

[0031] Inside the opening 4b is a ball screw type moving mechanism 12 and a dustproof and dripproof cover 14 covering a portion of the moving mechanism 12. The moving mechanism 12 has a moving worktable 12a whose upper surface protrudes from the dustproof and dripproof cover 14, allowing the moving worktable 12a to move along the X-axis.

[0032] A holding table (chuck table) 16 is provided on the movable worktable 12a to hold the workpiece 11. The upper surface of the holding table 16 forms a holding surface 16a for holding the workpiece 11. The holding surface 16a is connected to a suction source (not shown) such as an injector via a suction path (not shown), a valve (not shown), etc., formed inside the holding table 16. In addition, a plurality of clamps 18 are provided around the holding table 16 to hold and fix the workpiece 11 (frame 17).

[0033] The moving mechanism 12 moves the holding table 16 together with the moving table 12a along the X-axis (machining feed). In addition, the holding table 16 is connected to a rotary drive source (not shown) such as an electric motor, which rotates the holding table 16 about a rotation axis that is approximately parallel to the Z-axis.

[0034] A pair of guide rails 20 are provided on the upper side of the opening 4b. These guide rails 20 maintain a state approximately parallel to the Y-axis while moving closer to and further apart from each other. Each pair of guide rails 20 has: a support surface that supports the lower surface of the workpiece 11 (frame 17); and a side surface that is approximately perpendicular to the support surface and contacts the outer periphery of the workpiece 11 (frame 17). The pair of guide rails 20 clamp the workpiece 11 along the X-axis for alignment.

[0035] A portal-shaped first support structure 22 is arranged above the base 4, spanning the opening 4b. A rail 24 is fixed along the Y-axis on the front surface side (guide rail 20 side) of the first support structure 22. The rail 24 is connected to the conveying unit (conveyor mechanism) 28 via a moving mechanism (lifting mechanism) 26.

[0036] The conveying unit 28 contacts the upper surface of the workpiece 11 (the upper surface of the frame 17) to attract and hold the workpiece 11. Furthermore, the conveying unit 28 is raised and lowered via the moving mechanism 26 and moves along the track 24 in the Y-axis direction. The conveying unit 28 conveys the workpiece 11 between the box 8 and the guide rail 20, and between the guide rail 20 and the holding table 16.

[0037] A gripping part (gripping mechanism) 28a is provided at the front end of the conveying unit 28 on the opening 4a side (box 8 side) to grip the workpiece 11. With the gripping part 28a holding the end of the workpiece 11 (end of the frame 17) stored in the box 8, the workpiece 11 is pulled out of the box 8 and onto a pair of guide rails 20 by moving the conveying unit 28 along the Y-axis. Furthermore, with the gripping part 28a holding the workpiece 11 positioned on the pair of guide rails 20, the workpiece 11 is stored in the box 8 by moving the conveying unit 28 along the Y-axis.

[0038] Furthermore, a track 30 is fixed along the Y-axis direction on the front surface side of the first support structure 22. The track 30 is connected to the conveying unit (conveyor mechanism) 34 via a moving mechanism (lifting mechanism) 32. The conveying unit 34 contacts the upper surface of the workpiece 11 (the upper surface of the frame 17) to attract and hold the workpiece 11. In addition, the conveying unit 34 is lifted and lowered by the moving mechanism 32 and moves along the track 30 in the Y-axis direction. The conveying unit 34 conveys the workpiece 11 between the holding table 16 and the cleaning unit 50, and between the cleaning unit 50 and the guide rail 20.

[0039] A portal-shaped second support structure 36 is arranged behind the first support structure 22, spanning the opening 4b. A pair of ball screw-type moving mechanisms 38a and 38b are fixed to both ends of the front surface side (first support structure 22 side) of the second support structure 36. Furthermore, a processing unit 40a is fixed to the lower part of the moving mechanism 38a, and a processing unit 40b is fixed to the lower part of the moving mechanism 38b. The processing units 40a and 40b are cutting units that use annular cutting tools 42 to cut the workpiece 11 (wafer 13).

[0040] The machining unit 40a is moved along the Y-axis and Z-axis directions by the moving mechanism 38a, thereby adjusting the position of the machining unit 40a in the Y-axis and Z-axis directions. Similarly, the machining unit 40b is moved along the Y-axis and Z-axis directions by the moving mechanism 38b, thereby adjusting the position of the machining unit 40b in the Y-axis and Z-axis directions.

[0041] Processing units 40a and 40b each have a cylindrical housing 44 (see reference). Figure 2 A cylindrical main shaft 46 (see reference) is housed within the casing 44. Figure 2 The spindle 46 is configured along the Y-axis, with its front end (one end side) protruding outside the housing 44. A ring-shaped cutting tool 42 is mounted on the front end of the spindle 46, and a rotation drive source (not shown), such as an electric motor, is connected to the base end (the other end side) of the spindle 46 to rotate the spindle 46.

[0042] The cutting tool 42 is a machining tool that cuts into the workpiece 11 (wafer 13) to perform cutting on the workpiece 11. It is formed by fixing abrasive grains made of diamond, cubic boron nitride (cBN), etc., using a bonding material. For example, as the cutting tool 42, an electroformed hub tool or a ring-shaped spacer tool is used. The electroformed hub tool has a cutting edge obtained by fixing abrasive grains using nickel plating, etc., while the spacer tool is composed of a cutting edge obtained by fixing abrasive grains using a bonding material made of metal, ceramic, resin, etc. In addition, there are no restrictions on the materials of the abrasive grains and bonding material included in the cutting tool, and they are appropriately selected according to the material of the workpiece 11 and the content of the cutting operation.

[0043] Imaging units (cameras) 48 are respectively provided adjacent to processing units 40a and 40b. Imaging units 48 take pictures of the workpiece 11 held by the holding table 16. The images obtained by the imaging units 48 are used for the alignment of the workpiece 11 held by the holding table 16 with the processing units 40a and 40b.

[0044] For example, when processing wafer 13, wafer 13 is positioned on holding stage 16 with belt 15 in between, and frame 17 is fixed by clamp 18. In this state, when negative pressure from the suction source is applied to holding surface 16a, wafer 13 is attracted and held by holding stage 16 with belt 15 in between. Then, while supplying liquid such as pure water (cutting fluid) toward wafer 13, the processing unit 40a or the cutting tool 42 mounted on processing unit 40b is rotated to cut into wafer 13, thereby cutting wafer 13.

[0045] In addition, Figure 1The image shows an example of a so-called facing dual-axis cutting device, in which the machining apparatus 2 has two sets of machining units 40a and 40b and a pair of cutting tools 42 arranged facing each other. However, the number of machining units provided in the machining apparatus 2 can also be one set.

[0046] A cleaning unit 50 is arranged on the side opposite to the opening 4a of the opening 4b. The cleaning unit 50 has a rotary table 52 that holds the workpiece 11 within a cylindrical cleaning space. The rotary table 52 is connected to a rotary drive source (not shown) that rotates the rotary table 52 at a predetermined speed.

[0047] A nozzle 54 is disposed above the rotary table 52, which provides a cleaning fluid (e.g., a mixture of water and air) toward the workpiece 11 held by the rotary table 52. The workpiece 11 is cleaned by providing fluid from the nozzle 54 toward the workpiece 11 while the rotary table 52 holding the workpiece 11 is rotated.

[0048] After processing by processing units 40a and 40b, the workpiece 11 is transferred by transfer unit 34 to cleaning unit 50 for cleaning. Then, the workpiece 11 is transferred by transfer unit 34 to a pair of guide rails 20. After alignment based on the pair of guide rails 20, transfer unit 28 holds the workpiece 11 with holding part 28a and stores the workpiece 11 in box 8.

[0049] A cover 56 is provided on the upper side of the base 4, which covers the structural elements mounted on the base 4. Figure 1 In the diagram, the outline of cover 56 is shown using a double-dotted line. Furthermore, the processing apparatus 2 includes: an input unit (input section, input device) 58 for inputting information into the processing apparatus 2; and a display unit (display section, display device) 60 for displaying various information related to the processing apparatus 2. For example, a keyboard, mouse, etc., may be used as the input unit 58, and various displays may be used as the display unit 60.

[0050] In addition, such as Figure 1 As shown, the touch panel 62 can also be provided on the side of the cover 56. In this case, the touch panel 62 functions as an interface that serves as both the input unit 58 and the display unit 60. Furthermore, the operator can input information such as processing conditions to the processing device 2 through touch operation of the touch panel 62.

[0051] A notification unit (notification section) 64 is provided on the upper surface of the cover 56 to notify the operator of prescribed information. For example, a warning light is provided as the notification unit 64, which illuminates or flashes to notify the operator of the abnormality when the processing device 2 malfunctions. However, the notification unit 64 is not limited. For example, the notification unit 64 could also be a speaker that emits an abnormality sound (warning tone) when the processing device 2 malfunctions. In addition, by displaying the prescribed information on the display unit 60, the display unit 60 can also function as the notification unit 64.

[0052] The structural elements constituting the processing apparatus 2 (box-mounted stage 6, detector 10, moving mechanism 12, holding table 16, fixture 18, guide rail 20, moving mechanism 26, transfer unit 28, moving mechanism 32, transfer unit 34, moving mechanisms 38a and 38b, processing unit 40a and 40b, imaging unit 48, cleaning unit 50, input unit 58, display unit 60, notification unit 64, etc.) are connected to the control unit (control unit) 66. The control unit 66 controls the operation of each structural element of the processing apparatus 2.

[0053] For example, the control unit 66 is configured as a computer, comprising: a processing unit that performs calculations and other processing required for the operation of the processing device 2; and a storage unit that stores various information (data, programs, etc.) for the processing unit. The processing unit is configured to include a processor such as a CPU (Central Processing Unit). Furthermore, the storage unit is configured to include various memories that function as main storage devices, auxiliary storage devices, etc.

[0054] The workpieces 11 stored in box 8 are transferred one by one from box 8 to holding worktable 16 by transfer unit 28, and processed by processing units 40a and 40b. After processing, the workpieces 11 are transferred to cleaning unit 50 by transfer unit 34 and then stored in box 8 by transfer unit 28 and transfer unit 34.

[0055] Figure 2 This is a block diagram showing the control unit 66. Additionally, in Figure 2 In addition to the functional structure of the control unit 66, the diagram also shows some structural elements of the processing device 2 connected to the control unit 66 (holding table 16, fixture 18, moving mechanism 38a, processing unit 40a, touch panel 62).

[0056] The control unit 66 includes: a processing unit 68 that processes signals (input signals) input from structural elements of the processing device 2 and generates signals (control signals) to control the operation of structural elements of the processing device 2; and a storage unit 70 that stores information (data, programs, etc.) processed by the processing unit 68.

[0057] The processing unit 40a is connected to the moving mechanism 38a. Specifically, a pair of Y-axis guide rails 80 arranged along the Y-axis direction are fixed to the front surface side of the second support structure 36. Moreover, a flat Y-axis moving plate 82 of the moving mechanism 38a is mounted on the pair of Y-axis guide rails 80 in a manner that allows it to slide along the pair of Y-axis guide rails 80 in the Y-axis direction.

[0058] A nut portion (not shown) is provided on the rear surface (back side) of the Y-axis moving plate 82, in which a Y-axis ball screw 84, arranged along a pair of Y-axis guide rails 80, is screwed. Furthermore, a Y-axis pulse motor (not shown) is connected to the end of the Y-axis ball screw 84. If the Y-axis ball screw 84 is rotated by the Y-axis pulse motor, the Y-axis moving plate 82 moves along the Y-axis guide rails 80 in the Y-axis direction.

[0059] A pair of Z-axis guide rails 86 are fixed along the Z-axis direction on the front surface (front side) of the Y-axis moving plate 82. Furthermore, a flat Z-axis moving plate 88 is mounted on the pair of Z-axis guide rails 86 in such a way that it can slide along the Z-axis guide rails 86 in the Z-axis direction.

[0060] A nut portion (not shown) is provided on the rear surface (back side) of the Z-axis moving plate 88, in which a Z-axis ball screw 90, arranged along a pair of Z-axis guide rails 86, is screwed. Furthermore, a Z-axis pulse motor 92 is connected to the end of the Z-axis ball screw 90. If the Z-axis ball screw 90 is rotated by the Z-axis pulse motor 92, the Z-axis moving plate 88 moves along the Z-axis guide rails 86 in the Z-axis direction. Moreover, a machining unit 40a is fixed to the lower part of the Z-axis moving plate 88.

[0061] Mobile mechanism 38b (refer to) Figure 1 The structure of the Y-axis moving plate 82 of the moving mechanism 38a is the same as that of the moving mechanism 38b. However, the Y-axis moving plate 82 of the moving mechanism 38a and the Y-axis moving plate 82 of the moving mechanism 38b are connected to different Y-axis ball screws 84.

[0062] Control signals generated by the control unit 66 are input to the structural elements of the processing device 2, thereby controlling the operation of the structural elements. For example, the control unit 66 generates a control signal to cause the display unit 60 (touch panel 62) to display a specified image, and outputs the control signal to the display unit 60. As a result, various screens (operation screens) for processing selection, information input, etc., are displayed in the display area 60a of the display unit 60.

[0063] Furthermore, when the operator operates the input unit 58 (touch panel 62), the input unit 58 outputs a signal to the control unit 66 corresponding to the operator's operation (process selection, information input, etc.). Then, the signal output from the input unit 58 is input to the processing unit 68 of the control unit 66, and the processing unit 68 performs the prescribed processing according to the input signal.

[0064] For example, when performing maintenance on the processing device 2, an operation screen (maintenance screen) for selecting maintenance is displayed in the display area 60a of the display unit 60 (touch panel 62). Figure 3 This is an image showing the operation screen (maintenance screen) 100. The operation screen 100 includes multiple selection keys for selecting the process to be performed by the processing device 2. In addition, the operation screen 100 may also include operation keys (keyboard, numeric keys, etc.) for inputting information into the processing device 2.

[0065] Figure 3 An example is shown below: the operation screen 100 includes multiple selection keys (maintenance execution keys) 102 for selecting maintenance, a selection key (confirm key) 104 for confirming the information entered into the operation screen 100, and a selection key (end key) 106 for closing the operation screen 100. For example, the operation screen 100 includes six selection keys 102 (selection keys 102a to 102f). However, there is no limit to the number of selection keys 102.

[0066] The selection keys 102a to 102d are respectively assigned to the prescribed maintenance performed in the processing apparatus 2. Furthermore, the name of the maintenance performed when a selection key 102a to 102d is displayed inside the outline of the selection keys 102a to 102d. In other words, the selection keys 102a to 102d are display bars showing the names of the maintenance. For example, the manufacturer of the processing apparatus 2 selects maintenance A to maintenance D, which are performed more frequently, and pre-assigns them to the selection keys 102a to 102d.

[0067] The operator can select any one of the selection keys 102a to 102d by touching the area displayed on the touch panel 62. Then, the processing device 2 performs any of the maintenance functions A to D corresponding to the selected selection key 102.

[0068] On the other hand, user-configurable settings are assigned to selection keys 102e and 102f. In the initial state of the operation screen 100, no settings are assigned to selection keys 102e and 102f, such as... Figure 3 As shown, blank fields are displayed as selection keys 102e and 102f. The user of the processing device 2 can then set the maintenance to be performed when selection keys 102e and 102f are selected via the operation input unit 58 (touch panel 62). Details of the steps for assigning maintenance to selection keys 102e and 102f will be explained later.

[0069] When any selection key 102 assigned to maintenance is selected, firstly, the movable unit included in the processing device 2 moves to a position suitable for maintenance. The movable unit corresponds to the structural element in the processing device 2 that is configured to move within the processing device 2. For example, the box-mounted stage 6, the moving mechanism 12, the holding table 16, the fixture 18, the guide rail 20, the moving mechanisms 26 and 32, the transfer unit 28 and 34, the moving mechanisms 38a and 38b, the processing unit 40a and 40b, and the shooting unit 48 are equivalent to movable units.

[0070] The position of the movable unit during maintenance is pre-stored in the storage unit 70 of the control unit 66 according to the maintenance content (see reference). Figure 2 Then, the processing device 2 moves the movable unit to a position suitable for maintenance assigned to the selection key 102 chosen by the operator. Thus, the operation of manually moving the movable unit to the designated position by the operator is no longer required.

[0071] Furthermore, after the movable unit is positioned in the designated location, the selected maintenance is performed. Examples of maintenance include: confirming the operation of each movable unit; confirming and cleaning the operation of the detector 10 with the cassette stage 6 lowered (exposing the detector 10); replacing the holding table 16; cleaning the holding table 16 and its surroundings with the machining units 40a and 40b retracted from above the holding table 16; confirming the condition of the holding table 16 (whether there are scratches, etc.) by taking pictures of the holding table 16 using the imaging unit 48; replacing the cutting tools 42 mounted on the machining units 40a and 40b; and correcting the shape of the surfaces (support surfaces) of the machining units 40a and 40b that contact the cutting tools 42.

[0072] Next, a specific example of the operation of the processing device 2 will be described. The operation of the processing device 2 is controlled by the control unit 66. Figure 4 This is a flowchart illustrating the actions of the control unit 66 during maintenance.

[0073] First, the operator refers to the operation screen 100 displayed on the touch panel 62 (display unit 60) (refer to...). Figure 3 While operating the touch panel 62 (input unit 58), select the selection key 102 corresponding to the maintenance to be performed. Then, the information showing the selected maintenance (maintenance selection information) is input from the touch panel 62 to the processing unit 68 (step S11).

[0074] When maintenance selection information is input, the processing unit 68 accesses the storage unit 70 and reads information (position information) showing the position of each movable unit when the selected maintenance is performed. Then, the processing unit 68 generates a control signal to move each movable unit to the position shown in the read position information and outputs it to each movable unit. As a result, the movable units are moved to positions suitable for maintenance (step S12).

[0075] For example, if the selected maintenance is the replacement of the cutting tool 42, the moving mechanisms 38a and 38b are controlled by control signals to position the machining units 40a and 40b in a predetermined position. Similarly, if the selected maintenance is the capturing unit 48 capturing images of the holding table 16, the holding table 16 and the capturing unit 48 are positioned in a predetermined position by controlling the moving mechanisms 12 and 38a and 38b with control signals.

[0076] Next, the processing unit 68 generates a control signal for performing the selected maintenance and outputs the control signal to the structural element to be maintained. For example, a program for generating control signals to perform each maintenance is pre-stored in the storage unit 70. Then, the processing unit 68 reads from the storage unit 70 and executes the program corresponding to the selected maintenance, generating control signals sequentially. Thus, the selected maintenance is performed (step S13).

[0077] In addition, as mentioned above, the operator can operate the screen 100 (refer to...). Figure 3 The maintenance of the expected allocation of a portion of the selection keys 102 (selection keys 102e, 102f) contained therein. Figure 5 This is a flowchart illustrating the operation of the control unit 66 during maintenance allocation.

[0078] First, the operator operates the touch panel 62 (input unit 58) to select the operation screen 100 (see reference). Figure 3 The selection key 102e included in the selection key 102 can be assigned and maintained by the user. For example, by continuously touching the area of ​​the touch panel 62 that displays the selection key 102e for a certain period of time (long press, long duration touch), the selection key 102e is selected.

[0079] Next, the operator inputs maintenance-related information (maintenance information) assigned to the selection key 102e onto the touch panel 62 (input unit 58). Specifically, the maintenance information includes the name of the maintenance, information showing the position of each movable unit during maintenance (position information), etc. The maintenance name includes a string indicating the content of the maintenance. Additionally, the movable unit position information includes the direction and distance of movement relative to the reference position (origin position) of the movable unit, and the coordinates of the movable unit's destination, etc.

[0080] For example, when assigning maintenance related to processing units 40a and 40b to selection key 102e, the position information of processing units 40a and 40b during maintenance is input. Examples of position information for processing units 40a and 40b include the Y and Z coordinates of processing units 40a and 40b, the Y coordinate of Y-axis moving plate 82 and the Z coordinate of Z-axis moving plate 88, and the rotational speeds of Y-axis pulse motor and Z-axis pulse motor 92.

[0081] The maintenance information input to the touch panel 62, along with information indicating the selected selection key 102 (key selection information), is input to the processing unit 68 (step S21). Then, the processing unit 68 accesses the storage unit 70 and stores the maintenance information and key selection information together in the storage unit 70 (step S22).

[0082] Additionally, the processing unit 68 generates a control signal for displaying the name of the maintenance included in the maintenance information in the selected selection key 102e, and outputs the control signal to the touch panel 62 (display unit 60). Thus, the name of the maintenance is displayed in the selection key 102e (step S23).

[0083] Through the above actions, the maintenance specified by the operator (replacement of cutting tool 42) is assigned to selection key 102e. Then, when the operator selects selection key 102e (step S11), processing unit 68 reads the maintenance information stored in storage unit 70 and moves each movable unit to a position suitable for performing maintenance (step S12). Then, maintenance is performed manually or automatically.

[0084] Furthermore, the above explanation addresses the situations where, prior to step S21, the storage unit 70 does not store maintenance information (maintenance name and movable unit position information) assigned to selection keys 102e and 102f, and selection keys 102e and 102f are blank (see [reference]). Figure 3 However, if maintenance has already been assigned to selection keys 102e and 102f, it is possible to change or delete the maintenance assigned to selection keys 102e and 102f.

[0085] Specifically, when the operator selects selection keys 102e and 102f and enters maintenance information, the processing unit 68 overwrites the maintenance information stored in the storage unit 70 for selection keys 102e and 102f with the newly entered maintenance information. This changes the maintenance assigned to selection keys 102e and 102f. Conversely, when the operator selects selection keys 102e and 102f and enters information to delete maintenance information, the processing unit 68 deletes the maintenance information stored in the storage unit 70 for selection keys 102e and 102f. This deletes the maintenance assigned to selection keys 102e and 102f, leaving selection keys 102e and 102f blank.

[0086] The operation of the control unit 66 during maintenance and the allocation of maintenance tasks are achieved, for example, by executing a program stored in the storage unit 70. Specifically, the storage unit 70 pre-stores a program... Figure 4 The procedures and descriptions of each step shown Figure 5 The procedure for each step is shown. Furthermore, when information is input from the touch panel 62 to the processing unit 68, the processing unit 68 selects and executes the program stored in the storage unit 70. This allows for the execution or allocation of maintenance tasks.

[0087] As described above, in the processing apparatus 2 of this embodiment, when the selection key 102 for selecting maintenance is selected, the movable unit moves to the position indicated by the position information stored in the storage unit 70. Furthermore, the position information stored in the storage unit 70 can be changed via the operation input unit 58 (touch panel 62). Therefore, the user of the processing apparatus 2 can freely set the position of the movable unit during maintenance by operating the input unit 58. Thus, even when performing maintenance not pre-registered in the processing apparatus 2, the movable unit can automatically move to the position desired by the user.

[0088] Furthermore, in this embodiment, the processing device 2 is described as a cutting device having processing units 40a and 40b (cutting units) for cutting the workpiece 11, but the type of processing device 2 is not limited. For example, the processing device 2 may also be a grinding device having a grinding unit for grinding the workpiece 11, or a grinding device having a grinding unit for polishing the workpiece 11.

[0089] The grinding unit of the grinding apparatus has a spindle, and an annular grinding wheel with multiple grinding tools fixed on it is mounted at the front end of the spindle. The workpiece 11 is ground by rotating the grinding wheel while the grinding tools contact the workpiece 11. Similarly, the grinding unit of the lapping apparatus has a spindle, and a disc-shaped lapping pad is mounted at the front end of the spindle. The workpiece 11 is lapping by rotating the lapping pad while it contacts the workpiece 11.

[0090] Furthermore, the processing apparatus 2 can also be a laser processing apparatus that processes the workpiece 11 by irradiating it with a laser beam. The laser processing apparatus includes a laser irradiation unit that irradiates the laser beam used for processing the workpiece 11. For example, the laser irradiation unit includes: a laser oscillator that pulses to generate a laser beam of a predetermined wavelength; and a concentrator that focuses the laser beam oscillating from the laser oscillator. By focusing the laser beam irradiated from the laser irradiation unit onto the front or interior of the workpiece, laser processing is performed on the workpiece 11.

[0091] In addition, the structure and method of the above embodiments can be implemented with appropriate modifications without departing from the purpose of the present invention.

Claims

1. A processing apparatus for processing a workpiece, characterized in that, The processing device has the following features: Movable unit, which is capable of movement; Input unit; Display unit; as well as The control unit controls the movable unit, the input unit, and the display unit. The control unit has a storage section that stores the name of the maintenance and position information indicating the position of the movable unit when the maintenance is performed. The display unit shows the selection keys for choosing this maintenance. When the selection key is selected, the control unit moves the movable unit to the position indicated by the position information. The name and location information of the maintenance stored in the storage unit can be changed by operating the input unit. If the name and location information for maintenance are not stored in the storage unit, the display unit displays a blank bar as the selection key. If the name and location information of the maintenance are stored in the storage unit, the display unit displays a display bar showing the name of the maintenance as the selection key.

2. The processing apparatus according to claim 1, characterized in that, The movable unit is a holding table that holds the workpiece or a processing unit that processes the workpiece.

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