Semiconductor packaging structure and preparation method thereof
By setting up adapter plates and solder balls in the semiconductor packaging structure, the problems of large size and inability to repair in traditional packaging structures are solved, and the product is miniaturized and the convenience of repair and replacement is achieved.
CN114256169BActive Publication Date: 2025-03-25FOREHOPE ELECTRONICS NINGBO CO LTD
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Patent Information
- Application Number
- CN202111500686.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-12-09
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2041-12-09
AI Technical Summary
Technical Problem
The traditional fan-out semiconductor packaging structure has a large ball size, which hinders the miniaturization of the product and cannot be repaired and replaced.
Method used
A semiconductor package structure is adopted, in which a semiconductor device is arranged on the substrate carrier plate, and a plastic seal is coated thereon, a first adapter plate and a second adapter plate are provided, and a groove penetrated to the semiconductor device is opened on the plastic seal, and the adapter plate is mounted in the groove, and electrical connection is realized through solder balls.
Benefits of technology
The size of the ball planting is reduced, which is conducive to the miniaturization of the product and facilitates the maintenance and replacement of the product.
✦ Generated by Eureka AI based on patent content.
Abstract
The embodiment of the present invention provides a semiconductor packaging structure and a preparation method thereof, which relates to the field of semiconductor packaging technology. A semiconductor device is arranged on a base carrier, and a plastic package body is arranged to cover the outside of the semiconductor device, and then a first adapter board and a second adapter board are arranged on the semiconductor device, wherein the plastic package body is provided with a first groove and a second groove that penetrate to the semiconductor device, and the first adapter board and the second adapter board are respectively mounted in the first groove and the second groove, wherein the first adapter board and the second adapter board are provided with a first solder ball and a second solder ball, and the semiconductor device is electrically connected to the first adapter board and the second adapter board at the same time, and the wiring structure is realized by setting the adapter board, and only the adapter board needs to be processed when the product is repaired and replaced later, which is convenient and reliable. At the same time, the external circuit is realized by the solder balls on the adapter board, and the adapter board can be prepared in advance, and the size of its solder balls and the occupied space can be made smaller, which undoubtedly reduces the size of the entire product and is conducive to the miniaturization of the product.
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