Input device driving method and interface device

Abstract

The present application relates to an input device driving method and an interface device. The interface device according to an embodiment of the present application can include an electronic device and an input device in communication with the electronic device, wherein the electronic device includes a display layer, a sensor layer, and a control section that outputs a first uplink signal and a second uplink signal to the sensor layer, and the input device includes a communication section that receives an uplink signal from the sensor layer, a memory that stores first information and second information, a signal determination section that determines whether the uplink signal is the first uplink signal or the second uplink signal based on the first information and the second information, and a signal conversion section that outputs converted data by converting the second uplink signal in the case where the uplink signal is the second uplink signal.

Description

Technical Field

[0001] The present invention relates to an input device driving method with improved sensing reliability and an interface device using the input device driving method. Background Technology

[0002] Electronic devices can sense external input applied from outside the device. This external input can be user input, which can include various forms such as a part of the user's body, light, heat, a pen, or pressure. Electronic devices can identify the pen's coordinates using either electromagnetic resonance (EMR) or active electrostatics (AES). Summary of the Invention

[0003] The purpose of this invention is to provide an input device driving method with improved sensing reliability and an interface device using the input device driving method.

[0004] An interface device according to an embodiment of the present invention may include: an electronic device and an input device communicating with the electronic device, wherein the electronic device includes: a display layer; a sensor layer disposed on the display layer for sensing a first input generated by the input device; and a control unit for outputting a first uplink signal and a second uplink signal having a phase different from the phase of the first uplink signal to the sensor layer, wherein the input device includes: a communication unit for receiving the uplink signal from the sensor layer; a memory for storing first information corresponding to the first uplink signal and second information corresponding to the second uplink signal; a signal determination unit for determining whether the uplink signal is the first uplink signal or the second uplink signal based on the first information and the second information; and a signal conversion unit for converting the second uplink signal and outputting converted data when the uplink signal is the second uplink signal.

[0005] The first uplink signal may include first synchronization data, first information data and first verification data, and the second uplink signal may include second synchronization data, second information data and second verification data.

[0006] The signal determination unit can determine whether the uplink signal is the first uplink signal or the second uplink signal based on the first synchronization data or the second synchronization data and the first information and the second information stored in the memory.

[0007] The signal determination unit can determine whether the uplink signal is the first uplink signal or the second uplink signal based on the first information data or the second information data and the first information and the second information stored in the memory.

[0008] The signal conversion unit can convert the first bit of the second uplink signal into a second bit that is different from the first bit, and convert the second bit of the second uplink signal back into the first bit, and output the converted data.

[0009] The input device can output a downlink signal based on the transformed data or the first uplink signal.

[0010] The display layer can display images during multiple frame intervals. In the nth frame interval, the control unit outputs the first uplink signal to the sensor layer. In the (n+1)th frame interval, the control unit outputs the second uplink signal to the sensor layer, where n is a positive integer.

[0011] The sensor layer may define a first region and a second region adjacent to the first region. The control unit outputs the first uplink signal to the first region and the second uplink signal to the second region.

[0012] The electronic device may further include a display driving unit that generates a vertical synchronization signal for driving the display layer, and the control unit outputs the first uplink signal or the second uplink signal to the sensor layer in synchronization with the vertical synchronization signal.

[0013] The sensor layer can operate in a first mode for sensing the first input and a second mode for sensing the second input generated by touch. During the period when the display layer displays an image of a frame interval, the control unit operates in the first mode and the second mode in sequence.

[0014] The input device may further include a noise determination unit for determining noise signals that are different from the first uplink signal and the second uplink signal.

[0015] If the noise determination unit determines that the uplink signal is the noise signal, the noise signal can be ignored.

[0016] An input device driving method according to an embodiment of the present invention may include the following steps: receiving an uplink signal; determining whether the uplink signal is a first uplink signal or a second uplink signal having a phase different from that of the first uplink signal; and if the uplink signal is the second uplink signal, transforming the second uplink signal to output transformed data.

[0017] The first uplink signal may include first synchronization data, first information data, and first verification data. The second uplink signal includes second synchronization data, second information data, and second verification data. The step of determining the uplink signal includes the following steps: determining whether the uplink signal is the first uplink signal or the second uplink signal based on the first synchronization data or the second synchronization data.

[0018] The step of transforming the second uplink signal may include transforming a first bit of the second uplink signal into a second bit that is different from the first bit, transforming the second bit of the second uplink signal back into the first bit, and then outputting the transformed data.

[0019] It may also include the following steps: outputting a downlink signal based on the transformed data or the first uplink signal.

[0020] The first uplink signal may include first synchronization data, first information data, and first verification data. The second uplink signal includes second synchronization data, second information data, and second verification data. The step of determining the uplink signal includes the following steps: determining whether the uplink signal is the first uplink signal or the second uplink signal based on the first information data or the second information data.

[0021] It may also include the following steps: further identifying a noise signal that is different from the first uplink signal and the second uplink signal; and ignoring the noise signal if the input device receives the noise signal.

[0022] The step of determining the noise signal can be performed simultaneously with the step of determining the uplink signal.

[0023] The step of determining the noise signal can be performed after the step of transforming the second uplink signal.

[0024] According to the present invention, the electronic device can output a first uplink signal and a second uplink signal having a phase different from that of the first uplink signal to an input device. Since the electronic device outputs uplink signals with different phases, flicker in the display layer caused by the uplink signals can be eliminated or reduced. The image quality of the display layer can be improved.

[0025] Furthermore, according to the present invention, the input device may include a signal determination unit and a signal conversion unit. When the signal determination unit identifies a second uplink signal, the signal conversion unit can convert the second uplink signal and output converted data. The converted data may be a signal that the input device can parse. The input device can output a downlink signal based on the first uplink signal and the converted data. The electronic device can sense the coordinates or slope of the input device based on the downlink signal received from the input device. Therefore, the sensing reliability of the sensor layer can be improved. Attached Figure Description

[0026] Figure 1a and Figure 1b This is a perspective view illustrating an interface device according to an embodiment of the present invention.

[0027] Figure 2 This is a schematic block diagram illustrating an electronic device and an input device according to an embodiment of the present invention.

[0028] Figure 3a and Figure 3b This is a cross-sectional view of an electronic device according to an embodiment of the present invention.

[0029] Figure 4 This is a cross-sectional view of an electronic device according to an embodiment of the present invention.

[0030] Figure 5 This is a block diagram of a display layer and a display driver according to an embodiment of the present invention.

[0031] Figure 6 This is a block diagram of a sensor layer and a control unit according to an embodiment of the present invention.

[0032] Figure 7a and Figure 7b This is a diagram illustrating a portion of a sensor layer operating in a first mode according to an embodiment of the present invention.

[0033] Figure 8 This is a diagram illustrating a portion of a sensor layer operating in a second mode according to an embodiment of the present invention.

[0034] Figure 9 The diagram illustrates the waveforms of each of a first uplink signal and a second uplink signal according to an embodiment of the present invention.

[0035] Figure 10 The data of each of the first uplink signal and the second uplink signal according to an embodiment of the present invention are schematically illustrated.

[0036] Figure 11 This is a flowchart illustrating an input device driving method according to an embodiment of the present invention.

[0037] Figure 12 The diagram illustrates the waveforms of each of the data and transformed data of the second uplink signal according to an embodiment of the present invention.

[0038] Figure 13a This is a plan view illustrating a sensor layer according to an embodiment of the present invention.

[0039] Figure 13b This is a conceptual diagram illustrating the operation of the display layer and sensor layer according to an embodiment of the present invention.

[0040] Figure 14 This is a plan view illustrating a sensor layer according to an embodiment of the present invention.

[0041] Figure 15a This is a flowchart illustrating an input device driving method according to an embodiment of the present invention.

[0042] Figure 15b This is a flowchart illustrating an input device driving method according to an embodiment of the present invention.

[0043] Explanation of reference numerals in the attached figures

[0044] 10000: Interface device; 1000: Electronic device

[0045] 100: Display layer; 200: Sensor layer

[0046] ULS: Uplink signal; 2000: Input device

[0047] 2400: Signal Determination Unit; 2500: Signal Conversion Unit Detailed Implementation

[0048] In this specification, when it is mentioned that a certain component (or region, layer, part, etc.) is "above", "connected" or "combined" with another component, it means that it can be directly arranged on or directly connected / combined with another component, or a third component can be arranged between them.

[0049] The same reference numerals refer to the same constituent elements. Furthermore, in the drawings, the thickness, proportions, and dimensions of the constituent elements are exaggerated for the purpose of effective explanation of the technical content.

[0050] "And / or" includes all combinations of more than one that can be defined in relation to the related composition.

[0051] The terms "first," "second," etc., can be used to describe multiple constituent elements, but the constituent elements should not be limited by the terms. The terms are used only to distinguish one constituent element from another. For example, without departing from the scope of the invention, a first constituent element can be named a second constituent element, and similarly, a second constituent element can be named a first constituent element. Singular expressions include plural expressions unless the context explicitly indicates a different meaning.

[0052] Furthermore, terms such as "below," "lower side," "above," and "upper side" are used to describe the relationships between the components illustrated in the accompanying drawings. These terms are relative concepts and are explained based on the directions shown in the accompanying drawings.

[0053] Unless otherwise defined, all terms (including technical and scientific terms) used in this specification shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Furthermore, terms such as those defined in commonly used dictionaries shall be interpreted as having the same meaning as in the context of the relevant art, and may be expressly defined herein unless interpreted as having an ideal or overly formal meaning.

[0054] Terms such as “including” or “having” should be understood as being intended to specify the presence of features, figures, steps, operations, constituent elements, components or combinations thereof described in the specification, rather than precluding the presence or possibility of one or more other features or figures, steps, operations, constituent elements, components or combinations thereof.

[0055] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0056] Figure 1a This is a perspective view illustrating an interface device according to an embodiment of the present invention.

[0057] Reference Figure 1a The interface device 10000 may include an electronic device 1000 and an input device 2000. The electronic device 1000 may sense a first input generated by the input device 2000. The interface device 10000 may also be referred to as a digital-to-digital converter.

[0058] The electronic device 1000 can be a device activated by an electrical signal. For example, the electronic device 1000 can be a mobile phone, tablet computer, car navigation system, game console, or wearable device, but is not limited to these. Figure 1aAn exemplary illustration shows an electronic device 1000 as a mobile phone.

[0059] The electronic device 1000 may define an effective area 1000A and a peripheral area 1000NA. The electronic device 1000 may display an image through the effective area 1000A. The effective area 1000A may include a surface defined by a first direction DR1 and a second direction DR2. The peripheral area 1000NA may be adjacent to the effective area 1000A. The peripheral area 1000NA may surround the perimeter of the effective area 1000A.

[0060] The thickness direction of the electronic device 1000 can be parallel to a third direction DR3 that intersects the first direction DR1 and the second direction DR2. Therefore, the front (or upper) and rear (or lower) surfaces of the components constituting the electronic device 1000 can be defined with reference to the third direction DR3.

[0061] The electronic device 1000 can sense input applied from outside the electronic device 1000. The external input can include various forms of external input such as a part of the user's body, light, heat, or pressure. The external input can be referred to as a second input.

[0062] Figure 1a The illustrated electronic device 1000 can sense input generated by a user's touch and input generated by an input device 2000. The input device 2000 can refer to a device other than the user's body. The input generated by the input device 2000 can be referred to as the first input. For example, the input device 2000 can be an active pen, a stylus, a touch pen, or an electronic pen. The following explanation uses the case where the input device 2000 is an active pen as an example.

[0063] Electronic device 1000 and input device 2000 can perform bidirectional communication. Electronic device 1000 can provide uplink signals to input device 2000. For example, the uplink signals may include synchronization data or information from electronic device 1000, but are not particularly limited thereto. Input device 2000 can provide downlink signals to electronic device 1000. The downlink signals may include synchronization data or status information from input device 2000. For example, the downlink signals may include coordinate information of input device 2000, battery information of input device 2000, slope information of input device 2000, and / or various information stored in input device 2000, etc., but are not particularly limited thereto. The uplink signals and the downlink signals will be described later.

[0064] Figure 1b This is a perspective view illustrating an interface device according to an embodiment of the present invention. In the description... Figure 1b At that time, for those who passed Figure 1a The constituent elements of the description are labeled with the same reference numerals, and their descriptions are omitted.

[0065] Reference Figure 1b The interface device 10000-1 may include an electronic device 1000-1 and an input device 2000. Figure 1b The illustration shows the electronic device 1000-1 folded at a predetermined angle. In the folded state of the electronic device 1000-1, the effective area 1000A-1 may include a plane defined by a first direction DR1 and a second direction DR2.

[0066] The effective region 1000A-1 may include a first region 1000A1, a second region 1000A2, and a third region 1000A3. The first region 1000A1, the second region 1000A2, and the third region 1000A3 may be defined sequentially along a first direction DR1. The second region 1000A2 may be bent with reference to a folding axis 1000FX extending along a second direction DR2. Therefore, the first region 1000A1 and the third region 1000A3 may be referred to as non-folded regions, and the second region 1000A2 may be referred to as a folded region.

[0067] If the electronic device 1000-1 is folded, the first region 1000A1 and the third region 1000A3 can face each other. Therefore, in the fully folded state, the effective region 1000A-1 may not be exposed to the outside, which can be referred to as in-folding. However, this is only an example, and the operation of the electronic device 1000-1 is not limited to this.

[0068] For example, if the electronic device 1000-1 according to an embodiment of the present invention is folded, the first region 1000A1 and the third region 1000A3 can be opposite to each other. Therefore, in the folded state, the effective region 1000A-1 can also be exposed to the outside, which can be referred to as out-folding.

[0069] Electronic device 1000-1 may perform only one of the inward folding and outward folding operations. Alternatively, electronic device 1000-1 may perform both inward folding and outward folding operations. In this case, the same area of ​​electronic device 1000-1 (e.g., the second area 1000A2) may be folded inward and outward.

[0070] Figure 1b The illustration shows one folded region and two non-folded regions, but the number of folded and non-folded regions is not limited to this. For example, electronic device 1000-1 may include more than two non-folded regions and multiple folded regions arranged between adjacent non-folded regions.

[0071] Figure 1b The illustration exemplarily depicts a folding shaft 1000FX extending along a second direction DR2, but the invention is not limited thereto. For example, the folding shaft 1000FX may extend along a direction parallel to the first direction DR1. In this case, the first region 1000A1, the second region 1000A2, and the third region 1000A3 may be arranged sequentially along the second direction DR2.

[0072] Electronic device 1000-1 and input device 2000 can perform bidirectional communication. Electronic device 1000-1 can provide uplink signals to input device 2000. Input device 2000 can provide downlink signals to electronic device 1000-1. Electronic device 1000-1 can use the signals provided from input device 2000 to sense the coordinates or slope of input device 2000.

[0073] Figure 2 This is a schematic block diagram illustrating an electronic device and an input device according to an embodiment of the present invention.

[0074] Reference Figure 2 The electronic device 1000 may include a display layer 100, a sensor layer 200, a display driver unit 100C, a control unit 200C, and a main control unit 1000C.

[0075] Display layer 100 may be a component that substantially generates an image. Display layer 100 may be a light-emitting display layer, for example, display layer 100 may be an organic light-emitting display layer, a quantum dot display layer, a micro LED display layer, or a nano LED display layer.

[0076] Sensor layer 200 may be disposed on display layer 100. Sensor layer 200 may sense external input applied from the outside. Sensor layer 200 may sense a first input generated by input device 2000 and a second input generated by user's body 3000.

[0077] The main control unit 1000C can control the overall operation of the electronic device 1000. For example, the main control unit 1000C can control the operation of the display driver unit 100C and the control unit 200C. The main control unit 1000C may include at least one microprocessor, and the main control unit 1000C may be referred to as a host.

[0078] The display driver unit 100C can control the display layer 100. The main control unit 1000C may also include a graphics controller. The display driver unit 100C can receive image data RGB and control signals D-CS from the main control unit 1000C. The control signals D-CS may include various signals. For example, the control signals D-CS may include an input vertical synchronization signal, an input horizontal synchronization signal, a master clock signal, and a data enable signal. The display driver unit 100C can generate vertical synchronization signals and horizontal synchronization signals based on the control signals D-CS to control the timing of providing signals to the display layer 100.

[0079] The control unit 200C can control the sensor layer 200. The control unit 200C can receive a control signal I-CS from the main control unit 1000C. The control signal I-CS may include a mode determination signal for determining the drive mode of the control unit 200C and a clock signal. The control unit 200C can operate according to the control signal I-CS in either a first mode that senses a first input generated by the input device 2000 or a second mode that senses a second input generated by the user's body 3000. The control unit 200C can control the sensor layer 200 in either the first or second mode according to the mode determination signal.

[0080] The control unit 200C can calculate the coordinate information of the first input or the second input based on the signal received from the sensor layer 200, and provide the coordinate signal I-SS containing the coordinate information to the main control unit 1000C. The main control unit 1000C can perform an operation corresponding to the user's input based on the coordinate signal I-SS. For example, the main control unit 1000C can operate the display driver unit 100C based on the coordinate signal I-SS, so that a new application image is displayed on the display layer 100.

[0081] The input device 2000 may include a housing 2100, a power supply 2200, a memory 2300, a signal judgment unit 2400, a signal conversion unit 2500, a noise judgment unit 2600, a communication unit 2700, and pen electrodes 2800. However, the components constituting the input device 2000 are not limited to those listed above. For example, the input device 2000 may also include an electrode switch that switches between signal transmission and signal reception modes, a pressure sensor that senses pressure, or a rotation sensor that senses rotation.

[0082] The housing 2100 may have a pen shape. An accommodating space may be formed inside the housing 2100. The accommodating space defined inside the housing 2100 may accommodate a power supply 2200, a memory 2300, a signal judgment unit 2400, a signal conversion unit 2500, a noise judgment unit 2600, a communication unit 2700, and pen electrodes 2800.

[0083] The power supply 2200 can supply power to the internal memory 2300, signal judgment unit 2400, signal conversion unit 2500, noise judgment unit 2600, and communication unit 2700 of the input device 2000. The power supply 2200 may include a battery or a high-capacity capacitor.

[0084] Information about the uplink signal ULS can be stored in memory 2300.

[0085] The signal determination unit 2400 can distinguish the uplink signal ULS received from the sensor layer 200 based on the information stored in the memory 2300.

[0086] The signal conversion unit 2500 can convert the uplink signal ULS that is distinguished by the signal determination unit 2400.

[0087] The noise determination unit 2600 can determine noise signals that are different from the uplink signal ULS received from the sensor layer 200. The signal determination unit 2400, the signal conversion unit 2500, and the noise determination unit 2600 will be described later.

[0088] The communication unit 2700 may include a transmitting circuit 2710 and a receiving circuit 2720. The transmitting circuit 2710 may output a downlink signal DLS to the sensor layer 200. The receiving circuit 2720 may receive an uplink signal ULS provided from the sensor layer 200. The uplink signal ULS may have a frequency of 500 kHz. The uplink signal ULS may include a first uplink signal ULS1 (see reference). Figure 9 ) and the second uplink signal ULS2 (refer to Figure 9 The first uplink signal ULS1 (see below) will be discussed later. Figure 9 ) and the second uplink signal ULS2 (refer to Figure 9 (This will be explained.)

[0089] The pen electrode 2800 can be electrically connected to the communication unit 2700. A portion of the pen electrode 2800 may protrude from the housing 2100. Alternatively, the input device 2000 may also include a covering housing that covers the pen electrode 2800 exposed from the housing 2100. Alternatively, the pen electrode 2800 may be built inside the housing 2100. The pen electrode 2800 may include a first pen electrode that senses the coordinates of the input device 2000 and a second pen electrode that senses the slope of the input device 2000.

[0090] Figure 3a This is a cross-sectional view of an electronic device according to an embodiment of the present invention.

[0091] Reference Figure 3aThe electronic device 1000 may include a display layer 100 and a sensor layer 200. The display layer 100 may include a base layer 110, a circuit layer 120, a light-emitting element layer 130, and an encapsulation layer 140.

[0092] The substrate 110 may be a component that provides a base surface for arranging the circuit layer 120. The substrate 110 may be a glass substrate, a metal substrate, or a polymer substrate. However, the embodiments are not limited to this, and the substrate 110 may be an inorganic layer, an organic layer, or a composite material layer.

[0093] The base layer 110 may have a multi-layer structure. For example, the base layer 110 may include a first synthetic resin layer and silicon dioxide (SiO2) disposed on the first synthetic resin layer. x The system comprises a silicon oxide layer, an amorphous silicon (a-Si) layer disposed on the silicon oxide layer, and a second synthetic resin layer disposed on the amorphous silicon layer. The silicon oxide layer and the amorphous silicon layer may be referred to as base barrier layers.

[0094] Each of the first and second synthetic resin layers may comprise a polyimide-based resin. Furthermore, each of the first and second synthetic resin layers may comprise at least one selected from acrylate-based resins, methacrylate-based resins, polyisoprene-based resins, vinyl-based resins, epoxy-based resins, polyurethane-based resins, cellulose-based resins, siloxane-based resins, polyamide-based resins, and perylene-based resins. Additionally, in this specification, "~~"-based resins refer to compounds containing the functional group "~~".

[0095] Circuit layer 120 can be disposed on substrate 110. Circuit layer 120 may include insulating layers, semiconductor patterns, conductive patterns, and signal lines. Insulating layers, semiconductor layers, and conductive layers can be formed on substrate 110 by coating, deposition, or other methods. Subsequently, insulating layers, semiconductor layers, and conductive layers can be selectively patterned through multiple photolithography processes. Subsequently, semiconductor patterns, conductive patterns, and signal lines included in circuit layer 120 can be formed.

[0096] The light-emitting element layer 130 may be disposed on the circuit layer 120. The light-emitting element layer 130 may include light-emitting elements. For example, the light-emitting element layer 130 may include organic light-emitting materials, quantum dots, quantum rods, micro LEDs, or nano LEDs.

[0097] The encapsulation layer 140 can be disposed on the light-emitting element layer 130. The encapsulation layer 140 can protect the light-emitting element layer 130 from foreign matter such as moisture, oxygen and dust particles.

[0098] The sensor layer 200 can be formed on the display layer 100 through a continuous process. In this case, it can be described as the sensor layer 200 being directly disposed on the display layer 100. "Directly disposed" can mean that no third component is disposed between the sensor layer 200 and the display layer 100. That is, no additional adhesive components may be disposed between the sensor layer 200 and the display layer 100. Alternatively, the sensor layer 200 can be bonded to the display layer 100 with adhesive components. The adhesive components may include conventional adhesives or bonding agents.

[0099] Figure 3b This is a cross-sectional view of an electronic device according to an embodiment of the present invention.

[0100] Reference Figure 3b The electronic device 1000-1 may include a display layer 100-1 and a sensor layer 200-1. The display layer 100-1 may include a base substrate 110-1, a circuit layer 120-1, a light-emitting element layer 130-1, a packaging substrate 140-1, and a bonding component 150-1.

[0101] Each of the base substrate 110-1 and the encapsulation substrate 140-1 can be a glass substrate, a metal substrate, or a polymer substrate, but is not particularly limited to these.

[0102] The bonding component 150-1 may be disposed between the base substrate 110-1 and the encapsulation substrate 140-1. The bonding component 150-1 can bond the encapsulation substrate 140-1 to the base substrate 110-1 or the circuit layer 120-1. The bonding component 150-1 may include inorganic or organic materials. For example, inorganic materials may include frit sealant, and organic materials may include photocurable resin or photoplastic resin. However, the materials constituting the bonding component 150-1 are not limited to the examples described above.

[0103] The sensor layer 200-1 can be directly disposed on the packaging substrate 140-1. "Directly disposed" means that no third component is disposed between the sensor layer 200-1 and the packaging substrate 140-1. That is, no additional adhesive component needs to be disposed between the sensor layer 200-1 and the display layer 100-1. However, this is not a limitation; an adhesive layer may also be disposed between the sensor layer 200-1 and the packaging substrate 140-1.

[0104] Figure 4 This is a cross-sectional view of an electronic device according to an embodiment of the present invention. (In the description...) Figure 4At that time, for those who passed Figure 3a The constituent elements of the description are labeled with the same reference numerals, and their descriptions are omitted.

[0105] Reference Figure 4 At least one inorganic layer is formed on the upper surface of the base layer 110. The inorganic layer may include at least one of alumina, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The inorganic layer may be formed in multiple layers. The multiple inorganic layers may constitute a barrier layer and / or a buffer layer. In this embodiment, the display layer 100 is illustrated to include a buffer layer BFL.

[0106] The buffer layer BFL can improve the adhesion between the substrate 110 and the semiconductor pattern. The buffer layer BFL may include a silicon oxide layer and a silicon nitride layer, which may be stacked alternately.

[0107] Semiconductor patterns can be arranged on the buffer layer BFL. The semiconductor patterns can include polycrystalline silicon. However, they are not limited to this; the semiconductor patterns can also include amorphous silicon, low-temperature polycrystalline silicon, or oxide semiconductors.

[0108] Figure 4 Only a portion of the semiconductor pattern is illustrated; semiconductor patterns can be arranged in other areas. The semiconductor patterns can be arranged across pixels according to a specific rule. The electrical properties of the semiconductor patterns can differ depending on whether they are doped. The semiconductor pattern can include a first region with high conductivity and a second region with low conductivity. The first region can be doped with either N-type or P-type dopant. A P-type transistor can include a doped region with P-type dopant, and an N-type transistor can include a doped region with N-type dopant. The second region can be undoped, or it can be doped at a lower concentration than the first region.

[0109] The conductivity of the first region is greater than that of the second region. The first region can essentially function as an electrode or signal line. The second region can essentially be equivalent to the active region (or channel region) of a transistor. In other words, part of the semiconductor pattern can be the active region of a transistor, another part can be the source or drain of a transistor, and yet another part can be a connecting electrode or a connecting signal line.

[0110] Each pixel can have an equivalent circuit including seven transistors, a capacitor, and a light-emitting element; the equivalent circuit of a pixel can be deformed into various forms. Figure 4 An exemplary illustration shows a transistor 100PC and a light-emitting element 100PE included in a pixel.

[0111] Transistor 100PC may include a source SC1, an active region A1, and a drain D1. The source SC1, active region A1, and drain D1 can be formed by a semiconductor pattern. The source SC1 and drain D1 may extend in opposite directions from the active region A1 in cross-section. Figure 4 A portion of the connection signal line SCL, formed by a semiconductor pattern, is illustrated. Although not shown separately, the connection signal line SCL can be connected in a plane to the drain D1 of transistor 100PC.

[0112] The first insulating layer 10 may be disposed on the buffer layer BFL. The first insulating layer 10 may overlap multiple pixels and cover the semiconductor pattern. The first insulating layer 10 may be an inorganic layer and / or an organic layer, and may have a single-layer structure or a multi-layer structure. The first insulating layer 10 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. In this embodiment, the first insulating layer 10 may be a single-layer silicon oxide layer. Not only the first insulating layer 10, but the insulating layer of the circuit layer 120 described later may also be an inorganic layer and / or an organic layer, and may have a single-layer structure or a multi-layer structure. The inorganic layer may include at least one of the above-mentioned substances, but is not limited thereto.

[0113] Gate G1 is disposed on the first insulating layer 10. Gate G1 may be part of a metal pattern. Gate G1 overlaps with the active region A1. In the process of doping the semiconductor pattern, gate G1 can function as a mask.

[0114] The second insulating layer 20 can be disposed on the first insulating layer 10 and cover the gate G1. The second insulating layer 20 can overlap multiple pixels. The second insulating layer 20 can be an inorganic layer and / or an organic layer, and can have a single-layer structure or a multi-layer structure. The second insulating layer 20 can include at least one of silicon oxide, silicon nitride, and silicon oxynitride. In this embodiment, the second insulating layer 20 can have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0115] The third insulating layer 30 may be disposed on the second insulating layer 20. The third insulating layer 30 may have a single-layer structure or a multi-layer structure. For example, the third insulating layer 30 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0116] The first connecting electrode CNE1 can be disposed on the third insulating layer 30. The first connecting electrode CNE1 can be connected to the connecting signal line SCL through the contact hole CNT-1 that passes through the first insulating layer 10, the second insulating layer 20 and the third insulating layer 30.

[0117] The fourth insulating layer 40 may be disposed on the third insulating layer 30. The fourth insulating layer 40 may be a single layer of silicon oxide. The fifth insulating layer 50 may be disposed on the fourth insulating layer 40. The fifth insulating layer 50 may be an organic layer.

[0118] The second connecting electrode CNE2 can be disposed on the fifth insulating layer 50. The second connecting electrode CNE2 can be connected to the first connecting electrode CNE1 through the contact hole CNT-2 that passes through the fourth insulating layer 40 and the fifth insulating layer 50.

[0119] The sixth insulating layer 60 may be disposed on the fifth insulating layer 50 and cover the second connecting electrode CNE2. The sixth insulating layer 60 may be an organic layer.

[0120] The light-emitting element layer 130 may be disposed on the circuit layer 120. The light-emitting element layer 130 may include a light-emitting element 100PE. For example, the light-emitting element layer 130 may include an organic light-emitting material, quantum dot, quantum rod, micro LED, or nano LED. Hereinafter, the case where the light-emitting element 100PE is an organic light-emitting element will be described as an example, but it is not particularly limited to this.

[0121] The light-emitting element 100PE may include a first electrode AE, a light-emitting layer EL, and a second electrode CE. The first electrode AE ​​may be disposed on a sixth insulating layer 60. The first electrode AE ​​may be connected to a second connecting electrode CNE2 through a contact hole CNT-3 penetrating the sixth insulating layer 60.

[0122] A pixel defining film 70 may be disposed on a sixth insulating layer 60 and cover a portion of the first electrode AE. An opening 70-OP is defined in the pixel defining film 70. The opening 70-OP of the pixel defining film 70 exposes at least a portion of the first electrode AE.

[0123] Effective area 1000A (reference) Figure 1a The electrode may include a light-emitting region PXA and a non-light-emitting region NPXA adjacent to the light-emitting region PXA. The non-light-emitting region NPXA may surround the light-emitting region PXA. In this embodiment, the light-emitting region PXA is defined as corresponding to a portion of the first electrode AE ​​exposed through the opening 70-OP.

[0124] The light-emitting layer EL can be disposed on the first electrode AE. The light-emitting layer EL can be disposed in the region corresponding to the opening 70-OP. That is, the light-emitting layer EL can be formed separately in each pixel. When the light-emitting layer EL is formed separately in each pixel, the light-emitting layer EL can emit light of at least one color selected from blue, red, and green. However, it is not limited to this; the light-emitting layer EL can also be provided together with the pixel. In this case, the light-emitting layer EL can also provide blue light or white light.

[0125] The second electrode CE can be disposed on the light-emitting layer EL. The second electrode CE can have a single shape and be disposed together on multiple pixels.

[0126] Although not illustrated, a hole control layer may be disposed between the first electrode AE ​​and the light-emitting layer EL. The hole control layer may be disposed together in the light-emitting region PXA and the non-light-emitting region NPXA. The hole control layer may include a hole transport layer and a hole injection layer. An electron control layer may be disposed between the light-emitting layer EL and the second electrode CE. The electron control layer may include an electron transport layer and an electron injection layer. The hole control layer and the electron control layer may be jointly formed over multiple pixels using an open mask.

[0127] The encapsulation layer 140 may be disposed on the light-emitting element layer 130. The encapsulation layer 140 may include inorganic layers, organic layers and inorganic layers stacked in sequence, but the layers constituting the encapsulation layer 140 are not limited to these.

[0128] The inorganic layer protects the light-emitting element layer 130 from moisture and oxygen, while the organic layer protects it from foreign matter such as dust particles. The inorganic layer may include silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, or aluminum oxide, etc. The organic layer may include, but is not limited to, acrylic-based organic layers.

[0129] The sensor layer 200 can be formed on the display layer 100 through a continuous process. In this case, it can be described as the sensor layer 200 being directly disposed on the display layer 100. "Directly disposed" can mean that no third component is disposed between the sensor layer 200 and the display layer 100. That is, no additional adhesive components may be disposed between the sensor layer 200 and the display layer 100. Alternatively, the sensor layer 200 can be bonded to the display layer 100 by adhesive components. The adhesive components may include conventional adhesives or bonding agents.

[0130] The sensor layer 200 may include a base insulating layer 201, a first conductive layer 202, a sensing insulating layer 203, a second conductive layer 204, and a cover insulating layer 205.

[0131] The base insulating layer 201 may be an inorganic layer comprising at least one of silicon nitride, silicon oxynitride, and silicon oxide. Alternatively, the base insulating layer 201 may also be an organic layer comprising epoxy resin, acrylic resin, or imide resin. The base insulating layer 201 may have a single-layer structure or a multilayer structure stacked along the third direction DR3.

[0132] Each of the first conductive layer 202 and the second conductive layer 204 may have a single-layer structure or a multi-layer structure stacked along the third direction DR3.

[0133] The single-layer conductive layer can include a metal layer or a transparent conductive layer. The metal layer can include molybdenum, silver, titanium, copper, aluminum, or their alloys. The transparent conductive layer can include transparent conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide (IZTO). Furthermore, the transparent conductive layer can include conductive polymers such as PEDOT, metal nanowires, graphene, etc.

[0134] The conductive layer in a multilayer structure may include a metal layer. The metal layer may, for example, have a three-layer structure of titanium / aluminum / titanium. The conductive layer in a multilayer structure may include at least one metal layer and at least one transparent conductive layer.

[0135] At least one of the sensing insulating layer 203 and the covering insulating layer 205 may include an inorganic film. The inorganic film may include at least one of alumina, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0136] At least one of the sensing insulating layer 203 and the covering insulating layer 205 may include an organic film. The organic film may include at least one of acrylic resin, methacrylic resin, polyisoprene resin, ethylene resin, epoxy resin, polyurethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin.

[0137] Figure 5 This is a block diagram of a display layer and a display driver according to an embodiment of the present invention.

[0138] Reference Figure 5 The display layer 100 may include multiple scan lines SL1-SLn, multiple data lines DL1-DLm, and multiple pixels PX. Each of the multiple pixels PX may be connected to a corresponding data line in the multiple data lines DL1-DLm, and to a corresponding scan line in the multiple scan lines SL1-SLn. In one embodiment of the present invention, the display layer 100 may further include light-emitting control lines, and the display driving unit 100C may further include a light-emitting driving circuit that provides control signals to the light-emitting control lines. The configuration of the display layer 100 is not particularly limited.

[0139] The display driver unit 100C may include a signal control circuit 100C1, a scan drive circuit 100C2, and a data drive circuit 100C3.

[0140] The signal control circuit 100C1 can be controlled from the main control unit 1000C (see reference). Figure 2 It receives image data (RGB) and control signals (D-CS). The control signals (D-CS) can include various signals. For example, the control signals (D-CS) can include input vertical synchronization signals, input horizontal synchronization signals, master clock signals, and data enable signals, etc.

[0141] The signal control circuit 100C1 can generate a first control signal CONT1 and a vertical synchronization signal Vsync based on the control signal D-CS, and output the first control signal CONT1 and the vertical synchronization signal Vsync to the scan drive circuit 100C2. The vertical synchronization signal Vsync can be included in the first control signal CONT1.

[0142] The signal control circuit 100C1 can generate a second control signal CONT2 and a horizontal synchronization signal Hsync based on the control signal D-CS, and output the second control signal CONT2 and the horizontal synchronization signal Hsync to the data drive circuit 100C3. The horizontal synchronization signal Hsync can be included in the second control signal CONT2.

[0143] Furthermore, the signal control circuit 100C1 can process the image data RGB into a data signal DS that meets the operating conditions of the display layer 100 and output it to the data driving circuit 100C3. The first control signal CONT1 and the second control signal CONT2 are signals required for the operation of the scan driving circuit 100C2 and the data driving circuit 100C3, and are not particularly limited thereto.

[0144] The scan driving circuit 100C2 can drive multiple scan lines SL1-SLn in response to the first control signal CONT1 and the vertical synchronization signal Vsync. In one embodiment of the present invention, the scan driving circuit 100C2 can utilize the circuit layer 120 (see reference 120) within the display layer 100. Figure 4 The same process can be used, but it is not limited to this. For example, the scan drive circuit 100C2 can be implemented as an integrated circuit (IC) and directly mounted on a predetermined area of ​​the display layer 100, or it can be mounted on an additional printed circuit board in a chip-on-film (COF) manner and electrically connected to the display layer 100.

[0145] The data driving circuit 100C3 can output grayscale voltages to drive multiple data lines DL1-DLm in response to the second control signal CONT2, the horizontal synchronization signal Hsync, and the data signal DS from the signal control circuit 100C1. The data driving circuit 100C3 can be implemented as an integrated circuit and directly mounted on a predetermined area of ​​the display layer 100, or it can be mounted on an additional printed circuit board as a chip-on-film assembly and electrically connected to the display layer 100, but is not particularly limited to these methods. For example, the data driving circuit 100C3 can utilize the circuit layer 120 within the display layer 100 (see reference 120). Figure 4 Formed using the same process.

[0146] Figure 6 This is a block diagram of a sensor layer and a control unit according to an embodiment of the present invention.

[0147] Reference Figure 6 In the sensor layer 200, an active region 200A and a surrounding region 200N can be defined. The active region 200A can be a region activated by an electrical signal. For example, the active region 200A can be a region sensing an input. The active region 200A can be integrated with the electronic device 1000 (see reference). Figure 1a The effective area is 1000A (refer to) Figure 1a The surrounding area 200N can surround the effective area 200A. The surrounding area 200N can overlap with the electronic device 1000 (refer to...). Figure 1a The surrounding area of ​​1000NA (refer to) Figure 1a )overlapping.

[0148] The sensor layer 200 may include a plurality of electrodes 210 and a plurality of cross electrodes 220. Each of the plurality of electrodes 210 may extend along a first direction DR1, and the plurality of electrodes 210 are arranged spaced apart from each other in a second direction DR2. Each of the plurality of cross electrodes 220 may extend along the second direction DR2, and the plurality of cross electrodes 220 are arranged spaced apart from each other in the first direction DR1.

[0149] The plurality of cross electrodes 220 may be insulated from the plurality of electrodes 210. Each of the plurality of electrodes 210 and the plurality of cross electrodes 220 may have a stripe shape or a slat shape. The plurality of electrodes 210 and the plurality of cross electrodes 220 having such shapes can improve the sensing characteristics of continuous linear input. However, the shape of each of the plurality of electrodes 210 and the plurality of cross electrodes 220 is not limited thereto.

[0150] The control unit 200C can be electrically connected to the sensor layer 200. The control unit 200C can control the sensor layer 200. The control unit 200C can control the sensor layer 200 from the main control unit 1000C (see reference). Figure 2) receives control signal I-CS and sends it to the main control unit 1000C (refer to Figure 2 It provides coordinate signals I-SS.

[0151] The control unit 200C may include a sensor control circuit 200C1, a signal generation circuit 200C2, an input detection circuit 200C3, and a switching circuit 200C4. The sensor control circuit 200C1, the signal generation circuit 200C2, and the input detection circuit 200C3 may be implemented in a single chip, or a portion of the sensor control circuit 200C1, the signal generation circuit 200C2, and the input detection circuit 200C3 may be implemented in different chips.

[0152] The sensor control circuit 200C1 can control the operation of the signal generation circuit 200C2 and the switching circuit 200C4, and calculate the coordinates of the external input based on the drive signal received from the input detection circuit 200C3, or analyze the modulation signal received from the input device 2000 (see reference 2000) based on the modulation signal received from the input detection circuit 200C3. Figure 2 The sensor control circuit 200C1 can provide the sensor layer 200 with a first uplink signal or a second uplink signal having a phase different from the first uplink signal. This will be explained later.

[0153] The signal generation circuit 200C2 can provide an output signal (or drive signal) called the TX signal to the sensor layer 200. The signal generation circuit 200C2 can output an output signal that conforms to the operating mode to the sensor layer 200.

[0154] The input detection circuit 200C3 converts the analog signal, known as the RX signal (or sensing signal), received from the sensor layer 200 into a digital signal. The input detection circuit 200C3 amplifies the received analog signal and then filters it. Finally, the input detection circuit 200C3 converts the filtered signal back into a digital signal.

[0155] The switching circuit 200C4 can selectively control the electrical connection between the sensor layer 200 and the signal generation circuit 200C2 and / or the input detection circuit 200C3, depending on the control of the sensor control circuit 200C1.

[0156] Switching circuit 200C4 can connect each of the plurality of electrodes 210 and the plurality of cross electrodes 220 to signal generation circuit 200C2. Alternatively, each of the plurality of electrodes 210 and the plurality of cross electrodes 220 can be connected to input detection circuit 200C3. In this case, sensor layer 200 can operate in a first mode.

[0157] The switching circuit 200C4 can, under the control of the sensor control circuit 200C1, connect one group of the plurality of electrodes 210 and the plurality of cross electrodes 220 to the signal generation circuit 200C2, and connect the remaining group of the plurality of electrodes 210 and the plurality of cross electrodes 220 to the input detection circuit 200C3. In this case, the sensor layer 200 can operate in a second mode.

[0158] Figure 7a and Figure 7b This is a diagram illustrating a portion of a sensor layer operating in a first mode according to an embodiment of the present invention.

[0159] Reference Figures 6 to 7b A portion of an electrode 210 and a portion of a cross electrode 220 can be defined as a sensing unit 200U. Figure 7a and Figure 7b The enlarged illustration shows a sensing unit 200U.

[0160] The cross electrode 220 may include a cross pattern 221 and a bridging pattern 222 electrically connected to the cross pattern 221. The cross pattern 221 may place the electrodes 210 therebetween while being spaced apart from each other. The bridging pattern 222 may overlap with the electrodes 210 and may be insulated from crossing the electrodes 210.

[0161] The cross pattern 221 and the electrode 210 can be arranged on the same layer, while the bridging pattern 222 can be arranged on a different layer than the cross pattern 221 and the electrode 210. For example, the cross pattern 221 and the electrode 210 can be included in the second conductive layer 204 (see reference). Figure 4 The bridging pattern 222 may be included in the first conductive layer 202 (see reference). Figure 4 This structure can be referred to as a bottom bridging structure. However, the invention is not particularly limited thereto. For example, the cross pattern 221 and the electrode 210 may be included in the first conductive layer 202 (see reference). Figure 4 The bridging pattern 222 may be included in the second conductive layer 204 (see reference). Figure 4 This structure can be called a top bridging structure.

[0162] Furthermore, the sensor layer 200 may also include a dummy pattern 250 disposed in the area where the cross pattern 221 and the electrode 210 are not disposed. The dummy pattern 250 may be provided to prevent the electrode 210 and the cross electrode 220 from being identified externally. The dummy pattern 250 may be an electrically levitated pattern.

[0163] Each of the cross pattern 221, electrode 210, and dummy pattern 250 can have a grid structure. In this case, each of the cross pattern 221, electrode 210, and dummy pattern 250 can be defined with an opening. However, it is not limited to this; each of the cross pattern 221, electrode 210, and dummy pattern 250 can also be constructed using a transparent monolithic electrode.

[0164] The first mode could be electronic device 1000 (refer to...) Figure 1a ) and input device 2000 (refer to) Figure 1a The control unit 200C can sense data exchanged between the input device 2000 (see reference 2000). In the first mode, the control unit 200C can sense data exchanged between the input device 2000 (see reference 2000). Figure 2 The first input generated. Figure 7a The operation shown in the diagram can be performed from electronic device 1000 (see reference). Figure 1a Input device 2000 (reference) Figure 1a It provides uplink signaling operations.

[0165] Reference Figure 7a Each of electrode 210 and cross electrode 220 is illustrated as being used to provide uplink signals S1a, S1b from control unit 200C to input device 2000 (see reference). Figure 1a This is one example of a transmitting electrode, but it is not particularly limited to this. For example, electrode 210 or cross electrode 220 can also be used as a transmitting electrode. The uplink signals S1a and S1b can be... Figure 2 The uplink signal ULS.

[0166] Reference Figure 7b Each of electrode 210 and cross electrode 220 can be used for input device 2000 (see reference) Figure 1a The derived sensing signals S2a and S2b are transmitted to the receiving electrode of the control unit 200C. The control unit 200C can receive the first sensing signal S2a from the electrode 210 and the second sensing signal S2b from the cross electrode 220.

[0167] Figure 8 This is a diagram illustrating a portion of a sensor layer operating in a second mode according to an embodiment of the present invention.

[0168] Reference Figure 6 and Figure 8 In the second mode, the control unit 200C can sense the user's body 3000 (refer to...) Figure 2 The second input generated. In the second mode, the control unit 200C can sense the external input by sensing the change in the mutual capacitance formed between the electrode 210 and the cross electrode 220.

[0169] The control unit 200C can provide an output signal S3 to the electrode 210, and the control unit 200C can receive a sensing signal S4 from the cross electrode 220. That is, in the second mode, the electrode 210 can function as a transmitting electrode, and the cross electrode 220 can function as a receiving electrode. However, it is not particularly limited to this. For example, the electrode 210 can also function as a receiving electrode, and the cross electrode 220 can also function as a transmitting electrode.

[0170] Figure 9 The diagram illustrates the waveforms of each of a first uplink signal and a second uplink signal according to an embodiment of the present invention.

[0171] Reference Figure 9 The control unit 200C can output a first uplink signal ULS1 or a second uplink signal ULS2 to the sensor layer 200. The first uplink signal ULS1 and the second uplink signal ULS2 can be out of phase with each other.

[0172] The second uplink signal ULS2 can have a 180-degree phase difference with the first uplink signal ULS1. That is, the second uplink signal ULS2 can be the inverse of the first uplink signal ULS1. Figure 2 Uplink signal ULS (reference) Figure 2 It may include a first uplink signal ULS1 and a second uplink signal ULS2.

[0173] Figure 10 The data of each of the first uplink signal and the second uplink signal according to an embodiment of the present invention are schematically illustrated.

[0174] Reference Figure 10 The first uplink signal ULS1 and the second uplink signal ULS2 can have the same size. For example, each of the first uplink signal ULS1 and the second uplink signal ULS2 can have a size of 33 bits.

[0175] The first uplink signal ULS1 may include first synchronization data PA1, first information data CD1, and first check data CRC1. The second uplink signal ULS2 may include second synchronization data PA2, second information data CD2, and second check data CRC2.

[0176] Input device 2000 (reference) Figure 2The first uplink signal ULS1 and the second uplink signal ULS2 can be identified based on the first synchronization data PA1 and the second synchronization data PA2. Each of the first synchronization data PA1 and the second synchronization data PA2 can be 3 bits in size. The first synchronization data PA1 and the second synchronization data PA2 can be different from each other. For example, the first synchronization data PA1 can have 001 data and the second synchronization data PA2 can have 110 data. However, this is only exemplary, and the first synchronization data PA1 and the second synchronization data PA2 according to an embodiment of the present invention can be different according to the communication protocol. For example, the first synchronization data PA1 can be 101 and the second synchronization data PA2 can be 010.

[0177] Each of the first information data CD1 and the second information data CD2 may have a size of 25 bits. Each of the first information data CD1 and the second information data CD2 may include an electronic device 1000 (see reference). Figure 2 (information).

[0178] Each of the first checksum CRC1 and the second checksum CRC2 can be 5 bits in size. Each of the first checksum CRC1 and the second checksum CRC2 can include check information. The check information can detect errors in the transmitted data. The check information can be a cyclic redundancy check (CRC).

[0179] Figure 11 This is a flowchart illustrating an input device driving method according to an embodiment of the present invention. Figure 12 The diagram illustrates the waveforms of each of the data and transformed data of the second uplink signal according to an embodiment of the present invention.

[0180] Reference Figure 2 , Figures 9 to 12 The communication unit 2700 can receive the uplink signal ULS (S100) from the sensor layer 200.

[0181] The memory 2300 may store first information corresponding to the first uplink signal ULS1 and second information corresponding to the second uplink signal ULS2. The first information can be based on the first synchronization data PA1 (refer to...). Figure 9 The information is stored accordingly. For example, the first information may include data for 001. The second information may be stored according to the second synchronization data PA2 (refer to...). Figure 9 And stored. For example, the second information may include data from 110.

[0182] The signal determination unit 2400 can determine whether the uplink signal ULS is the first uplink signal ULS1 or the second uplink signal ULS2 based on the first information and the second information (S200).

[0183] The signal conversion unit 2500 can convert the second uplink signal ULS2 to output converted data UTD when the uplink signal ULS is a second uplink signal ULS2 (S300). The signal conversion unit 2500 can convert a first bit of the second uplink signal ULS2 to a second bit different from the first bit, and convert the second bit back to the first bit to output the converted data UTD. The first bit can be 0 bits, and the second bit can be 1 bit. The converted data UTD can have a 180-degree phase difference with the second uplink signal ULS2. That is, the converted data UTD can be inverted compared to the second uplink signal ULS2.

[0184] The second uplink signal ULS2 can have the same characteristics as the first uplink signal ULS1 (see reference). Figure 9 The transformed data UTD obtained by transforming the second uplink signal ULS2 can have a different phase than the first uplink signal ULS1 (refer to...). Figure 9 (Same phase)

[0185] According to the present invention, the signal determination unit 2400 can distinguish the uplink signal ULS based on the first information and the second information stored in the memory 2300. That is, even without receiving a separate signal for distinguishing the uplink signal ULS from the electronic device 1000, the input device 2000 can identify the uplink signal ULS as either the first uplink signal ULS1 or the second uplink signal ULS2. Therefore, the amount of information transmitted from the electronic device 1000 to the input device 2000 can be reduced.

[0186] Figure 13a This is a plan view of a sensor layer according to an embodiment of the present invention. Figure 13b This is a conceptual diagram illustrating the operation of the display layer and sensor layer according to an embodiment of the present invention.

[0187] Reference Figure 2 , Figure 13a and Figure 13b The sensor layer 200 may include a base insulating layer 201, multiple electrodes 210, multiple cross electrodes 220, multiple wirings 230, and multiple pads 240.

[0188] Multiple electrodes 210 and multiple cross electrodes 220 can be arranged in the effective area 200A. Multiple wirings 230 and multiple pads 240 can be arranged in the surrounding area 200N.

[0189] Each of the plurality of electrodes 210 and the plurality of cross electrodes 220 can be electrically connected to a corresponding wiring in the plurality of wirings 230. Although Figure 13a The illustration shows a single routing structure where one wire 230 is connected to one electrode 210 and another wire 230 is connected to one cross electrode 220, but it is not particularly limited to this. For example, each of the multiple cross electrodes 220 may have two wires 230 connected to it. Alternatively, each of the multiple electrodes 210 may have two wires 230 connected to it, and each of the multiple cross electrodes 220 may also have two wires 230 connected to it.

[0190] Multiple pads 240 can be electrically connected to multiple wires 230 respectively. The sensor layer 200 can be electrically connected to the control unit 200C through the multiple pads 240. However, this is only exemplary, and multiple pads 240 according to an embodiment of the present invention can also be arranged on the display layer 100. In this case, multiple wires 230 can be electrically connected to multiple pads 240 through contact holes.

[0191] A signal region AR can be defined on sensor layer 200. When viewed from a plane, the signal region AR can overlap with the effective region 200A (see reference). Figure 6 ).

[0192] The control unit 200C can generate a first uplink signal ULS1 and a second uplink signal ULS2.

[0193] Display layer 100 can display images in units of a frame interval. A frame interval can be defined as the interval from the rising edge of the vertical synchronization signal Vsync to the next rising edge.

[0194] With the operating frequency of display layer 100 at 60Hz (Hertz), the time corresponding to one frame interval is approximately 16.44ms (milliseconds); with the operating frequency of display layer 100 at 120Hz, the time corresponding to one frame interval is approximately 8.33ms. Figure 13b The illustration is based on the case where the operating frequency of the display layer 100 is 60Hz.

[0195] The sensor layer 200 can operate in a first mode MD1 that senses a first input generated by the input device 2000 or a second mode MD2 that senses a second input generated by the user's body 3000. During the period when the display layer 100 displays an image of a frame interval, the control unit 200C can operate in the first mode MD1 and the second mode MD2 sequentially.

[0196] During the nth frame interval (n is a positive integer), sensor layer 200 can operate in both the first mode MD1 and the second mode MD2. The nth frame interval can be referred to as the odd-numbered frame interval. The nth frame interval can also be referred to as the first frame interval.

[0197] The first mode MD1 may include a first interval PU1 and a second interval PS. The second interval PS may occur after the first interval PU1. The control unit 200C may determine the starting point of the first interval PU1 synchronously with the vertical synchronization signal Vsync. The starting point of the first interval PU1 can be determined based on the time point of the level change of the vertical synchronization signal Vsync. For example, the starting point of the first interval PU1 may be defined as the time point when the vertical synchronization signal Vsync changes from a high level to a low level.

[0198] In the first interval PU1, the control unit 200C can output a first uplink signal ULS1 to the sensor layer 200. The frame interval that provides the first uplink signal ULS1 can be referred to as the first frame interval.

[0199] The input device 2000 can output a downlink signal DLS based on the first uplink signal ULS1. The input device 2000 can provide the downlink signal DLS to the control unit 200C during the second interval PS.

[0200] In the second interval PS, the sensor layer 200 can receive the downlink signal DLS provided by the input device 2000. The sensor layer 200 can sense the first input of the input device 2000 based on the downlink signal DLS.

[0201] The second mode MD2 can be operated after the first mode MD1.

[0202] During the (n+1)th frame interval, sensor layer 200 can operate in both a first mode MD1 and a second mode MD2. The (n+1)th frame interval can be referred to as the even-numbered frame interval. The (n+1)th frame interval can also be referred to as the second frame interval.

[0203] The second mode MD2 may include a first interval PU2 and a second interval PS. The second interval PS may occur after the first interval PU2. The control unit 200C may determine the starting point of the first interval PU2 synchronously with the vertical synchronization signal Vsync. The starting point of the first interval PU2 can be determined based on the time point of the level change of the vertical synchronization signal Vsync. For example, the starting point of the first interval PU2 may be defined as the time point when the vertical synchronization signal Vsync changes from a high level to a low level.

[0204] In the first interval PU2, the control unit 200C can output a second uplink signal ULS2 to the sensor layer 200. The second uplink signal ULS2 may have a phase different from that of the first uplink signal ULS1.

[0205] Input device 2000 can output transformed data UTD (refer to) based on the second uplink signal ULS2. Figure 12 The input device 2000 can convert data UTD (refer to...). Figure 12 The input device 2000 can provide the downlink signal DLS to the control unit 200C during the second interval PS.

[0206] In the second interval PS, the sensor layer 200 can receive the downlink signal DLS provided by the input device 2000. The sensor layer 200 can sense the first input of the input device 2000 based on the downlink signal DLS.

[0207] The first frame interval and the second frame interval can be repeated. That is, during the (n+2)th frame interval, the control unit 200C can output the first uplink signal ULS1 to the sensor layer 200 in the first mode MD1.

[0208] The first mode MD1 and the second mode MD2 can repeat each other. In the 2a-1th first mode MD1 (where a is a positive integer), the control unit 200C can output a first uplink signal ULS1 to the sensor layer 200. In the 2ath first mode MD1, the control unit 200C can output a second uplink signal ULS2 to the sensor layer 200.

[0209] The first uplink signal ULS1 provided to the signal region AR can be transmitted via the sensor layer 200 and the second electrode CE (refer to...). Figure 4 The parasitic capacitance Cb formed between (refer to) Figure 4 And transferred to the second electrode CE (refer to) Figure 4 Transferred to the second electrode CE (refer to...) Figure 4 The first uplink signal ULS1 can be transmitted to multiple data cablings DL1-DLm (see reference). Figure 5 Each of the lines in ) . Therefore, the first noise may occur due to the first uplink signal ULS1. The first noise is related to the data signal DS (refer to Figure 5 These signals may interfere with each other, causing the first flicker. However, according to the present invention, the phase of the second uplink signal ULS2 provided to the signal region AR and the phase of the first uplink signal ULS1 can be out of phase. The second uplink signal ULS2 can be controlled by the parasitic capacitance Cb (refer to...). Figure 4And transferred to the second electrode CE (refer to) Figure 4 Transferred to the second electrode CE (refer to...) Figure 4 The second uplink signal ULS2 can be transmitted to multiple data cablings DL1-DLm (see reference). Figure 5 Each of the data signals in the above list. Second noise may occur due to the second uplink signal ULS2. This second noise is related to the data signal DS (refer to...). Figure 5 The first and second flickers may conflict (interfere) with each other, resulting in a second flicker. The first and second flickers repeat repeatedly over multiple frame intervals, producing an optical illusion that cancels each other out. Therefore, the image quality of the display layer 100 can be improved.

[0210] Furthermore, according to the present invention, when the signal determination unit 2400 identifies the second uplink signal ULS2, the signal conversion unit 2500 can output converted data UTD (refer to) based on the second uplink signal ULS2. Figure 12 Transformed data UTD (refer to) Figure 12 The signal can be one that the input device 2000 can parse. The input device 2000 can parse the signal based on the first uplink signal ULS1 or the transformed data UTD (see reference). Figure 12 The electronic device 1000 can sense the coordinates or slope of the input device 2000 based on the downlink signal DLS received from the input device 2000. Therefore, the input device 2000 can output the downlink signal DLS to the sensor layer 200 based on the first uplink signal ULS1 or the second uplink signal ULS2 received in each of the multiple frame intervals. Therefore, the sensing reliability of the sensor layer 200 can be improved.

[0211] Figure 14 This is a plan view illustrating a sensor layer according to an embodiment of the present invention. In the description... Figure 14 At that time, for those who passed Figure 13a The constituent elements of the description are labeled with the same reference numerals, and their descriptions are omitted.

[0212] Reference Figure 2 and Figure 14 In sensor layer 200, a first region AR1 and a second region AR2 can be defined. The second region AR2 can be adjacent to the first region AR1. Each of the first region AR1 and the second region AR2 can be an effective region 200A (see reference). Figure 6 A portion of the area. The second area AR2 may not overlap with the first area AR1. The first area AR1 may be provided with one of a first uplink signal ULS1 and a second uplink signal ULS2. The second area AR2 may be provided with the other of the first uplink signal ULS1 and the second uplink signal ULS2.

[0213] The first uplink signal ULS1 and the second uplink signal ULS2 can be transmitted through each of the plurality of electrodes 210. Each of the first region AR1 and the second region AR2 can be defined based on the plurality of electrodes 210. However, this is merely exemplary, and the reference for defining the plurality of regions according to an embodiment of the present invention is not limited thereto. For example, the first uplink signal ULS1 and the second uplink signal ULS2 can be transmitted through each of the plurality of cross electrodes 220, in which case the first region AR1 and the second region AR2 can be defined based on each of the plurality of cross electrodes 220. Furthermore, the first uplink signal ULS1 and the second uplink signal ULS2 can also be transmitted through both the plurality of electrodes 210 and the plurality of cross electrodes 220, in which case the first region AR1 and the second region AR2 can be defined based on both the plurality of electrodes 210 and the plurality of cross electrodes 220.

[0214] The first uplink signal ULS1 and the second uplink signal ULS2 can be transmitted through the sensor layer 200 and the second electrode CE (refer to...). Figure 4 The parasitic capacitance Cb formed between (refer to) Figure 4 And transferred to the second electrode CE (refer to) Figure 4 The data is transferred to multiple pixels PX arranged in a unified shape (see reference). Figure 5 The second electrode CE (refer to) Figure 4 The first uplink signal ULS1 and the second uplink signal ULS2 can cancel each other out.

[0215] According to the present invention, the electrode CE is transferred to the second electrode (reference). Figure 4 The first uplink signal ULS1 and the second uplink signal ULS2 can cancel each other out, thereby preventing the uplink signal ULS from being transmitted to multiple data cablings DL1-DLm (see reference). Figure 5 Each of the lines in ) can prevent the provision of up to a maximum of data cabling DL1-DLm (refer to Figure 5 Each data signal DS in ) (refer to Figure 5 The uplink signal ULS and the data signal DS (see reference) can interfere with each other (or interfere with each other) and prevent the data signal DS (see reference) from interfering with each other. Figure 5 Therefore, the distortion of the data signal DS (refer to) caused by the uplink signal ULS can be eliminated or reduced. Figure 5 This improves image quality by reducing flickering caused by distortion.

[0216] Furthermore, according to the present invention, when the signal determination unit 2400 identifies the second uplink signal ULS2, it can output transformed data UTD (refer to) based on the second uplink signal ULS2. Figure 12 Transformed data UTD (refer to) Figure 12 The signal can be one that the input device 2000 can parse. The input device 2000 can parse the signal based on the first uplink signal ULS1 or the transformed data UTD (see reference). Figure 12 The electronic device 1000 can sense the coordinates or slope of the input device 2000 based on the downlink signal DLS received from the input device 2000. Therefore, the input device 2000 can receive a first uplink signal ULS1 or a second uplink signal ULS2 from each of the first region AR1 and the second region AR2 and output the downlink signal DLS to the sensor layer 200. This improves the sensing reliability of the sensor layer 200.

[0217] Figure 15a This is a flowchart illustrating an input device driving method according to an embodiment of the present invention. In the description... Figure 15a At that time, for those who passed Figure 11 The constituent elements of the description are labeled with the same reference numerals, and their descriptions are omitted.

[0218] Reference Figure 2 and Figure 15a The input device 2000 can receive the uplink signal ULS (S100). The memory 2300 can store first information corresponding to the first uplink signal ULS1 and second information corresponding to the second uplink signal ULS2.

[0219] The first information can be based on the first synchronization data PA1 (refer to...) Figure 9 The second information can be stored based on the second synchronization data PA2 (refer to...). Figure 9 The information is stored in memory 2300. However, this is merely exemplary, and the first and second information stored in memory 2300 are not limited thereto. For example, the first information can be stored according to first information data CD1 (refer to...). Figure 9 The second information can be stored according to the second information data CD2 (refer to...). Figure 9 And storage.

[0220] The signal determination unit 2400 can determine whether the uplink signal ULS is the first uplink signal ULS1 or the second uplink signal ULS2 based on the first information and the second information.

[0221] The signal determination unit 2400 can compare the first information with the uplink signal ULS upon receiving the uplink signal ULS (S211). The first information can be based on the first synchronization data PA1 (refer to...). Figure 9 The information can be stored as follows. For example, the first information may include data of 001. The signal determination unit 2400 may determine the uplink signal ULS as the first uplink signal ULS1 if the synchronization data of the uplink signal ULS includes the data of the first information (S212). However, this is only an example. According to an embodiment of the present invention, the first information may also be based on the first information data CD1 (refer to...). Figure 9 The signal determination unit 2400 may also determine the uplink signal ULS as the first uplink signal ULS1 if the information data of the uplink signal ULS includes the data of the first information.

[0222] The signal determination unit 2400 can compare the uplink signal ULS with the second information even if the synchronization data of the uplink signal ULS does not include the first information (S221). The second information can be based on the second synchronization data PA2 (refer to...). Figure 9 The information is stored accordingly. For example, the second information may include the data of 110. The signal determination unit 2400 may determine the uplink signal ULS as the second uplink signal ULS2 (S222) if the synchronization data of the uplink signal ULS includes the data of 110. However, this is only an example, and the second information according to an embodiment of the present invention may also be based on the second information data CD2 (refer to...). Figure 9 The signal determination unit 2400 may also determine the uplink signal ULS as the second uplink signal ULS2 if the information data of the uplink signal ULS includes the data of the second information.

[0223] The signal conversion unit 2500 can convert the second uplink signal ULS2 and output converted data UTD (refer to...). Figure 12 (S300).

[0224] The noise determination unit 2600 can determine that the uplink signal ULS is a noise signal if the synchronization data of the uplink signal ULS does not include data from each of the first information and the second information (S410). If the noise determination unit 2600 determines that the uplink signal ULS is the noise signal, the noise signal can be ignored (S420).

[0225] The transmitting circuit 2710 of the communication unit 2700 can transmit data based on the first uplink signal ULS1 or the transformed data UTD (see reference). Figure 12Output downlink signal DLS(S500).

[0226] According to the present invention, the input device 2000 may include a signal conversion unit 2500. Upon receiving a second uplink signal ULS2, the signal conversion unit 2500 can convert the second uplink signal ULS2 into converted data UTD (refer to) that can be parsed by the transmitting circuit 2710. Figure 12 The transmitting circuit 2710 can transmit data ULS1 or transform data UTD (see reference 1). Figure 12 The input device 1000 outputs a downlink signal DLS. The electronic device 1000 can sense the coordinates or slope of the input device 2000 based on the downlink signal DLS received from the input device 2000. The input device 2000 can output the downlink signal DLS to the electronic device 1000 independently of the first uplink signal ULS1 and the second uplink signal ULS2 output from the electronic device 1000. Therefore, the sensing reliability of the sensor layer 200 can be improved.

[0227] Furthermore, according to the present invention, the electronic device 1000 can output a first uplink signal ULS1 and a second uplink signal ULS2 having a phase different from that of the first uplink signal ULS1 to the input device 2000. The flicker of the display layer 100 caused by the first uplink signal ULS1 can be eliminated or reduced by the second uplink signal ULS2. Therefore, the image quality of the display layer 100 can be improved. The input device 2000 can output a downlink signal DLS based on the first uplink signal ULS1 upon receiving it. The input device 2000 can transform the second uplink signal ULS2 upon receiving it and output transformed data UTD (refer to…) Figure 12 ), and can be based on the transformed data UTD (refer to Figure 12 Output downlink signal DLS. Transformed data UTD (reference) Figure 12 The uplink signal ULS2 can be substantially the same as the first uplink signal ULS1. The input device 2000 can output a downlink signal DLS to the sensor layer 200 if it receives not only the first uplink signal ULS1 but also the second uplink signal ULS2. The input device 2000 can recognize the second uplink signal ULS2 used for image quality improvement as a valid uplink signal ULS. That is, the input device 2000 and the electronic device 1000 can be synchronized not only by the first uplink signal ULS1 but also by the second uplink signal ULS2. Therefore, the sensing sensitivity of the sensor layer 200 can be improved.

[0228] Figure 15bThis is a flowchart illustrating an input device driving method according to an embodiment of the present invention. In the description... Figure 15b At that time, for those who passed Figure 11 The constituent elements of the description are labeled with the same reference numerals, and their descriptions are omitted.

[0229] Reference Figure 2 and Figure 15b The input device 2000 can receive the uplink signal ULS (S100). The memory 2300 can store first information corresponding to the first uplink signal ULS1 and second information corresponding to the second uplink signal ULS2.

[0230] The first information can be based on the first synchronization data PA1 (refer to...) Figure 9 The second information can be stored based on the second synchronization data PA2 (refer to...). Figure 9 And storage.

[0231] The signal determination unit 2400 can determine whether the uplink signal ULS is the first uplink signal ULS1 based on the first information.

[0232] The signal determination unit 2400 can compare the first information with the uplink signal ULS upon receiving the uplink signal ULS (S211-1). The first information can be based on the first synchronization data PA1 (refer to...). Figure 9 The information can be stored. For example, the first information may include data of 001. The signal determination unit 2400 may determine the uplink signal ULS as the first uplink signal ULS1 if the synchronization data of the uplink signal ULS includes the data of the first information (S212-1).

[0233] The signal determination unit 2400 can determine the uplink signal ULS as the second uplink signal ULS2 (S220-1) if the synchronization data of the uplink signal ULS does not include the data of the first information.

[0234] The signal conversion unit 2500 can convert the second uplink signal ULS2 and output converted data UTD (refer to...). Figure 12 (S300-1).

[0235] The noise detection unit 2600 can determine the transformed data UTD (reference). Figure 12 Is it a noise signal (S410-1)? The noise determination unit 2600 can determine whether the transformed data UTD (refer to) is a noise signal. Figure 12 If the data does not include the first information, the transformed data UTD (refer to) will be used. Figure 12 The signal is identified as noise. The noise detection unit 2600 determines the transformed data UTD (refer to...). Figure 12 In the case of the noise signal, the noise signal can be ignored (S420).

[0236] The transmitting circuit 2710 of the communication unit 2700 can transmit data based on the first uplink signal ULS1 or the transformed data UTD (see reference). Figure 12 Output downlink signal DLS(S500).

[0237] According to the present invention, the input device 2000 may include a signal conversion unit 2500. The signal conversion unit 2500 can convert a signal that is not the first uplink signal ULS1 into converted data UTD (refer to...). Figure 12 The transmitting circuit 2710 can transmit data ULS1 or transform data UTD (see reference 1). Figure 12 The input device 1000 outputs a downlink signal DLS. The electronic device 1000 can sense the coordinates or slope of the input device 2000 based on the downlink signal DLS received from the input device 2000. The input device 2000 can output the downlink signal DLS to the electronic device 1000 independently of the first uplink signal ULS1 and the second uplink signal ULS2 output from the electronic device 1000. Therefore, the sensing reliability of the sensor layer 200 can be improved.

[0238] While the preferred embodiments of the present invention have been described above, those skilled in the art or with ordinary knowledge of the art will understand that various modifications and alterations can be made to the present invention without departing from the spirit and technical scope of the invention as set forth in the claims. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed specification, but should be determined by the claims.

Claims

1. An interface device, comprising: Electronic devices and input devices that communicate with said electronic devices, The electronic device includes: Display layer; A sensor layer, disposed on the display layer, senses a first input generated by the input device; and The control unit outputs a first uplink signal and a second uplink signal having a phase opposite to the first uplink signal to the sensor layer. The input device includes: The communication unit receives uplink signals from the sensor layer; The memory stores first information corresponding to the first uplink signal and second information corresponding to the second uplink signal; The signal determination unit determines, based on the first information and the second information, whether the uplink signal is the first uplink signal or the second uplink signal; and The signal conversion unit, when the uplink signal is the second uplink signal, converts the second uplink signal and outputs converted data having the same phase as the first uplink signal.

2. The interface device according to claim 1, wherein, The first uplink signal includes first synchronization data, first information data, and first verification data. The second uplink signal includes second synchronization data, second information data, and second verification data.

3. The interface device according to claim 2, wherein, The signal determination unit determines whether the uplink signal is the first uplink signal or the second uplink signal based on the first synchronization data or the second synchronization data and the first information and the second information stored in the memory.

4. The interface device according to claim 2, wherein, The signal determination unit determines whether the uplink signal is the first uplink signal or the second uplink signal based on the first information data or the second information data and the first information and the second information stored in the memory.

5. The interface device according to claim 1, wherein, The signal conversion unit converts the first bit and the second bit of the second uplink signal into the second bit and the first bit, respectively, and outputs the converted data.

6. The interface device according to claim 5, wherein, The input device outputs a downlink signal based on the transformed data or the first uplink signal.

7. The interface device according to claim 1, wherein, The display layer displays images during multiple frame intervals. In the nth frame interval, the control unit outputs the first uplink signal to the sensor layer, and in the (n+1)th frame interval, the control unit outputs the second uplink signal to the sensor layer, where n is a positive integer.

8. The interface device according to claim 1, wherein, The sensor layer defines a first region and a second region adjacent to the first region. The control unit outputs the first uplink signal to the first region and the second uplink signal to the second region.

9. The interface device according to claim 1, wherein, The electronic device further includes a display driving unit that generates a vertical synchronization signal for driving the display layer. The control unit outputs either the first uplink signal or the second uplink signal to the sensor layer in sync with the vertical synchronization signal.

10. The interface device according to claim 1, wherein, The sensor layer operates in a first mode for sensing the first input and a second mode for sensing the second input generated by touch. During the display of an image within a frame range on the display layer, the control unit operates sequentially in the first mode and the second mode.

11. The interface device according to claim 1, wherein, The input device further includes a noise determination unit for determining noise signals that are different from the first uplink signal and the second uplink signal.

12. The interface device according to claim 11, wherein, If the noise determination unit determines that the uplink signal is the noise signal, the noise signal is ignored.

13. An input device driving method, comprising the following steps: Receive uplink signals; Determine whether the uplink signal is a first uplink signal or a second uplink signal with a phase opposite to that of the first uplink signal; and When the uplink signal is the second uplink signal, the second uplink signal is transformed to output transformed data with the same phase as the first uplink signal.

14. The input device driving method according to claim 13, wherein, The first uplink signal includes first synchronization data, first information data, and first verification data. The second uplink signal includes second synchronization data, second information data, and second verification data. The steps for determining the uplink signal include the following steps: determining whether the uplink signal is the first uplink signal or the second uplink signal based on the first synchronization data or the second synchronization data.

15. The input device driving method according to claim 13, wherein, The steps of transforming the second uplink signal include the following steps: transforming the first bit and the second bit of the second uplink signal into the second bit and the first bit, respectively, and outputting the transformed data.

16. The input device driving method according to claim 15, wherein, It also includes the following steps: The downlink signal is output based on the transformed data or the first uplink signal.

17. The input device driving method according to claim 13, wherein, The first uplink signal includes first synchronization data, first information data, and first verification data. The second uplink signal includes second synchronization data, second information data, and second verification data. The steps for determining the uplink signal include the following steps: determining whether the uplink signal is the first uplink signal or the second uplink signal based on the first information data or the second information data.

18. The input device driving method according to claim 13, wherein, It also includes the following steps: It also identifies noise signals that are different from the first uplink signal and the second uplink signal; and If the input device receives the noise signal, the noise signal is ignored.

19. The input device driving method according to claim 18, wherein, The step of determining the noise signal is performed simultaneously with the step of determining the uplink signal.

20. The input device driving method according to claim 18, wherein, The step of determining the noise signal is performed after the step of transforming the second uplink signal.

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