Curable polymer composition

By using a composition with photopolymerization and thermally reactive groups to form a cured composition with a dual network structure, the biocompatibility and cytotoxicity of the products in SLA production is solved, and safer and more effective material applications are achieved.

CN114502358BActive Publication Date: 2025-03-28POLY MED INC
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Patent Information

Application Number
CN202080071118.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2019-10-09
Filing Date
2020-10-08
Publication Date
2025-03-28
Estimated Expiration
2040-10-08

AI Technical Summary

Technical Problem

The prior art faces the biocompatibility and cytotoxicity of the products when using thermal- and light-cured materials for stereolithography (SLA) production, which affects its safety and application effect.

Method used

A curable composition is provided, which comprises a compound having a plurality of photopolymerized groups (such as polyhv) and a compound having a thermally reactive group (such as polyΔ), as well as a photoinitiator and stabilizer, a curable composition that forms a dual network structure by photopolymerization and thermal polymerization.

Benefits of technology

By forming a cured composition with a dual network structure, the biocompatibility and degradability of the material are improved, the cytotoxicity is reduced, and the safety and application effect of the product are enhanced.

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Abstract

Compounds and compositions are provided that are useful in additive printing, particularly additive printing techniques such as stereolithography (SLA), wherein a combination of one or more photocurable compounds, such as a compound having a plurality of ethylenically unsaturated groups and a compound having a plurality of thiol groups, are photopolymerized, optionally in the presence of two or more thermocurable compounds that react with each other and undergo thermal polymerization, thereby forming an article of manufacture in solid form.
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