Far-field voice installation structure and intelligent projection equipment

By designing a far-field voice installation structure in a far-field voice device and using buffers and seals for noise isolation, the problem of poor recognition and sensitivity of far-field wake-up is solved, and a higher recognition rate and sensitivity are achieved.

CN114615579BActive Publication Date: 2025-03-21FORMOVIE (CHONGQING) INNOVATIVE TECH CO LTD
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Patent Information

Application Number
CN202210190384.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-02-28
Publication Date
2025-03-21
Estimated Expiration
2042-02-28

AI Technical Summary

Technical Problem

The existing far-field voice equipment has shortcomings in multipath reflection, reverberation effect and background noise interference processing, resulting in poor far-field wake-up recognition and sensitivity.

Method used

A far-field voice installation structure is designed, including a housing, a first buffer member, a first seal, a microphone, a circuit board, a sealing buffer assembly and a pressing member. By pressing the buffer member between the circuit board and the housing, noise isolation is used by the sealing member and the sealing buffer member to improve airtightness and frequency response indexes.

Benefits of technology

It effectively reduces the sound noise floor, improves the far-field wake-up recognition rate and sensitivity, and enhances the airtightness and frequency response performance of the equipment.

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Abstract

The present invention relates to a far-field voice installation structure and an intelligent projection device. The far-field voice installation structure includes a shell, a first buffer, a first seal, a microphone, a circuit board, a sealing buffer assembly and a press-fitting piece. The press-fitting piece presses the sealing buffer assembly, the circuit board and the first buffer that are stacked in sequence on the back of the shell. The thickness of the first seal is greater than the thickness of the first buffer. A clearance hole is provided on the first buffer. The first seal is arranged in the clearance hole and the first seal is pressed between the back of the shell and the front of the circuit board. The shell, the first seal and the circuit board are respectively provided with voice holes. The microphone is installed on the back of the circuit board and the sound pickup part of the microphone faces the voice hole. The sealing buffer assembly is coated on the periphery of the microphone. The far-field wake-up sensitivity and recognition rate are improved by sealing and fixing the first buffer, the first seal, the sealing buffer assembly and the press-fitting piece together.
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