Test suite and test system

Abstract

The application discloses a test kit for testing a device under test, comprising: a socket structure for accommodating the device under test, wherein the device under test comprises an antenna and radiates a radio frequency signal; and a reflector comprising a lower surface, wherein the radio frequency signal emitted from the antenna of the device under test is reflected by the reflector, and the reflected radio frequency signal is received by the antenna of the device under test. The above structure of the application can facilitate the installation and removal of the device under test, thereby facilitating the test, and the structure is compact, occupies a smaller area, and can facilitate the mass test.

Description

Technical Field

[0001] The invention relates to the field of semiconductor testing technology, and in particular to a test kit and test system. Background Technology

[0002] As illustrated in this art, 5G wireless networks support operation in very high frequency bands, such as the millimeter wave (mmW) band (typically wavelengths from 1mm to 10mm or 10 to 300GHz). Transmitting in the millimeter wave band places high demands on test electronics to ensure proper operation of the transmitting and receiving circuitry. To check the electrical performance of the device under test (DUT), the DUT is stably electrically connected to the test equipment. Typically, test sockets are used as tools for electrically connecting the DUT and the test equipment.

[0003] Current test systems suffer from drawbacks including long test times and large physical size. There is a need for a reliable and cost-effective test system for high-volume testing of millimeter-wave devices. Summary of the Invention

[0004] In view of this, the present invention provides an improved test kit and test system for testing electronic devices or modules having or using millimeter-wave (mmW) antennas to solve the above-mentioned problems.

[0005] According to a first aspect of the present invention, a test kit is disclosed for testing a device under test, comprising:

[0006] A socket structure for accommodating the device under test (DUT), wherein the DUT includes an antenna and radiates radio frequency signals; and

[0007] A reflector, including a lower surface, wherein a radio frequency signal emitted from the antenna of the device under test is reflected by the reflector, and the reflected radio frequency signal is received by the antenna of the device under test.

[0008] According to a second aspect of the present invention, a testing system is disclosed, comprising:

[0009] The device under test includes an antenna for radiating radio frequency signals; and

[0010] The test kit includes a reflector, wherein a radio frequency signal emitted from the antenna of the device under test is reflected by the reflector, and the reflected radio frequency signal is received by the antenna of the device under test.

[0011] The test kit of the present invention includes: a socket structure for accommodating the device under test (DUT), wherein the DUT includes an antenna and radiates radio frequency (RF) signals; and a reflector including a lower surface, wherein RF signals emitted from the antenna of the DUT are reflected by the reflector, and the reflected RF signals are received by the antenna of the DUT. The above-described structure of the present invention facilitates the installation and removal of the DUT, thereby facilitating testing. Furthermore, its compact structure and small footprint allow for convenient large-scale testing. Attached Figure Description

[0012] Figure 1 This is a schematic cross-sectional view illustrating a test kit for testing a DUT according to an embodiment of the present invention;

[0013] Figure 2 This is a perspective view showing an exemplary guide plate according to an embodiment of the present invention;

[0014] Figure 3 This is a perspective view of an exemplary socket housing according to an embodiment of the present invention, the socket housing having a guide plate mounted thereon;

[0015] Figure 4 It is shown Figure 3 Exploded view of an exemplary socket housing, guide plate, and heat sink;

[0016] Figure 5 This is a bottom view of an SMD (surface-mounted device) connector according to an embodiment of the present invention and a schematic diagram of a recessed area on a guide plate for mounting the SMD connector.

[0017] Figure 6 A serrated surface of a reflector according to another embodiment of the present invention is shown;

[0018] Figure 7 This is a schematic cross-sectional view illustrating a test kit utilizing an insertion structure with a dual-nest configuration according to another embodiment of the present invention;

[0019] Figure 8 This is a schematic cross-sectional view illustrating a test kit according to yet another embodiment of the present invention. Detailed Implementation

[0020] In the following detailed description of embodiments of the invention, reference is made to the accompanying drawings, which form part of the invention, and which illustrate specific preferred embodiments in which the invention can be practiced. These embodiments have been described in sufficient detail to enable those skilled in the art to practice them, and it should be understood that other embodiments may be utilized, and mechanical, structural, and procedural changes may be made, without departing from the spirit and scope of the invention. Therefore, the following detailed description should not be construed as limiting, and the scope of the embodiments of the invention is defined only by the appended claims.

[0021] It will be understood that although the terms “first,” “second,” “third,” “primary,” “secondary,” etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or portion from another region, layer, or portion. Therefore, without departing from the teachings of the inventive concept, the first or primary element, component, region, layer, or portion discussed below may be referred to as a second or secondary element, component, region, layer, or portion.

[0022] Furthermore, for ease of description, spatial relative terms such as “below,” “under,” “under,” “above,” and “above” may be used herein to describe the relationship of an element or feature to it. Another element or feature is shown in the figure. In addition to the orientation described in the figure, the spatial relative terms are also intended to cover different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90 degrees or otherwise), and the spatial relative descriptive terms used herein may be interpreted accordingly. Additionally, it will be understood that when a layer is referred to as being “between” two layers, it may be the only layer between the two layers, or there may be one or more intermediate layers.

[0023] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the inventive concept. As used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It will also be understood that the terms “comprising” and / or “including” as used in this specification specify the presence of that feature, integer, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items and may be abbreviated to “ / ”.

[0024] What will be understood is that when an element or layer is referred to as being “on,” “connected to,” “coupled to,” or “adjacent to” another element or layer, it can be directly on, connected to, coupled to, or adjacent to that other element or layer, or there may be intermediate elements or layers. Conversely, when an element is referred to as being “directly on,” “directly connected to,” “directly coupled to,” or “immediately adjacent to” another element or layer, there are no intermediate elements or layers.

[0025] Note: (i) the same features will be represented by the same reference numerals throughout the figures and will not necessarily be described in detail in every figure in which they appear, and (ii) a series of figures may show different aspects of a single item, each of which is associated with various reference labels that may appear throughout the series or only in selected figures of the series.

[0026] Wireless microelectronic devices typically undergo a variety of tests to ensure adequate performance and verify their radio frequency (RF) functionality. Some tests are mandated by standards, while others are part of product development and validation. When an RF signal is transmitted from a transmitter to a receiver, it propagates along one or more paths in the radio channel. These paths have different angles of arrival, signal delays, polarization, and power, resulting in signals of varying duration and strength received. Additionally, noise and interference from other transmitters can also disrupt the radio connection.

[0027] This invention relates to a wireless test system for testing microelectronic devices or modules with antennas. Embodiments of the invention address improvements to test kits for holding and / or testing a device under test (DUT). For example, a method for testing a DUT may include setting the DUT to a simultaneous transmit and receive mode; receiving a low-frequency radio frequency (RF) signal from a test unit; up-converting the low-frequency RF signal to a high-frequency RF signal; transmitting the high-frequency RF signal using a first antenna of the DUT; receiving the high-frequency RF signal using a second antenna of the DUT; down-converting the received high-frequency RF signal to a received test RF signal; and providing the received test RF signal to the test unit.

[0028] DUT is a term commonly used to refer to any electronic device or module undergoing any testing. A DUT is typically inserted into a test socket, which in semiconductor testing connects to automatic test equipment (ATE). ATE is widely used in manufacturing to test various types of semiconductor devices, such as packaged or unpackaged integrated circuit (IC) devices, antenna-in modules (AIMs), printed circuit boards (PCBs), etc.

[0029] This invention is particularly suitable for radiation testing of RF microelectronic devices or DUTs with integrated millimeter-wave antenna structures. The integrated antenna structure can have multiple elements in an array design, which can be driven and / or sensed by integrated RF transmitter and / or receiver circuitry. The integrated antenna structure can operate or have a radiation pattern in, for example, the range of 20 GHz to 300 GHz (millimeter-wave frequencies). For example, the antenna structure can operate in frequency bands near 24 GHz, 60 GHz, 77 GHz, or 79 GHz, but is not limited thereto.

[0030] In a non-limiting example, the configuration depicted in the accompanying drawings can be applied to wireless testing of a DUT, which includes a transmitter, transmitting antenna, receiving antenna, receiver, and processor capable of generating electromagnetic waves in the radio or microwave domain.

[0031] Please refer to Figure 1 , Figure 1 This is a cross-sectional schematic diagram of a test kit for testing a DUT according to an embodiment of the present invention. Figure 1 As shown, test kit 1a includes a receptacle structure 10 and an insertion structure 20 detachable from the receptacle structure 10. According to an embodiment of the invention, the receptacle structure 10 may include a receptacle housing 100, which is attached to a load board 30, such as a printed circuit board or printed circuit board. The load board 30 may also be referred to as a test board. Although not explicitly depicted, it should be understood that the load board 30 typically includes a core (e.g., an FR4 copper-clad laminate core), multiple dielectric stacks, and traces on opposite surfaces of the core. Traces in different layers of the printed circuit board may be electrically connected to each other via plated vias or plated through-holes. Circuitry on the load board 30 may be electrically connected to a test unit (not shown) including a signal generator configured to generate test signals.

[0032] According to embodiments of the invention, the load board 30 can be combined with custom circuitry specific to testing a particular DUT. For example, the load board 30 can be a custom RF load board specifically modified for the radiation, electrical, and physical characteristics of a particular DUT. According to embodiments of the invention, the load board 30 can, for example, be electrically connected to RF instrument circuitry via RF cables and / or connectors (not shown). It is understood that the load board 30 can also be connected to a DC power supply, ground, digital inputs / outputs, and / or a computer, which are not shown for simplicity.

[0033] According to an embodiment of the present invention, the socket housing 100 may be made of a monolithic antistatic material, including but not limited to durable high-performance polyimide-based plastics, such as SP1+(DuPont) having a dielectric constant (Dk) of approximately 3.5. TM However, this is not the only possibility. According to embodiments of the invention, the socket housing 100 may include a plate-shaped base portion or base portion 101 integrated with the pin assembly PN (e.g., integrally manufactured or fixed together), thus making the pin assembly PN more accurately positioned and more secure. The pin assembly PN includes, but is not limited to, a pogo pin P1, a conductive pin P2, and a conductive pin P3. Conductive pins P2 and P3 can extend from the socket housing 100 and pass through corresponding through-holes formed in the base portion or base 101 for signal transmission. According to embodiments of the invention, the base portion or base 101 serves as an interface between the load board 30 and the DUT, and the pin assembly PN may include at least two different types and lengths of spring pins to suit different devices under test.

[0034] According to an embodiment of the invention, the socket housing 100 may include an annular peripheral structure 102 surrounding the base portion or base 101, thereby forming a cavity or chamber 110 defined by the inner sidewall of the annular peripheral structure 102 and the upper surface of the annular peripheral structure 102. According to an embodiment of the invention, the annular peripheral structure 102 is integrally formed with the base portion or base 101 to improve mechanical strength. According to an embodiment of the invention, the thickness (height) of the annular peripheral structure 102 is greater than the thickness (height) of the base portion or base 101. According to another embodiment of the invention, the socket housing 100 may directly contact the load plate 30. However, when the socket housing 100 overlaps with any high-frequency signal traces on the load plate 30, the socket housing 100 may be partially removed.

[0035] According to an embodiment of the invention, a floating guide plate 120 for guiding and adjusting the position and / or rotation angle of the DUT can be suitably installed within the cavity 110. The guide plate 120 can directly contact the socket housing 100. According to an embodiment of the invention, after the guide plate 120 is installed into the cavity 110, the upper surface 120S of the guide plate 120 can be slightly lower than the upper surface 102S of the annular peripheral structure 102. According to another embodiment of the invention, after the guide plate 120 is installed into the cavity 110, the upper surface 120S of the guide plate 120 can be coplanar with the upper surface 102S of the annular peripheral structure 102 of the socket housing 100.

[0036] Please also refer to Figures 2 to 4 . Figure 2 This is a perspective view showing an exemplary guide plate according to an embodiment of the present invention. Figure 3 This is a perspective view of an exemplary socket housing according to an embodiment of the present invention, the socket housing having a guide plate mounted thereon. Figure 4 It is shown Figure 3 An exploded view of an exemplary socket housing, an exemplary guide plate, and an exemplary heat sink. Figures 2 to 4 And a brief reference Figure 1 As shown, the guide plate 120 may include a mounting or assembling device for the DUT 130. Figure 1 A recessed structure 120r (e.g., a chip module with an antenna) is provided at the bottom of the guide plate 120 for mounting the surface mount device (SMD) connector of the DUT 130. Figure 1 and Figure 2 (Not explicitly shown in the image). Details of the SMD connector will be described later.

[0037] According to an embodiment of the invention, a first through-hole 122 and a second through-hole 123 may be provided at the bottom of the guide plate 120. According to an embodiment of the invention, for example, the through-hole 122 may be used to receive a connector 106 protruding from the base portion of the socket housing 100 or the base 101. According to an embodiment of the invention, for example, the connector 106 protruding from the base portion of the socket housing 100 or the base 101 may extend upward through the first through-hole 122. According to an embodiment of the invention, for example, the second through-hole 123 may be used to receive a heat sink 140 made of a high heat dissipation material. The heat sink 140 includes a plurality of through-holes 141 that allow spring pins P1 to pass through, thereby enabling the spring pins P1 to contact corresponding terminals on the DUT 130. Heat generated by the DUT 130 during testing can be dissipated to the load plate 30 through the spring pins P1 and the heat sink 140. The heat sink 140 improves the cooling capacity of high-power devices and stabilizes test results.

[0038] According to an embodiment of the invention, the guide plate 120 further includes two pairs of alignment ribs 124 and 125. For example, according to an embodiment of the invention, a pair of alignment ribs 124 may be disposed between the first through-hole 122 and the second through-hole 123. For example, according to an embodiment of the invention, a pair of alignment ribs 125 may be disposed adjacent to the heat sink 140. According to an embodiment of the invention, each alignment rib 124 may have an inclined end face 124S, and each alignment rib 125 may have an inclined end face 125S for guiding the DUT 130 when it is mounted onto the guide plate 120. The air space (or compartment) 126 between the alignment ribs 124, 125 and the DUT 130 can minimize the adverse effects on the dielectric material during testing. By removing unnecessary dielectric material from the guide plate 120, dielectric effects on the antenna radiation pattern are mitigated, and measurement stability can be improved.

[0039] According to embodiments of the invention, for example, the guide plate 120 can be fastened and secured to the socket housing 100 using screws 108, more specifically, by the peripheral head of each of four exemplary screws 108. According to embodiments of the invention, the screws 108 can be made of a non-conductive material such as engineering plastics, but are not limited thereto. According to embodiments of the invention, the socket housing 100 can be fastened or secured to the load plate 30 using screws 109, but are not limited thereto.

[0040] According to an embodiment of the present invention, the guide plate 120 may be made of an integral electrostatic-discharge (ESD) control material or an electrostatic dissipative material to prevent damage to the DUT 130 under high electrostatic voltage during testing. For example, the aforementioned ESD control material or electrostatic dissipative material may include, but is not limited to, plastics based on polyether ether ketone (PEEK), such as EKH-SS11 (Krefine) having a dielectric constant of approximately 5.3. An electrostatic dissipative material is defined as having a dielectric constant of 1x10⁻¹ as defined by the International Electrotechnical Commission (IEC) 61340-5-1. 5 Om to 1x10 11 Ohm's surface resistance (SR) material. Static dissipative materials are difficult to charge and have a low charge transfer rate, making them ideal for ESD-sensitive applications.

[0041] Please refer to Figure 5 , Figure 5This is a bottom view of the SMD connector C of the DUT 130 according to an embodiment of the present invention, and a schematic diagram of the recessed area 121 on the guide plate 120 for mounting the SMD connector C. Figure 5 As shown, two rows of signal pins PS can be provided on the bottom surface of the recessed area 121 on the guide plate 120. The signal pins PS are respectively connected to the RF terminals (or RF pins) CR located at the bottom of the SMD connector C. At the two opposite ends of the two rows of signal pins PS, multiple ground pins PG are arranged. The ground pins PG are respectively connected to the ground terminals (or ground pins) CG located at the bottom of the SMD connector C. The additional ground pins PG are used to improve signal integrity and alignment accuracy. According to one embodiment of the invention, each of the signal pins PS and ground pins PG can be a blunt-tipped pogo pin, which can prevent scratches on the coating of the device under test surface.

[0042] Return to reference Figure 1 The socket structure 10 may further include an annular socket base 150 for precision plunger alignment. According to an embodiment of the invention, the socket base 150 is mounted and secured to the upper surface 102S of the annular peripheral structure 102 of the socket housing 100. According to an embodiment of the invention, the socket base 150 includes a central or central through-hole 150p allowing the DUT 130 to pass through, and a lower portion of the insertion structure 20, the lower portion of which vacuum-clamps the DUT 130 and places the DUT 130 at a test position on the socket structure 10. The socket base 150 may include an inner (partial) 151 surrounding the upper surface 102S of the annular peripheral structure 102 of the socket housing 100, and an outer (partial) 152 surrounding the inner portion 151 and integrally formed with it. In embodiments of the invention, the thickness of the outer portion 152 is greater than the thickness of the inner portion 151. The socket base 150 may be made of an integral antistatic material, including but not limited to antistatic FR4 with a dielectric constant of approximately 4.37, but not limited to this.

[0043] like Figure 1As shown, the insertion structure 20 includes a nest 210. According to an embodiment of the invention, the nest 210 may be made of an ESD control material or an electrostatic dissipation material, including but not limited to PEEK, having a dielectric constant of approximately 3.3, but not limited thereto. According to an embodiment of the invention, the nest 210 has an upper side 210a and a lower side 210b. During testing, the lower side 210b of the nest 210 engages with and directly contacts the interior 151 of the socket base 150. According to an embodiment of the invention, a pressing member 220 may be attached to the upper side 210a of the nest 210. According to an embodiment of the invention, the pressing member 220 may be made of metal, but is not limited thereto. The pressing member 220 locks the nest 210 to the layout kit portion. According to an embodiment of the invention, the pressing member 220 may be attached to a robot arm or a robotic hand H.

[0044] According to an embodiment of the invention, reflector 230 may be coupled to the lower side 210b of nesting member 210. According to an embodiment of the invention, reflector 230 may be made of a metal such as brass or any suitable material capable of reflecting electromagnetic radiation such as RF signals emitted from DUT 130. Reflector 230 provides a reflective plane formed by the lower surface 230b, which prevents energy radiation into free space. According to an embodiment of the invention, the lower surface 230b may be a flat surface substantially parallel to the upper surface of DUT 130. According to another embodiment of the invention, such as... Figure 6 As shown, the lower surface 230b can be a serrated surface. Figure 6 In this process, the RF signal Tx transmitted from the antenna AT of DUT 130 is reflected by the sawtooth surface 230b of reflector 230, and the reflected RF signal Rx is received by the antenna AR of DUT. This measurement is performed by ATE.

[0045] According to an embodiment of the present invention, the reflector 230 may be integrally formed with the pressing member 220, but is not limited thereto. According to an embodiment of the present invention, the nesting member 210 may be sandwiched between the pressing member 220 and the reflector 230.

[0046] According to one embodiment of the invention, the nesting member 210 is coupled to at least one nozzle 240 for vacuum clamping and / or holding the DUT 130 in a guide plate 120 mounted in the socket housing 100. For illustrative purposes, in Figure 1Two nozzles 240 are shown. For example, according to an embodiment of the invention, the nozzles 240 may be made of ESD control materials or electrostatic dissipative materials, including but not limited to ESD420 with a dielectric constant of approximately 5.63, but not limited thereto. According to an embodiment of the invention, the nozzles 240 may be used to pick up and place the DUT 130 into the socket structure 10. According to an embodiment of the invention, during testing, the nozzles 240 may be used to press the DUT 130 into place, thereby facilitating the installation of the DUT 130 and improving work efficiency. According to one embodiment of the invention, the nozzles 240 may be used to provide coupling coefficient adjustments with different shapes and sizes.

[0047] According to an embodiment of the invention, the suction nozzle 240 may communicate with a connecting chamber or connecting cavity 210c between the nesting member 210 and the pressing member 220, the connecting chamber being further connected to the vacuum conduit 220c. According to an embodiment of the invention, for example, a vacuum seal 222, such as a rubber O-ring, may be provided around the vacuum conduit 220c, and a vacuum seal 212, such as a rubber O-ring, may be provided around the connecting cavity 210c. According to an embodiment of the invention, for example, the vacuum seals 212 and 222 may be made of a heat-resistant material.

[0048] During testing, a test enclosure TE is defined approximately between the lower surface 230b of reflector 230, the circumferential sidewall of the central through-hole 150p of socket base 150, and guide plate 120. The previously mentioned test methods for testing DUT 130 can be implemented within the test enclosure TE. The vertical distance between the lower surface 230b of reflector 230 and the antenna (not explicitly shown) of DUT 130 is defined as the reflection distance D, which can be adjusted to control received energy and maintain impedance matching. According to embodiments of the invention, for example, the reflection distance D can preferably be in the range of approximately 0.25λ and multiples of this length, where λ is the wavelength (mm) of the RF signal with the lowest frequency in the operating frequency band. For example, for an RF signal with a frequency of 24.5 GHz, λ is 12.4 mm, so the reflection distance D is between 3.1 mm and 9.3 mm.

[0049] Using this invention is advantageous because it can significantly improve the antenna coupling factor while maintaining antenna s11. The antenna coupling factor can be the same polarization or different polarizations. The operating frequency band can be single-band or multi-band.

[0050] Figure 7 This is a schematic cross-sectional view illustrating a test kit 1b utilizing an insertion structure with a double-nest configuration according to another embodiment of the invention, wherein the same regions, elements, or layers are represented by the same numerical designations. Figure 7 As shown, the socket structure 10 is omitted. Figure 1 The socket base 150 is shown. In contrast, the insertion structure 20 includes a base portion 205 that can be fastened or secured to a nesting member 210 coupled to the pressing member 220.

[0051] According to an embodiment of the invention, the nesting member 210 can be made of a metal such as brass, which is consistent with... Figure 1 The illustrated embodiment differs. The metal nest 210 can block electromagnetic waves escaping from the nozzle 240. According to an embodiment of the invention, the nest 210 may have drill holes 210d communicating with the nozzle 240 respectively. To reduce electromagnetic wave leakage, the diameter of each drill hole 210d is smaller than the diameter of the nozzle 240. The diameter of each drill hole 210d is designed not to support any propagation modes therein, thereby improving the coupling between antennas on the DUT 130.

[0052] According to an embodiment of the invention, the base 205 may be made of an integral antistatic material, including but not limited to antistatic FR4 with a dielectric constant of about 4.37, but not limited thereto. A nesting member 250, which may be made of, for example, PEEK, may be disposed between the reflector 230 and the nesting member 210. According to an embodiment of the invention, the nesting member 250 may be fixed to the nesting member 210 with screws, but is not limited thereto.

[0053] According to an embodiment of the invention, the nesting member 250 may be integrally formed with the nozzle 240 for vacuum clamping or holding the DUT 130. The loss tangent of the material of the nozzle 240 is as small as possible to maximize the coupling between the antennas of the DUT 130. According to an embodiment of the invention, the lower surface 230b of the reflector 230 may be flush with the lower surface 205b of the base 205. The test enclosure TE is generally defined between the lower surface 230b of the reflector 230, the peripheral sidewalls of the guide plate 120, and the upper surface of the DUT 130. The aforementioned test method for testing the DUT 130 can be performed within the test enclosure TE.

[0054] Figure 8 This is a schematic cross-sectional view illustrating a test kit 1c according to yet another embodiment of the invention, wherein the same regions, elements, or layers are indicated by the same reference numerals. For example... Figure 8As shown, the vacuum system 500 can be integrated with the load plate 30. According to an embodiment of the invention, the vacuum system 500 may include a plurality of vacuum tubes 520 passing through the load plate 30 for vacuum clamping. According to an embodiment of the invention, each vacuum tube 520 may include a suction nozzle 540 that directly contacts the DUT 130 during testing. According to an embodiment of the invention, the suction nozzle 540 may be made of ESD control material or electrostatic dissipative material, including but not limited to ESD 420 with a dielectric constant of approximately 5.63, but not limited thereto. During testing, a test enclosure TE is defined approximately between the lower surface 230b of the reflector 230, the peripheral sidewall of the central through-hole 150p of the socket base 150, and the guide plate 120. The aforementioned test method for testing, the DUT 130, can be implemented within the test enclosure TE. The reflection distance D between the lower surface 230b of the reflector 230 and the antenna 130t of the DUT 130 can be adjusted to control the received energy and maintain impedance matching. According to embodiments of the invention, for example, the reflection distance D can preferably be in the range of approximately 0.25λ to approximately 0.75λ, where λ is the wavelength (mm) of the RF signal with the lowest frequency in the operating frequency band. For example, for an RF signal with a frequency of 24.5 GHz, λ is 12.4 mm, so the reflection distance D is between 3.1 mm and 9.3 mm.

[0055] Those skilled in the art will readily observe that numerous modifications and alterations can be made to the apparatus and method while maintaining the teachings of this invention. Therefore, the foregoing disclosure should be interpreted as being limited only by the scope and limits of the appended claims.

Claims

1. A test kit for testing a device under test, characterized by, include: A socket structure for accommodating the device under test (DUT), wherein the DUT includes an antenna and radiates radio frequency signals; and A reflector, including a lower surface, wherein a radio frequency signal emitted from the antenna of the device under test is reflected by the reflector and the reflected radio frequency signal is received by the antenna of the device under test, wherein a test enclosure is provided between the lower surface of the reflector and the device under test; The socket structure includes a socket housing, a guide plate installed inside the socket housing, and a socket base fixed to the socket housing. The test kit also includes an insertion structure detachable from the socket structure, wherein the insertion structure includes a nesting member, a pressing member connected to the upper side of the nesting member, and the reflector connected to the lower side of the nesting member. The guide plate has a recessed area at the bottom for mounting the surface mount device connector of the device under test. Two rows of signal pins PS are provided on the bottom surface of the recessed area on the guide plate to connect to the radio frequency terminals arranged at the bottom of the surface mount device connector. The guide plate includes a first through hole and a second through hole at its bottom. The first through hole is located between the recessed area and the second through hole. The first through hole accommodates a connector protruding from the base portion of the socket housing, and the second through hole accommodates a heat sink.

2. The test kit as described in claim 1, characterized in that, The socket housing is made of a single piece of antistatic material, the guide plate is made of a single piece of electrostatic discharge control material or electrostatic dissipation material, and the nesting part is made of electrostatic discharge control material or electrostatic dissipation material.

3. The test kit as described in claim 1, characterized in that, The socket housing includes a base portion integrated with the pin assembly.

4. The test kit as described in claim 3, characterized in that, The base portion serves as the interface between the load plate and the device under test, and the pin assembly includes at least two different types and lengths of spring pins.

5. The test kit as described in claim 3, characterized in that, The socket housing includes an annular peripheral structure surrounding the base portion, thereby forming a cavity defined by the inner sidewall of the annular peripheral structure and the upper surface of the base portion.

6. The test kit as described in claim 5, characterized in that, The annular peripheral structure is integrally constructed with the base portion.

7. The test kit as described in claim 5, characterized in that, The thickness of the annular peripheral structure is greater than the thickness of the base portion.

8. The test kit as claimed in claim 1, characterized in that, The guide plate is in direct contact with the socket housing.

9. The test kit as claimed in claim 1, characterized in that, The guide plate includes recessed structures for mounting or assembling the device under test.

10. The test kit as claimed in claim 1, characterized in that, At the two opposite ends of the two rows of signal pins PS, there are multiple ground pins PG, which are respectively connected to the ground terminal located at the bottom of the surface mount device connector.

11. The test kit as claimed in claim 10, characterized in that, The heat sink includes a through-hole that allows the spring pins of the pin assembly to pass through.

12. The test kit as claimed in claim 1, characterized in that, The guide plate also includes an alignment rib having an inclined end face.

13. The test kit as claimed in claim 1, characterized in that, The socket base includes a central through-hole that allows the device under test (DUT) to pass through and a lower part of an insertion structure that vacuum-clamps the DUT and places it in the test position.

14. The test kit as claimed in claim 5, characterized in that, The socket base includes: an interior of the upper surface of an annular peripheral structure surrounding the socket housing; and an exterior surrounding the interior and integrally formed therewith, wherein the thickness of the exterior is greater than the thickness of the interior.

15. The test kit as claimed in claim 14, characterized in that, The lower side of the nesting piece engages and makes direct contact with the interior of the socket base.

16. The test kit as claimed in claim 1, characterized in that, The pressing component and the reflector are made of metal.

17. The test kit as claimed in claim 1, characterized in that, The lower surface of the reflector is a flat surface that is substantially parallel to the upper surface of the device under test, or the lower surface of the reflector is a serrated surface.

18. The test kit as claimed in claim 1, characterized in that, The reflector is integrally constructed with the pressing member.

19. The test kit as claimed in claim 1, characterized in that, The nesting component is connected to at least one nozzle for vacuum clamping or holding the device under test.

20. The test kit as claimed in claim 19, characterized in that, The at least one suction nozzle communicates with the connecting chamber disposed between the nesting member and the pressing member.

21. The test kit as claimed in claim 19, characterized in that, At least one nozzle is made of electrostatic discharge control material or electrostatic dissipation material.

22. A testing system, characterized in that, include: The device under test includes an antenna used to radiate radio frequency signals; as well as The test kit as described in any one of claims 1 to 21.

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