Sensor including multiple circuit substrates

By forming a convex rib positioning pin and a rigid flexible substrate of 180 degrees folded on the base member of the light sensor, the problem of increasing the thickness of the circuit substrate installation space is solved, and the compact configuration and optical performance of the light sensor are achieved.

CN115280454BActive Publication Date: 2025-02-25OMRON CORP
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Patent Information

Application Number
CN202180018926.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2020-04-10
Filing Date
2021-03-08
Publication Date
2025-02-25
Estimated Expiration
2041-03-08

AI Technical Summary

Technical Problem

In the existing optical sensors, the thickness of the installation space of the circuit substrate increases, which limits the improvement of the thinness and optical performance of the frame.

Method used

By forming a positioning pin with convex ribs on the base member, the second rigid substrate is precisely positioned, and the plurality of substrates are compactly arranged by folding the rigid flexible substrate of 180 degrees, reducing the installation space of the substrate.

Benefits of technology

The compact configuration of multiple circuit substrates to the limit is achieved, reducing the size of the frame, improving optical performance and circuit compactness.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention provides a sensor capable of compactly accommodating a plurality of circuit substrates. In the sensor including a plurality of circuit substrates according to the present invention, the base member of the sensor includes a first columnar protrusion, a second protrusion, and a third protrusion protruding from a first setting surface. A second setting surface is formed at the front end portions of the first protrusion, the second protrusion, and the third protrusion. The first protrusion includes a fourth pin protruding from the second setting surface and inserted into the second rigid substrate, and the second protrusion includes a fifth pin protruding from the second setting surface and inserted into the second rigid substrate. On the circumferential surface of the fourth pin, three ribs are formed that are arranged in a manner that the positions observed from the center of the fourth pin are less than 180 degrees. On the circumferential surface of the fifth pin, two ribs are formed that protrude along a fourth straight line orthogonal to a third straight line connecting the fourth pin and the fifth pin.
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Description

Technical Field

[0001] The present invention relates to a sensor including a plurality of circuit substrates. Background Art

[0002] In the housing of a sensor such as an optical sensor, in addition to optical components such as lenses, a circuit board on which an electronic circuit that realizes the sensor function is installed is also housed. If a high-performance sensor capable of detecting various workpieces is constructed, the size of the circuit board will become larger in order to perform complex processing. Sometimes, instead of increasing the size of the housing to accommodate the circuit board, the circuit board is divided into a size smaller than that of the housing and is installed in the housing.

[0003] However, if multiple circuit substrates are arranged in parallel, the thickness of the installation space of the circuit substrate will increase. If the size of the frame is the same, the thinner the installation space of the circuit substrate, the larger the lens can be installed, and the better the optical performance. In order to achieve miniaturization or performance improvement of the sensor, it is urgent to make the installation space of the circuit substrate as thin as possible.

[0004] Patent document 1 discloses a photoelectric sensor in which two circuit substrates are arranged orthogonally rather than in parallel. The first circuit substrate, i.e., the wiring substrate, is arranged along the cover body constituting the right side surface. The second circuit substrate, i.e., the input / output mounting substrate, is arranged along the upper surface perpendicular to the cover body.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2007-73417 Summary of the invention

[0008] Problems to be solved by the invention

[0009] However, since the upper surface is narrower than the right side surface, the size of the circuit board that can be arranged is limited. Therefore, an object of the present invention is to provide a sensor that can compactly accommodate a plurality of circuit boards.

[0010] Technical means of solving problems

[0011] A sensor of one embodiment of the present disclosure includes: a base member, which is formed with a first setting surface and a second setting surface parallel to the first setting surface; a first rigid substrate, which is fixed to the first setting surface; and a second rigid substrate, which is fixed to the second setting surface. Electronic components for sensing are installed across the first rigid substrate and the second rigid substrate. The base member includes a first protrusion, a second protrusion and a third protrusion in a columnar shape protruding from the first setting surface. A second setting surface is formed at the front end of the first protrusion, the second protrusion and the third protrusion. The first protrusion includes a fourth pin protruding from the second setting surface and inserted into the second rigid substrate, and the second protrusion includes a fifth pin protruding from the second setting surface and inserted into the second rigid substrate. Three ribs are formed on the circumference of the fourth pin, and the three ribs are arranged in a manner that the angles are less than 180 degrees when viewed from the fourth pin. Two ribs are formed on the circumference of the fifth pin, and the two ribs protrude along a fourth straight line orthogonal to the third straight line connecting the fourth pin and the fifth pin.

[0012] According to this embodiment, the second rigid substrate can be precisely positioned by forming a positioning pin with ribs on the circumferential surface. If described in detail, the second setting surface is defined by at least three supporting portions. On the second setting surface, the second rigid substrate is formed with a fourth pin with three ribs with a crossing angle less than 180 degrees, and all movements are restricted except for the rotational movement of the fourth pin as an axis. Furthermore, the second rigid substrate is also restricted in its rotational movement with the fourth pin as an axis by a fifth pin having two ribs protruding in the tangential direction of rotation. Since the first rigid substrate and the second rigid substrate can be precisely positioned via the base member in a manner that the substrates do not interfere with each other, multiple substrates can be arranged close to the limit. Since the installation space of the substrate can be minimized, the frame can be miniaturized. Thereby, the optical parts can be enlarged and the optical performance can be improved.

[0013] In the embodiment, the base member may include a first fixing portion, a second fixing portion and a third fixing portion for fixing the first rigid substrate, the first fixing portion including a first pin protruding from the first setting surface and inserted into the first rigid substrate, the second fixing portion including a second pin protruding from the first setting surface and inserted into the first rigid substrate, and the third fixing portion including a third pin protruding from the first setting surface and inserted into the first rigid substrate, three convex ribs are formed on the circumferential surface of the first pin, and the three convex ribs are arranged in a manner that the angles are less than 180 degrees when observed from the center of the first pin, and two convex ribs are formed on the circumferential surface of the second pin, and the two convex ribs protrude along a second straight line orthogonal to the first straight line connecting the first pin and the second pin.

[0014] According to this embodiment, the first rigid substrate can be positioned more precisely by the positioning pins having ribs formed on the peripheral surface thereof, and a plurality of substrates can be arranged close to each other as much as possible.

[0015] In the above embodiment, the first rigid substrate and the second rigid substrate may be part of the same rigid flexible substrate, the rigid flexible substrate may be folded 180 degrees so that the second rigid substrate faces the first rigid substrate, and the first rigid substrate and the second rigid substrate may be fixed to the base member.

[0016] According to this embodiment, the first rigid substrate and the second rigid substrate can be connected by a flexible substrate that forms an integral structure with the first rigid substrate and the second rigid substrate. Compared with the case where connectors are provided on the first rigid substrate and the second rigid substrate respectively and the connectors are connected by an independent flexible substrate, the area of ​​the first rigid substrate and the second rigid substrate can be reduced accordingly due to the absence of the connector.

[0017] In the embodiment, the light projecting unit and / or the light receiving unit may also be included, and the base component fixes the light projecting unit and / or the light receiving unit.

[0018] According to this embodiment, the resin bracket for fixing the light projecting unit and / or the light receiving unit can be used as a base member for positioning the first rigid substrate and the second rigid substrate. The first rigid substrate and the second rigid substrate can be precisely positioned without increasing the number of parts.

[0019] The embodiment may also include a light receiving part, wherein the second rigid substrate is located farther away from the light receiving part than the first rigid substrate, a signal circuit for processing the signal from the light receiving part is installed on the first rigid substrate, and a power supply circuit for supplying power to the electronic components is installed on the second rigid substrate.

[0020] According to this embodiment, the power circuit through which large current flows and the delicate signal circuit are arranged separately. The second rigid substrate with large heat generation is arranged at the outer periphery of the frame body far from the light receiving part and easy to dissipate heat, so the circuit substrate can be cooled efficiently.

[0021] In the above-described embodiment, a recessed portion recessed from the second installation surface may be formed around the fourth pin and the fifth pin.

[0022] According to this embodiment, when the pin is inserted into the second rigid substrate for positioning while the rib is compressed, the resin scraps of the rib that are scraped off are collected in the pocket formed in the concave portion around the pin rather than between the second setting surface and the second rigid substrate. The second rigid substrate can be positioned on the second setting surface with high precision.

[0023] The sensor of one embodiment of the present disclosure includes: a rigid flexible substrate, including a hard first rigid substrate and a second rigid substrate, and folded 180 degrees in a manner that the second rigid substrate faces the first rigid substrate; and a base member, including a flat bottom wall and a first protrusion, a second protrusion, and a third protrusion in a columnar shape protruding from the bottom wall. The first rigid substrate is fixed to a first setting surface formed on the bottom wall, and the second rigid substrate is fixed to a second setting surface formed across the front ends of the first protrusion, the second protrusion, and the third protrusion.

[0024] According to this embodiment, the rigid flexible substrate is fixed to the base member in a compact state folded 180 degrees, so that a plurality of circuit substrates can be compactly housed.

[0025] Effects of the Invention

[0026] According to the present invention, a sensor capable of compactly accommodating a plurality of circuit boards can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a perspective view showing an example of a sensor according to an embodiment of the present invention.

[0028] Figure 2 It was demolished Figure 1 The cover shown is a three-dimensional view of the internal structure of the sensor.

[0029] Figure 3 It is along Figure 2 Cross-sectional view along line III-III in FIG.

[0030] Figure 4 Take it out from the frame Figure 2 A three-dimensional view of the base component shown.

[0031] Figure 5 Yes means Figure 4 The front view of the light emitting part and the light receiving part is shown.

[0032] Figure 6 This is a perspective view showing a base member with the rigid flexible substrate and the like removed.

[0033] Figure 7 It focuses on Figure 6 A three-dimensional diagram showing the first setting surface shown.

[0034] Figure 8 It focuses on Figure 6 A stereoscopic view showing the second setting surface shown.

[0035] Fig. 9 Yes Figure 7 The recess of the first pin is shown in an enlarged perspective view.

[0036] [Explanation of Symbols]

[0037] 1: Sensor

[0038] 2: Frame

[0039] 3: Rigid flexible substrate

[0040] 4: Base components

[0041] 11: Light projection department

[0042] 12: Light receiving part

[0043] 13: Signal circuit

[0044] 14: Power circuit

[0045] 15: Operation Department

[0046] 16: Cables

[0047] 17: Grounding components

[0048] 20: Shell body

[0049] 21: Cover

[0050] 22: Bottom wall

[0051] 23: Peripheral wall

[0052] 24 detection surfaces

[0053] 31: First rigid substrate

[0054] 32: Second rigid substrate

[0055] 31A, 32A: First side

[0056] 31B, 32B: Second side

[0057] 33: Flexible substrate

[0058] 39: Electronic parts

[0059] 40: Bottom wall

[0060] 41: First fixed part

[0061] 42: Second fixing part

[0062] 43: Third fixed part

[0063] 44: First boss (an example of a first protrusion)

[0064] 45: Second boss (an example of a second protruding portion)

[0065] 46: Third boss (an example of a third protruding portion)

[0066] L1: First straight line

[0067] L2: Second straight line

[0068] L3: The third straight line

[0069] L4: The fourth straight line

[0070] R1~R10: ribs

[0071] S1: First setting surface

[0072] S2: Second setting surface DETAILED DESCRIPTION

[0073] The preferred embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings, the parts with the same reference numerals have the same or similar structures. Figure 1 It is a perspective view showing an example of the sensor 1 according to one embodiment of the present invention. Figure 2 It was demolished Figure 1 The cover 21 shown is a perspective view of the internal structure of the sensor 1.

[0074] In the illustrated example, a photoelectric sensor including at least one of a light projecting unit that emits light and a light receiving unit that receives light is disclosed as a sensor 1. When the projected light is blocked or reflected by a workpiece, the amount of light reaching the light receiving unit changes. The photoelectric sensor can detect this change and convert it into an electrical signal, which is then output to an external device.

[0075] However, the sensor 1 is not limited to a photoelectric sensor. The sensor 1 may also be a displacement sensor that detects the physical change of an object using an optical element and calculates the change as a distance to measure the distance from the sensor 1 to the object. It may also be an image sensor that calculates the area, center of gravity, length, position, etc. of the object by performing image processing on the image provided by a camera and outputs data or a determination result. It may also be a barcode reader that reads a barcode or a two-dimensional code. The sensor 1 is not limited to an optical sensor such as a photoelectric sensor, a displacement sensor, an image sensor, or a barcode reader, and may also be other types of sensors.

[0076] In the example shown in the figure, the sensor 1 is configured as a diffuse reflection type photoelectric sensor, and has a light projecting unit 11, a light receiving unit 12, a signal processing unit, a control unit, an output unit, a power supply unit, etc. for sensing built in, and is connected to an external power supply and a control device via a cable 16. In addition, the sensor 1 may be configured as a transmission type or a regressive reflection type photoelectric sensor, and the light projecting unit 11 and the light receiving unit 12 may be accommodated in respective housings 2. It may also be configured as a power supply built-in type photoelectric sensor in which an external power supply for supplying power to the power supply unit is built in the housing 2.

[0077] The frame 2 is formed of a metal material such as stainless steel or die-cast zinc, in addition to the detection surface 24 of the light-emitting section 11 and the light-receiving section 12 and the operation section 15 for the user to input the operation to the sensor 1. However, the material of the frame 2 is not limited to the metal material. For example, the frame 2 can also be formed of a resin material such as polybutylene terephthalate resin or acrylonitrile-butadiene-styrene (ABS) resin. The detection surface 24 is covered by a cover lens formed of a light-transmitting material such as methacrylic resin or glass. The operation section 15 is provided with an operation button or a display panel.

[0078] The frame 2 includes a case body 20 formed in a substantially rectangular cup shape and a cover 21 covering the opening of the case body 20. The case body 20 includes a bottom wall 22 and a peripheral wall 23 standing from the bottom wall 22 and extending toward the cover 21. In the frame 2, the bottom wall 22 and the cover 21 are located on opposite sides.

[0079] Figure 3 It is along Figure 2 sectional view along line III-III in . A plurality of rigid substrates 31, 32, ... arranged in parallel are housed in the frame 2. In the illustrated example, two rigid substrates 31, 32 arranged in parallel are housed in the frame 2. Although not illustrated, three or more rigid substrates arranged in parallel may be housed in the frame 2. The second rigid substrate 32 is arranged along the cover 21 of the frame 2. The first rigid substrate 31 is arranged in parallel with the second rigid substrate 32.

[0080] The first rigid substrate 31 is formed into a hard flat plate having a first surface 31A and a second surface 31B opposite to the first surface 31A. Similarly, the second rigid substrate 32 is formed into a hard flat plate having a first surface 32A and a second surface 32B opposite to the first surface 32A. The adjacent rigid substrates 31 and 32 are arranged so that the first surfaces 31A and 32A face each other.

[0081] The first rigid substrate 31 has electronic components 39 mounted on both surfaces 31A and 31B thereof. Similarly, the second rigid substrate 32 has electronic components 39 mounted on both surfaces 32A and 32B thereof. In addition, the electronic components 39 may be mounted on only one of the first surface 31A and the second surface 31B, or the electronic components 39 may be mounted on only one of the first surface 32A and the second surface 32B.

[0082] The electronic component 39 constitutes, for example, the aforementioned signal processing unit or power supply unit. To be specific, a signal circuit 13 for processing the signal from the light receiving unit is mounted on the first rigid substrate 31, constituting the signal processing unit. In addition to the signal circuit 13, a power supply circuit 14 for supplying power received from an external power supply to the electronic circuit is mounted on the second rigid substrate 32, constituting the power supply unit.

[0083] In the example shown in the figure, the size of the first rigid substrate 31 is smaller than that of the second rigid substrate 32. In the portion of the second rigid substrate 32 that is not facing the first rigid substrate 31, a grounding member 17 ( Figure 2 As shown in FIG. 1 , the grounding member 17 of the second rigid substrate 32 through which a large current flows can be arranged so as not to interfere with the first rigid substrate 31. Since there is no need to extend the wiring in a manner bypassing the first rigid substrate 31 to connect to the grounding member 17, the installation space of the grounding member 17 can be made compact.

[0084] In the example shown in the figure, the first rigid substrate 31 and the second rigid substrate 32 are part of the same rigid flexible substrate 3. The rigid flexible substrate 3 further includes a flexible substrate 33 that connects the first rigid substrate 31 and the second rigid substrate 32. The rigid flexible substrate 3 is folded 180 degrees with the flexible substrate 33 as a bent portion so that the first rigid substrate 31 and the second rigid substrate 32 face each other.

[0085] The rigid flexible substrate 3 has a first surface (31A, 32A) and a second surface (31B, 32B) opposite to the first surface (31A, 32A). The first surfaces 31A, 32A of the first rigid substrate 31 and the second rigid substrate 32 are formed by dividing on the first surface (31A, 32A) of the rigid flexible substrate 3. Similarly, the second surfaces 31B, 32B of the first rigid substrate 31 and the second rigid substrate 32 are formed by dividing on the second surface (31B, 32B) of the rigid flexible substrate 3.

[0086] At least one of the light projecting unit 11 and the light receiving unit 12 is accommodated in the space between the bottom wall 22 and the first rigid substrate 31. The second rigid substrate 32 is located farther from the light receiving unit 12 than the first rigid substrate 31. If the size of the frame 2 is the same, the thinner the installation space of the first rigid substrate 31 and the second rigid substrate 32, the larger the lens can be mounted, thereby improving the optical performance of the light projecting unit 11 and / or the light receiving unit 12. The light projecting unit 11 and / or the light receiving unit 12 are fixed to the base member 4 formed of a resin material or the like.

[0087] Figure 4 Take it out from frame 2 Figure 2 The base member 4 is shown in the perspective view. Figure 4 As shown, the light projecting unit 11 and / or the light receiving unit 12, the first rigid substrate 31, and the second rigid substrate 32 are installed on the base member 4. The base member 4 includes a first setting surface S1 ( Figure 7 The bottom wall 40 (shown in the figure) and a plurality of (at least three, four in the example shown) bosses 44, 45, 46 protruding from the first setting surface S1. The second rigid substrate 32 is fixed to the second setting surface S2 formed at the front end of the boss. The bosses 44, 45, 46 are examples of protrusions.

[0088] The shape of the bosses 44, 45, 46 may be cylindrical, prism-shaped, substantially truncated cone, or substantially truncated pyramid. The protrusion is not limited to a boss formed in a cylindrical or substantially truncated cone shape, and the front end of the side wall standing upright from the bottom wall 40 may be formed as the protrusion, or the side wall may be formed in a stepped shape and the step portion may be formed as the protrusion.

[0089] Figure 5 Yes means Figure 4 The front view of the light projecting part 11 and the light receiving part 12 is shown. Figure 5 As shown, the bottom wall 40 of the base member 4 is formed in a flat plate shape extending along the light projecting unit 11 and / or the light receiving unit 12. The bottom wall 40 has a first surface 40A facing the light projecting unit 11 and / or the light receiving unit 12, and a second surface 40B on the opposite side of the first surface 40A. The second surface 40B is formed as a first setting surface S1 for fixing the first rigid substrate 31.

[0090] Figure 6 4 is a perspective view showing the base member 4 with the rigid flexible substrate 3 etc. removed. Figure 6 As shown, the second installation surface S2 formed across the front end portions of the plurality of bosses 44 , 45 , and 46 is formed parallel to the second surface 40B of the bottom wall 40 and the first installation surface S1 extending therefrom.

[0091] Figure 7 It focuses on Figure 6A stereoscopic view showing the first setting surface S1 shown in FIG. A plurality of fixing portions for fixing the first rigid substrate 31 are provided on the second surface 40B of the bottom wall 40 constituting the first setting surface S1. In the example shown in the figure, three fixing portions are provided: a first fixing portion 41, a second fixing portion 42, and a third fixing portion 43. The first fixing portion 41 includes a first pin P1 protruding from the first setting surface S1 and inserted into the first rigid substrate 31. Similarly, the second fixing portion 42 includes a second pin P2 protruding from the first setting surface S1 and inserted into the first rigid substrate 31. The third fixing portion 43 includes a third pin P3 protruding from the first setting surface S1 and inserted into the first rigid substrate 31.

[0092] The first pin P1 has three ribs (first rib R1, second rib R2, and third rib R3) protruding in the radial direction of the first pin P1 and extending in the axial direction. The three ribs R1, R2, and R3 are arranged so as to form an angle of less than 180 degrees when viewed from the center of the first pin P1.

[0093] In the example shown in the figure, three ribs R1, R2, and R3 are formed at approximately equal intervals in the circumferential direction of the first pin P1, and are configured so that when viewed from the center of the first pin P1, the first rib R1 forms an angle of 120 degrees with the second rib R2, the second rib R2 forms an angle of 120 degrees with the third rib R3, and the third rib R3 forms an angle of 120 degrees with the first rib R1.

[0094] The positional relationship of the three ribs may not necessarily be equidistant. When the angle formed by the first rib R1 and the second rib R2 is set as the first angle, the angle formed by the second rib R2 and the third rib R3 is set as the second angle, and the angle formed by the third rib R3 and the first rib R1 is set as the third angle, for example, the first angle may be slightly less than 180 degrees, and the total angle of the second angle and the third angle may be slightly greater than 180 degrees. Each angle is preferably greater than 90 degrees.

[0095] Two ribs (fourth rib R4 and fifth rib R5) are formed on the circumferential surface of the second pin P2, which protrude in the radial direction of the second pin P2 and extend in the axial direction. The fourth rib R4 protrudes along the second straight line L2 that is orthogonal to the first straight line L1 connecting the first pin P1 and the second pin P2. The fifth rib R5 protrudes along the second straight line L2 toward the opposite side of the fourth rib R4. No ribs are formed on the circumferential surface of the third pin P3. When the number of fixing portions is four or more, the number of third pins P3 (third fixing portion 43) without ribs is increased.

[0096] Figure 8 It focuses on Figure 6The base member 4 includes: a first boss 44 including a fourth pin P4, a second boss 45 including a fifth pin P5, and at least one third boss 46. In the example shown in the figure, the base member 4 includes two third bosses 46. As mentioned above, at the front end of each boss 44, 45, 46, a second setting surface S2 for fixing the second rigid substrate 32 is formed. The fourth pin P4 of the first boss 44 protrudes from the second setting surface S2 and is inserted into the second rigid substrate 32. Similarly, the fifth pin P5 of the second boss 45 protrudes from the second setting surface S2 and is inserted into the second rigid substrate 32.

[0097] On the circumferential surface of the fourth pin P4, similarly to the first pin P1, three ribs (sixth rib R6, seventh rib R7, and eighth rib R8) are formed, which protrude in the radial direction of the fourth pin P4 and extend in the axial direction. In detail, the three ribs R6, R7, and R8 are arranged in such a way that they form an angle of less than 180 degrees when viewed from the center of the fourth pin P4. In the example shown in the figure, the three ribs R6, R7, and R8 are formed at approximately equal intervals in the circumferential direction of the fourth pin P4, and are arranged such that, when viewed from the center of the fourth pin P4, the sixth rib R6 forms an angle of 120 degrees with the seventh rib R7, the seventh rib R7 forms an angle of 120 degrees with the eighth rib R8, and the eighth rib R8 forms an angle of 120 degrees with the sixth rib R6. The positional relationship of the three ribs may not necessarily be equal intervals.

[0098] On the circumferential surface of the fifth pin P5, similarly to the second pin P2, two ribs (ninth rib R9 and tenth rib R10) are formed which protrude in the radial direction of the fifth pin P5 and extend in the axial direction. Specifically, the ninth rib R9 protrudes along the fourth straight line L4 which is orthogonal to the third straight line L3 connecting the fourth pin P4 and the fifth pin P5. The tenth rib R10 protrudes along the fourth straight line L4 to the opposite side of the ninth rib R9. A screw hole is formed on the third boss 46 instead of a pin.

[0099] As long as the pins P1, P2, and P3 are heated and pressurized while the second surface 31B of the first rigid substrate 31 abuts against the first setting surface S1, the first rigid substrate 31 can be fixed to the first setting surface S1 by thermal caulking. As long as the second rigid substrate 32 is screwed to the third boss 46 while the first surface 32A of the second rigid substrate 32 abuts against the second setting surface S2, and the pins P4 and P5 are thermally caulked, the second rigid substrate 32 can be fixed to the second setting surface S2.

[0100] Fig. 9 Yes Figure 7 The concave portion 47 of the first pin P1 is shown in an enlarged perspective view. Fig. 9As shown in FIG. 1 , a concave portion 47 is formed around the first pin P1 and adjacent to the ribs R1, R2, and R3 and is recessed relative to the first installation surface S1. Similarly, a concave portion 47 is formed around the second pin P2 and adjacent to the ribs R4 and R5 and is recessed relative to the first installation surface S1. A concave portion 47 is formed around the fourth pin P4 and the fifth pin P5 and is recessed relative to the second installation surface S2. The concave portion 47 only needs to be adjacent to the ribs R1, R2, and R3 to the extent that the resin scraps scraped off the ribs can be received.

[0101] According to the sensor 1 of this embodiment configured as described above, the second rigid substrate 32 can be precisely positioned by the positioning pins P4 and P5 having ribs R6, R7, R8, R9, and R10 formed on the circumferential surface. Since the first rigid substrate 31 and the second rigid substrate 32 can be precisely positioned via the base member 4 in a manner that the substrates do not interfere with each other, a plurality of substrates can be arranged close to each other. Since the installation space of the substrate can be minimized, the frame can be miniaturized. Thus, the optical parts can be enlarged to improve the optical performance.

[0102] If the positioning pins P4 and P5 with ribs R1, R2, R3, R4, and R5 are formed on the circumference of not only the second setting surface S2 but also the first setting surface S1, the first rigid substrate 31 can be positioned more accurately, so that multiple substrates can be arranged close to each other. Since the rigid flexible substrate 3 is fixed to the base member 4 in a compact state folded 180 degrees, multiple rigid substrates 31 and 32 can be compactly accommodated in the frame 2. In addition, the rigid flexible substrate 3 can be divided at the boundary between the first rigid substrate 31 and the second rigid substrate 32 and connected by a connector or the like.

[0103] The above-described embodiments are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The various elements and their configurations, materials, conditions, shapes, and sizes included in the embodiments are not limited to the illustrative ones and can be appropriately changed. Moreover, the structures shown in different embodiments can be partially replaced or combined with each other. Part or all of this embodiment can be recorded as the following notes, but is not limited to the following.

[0104] [Notes]

[0105] A sensor 1, comprising:

[0106] The base member 4 is formed with a first setting surface S1 and a second setting surface S2 parallel to the first setting surface;

[0107] A hard first rigid substrate 31 is fixed to the first setting surface; and

[0108] A hard second rigid substrate 32 is fixed to the second setting surface.

[0109] The base member includes a bottom wall 40 on which the first installation surface is formed, and a first protrusion 44, a second protrusion 45, and a third protrusion 46 in a columnar shape protruding from the bottom wall.

[0110] The second setting surface is formed at the front ends of the first protrusion, the second protrusion, and the third protrusion.

[0111] The first protrusion includes a fourth pin P4 protruding from the second installation surface and inserted into the second rigid substrate.

[0112] The second protrusion includes a fifth pin P5 protruding from the second installation surface and inserted into the second rigid substrate.

[0113] Three ribs R6, R7, and R8 are formed on the circumferential surface of the fourth pin. The three ribs R6, R7, and R8 are arranged in such a way that they form an angle of less than 180 degrees when viewed from the center of the fourth pin.

[0114] Two ribs R9 and R10 are formed on the peripheral surface of the fifth pin. The two ribs R9 and R10 protrude along a fourth straight line L4 that is orthogonal to a third straight line L3 that connects the fourth pin and the fifth pin.

Claims

1. A sensor, comprising: A base member, formed with a first setting surface and a second setting surface parallel to the first setting surface; A first rigid substrate is fixed to the first setting surface; as well as A second rigid substrate is fixed to the second setting surface, An electronic component for sensing is mounted across the first rigid substrate and the second rigid substrate. The base member includes a first protrusion, a second protrusion, and a third protrusion in a columnar shape protruding from the first installation surface. The second setting surface is formed at the front ends of the first protrusion, the second protrusion, and the third protrusion. The first protrusion includes a fourth pin protruding from the second installation surface and inserted into the second rigid substrate. The second protrusion includes a fifth pin protruding from the second installation surface and inserted into the second rigid substrate. Three ribs are formed on the circumferential surface of the fourth pin, and the three ribs are arranged in such a way that the angles thereof are smaller than 180 degrees when viewed from the center of the fourth pin. Two ribs are formed on the peripheral surface of the fifth pin, and the two ribs protrude along a fourth straight line that is orthogonal to a third straight line connecting the fourth pin and the fifth pin.

2. The sensor according to claim 1, wherein The base member includes a first fixing portion, a second fixing portion, and a third fixing portion for fixing the first rigid substrate. The first fixing portion includes a first pin protruding from the first installation surface and inserted into the first rigid substrate. The second fixing portion includes a second pin protruding from the first installation surface and inserted into the first rigid substrate. The third fixing portion includes a third pin protruding from the first installation surface and inserted into the first rigid substrate. Three ribs are formed on the circumferential surface of the first pin, and the three ribs are arranged so as to form an angle of less than 180 degrees when viewed from the center of the first pin. Two ribs are formed on the peripheral surface of the second pin. The two ribs protrude along a second straight line that is orthogonal to a first straight line connecting the first pin and the second pin.

3. The sensor according to claim 1 or 2, wherein The first rigid substrate and the second rigid substrate are parts of the same rigid flexible substrate, The rigid flexible substrate is folded 180 degrees so that the second rigid substrate faces the first rigid substrate, and the first rigid substrate and the second rigid substrate are fixed to the base member.

4. The sensor according to claim 1 or 2, further comprising a light projecting unit and / or a light receiving unit, The base member fixes the light projecting unit and / or the light receiving unit.

5. The sensor according to claim 4, comprising the light receiving unit, The second rigid substrate is located farther from the light receiving portion than the first rigid substrate. A signal circuit for processing a signal from the light receiving unit is mounted on the first rigid substrate. A power supply circuit for supplying electric power to the electronic component is mounted on the second rigid substrate.

6. The sensor according to claim 1 or 2, wherein A recessed portion recessed from the second installation surface is formed around the fourth pin and the fifth pin.

Citation Information

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