Substrate liquid processing apparatus and substrate liquid processing method

Abstract

The present invention provides a technique for inhibiting particles from mixing into a processing liquid to be supplied to a substrate. A substrate liquid processing apparatus includes a supply container into which a processing liquid is supplied via a supply line; a pressurizing device that pressurizes the inside of the supply container; a discharge nozzle that discharges the supplied processing liquid; a supply line that is connected to the supply container and the discharge nozzle, and in which no adjustment mechanism that variably restricts a flow path connecting the supply container and the discharge nozzle is provided; a first discharge line that is connected to a first branch portion of the supply line between the supply container and the discharge nozzle; a flow adjustment mechanism that is provided in the first discharge line and restricts passage of the processing liquid at a pressure lower than a set pressure; and a control section that adjusts the set pressure.

Description

Technical Field

[0001] This invention relates to a substrate liquid treatment apparatus and a substrate liquid treatment method. Background Technology

[0002] Substrate liquid treatment devices capable of suppressing particle contamination in the treatment liquid are known. In the device of Patent Document 1, since there is no need to install a control valve for adjusting the flow rate in the branch lines, there is no possibility of particles that might originate from the control valve flowing through the liquid treatment unit. The device of Patent Document 2 can suppress dust generation inside the constant pressure valve.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2015-41751

[0006] Patent Document 2: Japanese Patent Application Publication No. 2017-204069 Summary of the Invention

[0007] The technical problem that the invention aims to solve

[0008] This invention provides a technique that helps to suppress the mixing of particles into the processing solution to be supplied to the substrate.

[0009] Technical solutions for solving technical problems

[0010] One aspect of the present invention relates to a substrate liquid processing apparatus, comprising: a supply container, wherein a processing liquid is supplied to the inside of the supply container via a guide line; a pressurizing device for pressurizing the inside of the supply container; a nozzle for ejecting the supplied processing liquid; a supply line connected to the supply container and the nozzle, without an adjustment mechanism for variably restricting the flow path connecting the supply container and the nozzle; a first drain line connected to a first branch portion of the supply line between the supply container and the nozzle; a flow regulation mechanism disposed in the first drain line for restricting the passage of processing liquid with a pressure lower than a set pressure; and a control unit for adjusting the set pressure.

[0011] Invention Effects

[0012] Using this invention helps to prevent particles from mixing into the processing solution to be provided to the substrate. Attached Figure Description

[0013] Figure 1 This is a diagram illustrating an example of a processing system.

[0014] Figure 2 This is a diagram showing an overview of one example of a processing unit.

[0015] Figure 3 This is a diagram showing a schematic structure of one example of a liquid supply circuit used to supply processing fluid to the nozzle.

[0016] Figure 4 This is a diagram illustrating one example of a storage unit.

[0017] Figure 5 This is a diagram illustrating one example of a storage unit.

[0018] Figure 6 This is a diagram illustrating one example of a storage unit.

[0019] Figure 7 This is a diagram illustrating one example of a storage unit.

[0020] Figure 8 This is a diagram illustrating the first approach to the treatment fluid supply system.

[0021] Figure 9 This is a diagram illustrating the first approach to the treatment fluid supply system.

[0022] Figure 10 This is a diagram illustrating the first approach to the treatment fluid supply system.

[0023] Figure 11 This is a diagram illustrating the first approach to the treatment fluid supply system.

[0024] Figure 12 This is a diagram illustrating a second approach to the treatment fluid supply system.

[0025] Figure 13 This is a diagram illustrating a second approach to the treatment fluid supply system.

[0026] Figure 14 This is a partial cross-sectional view used to illustrate an example of the heating method in the first heating zone of the guide pipeline.

[0027] Figure 15 This is a partial cross-sectional view used to illustrate an example of the heating method in the first heating zone of the guide pipeline.

[0028] Figure 16 This is a partial cross-sectional view used to illustrate an example of the heating method in the first heating zone of the guide pipeline.

[0029] Figure 17 This is a partial cross-sectional view used to illustrate an example of the heating method in the first heating zone of the guide pipeline.

[0030] Figure 18 This is a schematic structural diagram illustrating an example of the heating method in the first heating zone of the guide pipeline.

[0031] Figure 19This is a schematic structural diagram illustrating an example of the heating method in the first heating zone of the guide pipeline.

[0032] Figure 20 This is a schematic structural diagram illustrating an example of the heating method in the first heating zone of the guide pipeline.

[0033] Figure 21 This is a diagram illustrating the first approach to a process fluid temperature control system.

[0034] Figure 22 This is a diagram illustrating a second approach to the temperature control system for the processing fluid.

[0035] Figure 23 This is a diagram illustrating an agitator installed inside the supply piping that constitutes the supply pipeline.

[0036] Figure 24 This is a diagram illustrating an example of stirring the treatment liquid supplied to the container.

[0037] Figure 25 This is a diagram illustrating a structural example of a supply container capable of suppressing uneven temperature distribution in the treatment liquid.

[0038] Figure 26 This is a diagram illustrating a structural example of a supply container capable of suppressing the temperature drop of the processing liquid. Detailed Implementation

[0039] Figure 1 This is a diagram showing an overview of one example of a processing system 80. Figure 1 The processing system 80 shown has an infeed / outfeed station 91 and a processing station 92. The infeed / outfeed station 91 includes a loading section 81 with multiple carriers C and a conveying section 82 equipped with a first conveying mechanism 83 and a transfer section 84. Multiple substrates W are horizontally housed in each carrier C. The processing station 92 is equipped with multiple processing units 10 disposed on both sides of a conveying path 86 and a second conveying mechanism 85 that moves back and forth in the conveying path 86.

[0040] The substrate W is taken from the carrier C by the first conveying mechanism 83 and placed in the transfer section 84, and then taken out from the transfer section 84 by the second conveying mechanism 85. Next, the substrate W is fed into the corresponding processing unit 10 by the second conveying mechanism 85, where a prescribed liquid treatment (e.g., chemical treatment) is performed. Afterwards, the substrate W is taken from the corresponding processing unit 10 by the second conveying mechanism 85 and placed in the transfer section 84, and then returned to the carrier C of the placement section 81 by the first conveying mechanism 83.

[0041] The processing system 80 includes a control unit 93. The control unit 93, for example, is a computer and includes an arithmetic processing unit and a storage unit. The storage unit of the control unit 93 stores programs and data for various processes executed in the processing system 80. The arithmetic processing unit of the control unit 93 controls various mechanisms of the processing system 80 to perform various processes by appropriately reading and executing the programs stored in the storage unit.

[0042] The programs and data stored in the storage unit of the control unit 93 can be recorded on a computer-readable storage medium and installed from that storage medium into the storage unit. Examples of computer-readable storage media include hard disks (HD), floppy disks (FD), optical disks (CD), magneto-optical disks (MO), and memory cards.

[0043] Figure 2 This is a diagram showing an outline of one example of the processing unit 10.

[0044] Processing unit 10 and control unit 93 (see reference) Figure 1 Together, they constitute a substrate liquid treatment apparatus, including a substrate holding section 11, a rotation drive section 12, a liquid supply section 15, a cup-shaped structure 21, an inactive gas supply section 22, and a processing chamber 23. The substrate holding section 11, the rotation drive section 12, the liquid supply section 15, and the cup-shaped structure 21 are disposed inside the processing chamber 23. The inactive gas supply section 22 supplies an inactive gas (e.g., nitrogen) into the processing chamber 23.

[0045] The substrate holding section 11 holds the substrate through the second conveying mechanism 85 (see reference). Figure 1 The substrate W is supplied. The illustrated substrate holding part 11 uses a vacuum method to hold the back side of the substrate W by adsorption, but the substrate holding part 11 can also hold the substrate W by other means (e.g., mechanical clamping). The rotation drive part 12 provides rotational power to the substrate holding part 11, causing the substrate W held in the substrate holding part 11 to rotate together with the substrate holding part 11. The illustrated rotation drive part 12 includes a rotation drive shaft and a rotation drive main body, wherein the rotation drive shaft extends along the rotation axis A1 and the substrate holding part 11 is fixedly mounted at its front end, and the rotation drive main body causes the rotation drive shaft to rotate about the rotation axis A1. In this illustrated example, the substrate holding part 11 and the rotation drive part 12 constitute at least a part of the rotation mechanism 13 that rotates the substrate W about the rotation axis A1.

[0046] The liquid supply unit 15 includes a nozzle drive unit 16, a drive arm 17, and a nozzle 19. The nozzle drive unit 16 includes a rotation drive shaft and a rotation drive body, wherein the rotation drive shaft extends along a rotation axis A2, and the drive arm 17 is fixedly mounted at its front end. The rotation drive body causes the rotation drive shaft to rotate about the rotation axis A2. The rotation drive shaft of the nozzle drive unit 16 is mounted on one end of the drive arm 17, and the nozzle 19 is mounted on a nozzle head 18 constituting the other end of the drive arm 17. The nozzle 19 moves together with the drive arm 17 (including the nozzle head 18) about the rotation axis A2. In this illustration, the nozzle drive unit 16 and the drive arm 17 constitute at least a portion of the nozzle moving mechanism that moves the nozzle 19.

[0047] Nozzle 19 ejects through the supply line described later (see reference). Figure 3 The processing fluid is supplied from the nozzle 19 (see attached figure 14). The processing fluid ejected from the nozzle 19 is supplied to the substrate W held by the substrate holding part 11 for liquid treatment of the substrate W. The supply line is connected to the nozzle 19 inside the processing chamber 23 via the nozzle drive part 16 and the drive arm 17. In addition, the supply injector (liquid flow switching mechanism) described later can be installed on the movably provided drive arm 17 in addition to the nozzle 19 (see attached figure 14). Figure 12 (See attached figures marked "69") etc.

[0048] The specific composition and purpose of the processing liquid supplied to the nozzle 19 are not limited. For example, a chemical solution used to change the properties of the substrate W, a rinsing solution used to rinse the surface of the substrate W, and a cleaning solution used to clean the substrate W can be used as the processing liquid. Furthermore, the number of nozzles 19 provided in the liquid supply unit 15 is not limited. Figure 2 Only one nozzle 19 is shown in the figure, but the liquid supply unit 15 may also have two or more nozzles 19. For example, the nozzle 18 may be provided with a nozzle 19 for spraying a medicine, a nozzle 19 for spraying a rinsing liquid such as pure water (DIW), and a nozzle 19 for spraying a cleaning liquid (such as IPA) for substrate cleaning.

[0049] The cup-shaped structure 21 has an annular planar shape and is arranged to surround the substrate W held in the substrate holding portion 11. The cup-shaped structure 21 catches liquid splashed from the substrate W and guides it to a drain pipe (not shown), or adjusts the flow of gas to prevent gas diffusion around the substrate W. The specific structure of the cup-shaped structure 21 is not limited. For example, the cup-shaped structure 21 may have separate cup-shaped parts mainly for guiding liquid and cup-shaped parts mainly for adjusting the flow of gas.

[0050] The processing unit 10 may also include other mechanisms not described above. For example, it may also be provided with an exhaust regulating mechanism for discharging gas from the processing chamber 23, or a liquid discharge regulating mechanism for discharging liquid that has fallen (splashed) from the substrate W from the processing chamber 23. In addition, a heating device may be provided for heating the liquid on the substrate W to promote liquid treatment of the substrate W.

[0051] [Liquid Supply Circuit]

[0052] Figure 3 This is a diagram showing a schematic structure of one example of a liquid supply circuit 30 for supplying processing liquid P to the nozzle 19. The liquid supply circuit 30 is implemented by various structural elements of the processing unit 10 and other structural elements of the processing system 80.

[0053] Figure 3 The liquid supply circuit 30 shown includes a storage unit 32 connected to the processing liquid supply source 31 via a storage line L1, a supply container 37 connected to the storage unit 32 via a guide line L2, and a nozzle 19 connected to the supply container 37 via a supply line L4.

[0054] Storage unit 32 stores the processed liquid P supplied from the processed liquid supply source 31 via storage pipeline L1. The specific structure of storage unit 32 is not limited. For example, storage unit 32 may have only one storage container for storing processed liquid P, but it may also have multiple containers (see below). Figures 4-7 A storage on / off valve 45 is installed in the storage pipeline L1. Under the control of the control unit 93, the storage on / off valve 45 opens and closes the flow path of the storage pipeline L1, thereby controlling the supply of the processing liquid P to the storage unit 32.

[0055] A guide valve 33 and a guide filter 34 are provided downstream of the guide valve 33 in the guide line L2. The guide valve 33 opens and closes the flow path of the guide line L2 under the control of the control unit 93. The guide filter 34 removes foreign matter from the processed liquid P while allowing the processed liquid P to pass through. The processed liquid P is supplied from the storage unit 32 to the supply container 37 through the guide line L2, whose flow path is opened by the guide valve 33.

[0056] The method for conveying the treatment liquid P from the storage unit 32 to the supply container 37 is not limited. For example, the treatment liquid P can be conveyed from the storage unit 32 to the guide line L2 (described later) by blowing pressurized gas (e.g., an inactive gas such as nitrogen) into the storage container of the storage unit 32. Figure 7Furthermore, by positioning the storage unit 32 and the guide line L2 above the supply container 37, the processing liquid P can be conveyed from the storage unit 32 to the supply container 37 using gravity. When using a pump (not shown) or similar delivery device that directly delivers the processing liquid P from the guide line L2, such a delivery device is preferably located upstream of the guide filter 34. In this case, even if particles are released into the processing liquid P from the delivery device, such particles can be removed from the processing liquid P using the guide filter 34.

[0057] At least one of the guide line L2 and the supply container 37 is provided with a heating zone for heating the processing liquid via a heating element. Figure 3 In the example shown, heating zones are set at both the guide line L2 and the supply container 37. Specifically, a first heating element 35 is provided near the first heating zone Z1 of the guide line L2, and the processing liquid P in the first heating zone Z1 is heated by the first heating element 35. Furthermore, a second heating element 36 is provided near the second heating zone Z2 of the supply container 37, and the processing liquid P in the second heating zone Z2 is heated by the second heating element 36.

[0058] Heating zones Z1 and Z2 are located downstream of the guide filter 34. The guide filter 34 removes foreign matter from the portion of the processed liquid P flowing upstream of the heating zones Z1 and Z2 in the flow path of the processed liquid P. There is a tendency that the higher the temperature of the processed liquid P passing through the guide filter 34, the easier it is for foreign matter to be released from the guide filter 34 into the processed liquid P. Figure 3 In the liquid supply circuit 30 shown, the preheated treatment liquid P passes through the guide filter 34, thus preventing the release of foreign matter from the guide filter 34 into the treatment liquid P. Furthermore, Figure 3 In the liquid supply circuit 30 shown, in the flow path of the processing liquid P from the guide line L2 to the nozzle 19, there are no filters for removing foreign matter from the processing liquid P in the heating zones Z1 and Z2 and in the flow path downstream of the heating zones Z1 and Z2. By preventing the high-temperature processing liquid P after being heated in the heating zones Z1 and Z2 from passing through the filters, contamination of the processing liquid P can be prevented.

[0059] The treatment fluid P is supplied to the inside of the supply container 37 via the guide line L2. A pressurizing device 38 is installed in the supply container 37. The pressurizing device 38 pressurizes the inside of the supply container 37 and delivers the treatment fluid P from the supply container 37 to the supply line L4. The pressurizing device 38 shown in the figure is connected to the supply container 37 via a gas line L3, which can supply pressurizing gas (such as an inactive gas such as nitrogen) into the supply container 37 to increase the pressure inside the supply container 37. A pressurizing filter 39 is provided in the gas line L3 downstream of the pressurizing device 38. The pressurizing filter 39 removes foreign matter from the pressurizing gas while allowing the pressurizing gas from the pressurizing device 38 to pass through. Thus, the pressurizing gas delivered from the pressurizing device 38 to the gas line L3 flows into the supply container 37 in a clean state after the foreign matter has been removed by the pressurizing filter 39.

[0060] Supply line L4 is connected to supply container 37 and nozzle 19. Supply line L4 does not have a regulating mechanism for variably limiting the flow path connecting supply container 37 and nozzle 19. The "regulating mechanism for variably limiting the flow path" mentioned here can be any regulating mechanism. Typically, a regulating mechanism such as a valve or pump capable of changing the cross-sectional area of ​​the processed liquid flow path can be equivalent to a "regulating mechanism for variably limiting the flow path." Examples of valves that can be equivalent to a "regulating mechanism for variably limiting the flow path" include, for example, a distribution valve that functions as an on / off valve for opening and closing the flow path, and a backflow valve for retracting the liquid level at the nozzle tip upstream. A "regulating mechanism for variably limiting the flow path" may allow particles such as dust to mix into the liquid within the flow path. Figure 3 In the liquid supply circuit 30 shown, there is no "adjustment mechanism for variable restriction of the flow path" located downstream of the guide filter 34, so it is possible to prevent the occurrence of particulate matter mixed into the treatment liquid P in the flow path between the guide filter 34 and the nozzle 19.

[0061] A first branch section b1 between the supply container 37 and the nozzle 19 in the supply line L4 is connected to a first drain line L5. A flow regulating mechanism 40 is provided in the first drain line L5. The flow regulating mechanism 40 can regulate the flow of the processing liquid P in the supply line L4 and the first drain line L5, controlling the discharge of the processing liquid P from the nozzle 19. The flow regulating mechanism 40 can be implemented by various structures; specific examples of the flow regulating mechanism 40 will be described later (see [reference]). Figures 8 to 13 The treated liquid P after passing through the flow regulating mechanism 40 is sent downstream via the first drain line L5, or returned to the storage unit 32, or discharged into the drain container 41.

[0062] In the liquid supply circuit 30 (substrate liquid treatment apparatus) having the above-described structure, the processing liquid P is supplied from the supply container 37 to the nozzle 19 via the supply line L4 by pressurizing the inside of the supply container 37 using the pressurizing device 38. The processing liquid P supplied to the nozzle 19 is then ejected from the nozzle 19 toward the substrate W, thereby implementing a substrate liquid treatment method for liquid treatment of the substrate W by supplying the processing liquid P to the substrate W.

[0063] Next, specific examples of the structural elements of the liquid supply circuit 30 will be explained.

[0064] [Storage Unit]

[0065] Figures 4-7 This is a diagram illustrating one example of storage unit 32.

[0066] Figures 4-7 The storage unit 32 shown has multiple storage containers (i.e., a first storage container 47a and a second storage container 47b). The first storage container 47a and the second storage container 47b are connected to each other via multiple circulation lines (i.e., a first circulation line L7a and a second circulation line L7b).

[0067] The first circulation line L7a is a line that guides the processed liquid P from the first storage container 47a to the second storage container 47b. A first circulation on / off valve 49a and a first circulation filter 50a are provided in the first circulation line L7a. The first circulation on / off valve 49a is located upstream of the first circulation filter 50a (i.e., on the side of the first storage container 47a), and opens and closes the first circulation line L7a under the control of the control unit 93. The first circulation filter 50a is located downstream of the first circulation on / off valve 49a (i.e., on the side of the second storage container 47b), and removes foreign matter from the processed liquid P while allowing it to pass through the first circulation line L7a.

[0068] The second circulation line L7b is a line that guides the treatment liquid P from the second storage container 47b to the first storage container 47a. A second circulation on / off valve 49b and a second circulation filter 50b are provided in the second circulation line L7b. The second circulation on / off valve 49b is located upstream of the second circulation filter 50b (i.e., on the side of the second storage container 47b) and is opened and closed under the control of the control unit 93. The second circulation filter 50b is located downstream of the second circulation on / off valve 49b (i.e., on the side of the first storage container 47a) and removes foreign matter from the treatment liquid P while allowing it to pass through the second circulation line L7b.

[0069] A first storage pressurization unit 48a is installed in a first storage container 47a, and a second storage pressurization unit 48b is installed in a second storage container 47b. Under the control of the control unit 93, the first storage pressurization unit 48a pressurizes the inside of the first storage container 47a, and the second storage pressurization unit 48b pressurizes the inside of the second storage container 47b. The specific structure of the first storage pressurization unit 48a and the second storage pressurization unit 48b is not limited. For example, the first storage pressurization unit 48a and the second storage pressurization unit 48b may each have a compressor that delivers pressurizing gas to the inside of the first storage container 47a and the second storage container 47b, respectively.

[0070] Storage line L1 is connected to the first storage container 47a. A storage on / off valve 45 and a storage filter 46 are installed on storage line L1. Storage on / off valve 45 is located upstream of storage filter 46 (i.e., on the side of the processing liquid supply source 31), and opens and closes storage line L1 under the control of control unit 93. Storage filter 46 is located downstream of storage on / off valve 45 (i.e., on the side of the first storage container 47a), and removes foreign matter from processing liquid P while allowing it to pass through storage line L1.

[0071] The guide line L2 is connected to the first storage container 47a, and the first storage container 47a is connected to the supply container 37 via the guide line L2.

[0072] Storage unit 32 may also be provided with other mechanisms (not shown) as needed. For example, each of the first storage container 47a and the second storage container 47b may be provided with a level sensor or other liquid volume measuring mechanism (not shown). For example, multiple sensors for detecting the presence or absence of liquid P may be placed at different heights in each storage container 47a, 47b, thereby measuring the height of liquid P in each storage container 47a, 47b. The measurement results of this liquid volume measuring mechanism are sent to the control unit 93.

[0073] Alternatively, the first drain line L5 (refer to...) Figure 3 The process fluid, after passing through the flow regulating mechanism 40, flows into at least one of the multiple storage containers 47a and 47b via the first drain line L5. The first drain line L5 can be directly connected to at least one of the multiple storage containers 47a and 47b, or it can be connected to them via the storage line L1. By connecting the first drain line L5 to the portion of the storage line L1 upstream of the storage filter 46, the process fluid P flowing from the first drain line L5 into the storage line L1 flows into the first storage container 47a after foreign matter is removed by the storage filter 46.

[0074] When the processing liquid P is supplied to the storage unit 32 having the above structure, the storage unit 32 is placed Figure 4 The state shown is as follows: Under the control of the control unit 93, the storage line L1 is opened by the storage on / off valve 45, and the first circulation line L7a, the second circulation line L7b, and the guide line L2 are closed by the first circulation on / off valve 49a, the second circulation on / off valve 49b, and the guide on / off valve 33. As a result, the processing liquid P is supplied from the processing liquid supply source 31 to the first storage container 47a via the storage line L1, and the processing liquid P is stored in the first storage container 47a.

[0075] Based on the measurement results from the liquid volume measuring mechanism, the control unit 93 monitors the height and / or volume of the processing liquid P in the first storage container 47a. When the processing liquid P in the first storage container 47a reaches a predetermined height and / or volume (e.g., 300cc to 500cc), the control unit 93 controls the storage on / off valve 45 to close the storage pipeline L1, stopping the supply of processing liquid P to the first storage container 47a.

[0076] Then, the treatment solution P is circulated among multiple storage containers 47a and 47b, and foreign matter is removed using circulation filters 50a and 50b. For example, as... Figure 5 As shown, under the control of the control unit 93, the first circulation line L7a is opened by the first circulation on / off valve 49a, and the second circulation line L7b and the guide line L2 are closed by the second circulation on / off valve 49b and the guide on / off valve 33. In this state, the first storage pressurization unit 48a pressurizes the inside of the first storage container 47a, thereby enabling the processing liquid P to be transported from the first storage container 47a to the second storage container 47b via the first circulation line L7a. Furthermore, as... Figure 6 As shown, under the control of the control unit 93, the second circulation line L7b is opened by the second circulation on / off valve 49b, and the first circulation line L7a and the guide line L2 are closed by the first circulation on / off valve 49a and the guide on / off valve 33. In this state, the second storage pressurization unit 48b pressurizes the inside of the second storage container 47b, thereby enabling the processing liquid P to be delivered from the second storage container 47b to the first storage container 47a.

[0077] After foreign matter is removed from the treatment liquid P through circulating filters 50a and 50b, the treatment liquid P is transported from storage unit 32 to supply container 37. Specifically, as shown below... Figure 7 As shown, under the control of the control unit 93, the guide line L2 is opened by the guide on / off valve 33, and the first circulation line L7a and the second circulation line L7b are closed by the first circulation on / off valve 49a and the second circulation on / off valve 49b. In this state, the inside of the first storage container 47a is pressurized by the first storage pressurization unit 48a, thereby enabling the processing fluid P to be delivered from the first storage container 47a to the guide line L2.

[0078] In the above Figures 4-7 In the example shown, the first circulation filter 50a and the second circulation filter 50b constitute a "filter for removing foreign matter from the processing fluid flowing in at least one of the plurality of circulation lines". Furthermore, the combination of the first storage pressurization unit 48a, the second storage pressurization unit 48b, the first circulation on / off valve 49a, the second circulation on / off valve 49b, and the guide on / off valve 33 constitutes a "circulation regulating mechanism for circulating the processing fluid between the plurality of storage containers via the plurality of circulation lines".

[0079] In existing substrate liquid treatment devices, for example, the liquid is circulated using a bellows pump while being filtered to remove foreign matter. According to the above... Figures 4-7 The storage unit 32 shown can remove foreign matter from the treatment liquid P by circulating the treatment liquid P among multiple storage containers 47a and 47b using pressurized gas. Therefore, without the need for a complex structure such as a bellows pump, foreign matter can be properly removed from the treatment liquid P using the simple structure of the storage unit 32.

[0080] Next, a specific example of a supply system for supplying treatment fluid P from supply container 37 to nozzle 19 will be described. Two structural examples of such a treatment fluid supply system (i.e., "the first type of treatment fluid supply system" and "the second type of treatment fluid supply system") will be described below.

[0081] [The first method of processing fluid supply system]

[0082] Figures 8-11 This is a diagram illustrating the first approach to the treatment fluid supply system. Figures 8-11 Some structural elements are omitted from the illustration. For example, this method includes a heating unit for heating the processing liquid P (i.e., Figure 3 The first heating part 35 and the second heating part 36), but Figures 8-11 The illustration of the heating element is omitted. Furthermore, detailed explanations of the structure and function of the already described elements are omitted.

[0083] In this configuration, the supply container 37, in addition to being connected to the aforementioned guide line L2, gas line L3, and supply line L4, is also connected to an atmospheric opening line L9. The atmospheric opening line L9 is designed to connect the inside of the supply container 37 to its surrounding environment (e.g., the atmosphere), ensuring that the pressure inside the supply container 37 is the same as the ambient pressure (e.g., atmospheric pressure). An atmospheric opening valve 63 is installed on the atmospheric opening line L9. Under the control of the control unit 93, the atmospheric opening valve 63 opens and closes the flow path of the atmospheric opening line L9. By opening the atmospheric opening line L9 through the atmospheric opening valve 63, the inside of the supply container 37 is opened to the surrounding environment, allowing gas to move freely between the inside of the supply container 37 and its surroundings via the atmospheric opening line L9. Conversely, by closing the atmospheric opening line L9 through the atmospheric opening valve 63, the inside of the supply container 37 is isolated from its surroundings, preventing gas flow between the inside of the supply container 37 and its surroundings. For example, when the treatment fluid P is supplied to the nozzle 19 (see below) Figure 9 The control unit 93 controls the atmospheric opening valve 63 to close the atmospheric opening pipeline L9, placing the inside of the supply container 37 in a state where efficient pressurization is possible. Additionally, without supplying the treatment fluid P to the nozzle 19 (see below for details...), Figure 10 and Figure 11 The control unit 93 controls the atmospheric opening valve 63 to open L9.

[0084] The pressurizing device 38 includes a gas supply unit 65, a pressure regulating unit 66, and a gas on / off valve 67. The gas supply unit 65 allows pressurizing gas to flow in a gas line L3 connected to the inside of the supply container 37. The pressure regulating unit 66 regulates the pressure of the pressurizing gas flowing in the gas line L3. The gas on / off valve 67 opens and closes the flow path of the gas line L3. The gas supply unit 65 can be driven by the control unit 93, and may include a compressor, for example. The pressure regulating unit 66 can be driven by the control unit 93, and may include an electro-pneumatic regulator, for example. The gas supply unit 65 and the pressure regulating unit 66 can be stopped by the control unit 93, for example, when the liquid supply circuit 30 is in standby mode. The gas on / off valve 67 can be driven by the control unit 93, and may be a solenoid valve, for example.

[0085] The supply container 37 is equipped with a liquid level sensor and other liquid volume measuring mechanism (not shown) to measure the height and / or quantity of the processing liquid P stored inside. The measurement results of this liquid volume measuring mechanism are sent to the control unit 93.

[0086] The nozzle 19 is located above the supply container 37 and the flow regulating mechanism 40 (specifically, the back pressure valve 42). The supply container 37 and the flow regulating mechanism 40 (back pressure valve 42) are located below the highest point in the supply line L4.

[0087] A liquid detection sensor 61 is installed near the supply line L4. The liquid detection sensor 61 detects whether there is processing liquid P at a first measuring point M1 located downstream of the first branch section b1 (i.e., on the nozzle 19 side) in the supply line L4. The detection method of the liquid detection sensor 61 is not limited. For example, if the supply line L4 is made of a light-transmitting component, an optical sensor can be used for the liquid detection sensor 61. Alternatively, the liquid detection sensor 61 can also be a sensor that measures the electrostatic capacitance or magnetic field at the first measuring point M1. The liquid detection sensor 61 sends the detection result to the control unit 93.

[0088] The first branch portion b1 is located between the highest point of the supply line L4 from the supply container 37 to the nozzle 19 and the supply container 37. The first measuring portion M1 is located between the highest point of the supply line L4 from the supply container 37 to the nozzle 19 and the first branch portion b1, and is set at a position lower than the highest point of the supply line L4.

[0089] A flow meter 62 is installed in the supply line L4. The flow meter 62 measures the flow rate of the treatment fluid P in the supply line L4 at the second measuring point M2, which is located downstream of the first branch section b1 (i.e., on the side of the nozzle 19). The flow meter 62 sends the measurement result to the control unit 93. Based on the measurement result of the flow meter 62, the control unit 93 adjusts the set pressure of the back pressure valve 42, which will be described later.

[0090] A back pressure valve 42 and a drain on / off valve 43 located downstream of the back pressure valve 42 are provided in the first drain line L5. The drain on / off valve 43 opens and closes the flow path of the first drain line L5 under the control of the control unit 93. The back pressure valve 42 functions as the aforementioned flow regulating mechanism 40, restricting the passage of the processing fluid P with a pressure lower than the set pressure. In this example, the back pressure valve 42 allows the passage of processing fluid P with a pressure higher than the set pressure, and prevents the passage of processing fluid P with a pressure lower than the set pressure. Thus, the back pressure valve 42 regulates the pressure of the processing fluid P in the first drain line L5 (especially the flow path upstream of the back pressure valve 42) and the supply line L4 to a pressure lower than the set pressure.

[0091] The set pressure of the back pressure valve 42 is adjusted by the control unit 93, and the flow state of the treatment fluid P can be changed by changing this set pressure. For example, when the treatment fluid P is supplied to the nozzle 19, the control unit 93 adjusts the set pressure of the back pressure valve 42 to be above the peak head pressure at the highest point of the supply line L4 from the supply container 37 to the nozzle 19. On the other hand, when the treatment fluid P is not supplied to the nozzle 19, the control unit 93 adjusts the set pressure of the back pressure valve 42 to be below the peak head pressure.

[0092] The second branch section b2 between the supply container 37 and the nozzle 19 in the supply line L4 is connected to the second drainage line L6. Figures 8-11 In the example shown, the second branch b2 is positioned at the same location as the first branch b1, but the second branch b2 can also be positioned upstream or downstream of the first branch b1. Additionally, the second drain line L6 can also be connected to the supply line L4 via the first drain line L5.

[0093] A suction mechanism 53 is provided in the second drain line L6. The driving mode of the suction mechanism 53 can be switched between a suction mode in which the flow path of the supply line L4 is suctioned through the second drain line L6, and a non-suction mode in which the flow path of the supply line L4 is suctioned without passing through the second drain line L6. For example, when the treatment fluid P is not supplied to the nozzle 19, the control unit 93 at least temporarily adjusts the suction mechanism 53 to the suction mode. As a result, the treatment fluid P in the supply line L4 can be quickly removed from the nozzle 19, and accidental adverse situations such as the treatment fluid P dripping from the nozzle 19 can be prevented.

[0094] The suction mechanism 53 in this example includes a mode switching valve 54, a negative pressure container 55, and a negative pressure regulator 56. The mode switching valve 54 is located on the second drain line L6 and opens and closes the second drain line L6 under the control of the control unit 93. One end of the second drain line L6 is connected to the supply line L4 (especially the second branch section b2), and the other end of the second drain line L6 is connected to the negative pressure container 55. The negative pressure regulator 56 adjusts the negative pressure container 55 to a negative pressure state.

[0095] The illustrated negative pressure regulator 56 includes a negative pressure compressor 57, a negative pressure on / off valve 58, and a negative pressure injector 59. The negative pressure compressor 57, under the control of the control unit 93, supplies gas (e.g., inert gas such as nitrogen) to the negative pressure line L8. The negative pressure on / off valve 58 is located between the negative pressure compressor 57 and the negative pressure injector 59, and opens and closes the negative pressure line L8 under the control of the control unit 93. The negative pressure injector 59 can be configured as an aspirator connecting the negative pressure container 55 and the negative pressure line L8, and can create a depressurized state inside the negative pressure container 55 by utilizing the Venturi effect of the gas flowing into the negative pressure line L8. The aspirator typically has a T-shaped flow path composed of a combination of horizontal and vertical flow paths. The horizontal flow path locally narrows at the confluence with the vertical flow path. By allowing the fluid (in this example, gas from the negative pressure compressor 57) to flow in the horizontal flow path, at the confluence, the fluid velocity increases and the pressure decreases, resulting in the fluid in the vertical flow path being drawn towards the horizontal flow path side.

[0096] When the suction mechanism 53 is adjusted to non-suction mode, the control unit 93 controls the mode switching valve 54 to close the flow path of the second drain line L6. On the other hand, when the suction mechanism 53 is adjusted to suction mode, the control unit 93 controls the mode switching valve 54 to open the flow path of the second drain line L6.

[0097] For example, when adjusting the temperature of the processing liquid P, the liquid supply circuit 30 is set to a position under the control of the control unit 93. Figure 8 The state is as shown. Specifically, guide line L2 is opened by guide on / off valve 33, atmospheric access line L9 is closed by atmospheric access valve 63, and gas line L3 is opened by gas on / off valve 67. Additionally, the first drain line L5 is opened by drain on / off valve 43, and the second drain line L6 is closed by mode switching valve 54. Furthermore, the control unit 93 sets the set pressure of the back pressure valve 42 below the aforementioned peak head pressure.

[0098] In this state, the pressurized gas supplied from the gas supply unit 65 to the gas pipeline L3 is pressure-regulated by the pressure regulating unit 66, and then supplied to the supply container 37 after passing through the pressure filter 39. As a result, the inside of the supply container 37 is pressurized, and the processed liquid P is delivered from the supply container 37 to the supply pipeline L4. On the other hand, the gas from the storage unit 32 (e.g., Figures 4-7 The first storage container 47a) shown supplies the processing liquid P to the supply container 37 via the guide line L2. Based on the measurement results of the liquid volume measuring mechanism (not shown) installed in the supply container 37, the control unit 93 controls the guide opening and closing valve 33 to open and close the guide line L2, and stores an appropriate amount of processing liquid P in the supply container 37.

[0099] A portion of the treated liquid P flowing from the supply container 37 into the supply line L4 flows through the first branch section b1 into the first drain line L5, reaching the back pressure valve 42. Since the set pressure of the back pressure valve 42 is adjusted to be lower than the peak head pressure, the back pressure valve 42 allows the treated liquid P to pass through while simultaneously regulating the pressure of the treated liquid P in the supply line L4 to be lower than the peak head pressure. Therefore, the treated liquid P in the supply line L4 can only reach a height position lower than the highest point in the supply line L4, and the treated liquid P is not supplied to the nozzle 19.

[0100] The treatment fluid P, after passing through the back pressure valve 42, is transported to the storage unit 32 (e.g., after passing through the first drain line L5) via the first drain line L5. Figures 4-7 The first storage container 47a is shown. The processing liquid P can be directly transported from the first drain line L5 to the storage unit 32, or it can be transported from the first drain line L5 to the storage unit 32 via a container and pipeline not shown. The processing liquid P transported from the first drain line L5 to the storage unit 32 is returned to the supply container 37 via the guide line L2.

[0101] Thus, in the liquid supply circuit 30, Figure 8 In the state shown, the processing liquid P supplied from the supply container 37 to the supply line L4 does not exit from the nozzle 19, but returns to the supply container 37 via the first drain line L5, the storage unit 32, and the guide line L2. The processing liquid P circulates in the liquid supply circuit 30 while simultaneously being heated in the heating zone (…). Figure 8 Illustrations omitted; please refer to the original text. Figure 3 The first heating zone Z1 and the second heating zone Z2 are heated and gradually heated to the desired temperature.

[0102] After the processing fluid P is adjusted to the desired temperature, when the processing fluid P is supplied to the nozzle 19 and ejected from the nozzle 19, the liquid supply circuit 30 is set under the control of the control unit 93. Figure 9 The state shown.

[0103] That is, the control unit 93 sets the set pressure of the back pressure valve 42 to be above (preferably higher than) the peak head pressure. The guide line L2 is closed by the guide on / off valve 33, but the open / closed states of the atmospheric open line L9, gas line L3, first drain line L5, and second drain line L6 are set to the same position as... Figure 8 The same state is shown. In addition, the pressurizing device 38 (especially the air pressure regulating unit 66) pressurizes the inside of the supply container 37 so that the treatment liquid P delivered from the supply container 37 to the supply pipeline L4 has a pressure greater than the peak head pressure (preferably a pressure higher than the peak head pressure).

[0104] Therefore, the treatment fluid P in the supply line L4 is regulated by the back pressure valve 42 to the same pressure as the "set pressure above the peak head pressure". As a result, the treatment fluid P reaches the highest point in the supply line L4 and is then supplied to the nozzle 19.

[0105] Furthermore, the control unit 93 can also adjust the set pressure of the back pressure valve 42 based on the measurement results of the flow meter 62. For example, if the control unit 93 determines, based on the measurement results of the flow meter 62, that the amount of treatment fluid P supplied to the nozzle 19 is insufficient, it can increase the set pressure of the back pressure valve 42, thereby supplying more treatment fluid P to the nozzle 19. Alternatively, if the control unit 93 determines, based on the measurement results of the flow meter 62, that the amount of treatment fluid P supplied to the nozzle 19 is excessive, it can decrease the set pressure of the back pressure valve 42, thereby reducing the amount of treatment fluid P supplied to the nozzle 19.

[0106] exist Figure 9 In the example shown, during the supply of treatment fluid P to the nozzle 19, the negative pressure on / off valve 58 opens the negative pressure line L8 under the control of the control unit 93, and the negative pressure container 55 is adjusted to a negative pressure state.

[0107] Next, when the supply of processing fluid P to nozzle 19 is stopped from the state where it is being supplied, thereby stopping the ejection of processing fluid P from nozzle 19, the fluid supply circuit 30 is set to a state under the control of the control unit 93. Figure 10 The state shown.

[0108] That is, the control unit 93 sets the back pressure valve 42 to a pressure lower than the aforementioned peak head pressure. As a result, the back pressure valve 42 adjusts the treatment fluid P in the supply line L4 to a pressure lower than the peak head pressure. Consequently, the treatment fluid P cannot reach the highest point in the supply line L4, and the treatment fluid P is no longer supplied to the nozzle 19.

[0109] Furthermore, the second drain line L6 is opened by the mode switching valve 54 under the control of the control unit 93, and the suction mechanism 53 is adjusted to suction mode. As a result, the negative pressure container 55 is connected to the supply line L4 via the second drain line L6, and the treatment fluid P from the supply line L4 is drawn into the negative pressure container 55 via the second drain line L6. Consequently, the head position of the treatment fluid P in the supply line L4 can be quickly moved away from the nozzle 19, and the ejection of treatment fluid P from the nozzle 19 can be stopped instantly. The treatment fluid P flowing into the negative pressure container 55 is transported to the storage unit 32 via the negative pressure ejector 59 and the negative pressure line L8.

[0110] Based on the detection result of the liquid detection sensor 61, the control unit 93 switches the suction mechanism 53 (described later) from suction mode to non-suction mode. When the detection result of the liquid detection sensor 61 indicates that the treated liquid P is present at the first measurement point M1, the control unit 93 controls the suction mechanism 53 (especially the mode switching valve 54) to maintain suction mode. Conversely, when the detection result of the liquid detection sensor 61 indicates that the treated liquid P is not present at the first measurement point M1, the control unit 93 controls the suction mechanism 53 (especially the mode switching valve 54) to switch from suction mode to non-suction mode. This ensures that the head position of the treated liquid P in the supply line L4 is reliably moved away from the nozzle 19.

[0111] In addition, atmospheric access line L9 is opened by atmospheric access valve 63, and gas line L3 is closed by gas on / off valve 67. As a result, the pressure inside supply container 37 is adjusted to be the same as the pressure around supply container 37, which can reduce the pressure of the processed liquid P from supply container 37 to supply line L4.

[0112] In addition, the opening and closing states of the guide line L2 and the first drain line L5 are set to be consistent with... Figure 9 The state shown is the same as the state shown.

[0113] Next, with the liquid supply circuit 30 in standby mode, the liquid supply circuit 30 is then set to a standby state under the control of the control unit 93. Figure 11 The state shown.

[0114] That is, the control unit 93 sets the back pressure valve 42 to a pressure lower than the aforementioned peak head pressure. The first drain line L5 is closed by the drain on / off valve 43, the atmospheric open line L9 is opened by the atmospheric open valve 63, and the gas line L3 is closed by the gas on / off valve 67. The second drain line L6 is closed by the mode switching valve 54, and the negative pressure line L8 is closed by the negative pressure on / off valve 58.

[0115] Therefore, the treatment fluid P in the supply container 37 and supply line L4 is not supplied to the nozzle 19, nor is it circulated. The inside of the supply container 37 is not pressurized, and the treatment fluid P in the supply line L4 is not discharged via the first drain line L5 and the second drain line L6. Therefore, the liquid level of the treatment fluid P in the supply line L4 is the same as the liquid level of the treatment fluid P in the supply container 37.

[0116] On the other hand, the guide line L2 is opened by the guide on / off valve 33, and the processing liquid P is supplied from the storage unit 32 to the supply container 37 via the guide line L2. The control unit 93 monitors the amount of processing liquid P stored in the supply container 37 based on the measurement results of the liquid volume measuring mechanism (not shown) installed in the supply container 37. Then, when the processing liquid P in the supply container 37 reaches an appropriate amount, the control unit 93 closes the guide line L2 using the guide on / off valve 33, stopping the supply of processing liquid P to the supply container 37.

[0117] In existing substrate liquid processing devices, pressure is sometimes applied to the processing liquid near the nozzle, and the opening and closing of an on / off valve located on the supply line is controlled to switch whether the processing liquid is ejected from the nozzle. On the other hand, according to Figures 8-11 The liquid supply circuit 30 shown can switch whether the treatment liquid P is ejected from the nozzle 19 by changing the set pressure of the back pressure valve 42. Therefore, the liquid supply circuit 30 according to this method does not require a device for applying pressure to the treatment liquid P near the nozzle 19, and does not require an on / off valve in the supply line L4.

[0118] Furthermore, in existing substrate liquid processing apparatuses, a constant pressure valve installed in the supply line is sometimes used to regulate the flow rate of the processing liquid in the supply line, thereby controlling the amount of processing liquid supplied to the nozzle. On the other hand, according to Figures 8-11 The liquid supply circuit 30 shown can use pressurized gas supplied from the pressurizing device 38 to the supply container 37 to change the supply amount of the processed liquid P to the nozzle 19. Therefore, according to this method, the liquid supply circuit 30 does not require a constant pressure valve to be installed in the supply line L4.

[0119] [Second method for processing fluid supply system]

[0120] Figure 12 and Figure 13 This is a diagram illustrating a second approach to the treatment fluid supply system. Figure 12 and Figure 13 Some structural elements are omitted from the illustration. For example, this method includes a heating unit for heating the processing liquid P (i.e., Figure 3 The first heating part 35 and the second heating part 36), but Figure 12 and Figure 13 Illustrations have been omitted. Furthermore, detailed explanations of the structure and function of the already described elements have been omitted.

[0121] The liquid supply circuit 30 of this embodiment also has the same supply container 37, pressurizing device 38, nozzle 19, and supply line L4 as the liquid supply circuit 30 of the first embodiment described above. That is, the processing liquid P is supplied to the inside of the supply container 37 via the guide line L2, the pressurizing device 38 pressurizes the inside of the supply container 37, and the nozzle 19 ejects the supplied processing liquid P. The supply line L4 is connected to the supply container 37 and the nozzle 19, and there is no adjustment mechanism for variably limiting the flow path connecting the supply container 37 and the nozzle 19.

[0122] The liquid supply circuit 30 of this embodiment also includes a supply injector 69. The supply injector 69 functions as a liquid flow switching mechanism and is located in the first branch section b1. Based on the flow of the processed liquid P in the first drain line L5, it switches whether the flow of the processed liquid P in the portion connecting the first branch section b1 and the nozzle 19 in the supply line L4 is allowed to switch. Specifically, the supply injector 69 can be configured as a suction device connecting the nozzle 19, the supply line L4, and the first drain line L5. The supply injector 69 can create a depressurized state at the nozzle 19 by utilizing the Venturi effect of the processed liquid P flowing from the supply line L4 to the first drain line L5.

[0123] The first drain line L5, which is connected to the first branch section b1, is connected to the supply line L4 in the supply injector 69. The first drain line L5 branches into a first branch drain line L5a equipped with a back pressure valve 42 and a second branch drain line L5b equipped with a drain on / off valve 43. The first branch drain line L5a and the second branch drain line L5b are connected to the storage unit 32 (e.g., Figures 4-7 The first storage container 47a) shown is connected.

[0124] The highest point of the first drain line L5 is positioned at the same height as the highest point of the supply line L4, or at a lower height than the highest point of the supply line L4. In particular, the first branch drain line L5a and the second branch drain line L5b are positioned at a lower height than the highest point of the supply line L4.

[0125] Back pressure valve 42 restricts the passage of processing fluid P with a pressure lower than the set pressure, wherein processing fluid P with a pressure higher than the set pressure is allowed to pass through, while processing fluid P with a pressure lower than the set pressure is not allowed to pass through. Drainage on / off valve 43 opens and closes the second branch drainage pipeline L5b under the control of control unit 93.

[0126] Under the control of the control unit 93, the back pressure valve 42 and the drain on / off valve 43 function as a flow regulating mechanism 40 for regulating the flow of the treatment fluid P in the first drain line L5. For example, when the second branch drain line L5b is opened by the drain on / off valve 43 (see...). Figure 12 The treated liquid P in the first drain line L5 is transported to the storage unit 32 via the second branch drain line L5b. Therefore, the treated liquid P in the first drain line L5 can be transported downstream smoothly with minimal pressure regulation. On the other hand, when the second branch drain line L5b is closed by the drain on / off valve 43 (see...), Figure 13 The back pressure valve 42 obstructs the flow of the treatment fluid P in the first drain line L5, so as to adjust the pressure of the treatment fluid P in the first drain line L5 to a pressure lower than the set pressure.

[0127] Other structures are similar to the liquid supply circuit 30 of the first method described above (refer to...). Figures 8-11 The same applies. For example, the nozzle 19 is located above the supply container 37 and the flow regulating mechanism 40 (specifically, the back pressure valve 42 and the drain valve 43).

[0128] For example, when adjusting the temperature of the processing liquid P, the liquid supply circuit 30 is set to a position under the control of the control unit 93. Figure 12 The state shown is as follows: the guide line L2 is opened by the guide on / off valve 33, the atmospheric open line L9 is closed by the atmospheric open valve 63, the gas line L3 is opened by the gas on / off valve 67, and the second branch drain line L5b is opened by the drain on / off valve 43.

[0129] In this state, the pressurized gas supplied from the gas supply unit 65 to the gas pipeline L3 is pressure-regulated by the pressure regulating unit 66, and then supplied to the supply container 37 after passing through the pressure filter 39. As a result, the inside of the supply container 37 is pressurized, and the treated liquid P is delivered from the supply container 37 to the supply pipeline L4. At this time, the pressurizing device 38 (especially the pressure regulating unit 66) pressurizes the inside of the supply container 37 so that the treated liquid P delivered from the supply container 37 to the supply pipeline L4 has a pressure higher than the aforementioned peak head pressure.

[0130] On the other hand, from storage unit 32 (e.g. Figures 4-7 The first storage container 47a) shown supplies the processing liquid P to the supply container 37 via the guide line L2. The control unit 93 controls the guide opening and closing valve 33 to open and close the guide line L2 based on the measurement results of the liquid volume measuring mechanism (not shown) installed in the supply container 37, so as to store an appropriate amount of processing liquid P in the supply container 37.

[0131] The processing liquid P flowing from the supply container 37 into the supply line L4 flows into the first drain line L5 through the first branch section b1 and is then transported to the storage unit 32 via the second branch drain line L5b. That is, the processing liquid P in the supply line L4 experiences a velocity increase in the supply injector 69 before flowing into the first drain line L5. On the other hand, the portion between the first branch section b1 and the nozzle 19 in the supply line L4 is depressurized. As a result, almost all of the processing liquid P in the supply line L4 flows into the first drain line L5 and is not supplied to the nozzle 19. Specifically, the gas surrounding the nozzle 19 flows into the supply line L4 through the nozzle 19, generating an airflow from the nozzle 19 to the first branch section b1.

[0132] The processed liquid P, delivered from the second branch drain line L5b to the storage unit 32, returns to the supply container 37 via the guide line L2. Thus, the liquid supply circuit 30 is in a state of... Figure 12 In the state shown, the processing liquid P supplied from the supply container 37 to the supply line L4 does not exit from the nozzle 19, but returns to the supply container 37 via the first drain line L5, the storage unit 32, and the guide line L2. The processing liquid P circulates in the liquid supply circuit 30 while simultaneously being heated in the heating zone (…). Figure 12 Illustrations omitted; please refer to the original text. Figure 3 The first heating zone Z1 and the second heating zone Z2 are heated and gradually heated to the desired temperature.

[0133] After the processing fluid P is adjusted to the desired temperature, when the processing fluid P is supplied to the nozzle 19 to be ejected from the nozzle 19, the liquid supply circuit 30 is set under the control of the control unit 93. Figure 13 The state shown.

[0134] That is, the second branch drain line L5b is closed by the drain on / off valve 43, and the guide line L2 is closed by the guide on / off valve 33. The opening and closing states of the atmospheric open line L9 and the gas line L3 are set to the same as those of the other lines. Figure 12 The same state is shown. Then, the pressurizing device 38 (especially the air pressure regulating unit 66) pressurizes the inside of the supply container 37 so that the treatment liquid P sent from the supply container 37 to the supply line L4 has a pressure higher than the peak head pressure.

[0135] As a result, the flow of the treatment fluid P in the supply line L4 is impeded by the back pressure valve 42, which regulates the pressure to the same level as the "set pressure above the peak head pressure". Consequently, the treatment fluid P also flows into the portion between the first branch section b1 and the nozzle 19 in the supply line L4 through the supply injector 69 and is supplied to the nozzle 19.

[0136] The treated liquid P, which flows into the first drain line L5 and passes through the back pressure valve 42, is transported to the storage unit 32 via the first branch drain line L5a.

[0137] Then, when the supply of treatment fluid P to nozzle 19 is stopped and the discharge of treatment fluid P from nozzle 19 ceases, gas line L3 is closed by gas on / off valve 67, and atmospheric open line L9 is opened by atmospheric open valve 63. As a result, the treatment fluid P in supply line L4 is adjusted to a pressure lower than the peak head pressure, and consequently, the treatment fluid P cannot reach the highest point in supply line L4, and is no longer supplied to nozzle 19.

[0138] Then, with the liquid supply circuit 30 in standby mode, the gas line L3 is closed by the gas on / off valve 67, the atmospheric opening line L9 is opened by the atmospheric opening valve 63, and the guide line L2 is opened by the guide on / off valve 33. As a result, the processing liquid P in the supply container 37 and the supply line L4 is neither supplied to the nozzle 19 nor circulated, but is supplied from the storage unit 32 to the supply container 37 via the guide line L2. The control unit 93 monitors the amount of processing liquid P stored in the supply container 37 based on the measurement results from the liquid volume measuring mechanism (not shown) installed in the supply container 37. Then, when the processing liquid P in the supply container 37 reaches an appropriate amount, the control unit 93 closes the guide line L2 using the guide on / off valve 33, stopping the supply of processing liquid P to the supply container 37.

[0139] [Heating zone and heating section]

[0140] Next, an example will be given to illustrate the specific method of heating the processing liquid P in the heating zone (especially the first heating zone Z1).

[0141] Figures 14-17 This is a partial cross-sectional view illustrating an example of the heating method in the first heating zone Z1 of the guide pipeline L2. The first heating unit 35 can heat the processing liquid P in the first heating zone Z1 using a temperature regulating liquid Q with a temperature higher than that of the processing liquid P in the first heating zone Z1.

[0142] If the guide pipe 71 constituting the guide line L2 is made of a material (e.g., PFA (polytetrafluoroethylene)) that allows the temperature regulating fluid Q used in the first heating section 35 to pass through, there is a concern that the temperature regulating fluid Q may mix into the processing fluid P of the guide line L2. To avoid this concern, for example... Figure 14 As shown, a liquid with the same composition as the processing liquid P flowing in the guide line L2 can be used as a temperature regulating liquid Q in the first heating section 35. In this case, even if the temperature regulating liquid Q enters the guide line L2 through the guide pipe 71, the composition of the processing liquid P flowing in the guide line L2 will not change, and a processing liquid P with a suitable composition can be supplied to the nozzle 19.

[0143] In addition, such as Figure 15 As shown, when the guide pipe 71 is made of a material (e.g., metal) that does not allow the temperature regulating liquid Q to pass through (preferably neither the treatment liquid P nor the temperature regulating liquid Q can pass through), the treatment liquid P with a suitable composition can also be supplied to the nozzle 19.

[0144] In addition, such as Figure 16 As shown, the guide pipe 71 constituting the guide line L2 may have an inner pipe 71a and an outer cladding 71b disposed outside the inner pipe 71a. In this case, it is preferable that at least one of the inner pipe 71a and the outer cladding 71b is made of a material that does not allow the processing fluid P to pass through. Furthermore, it is preferable that at least one of the inner pipe 71a and the outer cladding 71b is made of a material that does not allow the temperature regulating fluid Q to pass through. For example, if the inner pipe 71a is made of a material that allows the temperature regulating fluid Q to pass through, the outer cladding 71b is preferably made of a material that does not allow the temperature regulating fluid Q to pass through (preferably neither the processing fluid P nor the temperature regulating fluid Q passes through).

[0145] In addition, such as Figure 17 As shown, by using a liquid with a higher density than the treatment liquid P as the temperature control liquid Q, it is possible to prevent the temperature control liquid Q from passing through the guide pipe 71.

[0146] Figures 18-20 This is a schematic structural diagram illustrating an example of the heating method in the first heating zone Z1 of the guide pipe L2. Figure 18 and Figure 19 The diagram shows a temperature regulating container 75 with a guide pipe 71 located inside the temperature regulating container 75.

[0147] The first heating zone Z1 may include a spiral-shaped portion in the guide pipe 71 that forms the guide line L2. In this case, the first heating unit 35 that heats the processing liquid P in the first heating zone Z1 can be miniaturized, and the processing liquid P can be heated efficiently in a limited space.

[0148] The processing fluid P flowing in the guide line L2 may sometimes boil violently due to heating in the first heating zone Z1. When the processing fluid P boils violently, the pressure in the guide pipe 71 that constitutes the guide line L2 increases sharply, which may cause the guide pipe 71 to break.

[0149] To prevent damage to the guide pipe 71 caused by the boiling of the processing liquid P, the first heating unit 35 can use, for example, a storage container. Figure 18 The high-temperature temperature regulating liquid Q in the temperature regulating container 75 shown is used to heat the processing liquid P in the first heating zone Z1.

[0150] Figure 18 The first heating unit 35 shown includes a temperature regulating container 75, a flow path switching unit 74 connected to the temperature regulating container 75 via a regulating liquid supply line 76, and a gas-liquid discharge line 77 connected to the temperature regulating container 75. A guide pipe 71 constituting the guide line L2 passes through the temperature regulating container 75, and a first heating zone Z1 including the spiral-shaped portion of the guide pipe 71 is located inside the temperature regulating container 75. The flow path switching unit 74 is installed on the regulating liquid supply line 76 connected to the temperature regulating container 75, and a temperature regulating liquid supply unit 72 and a purge gas supply unit 73 are connected to the flow path switching unit 74. Under the control of the control unit 93, the flow path switching unit 74 can selectively introduce the temperature regulating liquid Q supplied from the temperature regulating liquid supply unit 72 and the purge gas (e.g., an inactive gas such as nitrogen) supplied from the purge gas supply unit 73 into the inside of the temperature regulating container 75. In this way, the temperature regulating fluid supply unit 72 and the purging gas supply unit 73 can be connected to the regulating fluid supply line 76 via the flow path switching unit 74. In addition, the temperature regulating container 75 is connected to the temperature regulating fluid supply unit 72 via the gas-liquid discharge line 77.

[0151] For example, when the processing fluid P is heated in the first heating zone Z1, the flow path switching unit 74, under the control of the control unit 93, transports the high-temperature temperature regulating fluid Q supplied from the temperature regulating fluid supply unit 72 to the temperature regulating container 75 via the regulating fluid supply line 76. As a result, the portion of the processing fluid P located inside the temperature regulating container 75 in the guide line L2 is heated by the temperature regulating fluid Q inside the temperature regulating container 75.

[0152] On the other hand, when the heating of the processing liquid P is stopped in the first heating zone Z1, the flow path switching unit 74, under the control of the control unit 93, transports the purge gas supplied from the purge gas supply unit 73 to the temperature regulating container 75 via the regulating liquid supply line 76. As a result, the temperature regulating liquid Q in the temperature regulating container 75 is forced out by the purge gas into the gas-liquid discharge line 77. The temperature regulating liquid Q discharged from the temperature regulating container 75 to the gas-liquid discharge line 77 is then transported to the temperature regulating liquid supply unit 72 via the gas-liquid discharge line 77.

[0153] In this manner, with temperature-regulating liquid Q stored in the temperature-regulating container 75, the flow path switching unit 74 introduces purge gas into the inside of the temperature-regulating container 75, thereby rapidly discharging the temperature-regulating liquid Q from the temperature-regulating container 75 to the gas-liquid discharge line 77. By rapidly discharging the temperature-regulating liquid Q from the temperature-regulating container 75 using purge gas, the heating of the processing liquid P in the first heating zone Z1 can be quickly stopped. This effectively prevents the processing liquid P in the guide line L2 (especially in and near the first heating zone Z1) from boiling over.

[0154] In addition, such as Figure 19 As shown, an overflow line L10 equipped with a relief valve 87 can be connected to the guide line L2. When the pressure of the processed liquid P in the guide line L2 is lower than the set overflow pressure of the relief valve 87, the relief valve 87 closes the overflow line L10. Conversely, when the pressure of the processed liquid P in the guide line L2 is higher than the set overflow pressure of the relief valve 87, the overflow line L10 is opened by the relief valve 87, and the processed liquid P flows from the guide line L2 to the overflow line L10. Therefore, even if boiling of the processed liquid P occurs in the guide line L2, excessive pressure in the guide line L2 can be prevented, thereby preventing damage to the guide piping 71.

[0155] Furthermore, the first heating unit 35 can be used instead of the temperature regulating liquid Q stored in the temperature regulating container 75. Figure 20 The electric heater 88 shown is used to heat the processing liquid P in the first heating zone Z1. Figure 20 In the example shown, an electric heater 88 is arranged in a spiral shape that runs through the guide pipe 71. The control unit 93 can switch the power supply to the electric heater 88 from ON to OFF to switch the heating and non-heating of the processing liquid P in the first heating zone Z1. From the viewpoint of preventing the processing liquid P from boiling over, the electric heater 88 preferably lowers the temperature quickly when switching from a heating state to a non-heating state. Therefore, the electric heater 88 is preferably a heater with a small heat capacity; for example, a halogen heater can be used as the electric heater 88.

[0156] [Temperature control of the treatment solution]

[0157] When a large amount of processing liquid P is stored in the supply container 37, it is difficult to maintain the temperature of the processing liquid P supplied from the supply container 37 to the supply line L4 at the desired temperature. In particular, the larger the amount of processing liquid P stored in the supply container 37, the more easily the temperature of the processing liquid P becomes higher or lower than the desired temperature. On the other hand, in order to stably perform liquid processing on the substrate W, it is preferable to stably adjust the processing liquid P in the supply line L4 to the desired temperature.

[0158] To adjust the temperature of the processing fluid P in the supply line L4 to the desired temperature, the processing fluid P stored in the supply container 37 can be adjusted to a temperature higher than the desired temperature. This can be achieved by adding a low-temperature processing fluid P to the supply line L4. For example, a coolant supply unit for supplying the low-temperature processing fluid P can be provided in at least either the supply container 37 or the supply line L4.

[0159] Figure 21 This is a diagram illustrating the first approach to a process fluid temperature control system.

[0160] In this method, the temperature of the processing fluid P is adjusted by supplying a processing fluid P with a temperature lower than the desired temperature from the coolant supply unit 101 to the supply container 37. That is, the coolant supply unit 101 for supplying the low-temperature processing fluid P is provided in the supply container 37. Figure 21 The coolant supply unit 101 shown includes a coolant supply section 102, a coolant on / off valve 103, a coolant flow meter 108, and a coolant filter 104.

[0161] The coolant supply unit 102 delivers a processing fluid P at a temperature lower than the desired temperature to the coolant line L11, which is connected to the inside of the supply container 37. The processing fluid P delivered by the coolant supply unit 102 to the coolant line L11 can have a temperature lower than the ambient temperature or the same as the ambient temperature.

[0162] The coolant on / off valve 103 opens and closes the coolant line L11 under the control of the control unit 93. When the coolant line L11 is closed by the coolant on / off valve 103, the low-temperature processing fluid P supplied from the coolant supply unit 102 to the coolant line L11 is not delivered to the supply container 37. Conversely, when the coolant line L11 is opened by the coolant on / off valve 103, the low-temperature processing fluid P supplied from the coolant supply unit 102 to the coolant line L11 is delivered to the supply container 37.

[0163] Cooling flow meter 108 measures the flow rate of the low-temperature processing fluid P flowing in the coolant line L11. The measurement result of cooling flow meter 108 is sent to control unit 93. Coolant filter 104 removes foreign matter from the processing fluid P while allowing it to pass through the coolant line L11.

[0164] A liquid temperature sensor 105 and a liquid level sensor 106 are provided in the supply container 37. The liquid temperature sensor 105 measures the temperature of the processed liquid P stored in the supply container 37. The liquid level sensor 106 measures the liquid level of the processed liquid P stored in the supply container 37. The measurement results of the liquid temperature sensor 105 and the liquid level sensor 106 are sent to the control unit 93.

[0165] In addition to the aforementioned guide line L2, atmospheric vent line L9, gas line L3, coolant line L11, and supply line L4, the supply container 37 is also connected to a third drain line L12. A temperature regulating valve 107 and a drain flow meter 109 are installed on the third drain line L12. The temperature regulating valve 107 opens and closes the third drain line L12 under the control of the control unit 93. The drain flow meter 109 measures the flow rate of the processed liquid P flowing in the third drain line L12. The measurement result of the drain flow meter 109 is sent to the control unit 93.

[0166] In this method, the control unit 93 controls the second heating unit 36 ​​to heat the processing liquid P stored in the supply container 37 (i.e., the second heating zone Z2) so that the temperature of the processing liquid P stored in the supply container 37 is higher than the desired temperature.

[0167] Furthermore, when the control unit 93 determines, based on the measurement result of the liquid temperature measuring sensor 105, that the processing liquid P in the supply container 37 has a temperature higher than the desired temperature, it discharges a predetermined amount of processing liquid P from the supply container 37 via the third drain line L12. That is, the control unit 93 controls the temperature regulating valve 107 to open the third drain line L12, discharging the high-temperature processing liquid P from the supply container 37 into the third drain line L12. When the control unit 93 determines, based on the measurement result of the drain flow meter 109, that the discharge amount of the high-temperature processing liquid P from the supply container 37 has reached a predetermined amount, it controls the temperature regulating valve 107 to close the third drain line L12.

[0168] On the other hand, low-temperature processing fluid P is supplied from the coolant supply unit 101 to the supply container 37 via the coolant line L11. That is, the control unit 93 controls the coolant on / off valve 103 to open the coolant line L11, supplying the low-temperature processing fluid P from the coolant supply unit 101 to the supply container 37. For example, when the second heating unit 36 ​​heats the processing fluid P in the second heating zone Z2 to a first temperature, the coolant supply unit 101 supplies the processing fluid P at a second temperature lower than the first temperature to the supply container 37. When the control unit 93 determines, based on the measurement result of the cooling flow meter 108, that the supply amount of low-temperature processing fluid P to the supply container 37 has reached a predetermined amount, it controls the coolant on / off valve 103 to close the coolant line L11.

[0169] By discharging high-temperature processing liquid P from the supply container 37 while simultaneously supplying low-temperature processing liquid P to the supply container 37, the temperature of the processing liquid P delivered from the supply container 37 to the supply line L4 can be stably adjusted to the desired temperature.

[0170] Furthermore, the amount of processed liquid P discharged from the supply container 37 via the third drain line L12 can be the same as or different from the amount of processed liquid P supplied to the supply container 37 via the coolant line L11. Additionally, the amount of processed liquid P discharged from the supply container 37 via the third drain line L12 can be a predetermined fixed amount, or an amount determined based on the measurement result of the liquid temperature measuring sensor 105. The amount of processed liquid P supplied to the supply container 37 via the coolant line L11 can be a fixed amount, an amount determined based on the amount of processed liquid P discharged from the supply container 37, or an amount determined based on the measurement result of the liquid temperature measuring sensor 105.

[0171] Figure 22 This is a diagram illustrating a second approach to the temperature control system for the processing fluid.

[0172] In this method, the temperature of the processing fluid P is adjusted by supplying a processing fluid P with a temperature lower than the desired temperature from the coolant supply unit 101 to the supply line L4. That is, the coolant line L11 is not connected to the supply container 37 but to the supply line L4, and the coolant supply unit 101 supplies the low-temperature processing fluid P to the supply line L4 via the coolant line L11.

[0173] Other structures are similar to the first method described above (see reference). Figure 21 )same.

[0174] In this method, the low-temperature processing liquid P flowing into the supply line L4 via the coolant line L11 is mixed with the high-temperature processing liquid P flowing into the supply line L4 from the supply container 37, and the processing liquid P is adjusted to the desired temperature in the supply line L4.

[0175] The amount of cryogenic processing fluid P supplied from the coolant supply unit 101 to the supply line L4 is determined based on the temperature and quantity of the processing fluid P flowing into the supply line L4 from the supply container 37. The control unit 93 obtains the temperature of the processing fluid P flowing into the supply line L4 from the supply container 37 based on the measurement results of the liquid temperature measuring sensor 105, and obtains the temperature of the processing fluid P flowing into the supply line L4 from the supply container 37 based on the measurement results of the flow meter 62. Based on the measurement results of the liquid temperature measuring sensor 105 and the flow meter 62, the control unit 93 determines the amount of cryogenic processing fluid P to be supplied from the coolant supply unit 101 to the supply line L4. Then, based on the measurement results of the cooling flow meter 108, while monitoring the amount of cryogenic processing fluid P supplied from the coolant supply unit 101 to the supply line L4, the control unit 93 controls the coolant on / off valve 103 to allow the determined amount of cryogenic processing fluid P to flow into the supply line L4.

[0176] In addition, in order to suppress the temperature unevenness of the treatment liquid P in the supply pipeline L4, it is preferable to stir the treatment liquid P.

[0177] Specifically, by stirring the treatment liquid P in the supply line L4, temperature unevenness of the treatment liquid P in the supply line L4 can be suppressed. For example, as... Figure 23 As shown, by providing a stirring body 116 (stirring section) inside the supply pipe 115 that constitutes the supply line L4, the treatment liquid P is stirred by the stirring body 116 while flowing in the supply line L4. The specific shape of the stirring body 116 is not limited, for example, the stirring body 116 can be constructed using a static mixer.

[0178] Furthermore, by stirring the treatment liquid P in the supply container 37, temperature unevenness of the treatment liquid P in the supply container 37 and the supply line L4 can be suppressed. For example, as Figure 24 As shown, pressurized gas N supplied from pressurizing device 38 via gas line L3 can be used to agitate the treatment liquid P in supply container 37. Figure 24 In the example shown, pressurized gas N is ejected from one end of the gas pipeline L3 (stirring section) while it is in the processing liquid P inside the supply container 37.

[0179] Furthermore, by reducing the height (i.e., vertical dimension) or width (i.e., horizontal dimension) of the supply container 37, temperature unevenness of the treatment liquid P in the supply line L4 can also be suppressed. For example, as Figure 25As shown, the second heating element 36 can be arranged to surround the supply container 37 from above, below, and horizontally, and the height of the supply container 37 can be reduced while its width can be increased. In this case, the portion of the processing liquid P stored in the supply container 37 that is far from the second heating element 36 can be reduced, thus preventing uneven heating of the processing liquid P.

[0180] Furthermore, since the temperature of the processing liquid P inside the supply container 37 is easily affected by the ambient temperature, it is difficult to stably maintain the temperature of the processing liquid P supplied from the supply container 37 to the supply line L4 at the desired temperature. Therefore, the supply container 37 preferably has a structure that makes the temperature of the processing liquid P inside the supply container 37 less susceptible to the influence of the ambient temperature.

[0181] For example, such as Figure 26 As shown, the supply container 37 may have a heat insulation part 37c, which reduces the heat movement and heat transfer between the processing liquid P inside the supply container 37 and the surrounding area of ​​the supply container 37. Figure 26 The supply container 37 shown has an internal structure 37a for storing the processing liquid P on its inner side, an external structure 37b disposed outside the internal structure 37a, and a heat insulation portion 37c disposed between the internal structure 37a and the external structure 37b. Compared to the internal structure 37a, the heat insulation portion 37c exhibits a value that is difficult to transfer heat, for example, in at least one of thermal conductivity, thermal diffusivity, thermal diffusivity, and thermal transfer coefficient. The heat insulation portion 37c can be made of any gas, liquid, and / or solid, or it can be made of the same gas (e.g., air) as the gas surrounding the supply container 37. Figure 26 The supply container 37 shown is integrated with the second heating part 36, which is installed in the internal structure 37a.

[0182] It should be noted that the embodiments disclosed in this specification are merely illustrative in all respects and should not be interpreted as limiting. The above embodiments and modifications can be omitted, substituted, and changed in various ways without departing from the scope and spirit of the invention. For example, the above embodiments and modifications can be combined, or can be combined with embodiments other than those described above.

[0183] Furthermore, the types of technology used to implement the above-described technical ideas are not limited. For example, the substrate liquid treatment apparatus described above can also be applied to other apparatuses. Alternatively, the above-described technical ideas can be implemented using a computer program that causes a computer to execute one or more steps included in the above-described substrate liquid treatment method. Furthermore, the above-described technical ideas can be implemented using a computer-readable non-transitory recording medium that records such a computer program.

Claims

1. A substrate liquid treatment apparatus, characterized in that, include: The treatment fluid is supplied to the inside of the supply container via a guide line; A pressurizing device for pressurizing the inside of the supply container; The nozzle that sprays out the supplied treatment fluid; The supply line, which is connected to the supply container and the nozzle, is not provided with an adjustment mechanism that variably restricts the flow path connecting the supply container and the nozzle. The first drain line is connected to the first branch portion of the supply line between the supply container and the nozzle. A flow regulating mechanism is provided in the first drain line to restrict the passage of the treatment liquid with a pressure lower than the set pressure. The control unit adjusts the set pressure; as well as The storage unit is connected to the supply container via a guide pipeline. The storage unit includes: a plurality of storage containers; a plurality of circulation lines connecting the plurality of storage containers to each other; a filter for removing foreign matter from the treatment liquid flowing from at least any of the plurality of circulation lines; and a circulation regulating mechanism for circulating the treatment liquid among the plurality of storage units via the plurality of circulation lines.

2. The substrate liquid treatment apparatus as described in claim 1, characterized in that: The nozzle is located above both the supply container and the liquid flow regulating mechanism. The control unit, When the treatment fluid is supplied to the nozzle, the set pressure is adjusted to be above the peak head pressure, wherein the peak head pressure is the pressure head at the highest point of the supply line from the supply container to the nozzle. Without supplying the treatment fluid to the nozzle, the set pressure is adjusted to be lower than the peak head pressure.

3. The substrate liquid treatment apparatus as described in claim 1, characterized in that, include: A second drain line connected to the supply line; and A suction mechanism, disposed on the second drain line, is capable of switching between a suction mode in which the supply line is suctioned via the second drain line and a non-suction mode in which the supply line is not suctioned via the second drain line. The control unit adjusts the suction mechanism to the suction mode at least temporarily when the treatment liquid is not supplied to the nozzle.

4. The substrate liquid treatment apparatus as described in claim 3, characterized in that: The suction mechanism includes: a mode switching valve disposed on the second drain line; a negative pressure container connected to the second drain line; and a negative pressure regulator for adjusting the negative pressure container to a negative pressure state. The control unit, The mode switching valve is controlled to close the flow path of the second drain line between the supply line and the negative pressure container, thereby adjusting the suction mechanism to the non-suction mode. The mode switching valve is controlled to open the flow path of the second drain line between the supply line and the negative pressure container, thereby adjusting the suction mechanism to the suction mode.

5. The substrate liquid treatment apparatus as described in claim 3, characterized in that: This includes a liquid detection sensor that detects whether the processing liquid is present at a first measuring point in the supply line located downstream of the first branch. The control unit switches the suction mechanism from the suction mode to the non-suction mode based on the detection result of the liquid detection sensor.

6. The substrate liquid treatment apparatus as described in claim 1, characterized in that: Includes a flow meter that measures the flow rate of the processed liquid in the supply line at a second measuring point located downstream of the first branch. The control unit adjusts the set pressure based on the measurement results of the flow meter.

7. A substrate liquid treatment apparatus, characterized in that, include: The treatment fluid is supplied to the inside of the supply container via a guide line; A pressurizing device for pressurizing the inside of the supply container; The nozzle that sprays out the supplied treatment fluid; The supply line, which is connected to the supply container and the nozzle, is not provided with an adjustment mechanism that variably restricts the flow path connecting the supply container and the nozzle. The first drain line is connected to the first branch portion of the supply line between the supply container and the nozzle. A flow regulating mechanism that regulates the flow of the treatment liquid in the first drain line; A flow switching mechanism is provided in the first branch section, which switches whether to allow the flow of the treatment liquid in the supply line connecting the first branch section and the nozzle, according to the flow of the treatment liquid in the first drain line. The control unit that controls the fluid flow regulating mechanism; as well as The storage unit is connected to the supply container via a guide pipeline. The storage unit includes: a plurality of storage containers; a plurality of circulation lines connecting the plurality of storage containers to each other; a filter for removing foreign matter from the treatment liquid flowing from at least any of the plurality of circulation lines; and a circulation regulating mechanism for circulating the treatment liquid among the plurality of storage units via the plurality of circulation lines.

8. The substrate liquid treatment apparatus as described in claim 7, characterized in that: It includes a movable arm, the fluid switching mechanism and the nozzle are mounted on the arm.

9. The substrate liquid treatment apparatus according to any one of claims 1 to 8, characterized in that, include: An open-atmosphere pipeline connecting the inside of the supply container to the surrounding environment of the supply container; and An atmospheric opening valve is installed in the atmospheric opening pipeline. When the treatment fluid is supplied to the nozzle, the control unit controls the atmospheric opening valve to close the atmospheric opening pipeline.

10. The substrate liquid treatment apparatus according to any one of claims 1 to 8, characterized in that: The first drainage line is connected to at least one of the plurality of storage containers. The treatment liquid, after passing through the liquid flow regulating mechanism, flows into at least one of the plurality of storage containers via the first drain line.

11. The substrate liquid treatment apparatus according to any one of claims 1 to 8, characterized in that: The pressurizing device includes: a gas supply unit that allows gas to flow in a gas pipeline connected to the inside of the supply container; and a pressure regulating unit that regulates the pressure of the gas flowing in the gas pipeline. The air pressure regulating unit is an electric pneumatic regulator.

12. The substrate liquid treatment apparatus according to any one of claims 1 to 8, characterized in that, include: A heating unit that heats the processing liquid in a heating zone located in at least one of the guide line and the supply container; and A filter that removes foreign matter from the portion of the treatment liquid flowing upstream of the heating zone in the flow path of the treatment liquid. In the flow path of the treatment fluid from the guide line to the nozzle, there is no filter for removing foreign matter from the treatment fluid in the heating zone and in the flow path downstream of the heating zone.

13. The substrate liquid treatment apparatus as described in claim 12, characterized in that: The heating zone includes a first heating zone located in the guide pipeline. The heating unit includes a first heating unit for heating the processing liquid in the first heating zone. The first heating unit uses a temperature regulating liquid with a temperature higher than that of the processing liquid in the first heating zone to heat the processing liquid in the first heating zone.

14. The substrate liquid treatment apparatus as described in claim 13, characterized in that: The first heating element includes: A temperature regulating container, wherein the first heating zone is located inside the temperature regulating container; A flow path switching unit selectively introduces the temperature regulating liquid and purge gas into the inner side of the temperature regulating container; and The gas-liquid discharge pipeline connected to the temperature regulating container, With the temperature regulating liquid stored in the temperature regulating container, the flow path switching unit introduces the purging gas into the inside of the temperature regulating container, thereby discharging the temperature regulating liquid from the temperature regulating container to the gas-liquid discharge pipeline.

15. The substrate liquid treatment apparatus as described in claim 12, characterized in that: This includes an overflow line connected to the guide line and equipped with an overflow valve.

16. The substrate liquid treatment apparatus as described in claim 12, characterized in that: The heating element includes an electric heater.

17. The substrate liquid treatment apparatus as described in claim 12, characterized in that: It includes a coolant supply unit that supplies the processing fluid to at least one of the supply container and the supply pipeline. The heating zone includes a second heating zone located in the supply container. The heating unit includes a second heating unit that heats the processing liquid in the second heating zone to a first temperature. The coolant supply unit supplies the processing fluid at a second temperature lower than the first temperature to at least one of the supply container and the supply pipeline.

18. The substrate liquid treatment apparatus as described in claim 12, characterized in that: It includes a stirring unit that stirs the treatment liquid in at least one of the supply container and the supply line.

19. The substrate liquid treatment apparatus as described in claim 12, characterized in that: The heating element is arranged to surround the supply container from above, below, and horizontally.

20. The substrate liquid treatment apparatus according to any one of claims 1 to 8, characterized in that: The supply container includes a heat insulation section.

21. A method for treating a substrate solution, characterized in that: The substrate liquid treatment apparatus includes: a supply container into which a treatment liquid is supplied via a guide line; a pressurizing device for pressurizing the inside of the supply container; a nozzle for ejecting the supplied treatment liquid; a supply line connected to the supply container and the nozzle, without a regulating mechanism for variably restricting the flow path connecting the supply container and the nozzle; a first drain line connected to a first branch portion of the supply line between the supply container and the nozzle; a flow regulating mechanism disposed on the first drain line for restricting the passage of the treatment liquid at a pressure lower than a set pressure; and a storage unit connected to the supply container via the guide line, the storage unit including: a plurality of storage containers; a plurality of circulation lines connecting the plurality of storage containers to each other; a filter for removing foreign matter from the treatment liquid flowing in at least one of the plurality of circulation lines; and a circulation regulating mechanism for circulating the treatment liquid among the plurality of storage units via the plurality of circulation lines. The substrate liquid treatment method includes: In the substrate liquid treatment apparatus, the step of pressurizing the inside of the supply container using the pressurizing device to supply the treatment liquid from the supply container to the nozzle via the supply line; and The step of circulating the treatment liquid among the plurality of storage containers via the plurality of circulation pipelines.

22. A method for treating a substrate solution, characterized in that: The substrate liquid treatment apparatus includes: a supply container, into which the treatment liquid is supplied via a guide line; a pressurizing device for pressurizing the inside of the supply container; a nozzle for ejecting the supplied treatment liquid; a supply line connected to the supply container and the nozzle, without an adjustment mechanism for variably restricting the flow path connecting the supply container and the nozzle; a first drain line connected to a first branch portion of the supply line between the supply container and the nozzle; a flow regulation mechanism for regulating the flow of the treatment liquid in the first drain line; and a flow switching mechanism. Located at the first branch section, the system switches whether to allow the treatment liquid to flow in the portion of the supply line connecting the first branch section and the nozzle, based on the flow of the treatment liquid in the first drain line; and a storage unit connected to the supply container via a guide line, the storage unit comprising: a plurality of storage containers; a plurality of circulation lines connecting the plurality of storage containers to each other; a filter for removing foreign matter from the treatment liquid flowing in at least any of the plurality of circulation lines; and a circulation regulating mechanism for circulating the treatment liquid among the plurality of storage units via the plurality of circulation lines. The substrate liquid treatment method includes: In the substrate liquid treatment apparatus, the steps of pressurizing the inside of the supply container using the pressurizing device and supplying the treatment liquid from the supply container to the nozzle via the supply line; and The step of circulating the treatment liquid among the plurality of storage containers via the plurality of circulation pipelines.

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