A thermal buffer

By designing a thermal buffer containing a foam metal plate and a partition with a low melting point alloy, the problem of low heat storage rate in the prior art is solved, and efficient protection of electronic devices is achieved.

CN115529807BActive Publication Date: 2025-03-21CHINA UNIV OF PETROLEUM (EAST CHINA)
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Patent Information

Application Number
CN202211271098.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-10-17
Publication Date
2025-03-21
Estimated Expiration
2042-10-17

AI Technical Summary

Technical Problem

The existing technology cannot effectively meet the efficient heat dissipation needs of bullet-mounted electronic equipment. The sensible thermal energy storage technology has low energy storage density, and the poor thermal conductivity of the phase change latent heat storage technology has led to a low heat storage rate.

Method used

A thermal buffer is designed, including a top cover, an encapsulation substrate, a bottom plate and a partition. The partition consists of a foam metal plate and a low melting point alloy to separate the aqueous solvent and the solute storage chamber, and uses the latent heat of the phase change of the low melting point alloy and the dissolved heat of the solute and the water solvent to absorb heat.

Benefits of technology

It effectively improves the heat storage rate and realizes effective protection of electronic equipment. It is suitable for bomb loading and other short-term electronic equipment.

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Abstract

The present invention discloses a thermal buffer, which relates to the field of heat dissipation of electronic equipment, including a top cover, a packaging substrate, a bottom plate and a partition, wherein the packaging substrate is a hollow structure with upper and lower ends open, the bottom plate is arranged at the lower end of the packaging substrate, the top cover is arranged at the upper end of the packaging substrate, a cavity is formed between the top cover, the packaging substrate and the bottom plate, the partition is arranged in the cavity and divides the cavity into at least two accommodating cavities, any two adjacent accommodating cavities are respectively used to place a water solvent and a solute capable of dissolving and absorbing heat, and the partition includes a foam metal plate and a low melting point alloy filled in the foam metal plate. The present invention utilizes the phase change latent heat of the low melting point alloy and the dissolution heat of the solute and the water solvent to absorb the heat generated by the electronic equipment, which can effectively improve the heat storage rate and realize effective protection of the electronic equipment.
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