Bone conduction earphone

Abstract

The application discloses a bone conduction earphone, which comprises an ear hanging assembly and a core module, the core module is arranged at one end of the ear hanging assembly, the ear hanging assembly comprises an ear hanging shell, the core module comprises a core shell and a core, one end of the core shell is open to form a cavity structure for accommodating the core; the elastic modulus of the core shell is greater than that of the ear hanging shell.

Description

[0001] Cross-referencing

[0002] This application claims priority to Chinese applications 202020720127.1, 202020720129.0 and 202010367107.5, all filed on April 30, 2020, the contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of bone conduction technology, specifically to a bone conduction headphone. Background Technology

[0004] Bone conduction is a sound transmission method that converts electrical signals into mechanical vibrations, which are then transmitted through the skull, bony labyrinth, inner ear fluid, cochlea, auditory nerve, and auditory cortex of the brain to achieve sound wave transmission. Bone conduction headphones utilize this technology, fitting snugly against the skull, allowing sound waves to travel directly through the bone to the auditory nerve without passing through the external auditory canal and eardrum, thus "liberating" both ears. Summary of the Invention

[0005] This application provides a bone conduction headphone, which includes an ear hook assembly and a core module. The core module is disposed at one end of the ear hook assembly. The ear hook assembly includes an ear hook housing, and the core module includes a core housing and a core. One end of the core housing is open, forming a cavity structure for accommodating the core. The elastic modulus of the core housing is greater than that of the ear hook housing.

[0006] In some embodiments, the ear hook housing includes an earphone fixing part, a bending transition part, and a receiving compartment connected in sequence. The earphone fixing part covers the opening end of the main body housing and is provided with a reinforcing structure so that the ratio of the difference between the stiffness of the skin contact area of ​​the main body housing and the stiffness of the earphone fixing part to the stiffness of the skin contact area of ​​the main body housing is less than or equal to 10%.

[0007] In some embodiments, the reinforcing structure includes reinforcing ribs disposed on the headphone fixing portion.

[0008] In some embodiments, the number of reinforcing ribs is multiple, and the multiple reinforcing ribs are arranged side by side or in a grid pattern.

[0009] In some embodiments, the earphone fixing part has a major axis direction and a minor axis direction, the dimension of the earphone fixing part along the major axis direction is larger than the dimension along the minor axis direction, and a plurality of reinforcing ribs are respectively arranged along the major axis direction and the minor axis direction to form a grid; or, a plurality of reinforcing ribs extend along the minor axis direction in a strip-like manner and are arranged side by side along the major axis direction.

[0010] In some embodiments, the ratio between the thickness of the reinforcing rib and the thickness of the earphone fixing part is within the closed interval [0.8, 1.2].

[0011] In some embodiments, the ratio between the width of the reinforcing rib and the thickness of the earphone fixing part is within the closed interval [0.4, 0.6].

[0012] In some embodiments, the ratio between the spacing of the reinforcing ribs and the thickness of the earphone fixing part is within the closed interval [1.6, 2.4].

[0013] In some embodiments, the thickness of the reinforcing rib is the same as the thickness of the earphone fixing part.

[0014] In some embodiments, the width of the reinforcing rib is half the thickness of the earphone fixing part.

[0015] In some embodiments, the spacing of the reinforcing ribs is twice the thickness of the earphone fixing portion.

[0016] In some embodiments, there are multiple reinforcing ribs, and the multiple reinforcing ribs are arranged radially around a preset reference point on the earphone fixing part.

[0017] In some embodiments, the ends of the plurality of reinforcing ribs are spaced apart from each other, and the extension lines of the plurality of reinforcing ribs intersect at the preset reference point.

[0018] In some embodiments, the reinforcing structure is a metal component, and the reinforcing structure and the earphone fixing part are integrally molded metal inserts.

[0019] In some embodiments, the housing includes a bottom wall and an annular peripheral wall. The bottom wall includes a skin contact area of ​​the housing. One end of the annular peripheral wall is integrally connected to the bottom wall. The earphone fixing part includes a fixing body connected to the bent transition part and an annular flange integrally connected to the fixing body and extending toward the housing. The annular flange and the other end of the annular peripheral wall away from the bottom wall are abutted against each other. The reinforcing structure includes an arcuate structure disposed between the fixing body and the annular flange; or, the reinforcing structure is a thickening layer integrally disposed with the fixing body.

[0020] In some embodiments, the ear hook housing includes an elastic metal wire disposed within the earphone fixing portion, the bending transition portion, and / or the receiving compartment.

[0021] In some embodiments, the reinforcing structure is made of any one of polycarbonate, polyamide, or acrylonitrile-butadiene-styrene copolymer.

[0022] In some embodiments, the movement module further includes a cover plate covering the opening of the movement housing, and the ear loop housing is connected to the cover plate; wherein the elastic modulus of the cover plate is greater than the elastic modulus of the ear loop housing.

[0023] In some embodiments, the elastic modulus of the cover plate is less than or equal to the elastic modulus of the movement housing.

[0024] In some embodiments, the movement housing includes a bottom wall and an annular peripheral wall, one end of the annular peripheral wall is integrally connected to the bottom wall, and a cover plate is disposed over the other end of the annular peripheral wall and is disposed opposite to the bottom wall, wherein at least a portion of the bottom wall is in contact with the user's skin; wherein the ratio of the difference between the stiffness of the bottom wall and the stiffness of the cover plate to the stiffness of the bottom wall is less than or equal to 10%.

[0025] In some embodiments, the area of ​​the bottom wall is less than or equal to the area of ​​the cover plate, and the thickness of the bottom wall is less than or equal to the thickness of the cover plate.

[0026] In some embodiments, the material of the cover plate is the same as that of the movement housing, and the ratio of the thickness to the area of ​​the cover plate to the ratio of the thickness to the area of ​​the bottom wall is greater than or equal to 90%.

[0027] In some embodiments, the ratio of the thickness to the area of ​​the bottom wall is equal to the ratio of the thickness to the area of ​​the cover plate.

[0028] In some embodiments, the ear hook housing includes a accommodating compartment, a bending transition portion, and an earphone fixing portion. The accommodating compartment is used to accommodate a battery or a main control circuit board. The bending transition portion connects the accommodating compartment and the earphone fixing portion and is bent to be hung on the outside of the ear. The earphone fixing portion covers the side of the cover plate away from the main housing.

[0029] In some embodiments, the earphone fixing part and the cover plate are connected by adhesive bonding or a combination of snap-fit ​​and adhesive bonding.

[0030] In some embodiments, the cover plate is completely covered by the earphone fixing part, and the adhesive disposed between the earphone fixing part and the cover plate has a filling degree greater than or equal to 90%.

[0031] In some embodiments, the cover plate has a button receiving groove on the side opposite to the mechanism housing. The ear hook assembly also includes a button and a decorative element. The decorative element includes a decorative bracket, which is mounted and fixed on one side of the ear hook housing. The earphone fixing part has a button adapter hole. The button is disposed in the button receiving groove and exposed through the button adapter hole. The decorative bracket extends in a cantilever form above the button exposed through the button adapter hole and can trigger the button under external pressure.

[0032] In some embodiments, the cover plate has a microphone receiving groove on the side opposite to the core housing, and the core module further includes a first microphone and a second microphone. The first microphone is housed in the core housing, and the second microphone is disposed in the microphone receiving groove and covered by the earphone fixing part.

[0033] In some embodiments, the cover plate is made of any one or more of polycarbonate, polyamide, and acrylonitrile-butadiene-styrene mixed with glass fiber and / or carbon fiber.

[0034] In some embodiments, the ear hook shell is made of any one of polycarbonate, polyamide, or acrylonitrile-butadiene-styrene copolymer.

[0035] In some embodiments, the material of the movement housing is any one or more of polycarbonate, polyamide, and acrylonitrile-butadiene-styrene mixed with glass fiber and / or carbon fiber.

[0036] The beneficial effects of this application include: the bone conduction headphones provided by this application have a reinforcing structure on the earphone fixing part of the ear hook shell, so that when the elastic modulus of the core shell is greater than the elastic modulus of the ear hook shell, the ratio of the difference between the stiffness of the skin contact area of ​​the core shell and the stiffness of the earphone fixing part to the stiffness of the skin contact area of ​​the core shell is less than or equal to 10%. This can ensure that the core shell has sufficient stiffness so that its resonant frequency is located in the highest possible high frequency range, and can also reduce the stiffness difference between the earphone fixing part and the core shell to increase the resonant frequency of the structure and improve the sound leakage of the bone conduction headphones.

[0037] The beneficial effects of this application also include: the bone conduction headphones provided by this application use a cover plate to connect with the core housing instead of the ear hook housing, and the elastic modulus of the core housing is greater than that of the ear hook housing, and the elastic modulus of the cover plate is greater than that of the ear hook housing, so as to increase the stiffness of the relevant structure located at the opening end of the core housing. This can ensure that the core housing has sufficient stiffness so that its resonant frequency is located in the highest possible high frequency range, and can also reduce the stiffness difference between the relevant structure located at the opening end of the core housing and the core housing to increase the resonant frequency of the structure and improve the sound leakage of the bone conduction headphones. Attached Figure Description

[0038] This application will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting; in these embodiments, the same reference numerals denote the same structures, wherein:

[0039] Figure 1 This is an exploded structural diagram of a bone conduction headphone according to some embodiments of this application;

[0040] Figure 2 As shown in some embodiments of this application Figure 1 Exploded view of the middle ear hook assembly;

[0041] Figure 3 As shown in some embodiments of this application Figure 2 Schematic diagram of the middle ear hook shell;

[0042] Figure 4 As shown in some embodiments of this application Figure 1 Exploded view of the middle ear hook assembly;

[0043] Figure 5 As shown in some embodiments of this application Figure 4 Schematic diagram of the middle ear hook shell;

[0044] Figure 6 As shown in some embodiments of this application Figure 4 A schematic diagram of the structure of the decorative bracket near the ear hook housing;

[0045] Figure 7 As shown in some embodiments of this application Figure 4 A schematic diagram illustrating the principle of the trigger button on the decorative bracket;

[0046] Figure 8 As shown in some embodiments of this application Figure 1 Exploded view of the central mechanism module;

[0047] Figure 9The frequency response curves of bone conduction headphones are shown in some embodiments of this application;

[0048] Figure 10 As shown in some embodiments of this application Figure 8 A cross-sectional schematic diagram of the reinforcing structure provided on the middle ear hook shell;

[0049] Figure 11 As shown in some embodiments of this application Figure 8 A top view of the reinforcing structure installed on the middle ear hook shell;

[0050] Figure 12 As shown in some embodiments of this application Figure 10 and Figure 11 Frequency response curves corresponding to various reinforcement structures;

[0051] Figure 13 As shown in some embodiments of this application Figure 8 A cross-sectional view of the central movement module along direction II after assembly;

[0052] Figure 14 As shown in some embodiments of this application Figure 8 Schematic diagram of the central movement support structure;

[0053] Figure 15 As shown in some embodiments of this application Figure 8 A top view of the assembled central movement module;

[0054] Figure 16 As shown in some embodiments of this application Figure 1 Exploded view of the central mechanism module;

[0055] Figure 17 As shown in some embodiments of this application Figure 14 Frequency response curves of structures corresponding to different types of colloids are set between the middle ear hook assembly and the cover plate;

[0056] Figure 18 As shown in some embodiments of this application Figure 16 A cross-sectional view of the central mechanism module along the II-II direction after assembly;

[0057] Figure 19 As shown in some embodiments of this application Figure 16 A schematic diagram of the structure of the middle cover plate near the movement housing;

[0058] Figure 20 As shown in some embodiments of this application Figure 19 Top view of the middle cover plate;

[0059] Figure 21 As shown in some embodiments of this application Figure 16 Another perspective of the exploded structure of the central movement module;

[0060] Figure 22 As shown in some embodiments of this application Figure 21 Top view of the middle cover plate;

[0061] Figure 23 This is a schematic diagram of the movement according to some embodiments of this application;

[0062] Figure 24 As shown in some embodiments of this application Figure 23 A schematic diagram showing the relationship between the force coefficient BL of the magnet in the middle;

[0063] Figure 25 As shown in some embodiments of this application Figure 23 A schematic diagram showing the relationship between the thickness of the magnetic shield and the magnetic plate and the force coefficient BL.

[0064] Figure 26 As shown in some embodiments of this application Figure 23 A schematic diagram showing the relationship between the height of the intermediate magnetic shield and the force coefficient BL.

[0065] Figure 27 As shown in some embodiments of this application Figure 1 A schematic diagram of the bone conduction headphones when not being worn.

[0066] Figure 28 As shown in some embodiments of this application Figure 1 A schematic diagram of the cross-sectional structure of the mid-rear suspension assembly along the III-III direction. Detailed Implementation

[0067] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some examples or embodiments of this application. For those skilled in the art, these drawings can be applied to other similar scenarios without creative effort. Unless obvious from the context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations. It should be understood that the drawings are for illustrative and descriptive purposes only and are not intended to limit the scope of this application. It should be understood that the drawings are not drawn to scale.

[0068] It should be understood that, for the convenience of describing this application, the terms "center", "upper surface", "lower surface", "upper", "lower", "top", "bottom", "inner", "outer", "axial", "radial", "outer periphery", "external", etc., indicate the positional relationship based on the positional relationship shown in the accompanying drawings, and do not indicate that the device, component or unit referred to must have a specific positional relationship, and should not be construed as a limitation of this application.

[0069] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" do not specifically refer to the singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0070] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be particularly noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present application.

[0071] The reference to "embodiment" in this application means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0072] like Figures 1 to 5 As shown, the bone conduction headphones 10 may include two core modules 20, two ear hook assemblies 30, a back hook assembly 40, a main control circuit board 50, and a battery 60. In some embodiments, one end of each of the two ear hook assemblies 30 is connected to a corresponding core module 20, and both ends of the back hook assembly 40 are connected to the other ends of the two ear hook assemblies 30 away from the core modules 20. In some embodiments, the two ear hook assemblies 30 are used to hang on the outside of the user's two ears, and the back hook assembly 40 is used to wrap around the back of the user's head to meet the user's needs for wearing the bone conduction headphones 10. This arrangement ensures that when the bone conduction headphones 10 are worn, the two core modules 20 are located on the left and right sides of the user's head, respectively; and with the cooperation of the two ear hook assemblies 30 and the back hook assembly 40, the two core modules 20 can hold the user's head and contact the user's skin, thereby enabling sound transmission based on bone conduction technology.

[0073] In some embodiments, the main control circuit board 50 and the battery 60 may be disposed within the same ear hook assembly 30; alternatively, they may be disposed within two separate ear hook assemblies 30, the specific structures of which will be described in detail later. In some embodiments, both the main control circuit board 50 and the battery 60 can be connected via conductors ( Figures 1 to 5 (Not shown in the image) is connected to two core modules 20. The former can be used to control the sound output of the core module 20 (e.g., converting electrical signals into mechanical vibrations), while the latter can be used to provide power to the bone conduction headphones 10 (e.g., there may be two core modules 20). Of course, the bone conduction headphones 10 described in this application may also include microphones, pickups, and other microphones, as well as communication components such as Bluetooth. These can also be connected to the main control circuit board 50 and the battery 60 via wires to achieve corresponding functions.

[0074] It should be noted that two mechanism modules 20 are provided in this application, and both mechanism modules 20 can produce sound. This is mainly to facilitate the bone conduction headphones 10 to achieve stereo sound effects, thereby improving the user experience of the bone conduction headphones 10. Therefore, in some other application scenarios where stereo sound requirements are not particularly high, such as hearing aids for hearing-impaired patients and live broadcast prompts for presenters, the bone conduction headphones 10 may only have one mechanism module 20. In some embodiments, the conductor may be a wire, used to achieve electrical connection between the various electronic components of the bone conduction headphones 10; if multiple circuits require electrical connection, the conductor may be configured as multi-strand wires accordingly.

[0075] like Figure 2 As shown, the ear hook assembly 30 may include an ear hook housing 31 and a decorative element 32, which can be connected by one or a combination of assembly methods such as adhesive bonding, snap-fit, and threaded connection. In some embodiments, when the bone conduction headphones 10 are in the wearing state, the decorative element 32 is located on the side of the ear hook housing 31 away from the core module 20, that is, on the outside of the bone conduction headphones 10, so that the decorative element 32 can decorate the ear hook housing 31, thereby increasing the aesthetic appearance of the bone conduction headphones 10. At this time, the decorative element 32 may protrude from the ear hook housing 31 or be embedded in the ear hook housing 31. In some embodiments, the decorative element 32 may be, but is not limited to, a sticker, a plastic part, a metal part, etc., and may be printed with geometric patterns, cartoon patterns, logo patterns, etc., or coated with fluorescent materials, reflective materials, etc., to achieve the corresponding decorative effect.

[0076] like Figure 2 and Figure 3As shown, the ear hook housing 31 may include an earphone fixing part 311, a bending transition part 312, and a receiving compartment 313 connected in sequence. In some embodiments, the earphone fixing part 311 may be used to fix the core module 20, and the cooperation between the two will be described in detail later. The bending transition part 312 may be used to connect the receiving compartment 313 and the earphone fixing part 311, and is bent to hang on the outside of the ear. In some embodiments, the end of the receiving compartment 313 away from the earphone fixing part 311 may be connected to the rear hanging assembly 40 by one or a combination of assembly methods such as adhesive bonding, snap-fit, and threaded connection, so as to facilitate the assembly between the ear hook assembly 30 and the rear hanging assembly 40. In some embodiments, one end of the receiving compartment 313 is open to accommodate the main control circuit board 50 or the battery 60. In some embodiments, the ear hook housing 31 may also include a compartment cover 314, which covers the open end of the receiving compartment 313.

[0077] In some embodiments, when the accommodating compartment 313 is primarily used to accommodate the main control circuit board 50, such as Figure 2 As shown, the ear hook assembly 30 may also include a control button 33 and a TYPE-C (USB) interface 34. In some embodiments, the control button 33 and the TYPE-C (USB) interface 34 may be disposed on the receiving compartment 313 to facilitate connection with the main control circuit board 50, thereby shortening the wiring distance. In this case, the control button 33 and the TYPE-C (USB) interface 34 may be partially exposed outside the ear hook housing 31 for user operation. With this configuration, the control button 33 can be used to turn the bone conduction headphones 10 on and off, adjust the volume, and other functions, while the TYPE-C (USB) interface 34 can be used to perform data transmission, charging, and other functions. Furthermore, the ear hook assembly 30 may also include an indicator light 35. In some embodiments, the indicator light 35 may be disposed on the receiving compartment 313 to facilitate connection with the main control circuit board 50, thereby shortening the wiring distance. In this case, the indicator light 35 may be partially exposed outside the ear hook housing 31, such as... Figure 2 As shown; it can also specifically include an LED light source concealed inside the ear hook housing 31 and a light guide partially exposed outside the ear hook housing 31. Figure 2 and Figure 3 (Not shown in the image). With this configuration, indicator light 35 can provide alerts when the bone conduction headphones 10 are charging or low on battery.

[0078] It should be noted that when the bone conduction headphones 10 are worn, they hang on the outside of the user's ear. Specifically, the core module 20 is generally located in front of the ear, while the main control circuit board 50 or battery 60 is generally located behind the ear. In this case, the ear acts as a fulcrum supporting the bone conduction headphones 10, causing the ear to bear most of the weight of the headphones. This can cause discomfort after prolonged wear. Therefore, the ear hook shell 31 (especially the bending transition portion 312) is generally made of a softer material to improve the wearing comfort of the bone conduction headphones 10. In some embodiments, the material of the ear hook shell 31 may include polycarbonate (PC), polyamides (PA), acrylonitrile butadiene styrene (ABS), polystyrene (PS), high impact polystyrene (HIPS), polypropylene (PP), polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyurethanes (PU), polyethylene (PE), phenolic resin (PF), urea-formaldehyde resin (UF), melamine-formaldehyde resin (MF), silicone, or any combination thereof. In some embodiments, because the ear hook shell 31 is relatively soft, it may lack rigidity and be unable to maintain its structure under external forces, or even be too weak to break. Therefore, the ear hook housing 31 may (at least in the bending transition portion 312) contain a built-in elastic metal wire. Figure 3 (Not shown in the image) to improve the strength of the ear hook housing 31, thereby increasing its reliability. In some embodiments, the elastic wire may be made of, but is not limited to, spring steel, titanium alloy, titanium-nickel alloy, chromium-molybdenum steel, etc. In some embodiments, the ear hook housing 31 may be a metal insert injection-molded integral structural component.

[0079] In some embodiments, elastic metal wires may be provided in the earphone fixing part 311, the bending transition part 312, and the receiving cavity 313. In some embodiments, the elastic metal wires may be provided on the earphone fixing part 311, the bending transition part 312, and / or the receiving cavity 313. In some embodiments, the shape of the elastic metal wires may match the shape of the corresponding components of the ear hook housing 31. For example, when the elastic metal wires are provided in the bending transition part 312, the elastic metal wires may extend along the extending direction of the bending transition part 312. In other embodiments, the elastic metal wires may be bent into a certain shape (such as a spiral, a wavy shape, or an arc shape) before being provided in the earphone fixing part 311, the bending transition part 312, and / or the receiving cavity 313 to further enhance the strength of the ear hook housing 31.

[0080] Based on the detailed description above, since the core module 20 is located at one end of the ear hook assembly 30 (e.g., the end where the earphone fixing part 311 is located), and the main control circuit board 50 or battery 60 is located at the other end of the ear hook assembly 30 (e.g., the other end where the receiving compartment 313 is located), when the core module 20 is connected to the main control circuit board 50 and the battery 60 via wires, the wires must at least pass through the area where the bending transition part 312 is located. In some embodiments, for the aesthetic appearance of the bone conduction headphones 10, the wires are not exposed outside the ear hook housing 31, but are threaded inside the ear hook housing 31, so that at least the bending transition part 312 covers the wires. However, since the wires are generally soft, threading the wires inside the ear hook housing 31 can be quite difficult. Therefore, as Figures 2 to 5 As shown, in some embodiments, the ear hook housing 31 has at least a first groove 315 on the bent transition portion 312. The first groove 315 can be used for wiring to reduce the difficulty of threading wires through the ear hook housing 31. In some embodiments, the first groove 315 can be specifically located on the side of the ear hook housing 31 near the decorative bracket 321. In some embodiments, the decorative member 32 can be embedded and fixed in the first groove 315 corresponding to the bent transition portion 312 to form a wiring channel. Figure 2 and Figure 4 (Not marked in the text) This allows the wires to extend from the core module 20 through the wiring channel into the receiving compartment 313, facilitating the connection between the core module 20 and the main control circuit board 50 and the battery 60. This arrangement ensures that when the wires pass through the first groove 315 into the ear hook housing 31, the decorative element 32 can cover the wires, preventing them from being exposed outside the ear hook housing 31. In some embodiments, the decorative element 32 can not only decorate the ear hook housing 31 but also conceal the wires, enabling the decorative element 32 to serve a dual purpose.

[0081] like Figure 2As shown, the decorative element 32 may include a decorative bracket 321 and a decorative strip 322. In some embodiments, the decorative bracket 321 is bent in a corresponding manner to the bending transition portion 312, so that when the decorative bracket 321 is embedded and fixed in the first groove 315 corresponding to the bending transition portion 312, the decorative bracket 321 and the first groove 315 on the bending transition portion 312 cooperate to form a wiring channel, allowing the wire to extend from the mechanism module 20 through the wiring channel to the receiving compartment 313. In some embodiments, the decorative strip 322 is embedded in the first groove 315 and is attached and fixed to the decorative bracket 312. In some embodiments, the decorative bracket 321 may be a plastic part and may be assembled with the ear hook housing 31 by adhesive bonding and / or snap-fit. The decorative strip 322 may be a sticker and may be attached to the decorative bracket 312 by adhesive bonding. With this configuration, when the user wants to change the decorative effect of the decorative element 32, the user can simply replace the decorative strip 322 without removing the entire decorative element 32 from the ear hook housing 31. Of course, in some embodiments, such as Figure 6 As shown, the decorative bracket 321 may also have a second groove 3211 on the side facing the ear hook housing 31, so that when the decorative bracket 321 is embedded and fixed in the first groove 315, the second groove 3211 and the first groove 315 cooperate with each other to form a wiring channel.

[0082] In some embodiments, the bottom of the first groove 315 may have a recess 316 near the end of the decorative strip 322, allowing a user to press the decorative strip 322 into the recess 316, causing the end of the decorative strip 322 to pop out of the first groove 315 for easy replacement. In this case, the first groove 315 may further extend into the receiving compartment 313, and the recess 316 may be disposed on the receiving compartment 313. In some embodiments, the recess 316 is located outside the area covered by the decorative bracket 321 over the first groove 315, and the decorative strip 322 is fitted and fixed to the decorative bracket 321, covering the recess 316. In this case, the overall length of the decorative strip 322 may be greater than the overall length of the decorative bracket 321.

[0083] It should be noted that the decorative bracket 321 and the decorative strip 322 can also be integrally molded structural components. In some embodiments, the materials of the decorative bracket 321 and the decorative strip 322 can be different, and they can be injection molded in two colors, so that the decorative bracket 321 can play a supporting role, and the decorative strip 322 can play a decorative role. In this case, the overall length of the decorative strip 322 can be greater than or equal to the overall length of the decorative bracket 321.

[0084] like Figure 3As shown, the first groove 315 can be divided into a first sub-groove segment 3151 located on the bent transition portion 312, a second sub-groove segment 3152 located on the earphone fixing portion 311, and a third sub-groove segment 3153 located on the receiving compartment 313. In some embodiments, the depth of the first sub-groove segment 3151 is greater than the depth of the second sub-groove segment 3152 and the third sub-groove segment 3153, such that the first sub-groove segment 3151 is mainly used to accommodate the decorative bracket 321 and realize wiring, while the second sub-groove segment 3152 and the third sub-groove segment 3153 are mainly used to accommodate the decorative strip 322. In other words, the decorative strip 322 can extend further into the second sub-groove segment 3152 and the third sub-groove segment 3153 in addition to being located in the first sub-groove segment 3151. In some embodiments, a recess 316 can be provided in the third sub-groove segment 3153. In some embodiments, the depth of the second sub-slot 3152 may be equal to the depth of the third sub-slot 3153, and after the decorative bracket 321 is embedded and fixed to the first sub-slot 3151, the side of the decorative bracket 321 facing away from the ear hook housing 31 may be substantially flush with the bottom of the second sub-slot 3152 and the third sub-slot 3153, thereby allowing the decorative strip 322 to be flatly attached to the earphone fixing part 311, the decorative bracket 321 and the receiving compartment 313.

[0085] In some embodiments, the bonding strength between the decorative strip 322 and the decorative bracket 321 may be less than the fixing strength between the decorative bracket 321 and the bent transition portion 312. In some embodiments, when the decorative strip 322 and the decorative bracket 321 are glued together, the bonding strength may refer to the adhesive strength between the two. In this case, the magnitude of the bonding strength may primarily depend on the roughness of the surfaces on which the decorative bracket 321 and the decorative strip 322 are bonded; and / or, the amount (and / or tackiness) of the adhesive between the decorative strip 322 and the decorative bracket 321. In some embodiments, when the decorative bracket 321 and the bent transition portion 312 are snapped together, the fixing strength may refer to the snapping strength between the two. In this case, the fixing strength may primarily depend on the fit clearance between the decorative bracket 321 and the bent transition portion 312; and / or, the depth of the snapping together. With this configuration, when the decorative bracket 321 and the ear hook housing 31 are mainly assembled by snap-fit, the two ends of the decorative strip 322 can be glued to the receiving compartment 313 and the earphone fixing part 311 respectively, which can further fix the decorative bracket 321. Moreover, when the decorative strip 322 is replaced to change the decorative effect of the decorative part 32, the decorative bracket 321 will not be lifted up due to the excessive adhesion between it and the decorative strip 322.

[0086] It should be noted that: when Figure 2 The storage compartment 313 shown is mainly used to accommodate the main control circuit board 50. Figure 4 The shown compartment 313 can primarily be used to house the battery 60. At this time, if... Figure 2The ear hook assembly 30 shown corresponds to the left ear hook of the bone conduction headphones. Figure 4 The ear hook assembly 30 shown can correspond to the right ear hook of the bone conduction headphone 10; conversely, if Figure 2 The ear hook assembly 30 shown corresponds to the right ear hook of the bone conduction headphone 10. Figure 4 The ear hook assembly 30 shown corresponds to the left ear hook of the bone conduction headphone 10. In other words, the main control circuit board 50 and the battery 60 can be respectively housed within the two ear hook assemblies 30. This arrangement not only increases the capacity of the battery 60 to improve the battery life of the bone conduction headphone 10, but also balances the weight of the bone conduction headphone 10 to improve its wearing comfort. In some embodiments, the main control circuit board 50 and the battery 60 can be connected via wires built into the back cover assembly 40; the specific structure will be described in detail later.

[0087] like Figure 4 As shown, the ear hook assembly 30 may also include a button 36, and the ear hook housing 31 may also have a button adapter hole 317. In some embodiments, the decorative bracket 321 is mounted and fixed on one side of the ear hook housing 31, and the button 36 is located on the other side of the ear hook housing 31 away from the decorative bracket 321 and is exposed through the button adapter hole 317. The decorative bracket 321 further extends in a cantilever form above the button 36 exposed through the button adapter hole 317, and can trigger the button 36 under external pressure. With this configuration, the button 36 can replace the control key 33 mentioned above to simplify the structure of the bone conduction headphones 10; it can also coexist with the control key 33 mentioned above and can be used to implement functions such as play / pause and AI wake-up to expand the interactive capabilities of the bone conduction headphones 10.

[0088] In some embodiments, the button adapter hole 317 can be formed in the earphone fixing part 311, allowing the user to press the button 36 on the earphone fixing part 311. In this case, the ear hook assembly 30 may also include a sealing member 37, which is disposed between the button 36 and the earphone fixing part 311. In some embodiments, the material of the sealing member 37 may be, but is not limited to, silicone, rubber, etc. This configuration can increase the waterproof performance of the earphone fixing part 311 in the area where the button 36 is located, and also improve the tactile feel of pressing the button 36.

[0089] In some embodiments, when the core module 20 is located at one end of the ear hook assembly 30 (specifically, at the end where the earphone fixing part 311 is located) and the battery 60 is located at the other end of the ear hook assembly 30 (specifically, at the other end where the receiving compartment 313 is located), the wire must at least pass through the area where the bending transition part 312 is located, so that the core module 20 can be connected to the battery 60 via the wire. Therefore, as follows... Figure 4As shown, the ear hook housing 31 has a first groove 315 on at least one side of the earphone fixing portion 311 and the bending transition portion 312 near the decorative bracket 321. The first groove 315 can be used for wiring to reduce the difficulty of threading wires through the ear hook housing 31. In some embodiments, one end of the first groove 315 communicates with the button adapter hole 317, so that when the decorative bracket 321 is embedded and fixed in the first groove 315, the decorative bracket 321 can also cover the button adapter hole 317 to facilitate triggering the button 36.

[0090] In the above manner, the decorative piece 32 can not only decorate the ear hook housing 31 and cover the wires, but also cover and trigger the button 36, so that the decorative piece 32 can achieve "one piece with four uses".

[0091] like Figure 5 As shown, the first groove 315 can be divided into a first sub-groove segment 3151 located on the bending transition portion 312 and a second sub-groove segment 3152 located on the earphone fixing portion 311. In some embodiments, the depth of the first sub-groove segment 3151 is greater than the depth of the second sub-groove segment 3152, so that the first sub-groove segment 3151 is mainly used for wiring, and the second sub-groove segment 3152, together with the first sub-groove segment 3151, is used to accommodate the decorative bracket 321. At this time, the button adapter hole 317 can be provided in the second sub-groove segment 3152, that is, the projections of the two on the earphone fixing portion 311 at least partially overlap. In some embodiments, the first groove 315 can also be divided into a third sub-groove segment 3153 located on the receiving compartment 313, and the third sub-groove segment 3153 can also be provided with a recess 316. In some embodiments, the depth of the second sub-groove segment 3152 can be greater than the depth of the third sub-groove segment 3153, so that the third sub-groove segment 3153 is mainly used to accommodate the decorative strip 322. In other words, the decorative strip 322, in addition to being located within the first sub-slot 3151 and the second sub-slot 3152, can further extend into the third sub-slot 3153. At this time, after the decorative bracket 321 is embedded and fixed in the first sub-slot 3151, the side of the decorative bracket 321 facing away from the ear hook housing 31 can be roughly flush with the bottom of the third sub-slot 3153, thereby allowing the decorative strip 322 to be flatly attached to the earphone fixing part 311, the decorative bracket 321, and the receiving compartment 313; and the decorative bracket 321 can form a cantilever at the corresponding button adapter hole 317 in the second sub-slot 3152.

[0092] like Figure 6As shown, the decorative bracket 321 may include a fixing portion 3212 corresponding to the first sub-slot segment 3151 and a pressing portion 3213 corresponding to the second sub-slot segment 3152. In some embodiments, the thickness of the fixing portion 3212 is greater than the thickness of the pressing portion 3213, such that the fixing portion 3212 is mainly used to realize the assembly between the decorative bracket 321 and the ear hook housing 31, and the pressing portion 3213 is mainly used to trigger the button 36. In some embodiments, when the decorative bracket 321 has a second groove 3211 on the side facing the ear hook housing 31, the second groove 3211 may be provided on the fixing portion 3212.

[0093] like Figure 6 and Figure 7 As shown, the decorative bracket 321 may further include a connecting portion 3214 connecting the fixing portion 3212 and the pressing portion 3213. In some embodiments, the connecting portion 3214 bends and extends away from the ear hook housing 31 relative to the fixing portion 3212, and the pressing portion 3213 bends and extends closer to the ear hook housing 31 relative to the connecting portion 3214. In this case, the connecting portion 3214 causes the pressing portion 3213 to be suspended relative to the fixing portion 3212, and there is a certain distance between the pressing portion 3213 and the fixing portion 3212. In some embodiments, this distance may be greater than or equal to the trigger stroke of the button 36. This configuration can effectively improve the problem that when the user presses one end of the decorative bracket 321 (specifically, the end where the pressing portion 3213 is located), the other end of the decorative bracket 321 tilts up.

[0094] In some embodiments, a button protrusion 3215 may be provided on the side of the pressing part 3213 near the ear hook housing 31, so that the button protrusion 3215 can trigger the button 36 when the pressing part 3213 is pressed by an external force. In some embodiments, the projections of the button protrusion 3215 and the button 36 on the earphone fixing part 311 at least partially overlap, and the effective contact area between the button protrusion 3215 and the button 36 is smaller than the effective contact area between the pressing part 3213 and the button 36. This configuration can reduce the difficulty of triggering the button 36; especially when a seal 37 is provided between the button 36 and the earphone fixing part 311, because the button 36 needs the seal 37 to deform first to be triggered. Based on the relationship F∝ε·S, under the same external force F applied by the user, the smaller the effective area S of the area where the seal 37 needs to deform, the greater the deformation ε of the seal 37, and thus the easier it is to trigger the button 36. Obviously, compared to the pressing part 3213, the button protrusion 3215 can reduce the aforementioned effective area.

[0095] In some embodiments, the decorative bracket 321 may also be provided with a stop portion 3216 at its end near the earphone fixing portion 311. In some embodiments, the stop portion 3216 is used to form a stop with the earphone fixing portion 311 away from the inner surface of the decorative bracket 321, to prevent the end of the decorative bracket 321 from prying up from the first groove 315, especially under the action of external force. Figure 7 As shown, the stop portion 3216 can be specifically located at the end of the pressing portion 3213 away from the fixing portion 3212. At this time, due to the stopping effect between the stop portion 3216 and the earphone fixing portion 311, after the decorative bracket 321 deforms under external force and triggers the button 36, the decorative bracket 321 will not tilt up due to excessive elastic recovery.

[0096] See again Figure 2 or Figure 6 The decorative bracket 321 may also be provided with an overlapping portion 3217 at one end near the receiving compartment 313 (that is, the other end away from the pressing portion 3213). In some embodiments, the thickness of the overlapping portion 3217 is less than the thickness of the fixing portion 3212, so as to structurally avoid the reinforcing structure of the ear hook housing 21 (specifically located between the bending transition portion 312 and the receiving compartment 313).

[0097] like Figure 8 As shown, the mechanism module 20 may include a mechanism housing 21 and a mechanism 22. In some embodiments, one end of the mechanism housing 21 is open, and an ear hook housing 31 (specifically, an earphone fixing part 311) covers the open end of the mechanism housing 21 to form a cavity structure for accommodating the mechanism 22. In this case, the ear hook housing 31 is equivalent to a cover for the mechanism housing 21. Compared with the plug-in assembly method of the ear hook structure and the mechanism structure in the related art, the cover assembly method of the ear hook housing 31 and the mechanism housing 21 in this embodiment can improve the stress problem at the plug-in point of the ear hook structure and the mechanism structure in the related art, thereby increasing the reliability of the bone conduction earphone 10.

[0098] It should be noted that: Figure 8 The ear hook housing is shown in the diagram, mainly to facilitate the description of the relative positional relationship between the ear hook housing and the movement housing, and thus implicitly to indicate a possible assembly method between the ear hook housing and the movement housing.

[0099] In some embodiments, the mechanism 22 can be directly or indirectly fixed within the mechanism housing 21, so that the mechanism 22 vibrates under the excitation of an electrical signal, causing the mechanism housing 21 to vibrate accordingly. When a user wears the bone conduction headphones 10, the skin contact area of ​​the mechanism housing 21 (i.e., the bottom wall 211 described below) can contact the user's skin, allowing the aforementioned vibration to be transmitted through the skull to the auditory nerve, thereby enabling the user to hear the sound played by the bone conduction headphones 10. In this embodiment, the mechanism module 20 may further include a mechanism support 23, which is used to fix the mechanism 22 within the mechanism housing 21.

[0100] Generally, low frequency refers to sound with a frequency below 500Hz, mid frequency refers to sound with a frequency range of 500-4000Hz, and high frequency refers to sound with a frequency above 4000Hz. In some embodiments, such as Figure 9As shown, the horizontal axis represents the vibration frequency (in Hz), and the vertical axis represents the vibration intensity (in dB). The high-frequency region (frequency range greater than 4000Hz) has a first high-frequency trough V, a first high-frequency peak P1, and a second high-frequency peak P2. In some embodiments, the first high-frequency trough V and the first high-frequency peak P1 may be generated by the deformation of the non-skin contact area of ​​the core housing 21 (i.e., the annular peripheral wall 212 described later) at high frequencies, and the second high-frequency peak P2 may be generated by the deformation of the skin contact area of ​​the core housing 21 at high frequencies. Generally, the frequency response curve in the frequency range of 500-6000Hz is particularly critical for bone conduction headphones. In some embodiments, sharp peaks and valleys are undesirable in this frequency range; the flatter the frequency response curve, the better the sound quality of the bone conduction headphones. Generally, the greater the stiffness, the smaller the deformation generated when the structure is under stress, which is also conducive to generating higher frequency resonances. Therefore, in most cases, product manufacturers will increase the stiffness of the core housing 21 to shift the first high-frequency trough V, the first high-frequency peak P1, and the second high-frequency peak P2 to the higher frequency region. In other words, to achieve better sound quality, the stiffness of the mechanism housing 21 can be as high as possible. Therefore, in this embodiment, the material of the mechanism housing 21 can be, but is not limited to, a mixture of polycarbonate, polyamide, acrylonitrile-butadiene-styrene copolymer, and glass fiber or carbon fiber. In some embodiments, the mechanism housing 21 can be made of a mixture of carbon fiber and polycarbonate in a certain proportion, or a mixture of glass fiber and polycarbonate in a certain proportion, or a mixture of glass fiber and polyamide in a certain proportion. In other embodiments, the mechanism housing 21 can be made of a mixture of carbon fiber, glass fiber, and polycarbonate in a certain proportion. In some embodiments, adding different proportions of carbon fiber and / or glass fiber results in different elastic moduli of the material, and thus different stiffness of the resulting mechanism housing 21. For example, adding 20%-50% glass fiber to polycarbonate can achieve an elastic modulus of 6-8 GPa.

[0101] Based on the above detailed description, on the one hand, the ear hook shell 31 (especially the earphone fixing part 311) is part of the mechanism module 20 to form a cavity structure that accommodates the mechanism 22; on the other hand, in some embodiments of this application, in order to improve the wearing comfort of bone conduction headphones, the ear hook shell 31 is generally made of a softer material, resulting in lower rigidity. With this configuration, when the ear hook shell 31 covers the mechanism shell 21 to form a cavity structure that accommodates the mechanism 22, the rigidity of the ear hook shell 31 (especially the earphone fixing part 311) is less than the rigidity of the mechanism shell 21, making the bone conduction headphones prone to sound leakage, thus affecting user satisfaction.

[0102] Generally, the resonant frequency of a structure is related to its stiffness; and for the same mass, the greater the stiffness of the structure, the higher its resonant frequency. In some embodiments, the stiffness K of the structure is related to factors such as its material (specifically, its elastic modulus) and its specific structural form. Generally, the greater the elastic modulus E of the material, the greater the stiffness K of the structure; the greater the thickness t of the structure, the greater the stiffness K of the structure; and the smaller the area S of the structure, the greater the stiffness K of the structure. In this case, the above relationships can be simply described by the formula K∝(E·t) / S. Therefore, increasing the elastic modulus E of the material, increasing the thickness t of the structure, decreasing the area S of the structure, or a combination thereof, can increase the stiffness K of the structure, thereby increasing the resonant frequency of the structure.

[0103] In this embodiment, the ear hook shell 31 is generally made of a softer material (i.e., a material with a low elastic modulus, such as polycarbonate or polyamide, whose elastic modulus is mostly 2-3 GPa), while the mechanism shell 21 is generally made of a harder material (i.e., a material with a high elastic modulus, such as polycarbonate with 20%-50% glass fiber added, whose elastic modulus can reach 6-8 GPa). Obviously, due to the difference in elastic modulus, the stiffness of the ear hook shell 31 is inconsistent with that of the mechanism shell 21, easily leading to the aforementioned sound leakage. Furthermore, after the ear hook shell 31 and the mechanism shell 21 are connected, the inconsistent stiffness of the two can easily cause the structure to resonate at relatively low frequencies. Therefore, in some embodiments, when the elastic modulus of the mechanism shell 21 is greater than that of the ear hook shell 31, the headphone fixing part 311 is provided with a reinforcing structure 318. In some embodiments, the reinforcing structure 318 can increase the stiffness of the headphone fixing part 311. In some embodiments, the reinforcing structure 318 can reduce the difference between the stiffness K1 of the skin contact area of ​​the mechanism housing 21 and the stiffness K2 of the earphone fixing part 311. In some embodiments, the reinforcing structure 318 can make the ratio of the difference between the stiffness K1 of the skin contact area of ​​the mechanism housing 21 and the stiffness K2 of the earphone fixing part 311 to the stiffness K1 of the skin contact area of ​​the mechanism housing 21 less than or equal to 30%. For example, the reinforcing structure 318 can make the ratio of the difference between the stiffness K1 of the skin contact area of ​​the mechanism housing 21 and the stiffness K2 of the earphone fixing part 311 to the stiffness K1 of the skin contact area of ​​the mechanism housing 21 less than or equal to 20%. As another example, the reinforcing structure 318 can make the ratio of the difference between the stiffness K1 of the skin contact area of ​​the mechanism housing 21 and the stiffness K2 of the earphone fixing part 311 to the stiffness K1 of the skin contact area of ​​the mechanism housing 21 less than or equal to 10%. That is, (K1-K2) / K1≤10%, or K2 / K1≥90%. This configuration ensures that the housing 21 has sufficient rigidity so that its resonant frequency is located in the highest possible high-frequency range. It also reduces the rigidity difference between the headphone fixing part 311 and the housing 21, thereby increasing the resonant frequency of the structure and improving the aforementioned sound leakage.

[0104] In some embodiments, the mechanism housing 21 can be spherical, ellipsoidal, polyhedral, or other shapes. A portion of the mechanism housing 21 can be used for contact with the user's skin. For example, when the mechanism housing 21 is a polyhedron, one face can be used for contact with the user's skin. In some embodiments, the mechanism housing 21 can also be other irregular shapes. In some embodiments, the mechanism housing 21 can be a one-piece molded structure. For example, the mechanism housing 21 can be a one-piece molded structure formed by 3D printing. In some embodiments, the mechanism housing 21 can be formed by molding multiple components separately and then snapping, welding, or bonding the multiple components together.

[0105] In some embodiments, such as Figure 10 As shown, the core housing 21 may include a bottom wall 211 and an annular peripheral wall 212. In some embodiments, the bottom wall 211 is the skin contact area of ​​the core housing 21, and one end of the annular peripheral wall 212 is integrally connected to the bottom wall 211. In other words, the bottom wall 211 is used for contact with the user's skin. In some embodiments, the annular peripheral wall 212 may also be in contact with the user's skin. In some embodiments, the bottom wall 211 and the annular peripheral wall 212 may be connected by snap-fit, welding, or bonding. In some embodiments, the earphone fixing part 311 may include a fixing body 3111 connected to the bending transition part 312 and an annular flange 3112 integrally connected to the fixing body 3111 and extending toward the core housing 21. In some embodiments, the annular flange 3112 and the other end of the annular peripheral wall 212 away from the bottom wall 211 abut against each other, and the two may be connected by adhesive bonding or a combination of adhesive bonding and snap-fit.

[0106] It should be noted that in some embodiments, the bottom wall 211 can be triangular, trapezoidal, rectangular, square, circular, elliptical, or quasi-elliptical (and...). Figure 11 The shape of the earphone fixing part 311 shown is similar to any of the following: In some embodiments, the annular peripheral wall 212 can be perpendicular to the bottom wall 211, meaning the area of ​​the opening end of the mechanism housing 21 is equal to the area of ​​the bottom wall 211; the annular peripheral wall 212 can also be tilted outward relative to the bottom wall 211 at an angle (e.g., the tilt angle is less than or equal to 30°), meaning the area of ​​the opening end of the mechanism housing 21 is greater than the area of ​​the bottom wall 211. In some embodiments, an example is given where the bottom wall 211 is approximately elliptical and the annular peripheral wall 212 is tilted outward relative to the bottom wall 211 at 10°. With this configuration, while ensuring a certain level of wearing comfort (because the bottom wall 211, as the skin contact area of ​​the mechanism housing 21, will contact the user's skin, its area should not be too small), reducing the area of ​​the bottom wall 211 can increase the resonant frequency of the mechanism housing 21.

[0107] like Figure 10As shown in (a), the reinforcing structure 318 may include an arc-shaped structure disposed between the fixing body 3111 and the annular flange 3112, i.e., a chamfered (fillet) treatment. In some embodiments, since the dimension of the annular flange 3112 in the thickness direction of the earphone fixing part 311 is generally small, the annular flange 3112 and the aforementioned arc-shaped structure can be integrated. In this case, the structure of the earphone fixing part 311 may only include the fixing body 3111 and the reinforcing structure 318 of the arc-shaped structure. With this configuration, the aforementioned arc-shaped structure reduces the effective area of ​​the earphone fixing part 311, which can increase the rigidity of the earphone fixing part 311, thereby reducing the rigidity difference between the earphone fixing part 311 and the core housing 21. It should be noted that the dimensions of the aforementioned arc-shaped structure can be reasonably designed according to the rigidity requirements of the earphone fixing part 311, and are not limited here.

[0108] In some embodiments, the fixing body 3111 and the annular flange 3112 may be made of the same or different materials. In some embodiments, the material of the arc-shaped structure may be the same as the material of the fixing body 3111 or the annular flange 3112. In other embodiments, the material of the arc-shaped structure may be different from the materials of both the fixing body 3111 and the annular flange 3112. By way of example only, the material of the arc-shaped structure may also be any one or a combination of polycarbonate, polyamide, acrylonitrile-butadiene-styrene copolymer, and metal.

[0109] like Figure 10 As shown in (b), the reinforcing structure 318 can be a thickened layer integrally formed with the fixing body 3111, that is, a thickened layer. In some embodiments, the material of the thickened layer can be the same as the material of the ear hook shell 31. For example, the material of the thickened layer can be any one or a combination of polycarbonate, polyamide, acrylonitrile-butadiene-styrene copolymer. It should be noted that the reinforcing structure 318 can be located on the side of the fixing body 3111 close to the core shell 21, or on the other side of the fixing body 3111 away from the core shell 21, or on both sides of the fixing body 3111. In some embodiments, since the size of the annular flange 3112 in the thickness direction of the earphone fixing part 311 is generally small, the annular flange 3112 and the aforementioned thickened layer can be integrated. In this case, the structure of the earphone fixing part 311 can consist only of the fixing body 3111 and the reinforcing structure 318 formed by the thickened layer. This design increases the effective thickness of the headphone fixing part 311, thereby increasing its rigidity and reducing the rigidity difference between the headphone fixing part 311 and the core housing 21. It should be noted that the dimensions of the thickening layer can be reasonably designed according to the rigidity requirements of the headphone fixing part 311, and are not limited here.

[0110] In some other embodiments, the reinforcing structure 318 can be a metal component. In some embodiments, the metal component can be made of, but is not limited to, aluminum alloy, magnesium alloy, titanium alloy, nickel alloy, chromium-molybdenum steel, stainless steel, or any combination thereof. In this case, the reinforcing structure 318 and the earphone fixing part 311 can be integrally molded metal inserts. This configuration effectively increases the rigidity of the earphone fixing part 311, thereby reducing the rigidity difference between the earphone fixing part 311 and the core housing 21. It should be noted that the material, dimensions, and other parameters of the aforementioned metal component can be reasonably designed according to the rigidity requirements of the earphone fixing part 311, and are not limited here.

[0111] In some embodiments, the reinforcing structure 318 may include one or more reinforcing beams. The two ends of the reinforcing beam may be connected to the fixing body 3111 and the annular flange 3112, respectively. In some embodiments, one end of the reinforcing beam may be connected to one side surface of the fixing body 3111; for example, one side surface of the fixing body 3111 may be... Figure 10 The lower surface of the fixed body 3111 shown in (a) or (b); one end of the reinforcing beam may be connected to one side surface of the annular flange 3112, for example, one side surface of the annular flange 3112 may be Figure 10 The inner surface of the annular flange 3112 is shown in (a) or (b). In some embodiments, the angle between the reinforcing beam and the lower surface of the fixing body 3111 or between the reinforcing beam and the inner surface of the annular flange 3112 can be from 30° to 60°. The reinforcing beam can be of various shapes such as straight, polygonal, or wavy. The cross-section of the reinforcing beam can be of various shapes such as rectangular, circular, triangular, or irregular.

[0112] In other embodiments, such as Figure 11 As shown, the reinforcing structure 318 can be a reinforcing rib disposed on the earphone fixing part 311. In some embodiments, the aforementioned reinforcing ribs are mainly distributed on the side of the earphone fixing part 311 near the core housing 21. In some embodiments, the number of reinforcing ribs can be multiple, and the multiple reinforcing ribs can be arranged as follows: Figure 11 The side-by-side arrangement shown in (a) and (b) or as shown in the figure Figure 11 The grid-like arrangement shown in (c) is also possible; multiple reinforcing ribs can also be arranged around a preset reference point on the earphone fixing part 311 as a center. Figure 11The radial arrangement is shown in (d). In some embodiments, the material of the reinforcing ribs can be the same as that of the ear hook housing 31. For example, the material of the reinforcing ribs is any one or any combination of polycarbonate, polyamide, acrylonitrile-butadiene-styrene copolymer. Compared with methods such as injection molding a metal part into the earphone fixing part 311 or directly thickening the earphone fixing part 311, providing reinforcing ribs on the earphone fixing part 311 can increase the rigidity of the earphone fixing part 311 while also taking into account the weight of the earphone fixing part 311.

[0113] In some embodiments, such as Figure 11 As shown, the headphone fixing part 311 may have a long axis direction (e.g., Figure 11 The direction indicated by the dashed line X at the midpoint) and the direction of a minor axis (such as...) Figure 11 (The direction indicated by the dashed line Y). In some embodiments, the dimension of the earphone fixing part 311 along its major axis can be larger than its dimension along its minor axis. The distribution of the reinforcing ribs is described below by way of example:

[0114] like Figure 11 As shown in (a), multiple reinforcing ribs can extend along the long axis in a strip-like manner and be arranged side by side along the short axis. In this case, the reinforcing structure 318 can be simply regarded as the long-side reinforcement of the earphone fixing part 311.

[0115] like Figure 11 As shown in (b), multiple reinforcing ribs can extend along the short axis in a strip-like manner and be arranged side by side along the long axis. In this case, the reinforcing structure 318 can be simply regarded as the short-side reinforcement of the earphone fixing part 311.

[0116] like Figure 11 As shown in (c), multiple reinforcing ribs can be arranged along the long axis and short axis respectively to form a grid. In this case, the reinforcing structure 318 can be simply regarded as the cross reinforcement of the earphone fixing part 311.

[0117] like Figure 11 As shown in (d), the ends of multiple reinforcing ribs that are close to each other can be spaced out, and the extension lines of the multiple reinforcing ribs can intersect at a preset reference point (e.g., Figure 11 (As shown by the solid point O). At this point, the reinforcing structure 318 can be simply regarded as a radial reinforcement of the earphone fixing part 311.

[0118] In some embodiments, when multiple reinforcing ribs form a mesh, the mesh shape can be triangular, parallelogram, trapezoidal, regular polygon, spindle-shaped, or irregular. In some embodiments, the reinforcing ribs can be of various shapes. For example, the reinforcing ribs can be strip-shaped, flat, curved plate-shaped, corrugated plate-shaped, column-shaped, ring-shaped, etc. The reinforcing structure 318 may include reinforcing ribs of one shape or multiple reinforcing ribs of different shapes.

[0119] In some embodiments, the reinforcing structure 318 may include a ring-shaped reinforcing rib and a plurality of strip-shaped reinforcing ribs. In some embodiments, the ring-shaped reinforcing rib may be disposed at a predetermined position on the earphone fixing part 311, and the axis of the ring-shaped reinforcing rib may be perpendicular to the plane on which the reinforcing structure 318 is disposed on the earphone fixing part 311. The strip-shaped reinforcing ribs may be radially connected to the annular outer wall of the ring-shaped reinforcing rib. In some embodiments, the reinforcing structure 318 may include a plurality of ring-shaped reinforcing ribs and a plurality of strip-shaped reinforcing ribs. The plurality of ring-shaped reinforcing ribs may be arranged at intervals, and one or more plate-shaped reinforcing ribs may be disposed between every two ring-shaped reinforcing ribs, and the two ends of the plate-shaped reinforcing ribs may be respectively connected to the annular outer wall of the ring-shaped reinforcing rib.

[0120] In some embodiments, under equivalent conditions, when the dimensional relationship between the reinforcing rib and the earphone fixing part 311 satisfies the following, the rigidity of the earphone fixing part 311 can be effectively increased while also taking into account its weight. In some embodiments, the ratio between the thickness of the reinforcing rib and the thickness of the earphone fixing part 311 can be within the closed range [0.6, 1.4]. For example, the ratio between the thickness of the reinforcing rib and the thickness of the earphone fixing part 311 can be within the closed range [0.8, 1.2]. Another example is that the thickness of the reinforcing rib and the thickness of the earphone fixing part 311 can be the same. In some embodiments, the ratio between the width of the reinforcing rib and the thickness of the earphone fixing part 311 can be within the closed range [0.3, 0.7]. For example, the ratio between the width of the reinforcing rib and the thickness of the earphone fixing part 311 can be within the closed range [0.4, 0.6]. Another example is that the width of the reinforcing rib can be half the thickness of the earphone fixing part 311. In some embodiments, the ratio between the spacing of the reinforcing ribs and the thickness of the earphone fixing portion 311 can be within the closed range [1.2, 2.8]. For example, the ratio between the spacing of the reinforcing ribs and the thickness of the earphone fixing portion 311 can be within the closed range [1.6, 2.4]. As another example, the spacing of the reinforcing ribs can be twice the thickness of the earphone fixing portion 311. In some embodiments, an exemplary description is given with the thickness of the earphone fixing portion 311 being 0.8 mm, and the thickness, width, and spacing of the reinforcing ribs being 0.8 mm, 0.4 mm, and 1.6 mm, respectively.

[0121] It should be noted that: Figure 10 and Figure 11The various reinforcing structures shown can be reasonably combined according to the rigidity requirements of the headphone fixing part 311, and no restrictions are imposed here.

[0122] like Figure 12 As shown, curve (A+B) can indicate that the material of the earphone fixing part 311 is different from that of the core housing 21 (e.g., the former has a lower elastic modulus than the latter), and the earphone fixing part 311 is structurally unchanged; curve (B+B) can indicate that the material of the earphone fixing part 311 is the same as that of the core housing 21 (e.g., their elastic moduli are equal), and the earphone fixing part 311 is structurally similar to the core housing 21 (e.g., their thicknesses are equal, and the area of ​​the earphone fixing part 311 is equal to the area of ​​the bottom wall 211). In some embodiments, A can correspond to the earphone fixing part 311, and B can correspond to the bottom wall 211 (i.e., the skin contact area of ​​the core housing 21); (A+B) and (B+B) can structurally correspond to the ear hook housing 31 (specifically, the earphone fixing part 311) covering the core housing 21.

[0123] Depend on Figure 12 It can be concluded without a doubt that for structure (A+B), its resonance valley (which can correspond to the first high-frequency valley V mentioned above) occurs at a frequency of approximately 5500 Hz; while for structure (B+B), its resonance valley (which can correspond to the first high-frequency valley V mentioned above) occurs at a frequency of approximately 8400 Hz. Clearly, if structure (A+B) is improved to structure (B+B), the resonant frequency of the structure can be effectively increased.

[0124] In some embodiments, for the structure (A+B), the headphone fixing part 311 is provided with such Figure 10 The chamfer shown in (a) is as follows: Figure 10 The thickened (Thicken) shown in (b) is as follows: Figure 11 As shown in (a), the long-side reinforcement is as follows: Figure 11 The short-side reinforcement shown in (b) is as follows: Figure 11 The cross reinforcement shown in (c) is as follows: Figure 11After the radial reinforcement structure 318 shown in (d), the resonance valleys of (A+B+reinforcement structure) all appear within the frequency range of 5500-8400Hz. In other words, providing the reinforcement structure 318 on the earphone fixing part 311 does indeed help increase the resonant frequency of the structure, which also helps to reduce the stiffness difference between the earphone fixing part 311 and the core housing 21, thereby helping to improve the aforementioned sound leakage. It should be noted that different structures of the reinforcement structure 318 result in different effects on increasing the resonant frequency, that is, different degrees of improvement in sound leakage. In some embodiments, if the effect of the reinforcement structure 318 on increasing the resonant frequency is ranked from best to relatively best, the order is: cross reinforcement > short side reinforcement > radial reinforcement > thickening > long side reinforcement > chamfering.

[0125] Based on the detailed description above, the mechanism 22 vibrates under the excitation of an electrical signal, causing the mechanism housing 21 to vibrate accordingly. When a user wears the bone conduction headphones 10, the bottom wall 211 of the mechanism housing 21 (i.e., the skin contact area) can contact the user's skin, allowing the vibration to be transmitted through the skull to the auditory nerve, thus enabling the user to hear the sound played by the bone conduction headphones 10. To ensure the reliability of the vibration transmission process, the mechanism housing 21 must vibrate along with the mechanism 22. Therefore, the mechanism 22 needs to be fixed inside the mechanism housing 21.

[0126] like Figure 13 and Figure 8 As shown, one end of the movement housing 21 is open, and the movement bracket 23 and the movement 22 are housed within the movement housing 21. In some embodiments, the movement bracket 23 is used to secure the movement 22 within the movement housing 21. In some embodiments, such as Figure 14 As shown, the movement support 23 may include an annular support body 231 and a limiting structure disposed on the support body 231. The movement 22 is hung on the support body 231 for fixed connection with the movement housing 21. Figure 13 As shown, the limiting structure and the movement housing 21 can interfere with each other, so that the movement support 23 moves along the circumference of the support body 231 (e.g., Figure 14 (In the direction indicated by arrow C) and the mechanism housing 21 remain relatively fixed. In some embodiments, the plane of the support body 231 can be parallel to the plane of the bottom wall 211 to increase the fit between the two, thereby increasing the vibration transmission effect mentioned above. At this time, an adhesive such as structural adhesive, hot melt adhesive, or instant adhesive can also be provided between the support body 231 and the bottom wall 211. Figure 13(Not shown in the image). With this configuration, the movement bracket 23 and the movement housing 21 can be assembled using a combination of snap-fit ​​and adhesive bonding, effectively limiting the degrees of freedom between them. Of course, in other embodiments, the movement bracket 23 and the movement housing 21 can also be directly fixed by adhesive bonding. For example, an adhesive such as structural adhesive, hot melt adhesive, or instant adhesive can be applied between the bracket body 231 and the bottom wall 211. Figure 13 (not shown in the figure), which can also effectively limit the degree of freedom between the movement support 23 and the movement housing 21; it can also simplify the structure of the movement housing 21.

[0127] like Figure 13 As shown, the movement housing 21 may also include a positioning post 213 connected to the bottom wall 211 or the annular peripheral wall 212. Figure 14 As shown, the limiting structure may include a first limiting structure 232. In some embodiments, the first limiting structure 232 is provided with an insertion hole 233. In some embodiments, the positioning post 213 is inserted into the insertion hole 233. This configuration can effectively increase the assembly accuracy between the movement support 23 and the movement housing 21. At this time, the aforementioned adhesive can also be provided between the support body 231 and the bottom wall 211.

[0128] In some embodiments, such as Figure 14 As shown, the limiting structure may further include a second limiting structure 234. The second limiting structure 234 is located along the circumference of the support body 231 (e.g., Figure 14 The second limiting structure 234 (in the direction indicated by arrow C) is spaced apart from the first limiting structure 232. In some embodiments, the second limiting structure 234 can abut against the annular peripheral wall 212, which will be described in detail later. With this configuration, the second limiting structure 234 and the first limiting structure 232 respectively cooperate with the corresponding structures on the movement housing 21, so that the movement support 23 and the movement housing 21 remain relatively fixed, that is, the degree of freedom between the movement support 23 and the movement housing 21 is effectively restricted.

[0129] like Figure 8 As shown, the opening end of the annular peripheral wall 212 has a major axis direction (e.g., Figure 8 The direction indicated by the dashed line X at the midpoint) and the direction of a minor axis (such as...) Figure 8 (The direction indicated by the dashed line Y). In some embodiments, the dimension of the opening end of the annular peripheral wall 212 along the major axis direction can be larger than the dimension along the minor axis direction. In some embodiments, such as Figure 15 As shown, the first limiting structure 232 and the second limiting structure 234 are spaced apart along the long axis on opposite sides of the support body 231, and the reference plane where the opening end of the first limiting structure 232 and the second limiting structure 234 is located (e.g., the reference plane where the opening end of the annular peripheral wall 212 is located) Figure 15The projection of the support body 231 onto the plane (shown by the dashed rectangle) is at least partially located outside the projection of the support body 231 onto the reference plane. This arrangement facilitates the engagement of the first limiting structure 232 with the positioning post 213 and the second limiting structure 234 with the annular peripheral wall 212.

[0130] like Figure 14 As shown, the first limiting structure 232 may include a first axial extension 2321 and a first radial extension 2322. In some embodiments, the first axial extension 2321 is connected to the support body 231 and extends along the axial direction of the support body 231 (e.g., along the axial direction of the support body 231). Figure 14 The first radial extension 2322 extends towards the side where the movement 22 is located (in the direction indicated by the dashed line Z); the first radial extension 2322 connects to the first axial extension 2321 and extends outward along the radial direction of the support body 231 (that is, in the direction of the diameter of the support body 231). At this time, the insertion hole 233 is provided on the first radial extension 2322, as shown in the image. Figures 13 to 15 As shown, this is to facilitate the engagement of the first limiting structure 232 with the positioning post 213. In some embodiments, such as Figure 14 As shown, the second limiting structure 234 may include a second axial extension 2341 and a second radial extension 2342. In some embodiments, the second axial extension 2341 is connected to the support body 231 and extends axially towards the side where the movement 22 is located; the second radial extension 2342 is connected to the second axial extension 2341 and extends radially outward from the support body 231. At this time, the second radial extension 2342 abuts against the annular peripheral wall 212, as... Figure 13 and Figure 15 As shown, for example, the two are engaged so that the second limiting structure 234 abuts against the annular peripheral wall 212. This arrangement, as... Figure 13 As shown, the movement 22 is located between the first axial extension 2321 and the second axial extension 2341.

[0131] It should be noted that: such as Figures 13 to 15 As shown, with the movement 22 as a reference, if the area between the first axial extension 2321 and the second axial extension 2341 is the inner side of the support body 231, then the area outside the inner side is the outer side of the support body 231.

[0132] See again Figure 13The annular peripheral wall 212 may also include an inclined region 214 corresponding to the first limiting structure 232 and inclined relative to the bottom wall 211. In some embodiments, the positioning post 213 may be disposed on the inclined region 214. This arrangement can reduce the effective distance between the first radial extension 2322 and the bottom wall 211, that is, reduce the height of the positioning post 213, thereby increasing the structural strength of the positioning post 213 (especially its root connected to the inclined region 214) on the core housing 21, so as to avoid the positioning post 213 from breaking or falling off in extreme situations such as drops or collisions of the bone conduction headphones 10.

[0133] See again Figure 15 The number of second limiting structures 234 can be two, spaced apart along the minor axis. In some embodiments, the projections of the first limiting structure 232 onto the reference plane and the projections of the two second limiting structures 234 onto the reference plane are sequentially connected to form an acute triangle (e.g., Figure 15 (As shown by the dashed triangle). Specifically, this acute triangle can be either an acute isosceles triangle or an equilateral triangle. This arrangement ensures that the interaction points between the movement support 23 and the movement housing 21 are as symmetrical as possible, thereby increasing the reliability of the assembly of the movement support 23 and the movement housing 21.

[0134] In some embodiments, the outer contour of the support body 231 may be circular, and the annular peripheral wall 212 may have two arc-shaped recessed areas 2121 arranged opposite each other along the minor axis. In some embodiments, the outer contour of the support body 231 is respectively embedded in the two arc-shaped recessed areas 2121. This arrangement can further restrict the degree of freedom between the movement support 23 and the movement housing 21.

[0135] Based on the above detailed description, when the elastic modulus of the movement housing 21 is greater than that of the ear hook housing 31, the ear hook housing 31, after being connected to the movement housing 21, forms the aforementioned structure (A+B). Due to the difference in stiffness, the resonant frequency of structure (A+B) may be lower (e.g., ...). Figure 16 As shown in the curve (A+B), the aforementioned sound leakage is also prone to occur; however, by improving the structure (A+B) to the structure (B+B), the resonant frequency of the structure can be effectively increased (as shown in the curve (A+B)). Figure 12 (As shown by the curve (B+B)). Based on this, the relevant structure of the movement module 20 is improved in this embodiment.

[0136] like Figure 16As shown, the mechanism module 20 may further include a cover plate 24. In some embodiments, one end of the mechanism housing 21 is open, and the cover plate 24 covers the open end of the mechanism housing 21 to form a cavity structure for accommodating the mechanism 22. In some embodiments, the cover plate 24 may cover the other end of the annular peripheral wall 212 away from the bottom wall 211 and be disposed opposite to the bottom wall 211. In this case, the cover plate 24 and the mechanism housing 21 can be connected by adhesive bonding or a combination of snap-fit ​​and adhesive bonding. In some embodiments, the ear hook housing 31 is connected to the cover plate 24, for example, the earphone fixing part 311 covers the side of the cover plate 24 away from the mechanism housing 21 in a fully covered or partially covered manner. Some embodiments of this application are illustrated by example of the earphone fixing part 311 fully covering the cover plate 24. In this case, the ear hook housing 31 and the mechanism housing 21 can still be connected by adhesive bonding or a combination of snap-fit ​​and adhesive bonding.

[0137] In some embodiments, the shape of the cover plate 24 may correspond to the shape of the opening at the open end of the mechanism housing 21, so that the cover plate 24 can completely cover the opening at the open end of the mechanism housing 21. In some embodiments, the cover plate 24 may only cover a portion of the opening at the open end of the mechanism housing 21, while the other portion of the opening may be covered by the ear hook housing 31 (such as the earphone fixing part 311). In some embodiments, the cover plate 24 and the mechanism housing 21 may also be connected by means of threaded connection or welding. In some embodiments, the ear hook housing 31 and the mechanism housing 21 may also be connected by means of threaded connection or welding.

[0138] It should be noted that: Figure 16 The ear hook housing is shown in the diagram, mainly to facilitate the description of the relative positional relationship between the ear hook housing and the cover plate, and thus implicitly to indicate a possible assembly method between the ear hook housing and the cover plate.

[0139] In some embodiments, the elastic modulus of the mechanism housing 21 is greater than that of the ear hook housing 31, and the elastic modulus of the cover plate 24 is greater than that of the ear hook housing 31. In this case, using the cover plate 24 instead of the earphone fixing part 311 to connect with the mechanism housing 21 helps increase the stiffness of the structure at the open end of the mechanism housing 21 (specifically, the cover plate 24 and the earphone fixing part 311), thereby helping to reduce the difference between the stiffness of the bottom wall 211 of the mechanism housing 21 and the stiffness of the structure at its open end. This arrangement ensures that the mechanism housing 21 has sufficient stiffness to keep its resonant frequency in the highest possible high-frequency range, also helps to increase the resonant frequency of the structure (mechanical housing 21 + cover plate 24 + earphone fixing part 311), and helps to improve the aforementioned sound leakage.

[0140] In some embodiments, the ratio of the difference between the stiffness K4 of the movement housing 21 and the stiffness K3 of the cover plate 24 to the stiffness K4 of the movement housing 21 can be less than or equal to 30%. That is, (K4-K3) / K4≤30%, or K3 / K4≥70%. For example, the ratio of the difference between the stiffness K4 of the movement housing 21 and the stiffness K3 of the cover plate 24 to the stiffness K4 of the movement housing 21 can be less than or equal to 20%. That is, (K4-K3) / K4≤20%, or K3 / K4≥80%. As another example, the ratio of the difference between the stiffness K4 of the movement housing 21 and the stiffness K3 of the cover plate 24 to the stiffness K4 of the movement housing 21 can be less than or equal to 10%. That is, (K4-K3) / K4≤10%, or K3 / K4≥90%. In some embodiments, the stiffness K4 of the movement housing 21 can be represented by the stiffness of a portion of the movement housing 21. For example, the stiffness K4 of the movement housing 21 can be represented by the stiffness of the portion of the movement housing 21 that contacts the skin. By way of example only, when the movement housing 21 includes a bottom wall 211 and an annular peripheral wall 212, the stiffness K1 of the bottom wall 211 can be used to represent the stiffness K4 of the movement housing 21. In the embodiments described below, the stiffness K1 of the bottom wall 211 is mainly used as an example to represent the stiffness of the movement housing 21 for illustration.

[0141] In some embodiments, the elastic modulus of the cover plate 24 may be less than or equal to the elastic modulus of the movement housing 21. For example, the elastic modulus of the cover plate 24 may be equal to the elastic modulus of the movement housing 21. In this case, the cover plate 24 and the movement housing 21, after being connected, can form a structure similar to (B+B) described above. This arrangement ensures that the ratio of the difference between the stiffness K1 of the bottom wall 211 and the stiffness K3 of the cover plate 24 to the stiffness K1 of the bottom wall 211 is less than or equal to 10%. That is, (K1-K3) / K1≤10%, or K3 / K1≥90%.

[0142] In some embodiments, the area of ​​the bottom wall 211 may be greater than, less than, or equal to the area of ​​the cover plate 24. In some embodiments, the thickness of the bottom wall 211 may be greater than, less than, or equal to the area of ​​the cover plate 24. The specific area and thickness relationship between the bottom wall 211 and the cover plate 24 can be determined based on the stiffness of the bottom wall 211 and the stiffness of the cover plate 24.

[0143] In some embodiments, the area of ​​the bottom wall 211 is less than or equal to the area of ​​the cover plate 24, and the thickness of the bottom wall 211 is less than or equal to the thickness of the cover plate 24. Based on the detailed description above, reducing the area of ​​the bottom wall 211 can increase the resonant frequency of the movement housing 21 while ensuring a certain level of wearing comfort. Therefore, in some embodiments, in order to ensure that the movement housing 21 has sufficient rigidity so that its resonant frequency is located in the highest possible high-frequency region, the area of ​​the bottom wall 211 can be less than or equal to the area of ​​the cover plate 24, that is, the area of ​​the opening end of the movement housing 21 is greater than the area of ​​the bottom wall 211. In some embodiments, according to the above-mentioned relationship K∝(E·t) / S, when the elastic modulus of the cover plate 24 is less than or equal to the elastic modulus of the movement housing 21, and the area of ​​the bottom wall 211 is less than or equal to the area of ​​the cover plate 24, in order to satisfy the above-mentioned relationship (K1-K3) / K1≤10%, the thickness of the bottom wall 211 needs to be less than or equal to the thickness of the cover plate 24.

[0144] In some embodiments, the cover plate may be made of any one or more of polycarbonate, polyamide, and acrylonitrile-butadiene-styrene mixed with glass fiber and / or carbon fiber.

[0145] In some embodiments, the material of the cover plate 24 may be the same as that of the movement housing 21. For example, both the cover plate 24 and the movement housing 21 may be made of a mixture of polycarbonate and glass fiber and / or carbon fiber. In some embodiments, in order to make the stiffness K1 of the movement housing 21 greater than the stiffness K3 of the cover plate 24, the glass fiber and / or carbon fiber content ratio of the movement housing 21 (e.g., bottom wall 211) may be greater than that of the cover plate 24. In some embodiments, according to the above-described relationship K∝(E·t) / S, in order to satisfy the above-described relationship K3 / K1≥90%, the ratio of the thickness to area of ​​the cover plate 24 to the ratio of the thickness to area of ​​the bottom wall 211 needs to be greater than or equal to 90%. For example, the ratio of the thickness to area of ​​the bottom wall 211 may be equal to the ratio of the thickness to area of ​​the cover plate 24.

[0146] It should be noted that, according to the above relationship K∝(E·t) / S, in order to satisfy the relationship (K1-K3) / K1≤10%, the structural parameters (e.g., thickness, area, and proportion) of the cover plate 24 and the movement housing 21 can be designed based on their materials, or the materials of the cover plate 24 and the movement housing 21 can be selected based on their structural parameters. Therefore, the above embodiments are only examples to provide two possible design schemes.

[0147] Based on the above detailed description, after the cover plate 24 replaces the headphone fixing part 311 and is connected to the mechanism housing 21, the headphone fixing part 311 still needs to be connected to the side of the cover plate 24 away from the mechanism housing 21. For example, the headphone fixing part 311 can fully cover the cover plate 24, or the headphone fixing part 311 can cover the cover plate 24 (i.e., the headphone fixing part 311 only covers part of the cover plate 24).

[0148] In some embodiments, if both the ear hook housing 31 and the cover plate 24 are made of plastic, and the elastic modulus of the former is less than that of the latter, they can be formed into an integral structural component by two-color injection molding. If the ear hook housing 31 is made of plastic and the cover plate 24 is made of metal, and the elastic modulus of the former is less than that of the latter, they can be formed into an integral structural component by metal insert injection molding. In this case, the ear hook housing 31 and the cover plate 24 will be connected to the mechanism housing 21 as a whole. This arrangement can well ensure the consistency of vibration between the ear hook housing 31 and the cover plate 24; however, it will also be difficult to install the buttons mentioned above, the second microphone mentioned later, etc., between the ear hook housing 31 and the cover plate 24.

[0149] In some embodiments, the earphone fixing part 311 and the cover plate 24 can also be manufactured as an integral structural component by means of 3D printing or other methods. In some embodiments, the earphone fixing part 311 and the cover plate 24 can be connected by means of threaded connection or welding. In some embodiments, the earphone fixing part 311 and the cover plate 24 can be connected by adhesive bonding or a combination of snap-fit ​​and adhesive bonding. At this time, the ear hook housing 31 and the cover plate 24 are also provided with the button mentioned above, the second microphone mentioned later, etc., the specific structure of which will be described in detail later. In some embodiments, the adhesive ( Figure 16 (Not shown in the image) The filling degree between the two should be as large as possible, for example, greater than or equal to 90%. This is because when the filling degree of the adhesive between the earphone fixing part 311 and the cover plate 24 is small, not only is it difficult to guarantee the connection strength between the earphone fixing part 311 and the cover plate 24, but the vibration of the two may also have a large hysteresis problem. Air may also be trapped between them, which will adversely affect the resonant frequency of the structure. That is, the beneficial effect of improving the structure (A+B) to the structure (B+B) mentioned above is difficult to guarantee, and the structure may also have noise problems during vibration.

[0150] In some embodiments, the filling degree of the adhesive between the earphone fixing part 311 and the cover plate 24 can be the ratio of the volume occupied by the adhesive to the volume of the space between the earphone fixing part 311 and the cover plate 24. In some embodiments, the filling degree of the adhesive between the earphone fixing part 311 and the cover plate 24 is greater than or equal to 80%. In other embodiments, the filling degree of the adhesive between the earphone fixing part 311 and the cover plate 24 is greater than or equal to 90%.

[0151] In addition, in some embodiments under equivalent conditions, such as Figure 17 As shown, the different types of adhesives (e.g., structural adhesive, hot melt adhesive, instant adhesive, silicone, etc.) applied between the earphone fixing part 311 and the cover plate 24 have a significant impact on the resonant frequency of the structure. In some embodiments, by Figure 17 It can be concluded without a doubt that different types of colloids do affect the resonant frequency of a structure. If we rank the beneficial effects of the aforementioned colloids on the resonant frequency from best to worst, the order is: structural adhesive > hot melt adhesive > instant adhesive > silicone. It should be noted that because silicone is generally soft, its beneficial effect on the resonant frequency of the structure is the weakest. Therefore, if the resonant frequency of the structure is considered, a harder colloid can be used between the earphone fixing part 311 and the cover plate 24.

[0152] Based on the above detailed description, on the one hand, the mechanism support 23 can be used to fix the mechanism 22 inside the mechanism housing 21 to increase the reliability of the mechanism 22 driving the mechanism housing 21 to vibrate; on the other hand, the cover plate 24 can be used to increase the rigidity of the structure located at the opening end of the mechanism housing 21 (specifically, the cover plate 24 and the earphone fixing part 311) to reduce the difference between the rigidity of the bottom wall 211 of the mechanism housing 21 and the rigidity of the structure at its opening end. In some embodiments, the fit between the mechanism support 23 and the mechanism housing 21 (especially in the Z direction mentioned above) can be achieved by adhesive bonding between the support body 231 and the bottom wall 211; and / or by snap-fit ​​between the limiting structure and the annular peripheral wall 212. In some embodiments, based on the cover plate 24, another inventive concept is provided for the fit between the mechanism support 23 and the mechanism housing 21 (especially in the Z direction mentioned above).

[0153] like Figure 18 and Figure 19As shown, the cover plate 24 not only covers the open end of the mechanism housing 21, but also has a pressing structure on the side of the cover plate 24 facing the mechanism housing 21. In some embodiments, the pressing structure is used to press and fix the mechanism support 23 inside the mechanism housing 21. With this configuration, the cover plate 24 can not only increase the rigidity of the structure located at the open end of the mechanism housing 21 (specifically, the cover plate 24 and the earphone fixing part 311), but also press the mechanism support 23 inside the mechanism housing 21, thereby enabling the cover plate 24 to achieve "two uses in one piece".

[0154] like Figure 19 As shown, the cover plate 24 may include a cover plate body 241 and a pressing structure integrally connected to the cover plate body 241. In some embodiments, the pressing structure may include a first pressing post 242 and a second pressing post 243, which are spaced apart circumferentially along the cover plate body 241 and abut against the movement support 23. In some embodiments, the plane of the cover plate body 214 may be parallel to the plane of the bottom wall 211, such that the plane of the cover plate body 214 may be parallel to the plane of the support body 231, thereby allowing the extension directions of the first pressing post 242 and the second pressing post 243 to be perpendicular to the plane of the support body 231, that is, the extension directions of the first pressing post 242 and the second pressing post 243 may be parallel to the aforementioned Z direction. This arrangement can effectively restrict the degrees of freedom between the movement support 23 and the movement housing 21, especially in the aforementioned Z direction.

[0155] like Figure 20 As shown, the cover plate 24 may have a major axis direction (e.g., Figure 20 The direction indicated by the dashed line X at the midpoint) and the direction of a minor axis (such as...) Figure 20 (The direction indicated by the dashed line Y). In some embodiments, the dimension of the cover plate 24 along the major axis can be larger than the dimension along the minor axis. In this case, the first pressing post 242 and the second pressing post 243 are spaced apart along the major axis. This arrangement increases the reliability of the cover plate 24 in pressing the movement support 23 into the movement housing 21.

[0156] In some embodiments, the number of second pressing posts 243 can be two spaced apart along the minor axis. In some embodiments, the projections of the first pressing post 242 onto the cover plate body 241 and the projections of the two second pressing posts 243 onto the cover plate body 241 are sequentially connected to form an acute triangle (e.g., Figure 20 (As shown by the dashed triangle). Specifically, this acute triangle can be either an acute isosceles triangle or an equilateral triangle. This arrangement ensures that the interaction points between the cover plate 24 and the movement support 23 are as symmetrical as possible, thereby increasing the reliability of the cover plate 24 in pressing the movement support 23 into the movement housing 21.

[0157] See again Figure 18 The first pressing post 242 contacts and abuts against the first limiting structure 232, and the second pressing post 243 contacts and abuts against the second limiting structure 234. At this time, abutment may not form between the second limiting structure 232 and the annular peripheral wall 212. Figure 13 The abutting fit shown is designed to reduce the machining accuracy of the second limiting structure 232, thereby saving the manufacturing cost of the movement bracket 23.

[0158] Similarly, such as Figure 14 As shown, the first limiting structure 232 may include a first axial extension 2321 and a first radial extension 2322. In some embodiments, the first axial extension 2321 is connected to the support body 231 and extends along the axial direction of the support body 231 (e.g., along the axial direction of the support body 231). Figure 14 The first radial extension 2322 extends towards the side where the movement 22 is located (in the direction indicated by the dashed line Z); the first radial extension 2322 connects to the first axial extension 2321 and extends outward along the radial direction of the support body 231 (that is, in the direction of the diameter of the support body 231). At this time, the insertion hole 233 is provided on the first radial extension 2321, and the first pressing post 242 abuts against the first radial extension 2321, that is, the first pressing post 242 presses against the first radial extension 2321. In some embodiments, such as Figure 14 As shown, the second limiting structure 234 may include a second axial extension 2341 and a second radial extension 2342. In some embodiments, the second axial extension 2341 is connected to the support body 231 and extends axially along the support body 231 toward the side where the movement 22 is located; the second radial extension 2342 is connected to the second axial extension 2341 and extends radially along the support body 231 toward the outside of the support body 231. At this time, the second pressing post 243 abuts against the second radial extension 2342, that is, the two contact and form a pressing force.

[0159] It should be noted that when the number of second pressing posts 243 is two spaced apart along the minor axis, and the projections of the first pressing post 242 on the cover body 241 and the projections of the two second pressing posts 243 on the cover body 241 form an acute triangle, the number of second limiting structures 234 can also be two spaced apart along the minor axis, and each corresponding to a second pressing post 243. This arrangement ensures that when the first pressing post 242 abuts against the first limiting structure 232 (specifically, the first radial extension 2322), the two second pressing posts 243 can abut against the second limiting structure 234 (specifically, the second radial extension 2342), thereby increasing the reliability of the cover 24 pressing the mechanism support 23 into the mechanism housing 21.

[0160] It is worth noting that: Figure 18 As shown, since the first axial extension 2321 and the second axial extension 2341 extend toward the direction close to the cover plate 24, and the first pressing post 242 and the second pressing post 243 also extend toward the direction close to the movement housing 21, the height of the first limiting structure 232 and the second limiting structure 234 relative to the support body 231, and the height of the first pressing post 242 and the second pressing post 243 relative to the cover plate body 241, can both be half the distance between the cover plate body 241 and the support body 231. This design is intended to prevent the first limiting structure 232 and the second limiting structure 234 from breaking or falling off in extreme situations such as drops or collisions due to their excessive height relative to the support body 231; or, to prevent the first pressing column 242 and the second pressing column 243 from breaking or falling off in extreme situations such as drops or collisions due to their excessive height relative to the cover plate body 241, thereby balancing the structural strength of the first limiting structure 232 and the second limiting structure 234 on the support body 231 and the structural strength of the first pressing column 242 and the second pressing column 243 on the cover plate body 241.

[0161] See again Figure 19 The first pressure column 242 is tubular. At this time, as... Figure 18 As shown, the positioning post 213 is not only inserted into the insertion hole 233 to increase the accuracy of the assembly between the movement bracket 23 and the movement housing 21; it is also further inserted into the first pressing post 242 to increase the accuracy of the assembly between the cover plate 24 and the movement housing 21.

[0162] like Figure 21 As shown, the mechanism module 20 may further include a first microphone 25 and a second microphone 26. In some embodiments, after the cover plate 24 is placed over the open end of the mechanism housing 21, the two form a cavity structure for accommodating the mechanism 22. At this time, the first microphone 25 can be accommodated inside the mechanism housing 21, and the second microphone 26 can be disposed outside the mechanism housing 21, so that the cover plate 24 separates the first microphone 25 and the second microphone 26, thereby avoiding interference between them (especially their rear acoustic chambers). With this configuration, the cover plate 24 can not only increase the rigidity of the structure located at the open end of the mechanism housing 21 (specifically, the cover plate 24 and the earphone fixing part 311), and press the mechanism bracket 23 into the mechanism housing 21, but also separate the first microphone 25 and the second microphone 26, thereby enabling the cover plate 24 to achieve "one piece, three uses". In some embodiments, when the ear hook housing 31 is covered by the cover plate 24, that is, when the earphone fixing part 311 is covered by the cover plate 24 on the side away from the mechanism housing 21, the second microphone 26 can be disposed between the cover plate 24 and the earphone fixing part 311.

[0163] In some embodiments, both the first microphone 25 and the second microphone 26 can be connected to the main control circuit board 50 so that they can process the sound and transmit it to the main control circuit board 50. In some embodiments, the first microphone 25 and the second microphone 26 can be any one or a combination of types such as electrodynamic, condenser, piezoelectric, carbon particle, and semiconductor. Specifically, they can be electret microphones or silicon microphones, and their specific structures are within the understanding of those skilled in the art and will not be described in detail here. In this case, the first microphone 25 and the second microphone 26 can be used to pick up the sound of the wearer's environment so that the bone conduction headphones 10 can perform noise reduction processing, thereby improving the user experience of the bone conduction headphones 10; they can also be used to pick up the wearer's voice so that the bone conduction headphones 10 can perform both speaker and microphone functions, thereby expanding the application range of the bone conduction headphones 10. Of course, the first microphone 25 and the second microphone 26 can also pick up the wearer's voice and the sound of their environment at the same time, so that while the bone conduction headphones 10 realizes the microphone function, it can also perform noise reduction processing, thereby improving the user experience of the bone conduction headphones 10.

[0164] like Figure 21 As shown, an annular flange 215 is provided on the inner side of the annular peripheral wall 212, and the first microphone 25 can be embedded and fixed in the annular flange 215. A microphone receiving groove 244 is recessed on the side of the cover plate 24 (specifically, the cover plate body 241) away from the mechanism housing 21. The second microphone 26 can be placed in the microphone receiving groove 244 and covered by the earphone fixing part 311, thereby reducing the overall thickness after the second microphone 26 is placed between the cover plate 24 and the earphone fixing part 311, thus increasing the structural feasibility and reliability of the three components. In other words, the first microphone 25 is fixed to the annular peripheral wall 212, and the second microphone 26 is fixed to the cover plate 24. At this time, in order to facilitate the first microphone 25 and the second microphone 26 in picking up the wearer's voice and / or the sound of their environment, a pickup hole (not shown in the figure) is generally opened on the annular peripheral wall 212 corresponding to the position of the first microphone 25, and a pickup hole (not shown in the figure) is generally also opened on the headphone fixing part 311 corresponding to the position of the second microphone 26. In some embodiments, the sound input direction of the first microphone 25 can be parallel to the cover plate 24 or inclined relative to the cover plate 24, and the sound input direction of the second microphone 26 can be perpendicular to the cover plate 24. This arrangement allows the first microphone 25 and the second microphone 26 to pick up sound from different directions, thereby increasing the noise reduction effect and / or microphone effect of the bone conduction headphones 10, and thus improving the user experience of the bone conduction headphones 10.

[0165] In some embodiments, the first microphone 25 may be attached to the annular peripheral wall by means of bonding, snap-fitting, or threaded connection. In some embodiments, the second microphone 26 may be disposed between the cover plate 24 and the earphone fixing part 311. In some embodiments, a microphone receiving slot may be disposed on the mechanism housing 21. In some embodiments, the cover plate 24 may be provided with a channel through which a power supply wire passes. This wire can be used for the second microphone 26 and the mechanism 21.

[0166] It should be noted that: generally, the sound input direction of the first microphone 25 is perpendicular to the annular peripheral wall 212; and based on the above detailed description, the plane containing the cover plate 24 (specifically, the cover plate body 214) can be parallel to the plane containing the bottom wall 211, while the annular peripheral wall 212 can be perpendicular to the bottom wall 211, or it can be tilted outward relative to the bottom wall 211 at an angle (e.g., the tilt angle is less than or equal to 30°). Therefore, when the annular peripheral wall 212 is perpendicular to the bottom wall 211, the sound input direction of the first microphone 25 is parallel to the cover plate 24; and when the annular peripheral wall 212 is tilted outward relative to the bottom wall 211 at an angle, the sound input direction of the first microphone 25 is tilted relative to the cover plate 24, and the tilt angles of the two can be approximately equal.

[0167] In some embodiments, the projection of the second microphone 26 onto the cover plate 24 can be offset from the projection of the first microphone 25 onto the cover plate 24. This arrangement allows the first microphone 25 and the second microphone 26 to pick up sound from different directions, thereby increasing the noise reduction and / or microphone effect of the bone conduction headphones 10 and improving user experience. In some embodiments, the projection of the second microphone 26 onto the cover plate 24 can be positioned closer to the bend transition portion 312 than the projection of the first microphone 25 onto the cover plate 24. This arrangement increases the relative distance between the first microphone 25 and the second microphone 26, further enabling them to pick up sound from different directions. It is worth noting that a larger relative distance is better.

[0168] It should be noted that: in Figure 21 From the perspective shown, the first microphone 25 and the second microphone 26 are located on opposite sides of the cover plate 24, with the first microphone 25 located on the back of the cover plate 24, making its projection on the cover plate 24 practically invisible. Therefore, for ease of description, it is simply assumed here that the first microphone 25 and the second microphone 26 are located on the same side of the cover plate 24, and a dashed box is used to represent the projection of the first microphone 25 on the cover plate 24.

[0169] like Figure 22 As shown, the cover plate 24 may have a major axis direction (e.g., Figure 22 The direction indicated by the dashed line X at the midpoint) and the direction of a minor axis (such as...) Figure 22 The direction indicated by the dashed line Y). In some embodiments, the dimension of the cover plate 24 along the major axis can be larger than the dimension along the minor axis. In this case, the line connecting the projection of the second microphone 26 onto the cover plate 24 and the projection of the first microphone 25 onto the cover plate 24 (e.g., the direction indicated by the dashed line Y). Figure 22 The angle between the dashed line shown and the major axis direction is less than 45°; for example, this angle is less than or equal to 10°. As another example, the line connecting the projection of the second microphone 26 onto the cover plate 24 and the projection of the first microphone 25 onto the cover plate 24 coincides with the major axis direction. This arrangement allows the projections of the second microphone 26 and the first microphone 25 onto the cover plate 24 to be staggered, while also increasing the relative distance between them, thereby enabling the first microphone 25 and the second microphone 26 to further pick up sounds from different directions. In some embodiments, the projection of the second microphone 26 onto the cover plate 24 can be positioned closer to the bend transition portion 312 than the projection of the first microphone 25 onto the cover plate 24.

[0170] Based on the above detailed description, the mechanism 22 and the first microphone 25 can be housed inside the mechanism housing 21, and the cover plate 24 can cover the open end of the mechanism housing 21. To facilitate wiring, corresponding through holes and grooves can be formed on the cover plate 24. For example... Figure 21 and Figure 16 As shown, the cover plate 24 also has a wire hole 245. In some embodiments, since the projection of the second microphone 26 on the cover plate 24 can be positioned closer to the bend transition portion 312 than the projection of the first microphone 25 on the cover plate 24, the wire hole 245 can be positioned closer to the first microphone 25. This arrangement allows the wires connecting the first microphone 25 to the main control circuit board 50 to pass through. Figure 21 and Figure 16 (Not shown in the image) The wire can extend from inside the housing 21 through the wire hole 245 to the side of the cover plate 24 opposite to the housing 21, and further extend through the wiring channel in the bending transition portion 312 to the receiving compartment 313. At this time, after the earphone fixing portion 311 covers the cover plate 24, the wire will also be at least partially (its length can be at least the straight-line distance of the wire hole 245 relative to the second microphone 26) between the cover plate 24 and the earphone fixing portion 311.

[0171] In some embodiments, such as Figure 21 and Figure 16As shown, a wiring groove 246 may also be recessed on the side of the cover plate 24 away from the housing 21. In some embodiments, one end of the wiring groove 246 communicates with the wire hole 245, and the aforementioned wire can further extend along the wiring groove 146. This arrangement reduces the overall thickness of the cover plate 24 and the earphone fixing part 311 after a portion of the wire is installed, thereby increasing the structural feasibility and reliability of the three components.

[0172] It should be noted that after the wires are routed from inside the housing 21 through the wire hole 245 and the wire routing groove 246, adhesive can be applied at least at both ends of the wire routing groove 246 to fix the wires relative to the cover plate 24, thereby increasing the structural compactness of the cover plate 24, the earphone fixing part 311, and the wires. In some embodiments, applying adhesive, especially at the wire hole 245, can also improve the airtightness of the housing module 20.

[0173] In some embodiments, such as Figure 21 As shown, two cable management grooves 216 can also be arranged side by side on the inner side of the annular peripheral wall 212, and the two cable management grooves 216 can be close to the annular flange 215. In some embodiments, positive and negative external conductors ( Figure 21 (not shown in the image) and the positive and negative terminals of the movement 22 ( Figure 21 The two solder joints formed between (not shown) are housed in two cable management slots 216. This arrangement is to prevent short circuits and other defects when the positive and negative terminals of the movement 22 are soldered to the positive and negative terminals of the aforementioned wires, thereby increasing the reliability of the wiring in the movement 22.

[0174] In some other embodiments, the bone conduction headphones 10 are also provided with, for example... Figure 4 When button 36 is shown, a button receiving groove can also be provided on the side of the cover plate 24 away from the mechanism housing 21. Figure 1 (See image, but not labeled). In some embodiments, button 36 is disposed within a button receiving slot and covered by the earphone fixing part 311. This arrangement reduces the overall thickness between the cover plate 24 and the earphone fixing part 311 after the button 36 is disposed, thereby increasing the structural feasibility and reliability of the three components. In this case, the button receiving slot is similar to the microphone receiving slot 244 described above. In some embodiments, the button receiving slot may be disposed on the mechanism housing 21. In some embodiments, the cover plate 24 may have a channel through which a power supply wire passes. This wire can be used to connect the button 36 and the mechanism 21.

[0175] It should be noted that: Figure 2 The shown accommodating compartment 313 is primarily used to house the main control circuit board 50, while Figure 4 The shown accommodating compartment 313 can primarily be used to house the battery 60. Therefore, both the first microphone 25 and the second microphone 26 can specifically correspond to... Figure 2The ear hook assembly 30 shown facilitates connection between the two and the main control circuit board 50, thereby shortening the wiring distance. Furthermore, due to the limited size of the mechanism module 20 and the ear hook assembly 30, placing the button 36 together with the first microphone 25 and the second microphone 26 might cause structural interference among the three. Therefore, the button 36 can specifically correspond to... Figure 4 The ear hook assembly 30 is shown. In other words, if button 36 corresponds to the left ear hook of the bone conduction headphone 10, then the first microphone 25 and the second microphone 26 can correspond to the right ear hook of the bone conduction headphone 10; conversely, if button 36 corresponds to the right ear hook of the bone conduction headphone 10, then the first microphone 25 and the second microphone 26 can correspond to the left ear hook of the bone conduction headphone 10. In some embodiments, for such Figure 8 Regarding the movement module 20 shown, since it does not have such Figure 16 The cover 24 of the shown mechanism module 20 may require adjustments to the aforementioned structures, such as the first microphone 25, the second microphone 26, and the button 36. For example, the bone conduction headphones 10 may have only one first microphone 25 or one second microphone 26; or, the bone conduction headphones 10 may still have a first microphone 25 and a second microphone 26, with one of the first microphone 25 and the second microphone 26 corresponding to the left ear hook of the bone conduction headphones 10, and the other corresponding to the right ear hook of the bone conduction headphones 10. As another example, the button 36 may be specifically fixed to the side of the headphone fixing part 311 near the housing 21.

[0176] like Figure 23 As shown, the mechanism 22 may include a magnetic shield 221, a magnet 222, a magnetic plate 223, and a coil 224. In some embodiments, the magnetic shield 221 may include a base plate 2211 and an annular side plate 2212 integrally connected to the base plate 2211. In some embodiments, the magnet 222 may be disposed within the annular side plate 2212 and fixed to the base plate 2211, and the magnetic plate 223 may be fixed to the side of the magnet 222 facing away from the base plate 2211. The coil 224 may be disposed within the magnetic gap 225 between the magnet 222 and the annular side plate 2212 and may be fixed to the mechanism support 23. In some embodiments, the magnetic gap between the magnet 222 and the annular side plate 2212 may be m, 1.0 mm ≤ m ≤ 1.5 mm, in order to balance the movement requirements of the coil 224 and the compactness of the mechanism 22.

[0177] It should be noted that: Figure 23 The movement shown can correspond to Figure 8 The shown movement module can also correspond to Figure 16 The movement module shown. In some embodiments, Figure 23The movement support is shown in the diagram, mainly to facilitate the description of the relative positional relationship between the movement support and the movement, and thus implicitly to indicate a possible assembly method between the movement support and the movement.

[0178] In some embodiments, the magnet 222 may be a metal alloy magnet, ferrite, etc. For example, the metal alloy magnet may be any one or a combination of neodymium iron boron, samarium cobalt, alnico, iron chromium cobalt, aluminum iron boron, iron carbon aluminum, etc. The ferrite may be any one or a combination of barium ferrite, iron ferrite, manganese ferrite, lithium manganese ferrite, etc. In some embodiments, the magnet 222 has a magnetization direction to facilitate the formation of a relatively stable magnetic field.

[0179] The magnetic shield 221 and the magnetic plate 223 cooperate with each other, mainly to adjust the magnetic field generated by the magnet 222, so as to increase the utilization rate of the magnetic field. In some embodiments, the magnetic shield 221 and the magnetic plate 223 can be made of paramagnetic materials such as metal materials, metal alloys, metal oxide materials, and amorphous metal materials. Specifically, the paramagnetic materials mentioned above can be, but are not limited to, iron, iron-silicon alloys, iron-aluminum alloys, nickel-iron alloys, iron-cobalt alloys, low-carbon steel, silicon steel sheets, silicon steel sheets, ferrite, etc.

[0180] With this configuration, coil 224 is situated within the magnetic field formed by magnet 222, magnetic shield 221, and magnetic plate 223, and is subjected to Ampere force under the excitation of an electrical signal. Driven by the Ampere force, coil 224 causes the movement 22 to vibrate mechanically. Movement 22 can be fixed within movement housing 21 via movement bracket 23, allowing movement housing 21 to vibrate along with it. In some embodiments, the resistance of coil 224 can be 8Ω to balance the generation of Ampere force with the circuit structure of movement 22.

[0181] Based on the detailed description above, the volume of the mechanism housing 21 is often limited, and it must at least accommodate structural components such as the mechanism 22, mechanism support 23, and first microphone 25. Although a larger Ampere force can be obtained by increasing the size of the mechanism 22 (e.g., increasing the volume of the magnet 222 and / or increasing the number of turns of the coil 224), thereby better driving the mechanism housing 21, this will also increase the weight and volume of the mechanism module 20, which is not conducive to the lightweighting of the mechanism module 20. To this end, some embodiments of this application have conducted extensive research and optimization design on the mechanism 22 based on the Ampere force formula F = BILsinθ. For example, parameter B can represent the strength of the magnetic field formed by the magnet 222, the magnetic shield 221, and the magnetic plate 223; parameter L can represent the effective length of the coil 224 in the aforementioned magnetic field; and parameter θ can represent the angle between the two (here, θ = 90°). In some embodiments, parameter I can represent the current in the coil 224 at a certain moment. Clearly, for a designed, manufactured, and assembled movement 22, parameters B and L are often relatively fixed values; while parameter I changes with the electrical signal input into the movement 22. Therefore, the optimized design of the movement 22 can be simply regarded as the optimized design of the force coefficient BL; and parameters B and L mainly depend on the structural parameters such as the shape and size of the magnet 222, the magnetic shield 221, and the magnetic plate 223.

[0182] The following section provides a detailed explanation of the influence of structural parameters such as the shape and size of magnet 222, magnetic shield 221, and magnetic plate 223 on the force coefficient BL:

[0183] In this embodiment, the magnet 222 can be cylindrical. For example... Figure 24 As shown, the horizontal axis represents the diameter φ of magnet 222, and the vertical axis represents the thickness t1 of magnet 222. It is clear that the larger the diameter φ of magnet 222, the larger the force coefficient BL; the larger the thickness t1 of magnet 222, the larger the force coefficient BL. In some embodiments, in order for the bone conduction headphones 10 to generate sufficient volume, that is, to generate a sufficiently large ampere force to drive coil 224 and thus cause the core housing 21 to vibrate, the force coefficient BL generally needs to be greater than 1.3. However, considering the weight and volume of the core module 20 (specifically, core 22), the diameter φ and thickness t1 of magnet 222 can satisfy the following relationship: 10.5mm ≤ φ ≤ 11.5mm, 3.0mm ≤ t1 ≤ 4.0mm. For example, the diameter φ of magnet 222 can be 10.8mm, and the thickness t1 can be 3.5mm.

[0184] In this embodiment, the diameter of the magnetic plate 223 can be equal to the diameter of the magnet 222, and the thickness of the magnetic plate 223 can be equal to the thickness of the magnetic shield 221. The magnetic plate 223 and the magnetic shield 221 can also be made of the same material. Figure 25 As shown, the horizontal axis represents the thickness t2 of the magnetic shield 221, and the vertical axis represents the force coefficient BL. It is clear that within a certain range, the force coefficient BL increases with increasing thickness t2; however, for t2 > 0.8 mm, the change in the force coefficient BL is not significant. That is, increasing the thickness t2 beyond t2 > 0.8 mm not only yields minimal benefit but also increases the weight of the movement 22. Therefore, considering the value of the force coefficient BL (at least greater than 1.3) and the weight and volume of the movement module 20 (specifically, the movement 22), the thickness t2 of the magnetic plate 223 and the magnetic shield 221 can satisfy the following relationship: 0.4 mm ≤ t2 ≤ 0.8 mm. For example, the thickness t2 can be 0.5 mm.

[0185] In this embodiment, the annular side plate 2212 can also be cylindrical, and its diameter D can be the sum of the diameter φ of the magnet 222 and twice the magnetic gap m, that is, D = φ + 2m. Figure 26 As shown, the horizontal axis represents the height h of the magnetic shield 221 (specifically, the annular side plate 2212), and the vertical axis represents the force coefficient BL. It is clear that within a certain range, the force coefficient BL increases with the height h of the magnetic shield 221; however, for h > 4.2 mm, the force coefficient BL decreases. Therefore, considering the value of the force coefficient BL (at least greater than 1.3) and the weight and volume of the mechanism module 20 (specifically, the mechanism 22), the height h of the magnetic shield 221 can satisfy the following relationship: 3.4 mm ≤ h ≤ 4.0 mm. For example, the height h of the magnetic shield 221 can be 3.7 mm.

[0186] See again Figure 1 The bone conduction headphones 10 may include two core modules 20. In some embodiments, either of the two core modules 20 may correspond to... Figure 8 The movement module shown can correspond to another one. Figure 16 The movement module shown is illustrated. It should be noted that the specific structure of each movement module 20 may be the same as or similar to any of the above embodiments, and can be referred to the detailed description of any of the above embodiments, which will not be repeated here.

[0187] like Figure 27As shown, the magnets 222 of the two core modules 20 have opposite polarities near the bottom wall 211 of their respective core housings 21, so that the two core modules 20 can attract each other when the bone conduction headphones 10 are not being worn. This arrangement facilitates the user's storage of the bone conduction headphones 10. It is worth noting that in some embodiments, the magnets 222 are also used to generate a magnetic field, causing the coil 224 to vibrate under the excitation of an electrical signal. In this case, the magnets 222 can achieve "two uses in one".

[0188] In some embodiments, the magnet 222 may not be pre-magnetized before the movement module 20 is assembled; instead, after the movement module 20 is assembled, it is placed as a whole in a magnetization device for magnetization, thereby making the magnet 222 magnetic. In some embodiments, after the above-mentioned magnetization process, the magnetic field directions of the magnets 222 of the two movement modules 20 can be as follows: Figure 27 As shown. With this configuration, since the magnet 222 is not magnetic before assembly, the assembly of the core module 20 will not be affected by magnetic forces, thereby increasing the assembly efficiency and yield of the core module 20, and thus increasing the production capacity and efficiency of the bone conduction headphones 10.

[0189] like Figure 28 As shown, the rear-mounted assembly 40 may include an elastic metal wire 41, a wire 42, and an elastic covering 43 that covers the elastic metal wire 41 and the wire 42. In some embodiments, the elastic covering 43 and the wire 42 are an integrally formed extruded structure; the covering 43 further forms a wire-passing channel (…). Figure 28 (Not specified in the text) The elastic metal wire 41 is threaded through the threading channel. For example, the threading channel is formed during the extrusion molding process. In some embodiments, the material of the elastic metal wire 41 may be, but is not limited to, spring steel, titanium alloy, titanium-nickel alloy, chromium-molybdenum steel, etc., and the material of the elastic cover 43 may be, but is not limited to, polycarbonate, polyamide, silicone, rubber, etc., so that the rear hanging component 40 can balance wearing comfort and structural rigidity.

[0190] It should be noted that: because the elastic metal wire 41 is threaded through the threading channel inside the covering body 43, Figure 28 The area where the medium elastic metal wire 41 is located can be simply regarded as the threading channel inside the covering body 43.

[0191] In some embodiments, the diameter of the threading channel in its natural state can be smaller than the diameter of the elastic wire 41, so that the elastic wire 41 can be fixed with the elastic cover 43 after being inserted into the threading channel, so as to avoid the rear hanging assembly 40 from being "sunken" due to the excessive gap between the elastic cover 43 and the elastic wire 41, especially when the user presses the rear hanging assembly 40, thereby increasing the structural compactness of the rear hanging assembly 40.

[0192] In some embodiments, the number of conductors 42 may be at least two strands. In some embodiments, each conductor 42 may include a metal wire and an insulating layer covering the metal wire. Figure 28 (Not shown in the image), the insulating layer is mainly used to achieve electrical insulation between metal wires.

[0193] It should be noted that: such as Figure 1 , Figure 2 , Figure 4 , Figure 8 and Figure 16 As shown, since the main control circuit board 50 and the battery 60 can be respectively housed in the two ear hook assemblies 30, and Figure 2 and Figure 4 The ear hook assembly 30 shown can correspond to the left and right ear hooks of the bone conduction headphone 10, respectively, so that not only do the main control circuit board 50 and the battery 60 need to be connected via the wire 42 built into the back cover assembly 40, but also... Figure 1 The mechanism module 20 (specifically, its mechanism 22) and button 36 of the middle (left) ear hook assembly 30 need to be further connected to the corresponding wires 42 built into the back cover assembly 40. Figure 1 The main control circuit board 50 of the middle (right) ear hook assembly 30 is connected, corresponding to... Figure 1 The mechanism module 20 of the middle (right) ear hook assembly 30 (specifically, its mechanism 22, first microphone 25, and second microphone 26) also needs to be further connected via the wire 42 built into the back cover assembly 40 to the corresponding... Figure 1 The battery 60 is connected to the middle (left) ear hook assembly 30. Therefore, the wire 42 needs to connect at least the three circuits described above.

[0194] Based on the above detailed description, the rear-mounted component 40 of this application embodiment can be manufactured according to the following process flow:

[0195] 1) Provide an extrusion molding equipment and wiring.

[0196] On the one hand, raw materials for forming the elastic coating 43 can be added to the extrusion molding equipment. In some embodiments, during the extrusion molding process, the raw materials of the elastic coating 43 will undergo at least the following stages: melting and plasticizing, die extrusion, shaping, cooling, and traction.

[0197] On the other hand, the number of wires 42 can be at least two strands to facilitate the connection between the various electronic components in the bone conduction headphones 10. In some embodiments, each wire 42 may include a metal wire and an insulating layer covering the metal wire to achieve electrical insulation between the metal wires.

[0198] 2) Place the wire in the extrusion molding equipment so that the raw material of the elastic coating and the wire can obtain the corresponding first semi-finished product during the extrusion molding process.

[0199] In some embodiments, the extrusion molding equipment can pull the wire 42 so that the elastic cover 43 can cover the wire 42 during the extrusion molding process. In some embodiments, the die head portion of the extrusion molding equipment can be provided with a core so that the aforementioned threading channel can be simultaneously formed inside the elastic cover 43 during the extrusion molding process. Therefore, the aforementioned first semi-finished product can specifically be an integral structure of the elastic cover 43 and the wire 42, and the interior of the cover 43 has a threading channel that extends substantially along its axial direction.

[0200] 3) Based on the usage requirements of the rear-mounted components, the first semi-finished product is further cut into a second semi-finished product with a corresponding length.

[0201] In some embodiments, the actual length of the second semi-finished product may be slightly greater than its length used for the rear-mounted component, that is, the second semi-finished product still has a certain margin at this time, so as to facilitate subsequent processing steps.

[0202] 4) The elastic metal wire is threaded through the threading channel of the second semi-finished product to obtain the rear hanging component.

[0203] In some embodiments, after step 4), not only is it necessary to shape the back-hook assembly into a curved structure of a certain shape to fit the back of the user's head, but it is also necessary to process the two ends of the back-hook assembly accordingly to facilitate a structural connection between it and the ear hook assembly, and to realize the circuit connection between the main control circuit board, battery, buttons, mechanism, and first and second microphones. Therefore, the back-hook assembly obtained in step 4) is essentially only a semi-finished product.

[0204] By means of the above method, not only can a very long semi-finished product (specifically, an integral structure of elastic cover 43 and wire 42) be produced in one go by extrusion molding process, but a wire-threading channel extending generally along its axis can also be formed inside the cover 43 at the same time. Then, the semi-finished product is cut into small segments of corresponding lengths for subsequent processing, so that the production efficiency of the rear-mounted component can be effectively improved.

[0205] The above description is only a part of the embodiments of this application and does not limit the scope of protection of this application. Any equivalent device or equivalent process transformation made based on the content of this application specification and drawings, or directly or indirectly applied to other related technical fields, are similarly included in the patent protection scope of this application.

[0206] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0207] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0208] Furthermore, those skilled in the art will understand that aspects of this application can be described and illustrated through several patentable types or situations, including any new and useful combination of processes, machines, products, or substances, or any new and useful improvements thereof. Accordingly, aspects of this application can be implemented entirely by hardware, entirely by software (including firmware, resident software, microcode, etc.), or by a combination of hardware and software. All of the above hardware or software may be referred to as a “data block,” “module,” “engine,” “unit,” “component,” or “system.” Furthermore, aspects of this application may manifest as a computer product located on one or more computer-readable media, the product including computer-readable program code.

[0209] Furthermore, unless expressly stated in the claims, the order of processing elements and sequences, the use of numbers and letters, or other names described in this application are not intended to limit the order of the processes and methods of this application. Although various examples have been discussed in the foregoing disclosure of some embodiments that are currently considered useful, it should be understood that such details are for illustrative purposes only, and the appended claims are not limited to the disclosed embodiments. Rather, the claims are intended to cover all modifications and equivalent combinations that conform to the substance and scope of the embodiments of this application. For example, while the system components described above can be implemented by hardware devices, they can also be implemented solely by software solutions, such as installing the described system on existing processing devices or mobile devices.

[0210] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments of the invention, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0211] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed depending on the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of scope in some embodiments of this application are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

[0212] For each patent, patent application, patent application publication, and other material such as articles, books, specifications, publications, and documents referenced in this application, the entire contents of that patent are incorporated herein by reference. This excludes historical application documents that are inconsistent with or conflict with the content of this application, as well as documents that limit the broadest scope of the claims in this application (currently or subsequently appended to this application). It should be noted that if there are any inconsistencies or conflicts between the descriptions, definitions, and / or terminology used in the supplementary materials of this application and the content of this application, the descriptions, definitions, and / or terminology used in this application shall prevail.

[0213] Finally, it should be understood that the embodiments described in this application are merely illustrative of the principles of the embodiments of this application. Other modifications may also fall within the scope of this application. Therefore, alternative configurations of the embodiments of this application are considered as examples and not limitations, and are regarded as consistent with the teachings of this application. Accordingly, the embodiments of this application are not limited to the embodiments explicitly described and illustrated in this application.

Claims

1. A bone conduction headphone, characterized in that, The bone conduction headphones include two ear hook assemblies, two mechanism modules, and a back hook assembly. The two mechanism modules are respectively disposed at one end of the corresponding ear hook assembly, and the two ends of the back hook assembly are respectively connected to the other ends of the two ear hook assemblies away from the mechanism modules. Each ear hook assembly includes an ear hook housing, and each mechanism module includes a mechanism housing and a mechanism. One end of the mechanism housing is open, forming a cavity structure for accommodating the mechanism. The elastic modulus of the mechanism housing is greater than that of the ear hook housing. The ear hook housing includes an earphone fixing part, which covers the open end of the mechanism housing. A reinforcing structure is provided on the earphone fixing part to reduce the stiffness difference between the earphone fixing part and the mechanism housing.

2. The bone conduction headphones as described in claim 1, characterized in that, The ear hook housing includes the earphone fixing part, the bending transition part and the receiving compartment connected in sequence; the ratio of the difference between the stiffness of the skin contact area of ​​the mechanism housing and the stiffness of the earphone fixing part to the stiffness of the skin contact area of ​​the mechanism housing is less than or equal to 10%.

3. The bone conduction headphones according to claim 2, characterized in that, The reinforcing structure includes reinforcing ribs disposed on the earphone fixing part.

4. The bone conduction headphones according to claim 3, characterized in that, The number of reinforcing ribs is multiple, and the multiple reinforcing ribs are arranged in a side-by-side or grid-like manner.

5. The bone conduction headphones according to claim 4, characterized in that, The earphone fixing part has a major axis direction and a minor axis direction. The dimension of the earphone fixing part along the major axis direction is larger than the dimension along the minor axis direction. A plurality of reinforcing ribs are respectively arranged along the major axis direction and the minor axis direction to form a grid; or, the plurality of reinforcing ribs extend along the minor axis direction in a strip-like manner and are arranged side by side along the major axis direction.

6. The bone conduction headphones according to claim 3, characterized in that, The ratio between the thickness of the reinforcing rib and the thickness of the earphone fixing part is within the closed interval [0.8, 1.2].

7. The bone conduction headphones according to claim 3, characterized in that, The ratio between the width of the reinforcing rib and the thickness of the earphone fixing part is within the closed interval [0.4, 0.6].

8. The bone conduction headphones according to claim 3, characterized in that, The ratio between the spacing of the reinforcing ribs and the thickness of the earphone fixing part is within the closed interval [1.6, 2.4].

9. The bone conduction headphones according to claim 6, characterized in that, The thickness of the reinforcing rib is the same as the thickness of the earphone fixing part.

10. The bone conduction headphones according to claim 7, characterized in that, The width of the reinforcing rib is half the thickness of the earphone fixing part.

11. The bone conduction headphones according to claim 8, characterized in that, The spacing between the reinforcing ribs is twice the thickness of the earphone fixing part.

12. The bone conduction headphones according to claim 3, characterized in that, The number of reinforcing ribs is multiple, and the multiple reinforcing ribs are arranged radially with a preset reference point on the earphone fixing part as the center.

13. The bone conduction headphones according to claim 12, characterized in that, The reinforcing ribs are spaced apart at one end and their extensions intersect at the preset reference point.

14. The bone conduction headphones according to claim 2, characterized in that, The reinforcing structure is a metal component, and the reinforcing structure and the earphone fixing part are integrally molded metal inserts.

15. The bone conduction headphones according to claim 2, characterized in that, The core housing includes a bottom wall and an annular peripheral wall. The bottom wall includes a skin contact area of ​​the core housing. One end of the annular peripheral wall is integrally connected to the bottom wall. The earphone fixing part includes a fixing body connected to the bending transition part and an annular flange integrally connected to the fixing body and extending towards the core housing. The annular flange and the other end of the annular peripheral wall away from the bottom wall are abutted against each other. The reinforcing structure includes an arc-shaped structure disposed between the fixing body and the annular flange; or, the reinforcing structure is a thickening layer integrally disposed with the fixing body.

16. The bone conduction headphones according to claim 2, characterized in that, The ear hook housing includes an elastic metal wire, which is disposed in the earphone fixing part, the bending transition part and / or the receiving compartment.

17. The bone conduction headphones according to claim 2, characterized in that, The reinforcing structure is made of any one of polycarbonate, polyamide, or acrylonitrile-butadiene-styrene copolymer.

18. The bone conduction headphones according to claim 1, characterized in that, The movement module also includes a cover plate, which covers the opening of the movement housing, and the ear loop housing is connected to the cover plate; wherein, the elastic modulus of the cover plate is greater than the elastic modulus of the ear loop housing.

19. The bone conduction headphones according to claim 18, characterized in that, The elastic modulus of the cover plate is less than or equal to the elastic modulus of the movement housing.

20. The bone conduction headphones according to claim 18, characterized in that, The mechanism housing includes a bottom wall and an annular peripheral wall. One end of the annular peripheral wall is integrally connected to the bottom wall. The cover plate covers the other end of the annular peripheral wall and is disposed opposite to the bottom wall. At least a portion of the bottom wall is in contact with the user's skin. The ratio of the difference between the stiffness of the bottom wall and the stiffness of the cover plate to the stiffness of the bottom wall is less than or equal to 10%.

21. The bone conduction headphones according to claim 20, characterized in that, The area of ​​the bottom wall is less than or equal to the area of ​​the cover plate, and the thickness of the bottom wall is less than or equal to the thickness of the cover plate.

22. The bone conduction headphones according to claim 20, characterized in that, The cover plate is made of the same material as the movement housing, and the ratio of the thickness to the area of ​​the cover plate to the ratio of the thickness to the area of ​​the bottom wall is greater than or equal to 90%.

23. The bone conduction headphones according to claim 22, characterized in that, The ratio of the thickness to the area of ​​the bottom wall is equal to the ratio of the thickness to the area of ​​the cover plate.

24. The bone conduction headphones according to claim 18, characterized in that, The ear hook housing includes a storage compartment, a bending transition section, and an earphone fixing section. The storage compartment is used to accommodate a battery or a main control circuit board. The bending transition section connects the storage compartment and the earphone fixing section and is bent to be hung on the outside of the ear. The earphone fixing section covers the side of the cover plate away from the main housing.

25. The bone conduction headphones according to claim 24, characterized in that, The earphone fixing part is connected to the cover plate by adhesive bonding or a combination of snap-fit ​​and adhesive bonding.

26. The bone conduction headphones according to claim 25, characterized in that, The cover plate is completely covered by the earphone fixing part, and the adhesive between the earphone fixing part and the cover plate has a filling degree of greater than or equal to 90%.

27. The bone conduction headphones according to claim 24, characterized in that, The cover plate has a button receiving groove on the side opposite to the mechanism housing. The ear hook assembly also includes a button and a decorative component. The decorative component includes a decorative bracket, which is mounted and fixed on one side of the ear hook housing. The earphone fixing part has a button adapter hole. The button is located in the button receiving groove and exposed through the button adapter hole. The decorative bracket extends further in a cantilever form above the button exposed through the button adapter hole and can trigger the button under external pressure.

28. The bone conduction headphones according to claim 24, characterized in that, The cover plate has a microphone receiving groove on the side opposite to the core housing. The core module also includes a first microphone and a second microphone. The first microphone is housed in the core housing, and the second microphone is disposed in the microphone receiving groove and covered by the earphone fixing part.

29. The bone conduction headphones according to claim 18, characterized in that, The cover plate is made of any one or more of polycarbonate, polyamide, and acrylonitrile-butadiene-styrene mixed with glass fiber and / or carbon fiber.

30. The bone conduction headphones according to claim 1, characterized in that, The ear hook shell is made of any one of polycarbonate, polyamide, or acrylonitrile-butadiene-styrene copolymer.

31. The bone conduction headphones according to claim 1, characterized in that, The material of the movement housing is any one or more of polycarbonate, polyamide, and acrylonitrile-butadiene-styrene mixed with glass fiber and / or carbon fiber.

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