An integrated unit with waterway, capacitor and power module and an application unit

Abstract

This invention provides an integrated unit and application unit with water channels, capacitors, and a power module, relating to the field of power module technology. It includes a water-cooled plate, DC bus capacitors connected to both sides of the water-cooled plate, and a power module. The water-cooled plate has a heat dissipation cavity with its opening facing the power module. The power module is tightly connected to one side of the water-cooled plate via a sealing part, which seals the heat dissipation cavity. The water-cooled plate has an inlet and an outlet, respectively communicating with opposite sides of the heat dissipation cavity. The DC bus capacitors are connected to the side of the water-cooled plate away from the power module via connectors located on both sides of the inlet and outlet, respectively. This forms a heat dissipation channel acting on the DC bus capacitors and the power module through the inlet, outlet, and heat dissipation cavity, solving the problem of low efficiency caused by the lack of a universal integrated unit in standard molded module designs, which necessitates repetitive design of water channels and housings.

Description

Technical Field

[0001] This invention relates to the field of power module technology, and in particular to an integrated unit and application unit having a water channel, a capacitor and a power module. Background Technology

[0002] Semiconductor device modules generate heat during operation. Therefore, in practical applications, cooling channels are installed after the module is installed to dissipate heat, reduce the device temperature, and ensure that the junction temperature of the power semiconductor devices remains within the allowable range. However, standard molded modules, in their three-in-one electronic control shared-casing design, lack a universal integrated unit. The cooling channels and capacitors at the bottom of the power module need to be redesigned, requiring repeated and extensive modifications to the shared casing for each use, resulting in complex operations and low efficiency. Summary of the Invention

[0003] In order to overcome the above-mentioned technical defects, the purpose of this invention is to provide an integrated unit and application unit with water channels, capacitors and power modules, to solve the problem that standard plastic-encapsulated module designs lack an integrated unit, requiring repeated design of the housing and water channels each time, resulting in low efficiency.

[0004] This invention discloses an integrated unit comprising a water channel, a capacitor, and a power module.

[0005] It includes a water-cooled plate, DC bus capacitors connected to both sides of the water-cooled plate, and a power module;

[0006] The water-cooled plate has a heat dissipation water cavity with its opening facing the power module. The power module is tightly connected to one side of the water-cooled plate through a sealing part and the heat dissipation water cavity is sealed.

[0007] The water-cooled plate is provided with an inlet and an outlet that are respectively connected to the opposite sides of the heat dissipation water cavity;

[0008] The DC bus capacitor and the water-cooled plate are connected by connectors located on both sides of the water inlet and water outlet, respectively, and a heat dissipation channel is formed through the water inlet, water outlet and heat dissipation cavity to act on the DC bus capacitor and the power module.

[0009] Preferably, the water inlet is connected to the water inlet pipe through the water inlet, and the volume of the water inlet gradually increases from the side where the water inlet is located to the side connected to the heat dissipation water cavity;

[0010] The water outlet is connected to the water outlet pipe through the water outlet, and the volume of the water outlet gradually decreases along the side connected to the heat dissipation water cavity toward the side where the water outlet is located.

[0011] Preferably, the water inlet is configured such that its width gradually increases from the side where the water inlet is located toward the side that communicates with the heat dissipation water cavity;

[0012] The water outlet section is configured such that its width gradually decreases from the side connected to the heat dissipation water cavity toward the side where the water outlet is located.

[0013] Preferably, the water inlet is configured such that its height gradually increases from the side where the water inlet is located toward the side that communicates with the heat dissipation water cavity;

[0014] The water outlet section is configured such that its height gradually decreases from the side connected to the heat dissipation water cavity toward the side where the water outlet is located.

[0015] Preferably, the volume of the water inlet and / or the water outlet varies linearly or exponentially along the side where the water inlet and / or the water outlet is located toward the side communicating with the heat dissipation water cavity.

[0016] Preferably, the water-cooled plate is provided with a first sealing element at the connection between the water inlet pipe and the water inlet;

[0017] The water-cooled plate is provided with a second sealing element at the connection between the water outlet pipe and the water outlet.

[0018] Preferably, the casing of the DC bus capacitor extends along its length.

[0019] The portion of the connector extending through the housing of the DC bus capacitor is fixed to the water-cooled plate.

[0020] The present invention also provides an integrated unit having a water channel, a capacitor, and a power module.

[0021] Includes the integrated unit described in any of the above;

[0022] It also includes control and drive boards for controlling the operating status of the DC bus capacitor, power module and cooling water channel;

[0023] The control and drive board is connected to the side of the power module away from the cooling channels.

[0024] The present invention also provides an application unit that applies at least one of the integrated units described in any of the above claims;

[0025] At least one DC bus capacitor is connected in parallel on the integrated unit along a direction perpendicular to the line connecting the water inlet and the water outlet.

[0026] Compared with existing technologies, the above technical solution has the following advantages:

[0027] This invention connects a DC bus capacitor and a power module to a water-cooled plate. The water-cooled plate has a heat dissipation cavity, and inlet and outlet sections respectively connected to opposite sides of the heat dissipation cavity. The inlet, outlet, and heat dissipation cavity form a heat dissipation channel that directly acts on the DC bus capacitor and power module. The housings of the power module and DC bus capacitor are fixed to the water-cooled plate, realizing an integrated module of the DC bus capacitor, power module, and heat dissipation channel. This can be used as a standardized module, directly applicable during use without requiring separate modifications to the water channel or housing structure each time. It addresses the problem of low efficiency due to the lack of an integrated unit in standard plastic-encapsulated module designs. Furthermore, at least other DC bus capacitors can be connected in parallel to the integrated unit along a direction perpendicular to the line connecting the inlet and outlet sections, enabling capacity expansion. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of an embodiment of the integrated unit and application unit with water channels, capacitors and power modules described in this invention.

[0029] Figure 2 This is a schematic diagram of the housing of the DC bus capacitor in Embodiment 1 of the integrated unit and application unit having water channels, capacitors and power modules described in this invention.

[0030] Figure 3 This is a schematic diagram illustrating the structure of the heat dissipation water cavity in Embodiment 1 of the integrated unit and application unit having water channels, capacitors and power modules described in this invention.

[0031] Figure 4 This is a schematic diagram illustrating the water inlet and water outlet sections in Embodiment 1 of the integrated unit and application unit with water channels, capacitors and power modules described in this invention.

[0032] Figure 5 This is a schematic diagram illustrating the gradually increasing height of the water inlet section in Embodiment 1 of the integrated unit and application unit with water channels, capacitors and power modules described in this invention.

[0033] Figure 6 This is a schematic diagram of the structure of an integrated unit and application unit having a water channel, a capacitor and a power module according to a second embodiment of the present invention;

[0034] Figure 7 This is a schematic diagram illustrating the structure of the thermal pad on the circuit board, as described in Embodiment 1 or Embodiment 2 of the integrated unit and application unit with water channels, capacitors and power modules of the present invention.

[0035] Figure label:

[0036] 1-DC bus capacitor; 2-Water-cooled plate; 3-Power module; 4-Sealing part; 5-Cooling water cavity; 6-Water inlet; 61-Water inlet; 7-Water outlet; 71-Water outlet; 8-Connector; 9-Control and drive board; 10-Capacitor thermal pad; 11-Board thermal pad; 12-Current sensor. Detailed Implementation

[0037] The advantages of the present invention will be further illustrated below with reference to the accompanying drawings and specific embodiments.

[0038] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0039] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The singular forms “a,” “the,” and “the” as used in this disclosure and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

[0040] It should be understood that although the terms first, second, third, etc., may be used in this disclosure to describe various information, such information should not be limited to these terms. These terms are used only to distinguish information of the same type from one another. For example, without departing from the scope of this disclosure, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."

[0041] In the description of this invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0042] In the description of this invention, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "linking" should be interpreted broadly. For example, they can refer to mechanical or electrical connections, or internal connections between two components. They can be direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0043] In the following description, suffixes such as "module," "part," or "unit" used to denote elements are used only for the convenience of the description of the invention and have no specific meaning in themselves. Therefore, "module" and "part" can be used interchangeably.

[0044] Example 1: This embodiment discloses an integrated unit with a water channel, capacitor, and power module. (See attached document.) Figures 1-2 The system includes a water-cooled plate, DC bus capacitors connected to both sides of the water-cooled plate, and power modules (including but not limited to IGBT modules and SiC modules). In this embodiment, the power module is tightly connected to one side of the water-cooled plate via a sealing part, and the housing of the DC bus capacitor is connected to the other side of the water-cooled plate via a connector, thus integrating the DC bus capacitor, power module, and heat dissipation channels. Specifically, the connectors may include bolts, locating pins, etc., or the housing of the DC bus capacitor can be aligned with the edge of the water-cooled plate (edge ​​to edge) and then fixedly connected by adhesive or welding, which is simple to operate and easy to disassemble. Alternatively, the connection can be achieved through fixed point welding or other existing connection structures.

[0045] In this embodiment, refer to Figure 1-4 The cavity opening of the water-cooled plate faces the heat dissipation cavity of the DC bus capacitor. The power module is tightly connected to one side of the water-cooled plate through a sealing part and seals the heat dissipation cavity. For example, the sealing part is a component or part used to tightly connect the power module and the water-cooled plate. For example, it includes a sealing groove provided at the connection between the power module and the water-cooled plate. When the power module is connected to the water-cooled plate, the sealing ring in the sealing groove is squeezed to tightly connect the power module and the water-cooled plate, thereby reducing the gap between them. In addition, other existing connection structures (including but not limited to snap-fit, welding, bolt connection, etc.) that tightly connect the power module and the water-cooled plate can also be used here.

[0046] The water-cooled plate is provided with an inlet and an outlet that are respectively connected to the opposite sides of the heat dissipation cavity. The DC bus capacitor is connected to the side of the water-cooled plate away from the power module through connectors located on both sides of the inlet and outlet. The inlet, outlet and heat dissipation cavity form a heat dissipation channel that directly acts on the DC bus capacitor and the power module, realizing the integration of the heat dissipation channel, the DC bus capacitor and the power module. That is, cooling water enters the heat dissipation cavity from the inlet, and the formed heat dissipation channel passes between the DC bus capacitor and the power module to dissipate heat from the power module and the DC bus capacitor. The heat dissipation cavity can be set to correspond to the shape of the DC bus capacitor to achieve sufficient heat dissipation from the DC bus capacitor.

[0047] As described above, this integrated module comprising the DC bus capacitor, power module, and cooling water channel can be used as a standardized module, allowing for direct mass production without requiring individual modifications to the water channel or casing structure each time. The cooling water cavity is positioned along the DC bus capacitor. For example, multiple baffles can be installed within the cooling water cavity to create different water flow paths (such as ring-shaped or S-shaped), increasing the heat dissipation path length and improving the heat dissipation effect.

[0048] In this embodiment, the water outlet and water inlet are located on both sides of the heat dissipation cavity. The water outlet and water inlet can be correspondingly located on both sides of the DC bus capacitor. The housing of the DC bus capacitor and the water-cooling plate can be connected by multiple connectors located on both sides of the water inlet and water outlet. The connectors can avoid the area where the DC bus capacitor extends perpendicular to the line connecting the water inlet and water outlet. If the water inlet and water outlet are located on both sides of the length direction of the heat dissipation cavity, the connectors can avoid the area where the DC bus capacitor extends along the width direction; if the water inlet and water outlet are located on both sides of the width direction of the heat dissipation cavity, the connectors can avoid the area where the DC bus capacitor extends along the length direction. This forms a region in a certain direction that can be used to arrange multiple DC bus capacitors, allowing for further expansion of the capacitor capacity. To improve the heat dissipation effect, a heat-conducting pad can also be provided at the connection points between the water inlet and water outlet and the power module (see [reference]). Figure 7 Additionally, a capacitor thermal pad can be placed between the water-cooled plate and the DC bus capacitor connection (see [reference]). Figure 7 Auxiliary heat dissipation structures such as ( ).

[0049] Specifically, the housing of the DC bus capacitor is connected to the water-cooled plate via connectors. Specifically, the housing of the DC bus capacitor extends along its length. The portion of the connector extending through the housing of the DC bus capacitor is fixed to the water-cooled plate. That is, the connection between the housing of the DC bus capacitor and the water-cooled plate avoids the area where the DC bus capacitor extends along its width (Y) direction. Connectors are attached at both ends of the DC bus capacitor's length (X) direction. When it is necessary to expand the capacitance, install multiple integrated units, or arrange other components during use, they can be arranged side-by-side in the area where the DC bus capacitor extends along its width (Y) or height (Z) direction to achieve capacitance expansion and improve space utilization within the equipment.

[0050] As a supplement, to further increase the connection stability between the DC bus capacitor's casing and the water-cooling plate, connecting parts can be installed at other locations between the water-cooling plate and the DC bus capacitor's casing. This should not affect the aforementioned capacity expansion or other component installations. Additionally, multiple leads for communication with the DC bus capacitor can be installed on its casing for use with other components. It should also be noted that in the actual manufacturing process, to achieve the inlet and outlet water sections, after setting up the cooling water cavity on the water-cooling plate, installation areas for the inlet and outlet water sections are reserved on the water-cooling plate. Then, the inlet and outlet water sections, with gradually changing internal widths or heights, are welded to the water-cooling plate to form a structure similar to a sleeve fitted onto both ends of the cooling water cavity and communicating with it. This forms a cooling water channel for ease of manufacturing. Other operations that improve manufacturing efficiency are also possible.

[0051] In a preferred embodiment, the water inlet is connected to an inlet pipe (not shown in the figure) via an inlet port, and the volume of the water inlet gradually increases from the side where the inlet port is located towards the side connected to the heat dissipation cavity; the water outlet is connected to an outlet pipe (not shown in the figure) via an outlet port, and the volume of the outlet gradually decreases from the side connected to the heat dissipation cavity towards the side where the outlet port is located. Specifically, the inlet pipe and outlet pipe can be configured to be perpendicular or parallel to the water-cooled plate, and can be located outside the water-cooled plate, connected to the heat dissipation cavity via the inlet and outlet ports. The water inlet and outlet can be configured to have the same shape or different shapes; in this embodiment, they are configured to have the same shape. The volume gradually increases from the side where the water inlet is located towards the side connected to the cooling water cavity. This gradually reduces the pressure of the water entering the cooling water cavity from the inlet pipe, thus filling the entire cooling water cavity to achieve sufficient heat dissipation for the DC bus capacitor. This also reduces the risk of excessive water pressure flowing directly through the cooling water cavity without accumulating within it. Conversely, the volume gradually decreases from the side connected to the cooling water cavity towards the side where the water outlet is located, which increases the water pressure at the outlet and thus increases the water flow velocity at the outlet. This prevents cooling water from accumulating at the outlet and maintains the flow of cooling water in the water channel.

[0052] In the above embodiments, as an option, refer to Figure 4 The water inlet is configured such that its width gradually increases from the side where the water inlet is located towards the side communicating with the heat dissipation cavity; the water outlet is configured such that its width gradually decreases from the side communicating with the heat dissipation cavity towards the side where the water outlet is located. Specifically, the water inlet and water outlet have the largest width on the side communicating with the heat dissipation cavity, which in this embodiment can be the same as the width of the heat dissipation cavity. The water inlet can be located on the centerline of the water-cooling plate, forming an approximately fan-shaped or triangular area along the side communicating with the heat dissipation cavity. Alternatively, the water inlet can be located at any position on the water-cooling plate, forming a curved area with gradually increasing volume along the side communicating with the heat dissipation cavity. The water outlet can also have a similar configuration to the water inlet.

[0053] In the above embodiments, as an option, refer to Figure 5The water inlet section is configured to gradually increase in height along the side where the water inlet is located towards the side communicating with the heat dissipation water cavity; the water outlet section is configured to gradually decrease in height along the side communicating with the heat dissipation water cavity towards the side where the water outlet is located. Based on the above requirement, the water pressure is gradually reduced in the water inlet section and gradually increased in the water outlet section. This can also be controlled by the height of the water inlet section and the water outlet section. The gradual increase in height along the side where the water inlet is located towards the side communicating with the heat dissipation water cavity controls the incoming water pressure to gradually decrease, allowing the cooling water to accumulate in the heat dissipation water cavity for a certain period of time. The gradual decrease in height along the side communicating with the heat dissipation water cavity towards the side where the water outlet is located increases the speed at which the cooling water moves to the water outlet, realizing the circulation of cooling water and improving the cooling effect.

[0054] In this embodiment, based on the above, refer to Figures 1-5 The width or height of the inlet and / or outlet sections can be adjusted to regulate the volume. Alternatively, the width and height can be set in a certain ratio, causing the volume of the inlet and / or outlet sections to change linearly or exponentially along the side where the inlet and / or outlet are located towards the side communicating with the cooling water cavity. That is, the pressure of the cooling water entering the inlet decreases linearly or exponentially, thereby reducing damage to the water-cooled plate caused by rapid water pressure changes or obstructed water flow. In this embodiment, the inlet and outlet sections are arranged relatively uniformly, forming a symmetrical distribution relative to the cooling water cavity. This ensures symmetrical pressure changes on both sides, allowing the cooling water to form a uniform and stable cooling path through the cooling water channels. This increases the cooling effect on the DC bus capacitors while also enhancing safety during practical use.

[0055] In a preferred embodiment, the water-cooled plate is provided with a first sealing element (not shown in the figure) at the connection between the water inlet pipe and the water inlet; the water-cooled plate is provided with a second sealing element (not shown in the figure) at the connection between the water outlet pipe and the water outlet. The first and second sealing elements can be the same or different. The first and / or second sealing elements include sealing rings, sealing strips, sealant, or other structures for sealing, which improves safety during use. Simultaneously, foam or sealing strips can be provided at the contact portion between the DC bus capacitor and the water-cooled plate (around the heat dissipation cavity) to reduce the gap between the power module and the water-cooled plate. Other sealing elements can also be provided at the connection between the housing of the DC bus capacitor and the water-cooled plate to further increase the stability and safety of the integrated unit.

[0056] Example 2: This embodiment also provides an integrated unit with a water channel, capacitor, and power module, see below. Figure 6 and Figure 7The system includes the integrated unit described in Embodiment 1 above; it also includes a control and drive board, which is used to control the operating status of the DC bus capacitor, power module, and cooling water channel. The control and drive board is connected to the side of the power module opposite to the cooling water channel. Specifically, the control and drive board is used to electrically connect and control the DC bus capacitor, power module, or cooling water channel, controlling the operation of the DC bus capacitor and power module in the integrated unit, or the on / off state of the water flow loop in the cooling water channel (e.g., the operation of the inlet and outlet sections can form a water flow loop for heat dissipation). In this embodiment, the control and drive board can be an integrated drive and control board, and can also be connected to a current sensor to achieve precise circuit control of the DC bus capacitor, power module, etc. The integrated unit can also form a standard module, and the water channel settings, such as in Embodiment 1, can be adjusted to suit various implementation scenarios without requiring separate modification of the water channel or shell structure each time.

[0057] Example 3: This embodiment provides an application unit that uses at least one integrated unit as described in Example 1 above. At least one DC bus capacitor is connected in parallel on the integrated unit along a direction perpendicular to the line connecting the water inlet and the water outlet. This DC bus capacitor can be connected in parallel with the DC bus capacitor on the integrated unit to expand the capacitance. The DC bus capacitors on the integrated unit are connected by leads passing through the housing of the DC bus capacitors. This enables the batch use of the integrated unit and allows for capacity expansion according to the application scenario. As an example, a three-dimensional coordinate system is established with the center point of the integrated unit as the origin. If the direction connecting the water inlet and the water outlet is the X-axis direction of the integrated unit, then capacity expansion can be set in either the Y-axis or Z-axis direction of the integrated unit.

[0058] It should be noted that the embodiments of the present invention have better implementability and are not intended to limit the present invention in any way. Any person skilled in the art may use the above-disclosed technical content to change or modify it into equivalent effective embodiments. However, any modifications or equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. An integrated unit comprising a water channel, a capacitor, and a power module, characterized in that: It includes a water-cooled plate, DC bus capacitors connected to both sides of the water-cooled plate, and a power module; The water-cooled plate has a heat dissipation water cavity with its opening facing the power module. The power module is tightly connected to one side of the water-cooled plate through a sealing part and the heat dissipation water cavity is sealed. Multiple baffles are set in the heat dissipation water cavity to form a ring or S-shaped water flow path. The shape of the heat dissipation water cavity corresponds to that of the DC bus capacitor. The water-cooled plate is provided with an inlet and an outlet that are respectively connected to the opposite sides of the heat dissipation water cavity; The DC bus capacitor is connected to the side of the water-cooled plate away from the power module by connectors located on both sides of the water inlet and water outlet, so as to form a heat dissipation channel acting on the DC bus capacitor and the power module through the water inlet, water outlet and heat dissipation cavity. The water inlet is connected to the water inlet pipe through the water inlet, and the volume of the water inlet gradually increases from the side where the water inlet is located toward the side that is connected to the heat dissipation water chamber. The water outlet is connected to the water outlet pipe through the water outlet, and the volume of the water outlet gradually decreases from the side connected to the heat dissipation water cavity to the side where the water outlet is located. The water inlet section is configured such that its width gradually increases from the side where the water inlet is located toward the side that communicates with the heat dissipation water cavity; The water outlet section is configured such that its width gradually decreases from the side connected to the heat dissipation water cavity toward the side where the water outlet is located. The water inlet section is configured such that its height gradually increases from the side where the water inlet is located toward the side that communicates with the heat dissipation water cavity; The water outlet section is configured such that its height gradually decreases from the side connected to the heat dissipation water cavity toward the side where the water outlet is located. The volume of the water inlet and / or the water outlet varies linearly or exponentially along the side where the water inlet and / or the water outlet is located toward the side that communicates with the heat dissipation water cavity. The water inlet and outlet have the widest width on the side connected to the heat dissipation cavity, and the width of the heat dissipation cavity is the same. The water inlet is located on the center line of the water-cooling plate, so that an area approximately fan-shaped or triangular in shape is formed along the water inlet to the side connected to the heat dissipation cavity. and A heat-conducting pad is installed on the part where the water inlet and outlet are connected to the power module, and a heat-conducting pad is installed between the water-cooled plate and the DC bus capacitor. The connection between the housing of the DC bus capacitor and the water-cooled plate avoids the area where the DC bus capacitor extends along the width direction, and the connectors are connected at both ends of the DC bus capacitor along the length direction. When it is necessary to expand the capacitor or set up multiple integrated units during use, they are arranged side by side in the area where the DC bus capacitor extends along the width or height direction.

2. The integrated unit according to claim 1, characterized in that: The water-cooled plate is provided with a first sealing element at the connection between the water inlet pipe and the water inlet; The water-cooled plate is provided with a second sealing element at the connection between the water outlet pipe and the water outlet.

3. The integrated unit according to claim 1, characterized in that: The casing of the DC bus capacitor extends along its length. The portion of the connector extending through the housing of the DC bus capacitor is fixed to the water-cooled plate.

4. An integrated unit comprising a water channel, a capacitor, and a power module, characterized in that: Includes the integrated unit as described in any one of claims 1-3 above; It also includes control and drive boards for controlling the operating status of the DC bus capacitor, power module and cooling water channel; The control and drive board is connected to the side of the power module away from the cooling channels.

5. An application unit, characterized in that: Apply at least one integrated unit as described in any one of claims 1-3 above; At least one DC bus capacitor is connected in parallel on the integrated unit along a direction perpendicular to the line connecting the water inlet and the water outlet.

Images