electronic devices

Abstract

This application discloses an electronic device, relating to the field of communication technology. The electronic device includes a housing, a sound-emitting unit, and a shock-absorbing assembly. The housing has a receiving cavity and includes a rear cover. The sound-emitting unit is housed within the receiving cavity, and the sound-emitting unit and the rear cover are spaced apart. The shock-absorbing assembly is housed within the receiving cavity and is disposed between the rear cover and the sound-emitting unit, with the shock-absorbing assembly and the sound-emitting unit spaced apart to form a rear cavity.

Description

Technical Field

[0001] This application belongs to the field of communication technology, and specifically relates to an electronic device. Background Technology

[0002] In related technologies, in order to achieve the thinning of electronic devices, the gap between the sound-generating unit and the back cover in electronic devices is getting smaller and smaller. When the diaphragm of the sound-generating unit vibrates to produce sound, the airflow generated on one side of the diaphragm flows out through the sound outlet. However, because the gap between the sound-generating unit and the back cover is getting smaller and smaller, the airflow generated on the other side of the diaphragm can directly impact the back cover. The back cover vibrates under the impact of the airflow, and the vibration of the back cover will affect the structural stability and working performance of various components in the electronic device. Summary of the Invention

[0003] This application aims to provide an electronic device that at least solves the technical problem that the airflow-driven housing vibration generated during the sound-generating process of the diaphragm of the sound-generating unit affects the structural stability and working performance of various components in the electronic device.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows:

[0005] In a first aspect, embodiments of this application provide an electronic device, which includes a housing, a sound-emitting unit, and a shock-absorbing component. The housing has a receiving cavity and includes a rear cover. The sound-emitting unit is received within the receiving cavity, and the sound-emitting unit and the rear cover are spaced apart. The shock-absorbing component is received within the receiving cavity and is disposed between the rear cover and the sound-emitting unit, with the shock-absorbing component and the sound-emitting unit spaced apart to form a rear cavity.

[0006] In the electronic device provided in this application, by setting a damping component between the back cover and the sound-generating unit, the damping component can block or reduce the airflow generated by the sound-generating unit's vibration and thus prevent or reduce the back cover from vibrating during the sound-generating unit's vibration and reduce the impact of the housing vibration on the structural stability and working performance of the various components in the electronic device. By setting a damping component and the sound-generating unit to form a rear cavity, it is beneficial to balance the air pressure on one side of the diaphragm, which is beneficial to the diaphragm vibration of the sound-generating unit and improves the sound-generating performance of the sound-generating unit.

[0007] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0008] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0009] Figure 1This is a schematic plan view of an embodiment of the electronic device according to this application;

[0010] Figure 2 This is one of the cross-sectional structural schematic diagrams of an embodiment of the electronic device according to this application;

[0011] Figure 3 This is a cross-sectional structural schematic diagram of an embodiment of the shock-absorbing component according to this application;

[0012] Figure 4 This is a schematic planar structure diagram of an embodiment of the shock-absorbing component according to this application;

[0013] Figure 5 This is one of the partial cross-sectional structural schematic diagrams of an embodiment of the electronic device according to this application;

[0014] Figure 6 This is a second partial cross-sectional structural schematic diagram of an embodiment of the electronic device according to this application;

[0015] Figure 7 This is a second cross-sectional structural schematic diagram of an embodiment of the electronic device according to this application. Detailed Implementation

[0016] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0017] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0018] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0019] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0020] The following is combined with Figures 1 to 7 This application describes an electronic device according to an embodiment of the present application.

[0021] like Figure 1 and Figure 2 As shown, this application embodiment provides an electronic device 100, which includes a housing 1, a sound-emitting unit 2, and a shock-absorbing component 3. The housing 1 has a receiving cavity 11 and includes a rear cover 12. The sound-emitting unit 2 is received in the receiving cavity 11, and the sound-emitting unit 2 and the rear cover 12 are spaced apart. The shock-absorbing component 3 is received in the receiving cavity 11 and is disposed between the rear cover 12 and the sound-emitting unit 2. The shock-absorbing component 3 and the sound-emitting unit 2 are spaced apart to form a rear cavity 21.

[0022] The electronic device 100 provided in this application can be a mobile phone, tablet computer, laptop computer, PDA, in-vehicle electronic device 100, mobile internet device (MID), augmented reality (AR) / virtual reality (VR) device, robot, wearable device, ultra-mobile personal computer (UMPC), netbook, or personal digital assistant (PDA), etc. It can also be a personal computer (PC), television (TV), ATM, or self-service machine, etc. The embodiments of this application do not specifically limit it. The following description uses a mobile phone as an example of electronic device 100.

[0023] The housing 1 may further include a front cover 13 and a middle frame 14, with the front cover 13 and the rear cover 12 respectively mounted on opposite sides of the middle frame 14, i.e., the middle frame 14 is located between the front cover 13 and the rear cover 12. Additionally, the middle frame 14 may include a border that may be arranged around the side of the electronic device 100. The electronic device 100 may also include a display screen 15, which may be mounted on the front cover 13 and located between the front cover 13 and the middle frame 14; the front cover 13 may be a glass cover.

[0024] The sound-generating unit 2 is a transducer that converts electrical signals into sound signals. The sound-generating unit 2 provided in this application can be a moving-coil sound-generating unit, a capacitive sound-generating unit, an electromagnetic sound-generating unit, or a piezoelectric sound-generating unit, etc., which can be selected by those skilled in the art as needed. The sound-generating unit 2 has a vibrating diaphragm 23 that can generate sound. One side of the sound-generating unit 2 with the diaphragm 23 is a front cavity 22 corresponding to the sound-generating unit 2, and the other side of the sound-generating unit 2 is a rear cavity 21 corresponding to the sound-generating unit 2. The housing 1 has a sound outlet 16, and the sound waves emitted by the sound-generating unit 2 can directly propagate through the front cavity 22 and through the sound outlet 16 to the outside of the electronic device 100.

[0025] The sound outlet 16 can be located on the front cover 13 or the middle frame 14. When the sound-emitting unit 2 is a receiver in the electronic device 100, the sound outlet 16 can be located on the front cover 13 for user convenience. When the sound-emitting unit 2 is a speaker in the electronic device 100, the sound outlet 16 can be located on the middle frame 14 to achieve a larger screen-to-body ratio. In the electronic device 100 provided in this application, there are no restrictions on how the front cavity 22 corresponding to the sound-emitting unit 2 is positioned.

[0026] Those skilled in the art will understand that during the vibration of the diaphragm 23 of the sound-generating unit 2, the diaphragm 23 compresses the front cavity 22 to reduce its volume, or compresses the rear cavity 21 to reduce its volume, thereby generating airflow moving in the front cavity 22 and airflow moving in the rear cavity 21. The damping component 3 is disposed between the sound-generating unit 2 and the rear cover 12. The damping component 3 can block or reduce the airflow from the rear cavity 21 acting on the rear cover 12, thereby preventing or reducing the vibration of the rear cover 12 during the vibration of the sound-generating unit 2. The damping component 3 may include deformable materials such as EVA (ethylene-vinyl acetate copolymer) foam, PE (polyethylene) foam, PU (polyurethane) foam, pearl cotton (EPE), and rubber, capable of absorbing the airflow energy of the rear cavity 21. The damping component 3 may also be a structure capable of converting the airflow energy of the rear cavity 21 into elastic potential energy, such as a spring-loaded structural component.

[0027] In the electronic device 100 provided in this application, by setting a damping component 3 between the back cover 12 and the sound-generating unit 2, the damping component 3 can block or reduce the airflow generated by the vibration of the unit and act on the back cover 12, thereby avoiding or reducing the vibration of the back cover 12 during the vibration of the sound-generating unit 2, and avoiding or reducing the impact of the vibration of the housing 1 on the structural stability and working performance of the components in the electronic device 100; by setting the damping component 3 and the sound-generating unit 2 to form a rear cavity 21, it is beneficial to balance the air pressure on one side of the diaphragm 23, which is beneficial to the vibration of the diaphragm 23 of the sound-generating unit 2 and improves the sound-generating performance of the sound-generating unit 2.

[0028] In some embodiments, the shock-absorbing component 3 includes a deformation layer 31, which is at least partially disposed between the back cover 12 and the sound-generating unit 2. The deformation layer 31 includes a plurality of transducers. The electronic device 100 also includes a battery, and the sound-generating unit 2 and the transducers are electrically connected to the battery, respectively.

[0029] The airflow generated by the vibration of the sound-generating unit 2 moves at least between the sound-generating unit 2 and the damping component 3. The deformation layer 31 can be entirely disposed between the back cover 12 and the sound-generating unit 2, so that the deformation layer 31 can block the aforementioned airflow and convert the airflow kinetic energy into deformation potential energy. The airflow generated by the vibration of the sound-generating unit 2 may also flow between other components and the damping component 3. The deformation layer 31 can also extend between other components and the back cover 12, so that the deformation layer 31 can block the aforementioned airflow and convert the airflow kinetic energy into deformation potential energy. Other components may be the battery 5, the control board, etc., disposed on the side of the damping component 3 opposite to the back cover 12.

[0030] The transducer can be based on the magnetostrictive effect, or on the electrostrictive and piezoelectric effects. The transducer can convert the kinetic energy of the airflow within the rear cavity into electrical energy, which is then output to the battery for storage.

[0031] In some embodiments, the damping component 3 further includes a support layer 32, and a deformation layer 31 is disposed on the support layer 32.

[0032] Compared to the deformation layer 31, the support layer 32 has no deformation capacity or weak deformation capacity. The support layer 32 can be made of a rigid material. The support layer 32 can provide a certain support force to the soft and deformable deformation layer 31, so that the shock absorber 3 can maintain a certain shape and facilitate the assembly of the shock absorber 3 into the receiving cavity 11.

[0033] Please refer to the following: Figure 3 and Figure 4 In some embodiments, the support layer 32 has multiple openings 321, and the transducer is a piezoelectric diaphragm 311. The piezoelectric diaphragm 311 is disposed in the openings 321, and the edge of the piezoelectric diaphragm 311 is connected to the support layer 32.

[0034] The piezoelectric diaphragm 311 can undergo a certain deformation under the drive of the airflow generated by the vibration of the sound-generating unit 2, converting the kinetic energy of the airflow into electrical energy, thereby consuming the kinetic energy of the airflow. The battery 5 in the electronic device 100 can be connected to the piezoelectric diaphragm 311 to store the electrical energy generated by the piezoelectric diaphragm 311. Alternatively, the piezoelectric diaphragm 311 can be connected to other electrical components in the electronic device 100 to provide the electrical energy generated by the piezoelectric diaphragm 311 to these other electrical components.

[0035] Please see Figure 5 In another embodiment, the damping component 3 further includes a flow-blocking layer 33, and the transducer includes a plurality of elastic elements 312, which are spaced apart. One end of the elastic element 312 is connected to the flow-blocking layer 33, and the other end is connected to the support layer 32.

[0036] The flow-blocking layer 33 is also made of a rigid material to maintain its fixed shape under airflow impact. Compared to the elastic element 312, the flow-blocking layer 33 has high strength and low deformation capacity. The materials of the flow-blocking layer 33 and the support layer 32 can be the same or different. The elastic element 312 can be a structural component with elastic deformation capacity, such as a rubber component, spring, or sheet. When the elastic element 312 is a device that can generate simple harmonic motion under the push of the flow-blocking layer 33, the transducer can also include magnetic components, transmission components, etc., to convert the simple harmonic mechanical energy of the elastic element 312 into electrical energy.

[0037] Compared to the sum of the relative areas of the multiple elastic elements 312 and the sound-generating unit 2, the relative area of ​​the baffle layer 33 and the sound-generating unit 2 is larger, allowing the baffle layer 33 to receive a larger area of ​​airflow impact generated by the sound-generating unit 2. Furthermore, since multiple elastic elements 312 are also provided between the baffle layer 33 and the rear cover 12, the baffle layer 33 can transfer the kinetic energy received from the airflow impact to the elastic elements 312 to dissipate the kinetic energy, thereby avoiding or reducing the vibration of the rear cover 12.

[0038] The shock-absorbing component 3 can be fixed within the receiving cavity 11 by fixing it to the rear cover 12. The shock-absorbing component 3 can also be fixed within the receiving cavity 11 by fixing it to other components in the electronic device 100. In some embodiments, the electronic device 100 further includes a bracket 4 disposed within the receiving cavity 11, and the shock-absorbing component 3 is connected to the bracket 4.

[0039] The bracket 4 can be a bracket for mounting the control motherboard, so that one bracket 4 can support multiple components. Of course, the bracket 4 can also be a bracket for mounting the battery 5, a bracket for mounting the camera, etc.

[0040] In some embodiments, a portion of the baffle layer 33 is disposed between the bracket 4 and the rear cover 12. The shock-absorbing assembly 3 further includes an adhesive layer 34, which bonds the baffle layer 33 and the bracket 4. One end of the baffle layer 33 is connected to the bracket 4 via the adhesive layer 34, and the other end of the baffle layer 33 is suspended between the sound-generating unit 2 and the rear cover 12. The adhesive layer 34 allows the baffle layer 33 and the bracket 4 to be bonded and fixed, facilitating the assembly of the shock-absorbing assembly 3 with the bracket 4.

[0041] Please see Figure 6 In other embodiments, the shock-absorbing component 3 further includes an adhesive layer 34, which is disposed on the side of the support layer 32 away from the sound-generating unit 2, and is bonded to the rear cover 12. Similarly, the adhesive layer 34 allows the baffle layer 33 and the rear cover 12 to be bonded and fixed, facilitating the assembly of the shock-absorbing component 3 and the rear cover 12.

[0042] Please see Figure 7 In some embodiments, there are multiple sound-generating units 2, and the shock-absorbing component 3 is disposed between the multiple sound-generating units 2 and the back cover 12.

[0043] For example, there are two sound-generating units 2, which are respectively disposed on opposite sides of the battery 5. One sound-generating unit 2 is a speaker, and the other sound-generating unit 2 is a receiver. In certain operating modes, the receiver can also function as a speaker, enabling dual-speaker playback. The shock-absorbing component 3 is disposed between the multiple sound-generating units 2 and the rear cover 12, so that the airflow generated by the multiple sound-generating units 2 can be blocked by the shock-absorbing component 3.

[0044] In some embodiments, the sound-generating unit 2 includes a housing having a cavity, a diaphragm 23 disposed on the housing, and a drive system housed within the cavity. The drive system is used to drive the diaphragm 23 to vibrate and generate sound. The housing has a vent 24 communicating with the cavity and the rear cavity 21.

[0045] Vent 24 connects the chamber and the rear chamber 21 to ensure air pressure balance within the chamber, which is beneficial for the vibration of the diaphragm 23. When the sound-generating unit 2 is a moving coil sound-generating unit 2, the driving system includes a magnetic circuit assembly with a magnetic gap and a voice coil inserted into the magnetic gap. The voice coil drives the diaphragm 23 to vibrate, and vent 24 also connects the magnetic gap and the rear chamber 21.

[0046] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. An electronic device, comprising: The electronic device comprises: a shell having a receiving cavity, the shell comprising a back cover; a sound emitting unit received in the receiving cavity, the sound emitting unit and the back cover being spaced apart; a shock absorbing assembly received in the receiving cavity, the shock absorbing assembly being arranged between the back cover and the sound emitting unit, the shock absorbing assembly and the sound emitting unit being spaced apart to form a back cavity; the shock absorbing assembly comprising a deformation layer, the deformation layer being at least partially arranged between the back cover and the sound emitting unit, the deformation layer comprising a plurality of transducers, the electronic device further comprising a battery, the sound emitting unit and the transducers being electrically connected to the battery, the transducers being configured to deform under the action of airflow generated by the sound emitting unit vibrating to emit sound and convert kinetic energy of the airflow into electrical energy.

2. The electronic device of claim 1, wherein, The shock absorbing assembly further comprises a support layer, and the deformation layer is arranged on the support layer.

3. The electronic device of claim 2, wherein, The support layer has a plurality of openings, the transducers are piezoelectric diaphragms, the piezoelectric diaphragms are arranged in the openings, and edges of the piezoelectric diaphragms are connected to the support layer.

4. The electronic device of claim 2, wherein, The shock absorbing assembly further comprises a flow blocking layer, the transducers comprise elastic members, a plurality of the elastic members are spaced apart, one end of each of the elastic members is connected to the flow blocking layer, and the other end of each of the elastic members is connected to the support layer.

5. The electronic device of claim 4, wherein, The electronic device further comprises a bracket fixed in the receiving cavity, and the shock absorbing assembly is connected to the bracket.

6. The electronic device of claim 5, wherein, Part of the flow blocking layer is arranged between the bracket and the back cover, and the shock absorbing assembly further comprises an adhesive layer, the adhesive layer bonding the flow blocking layer and the bracket.

7. The electronic device of claim 2, wherein, The shock absorbing assembly further comprises an adhesive layer, the adhesive layer being arranged on a side of the support layer away from the sound emitting unit, and the adhesive layer bonding the support layer and the back cover.

8. The electronic device of any of claims 1-7, wherein, The number of the sound emitting units is a plurality, and the shock absorbing assembly is arranged between the plurality of sound emitting units and the back cover.

9. The electronic device of any of claims 1-7, wherein, The sound emitting unit comprises a shell having a cavity, a diaphragm arranged on the shell, and a driving system received in the cavity, the driving system being configured to drive the diaphragm to vibrate and emit sound, and the shell has a vent hole communicating the cavity and the back cavity.

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