Antenna and network device

Abstract

The present disclosure provides an antenna and a network device, and belongs to the technical field of communication. The antenna provided by the present disclosure comprises a radiation floor and a plurality of heat-dissipating antenna units, and the plurality of heat-dissipating antenna units are located on the same side of the radiation floor. The heat-dissipating antenna unit comprises a feeding structure, a radiator and a heat-dissipating structure, and the heat-dissipating structure is in contact with or capacitively coupled with the radiator. Compared with the conventional antenna unit, the heat-dissipating antenna unit of the present disclosure is additionally provided with the heat-dissipating structure, so that the heat-dissipating antenna unit has good heat-dissipating performance in addition to the electromagnetic radiation function. When the antenna provided by the present disclosure is applied to the network device, the heat-dissipating antenna unit can timely dissipate heat, thereby improving the reliability of the network device.

Description

Technical Field

[0001] This disclosure relates to the field of communication technology, and in particular to an antenna and network device. Background Technology

[0002] Some network devices include active modules and antennas, where the antennas are used to transmit and receive signals, and the active modules are used to process signals before transmission and after reception.

[0003] Active modules generate heat during operation, and some of this heat is transferred to the antenna. For network devices, timely heat dissipation is essential for normal and stable operation. Summary of the Invention

[0004] This disclosure provides an antenna and a network device. The antenna includes a radiating ground plane and multiple heat-dissipating antenna elements. Each heat-dissipating antenna element has a heat dissipation structure, thus providing good heat dissipation performance. When the antenna is used in a network device, it can dissipate heat promptly, resulting in higher reliability of the network device. The technical solutions for the antenna and the network device are as follows:

[0005] In a first aspect, an antenna is provided, the antenna comprising a radiating ground plane and a plurality of heat-dissipating antenna elements located on the same side of the radiating ground plane; the heat-dissipating antenna elements comprising a feeding structure, a radiator, and a heat-dissipating structure; the feeding structure being connected to the radiating ground plane and the radiator respectively; and the heat-dissipating structure being in contact with or capacitively coupled to the radiator.

[0006] In this configuration, multiple heat-dissipating antenna elements are located on the same side of the radiating floor, which can also be understood as multiple heat-dissipating antenna elements located on the same surface of the radiating floor. Multiple heat-dissipating antenna elements can be understood as at least two heat-dissipating antenna elements. Of course, in one possible implementation, the antenna may also include only one heat-dissipating antenna element.

[0007] A radiating floor can be a metal plate used to reflect electromagnetic signals emitted by multiple heat-dissipating antenna units in a specific direction. Radiating floors can also be called radiating base plates or reflectors.

[0008] The heat dissipation antenna unit has both electromagnetic radiation capability and good heat dissipation capability, including feeding structure, radiator and heat dissipation structure.

[0009] A feed structure is used to feed power to a radiator. The first end of the feed structure is connected to the radiating ground plane, and the second end is connected to the radiator. The feed structure includes an outer conductor and a feed wire. The first end of the outer conductor is connected to the radiating ground plane, and the second end is connected to the radiator. The feed wire passes through the outer conductor, with one end electrically connected to the radiator and the other end passing through the radiating ground plane and electrically connected to the power supply. The feed structure can also be called a balance-unbalance converter (Balun), or simply a balun.

[0010] A radiator is used to radiate electromagnetic signals and may include one or more dipoles, each dipole comprising two symmetrically arranged radiating arms. In some examples, the radiator includes two dipoles, that is, the radiator includes four radiating arms.

[0011] The heat dissipation structure is in contact with or capacitively coupled to the radiator, thus enabling it to both dissipate heat and radiate electromagnetic signals. Contact includes both connected contact and non-connected contact. Capacitive coupling occurs when the distance between the heat dissipation structure and the radiator is very small, allowing high-frequency electromagnetic signals to break through the gap and create a de facto path. When the distance between the heat dissipation structure and the radiator is less than a certain threshold (e.g., less than 2 mm), they can be considered capacitively coupled. This threshold is related to the dimensions of both the heat dissipation structure and the radiator. Contact or capacitive coupling between the radiator and the heat dissipation structure can be collectively referred to as conductive connection between the heat dissipation structure and the radiator.

[0012] The technical solution provided in this disclosure includes an antenna comprising a radiating ground plane and multiple heat-dissipating antenna elements. Each heat-dissipating antenna element includes a feeding structure, a radiator, and a heat dissipation structure. Therefore, in addition to electromagnetic radiation capability, the heat-dissipating antenna element also possesses excellent heat dissipation capability. When the antenna provided in this disclosure is applied in network equipment, the antenna can dissipate heat in a timely manner, thereby improving the reliability of the network equipment.

[0013] In one possible implementation, the heat dissipation structure is a symmetrical structure.

[0014] In one possible implementation, the heat dissipation structure is a centrosymmetric structure.

[0015] In one possible implementation, the heat dissipation structure is symmetrical about the radiator.

[0016] In one possible implementation, the heat dissipation structure is centrally symmetric about the geometric center of the radiator.

[0017] In one possible implementation, the heat dissipation structure is symmetrical about the power supply structure.

[0018] In one possible implementation, the heat dissipation structure is centrally symmetrical about the feed center point of the feed structure.

[0019] In one possible implementation, the radiator includes multiple radiating arms; the heat dissipation structure includes multiple heat dissipation substructures, and the multiple heat dissipation substructures are respectively in contact with or capacitively coupled to the multiple radiating arms.

[0020] In one possible implementation, there are four radiating arms and four heat dissipation substructures, with the four heat dissipation substructures respectively in contact with or capacitively coupled to the four radiating arms.

[0021] In one possible implementation, the heat dissipation structure includes multiple heat dissipation units, which are heat sinks or heat dissipation columns.

[0022] Among them, heat sinks can also be called heat dissipation fins, and heat dissipation columns can also be called heat dissipation pins.

[0023] In one possible implementation, the heat dissipation structure further includes a base plate connected to the plurality of heat dissipation units.

[0024] The technical solution provided in this disclosure can improve the processing efficiency of the heat dissipation structure by setting a heat dissipation structure including a base plate.

[0025] In one possible implementation, the outer conductor of the power supply structure and the heat dissipation structure are the same structure.

[0026] The outer conductor and the heat dissipation structure are the same structure. It can be understood that the outer conductor is reused for the heat dissipation structure, or the heat dissipation structure is reused for the outer conductor of the power supply structure.

[0027] In one possible implementation, the outer conductor is columnar, and the outer diameter of the outer conductor gradually decreases in the direction away from the radiant floor.

[0028] The technical solution provided in this disclosure, by setting the outer diameter of the end of the outer conductor connected to the radiating ground to be larger, facilitates the transfer of heat from the radiating ground to the heat dissipation antenna unit.

[0029] In one possible implementation, the heat dissipation structure includes at least one of a first heat dissipation structure and a second heat dissipation structure; the first heat dissipation structure is connected to the radiant floor, and the second heat dissipation structure is connected to the radiator.

[0030] In one possible implementation, the first heat dissipation structure includes a first portion located between the radiant floor and the radiator.

[0031] In one possible implementation, the first heat dissipation structure further includes a second portion that passes through the radiator.

[0032] In one possible implementation, the second heat dissipation structure is located on the side of the radiator away from the radiating floor.

[0033] In one possible implementation, the second heat dissipation structure is located on the side of the radiator closest to the radiating floor.

[0034] In one possible implementation, the antenna has multiple first heat dissipation channels that are parallel to each other.

[0035] The technical solution provided in this disclosure improves the antenna's heat dissipation capacity by setting multiple parallel first heat dissipation channels, ensuring that the airflow is not obstructed when passing through multiple first heat dissipation channels.

[0036] In one possible implementation, the first heat dissipation duct is formed by the heat dissipation structure.

[0037] In one possible implementation, the plurality of heat-dissipating antenna elements are arranged in one or more columns on the radiating floor. A first heat dissipation duct is associated in at least one column of heat-dissipating antenna elements.

[0038] In one possible implementation, the multiple first heat dissipation channels of the heat dissipation antenna unit are respectively connected to the multiple first heat dissipation channels of the other heat dissipation antenna units located in the same column.

[0039] In one possible implementation, the multiple first heat dissipation channels of the heat dissipation antenna element are respectively opposite to the multiple first heat dissipation channels of the other heat dissipation antenna elements located in the same column.

[0040] In one possible implementation, the heat dissipation antenna unit includes N first heat dissipation air ducts, and the first heat dissipation air ducts of each column of heat dissipation antenna units are arranged in N columns.

[0041] In one possible implementation, at least one column of heat dissipation antenna elements includes multiple long air ducts, wherein the long air ducts include multiple first heat dissipation air ducts connected in sequence.

[0042] The technical solution provided in this disclosure, through the above design, can ensure the shortest path of airflow, realize the biomimetic enhanced convection design, and further improve the heat dissipation capability of the antenna.

[0043] In one possible implementation, the antenna further includes a floor cooling structure located on the radiating floor. For example, the floor cooling structure is connected to the radiating floor.

[0044] The floor heat dissipation structure can be located on the same side of the radiating floor as the heat dissipation antenna unit. The floor heat dissipation structure is separate from the radiator and is used solely for heat dissipation.

[0045] The technical solution disclosed herein further improves the antenna's heat dissipation capability by incorporating a floor heat dissipation structure on the radiating floor. Furthermore, the floor heat dissipation structure serves only to dissipate heat and does not affect the antenna's radiation characteristics.

[0046] In one possible implementation, the floor heat dissipation structure has a second heat dissipation duct that is parallel to the first heat dissipation duct of the antenna.

[0047] The technical solution provided in this disclosure, by setting the second heat dissipation duct parallel to the first heat dissipation duct of the antenna, can ensure the shortest path of airflow, realize the biomimetic enhanced convection design, and further improve the heat dissipation capability of the antenna.

[0048] In a second aspect, a network device is provided, the network device including an antenna as described in any of the first aspects.

[0049] Among them, network equipment can be an active antenna unit (AAU) or a base station, etc.

[0050] The technical solution provided in this disclosure improves the reliability of network devices by applying the aforementioned antenna in network equipment, enabling heat to be dissipated in a timely manner. Attached Figure Description

[0051] Figure 1 This is a schematic diagram of an antenna provided in an embodiment of this disclosure;

[0052] Figure 2 This is an exploded view of a heat dissipation antenna unit provided in an embodiment of this disclosure;

[0053] Figure 3 This is a schematic diagram of a heat dissipation antenna unit provided in an embodiment of this disclosure;

[0054] Figure 4 This is a schematic diagram of a heat dissipation antenna unit provided in an embodiment of this disclosure;

[0055] Figure 5 This is a schematic diagram of a heat dissipation antenna unit provided in an embodiment of this disclosure;

[0056] Figure 6 This is a schematic diagram of a heat dissipation antenna unit provided in an embodiment of this disclosure;

[0057] Figure 7 This is a schematic diagram of a heat dissipation antenna unit provided in an embodiment of this disclosure;

[0058] Figure 8 This is a schematic diagram of a heat dissipation antenna unit provided in an embodiment of this disclosure;

[0059] Figure 9 This is a schematic diagram of a heat dissipation antenna unit provided in an embodiment of this disclosure;

[0060] Figure 10 This is a schematic diagram of an antenna provided in an embodiment of this disclosure;

[0061] Figure 11 This is a schematic diagram of an antenna provided in an embodiment of this disclosure;

[0062] Figure 12 This is a schematic diagram of an antenna provided in an embodiment of this disclosure;

[0063] Figure 13 This is a schematic diagram of a network device provided in an embodiment of this disclosure;

[0064] Figure 14 This is a schematic diagram of a network device provided in an embodiment of this disclosure.

[0065] Legend

[0066] 01. Active module; 011. Backplane; 012. Integrated circuit chip; 013. Remote RF unit board; 0131. Thermal hole; 014. Power amplifier; 015. Filter; 016. Thermal adhesive; 017. Thermal pillar.

[0067] 02. Antenna;

[0068] 03. Antenna radome;

[0069] 1. Radiating floor; 2. Heat dissipation antenna unit;

[0070] 20. First heat dissipation airflow;

[0071] 21. Power supply structure; 211. Outer conductor; 212. Power supply line; O. Geometric center point.

[0072] 22. Radiator; 221. Radiating arm;

[0073] 23. Heat dissipation structure; 230. Heat dissipation substructure; 231. Heat dissipation unit; 232. Base plate; 23a. First heat dissipation structure; 23b. Second heat dissipation structure.

[0074] 3. Floor heat dissipation structure; 30. Second heat dissipation duct; 31. Floor heat dissipation unit. Detailed Implementation

[0075] Network devices consist of active modules and antennas. Active modules generate heat during operation, and some of this heat is transferred to the antenna. For network devices, timely heat dissipation is essential for normal and stable operation.

[0076] Taking the active antenna unit (AAU) as an example, the AAU is a hardware product that integrates radio frequency functions with the antenna. By working in conjunction with the baseband unit (BBU), it enables the rapid deployment of base stations.

[0077] In related technologies, to improve the heat dissipation capability of the AAU, a heat dissipation structure is installed on the housing that is in direct contact with the active module. To further improve the heat dissipation capability of the AAU, the heat generated by the AAU is sometimes conducted to the antenna for cooling. Therefore, how to improve the heat dissipation capability of the antenna is a key technical issue.

[0078] Currently, the following technical solutions are used in related technologies to improve the heat dissipation performance of antennas.

[0079] One possible approach is to add an additional heat dissipation module to the antenna. This module, made of low-loss non-metallic material, reduces its impact on antenna radiation performance. The heat dissipation module can be a hollow structure with openings at both ends to increase air convection and improve heat dissipation. Another possible approach is to add a fan to the antenna. The fan's airflow can expel hot air from inside the network device, thereby improving the antenna's heat dissipation capabilities.

[0080] However, the technical solutions employed in these technologies all result in a larger overall size for the AAU, increasing its wind resistance. Furthermore, adding fans undoubtedly increases electricity costs, thus raising the overall cost of the AAU.

[0081] Therefore, there is an urgent need for a new technical solution to improve the heat dissipation capacity of antennas, and this technical solution should have a small impact on the cost and overall size of network equipment.

[0082] The technical solutions provided by the embodiments of this disclosure will be described below:

[0083] This disclosure provides an antenna, such as... Figure 1 As shown, the antenna includes a radiating ground plane 1 and multiple heat-dissipating antenna elements 2, which are located on the same side of the radiating ground plane 1. Each heat-dissipating antenna element 2 includes a feeding structure 21, a radiator 22, and a heat-dissipating structure 23. The feeding structure 21 is connected to both the radiating ground plane 1 and the radiator 22. The heat-dissipating structure 23 is in contact with or capacitively coupled to the radiator 22.

[0084] The antenna provided in this disclosure can be used not only in AAUs (Automatic Anchor Units) but also in any network device with an antenna; this disclosure does not limit the application scenario of the antenna. The antenna provided in this disclosure can be used in base stations, and can also be called a base station antenna. The antenna provided in this disclosure has beamforming capabilities.

[0085] like Figure 1 As shown, multiple heat-dissipating antenna elements 2 are located on the same side of the radiating floor 1, which can also be understood as multiple heat-dissipating antenna elements 2 being located on the same surface of the radiating floor 1. Multiple heat-dissipating antenna elements 2 can be understood as at least two heat-dissipating antenna elements 2. Of course, in some examples, the antenna provided in this embodiment may also include only one heat-dissipating antenna element 2.

[0086] In some examples, multiple heat-dissipating antenna elements 2 are arranged in an array on the radiating floor 1. In this case, the antenna provided in the embodiments of this disclosure can also be referred to as an antenna array. Of course, the multiple heat-dissipating antenna elements 2 can also be arranged on the radiating floor 1 in other forms, and the embodiments of this disclosure do not limit this arrangement.

[0087] The radiating floor 1 can be a metal plate, used to reflect the electromagnetic signals emitted by multiple heat-dissipating antenna units 2 in a certain direction. The radiating floor 1 can also be called a radiating base plate or a reflector plate, etc.

[0088] The heat dissipation antenna unit 2 has both electromagnetic radiation capability and good heat dissipation capability, including a feeding structure 21, a radiator 22 and a heat dissipation structure 23.

[0089] The feeding structure 21 is used to feed the radiator 22, such as Figure 1 As shown, the first end of the feed structure 21 is connected to the radiating ground 1, and the second end is connected to the radiator 22. The feed structure 21 includes an outer conductor 211 and a feed wire 212. The first end of the outer conductor 211 is connected to the radiating ground 1, and the second end is connected to the radiator 22. The feed wire 212 passes through the outer conductor 211, with one end electrically connected to the radiator 22 and the other end passing through the radiating ground 1 and electrically connected to the feed power source. The feed structure 21 can also be called a balance-unbalance converter (Balun), or simply a balun. Furthermore, the feed structure 21 also has the capability to radiate electromagnetic signals.

[0090] The radiator 22 is used to radiate electromagnetic signals and may include one or more dipoles. Each dipole includes two symmetrically arranged radiating arms 221. The radiating arms 221 may be annular or plate-shaped, and this embodiment does not limit the shape.

[0091] The heat dissipation structure 23 is in contact or capacitively coupled to the radiator 22. Therefore, the heat dissipation structure 23 can both dissipate heat and radiate electromagnetic signals. Contact includes both connected contact and non-connected contact. Capacitive coupling refers to a situation where the distance between the heat dissipation structure 23 and the radiator 22 is very small, allowing high-frequency electromagnetic signals to break through the gap and form a de facto path. When the distance between the heat dissipation structure 23 and the radiator 22 is less than a certain distance threshold, they can be considered capacitively coupled. This distance threshold is related to the dimensions of the heat dissipation structure 23 and the radiator 22 (for example, this distance threshold can be 2 mm). Contact or capacitive coupling between the radiator 22 and the heat dissipation structure 23 can be collectively referred to as the heat dissipation structure 23 and the radiator 22 being conductive. The heat dissipation structure 23 is made of metal. Through proper design of the heat dissipation structure 23, the radiation characteristics of the heat dissipation antenna element 2 can be made at least as strong as those of a conventional antenna element excluding the heat dissipation structure 23. The heat dissipation structure 23 can also be referred to as a heat sink or radiator, etc.

[0092] This disclosure provides an antenna comprising a radiating ground plane 1 and multiple heat-dissipating antenna elements 2. In addition to a feed structure 21 and a radiator 22, each heat-dissipating antenna element 2 includes a heat dissipation structure 23. Therefore, the heat-dissipating antenna element 2 possesses both electromagnetic radiation capability and excellent heat dissipation capability. When the antenna provided in this disclosure is applied in network equipment, it can dissipate heat promptly, thereby improving the reliability of the network equipment.

[0093] Furthermore, it is understandable that adding a heat dissipation structure 23 to a conventional antenna unit to make it a heat dissipation antenna unit 2 has little impact on the overall size of the antenna, and adding only a metal heat dissipation structure 23 also has little impact on the cost of the antenna.

[0094] The heat dissipation structure 23 provided in the embodiments of this disclosure will now be described in more detail:

[0095] The heat dissipation structure 23 provided in this embodiment is associated with the radiator 22. The radiator 22 will be described first:

[0096] In some examples, the radiator 22 includes one or more dipoles, each dipole comprising two symmetrically arranged radiating arms 221. Examples include... Figure 2 As shown, the radiator 22 includes two dipoles and a total of four radiating arms 221. Therefore, this heat dissipation antenna unit 2 can also be called a dual-polarized dipole heat dissipation antenna unit.

[0097] It is understandable that the radiator 22 formed by the dipole has a symmetrical structure, meaning that the multiple radiating arms 221 of the radiator 22 are symmetrically arranged. The heat dissipation structure 23 is in contact with or capacitively coupled to the radiating arms 221, so the heat dissipation structure 23 can also be considered a new radiating arm portion, and therefore, the heat dissipation structure 23 can also be a symmetrical structure (such as a centrosymmetric structure). Furthermore, the heat dissipation structure 23 and the radiator 22 can be centrosymmetric about the same center point, thus allowing the heat dissipation antenna element 2 to still radiate electromagnetic signals normally.

[0098] In one possible configuration, the heat dissipation structure 23 is symmetrically arranged in the same way as the radiator 22. In some examples, the heat dissipation structure 23 is symmetrical about the radiator 22 (or centrally symmetrical), or it can be understood that the heat dissipation structure 23 is symmetrical about the power supply structure 21 (or centrally symmetrical).

[0099] For example, such as Figure 2 As shown, the heat dissipation structure 23 is centrally symmetrical about the geometric center point O of the radiator 22. The geometric center point O can also be referred to as the feed center point of the feed structure 22.

[0100] In some examples, such as Figure 2 As shown, the heat dissipation structure 23 includes multiple heat dissipation substructures 230. Each of the multiple heat dissipation substructures 230 is in contact with or capacitively coupled to a multiple radiating arm 221. Each heat dissipation substructure 230 and its corresponding radiating arm 221 can be considered to form a new radiating arm, and these multiple new radiating arms are symmetrically arranged.

[0101] For example, such as Figure 2 As shown, the radiator 22 includes four radiating arms 221, and the heat dissipation structure 23 includes four heat dissipation substructures 230, which are respectively in contact with or capacitively coupled to the four radiating arms 221.

[0102] In some examples, the heat dissipation structure 23 is divided into multiple heat dissipation substructures 230 in the same way as the radiator 22 is divided into multiple radiating arms 221. The four radiating arms 221 are centrally symmetric about the geometric center point O of the radiator 22, and the four heat dissipation substructures 230 can also be centrally symmetric about the geometric center point O.

[0103] It should be noted that the multiple heat dissipation substructures 230 can be separated from each other or connected together, and this disclosure does not limit this.

[0104] This disclosure does not limit the form of the heat dissipation structure 23. In some examples, the heat dissipation structure 23 includes multiple heat dissipation units 231. For example... Figures 2-4 as well as Figure 9 As shown, the heat sink 231 can be a heat sink (or heat dissipation fin), such as... Figure 5 , Figure 6 and Figure 8 As shown, the heat sink unit 231 can also be a heat sink column (or heat sink pin).

[0105] In some examples, such as Figures 2-4 as well as Figure 8 and Figure 9 As shown, the heat dissipation unit 231 can be directly connected to the radiant floor 1 or the radiator 22.

[0106] In other examples, such as Figure 5 and Figure 6 As shown, the heat dissipation structure 23 also includes a base plate 232, which is connected to multiple heat dissipation units 231.

[0107] For example, one side of the base plate 232 is connected to the radiant floor 1, and the other side is connected to a plurality of heat dissipation units 231.

[0108] In addition to the form of heat dissipation structure 23 including multiple heat dissipation units 231, such as Figure 7 and Figure 8 As shown, the heat dissipation structure 23 can also be the same structure as the outer conductor 211 of the power supply structure 21. That is, the outer conductor 211 is reused for the heat dissipation structure 23, or it can be understood that the heat dissipation structure 23 is reused for the outer conductor 211.

[0109] In some examples, such as Figure 7 and Figure 8 As shown, the outer conductor 211 is cylindrical. The outer diameter of the outer conductor 211 can gradually decrease along the direction away from the radiation floor 1. The cross-section of the outer conductor 211 can be circular, square, or any other shape, and this embodiment does not limit this.

[0110] By setting the outer diameter of the end of the outer conductor 211 connected to the radiating ground 1 to be larger, the contact area between the outer conductor 211 and the radiating ground 1 is larger, which facilitates the heat conduction of the radiating ground 1 to the heat dissipation antenna unit 2.

[0111] It should be noted that, Figure 7 and Figure 8 The outer conductor 211 shown can also be considered not as heat dissipation structure 23, but as an optimization of the structure of the outer conductor 211.

[0112] The present invention does not limit the method of fixing the heat dissipation structure 23.

[0113] In some examples, such as Figure 2 , Figure 3 as well as Figures 5-8As shown, the heat dissipation structure 23 includes a first heat dissipation structure 23a, which is connected to the radiant floor 1 and is in contact with or capacitively coupled to the radiator 22.

[0114] This disclosure does not limit the height of the first heat dissipation structure 23a in the embodiments. In some examples, such as Figure 2 , Figure 3 as well as Figures 5-8 As shown, the first heat dissipation structure 23a includes a first part, which is located between the radiant floor 1 and the radiator 22.

[0115] In some examples, the first heat dissipation structure 23a may consist of only the first part, such as Figure 2 , Figure 3 , Figure 5 , Figure 7 and Figure 8 As shown.

[0116] In other examples, in addition to the first portion, the first heat dissipation structure 23a also includes a second portion that passes through the radiator 22, such as... Figure 6 As shown.

[0117] It should be noted that in some scenarios, the first heat dissipation structure 23a is connected to the radiant floor 1 and also to the radiator 22. In this case, the first heat dissipation structure 23a can also be considered as the second heat dissipation structure 23b described below.

[0118] In some examples, such as Figure 2 , Figure 4 and Figure 8 As shown, the heat dissipation structure 23 includes a second heat dissipation structure 23b, which is connected to the radiator 22.

[0119] The second heat dissipation structure 23b can be located on the side of the radiator 22 away from the radiating floor 1, or it can be located on the side of the radiator 22 close to the radiating floor 1. This embodiment of the present disclosure does not limit this.

[0120] It should be noted that, in the case where the second heat dissipation structure 23b is located on the side of the radiator 22 close to the radiating floor 1, the second heat dissipation structure 23b can also be connected to the radiating floor 1. In this case, the second heat dissipation structure 23b can also be considered as the first heat dissipation structure 23a mentioned above.

[0121] In some examples, such as Figure 2 and Figure 8 As shown, the heat dissipation structure 23 includes both the first heat dissipation structure 23a and the second heat dissipation structure 23b.

[0122] It should be noted that the connection between the first heat dissipation structure 23a and the radiant floor 1, and the connection between the second heat dissipation structure 23b and the radiator 22, as referred to in the embodiments of this disclosure, not only includes the connection between two separate components, but also includes an integrally formed connection.

[0123] In some examples, the first heat dissipation structure 23a is integrally formed with the radiant floor 1.

[0124] In some examples, the first heat dissipation structure 23a is integrally formed with the radiator 22 and connected to the radiating floor 1 (e.g., by snap-fit ​​or welding).

[0125] In some examples, the second heat dissipation structure 23b is integrally formed with the radiator 22.

[0126] like Figure 1 As shown, in actual manufacturing, in some examples, the radiator 22 can be integrally formed with the first heat dissipation structure 23a, and the second heat dissipation structure 23b is connected to the radiator 22 by means of snap-fit ​​or welding. In other examples, the radiator 22 and the second heat dissipation structure 23b are integrally formed, and the first heat dissipation structure 23a is connected to the radiant floor 1 and the radiator 22 by means of snap-fit ​​or welding. In still other examples, the radiator 22 is integrally formed with both the first heat dissipation structure 23a and the second heat dissipation structure 23b.

[0127] In some examples, such as Figure 10-12 As shown, the antenna has multiple first heat dissipation ducts 20. For example, the first heat dissipation ducts 20 are straight ducts, and the multiple first heat dissipation ducts 20 are parallel to each other.

[0128] By setting multiple parallel first heat dissipation air ducts 20, the airflow will not be obstructed when there are multiple first heat dissipation air ducts 20, thus further improving the antenna's heat dissipation capability.

[0129] This disclosure does not limit the formation of the first heat dissipation duct 20. In some examples, such as Figure 10-12 As shown, the first heat dissipation duct 20 can be formed by the heat dissipation structure 23, and the two ends of the first heat dissipation duct 20 are respectively connected to the outside of the heat dissipation antenna unit 2.

[0130] The first heat dissipation duct 20 can be formed by heat dissipation units 231. For example, it can be formed between two heat dissipation units 231 or between two rows of heat dissipation units 231.

[0131] For example, such as Figures 10-12 As shown, the heat dissipation units 231 are arranged in multiple columns, and a first heat dissipation air duct 20 is formed between two adjacent columns of heat dissipation units 231.

[0132] In other examples, the first heat dissipation duct 20 may also be formed between the heat dissipation structure 23 and the power supply structure 21.

[0133] In other examples, the first heat dissipation duct 20 may also be formed between the heat dissipation structure 23 and the remaining heat dissipation antenna elements 2.

[0134] It should be noted that the three ways of forming the first heat dissipation duct 20 mentioned above can not only exist individually, but also exist in any combination.

[0135] In some examples, multiple heat-dissipating antenna elements 2 are arranged in one or more columns on the radiating floor 1. A first heat dissipation duct 20 is associated in at least one column (e.g., each column) of heat-dissipating antenna elements 2.

[0136] In some examples, such as Figures 10-12 As shown, the multiple first heat dissipation air ducts 20 of the heat dissipation antenna unit 2 are connected to the multiple first heat dissipation air ducts 20 of the other heat dissipation antenna units 2 located in the same column.

[0137] In some examples, such as Figures 10-12 As shown, the multiple first heat dissipation air ducts 20 of the heat dissipation antenna unit 2 are respectively opposite to the multiple first heat dissipation air ducts 20 of the other heat dissipation antenna units 2 located in the same column.

[0138] In some examples, such as Figures 10-12 As shown, the heat dissipation antenna unit 2 includes N first heat dissipation air ducts 20, and the first heat dissipation air ducts 20 of each column of heat dissipation antenna unit 2 are arranged in N columns.

[0139] In some examples, such as Figures 10-12 As shown, at least one column (e.g., each column) of heat dissipation antenna elements 2 includes multiple long air ducts, each long air duct including multiple first heat dissipation air ducts 20 connected in sequence. The multiple first heat dissipation air ducts included in the long air ducts are arranged at intervals.

[0140] The technical solution provided in this disclosure, through the above design, ensures that the airflow passes through the antenna via the shortest path, achieving a biomimetic enhanced convection design and further improving the antenna's heat dissipation capability.

[0141] In addition to the heat dissipation structure 23 described above for radiating electromagnetic signals and dissipating heat, the antenna provided in this embodiment may also include a floor heat dissipation structure 3 solely for heat dissipation, such as... Figure 12 As shown, the floor heat dissipation structure 3 is connected to the radiant floor 1.

[0142] The location of the floor heat dissipation structure 3 is not limited in this embodiment. In some examples, the floor heat dissipation structure 3 is located on the side of the radiating floor 1 closest to the heat dissipation antenna element 2. The floor heat dissipation structure 3 is separated from the radiator 22, and the distance from the radiator 22 is greater than a certain distance threshold. Therefore, the floor heat dissipation structure 3 is only used for heat dissipation and will not affect the radiation characteristics of the antenna.

[0143] The present disclosure does not limit the specific form of the floor heat dissipation structure 3. In some examples, the floor heat dissipation structure 3 includes a plurality of floor heat dissipation units 31, which are arranged at intervals on the radiant floor 1.

[0144] For example, such as Figure 12 As shown, the floor heat dissipation structure 3 includes multiple heat sinks (or heat dissipation teeth), which are arranged at intervals on the radiant floor 1 and can be parallel to each other.

[0145] Of course, the floor heat sink unit 31 being a heat sink is just an example. In practical applications, the floor heat sink unit 31 can also be a heat sink column (or heat sink pin). Multiple heat sink columns can be arranged in multiple columns, and the multiple columns of heat sink columns can be parallel to each other.

[0146] In some examples, the floor cooling structure 3 has one or more second cooling ducts 30. The second cooling duct 30 can be formed from floor cooling units 31, for example, the second cooling duct 30 can be formed between two floor cooling units 31 or between two rows of floor cooling units 31.

[0147] For example, such as Figure 12 As shown, the second heat dissipation duct 30 is formed between two adjacent heat sinks.

[0148] As another example, when the floor heat sink unit 31 is a heat sink column, and the heat sink columns are arranged in multiple rows on the radiant floor 1, the second heat dissipation duct 30 can be formed between two adjacent rows of heat sink columns.

[0149] This disclosure does not limit the positional relationship between the second heat dissipation duct 30 and the first heat dissipation duct 20. In some examples, such as Figure 12 As shown, the second heat dissipation duct 30 is parallel to the first heat dissipation duct 20 of the antenna, so that when the airflow passes through the antenna, it can ensure the shortest path of the airflow, realizing the biomimetic enhanced convection design and further improving the heat dissipation capacity of the antenna.

[0150] It should be further noted that the division of the antenna into a radiating ground plane 1 and a heat dissipation antenna element 2 in this embodiment is merely for ease of description and does not constitute a limitation on the embodiments of this disclosure. The antenna provided in this embodiment can also be divided according to other division criteria.

[0151] For example, the feed structure 21 and the radiator 22 can be considered as antenna elements. That is, the antenna includes a radiating ground plane 1, multiple antenna elements, and multiple heat dissipation structures 23 (or heat dissipation units). The multiple antenna elements are located on the same side of the radiating ground plane 1, and the multiple antenna elements and multiple heat dissipation structures 23 correspond one-to-one. The antenna element includes the feed structure 21 and the radiator 22. The feed structure 21 is connected to both the radiating ground plane 1 and the radiator 22. The heat dissipation structure 23 is in contact or capacitively coupled to the radiator 22.

[0152] For example, the antenna provided in this embodiment can also be considered a heat-dissipating antenna, which includes an antenna and a heat-dissipating structure 23. The antenna includes a radiating ground plane 1, a feeding structure 21, and a radiator 22, with the feeding structure 21 connected to both the radiating ground plane 1 and the radiator 22. The heat-dissipating structure 23 is in contact with or capacitively coupled to the radiator 22.

[0153] It should also be noted that the embodiments of this disclosure do not limit the source of heat dissipation for the antenna. In some examples, the antenna is used to dissipate heat generated by active modules associated with the antenna. For example, if the antenna is located in the AAU, then the antenna can be used to dissipate heat generated by active modules in the AAU. In addition, in other examples, the antenna provided in the embodiments of this disclosure can also be used to dissipate heat from other heat sources of the network device. For example, the antenna can be used to dissipate heat generated by all heat sources of the network device.

[0154] This disclosure provides a network device, such as... Figure 13 As shown, the network device includes the aforementioned antenna 02.

[0155] By applying antenna 02 in network devices, the heat in the network devices can be dissipated in a timely manner through antenna 02, thereby improving the reliability of the network devices.

[0156] This disclosure does not limit the specific type of network device. For example, the network device can be a base station and an AAU, etc.

[0157] like Figure 13 As shown, the network device includes an active module 01 and an antenna 02. The antenna 02 is used for transmitting and receiving signals, and the active module 01 is a module that generates heat during operation. Some of the heat generated by the active module 01 during operation is transferred to the antenna 02 and then dissipated through the antenna 02.

[0158] This disclosure does not limit the type of the active module 01. In some examples, the active module 01 can be a module related to the signal processing of the antenna 02. For example, the active module 01 can be used to process information before or after transmission by the antenna 02. In other examples, the active module 01 can also be a module that is not related to the signal processing of the antenna 02 but is in contact with the antenna 02. The active module 01 can be integrated with the antenna (such as an AAU) or it can be a separate component from the antenna.

[0159] In some examples, in order to improve the efficiency of heat transfer between the active module 01 and the antenna 02 and further improve the heat dissipation effect of the network device, thermal conductive devices or structures such as thermal conductive adhesive, thermal conductive pillars and high-density thermal conductive holes can be added between the active module 01 and the antenna 02.

[0160] Below, with Figure 14 For example, one possible implementation of active module 01 is provided ( Figure 14 The arrows in the image indicate the heat conduction path:

[0161] like Figure 14 As shown, the active module 01 includes a backplane 011, an integrated circuit chip 012, a remote radio unit (RU) board 013, a power amplifier (PA) 014, and a filter 015. Figure 14 The network device shown can be considered an AAU. It should be noted that... Figure 14 The active module 01 shown is merely an example and does not constitute a limitation on the embodiments of this disclosure. In practical applications, the active module 01 may also include more or fewer components.

[0162] The backplane 011 provides overall support for the network device and can be a metal plate. In some examples, heat dissipation structures, such as heat dissipation fins and heat dissipation pillars, can be installed on the backplane 011 to further improve the heat dissipation capability of the network device.

[0163] Integrated circuit chip 012 is located on remote radio frequency unit board 013, and integrated circuit chip 012 generates heat when it is working. This disclosure does not limit the specific type of integrated circuit chip 012. In some examples, integrated circuit chip 012 is a field-programmable gate array (FPGA), and in other examples, integrated circuit chip 012 is an application-specific integrated circuit (ASIC).

[0164] The remote radio frequency unit board 013 is a printed circuit board (PCB) used to support the integrated circuit chip 012 and the power amplifier 014.

[0165] The power amplifier 014 is located on the remote radio frequency unit board 013 and generates heat during operation.

[0166] Filter 015 is used to suppress irrelevant signals.

[0167] During operation, the heat generated by the integrated circuit chip 012 and the power amplifier 014 is transferred to the antenna 02 and dissipated in a timely manner through the antenna 02.

[0168] In some examples, to improve the efficiency of heat transfer between the active module 01 and the antenna 02, the network device also includes thermally conductive adhesive 016 and thermally conductive pillars 017.

[0169] like Figure 14 As shown, in some examples, a portion of thermally conductive adhesive 016 is located on the remote radio frequency unit board 013, opposite to the integrated circuit chip 012, and on a different side of the remote radio frequency unit board 013. In some examples, another portion of thermally conductive adhesive 016 is located on the side of the power amplifier 014 facing the antenna 02.

[0170] The first end of the heat-conducting column 017 is connected to the heat-conducting adhesive 016, and the second end is connected to the radiant floor 1.

[0171] Through the above design, the heat generated by the integrated circuit chip 012 and the power amplifier 014 can be transferred to the antenna 02 in sequence through the thermal conductive adhesive 016 and the thermal conductive pillar 017.

[0172] In some examples, such as Figure 14 As shown, a high-density thermal conductive hole 0131 can also be provided at the position of the integrated circuit chip 012 on the remote radio frequency unit board 013. One end of the high-density thermal conductive hole 0131 is connected to the integrated circuit chip 012, and the other end is connected to the thermal conductive adhesive 016.

[0173] The presence of high-density thermal conductive holes 0131 makes it easier for the heat generated by the integrated circuit chip 012 to be conducted to the thermal conductive adhesive 016, and then to the antenna 02.

[0174] In some examples, such as Figure 14 As shown, the network device may also include an antenna cover 03, which provides basic protection for the antenna 02.

[0175] In some examples, to improve the heat dissipation of network devices, the antenna cover 03 can be a hollow antenna cover with openings in some areas to allow air to circulate between the inside and outside of the antenna cover 03.

[0176] The embodiments disclosed herein do not limit the specific type of radome 03. In some examples, radome 03 can be a plastic radome, while in other examples, radome 03 can also be a periodic metallized hollow radome based on metamaterial design.

[0177] In addition, when network equipment has high heat dissipation requirements, the antenna cover 03 can also be removed.

[0178] The terminology used in the embodiments of this disclosure is for illustrative purposes only and is not intended to limit the disclosure. Unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in this specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, "a" or "one," and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "comprising," "including," and similar terms mean that the elements or objects preceding "comprising" encompass the elements or objects listed following "comprising" or "including," and their equivalents, but do not exclude other elements or objects. "Upper," "lower," "left," "right," etc., are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly. "A plurality" refers to two or more, unless otherwise expressly defined.

[0179] The above description is merely an optional embodiment of this disclosure and is not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. A base station antenna, characterized in that, The base station antenna includes a radiating floor (1) and multiple heat dissipation antenna units (2), the multiple heat dissipation antenna units (2) being located on the same side of the radiating floor (1); The heat dissipation antenna unit (2) includes a feeding structure (21), a radiator (22) and a heat dissipation structure (23), wherein the feeding structure (21) is connected to the radiating ground (1) and the radiator (22) respectively; The radiator (22) includes two dipoles, each of which includes two radiating arms (221), and the four radiating arms (221) are centrally symmetrical with respect to the geometric center point (O); The heat dissipation structure (23) includes four heat dissipation substructures (230), which are respectively in contact or capacitively coupled to the four radiation arms (221), and the four heat dissipation substructures (230) are symmetrical about the geometric center point (O). The heat dissipation substructure (230) is located below the corresponding radiating arm (221), and the outer conductor (211) of the heat dissipation substructure (230) and the power supply structure (21) are different structures; or, the heat dissipation substructure (230) is located above the corresponding radiating arm (221); or, a part of the heat dissipation substructure (230) is located below the radiating arm (221), and another part is located above the radiating arm (221).

2. The base station antenna according to claim 1, characterized in that, The heat dissipation substructure (230) includes multiple heat dissipation units (231), and the heat dissipation unit (231) is a heat sink or a heat dissipation column.

3. The base station antenna according to claim 2, characterized in that, The heat dissipation structure (23) also includes a base plate (232), which is connected to the plurality of heat dissipation units (231).

4. The base station antenna according to claim 1, characterized in that, The outer conductor (211) of the power supply structure (21) is columnar, and the outer diameter of the outer conductor (211) gradually decreases along the direction away from the radiant floor (1).

5. The base station antenna according to any one of claims 1-4, characterized in that, The heat dissipation substructure (230) includes at least one of a first heat dissipation structure (23a) and a second heat dissipation structure (23b); The first heat dissipation structure (23a) is connected to the radiant floor (1), and the second heat dissipation structure (23b) is connected to the radiator (22).

6. The base station antenna according to claim 5, characterized in that, The first heat dissipation structure (23a) includes a first portion located below the radiating arm (221).

7. The base station antenna according to claim 6, characterized in that, The first heat dissipation structure (23a) also includes a second part that passes through the radiating arm (221) and is located above the radiating arm (221).

8. The base station antenna according to claim 5, characterized in that, The second heat dissipation structure (23b) is connected to the upper surface of the radiating arm (221).

9. The base station antenna according to claim 5, characterized in that, The second heat dissipation structure (23b) is connected to the lower surface of the radiating arm (221).

10. The base station antenna according to any one of claims 1-4, characterized in that, The base station antenna has multiple first heat dissipation ducts (20), which are parallel to each other.

11. The base station antenna according to claim 10, characterized in that, The first heat dissipation duct (20) is formed by the heat dissipation structure (23).

12. The base station antenna according to claim 11, characterized in that, The plurality of heat dissipation antenna units (2) are arranged in one or more columns on the radiating floor (1).

13. The base station antenna according to claim 12, characterized in that, At least one column of heat dissipation antenna units (2) includes multiple long air ducts, the long air ducts including multiple first heat dissipation air ducts (20) connected in sequence.

14. The base station antenna according to claim 11, characterized in that, The base station antenna also includes a floor heat dissipation structure (3), which is located on the radiating floor (1).

15. The base station antenna according to claim 14, characterized in that, The floor heat dissipation structure (3) has a second heat dissipation duct (30), which is parallel to the first heat dissipation duct (20) of the antenna.

16. A network device, characterized in that, The network device includes a base station antenna as described in any one of claims 1-15.

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