Wafer stripping equipment
By designing automated wafer stripping equipment, the problems of high labor intensity and high labor costs caused by manual stripping are solved, and a more efficient wafer stripping process is achieved.
CN115910863BActive Publication Date: 2025-03-25SUZHOU QIANMING SEMICON EQUIP CO LTD
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Patent Information
- Application Number
- CN202211457889.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-11-21
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2042-11-21
AI Technical Summary
Technical Problem
In the prior art, wafer peeling after wafer cutting mainly relies on labor, resulting in high labor intensity, wasting human resources and increasing labor costs.
Method used
A wafer peeling equipment is designed, including a machine, a feeding mechanism, a peeling mechanism and a feeding mechanism. Automatically peeling of wafers is achieved by replacing manual operations through automated processes.
Benefits of technology
Through automated stripping of equipment, labor intensity is reduced, labor costs are reduced, and work efficiency is improved.
✦ Generated by Eureka AI based on patent content.
Abstract
The present invention discloses a wafer stripping device, including a machine platform and a loading mechanism, a stripping mechanism and a discharging mechanism arranged on the machine platform, wherein the loading mechanism includes a loading rack and a loading manipulator, wherein the loading rack is used to provide wafers to be stripped, and the loading manipulator is used to carry the wafers to be stripped; the stripping mechanism includes a positioning component, a cam lifting component, a rotating upper and lower component, and a transfer platform, wherein the positioning component receives the wafers to be stripped on the loading manipulator, the cam lifting component lifts the wafers, and the rotating upper and lower components absorb the stripped wafers and place them on the transfer platform; the discharging mechanism includes a discharging manipulator and a discharging rack, wherein the discharging manipulator absorbs the stripped wafers from the transfer platform, and the discharging manipulator places the stripped wafers in the crisp tray of the discharging rack. The present invention replaces manual labor with automation, reduces labor intensity, reduces labor costs, and improves work efficiency.
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