Array substrate and display device

Abstract

The application discloses an array substrate and a display device. The array substrate comprises a substrate, an array layer and a conductive assembly; the substrate comprises a main body part and a connecting part; the array layer is arranged on the substrate and corresponds to at least the main body part, and the array layer is provided with a pixel circuit; the conductive assembly is arranged on the connecting part of the substrate and is electrically connected with the pixel circuit; wherein the connecting part is arranged at an end of the substrate, and the thickness of the connecting part is smaller than that of the main body part. In the above manner, the reliability of the array substrate can be improved, and the display effect of the display panel can be improved.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to an array substrate and a display device. Background Technology

[0002] The current trend in display panel development is to improve the compactness of display panels in order to gradually achieve a full-screen display effect. However, in existing display panel products, due to the small space available for circuit layout at the end of the array substrate, circuit connections are prone to detachment and damage, resulting in low reliability of the display panel and affecting the user experience. Summary of the Invention

[0003] In view of this, the main technical problem solved by the present invention is to provide an array substrate and a display device that can improve the reliability of the array substrate and improve the display effect of the display panel.

[0004] To solve the above-mentioned technical problems, one technical solution adopted by the present invention is: to provide an array substrate, the array substrate comprising: a substrate, including a main body and a connecting part; an array layer, located on the substrate and disposed at least corresponding to the main body, the array layer being provided with pixel circuits; and a conductive component, disposed on the connecting part of the substrate and electrically connected to the pixel circuits; wherein the connecting part is located at the end of the substrate, and the thickness of the connecting part is less than the thickness of the main body.

[0005] In one embodiment of the present invention, the first surface of the connecting portion and the first surface of the main body portion are located on the same plane, the second surface of the connecting portion and the second surface of the main body portion are not on the same plane, the first surface of the main body portion is the side close to the array layer, and the second surface of the main body portion is the side away from the array layer; a conductive component is provided at least on the second surface of the connecting portion; the first surface of the connecting portion is provided with an array layer; preferably, the first surface of the connecting portion and the first surface of the main body portion are continuous surfaces.

[0006] In one embodiment of the present invention, the first surface of the connecting portion and the first surface of the main body portion are not on the same plane, and the second surface of the connecting portion and the second surface of the main body portion are on the same plane. The first surface of the main body portion is the side close to the array layer, and the second surface of the main body portion is the side away from the array layer. The conductive component is at least provided on the second surface of the connecting portion. Preferably, the second surface of the connecting portion and the second surface of the main body portion are continuous surfaces.

[0007] The connecting portion includes a first shaped sub-portion, an irregularly shaped sub-portion, and a second shaped sub-portion. The first shaped sub-portion is located at the end of the connecting portion, and the irregularly shaped sub-portion is adjacent to the first shaped sub-portion and the second shaped sub-portion, respectively. The first surface of the connecting portion is a continuous plane, and the second surface of the connecting portion is a continuous curved surface. The first surface of the connecting portion and the first surface of the main body are located on the same plane, and the thickness of the first shaped sub-portion is 45% to 60% of the substrate thickness.

[0008] The connecting portion includes a first shaped sub-portion, an irregularly shaped sub-portion, and a second shaped sub-portion. The first shaped sub-portion is located at the end of the connecting portion, and the irregularly shaped sub-portion is adjacent to the first shaped sub-portion and the second shaped sub-portion, respectively. The first surface of the connecting portion is a continuous plane, and the second surface of the connecting portion is a continuous curved surface. The first surface of the connecting portion and the second surface of the main body are located on the same plane, and the thickness of the second shaped sub-portion is 40% to 55% of the substrate thickness.

[0009] In one embodiment of the present invention, the conductive component extends from the end of the array layer along the end face of the array layer, the surface of the connecting portion, and the end face of the connecting portion to the back side of the substrate, wherein the back side of the substrate is the side facing away from the array layer; the conductive component includes a conductive layer and at least two protective film layers, wherein the at least two protective film layers are respectively disposed on opposite sides of the conductive layer; preferably, the conductive layer of the conductive component is at least one of copper, silver, and molybdenum.

[0010] In one embodiment of the present invention, the thickness of the protective film layer is 3000nm to 5000nm; the thickness of the conductive layer is 3000nm to 6000nm.

[0011] In one embodiment of the present invention, the thickness of the connecting portion is 30-60% of the thickness of the main body portion; preferably, the thickness of the connecting portion is 0.2mm-0.25mm.

[0012] To solve the above-mentioned technical problems, another technical solution adopted by the present invention is: to provide a display device, the display device including a control circuit and a display panel electrically connected to the control circuit, the display panel including an array substrate as described in any of the above embodiments; the display device includes a plurality of display panels spliced ​​together; the connection portions of two adjacent array substrates are aligned and matched.

[0013] In one embodiment of the present invention, the display device further includes a connector disposed on the side of the substrate away from the array layer. The connector is electrically connected to the conductive components of the connected array substrate, and then electrically connected to the control circuit of the display panel.

[0014] The beneficial effects of this invention are as follows: In existing panel designs, to ensure a certain bonding strength between the conductive components and the substrate, a large bezel is typically required to house the conductive components, mitigating the possibility of them detaching from the substrate due to external forces. However, a large bezel leads to significant gaps during panel splicing, resulting in a large non-display area and affecting display quality. Unlike existing technologies, this invention's substrate includes a main body and a connecting part. The connecting part is located at the end of the substrate, and its thickness is less than that of the main body. The conductive components are electrically connected to the pixel circuitry at the connecting part of the substrate, effectively forming a "step" between the connecting part and the main body, thus increasing the layout space in the thickness direction. This design allows the conductive components to be placed at the connecting part, increasing the layout space and attachment area of ​​the conductive components, thereby strengthening the bonding strength between the conductive components and the substrate. This mitigates abnormal situations such as component detachment and damage, improving the reliability of the array substrate and reducing the bezel width. It also allows for closer pixel placement in the display areas of the two spliced ​​screens, reducing the splicing seam and thus the non-display area during panel splicing, ultimately improving the display effect. Attached Figure Description

[0015] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention. Furthermore, these drawings and textual descriptions are not intended to limit the scope of the inventive concept in any way, but rather to illustrate the concept of the invention to those skilled in the art by reference to specific embodiments.

[0016] Figure 1 This is a schematic diagram of the structure of an embodiment of the display panel of the present invention;

[0017] Figure 2 This is a schematic diagram of the structure of an embodiment of the array substrate of the present invention;

[0018] Figure 3 This is a schematic diagram of the structure of the first embodiment of the array substrate of the present invention;

[0019] Figure 4 This is a schematic diagram of the structure of the second embodiment of the array substrate of the present invention;

[0020] Figure 5 This is a schematic diagram of the structure of the first embodiment of the display device of the present invention;

[0021] Figure 6 This is a schematic diagram of the structure of the second embodiment of the display device of the present invention;

[0022] Figure 7 This is a schematic diagram of the structure of the third embodiment of the array substrate of the present invention;

[0023] Figure 8 This is a schematic diagram of the structure of the fourth embodiment of the array substrate of the present invention;

[0024] Figure 9 This is a schematic diagram of the structure of the third embodiment of the display device of the present invention;

[0025] Figure 10 This is a schematic diagram of the structure of the fourth embodiment of the display device of the present invention;

[0026] Figure 11 yes Figure 10 A schematic diagram of the display device from another perspective;

[0027] Figure 12 This is a schematic diagram of the structure of an embodiment of the conductive component of the array substrate of the present invention;

[0028] Figure 13 This is a schematic diagram of the structure of an embodiment of the display device of the present invention. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions in the embodiments of this invention will be clearly and completely described below in conjunction with the embodiments of this invention. Obviously, the described embodiments are only some embodiments of this invention, not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0030] To address the low reliability of existing array substrates, this invention provides an array substrate and a display device that improves the reliability of the array substrate and enhances the user experience. The array substrate includes a substrate, an array layer, and conductive components. The substrate includes a main body and a connecting portion. The array layer is located on the substrate and is disposed at least corresponding to the main body, and pixel circuits are provided on the array layer. The conductive components are disposed on the connecting portion of the substrate and are electrically connected to the pixel circuits. The connecting portion is located at an end of the substrate, and its thickness is less than the thickness of the main body. A detailed description follows.

[0031] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of a display panel according to an embodiment of the present invention. It should be noted that the proportions of the components shown in the accompanying drawings are merely illustrative to facilitate a visual understanding of the structure of the present invention, and may differ from the illustrations in actual applications.

[0032] In one embodiment, the display panel can be used for various display methods, such as OLED display, quantum dot display, Micro-LED display, etc., but is not limited to these, and can also be other display panels.

[0033] The display panel includes a light-emitting layer 10 and an array substrate 20, which are stacked and electrically connected to each other. The light-emitting layer 10 includes light-emitting devices and a pixel definition layer (PDL). The PDL includes pixel definition structures and pixel openings between these structures, defining multiple pixel regions. Different colored light-emitting devices can be arranged within each pixel opening. The light-emitting devices include a cathode, an organic light-emitting layer, and an anode, stacked sequentially. The organic light-emitting layer includes a hole transport layer, an organic light-emitting material layer, and an electron transport layer. It may also include one or more layers of a hole injection layer, a hole blocking layer, an electron blocking layer, and an electron injection layer, which will not be elaborated further here. The structure of the array substrate 20 is described in detail below.

[0034] Please see Figure 2 , Figure 2 This is a schematic diagram of the structure of an embodiment of the array substrate of the present invention.

[0035] In one embodiment, the array substrate includes a substrate 21, an array layer 22, and a conductive component 23. The array layer 22 is used for electrical connection with the light-emitting layer of the display panel. The array layer 22 includes a pixel circuit 221, which is electrically connected to the light-emitting device of the light-emitting layer to control the light emission of the light-emitting device. The pixel circuit 221 is also electrically connected to the conductive component 23. The conductive component 23 is used for electrical connection between the pixel circuit 221 and peripheral circuits (such as control circuits).

[0036] An array layer 22 is disposed on a substrate 21. The substrate 21 can support the array layer 22 and the light-emitting layer of the display panel, etc. The substrate 21 includes a main body portion 211 and a connecting portion 212. The array layer 22 is disposed at least corresponding to the main body portion 211, so that the area of ​​the display panel corresponding to the main body portion 211 is the display area. In some embodiments, the array layer 22 may also be disposed on the connecting portion 212, so that the area of ​​the display panel corresponding to the connecting portion 212 can also be displayed. In this embodiment, the substrate 21 can be a rigid substrate 21 or a flexible substrate 21, and no specific limitation is made here; wherein, the material of the rigid substrate 21 can be glass, etc.; the material of the flexible substrate 21 can be polyimide, polyethylene terephthalate, polyethylene naphthalate, etc. Wherein, when the rigid substrate 21 is applied to the display panel, the display panel is a rigid panel; when the flexible substrate 21 is applied to the display panel, the display panel is a flexible panel.

[0037] The connecting portion 212 is located at the end of the substrate 21, and the thickness of the connecting portion 212 is less than the thickness of the main body portion 211. In other words, the thickness difference between the connecting portion 212 and the main body portion 211 creates a "step" in the substrate 21. The thickness direction is the relative direction between the substrate 21 and the array layer 22, and the thickness of the main body portion 211 can be the same as the thickness of the substrate 21. The conductive component 23 is disposed at the connecting portion 212 of the substrate 21 to increase the area of ​​the conductive component 23 attached to the substrate 21, mitigating abnormal situations such as detachment or damage of the conductive component 23. This alleviates electrical connection abnormalities, improves the reliability of the array substrate, and enhances the user experience.

[0038] Please refer to the following: Figure 2 , Figure 3-4 as well as Figure 5-6 , Figure 3 This is a schematic diagram of the structure of the first embodiment of the array substrate of the present invention. Figure 4 This is a schematic diagram of the structure of the second embodiment of the array substrate of the present invention. Figure 5 This is a schematic diagram of the structure of the first embodiment of the display device of the present invention. Figure 6 This is a schematic diagram of the structure of the second embodiment of the display device of the present invention.

[0039] In one embodiment, the first surface Z1 of the main body 211 is the side close to the array layer 22, the second surface Z2 of the main body 211 is the side away from the array layer 22, and the conductive component 23 is at least provided on the second surface L2 of the connecting portion 212.

[0040] like Figure 3 As shown, the first surface L1 of the substrate 21 connecting portion 212 and the first surface Z1 of the main body portion 211 are located on the same plane. Since the thickness of the connecting portion 212 is less than the thickness of the main body portion 211, the second surface L2 of the connecting portion 212 and the second surface Z2 of the main body portion 211 are naturally not on the same plane.

[0041] Furthermore, the first surface L1 of the connecting portion 212 may be provided with an array layer 22 to increase the orthogonal projection area of ​​the array layer 22 on the substrate 21. It is easy to understand that when the array substrate of this embodiment is used in a display panel, while increasing the orthogonal projection area of ​​the array layer 22 on the substrate 21, the orthogonal projection area of ​​the light-emitting layer on the substrate 21 can also be increased, thereby increasing the display area of ​​the display panel, reducing the proportion of the bezel that the display panel cannot display, and improving the visual experience.

[0042] Preferably, the first surface L1 of the connecting portion 212 and the first surface Z1 of the main body portion 211 are continuous surfaces, that is, the connecting portion 212 of the substrate 21 and the main body portion 211 are integrally formed, simplifying the processing technology of the substrate 21. For example, a substrate with a complete and uniform thickness can be formed first, and then one end of the substrate can be processed by cutting / etching to remove part of the thickness to form the connecting portion.

[0043] In an alternative embodiment, such as Figure 4 As shown, the second surface L2 of the substrate 21 connecting portion 212 and the second surface Z2 of the main body portion 211 are located on the same plane. Since the thickness of the connecting portion 212 is less than the thickness of the main body portion 211, the first surface L1 of the connecting portion 212 and the first surface Z1 of the main body portion 211 are naturally not on the same plane.

[0044] Preferably, the second surface L2 of the connecting portion 212 and the second surface Z2 of the main body portion 211 are continuous surfaces, that is, the connecting portion 212 of the substrate 21 and the main body portion 211 are integrally formed, which simplifies the processing technology of the substrate 21.

[0045] In actual array substrate fabrication, it is not necessary to... Figure 3 The substrate 21 shown and Figure 4 The substrate 21 shown is processed separately. Since the material and properties of the two sides of the individual substrate 21 in the thickness direction are not significantly different, the main body 211 and the connecting part 212 can be made by laser, etching, engraving and other methods in actual processing.

[0046] Optionally, the thickness of the connecting portion 212 is 30% to 60% of the thickness of the main body portion 211; in other words, the thickness of the connecting portion 212 is 30% to 60% of the overall thickness of the substrate 21. For example, the thickness of the connecting portion 212 can be 30%, 32.5%, 35%, 37.5%, 40%, 42%, 45%, 48%, 50%, 53%, 55%, 57%, or 60% of the thickness of the main body portion 211, and is not limited here. Taking a substrate 21 thickness of 0.5 mm as an example, the thickness of the connecting portion 212 is 0.2 mm to 0.25 mm. For example, the thickness of the connecting part 212 is 0.2mm, 0.203mm, 0.21mm, 0.217mm, 0.22mm, 0.225mm, 0.23mm, 0.234mm, 0.24mm, 0.246mm, or 0.25mm, and is not limited here.

[0047] In practical applications, array layers can be selectively fabricated on both sides of substrate 21, forming the two substrate types described above. This design facilitates the splicing of multiple array substrates. Taking the splicing of two array substrates as an example, ... Figure 5 As shown in the figure, the two substrates 21 are respectively as follows Figure 3 The substrate 21 shown and Figure 4 The substrate 21 shown has connecting portions 212 corresponding to the "stepped" areas of another substrate 21. These "stepped" areas are formed by the thickness difference between the main body 211 and the connecting portions 212, thus improving the compactness of the substrates 21 during splicing. Furthermore, the conductive components 23 are all located between the connecting portions 212 of the two substrates 21, which helps reduce interference from the external environment, increases the area of ​​the conductive components 23 attached to the substrate 21, alleviates electrical connection abnormalities, improves the reliability of the array substrate, and enhances the user experience. This method also reduces the bezel of the display panel, eliminating noticeable seams during splicing.

[0048] Therefore, the substrate 21 includes at least one connecting portion 212. Generally, the substrate 21 has four sides that can be spliced ​​with other substrates 21, and each side can be provided with a connecting portion 212. When the substrate 21 has at least two connecting portions 212, the connecting portions 212 can be symmetrical, that is, the second surface of the main body 211 and the second surface L2 of the main body 212 are all on the same plane (e.g., Figure 4 As shown and Figure 6 The substrate 21a shown in the figure, or the first surface Z1 of the main body 211 and the first surface L1 of the connecting part 212 are both on the same plane (e.g., substrate 21a), or the first surface Z1 of the main body 211 and the first surface L1 of the connecting part 212 are both on the same plane (e.g., substrate 21a). Figure 3 As shown and Figure 6 The substrate 21b shown in the diagram can also be complementary (e.g., substrate 21b). Figure 6 The substrate 21c shown in the figure, that is, the connection part 212 of one and the connection part 212 of the other can be aligned and matched, wherein the first plane L1 of the connection part 212 is on the same plane as the first plane Z1 of the main body part 211, and the second plane L2 of the other connection part 212 is on the same plane as the second plane Z2 of the main body part 211.

[0049] Please refer to the following: Figure 2 , Figure 7-8 as well as Figure 9-10 , Figure 7 This is a schematic diagram of the structure of the third embodiment of the array substrate of the present invention. Figure 8 This is a schematic diagram of the structure of the fourth embodiment of the array substrate of the present invention. Figure 9 This is a structural schematic diagram of the third embodiment of the display device of the present invention. Figure 10 This is a structural schematic diagram of the fourth embodiment of the display device of the present invention.

[0050] In one embodiment, the connecting portion 212 further includes a first shaped sub-portion, an irregularly shaped sub-portion, and a second shaped sub-portion. The first shaped sub-portion is located at the end of the connecting portion 212, and the irregularly shaped sub-portion is adjacent to the first and second shaped sub-portions, respectively. The first surface L1 of the connecting portion 212 is a continuous plane, and the second surface L2 of the connecting portion 212 is a continuous curved surface. Compared with the array substrate in the above embodiments, this embodiment has better performance. The irregularly shaped sub-portion can act as a transition buffer to further reduce edge chipping, and the conductive component 23 can be covered with the substrate 21 at a more gentle angle, thereby reducing the wear of the conductive component 23.

[0051] like Figure 7 As shown, the connection portion 212 includes a first shaped sub-portion 2121, an irregularly shaped sub-portion 2122, and a second shaped sub-portion 2123; the surfaces of the first shaped sub-portion 2121, the irregularly shaped sub-portion 2122, and the second shaped sub-portion 2123 facing the array layer 22 are the first surface L1 of the connection portion 212, and the surfaces of the first shaped sub-portion 2121, the irregularly shaped sub-portion 2122, and the second shaped sub-portion 2123 facing the array layer 22 are continuous planes. Furthermore, the conductive component 23 (such as...) Figure 2 As shown, the continuous curved surface of the first regular-shaped sub-part 2121, the irregular-shaped sub-part 2122 and the second regular-shaped sub-part 2123, i.e. the second surface L2 of the connecting part 212, can increase the area of ​​the conductive component 23.

[0052] Optionally, the first surface L1 of the connecting portion 212 and the first surface Z1 of the main body portion 211 are located on the same plane, and the thickness of the first shaped sub-part 2121 is 45% to 65% of the thickness of the substrate 21. For example, the thickness of the first shaped sub-part 2121 can be 45%, 50%, 52.5%, 55%, 57%, 59.2%, 60% of the thickness of the substrate 21, etc., and is not limited here. Such a setting can avoid edge chipping when supporting the array layer 22 and other components of the display device due to the first shaped sub-part 2121 being too thin, which would increase the product defect rate; it can also avoid the irregular sub-part 2122 and the first connecting portion 212 being too short in the preset direction X due to the first shaped sub-part 2121 being too thick.

[0053] In an alternative embodiment, such as Figure 8 As shown, the connection portion 212 includes a first shaped sub-portion 2124, an irregularly shaped sub-portion 2125, and a second shaped sub-portion 2126. The surfaces of the first shaped sub-portion 2124, the irregularly shaped sub-portion 2125, and the second shaped sub-portion 2126 away from the array layer 22 constitute the first surface L1 of the connection portion 212, and the surfaces of the first shaped sub-portion 2124, the irregularly shaped sub-portion 2125, and the second shaped sub-portion 2126 away from the array layer 22 are continuous planes. Furthermore, the conductive component 23 (such as...) Figure 2As shown, the continuous curved surface of the first regular-shaped sub-part 2124, the irregular-shaped sub-part 2125 and the second regular-shaped sub-part 2126, i.e. the second surface L2 of the connecting part 212, can increase the area of ​​the conductive component 23.

[0054] Optionally, the first surface L1 of the connecting portion 212 and the second surface Z2 of the main body portion 211 are located on the same plane, and the thickness of the second shaped sub-portion 2126 is 45% to 65% of the thickness of the substrate 21. For example, the thickness of the second shaped sub-portion 2126 can be 45%, 50%, 52.5%, 55%, 57%, 59.2%, 60%, etc., of the thickness of the substrate 21, and is not limited here. This setting can avoid the first shaped sub-portion 2124 and the irregularly shaped sub-portion 2125 being too thin due to the second shaped sub-portion 2126 being too thin, thereby avoiding the connection portion 212 breaking when the substrate 21 supports the array layer 22 and other components of the display device, which would lead to an increased product defect rate; it can also avoid the second shaped sub-portion 2126 being too thick, which would cause problems when it is connected to other substrates 21 (such as...). Figure 7 When the substrate 21 shown is spliced ​​together, the edge of the substrate 21 spliced ​​with it breaks, which leads to an increase in the defect rate of the product.

[0055] In the actual fabrication of array substrates Figure 7 The thickness of the first shaped sub-section 2121 of the substrate 21 shown is, and Figure 8 When the thickness of the second orthographic sub-section 2126 of the substrate 21 shown is different, it is possible to adjust... Figure 7 Substrate 21 and Figure 8 The substrates 21 in the two are processed separately to ensure that they can be matched. Specifically, the sides of the substrates 21 are first laser-cut to support irregular shapes, such as... Figure 7 and Figure 8 The irregular stepped shape shown completes the splicing surface contour, facilitating splicing and edge grinding. After preparing the irregular stepped edge of the substrate 21, an edge grinding process is performed to reduce the risk of edge chipping due to uneven external force or excessively large splicing edges when splicing the array substrates after the substrate 21 edge thickness is reduced, thus preventing defective products. Furthermore, after edge grinding, a conductive component 23 (such as...) is fabricated on the second surface L2 of the connection portion 212. Figure 9 (as shown in the image).

[0056] Specifically, Figure 7 Substrate 21 and Figure 8 The substrate 21 in the middle can be spliced ​​to obtain, as shown in the figure. Figure 9 In the array substrate shown, the first shaped sub-part 2121 mates with the second shaped sub-part 2126, the irregularly shaped sub-part 2122 mates with the irregularly shaped sub-part 2125, and the second shaped sub-part 2123 mates with the first shaped sub-part 2124. The conductive component 23 can be disposed on... Figure 7 The substrate 21 shown and Figure 8 The substrates 21 shown are located between the substrates. For example, the contact pad, peripheral circuitry, and overcoating protective layer are disposed between them. Figure 7 The substrate 21 shown and Figure 8 The substrates 21 shown are arranged between each other to alleviate the situation where area must be reserved for the conductive components 23 when splicing screens, thereby reducing the bezel of the display panel and eliminating the noticeable splicing gaps during splicing.

[0057] It should be noted that the irregularly shaped sub-parts 2122 and 2125, when used together, facilitate positioning during the splicing of the substrate 21, which helps to ensure... Figure 7 The substrate 21 shown is with Figure 8 The substrate 21 shown can be spliced ​​with the same horizontal precision, making it less likely to result in uneven flatness after splicing. For example, Figure 7 as well as Figure 8 The irregularly shaped sub-parts 2122 and 2125 shown in the diagram have surfaces that match each other, so as to... Figure 7 The substrate 21 shown is Figure 8 When the substrate 21 is shown, the irregularly shaped sub-parts 2122 and 2125 are aligned and matched to ensure the horizontal accuracy of the array substrate during splicing. Of course, in alternative embodiments, the surfaces of the irregularly shaped sub-parts 2122 and 2125 facing each other can also be other shapes, such as curved surfaces or other irregular surfaces, which will not be described in detail here.

[0058] Similarly, in this embodiment, the substrate 21 also includes at least one connection portion 212. Please refer to the following reference. Figure 10 and Figure 11 , Figure 11 yes Figure 10 The diagram shows the structure of the display device from another perspective.

[0059] In other words, when the substrate 21 has at least two connection portions 212, the connection portions 212 can be symmetrical (e.g., Figure 10 The substrates 21x and 21y shown in the diagram can be complementary; or the substrates 21 may have different connection portions 212 (e.g., ...). Figure 10 The substrate 21z shown in the figure can be Figure 3 (or Figure 4 The connecting part 212 shown in the figure is... Figure 8 (or Figure 9 The connecting portion 212 shown in the figure is provided on the same substrate 21, and will not be described in detail here.

[0060] Please continue reading. Figure 2 and Figure 12 , Figure 12This is a schematic diagram of the structure of an embodiment of the conductive component of the array substrate of the present invention.

[0061] In one embodiment, the conductive component 23 extends from the end of the array layer 22 along the end face of the array layer 22, the surface of the connecting portion 212, and the end face of the connecting portion 212 to the back side of the substrate 21, where the back side of the substrate 21 is the side facing away from the array layer 22. Taking the array substrate as an example of its application in a display device, the conductive component 23 is connected to the pixel circuit 221 at the end of the array layer 22 and can be connected to the control circuit of the display device on the back side of the substrate 21, thereby enabling the light-emitting device to emit light through the conductive component 23 and the pixel circuit 221.

[0062] Optionally, the conductive layer 232 can be used to replace FPC (Flexible Printed Circuit). To improve the compactness of the array substrate and reduce the proportion of the bezel that cannot be displayed when the array substrate is applied to a display panel, the conductive layer 232 can also be made of a metallic material, such as at least one of copper, silver, and molybdenum. It is readily understood that, in this way, compared to the existing method of electrically connecting the pixel circuit 221 and the control circuit using an FPC, electrically connecting the pixel circuit 221 and the control circuit using the conductive layer 232 can improve the compactness of the array substrate, thereby reducing the proportion of the bezel that cannot be displayed when the array substrate is applied to a display panel.

[0063] Furthermore, the conductive component 23 includes a conductive layer 232 and at least two protective film layers 231. As the name suggests, the protective film layers 231 can protect the conductive layer 232 and also provide insulation for it. The at least two protective film layers 231 are respectively disposed on opposite sides of the conductive layer 232 to increase the area covering the conductive layer 232, thereby reducing metal impurities in the array substrate. Moreover, due to the manufacturing process, the surface of the substrate 21 is not perfectly smooth and is relatively rough. By placing the protective film layer 231 between the substrate 21 and the conductive layer 232, wear on the conductive layer 232 from the substrate 21 surface can be alleviated. It can also smooth the bending degree of the conductive layer 232 at the main body 211 and the connecting portion 212, mitigating the risk of damage due to excessive bending. This helps protect the conductive layer 232 and provides dual protection for the conductive layer 232 through the steps formed with the main body 211 and the connecting portion 212, improving the reliability of the array substrate. At the same time, it can also prevent the conductive layer 232 from directly contacting the substrate 21, thereby reducing the contact resistance and improving the electrical performance of the array substrate.

[0064] Optionally, the protective film layer 231 can be made of organic materials, such as organic adhesives, or inorganic materials, such as silicon oxide or silicon nitride, without limitation.

[0065] Furthermore, the thickness of the protective film layer 231 can be 3000nm to 5000nm. For example, the thickness of the protective film layer 231 can be 3000nm, 3200nm, 3450nm, 3600nm, 3850nm, 4000nm, 4250nm, 4500nm, 4750nm, 5000nm, etc., and is not limited here.

[0066] The thickness of the conductive layer 232 can be from 3000nm to 6000nm. For example, the thickness of the conductive layer 232 can be 3000nm, 3200nm, 3450nm, 3600nm, 3850nm, 4000nm, 4250nm, 4500nm, 4750nm, 5000nm, 5000nm, 5200nm, 5450nm, 5600nm, 5850nm, 6000nm, etc., and is not limited here.

[0067] Optionally, a protective film layer 231 with a thickness of 3000nm to 5000nm can be formed on the connection portion 212 by chemical deposition, vapor deposition, deposition, coating, etc. Then, a conductive layer 232 with a thickness of 3000nm to 6000nm is formed on the protective film layer 231 by physical deposition, etching, vapor deposition, etc. Next, another protective film layer 231 with a thickness of 3000nm to 5000nm is formed on the conductive layer 232 by chemical deposition, vapor deposition, deposition, coating, etc. This is equivalent to the protective film layer 231 protecting the conductive layer 232 in a sandwich manner, forming a double layer of protection for the conductive layer 232 between the connection portions 212, thereby improving the reliability of the array substrate.

[0068] Please see Figure 13 , Figure 13 This is a schematic diagram of the structure of an embodiment of the display device of the present invention.

[0069] In one embodiment, the display device may be a mobile phone, tablet computer, laptop computer, fingerprint collector, etc., but is not limited to these, and may also be other display devices, which will not be described in detail here.

[0070] The display device includes a display panel 32 and a control circuit 31. The display panel 32 is electrically connected to the control circuit 31, and the display panel 32 functions as the screen of the display device. The detailed structure of the display panel 32 has been described above. The control circuit 31 functions as the motherboard of the display device, controlling and coordinating the operation of the display panel 32 and other components of the display device to ensure the normal operation of the display device.

[0071] Please refer to the following: Figure 5 and Figure 13In one embodiment, the display device includes multiple display panels 32 spliced ​​together to increase the display area, thereby facilitating the diversification of display effects. Furthermore, since the structure of the array substrate of each display panel 32 can reduce the proportion of bezels that cannot be used for display, when multiple display panels 32 are spliced ​​together, the visual impact of the splicing gaps between the display panels 32 can be mitigated during use, thus improving the display effect and enhancing the visual experience.

[0072] To ensure the display effect of multiple display panels 32 displaying simultaneously and to alleviate the situation where one display panel 32 is too protruding or too recessed, the connection portion 212 of the array substrate of two adjacent display panels 32 is aligned and matched, as in the above-described embodiment of splicing two array substrates, so as to smooth out the visual differences between each display panel 32.

[0073] Furthermore, when multiple display panels 32 are spliced ​​together, the connecting part 212 can be provided around the main body 211. The connecting part 212 can completely surround the main body 211 or not completely surround the main body 211, depending on whether each end of the substrate 21 is aligned and matched with the substrate 21 of other display panels 32. If other display panels 32 are aligned and matched, the connecting part 212 can be provided.

[0074] Please continue reading. Figure 6 Furthermore, the display device also includes a connector 33, which is disposed on the side of the substrate 21 away from the array layer. The connector 33 is electrically connected to the conductive components 23 of the connected array substrate, and then electrically connected to the control circuit 31 of the display panel 32. Thus, the control circuit 31 can control the light-emitting devices of the display panel 32 to emit light, and the display panel 32 can be used for display. The connector 33 may include peripheral circuits in the display panel 32 for connecting to the control circuit 31, such as fan out lines, GOA circuits, etc., but is not limited to these, and will not be described in detail here.

[0075] Furthermore, when the connector 33 is located on the side of the substrate 21 away from the array layer, since one side surface of the substrate 21 is aligned with the connector 33, the connector 33 can also serve as a structural limiter, ensuring that one side surface of the substrate 21 of each display panel 32 is located on the same plane, thereby improving the visual experience.

[0076] Optionally, the display device may also include alignment connectors 34, which are electrically connected to connectors 33. The number of alignment connectors 34 is the same as the number of display panels 32, which means that each alignment connector 34 is used to electrically connect to a display panel 32 and control the display panel 32 connected to it to display. The control circuit 31 can control each display panel 32 to work together through the alignment connectors 34.

[0077] The alignment connector 34 can be an ACF (Anisotropic Conductive Film) or a support connector that can conduct electricity, but is not limited to these.

[0078] Furthermore, in this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," "stacked," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0079] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An array substrate, characterized in that, include: The substrate includes a main body and a connecting portion; the connecting portion includes a first shaped sub-part, an irregularly shaped sub-part, and a second shaped sub-part, the first shaped sub-part being located at the end of the connecting portion, the irregularly shaped sub-part being adjacent to the continuous curved surfaces of the first shaped sub-part and the second shaped sub-part respectively, the first surface of the connecting portion being a continuous plane, the second surface of the connecting portion being a continuous curved surface, and the surface of the irregularly shaped sub-part being a matching inclined surface relative to the other irregularly shaped sub-part; An array layer is located on the substrate and is disposed at least corresponding to the main body portion; the array layer is provided with pixel circuits. A conductive component is disposed on the connection portion of the substrate and electrically connected to the pixel circuit. The conductive component is disposed on the first shaped sub-part, the irregular sub-part, and the second shaped sub-part. The conductive component includes a conductive layer and at least two protective film layers, with the at least two protective film layers respectively disposed on opposite sides of the conductive layer. The connecting portion is located at the end of the substrate, and the thickness of the connecting portion is less than the thickness of the main body portion.

2. The array substrate according to claim 1, characterized in that, The first surface of the connecting portion and the first surface of the main body portion are located on the same plane, the second surface of the connecting portion and the second surface of the main body portion are not on the same plane, the first surface of the main body portion is the side close to the array layer, and the second surface of the main body portion is the side away from the array layer; The conductive component is at least disposed on the second surface of the connection portion; The array layer is provided on the first surface of the connecting part.

3. The array substrate according to claim 2, characterized in that, The first surface of the connecting portion and the first surface of the main body portion are continuous surfaces.

4. The array substrate according to claim 1, characterized in that, The first surface of the connecting portion is not on the same plane as the first surface of the main body portion, and the second surface of the connecting portion is on the same plane as the second surface of the main body portion. The first surface of the main body portion is the side closer to the array layer, and the second surface of the main body portion is the side away from the array layer. The conductive component is provided at least on the second surface of the connection portion.

5. The array substrate according to claim 4, characterized in that, The second surface of the connecting part is continuous with the second surface of the main body part.

6. The array substrate according to claim 1, characterized in that, The first surface of the connecting portion and the first surface of the main body portion are located on the same plane, and the thickness of the first shaped sub-part is 45% to 60% of the thickness of the substrate.

7. The array substrate according to claim 1, characterized in that, The first surface of the connecting portion and the second surface of the main body portion are located on the same plane, and the thickness of the second shaped sub-part is 40% to 55% of the thickness of the substrate.

8. The array substrate according to any one of claims 2-7, characterized in that, The conductive component extends from the end of the array layer along the end face of the array layer, the surface of the connection portion, and the end face of the connection portion to the back side of the substrate, wherein the back side of the substrate is the side facing away from the array layer.

9. The array substrate according to claim 8, characterized in that, The conductive layer of the conductive component is at least one of copper, silver, and molybdenum.

10. The array substrate according to claim 8, characterized in that, The thickness of the protective film is 3000nm~5000nm; The thickness of the conductive layer is 3000nm~6000nm.

11. The array substrate according to any one of claims 1-4, characterized in that, The thickness of the connecting part is 30-60% of the thickness of the main body.

12. The array substrate according to claim 11, characterized in that, The thickness of the connecting part is 0.2mm~0.25mm.

13. A display device, characterized in that, The display device includes a control circuit and a display panel electrically connected to the control circuit. The display panel includes an array substrate as described in any one of claims 1-12. The display device includes a plurality of the display panels spliced ​​together. The connection portions of two adjacent array substrates are aligned and matched.

14. The display device according to claim 13, characterized in that, The display device further includes a connector disposed on the side of the substrate away from the array layer. The connector is electrically connected to the conductive components of the array substrate to which it is connected, and then electrically connected to the control circuit of the display panel.

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