Laser quality adjustment method with controllable adjustment amount
By adopting a laser quality adjustment method with controllable adjustment in the manufacturing process of micro hemispherical oscillator, the problem of inaccurate removal amount and secondary correction in the prior art is solved, and high-precision and high-efficiency quality adjustment is achieved.
Patent Information
- Application Number
- CN202211338627.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-10-28
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2042-10-28
AI Technical Summary
In the manufacturing process of micro hemispherical oscillator, material defects and geometric dimensional errors lead to mass asymmetry, affecting the quality factor of the oscillator and the zero bias drift of the gyroscope, and mass adjustment is required to reduce frequency cracking. The prior art has problems in the laser quality adjustment and the need for secondary correction, which affects the leveling accuracy and efficiency.
A laser quality adjustment method with controllable adjustment is adopted. By setting the processing area on the surface of the sample and drawing the processing path pattern, setting laser processing parameters for laser processing, measuring the geometric dimensions of the removal area and calculating the removal volume. Through multiple machining and fitting, a functional relationship between the removal volume and the processing variable is obtained, which is used to determine the processing variables required for the ideal removal amount and achieve accurate mass adjustment.
This method can accurately control the actual removal amount of laser without secondary correction, greatly improving the accuracy and efficiency of quality adjustment and reducing the number of leveling iterations.