Camera module

Abstract

This invention provides a camera module comprising: a gyroscope sensor for generating jitter data; a first driver integrated circuit (IC) for generating a drive signal for moving a first lens barrel in at least one direction perpendicular to the optical axis based on the jitter data; and a second driver IC for generating a drive signal for moving a second lens barrel in at least one direction perpendicular to the optical axis based on the jitter data. The first driver IC includes a register unit for storing the jitter data transmitted from the gyroscope sensor, and the jitter data stored in the register unit is transmitted to the second driver IC.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2019-0121004, filed on September 30, 2019, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference for all purposes. Technical Field

[0002] The following description relates to a camera module. Background Technology

[0003] Portable communication terminals (such as mobile phones, portable digital / data assistants (PDAs), and portable personal computers (PCs)) have become commonly used for transmitting image data as well as text or voice data. In response to this trend, camera modules have been standardly installed in portable communication terminals to enable image data transmission, image chat, and more.

[0004] Typically, a camera module includes a lens barrel containing a lens and a housing that houses the lens barrel, and includes an image sensor for converting the image of the subject into an electrical signal. Smartphones may employ camera modules that use a short focusing method to capture images of objects with a fixed focus; however, recent technological advancements have led to the adoption of camera modules that include actuators capable of autofocus (AF) adjustment. Furthermore, such camera modules incorporate actuators for optical image stabilization (OIS) to reduce resolution degradation caused by camera shake.

[0005] To achieve high-performance camera functionality, a camera module with multiple lens barrels is mounted on the electronics. To improve the autofocus function of each of the multiple lens barrels and reduce resolution degradation, it is necessary to provide different actuators for each of the multiple lens barrels.

[0006] To stably drive different actuators, different gyroscope sensors are needed to provide jitter data to each of the different actuators, and different memories are needed to provide firmware data to each of the different actuators. However, when the camera module is equipped with multiple gyroscope sensors and multiple memories, there is a problem that the manufacturing cost may increase and the size may also increase. Summary of the Invention

[0007] The present invention provides a simplified overview of the selected concepts, which are further described in the following detailed description. This summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to be used to help define the scope of the claimed subject matter.

[0008] A camera module is provided that can share a memory for storing firmware data and jitter data provided by a gyroscope sensor, wherein different driver ICs provide jitter data to the memory.

[0009] In one general aspect, a camera module includes: a gyroscope sensor for generating jitter data; a first driver IC for generating, based on the jitter data, a drive signal for moving a first lens barrel in at least one direction perpendicular to an optical axis; and a second driver IC for generating, based on the jitter data, a drive signal for moving a second lens barrel in at least one direction perpendicular to the optical axis. The first driver IC includes a register unit for storing the jitter data transmitted from the gyroscope sensor, and the jitter data stored in the register unit is transmitted to the second driver IC.

[0010] The first driver IC and the second driver IC can perform Serial Peripheral Interface (SPI) communication.

[0011] The first driver IC may include the slave port of the SPI communication, and the second driver IC may include the master port of the SPI communication.

[0012] The register unit may include a first register for storing raw data and a second register for storing modified data. The raw data may correspond to an original copy of the jitter data transmitted from the gyroscope sensor, and the modified data may correspond to a processed copy of the jitter data processed by the first driver IC.

[0013] One of the original data and the modified data can be transmitted to the second driver IC.

[0014] The data transmitted to the second driver IC in the original data and the modified data can be determined based on the command information of the frame from the slave port.

[0015] The first driver IC may include a status register unit, which is used to record changes in the jitter data stored in the register unit.

[0016] The first driver IC can generate an interrupt signal in response to a change in the state value of the state register unit.

[0017] The first driver IC can provide the interrupt signal to the second driver IC through the master input-slave output (MISO) pin of the slave port.

[0018] The second driver IC can read the jitter data stored in the register unit according to the interrupt signal.

[0019] In another general aspect, a camera module includes: a first driver integrated circuit (IC) for generating a drive signal for moving a first lens barrel in at least one of an optical axis direction and a direction perpendicular to the optical axis direction; and a second driver IC for generating a drive signal for moving a second lens barrel in at least one of the optical axis direction and a direction perpendicular to the optical axis direction. The first driver IC includes a non-volatile memory for storing first firmware data for driving the first driver IC and second firmware data for driving the second driver IC. The second firmware data is transferred to the second driver IC.

[0020] The second driver IC may include volatile memory for storing the second firmware data.

[0021] In another general aspect, a camera module includes: an external memory; a first driver integrated circuit (IC) for generating a drive signal for moving a first lens barrel in at least one of an optical axis direction and a direction perpendicular to the optical axis direction; and a second driver IC for generating a drive signal for moving a second lens barrel in at least one of the optical axis direction and a direction perpendicular to the optical axis direction. The first driver IC includes non-volatile memory for storing first firmware data for driving the first driver IC, and second firmware data for driving the second driver IC is stored in one of the external memory and the non-volatile memory.

[0022] The external memory may include a slave port for Serial Peripheral Interface Bus (SPI) communication, the first driver IC may include a slave port for SPI communication, and the second driver IC may include a master port for SPI communication.

[0023] The second driver IC can determine the memory storing the second firmware data in the external memory and the non-volatile memory based on the header information of the external memory and the non-volatile memory.

[0024] The second driver IC can change the structure of the frame on the master port in response to the memory storing the second firmware data in the external memory and the non-volatile memory.

[0025] Other features and aspects will become apparent from the following detailed description, the accompanying drawings, and the claims. Attached Figure Description

[0026] Figure 1 It is a perspective view based on the example camera module.

[0027] Figure 2 It is a block diagram based on the example camera module.

[0028] Figure 3 It is a block diagram of the actuator based on the example.

[0029] Figure 4 The provided example is a block diagram illustrating a method for communicating jitter data, comprising a first driver integrated circuit (IC), a second driver IC, and a gyroscope sensor.

[0030] Figure 5 It shows according to Figure 4 The example is a frame from the slave port of the first driver IC.

[0031] Figure 6 The provided example is a block diagram illustrating a method for communicating firmware data using a first driver IC and a second driver IC.

[0032] Figure 7 The provided example is a block diagram illustrating a method for communicating firmware data, comprising a first driver IC, a second driver IC, and an external memory.

[0033] Figure 8 This is a flowchart illustrating a method for reading and writing second firmware data to a second driver IC, based on an example.

[0034] Throughout the accompanying drawings and detailed embodiments, the same reference numerals denote the same elements. The drawings may not be drawn to scale, and for clarity, illustration, and convenience, the relative dimensions, scale, and depiction of the elements in the drawings may be exaggerated. Detailed Implementation

[0035] The following detailed embodiments are provided to aid the reader in gaining a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will be readily apparent to those skilled in the art. The order of operations described herein is merely illustrative and is not limited to the order presented; changes that will be readily apparent to those skilled in the art may be made, except for operations that must occur in a specific order. Furthermore, for clarity and brevity, descriptions of functions and structures well-known to those skilled in the art may be omitted.

[0036] The features described herein may be implemented in various forms and are not to be construed as being limited to the examples described herein. Rather, the examples provided herein are intended to make this disclosure thorough and complete, and to fully convey the scope of this disclosure to those skilled in the art.

[0037] Here, it should be noted that the use of the term "may" in relation to examples or embodiments, for example, regarding what an example or embodiment may include or implement, means that there exists at least one example or embodiment that includes or implements such a feature, but not all examples and embodiments are limited thereto.

[0038] Throughout the specification, when an element such as a layer, region, or substrate is described as being "on" another element, "connected" to another element, or "bonded" to another element, the element may be directly "on" another element, directly "connected" to another element, or directly "bonded" to another element, or there may be one or more other elements in between. In contrast, when an element is described as being "directly on" another element, directly "connected" to another element, or "bonded" to another element, there may be no other elements in between.

[0039] As used herein, the term “and / or” includes any one and any combination of any two or more of the relevant listed items.

[0040] Although terms such as “first,” “second,” and “third” may be used herein to describe various components, assemblies, regions, layers, or parts, these components, assemblies, regions, layers, or parts will not be limited by these terms. Rather, these terms are used only to distinguish one component, assembly, region, layer, or part from another. Therefore, without departing from the teaching of the examples described herein, the first component, first assembly, first region, first layer, or first part referred to as the first component, first assembly, first region, first layer, or first part may also be referred to as the second component, second assembly, second region, second layer, or second part.

[0041] For ease of description, spatial relative terms such as “above,” “above,” “below,” and “under” are used herein to describe the relationship between one element and another as shown in the accompanying drawings. Such spatial relative terms are intended to include not only the orientation depicted in the drawings but also the different orientations of the device during use or operation. For example, if the device in the drawings is flipped, an element described as “above” or “above” relative to another element will then be “below” or “under” relative to said other element. Thus, the term “above” includes both “above” and “below” orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative terms used herein will be interpreted accordingly.

[0042] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms “comprising,” “including,” and “having” enumerate the presence of the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0043] Due to manufacturing techniques and / or tolerances, the shapes shown in the accompanying drawings may vary. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include changes in shape that occur during manufacturing.

[0044] The features of the examples described herein can be combined in a variety of ways that will become apparent upon understanding the disclosure of this application. Furthermore, while the examples described herein have multiple constructions, other constructions that will become apparent upon understanding the disclosure of this application are possible.

[0045] The example will be described in detail below with reference to the accompanying drawings.

[0046] Figure 1 It is a perspective view based on the example camera module.

[0047] Reference Figure 1 The camera module 1 may include: a first camera module 10a, including a first lens barrel 100a, a first housing 200a for accommodating the first lens barrel 100a, and a first outer shell 300a coupled to the first housing 200a; and a second camera module 10b, including a second lens barrel 100b, a second housing 200b for accommodating the second lens barrel 100b, and a second outer shell 300b coupled to the second housing 200b.

[0048] The first camera module 10a and the second camera module 10b can be mounted on the same printed circuit board, or they can be mounted on different printed circuit boards.

[0049] Since the first camera module 10a and the second camera module 10b have similar structures, the first camera module 10a will be described in detail, and unnecessary descriptions will be omitted.

[0050] The first lens barrel 100a may be formed as a hollow cylindrical shape, and may accommodate a plurality of lenses for capturing a subject, and the plurality of lenses may be mounted on the first lens barrel 100a in the optical axis direction. If necessary, some of the plurality of lenses may be configured according to the design of the first lens barrel 100a, and each lens may have optical properties such as the same or different refractive indices.

[0051] The first camera module 10a may further include an image sensor for converting incident light through the first lens barrel 100a into an electrical signal. The image sensor is disposed below the first housing 200a. The image sensor can convert incident light through the first lens barrel 100a into an electrical signal. The image sensor may include a charge-coupled device (CCD) and a complementary metal-oxide-semiconductor (CMOS). The electrical signal converted by the image sensor is output as an image through a display unit of an electronic device. The image sensor is fixed to a printed circuit board and electrically connected to the printed circuit board via wire bonding.

[0052] An infrared filter can be positioned above the image sensor. The infrared filter blocks light in the infrared region from the light incident through the first lens barrel 100a.

[0053] The first camera module 10a includes a first actuator for driving the first lens barrel 100a in two directions: along the optical axis and perpendicular to the optical axis. The first actuator includes an AF actuator for adjusting the focus and an OIS actuator for correcting camera shake.

[0054] For example, the AF actuator can adjust the focus by moving the first lens barrel 100a in the optical axis direction (Z-axis direction), and the OIS actuator can correct camera shake during shooting by moving the first lens barrel 100a in two directions perpendicular to the optical axis direction (X-axis direction and Y-axis direction).

[0055] The first housing 200a may be formed having an open upper and lower portion, and the first lens barrel 100a and the first actuator may be accommodated within the internal space of the first housing 200a. A first outer shell 300a may be attached to the first housing 200a to surround the upper portion of the first housing 200a and to protect the internal components of the first camera module 10a. Furthermore, the first outer shell 300a may shield electromagnetic waves so that electromagnetic waves generated by the camera module do not affect other electronic components in the electronic device. Additionally, the first outer shell 300a may shield electromagnetic waves so that electromagnetic waves generated by other electronic components do not affect the camera module.

[0056] Figure 2 It is a block diagram based on the example camera module.

[0057] Reference Figure 1 and Figure 2The camera module 1 may include: a first camera module 10a, including a first lens barrel 100a and a first actuator 400a for driving the first lens barrel 100a in a direction perpendicular to the optical axis; and a second camera module 10b, including a second lens barrel 100b and a second actuator 400b for driving the second lens barrel 100b in a direction perpendicular to the optical axis. The first actuator 400a may include a first driver integrated circuit (IC) 401a, and the second actuator 400b may include a second driver IC 401b.

[0058] Figure 3 This is a block diagram based on the example actuator. Refer to the following text. Figures 1 to 3 Describe in detail the driving method of the actuator based on the example.

[0059] according to Figure 3 The example actuator 400 corresponds to Figure 2 One of the first actuator 400a and the second actuator 400b shown in the figure.

[0060] Reference Figure 3 Actuator 400 includes AF actuator 410 and OIS actuator 420.

[0061] The AF actuator 410 includes an AF driver IC 411, an AF coil 412, an AF magnet 413, and an AF position sensor 414. The OIS actuator 420 includes an OIS driver IC 421, an OIS coil 422, an OIS magnet 423, and an OIS position sensor 424.

[0062] Driver IC 401 may include AF driver IC 411 of AF actuator 410 and OIS driver IC 421 of OIS actuator 420, and driver IC 401 corresponds to Figure 2 One of the first driver IC 401a and the second driver IC 401b shown.

[0063] The AF driver IC 411 generates a drive signal Sdr based on the input signal Sin and the feedback signal Sf, and provides the generated drive signal Sdr to the AF coil 412. For example, the input signal Sin may be located inside the electronic device in which the camera module is applied, and may be provided by a host computer that controls the overall operation of the electronic device. The input signal Sin provided to the AF driver IC 411 may include information about the target position in the optical axis direction of the lens barrel.

[0064] The feedback signal Sf can be provided by the AF position sensor 414, which detects the current position of the lens barrel in the optical axis direction. For example, the AF position sensor 414 may include a Hall element. The AF position sensor 414 can detect the current position of the lens barrel by the current position of the AF magnet 413.

[0065] The AF driver IC 411 can be driven in a closed-loop manner, comparing the input signal Sin with the feedback signal Sf. The closed-loop AF driver IC 411 can be driven in a direction that reduces the error between the target position included in the input signal Sin and the current position detected in the feedback signal Sf. Compared to an open-loop system, the advantages of driving in a closed-loop manner are improved linearity, accuracy, and repeatability.

[0066] The AF driver IC 411 may include an H-bridge circuit capable of driving in both directions to provide a drive signal Sdr to the AF coil 412 in a voice coil motor manner. The drive signal Sdr may be provided to the AF coil 412 in the form of current or voltage.

[0067] When the drive signal Sdr is applied to the AF coil 412, the lens barrel can move in the optical axis direction due to the electromagnetic influence between the AF magnet 413 and the AF coil 412. For example, the AF magnet 413 can be mounted on one side of the lens barrel, and the AF coil 412 can be mounted on the housing to face the AF magnet 413. However, according to the example, the positions of the AF magnet 413 and the AF coil 412 can be interchanged.

[0068] The OIS driver IC 421 can generate a drive signal Sdr based on the input signal Sin, the gyroscope signal Sgy, and the feedback signal Sf, and can provide the generated drive signal Sdr to the OIS coil 422.

[0069] For example, the input signal Sin can be located inside the electronic device in which the camera module is applied, and can be provided by a host computer that controls the overall operation of the electronic device. The input signal Sin provided to the OIS driver IC421 can include information about the target position in a direction perpendicular to the optical axis of the lens barrel.

[0070] The gyroscope signal Sgy can be located in the camera module and provided by a gyroscope sensor that detects jitter in the camera module or electronics. For example, the gyroscope signal Sgy can include jitter data. For example, jitter data can include acceleration data and angular velocity data detected from jitter in the camera module or electronics.

[0071] The feedback signal Sf can be provided by the OIS position sensor 424, which detects the current position in a direction perpendicular to the optical axis of the lens barrel. For example, the OIS position sensor 424 may include a Hall element. The OIS position sensor 424 can detect the current position of the lens barrel by the current position of the OIS magnet 423.

[0072] The OIS driver IC 421 can be driven in a closed-loop manner, comparing the input signal Sin, the gyroscope signal Sgy, and the feedback signal Sf. The closed-loop OIS driver IC 421 can be driven in a direction that reduces the error in the target position included in the input signal Sin, the jitter information included in the gyroscope signal Sgy, and the current position detected in the feedback signal Sf. Compared to an open-loop system, the advantages of closed-loop driving include improved linearity, accuracy, and repeatability.

[0073] The OIS driver IC 421 may include an H-bridge circuit capable of driving in both directions to provide a drive signal Sdr to the OIS coil 422 in a voice coil motor manner. The drive signal Sdr may be provided to the OIS coil 422 in the form of voltage or current.

[0074] When the drive signal Sdr is applied to the OIS coil 422, the lens barrel can move in a direction perpendicular to the optical axis due to the electromagnetic influence between the OIS magnet 423 and the OIS coil 422. For example, two OIS magnets 423 are provided, one mounted on the lens barrel in a first direction perpendicular to the optical axis, and the other mounted on the lens barrel in a second direction perpendicular to the optical axis. Furthermore, two OIS coils can be provided, and each of the two OIS coils can be positioned facing each of the two OIS magnets. However, in some examples, the positions of the OIS magnets 423 and the OIS coils 422 can be changed.

[0075] In order to stably drive the first actuator 400a and the second actuator 400b of the camera module 1, two memories are required to store the firmware data of each of the first driver IC 401a and the second driver IC 401b, and two gyroscope sensors are required to provide jitter data to each of the first driver IC 401a and the second driver IC 401b.

[0076] However, in order to reduce the manufacturing cost and size of camera modules or electronic devices, it is necessary to limit the amount of memory used to store firmware data and the number of gyroscope sensors used to provide jitter data.

[0077] Figure 4The provided example is a block diagram illustrating a method for communicating jitter data, comprising a first driver IC, a second driver IC, and a gyroscope sensor.

[0078] Each of the first driver IC 401a and the second driver IC 401b may include a microcontroller unit (MCU). It is understood that the operation of the first driver IC 401a and the second driver IC 401b (described later) is performed by the microcontroller unit (MCU) disposed in each of the first driver IC 401a and the second driver IC 401b.

[0079] Reference Figure 4 The first driver IC 401a is connected to the gyroscope sensor 20, and the first driver IC 401a is also connected to the second driver IC 401b. The gyroscope sensor 20 corresponds to a component of the camera module.

[0080] The jitter data generated by the gyroscope sensor 20 can be transmitted to the first driver IC 401a, and the second driver IC 401b can receive the jitter data generated by the gyroscope sensor 20 through the first driver IC 401a. Each of the first driver IC 401a and the second driver IC 401b can perform OIS operation by using the jitter data.

[0081] The gyroscope sensor 20 and the first driver IC 401a can be connected via a communication line. As an example, the gyroscope sensor 20 and the first driver IC 401a can be connected via a Serial Peripheral Interface (SPI) communication line to perform SPI communication.

[0082] In the communication of jitter data between the gyroscope sensor 20 and the first driver IC 401a, the first driver IC 401a acts as the master in the SPI communication, and the gyroscope sensor 20 acts as the slave in the SPI communication. Therefore, the master port M is set in the first driver IC 401a, and the slave port S is set in the gyroscope sensor 20.

[0083] exist Figure 4 The diagram schematically shows the master port M and the slave port S, but the master port M and the slave port S may include a master input slave output (MISO) pin, a master output slave input (MOSI) pin, a serial clock (SCLK) pin, and a slave select (SS) pin.

[0084] In SPI communication, the operation of transferring specific data from the slave device to the master device in SPI communication can be understood as the operation of reading specific data from the slave device in SPI communication.

[0085] The first driver IC 401a and the second driver IC 401b can be connected via a communication line. For example, the first driver IC 401a and the second driver IC 401b can be connected via a Serial Peripheral Interface (SPI) communication line to perform SPI communication.

[0086] In the jitter data communication between the first driver IC 401a and the second driver IC 401b, the second driver IC 401b acts as the master in SPI communication, and the first driver IC 401a acts as the slave in SPI communication. The second driver IC 401b has a master port M, and the first driver IC 401a has a slave port S.

[0087] The first driver IC 401a may include a register unit (rg) for storing jitter data transmitted from the gyroscope sensor 20. For example, the register unit (rg) may include a first register (rg1) for storing raw data and a second register (rg2) for storing modified data. Here, the raw data corresponds to the original copy of the jitter data transmitted from the gyroscope sensor 20, and the modified data is a processed copy of the jitter data processed by the first driver IC 401a.

[0088] One of the original data and the modified data stored in the register unit (rg) can be transferred to the second driver IC 401b.

[0089] Figure 5 It shows according to Figure 4 The example is a frame from the slave port of the first driver IC 401a.

[0090] Reference Figure 5 The frame of the slave port S of the first driver IC 401a may include commands, data and status.

[0091] Commands may include information about reading / writing, control entities, and addresses; data may include raw data and information about modified data.

[0092] According to the command control entity, the data to be transmitted to the master port M set in the second driver IC 401b can be determined in the slave port S set in the first driver IC 401a.

[0093] For example, when the control entity is the first driver IC 401a, modified data can be transmitted to the second driver IC 401b, while when the control entity is the second driver IC 401b, original data can be transmitted to the second driver IC 401b.

[0094] For example, the control entity for the aforementioned commands can be determined by a host computer used to control the overall operation of the electronic device.

[0095] Based on the example, jitter data transmitted from the first driver IC 401a to the second driver IC 401b can be determined, and the type of transmitted data can be flexibly changed.

[0096] The first driver IC 401a may include a status register unit (srg) for recording changes in jitter data stored in the register unit (rg).

[0097] When the jitter data stored in the register cell (rg) changes, the state value of the status register cell (srg) can change. When the state value of the status register cell (srg) changes, the first driver IC 401a can generate an interrupt signal and provide the generated interrupt signal to the second driver IC 401b.

[0098] An interrupt signal can be provided from the first driver IC 401a to the second driver IC 401b via the Master Input Slave Output (MISO) pin. When the second driver IC 401b receives the interrupt signal, it can read jitter data from the register cell (rg) of the first driver IC 401a.

[0099] For example, a status register unit (srg) may include a first status register (srg1) that records changes to the original data stored in a first register (rg1) and a second status register (srg2) that records changes to the modified data stored in a second register (rg2).

[0100] When the original data changes, the state value of the first status register (srg1) changes, and when the modified data changes, the state value of the second status register (srg2) changes.

[0101] The first register (rg1) consists of multiple bits, and the first status register (srg1) consists of multiple bits corresponding to the multiple bits of the first register (rg1). Furthermore, the second register (rg2) consists of multiple bits, and the second status register (srg2) consists of multiple bits corresponding to the multiple bits of the second register (rg2).

[0102] When the data in a specific bit of one of the multiple bits of the first register (rg1) changes, the state value of the specific bit of the first status register (srg1) corresponding to that specific bit of the first register (rg1) can be changed.

[0103] Furthermore, when the data in a specific bit of one of the bits in the second register (rg2) changes, the state value of the specific bit in the second status register (srg2) corresponding to that specific bit in the second register (rg2) can also change.

[0104] When at least one of the state values ​​of the first state register (srg1) and the second state register (srg2) changes, the first driver IC 401a can generate an interrupt signal and provide the generated interrupt signal to the second driver IC 401b.

[0105] For example, an interrupt signal can be provided from the first driver IC 401a to the second driver IC 401b via the Master Input Slave Output (MISO) pin. When the second driver IC 401b receives the interrupt signal, it can read data from the registers in the first register (rg1) and the second register (rg2) of the first driver IC 401a where the data has changed.

[0106] According to the example, when the second driver IC 401b receives an interrupt signal, the second driver IC 401b can read jitter data from the register cell (rg) of the first driver IC 401a. Therefore, compared with the method of periodically reading jitter data, time loss can be reduced.

[0107] When the second driver IC 401b reads jitter data from the register unit (rg), it can initialize the status value of the status register unit (srg).

[0108] For example, when the second driver IC 401b reads jitter data from any bit of a register cell (rg), it can initialize any bit in the status register cell (srg) that corresponds to any bit of the register cell (rg).

[0109] As another example, when the second driver IC 401b reads jitter data from a specific bit in the register cell (rg) that corresponds to a specific bit in the status register cell (srg) whose status value has changed, all bits in the status register cell (srg) can be initialized.

[0110] As another example, at the end of the frame of the master port M of the second driver IC 401b, all bits of the status register unit (srg) can be initialized.

[0111] Figure 6 The provided example is a block diagram illustrating a method for communicating firmware data using a first driver IC and a second driver IC.

[0112] Reference Figure 6 The first driver IC 401a is connected to the second driver IC 401b via a communication line. For example, the first driver IC 401a and the second driver IC 401b can be connected to a Serial Peripheral Interface (SPI) communication line to perform SPI communication.

[0113] In the communication of firmware data between the first driver IC 401a and the second driver IC 401b, the second driver IC 401b acts as the master in SPI communication, while the first driver IC 401a acts as the slave in SPI communication. The master port M is set in the second driver IC 401b, and the slave port S is set in the first driver IC 401a.

[0114] The first driver IC 401a includes a non-volatile memory IM1 for storing firmware data. The firmware data stored in the non-volatile memory IM1 may include first firmware data for driving the first driver IC 401a and second firmware data for driving the second driver IC 401b. For example, each of the first and second firmware data may include data for autofocus (AF) and optical image stabilization (OIS).

[0115] For example, the non-volatile memory IM1 of the first driver IC 401a may include flash memory. Since the non-volatile memory IM1 of the first driver IC 401a is implemented as flash memory, the firmware data stored in the flash memory can be retained even when the first driver IC 401a is not powered.

[0116] The second driver IC 401b may include volatile memory IM2. Second firmware data stored in the non-volatile memory IM1 of the first driver IC 401a can be transferred to the second driver IC 401b and stored in volatile memory IM2. The second driver IC 401b can read the second firmware data stored in the non-volatile memory IM1 of the first driver IC 401a and can store it in volatile memory IM2.

[0117] For example, the volatile memory IM2 of the second driver IC 401b may include static random access memory (SRAM). Implementing the volatile memory IM2 of the second driver IC 401b as SRAM reduces the memory size and allows the volatile memory IM2 to operate at high speed, enabling the second driver IC 401b to be driven quickly via the second firmware data.

[0118] Figure 7 The following is a block diagram illustrating a method for communicating firmware data, provided according to another example: a first driver IC, a second driver IC, and an external memory.

[0119] Because according to Figure 7 Example of a first driver IC 401a and a second driver IC 401b according to Figure 6The example first driver IC 401a and second driver IC 401b are similar, so redundant descriptions will be omitted and descriptions will be provided based on the differences.

[0120] The external memory EM may include electrically erasable programmable read-only memory (EEPROM). The external memory EM corresponds to a component of the camera module.

[0121] The first driver IC 401a includes a non-volatile memory IM1. First firmware data for driving the first driver IC 401a can be stored in the non-volatile memory IM1 of the first driver IC 401a.

[0122] In addition, unlike Figure 6 In the example, Figure 7 In the example, the second firmware data used to drive the second driver IC 401b can be stored in one of the external memory EM and the non-volatile memory IM1 of the first driver IC 401a.

[0123] The second driver IC 401b can determine which of the external memory EM and the non-volatile memory IM1 of the first driver IC 401a stores the second firmware data, and can read the second firmware data from the determined memory.

[0124] The second driver IC 401b includes a volatile memory IM2 for storing read second firmware data.

[0125] Reference Figure 7 The first driver IC 401a and the second driver IC 401b can be connected to a connection line. For example, the first driver IC 401a and the second driver IC 401b can be connected via a Serial Peripheral Interface (SPI) communication line to perform SPI communication.

[0126] In the communication of firmware data between the first driver IC 401a and the second driver IC 401b, the second driver IC 401b acts as the master in SPI communication, while the first driver IC 401a acts as the slave in SPI communication. The second driver IC 401b has a master port M, and the first driver IC 401a has a slave port S.

[0127] The second driver IC 401b and the external memory EM can be connected via a communication line. For example, the second driver IC 401b and the external memory EM can be connected via a Serial Peripheral Interface (SPI) communication line to perform SPI communication.

[0128] In the communication of firmware data between the second driver IC 401b and the external memory EM, the second driver IC 401b acts as the master in SPI communication, and the external memory EM acts as the slave in SPI communication. The second driver IC 401b has a master port M, and the external memory EM has a slave port S.

[0129] Figure 8 This is a flowchart illustrating a method for reading and writing second firmware data to a second driver IC, based on an example.

[0130] Reference Figure 8 The second driver IC 401b reads the header information of the external memory EM and the non-volatile memory IM1 of the first driver IC 401a (S810).

[0131] The second driver IC 401b determines, based on the header information of the external memory EM and the non-volatile memory IM1 of the first driver IC 401a, which of the two stores the second firmware data (S820). For example, the header information may include information such as command code, address size, etc.

[0132] The second driver IC 401b responds to the non-volatile memory IM1 and the memory storing the second firmware data in the external memory EM to change the structure of the frame on the main port M (S830).

[0133] For example, when the non-volatile memory IM1 and the external memory EM storing the second firmware data are both non-volatile memory IM1, the second driver IC 401b changes the frame structure of the main port M in the same format as commands, addresses, IDLE (idle), and data. Furthermore, when the non-volatile memory IM1 and the external memory EM storing the second firmware data are both external memory EM, the second driver IC 401b changes the frame structure of the main port M in the same format as commands, addresses, and data. Here, in the frame structure of the non-volatile memory IM1, the IDLE interval corresponds to the interval required to obtain the second firmware data from the non-volatile memory IM1.

[0134] In response to the memory storing the second firmware data, the second driver IC 401b can read the second firmware data after changing the frame structure of the main port M. The read second firmware data can be stored in the volatile memory IM2 (S840).

[0135] As described above, in the example camera module, the memory storing firmware data and jitter data provided by the gyroscope sensor is shared, wherein different driver ICs provide jitter data to the memory, thereby reducing the manufacturing cost and size of the camera module.

[0136] While this disclosure includes specific examples, it will be apparent to those skilled in the art that various changes in form and detail may be made to these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be considered descriptive only and not for limiting purposes. The description of features or aspects in each example is to be considered applicable to similar features or aspects in other examples. Suitable results may be obtained if the described techniques are performed in a different order, and / or if components in the described system, architecture, apparatus, or circuit are combined in a different manner, and / or if components in the described system, architecture, apparatus, or circuit are replaced or added with other components or their equivalents. Therefore, the scope of this disclosure is not limited by the specific embodiments but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents shall be construed as being included in this disclosure.

Claims

1. A camera module, comprising: A first driver for a first camera module, the first driver including a first coil, a first magnet and a first driver integrated circuit IC, the first driver IC being configured to generate a drive signal for moving a first lens barrel in at least one of an optical axis direction and a direction perpendicular to the optical axis direction; as well as A second driver for a second camera module, the second driver including a second coil, a second magnet, and a second driver IC, the second driver IC being configured to generate a drive signal for moving the second lens barrel in at least one direction, namely the optical axis direction and a direction perpendicular to the optical axis direction. The first driver IC includes a non-volatile memory configured to store first firmware data for driving the first driver IC and second firmware data for driving the second driver IC. The second firmware data is transmitted to the second driver IC.

2. The camera module of claim 1, wherein, The second driver IC includes a volatile memory configured to store the second firmware data.

3. The camera module of claim 2, wherein, The first driver IC includes a slave port for Serial Peripheral Interface (SPI) communication, and the second driver IC includes a master port for the SPI communication.

4. A camera module, comprising: External memory; A first driver for a first camera module, the first driver including a first coil, a first magnet and a first driver integrated circuit IC, the first driver IC being configured to generate a drive signal for moving a first lens barrel in at least one of an optical axis direction and a direction perpendicular to the optical axis direction; as well as A second driver for a second camera module, the second driver including a second coil, a second magnet, and a second driver IC, the second driver IC being configured to generate a drive signal for moving the second lens barrel in at least one direction, namely the optical axis direction and a direction perpendicular to the optical axis direction. The first driver IC includes a non-volatile memory configured to store first firmware data for driving the first driver IC. The second firmware data used to drive the second driver IC is stored in one of the external memory and the non-volatile memory.

5. The camera module according to claim 4, wherein, The external memory includes a slave port for SPI communication via a serial peripheral interface bus. The first driver IC includes a slave port for SPI communication, and The second driver IC includes a master port for SPI communication.

6. The camera module according to claim 5, wherein, The second driver IC is configured to: determine the memory storing the second firmware data in the external memory and the non-volatile memory based on the header information of the external memory and the non-volatile memory.

7. The camera module according to claim 6, wherein, The second driver IC is configured to change the structure of the frame on the master port in response to the memory storing the second firmware data in the external memory and the non-volatile memory.

8. The camera module according to any one of claims 1 and 4, further comprising a gyroscope sensor configured to generate jitter data; in, The first driver IC is configured to generate a drive signal based on the jitter data for moving the first lens barrel in at least one direction perpendicular to the optical axis. as well as The second driver IC is configured to generate a drive signal based on the jitter data for moving the second lens barrel in at least one direction perpendicular to the optical axis.

9. The camera module according to any one of claims 1 and 4, wherein, Both the first driver IC and the second driver IC include an autofocus (AF) driver IC and an optical image stabilization (OIS) driver IC.

10. The camera module according to any one of claims 1 and 4, wherein, The first lens barrel is included in the first camera module. The second lens barrel is included in the second camera module, and The first camera module and the second camera module are mounted on a printed circuit board.

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