Camera module

Abstract

The present disclosure provides a camera module, the camera module comprising: a gyro sensor that generates shake data; a first driver integrated circuit (IC) that generates a drive signal to move a first lens barrel in one or more directions perpendicular to an optical axis direction in response to the shake data provided by the gyro sensor; and a second driver IC that generates a drive signal to move a second lens barrel in one or more directions perpendicular to the optical axis direction in response to the shake data provided by the gyro sensor. Each of the first driver IC and the second driver IC operates in one of a normal mode and a low power mode, and when the first driver IC operates in the low power mode, determines whether to enable a communication path of the shake data in the first driver IC in response to a mode of the second driver IC.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2020-0007298, filed with the Korean Intellectual Property Office on January 20, 2020, the entire disclosure of which is incorporated herein by reference for all purposes. Technical Field

[0002] The present disclosure relates to a camera module. Background Art

[0003] Generally, portable communication terminals such as mobile phones, personal digital assistants (PDAs), and portable personal computers (PCs) have recently become common for transmitting image data as well as text or voice data. In response to this trend, in order to enable image data transmission, image chatting, etc., camera modules have recently become standard in portable communication terminals.

[0004] Generally, a camera module includes a lens barrel having a lens therein and a housing that houses the lens barrel, and includes an image sensor that converts an image of a subject into an electrical signal. A smartphone may adopt a camera module using a short focal length method of photographing an object at a fixed focal length, but recently, according to technological development, an actuator capable of automatic focus (AF) adjustment has been adopted. In addition, such a camera module may adopt an actuator having an optical image stabilization (OIS) function to reduce the resolution degradation phenomenon caused by shake.

[0005] Recently, in order to implement a high-performance camera function, a camera module having a plurality of lens barrels has been mounted on an electronic device. In order to improve the autofocus function of each of the plurality of lens barrels and reduce the resolution degradation phenomenon, it is necessary to provide a different actuator for each of the plurality of lens barrels.

[0006] In order to stably drive different actuators, it is necessary to provide different gyro sensors that provide shake data to each of the different actuators and different memories that provide firmware data to each of the different actuators, but when the camera module is provided with a plurality of gyro sensors and a plurality of memories, there is a problem that its manufacturing cost and size may increase.

[0007] The above information is presented as background art information only to assist in understanding the present disclosure. No determination has been made, nor is any assertion made, as to whether any of the above constitutes prior art with respect to the present disclosure. Summary of the Invention

[0008] The present invention content is provided to introduce selected concepts in a simplified form and further describe these concepts in the following detailed description. The present invention content is not intended to identify the key features or essential features of the claimed subject matter, nor is it intended to assist in determining the scope of the claimed subject matter.

[0009] In one general aspect, a camera module includes: a gyro sensor that generates shake data; a first driver integrated circuit (IC) that generates a drive signal to move a first lens barrel in one or more directions perpendicular to the optical axis direction in response to the shake data provided by the gyro sensor; and a second driver IC that generates a drive signal to move a second lens barrel in one or more directions perpendicular to the optical axis direction in response to the shake data provided by the gyro sensor, wherein each of the first driver IC and the second driver IC operates in one of a normal mode and a low power mode, and when the first driver IC operates in the low power mode, it determines whether to enable the communication path of the shake data in the first driver IC in response to the mode of the second driver IC.

[0010] The communication path of the shake data in the first driver IC may be formed between a first communication port of the first driver IC connected to the gyro sensor and a second communication port of the first driver IC connected to the second driver IC.

[0011] When the first driver IC operates in the low power mode and the second driver IC operates in the normal mode, the communication path of the shake data in the first driver IC may be enabled.

[0012] Power may be supplied to the first communication port and the second communication port.

[0013] When the first driver IC operates in the low power mode and the second driver IC operates in the low power mode, the communication path of the shake data in the first driver IC may be deactivated.

[0014] The power supply to the first communication port and the second communication port may be cut off.

[0015] The gyro sensor and the first driver IC may perform Serial Peripheral Interface Bus (SPI) communication.

[0016] The first communication port of the first driver IC may include a master port in SPI communication.

[0017] The first driver IC and the second driver IC can perform Serial Peripheral Interface Bus (SPI) communication.

[0018] The second communication port of the first driver IC may include a slave port in SPI communication.

[0019] The first driver IC may include a non-volatile memory that stores first firmware data and second firmware data. The second driver IC may include a volatile memory that stores the second firmware data sent from the first driver IC. When the second driver IC operates in the low power mode, the volatile memory can hold the stored second firmware data.

[0020] The first driver IC can generate a drive signal according to the first firmware data to move the first lens barrel to a target position, and the second driver IC can generate a drive signal according to the second firmware data to move the second lens barrel to a target position.

[0021] In another general aspect, a camera module includes: a first driver integrated circuit (IC) including a non-volatile memory that stores first firmware data and second firmware data, the first driver IC generating a drive signal according to the first firmware data to move a first lens barrel to a target position; and a second driver IC including a volatile memory that stores the second firmware data sent from the first driver IC, the second driver IC generating a drive signal according to the second firmware data to move a second lens barrel to a target position, wherein each of the first driver IC and the second driver IC operates in one of a normal mode and a low power mode, and when the second driver IC operates in the low power mode, the volatile memory holds the stored second firmware data.

[0022] When the second driver IC operates in the low power mode, power can be supplied to the volatile memory.

[0023] When the second driver IC operates in the low power mode, the power supply to components of the second driver IC other than the volatile memory can be cut off.

[0024] The non-volatile memory may include one or more of flash memory and electrically erasable programmable read-only memory (EEPROM).

[0025] The volatile memory may include static random access memory (SRAM).

[0026] The camera module may further include a gyro sensor that generates shake data. Wherein, the first driver IC may generate a driving signal to move the first lens barrel in one or more directions perpendicular to the optical axis direction in response to the shake data provided by the gyro sensor. Wherein, the second driver IC may generate a driving signal to move the second lens barrel in one or more directions perpendicular to the optical axis direction in response to the shake data provided by the gyro sensor. And wherein, when the first driver IC operates in the low power mode, it may determine whether to enable the communication path of the shake data in the first driver IC in response to the mode of the second driver IC.

[0027] The communication path of the shake data in the first driver IC may be formed between a first communication port of the first driver IC connected to the gyro sensor and a second communication port of the first driver IC connected to the second driver IC.

[0028] Other features and aspects will be apparent from the following detailed description, drawings, and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a perspective view of a camera module according to one or more examples of the present disclosure.

[0030] Figure 2 is a block diagram of a camera module according to one or more examples of the present disclosure.

[0031] Figure 3 is a block diagram of an actuator according to one or more examples of the present disclosure.

[0032] Figure 4 is a block diagram of a first driver integrated circuit (IC), a second driver IC, and a gyro sensor provided to illustrate a method of transmitting shake data according to one or more examples of the present disclosure.

[0033] Figure 5 is a block diagram of a first driver IC and a second driver IC provided to illustrate a method of transmitting firmware data according to one or more examples of the present disclosure.

[0034] In all the drawings and the detailed description, the same reference numerals indicate the same elements. The drawings may not be drawn to scale, and for clarity, illustration, and convenience, the relative dimensions, proportions, and depictions of the elements in the drawings may be exaggerated. DETAILED DESCRIPTION

[0035] Hereinafter, although examples of the present disclosure will be described in detail with reference to the drawings, it should be noted that the examples are not limited thereto.

[0036] The following specific embodiments are provided to assist the reader in obtaining a comprehensive understanding of the methods, apparatuses, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatuses, and / or systems described herein will be apparent after understanding the present disclosure. For example, the order of operations described herein is merely exemplary and is not limited to the order set forth herein, but rather, changes that will be apparent after understanding the present disclosure may be made, except for operations that must occur in a specific order. Additionally, descriptions of features known in the art may be omitted for increased clarity and conciseness.

[0037] The features described herein may be implemented in different forms and will not be construed as limited to the examples described herein. Rather, the examples described herein are provided only to illustrate some of the various feasible ways of implementing the methods, apparatuses, and / or systems described herein that will be apparent after understanding the present disclosure.

[0038] Throughout the specification, when an element such as a layer, region, or substrate is described as being "on" another element, "connected to" another element, or "coupled to" another element, the element may be directly "on" the other element, directly "connected to" the other element, or directly "coupled to" the other element, or there may be one or more other elements intervening therebetween. In contrast, when an element is described as being "directly on" another element, "directly connected to" another element, or "directly coupled to" another element, there may be no other elements intervening therebetween. As used herein, a "portion" of an element may include the entire element or less than the entire element.

[0039] As used herein, the term "and / or" includes any one and any combination of any two or more of the associated listed items, and likewise, "at least one of..." includes any one and any combination of any two or more of the associated listed items.

[0040] Although terms such as "first," "second," and "third" may be used herein to describe various components, elements, regions, layers, or portions, these components, elements, regions, layers, or portions should not be limited by these terms. Rather, these terms are only used to distinguish one component, element, region, layer, or portion from another. Thus, a first component, first element, first region, first layer, or first portion as referred to in the examples described herein may also be referred to as a second component, second element, second region, second layer, or second portion without departing from the teachings of the examples.

[0041] For ease of description, spatially relative terms such as "above", "upper", "below", "lower", etc. may be used herein to describe the relationship of one element to another as shown in the drawings. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. For example, if the device in the drawings is flipped, an element described as "above" or "upper" relative to another element will then be "below" or "lower" relative to the other element. Thus, the term "above" includes both the above and below orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatially relative terms used herein will be interpreted accordingly.

[0042] The terms used herein are for the purpose of describing particular examples only and are not intended to limit the disclosure. Unless the context clearly dictates otherwise, the singular forms are also intended to include the plural forms. The terms "comprises", "comprising", and "having" list the presence of the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0043] The features of the examples described herein can be combined in various ways that will be apparent after understanding the disclosure. In addition, while the examples described herein have various configurations, other configurations that will be apparent after understanding the disclosure are also possible.

[0044] Here, it should be noted that the use of the term "may" with respect to an example (e.g., what an example may include or implement) means that there is at least one example that includes or implements such a feature, and not all examples are limited thereto.

[0045] One aspect of the present disclosure is to provide a camera module that shares a memory for storing firmware data and a gyro sensor for providing jitter data to different driver ICs.

[0046] Figure 1 is a perspective view of a camera module according to one or more examples of the present disclosure.

[0047] Referring to Figure 1 , a camera module 1 according to an example of the present disclosure includes a first camera module 10a and a second camera module 10b. The first camera module 10a includes: a first lens barrel 100a; a first housing 200a that houses the first lens barrel 100a; and a first outer case 300a that is coupled to the first housing 200a. The second camera module 10b includes: a second lens barrel 100b; a second housing 200b that houses the second lens barrel 100b; and a second outer case 300b that is coupled to the second housing 200b.

[0048] The first camera module 10a and the second camera module 10b can be mounted on a printed circuit board, or can be mounted on different printed circuit boards according to the examples described herein.

[0049] Since the configurations of the first camera module 10a and the second camera module 10b are similar, the first camera module 10a will be mainly described, and redundant descriptions applicable to the second camera module 10b can be omitted.

[0050] The first lens barrel 100a can be formed in a hollow cylindrical shape, and a plurality of lenses for photographing a subject can be accommodated therein, and the plurality of lenses can be mounted on the first lens barrel 100a in the optical axis direction. According to the design of the first lens barrel 100a, as many lenses as needed can be provided, and each lens can have optical characteristics such as the same or different refractive indices.

[0051] The first camera module 10a may further include an image sensor for converting the light incident through the first lens barrel 100a into an electrical signal. The image sensor can be disposed below the first housing 200a. The image sensor can convert the light incident through the first lens barrel 100a into an electrical signal. The image sensor can include a charge-coupled device (CCD), a complementary metal oxide semiconductor (CMOS), etc. and combinations thereof. The electrical signal converted by the image sensor can be output as an image through a display unit of the electronic device. The image sensor can be fixed to the printed circuit board and can be electrically connected to the printed circuit board through wire bonding.

[0052] An infrared light filter can be disposed above the image sensor. The infrared light filter can block the light in the infrared range among the light incident through the first lens barrel 100a.

[0053] The first camera module 10a may include a first actuator for driving the first lens barrel 100a in two directions, the optical axis direction and a direction perpendicular to the optical axis direction. The first actuator can include an autofocus (AF) actuator for adjusting the focal length and an optical image stabilization (OIS) actuator for correcting shake.

[0054] For example, the AF actuator can adjust the focal length by moving the first lens barrel 100a in the optical axis direction (Z-axis direction), and the OIS actuator can correct the shake during shooting by moving the first lens barrel 100a in two directions perpendicular to the optical axis direction (X-axis direction and Y-axis direction).

[0055] The first housing 200a may be formed to have an open upper portion and a lower portion, and the first lens barrel 100a and the first actuator may be accommodated in the inner space of the first housing 200a. The first outer case 300a may be coupled to the first housing 200a to surround the upper portion of the first housing 200a and may protect the internal components of the first camera module 10a. Additionally, the first outer case 300a may shield electromagnetic waves so that the electromagnetic waves generated by the camera module do not affect other electronic components in the electronic device. Additionally, the first outer case 300a may shield electromagnetic waves so that the electromagnetic waves generated by other electronic components do not affect the camera module.

[0056] Figure 2 is a block diagram of a camera module according to one or more examples of the present disclosure.

[0057] Referring to Figure 2 , the camera module 1 according to an example of the present disclosure may include a first camera module 10a and a second camera module 10b. The first camera module 10a includes a first lens barrel 100a and a first actuator 400a for driving the first lens barrel 100a in the optical axis direction and a direction perpendicular to the optical axis. The second camera module 10b includes a second lens barrel 100b and a second actuator 400b for driving the second lens barrel 100b in the optical axis direction and a direction perpendicular to the optical axis. The first actuator 400a may include a first driver integrated circuit (IC) 401a, and the second actuator 400b may include a second driver IC 401b.

[0058] Figure 3 is a block diagram of an actuator according to one or more examples of the present disclosure. Hereinafter, a driving method of an actuator according to one or more examples of the present disclosure will be described in detail with reference to Figures 1 to 3 .

[0059] According to Figure 3 an example of, the actuator 400 may correspond to Figure 2 either the first actuator 400a or the second actuator 400b shown in

[0060] Referring to Figure 3 , the actuator 400 according to an example of the present disclosure includes an AF actuator 410 and an OIS actuator 420.

[0061] The AF actuator 410 includes an AF driver IC 411, an AF coil 412, an AF magnet 413, and an AF position sensor 414, and the OIS actuator 420 includes an OIS driver IC 421, an OIS coil 422, an OIS magnet 423, and an OIS position sensor 424.

[0062] The driver IC 401 may include an AF driver IC 411 for the AF actuator 410 and an OIS driver IC 421 for the OIS actuator 420, and the driver IC 401 may correspond to Figure 2 either the first driver IC 401a or the second driver IC 401b shown in

[0063] The AF driver IC 411 may generate a drive signal Sdr based on an input signal Sin and a feedback signal Sf, and may provide the generated drive signal Sdr to the AF coil 412. For example, the input signal Sin may be set inside an electronic device adopting a camera module, and may be provided by a host that controls the overall operation of the electronic device. The input signal Sin provided to the AF driver IC 411 may include information about a target position in the optical axis direction of the lens barrel.

[0064] The feedback signal Sf may be provided by an AF position sensor 414 that detects the current position of the lens barrel in the optical axis direction. For example, the AF position sensor 414 may include a Hall element. The AF position sensor 414 may detect the current position of the lens barrel through the current position of the AF magnet 413.

[0065] The AF driver IC 411 may be driven in a closed-loop manner that compares the input signal Sin with the feedback signal Sf. The closed-loop AF driver IC 411 may be driven in a direction to reduce the error between the target position included in the input signal Sin and the current position detected in the feedback signal Sf. Driving in a closed-loop manner may be advantageous compared to an open-loop system because linearity, accuracy, and repeatability can be improved.

[0066] The AF driver IC 411 may include an H-bridge circuit that can be driven in two directions, thereby providing the drive signal Sdr to the AF coil 412 in a voice coil motor manner. The drive signal Sdr may be provided to the AF coil 412 in the form of current or voltage.

[0067] When the drive signal Sdr is applied to the AF coil 412, the lens barrel may move in the optical axis direction due to the electromagnetic influence between the AF magnet 413 and the AF coil 412. For example, the AF magnet 413 may be mounted on one side of the lens barrel, and the AF coil 412 may be mounted on the housing to face the AF magnet 413. However, according to an example, the positions of the AF magnet 413 and the AF coil 412 may be interchanged.

[0068] The OIS driver IC 421 may generate a drive signal Sdr based on the input signal Sin, a gyro signal Sgy, and the feedback signal Sf, and may provide the generated drive signal Sdr to the OIS coil 422.

[0069] For example, the input signal Sin can be set inside an electronic device employing a camera module and can be provided by a host that controls the overall operation of the electronic device. The input signal Sin provided to the OIS driver IC 421 can include information about a target position in a direction perpendicular to the optical axis of the lens barrel.

[0070] The gyro signal Sgy can be set in the camera module and can be provided by a gyro sensor that detects jitter of the camera module or the electronic device. For example, the gyro signal Sgy can include jitter data. For example, the gyro data can include acceleration data and angular velocity data detected from the jitter of the camera module or the electronic device.

[0071] The feedback signal Sf can be provided by the OIS position sensor 424, which detects a current position in a direction perpendicular to the optical axis of the lens barrel. For example, the OIS position sensor 424 can include a Hall element. The OIS position sensor 424 can detect the current position of the lens barrel through the current position of the OIS magnet 423.

[0072] The OIS driver IC 421 can be driven in a closed-loop type that compares the input signal Sin, the gyro signal Sgy, and the feedback signal Sf. The closed-loop type OIS driver IC 421 can be driven in a direction to reduce the error between the target position included in the input signal Sin, the jitter information included in the gyro signal Sgy, and the current position detected in the feedback signal Sf. Driving in a closed-loop type can be advantageous compared to an open-loop system because linearity, accuracy, and repeatability can be improved.

[0073] The OIS driver IC 421 can include an H-bridge circuit capable of driving in two directions, thereby providing a drive signal Sdr to the OIS coil 422 in a voice coil motor manner. The drive signal Sdr can be provided to the OIS coil 422 in the form of current or voltage.

[0074] When the drive signal Sdr is applied to the OIS coil 422, the lens barrel can move in a direction perpendicular to the optical axis due to the electromagnetic influence between the OIS magnet 423 and the OIS coil 422. For example, two OIS magnets 423 are provided, one OIS magnet is mounted on the lens barrel in a first direction perpendicular to the optical axis, and the other OIS magnet is mounted on the lens barrel in a second direction perpendicular to the optical axis. Additionally, two OIS coils 422 can be provided to face the corresponding OIS magnets 423 respectively. However, in some examples, the positions of the OIS magnet 423 and the OIS coil 422 can be changed. For example, one or more OIS coils 422 can be provided on the lens barrel, and one or more OIS magnets 423 can be provided to face the corresponding OIS coils 422 respectively.

[0075] For stable driving of the first actuator 400a and the second actuator 400b of the camera module 1, two memories for storing firmware data of each of the first driver IC 401a and the second driver IC 401b are required, and two gyro sensors for providing jitter data to each of the first driver IC 401a and the second driver IC 401b may be required.

[0076] However, in order to reduce the manufacturing cost and size of the camera module or the electronic device, it is necessary to limit the number of memories for storing firmware data and the number of gyro sensors for providing jitter data.

[0077] Figure 4 FIG. is a block diagram of a first driver IC, a second driver IC, and a gyro sensor for providing a method of transmitting jitter data according to one or more examples of the present disclosure.

[0078] Although not shown in Figure 4 each of the first driver IC 401a and the second driver IC 401b may include a microcontroller unit (MCU). It is understood that the operations of the first driver IC 401a and the second driver IC 401b to be described later are performed by the microcontroller units (MCUs) provided in each of the first driver IC 401a and the second driver IC 401b.

[0079] Referring to Figure 4 , the first driver IC 401a is connected to the gyro sensor 20, and the first driver IC 401a is connected to the second driver IC 401b. The gyro sensor 20 corresponds to a component of the camera module or the electronic device.

[0080] The jitter data generated by the gyro sensor 20 may be transmitted to the first driver IC 401a, and the second driver IC 401b may receive the jitter data generated by the gyro sensor 20 through the first driver IC 401a. Each of the first driver IC 401a and the second driver IC 401b may perform an OIS operation using the jitter data.

[0081] Each of the gyro sensor 20 and the first driver IC 401a may be provided with a communication port and may be connected by a communication line. In addition, each of the first driver IC 401a and the second driver IC 401b may be provided with a communication port and may be connected by a communication line. The communication port among the communication ports of the first driver IC 401a connected to the gyro sensor 20 may be referred to as a first communication port, and the communication port connected to the second driver IC 401b may be referred to as a second communication port.

[0082] The gyro sensor 20 and the first driver IC 401a can be connected through a Serial Peripheral Interface (SPI) communication line to perform SPI communication.

[0083] In the communication of jitter data between the gyro sensor 20 and the first driver IC 401a, the first driver IC 401a operates as a host in the SPI communication, and the gyro sensor 20 operates as a slave in the SPI communication. The first communication port of the first driver IC 401a includes a master port M, and the communication port of the gyro sensor 20 includes a slave port S.

[0084] In Figure 4 it, the master port M and the slave port S are schematically shown, but the master port M and the slave port S may include a Master In Slave Out (MISO) pin, a Master Out Slave In (MOSI) pin, a Serial Clock (SCLK) pin, and a Slave Select (SS) pin.

[0085] In the SPI communication, the operation of transmitting specific data of the slave in the SPI communication to the host in the SPI communication can be understood as an operation of reading specific data from the slave in the SPI communication.

[0086] The first driver IC 401a and the second driver IC 401b can be connected through a Serial Peripheral Interface (SPI) communication line to perform SPI communication.

[0087] In the communication of jitter data between the first driver IC 401a and the second driver IC 401b, the second driver IC 401b operates as a host in the SPI communication, and the first driver IC 401a operates as a slave in the SPI communication. The communication port of the second driver IC 401b includes a master port M, and the second communication port of the first driver IC 401a includes a slave port S. The master port M and the slave port S of the first driver IC can be electrically connected inside the first driver IC 401a to form a communication path for jitter data in the first driver IC 401a.

[0088] According to an example of the present disclosure, the second driver IC 401b can perform an OIS operation by using the jitter data transmitted from the gyro sensor 20 through the first driver IC 401a, thereby reducing the number of gyro sensors.

[0089] When it is necessary to perform a low-specification camera function or to reduce power consumption, one of the first camera module 10a and the second camera module 10b can operate in the normal mode, and the other camera module can operate in the low-power mode. Therefore, each of the first driver IC 401a and the second driver IC 401b can operate in one of the normal mode and the low-power mode. Here, the normal mode can be understood as a mode in which sufficient power is supplied to drive the driver IC, and the low-power mode can be understood as a mode in which power is cut off or the minimum power is supplied to limit the driving of the driver IC. The driver IC operating in the normal mode or the low-power mode can change the mode through an interrupt signal provided by the host.

[0090] However, as described above, in the low-power mode operation of the first driver IC 401a, when the second driver IC 401b receives jitter data from the gyro sensor 20 through the first driver IC 401a, the second driver IC 401b may not receive the jitter data when the power supplied to the first driver IC 401a is cut off.

[0091] According to an example of the present disclosure, when the first driver IC 401a operates in the low-power mode, whether to enable the communication path of the jitter data in the first driver IC 401a can be determined according to the mode of the second driver IC 401b. Here, the communication path of the jitter data in the first driver IC 401a can be formed between the main port M and the slave port S of the first driver IC 401a.

[0092] When the first driver IC 401a operates in the low-power mode and the second driver IC 401b operates in the normal mode, the communication path of the jitter data in the first driver IC 401a can be enabled. For example, power can be supplied to the main port M and the slave port S of the first driver IC 401a so that the communication path of the jitter data in the first driver IC 401a can be enabled. In this case, except for the main port M and the slave port S of the first driver IC 401a, the power to the remaining components of the first driver IC 401a (for example, to the microcontroller unit (MCU) of the first driver IC 401a) can be cut off.

[0093] When the first driver IC 401a operates in the low-power mode and the second driver IC 401b operates in the low-power mode, the communication path of the jitter data in the first driver IC 401a can be deactivated. For example, the power supply to the main port M and the slave port S of the first driver IC 401a can be cut off, so that the communication path of the jitter data in the first driver IC 401a can be deactivated. In this case, the power supply to the remaining components of the first driver IC 401a other than the main port M and the slave port S (for example, to the microcontroller unit (MCU) of the first driver IC 401a) can be cut off.

[0094] Figure 5 is a block diagram of a first driver IC and a second driver IC provided to illustrate a method of transmitting firmware data according to one or more examples of the present disclosure.

[0095] Referring to Figure 5 , each of the first driver IC 401a and the second driver IC 401b can be provided with a communication port and can be connected through a communication line.

[0096] For example, the first driver IC 401a and the second driver IC 401b can be connected through a serial peripheral interface bus (SPI) communication line to perform SPI communication.

[0097] In the communication of the firmware data of the first driver IC 401a and the second driver IC 401b, the second driver IC 401b operates as a host in the SPI communication, and the first driver IC 401a operates as a slave in the SPI communication. The communication port of the second driver IC 401b includes a main port M, and the communication port of the first driver IC 401a includes a slave port S.

[0098] The first driver IC 401a includes a non-volatile memory IM1 that stores firmware data. The firmware data stored in the non-volatile memory IM1 can include first firmware data for driving the first driver IC 401a and second firmware data for driving the second driver IC 401b. For example, each of the first firmware data and the second firmware data can include data for autofocus (AF) adjustment and optical image stabilization (OIS).

[0099] For example, the non-volatile memory IM1 of the first driver IC 401a can include one or more of a flash memory and an electrically erasable programmable read-only memory (EEPROM). Since the non-volatile memory IM1 of the first driver IC 401a is implemented as a flash memory, the firmware data stored in the flash memory can be retained even when power is not supplied to the first driver IC 401a.

[0100] The second driver IC 401b may include a volatile memory IM2. Second firmware data stored in the non-volatile memory IM1 of the first driver IC 401a may be transferred to the second driver IC 401b and stored in the volatile memory IM2. For example, the second driver IC 401b may read the second firmware data stored in the non-volatile memory IM1 of the first driver IC 401a at the start point of driving and store the second firmware data in the volatile memory IM2. Here, the start point of driving of the second driver IC 401b may be understood as the time when power is supplied to the camera module 1.

[0101] For example, the volatile memory IM2 of the second driver IC 401b may include a static random access memory (SRAM). The volatile memory IM2 of the second driver IC 401b may be implemented as an SRAM so that the size of the memory can be reduced, and the volatile memory IM2 can operate at high speed so that the second driver IC 401b can be driven quickly.

[0102] In the communication of the firmware data between the first driver IC 401a and the second driver IC 401b, it is shown that the first driver IC 401a and the second driver IC 401b are connected through a serial peripheral interface bus (SPI) communication line. However, according to an example, the first driver IC 401a and the second driver IC 401b may be connected through an internal integrated circuit (I2C) line to perform internal integrated circuit (I2C) communication.

[0103] According to an example of the present disclosure, the first driver IC 401a may include a non-volatile memory, and the second driver IC 401b may include a volatile memory, thereby reducing the number of expensive non-volatile memories and reducing its manufacturing cost.

[0104] When it is necessary to perform a low-specification camera function or reduce power consumption, one of the first camera module 10a and the second camera module 10b may operate in a normal mode, and the other camera module of the first camera module 10a and the second camera module 10b may operate in a low-power mode. Therefore, each of the first driver IC 401a and the second driver IC 401b may operate in one of a normal mode and a low-power mode. Here, the normal mode may be understood as a mode in which sufficient power is supplied for driving the driver IC, and the low-power mode may be understood as a mode in which the power supply is cut off or the minimum power is supplied to limit the driving of the driver IC. The driver IC operating in the normal mode or the low-power mode may change the mode through an interrupt signal provided by the host.

[0105] However, when the second driver IC 401b operates in the low power mode, if the power supply to the second driver IC 401b is cut off, there is a problem that it may take too much time for driving because the second firmware data must be received again when the second driver IC 401b enters the normal mode again.

[0106] According to an example of the present disclosure, when the second driver IC 401b operates in the low power mode, power can be supplied to the volatile memory IM2 of the second driver IC 401b so that the second firmware data stored in the volatile memory IM2 can be retained. On the other hand, the power supply to components other than the volatile memory IM2 of the second driver IC 401b (e.g., to the main port M of the second driver IC 401b and the microcontroller unit (MCU) of the second driver IC 401b) can be cut off.

[0107] Therefore, even when the second driver IC 401b operates in the low power mode, when the second driver IC 401b enters the normal mode again, since it is not necessary to receive the second firmware data again, the time required for driving can be reduced.

[0108] As described above, according to the camera module according to various examples of the present disclosure, different driver ICs can share the gyro sensor for providing jitter data and the memory for storing firmware data, thereby reducing the manufacturing cost of the camera module and reducing the size of the camera module.

[0109] Although specific examples have been shown and described above, it will be apparent after understanding the present disclosure that various changes in form and details can be made in these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are only considered in a descriptive sense and not for the purpose of limitation. The description of a feature or aspect in each example will be considered applicable to similar features or aspects in other examples. Suitable results can be obtained if the described techniques are performed in a different order, and / or if the components in the described system, architecture, device, or circuit are combined in a different manner, and / or if the components in the described system, architecture, device, or circuit are replaced or supplemented by other components or their equivalents. Therefore, the scope of the present disclosure is not defined by the specific embodiments, but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents will be construed as being included in the present disclosure.

Claims

1. A camera module, comprising: a gyro sensor that generates shake data; a first driver integrated circuit that generates a drive signal to move a first lens barrel in one or more directions perpendicular to the optical axis direction in response to the shake data provided by the gyro sensor; and a second driver integrated circuit that generates a drive signal to move a second lens barrel in one or more directions perpendicular to the optical axis direction in response to the shake data provided by the gyro sensor, wherein each of the first driver integrated circuit and the second driver integrated circuit operates in one of a normal mode and a low power mode, and wherein when the first driver integrated circuit operates in the low power mode, a communication path of the shake data in the first driver integrated circuit is enabled in response to the second driver integrated circuit operating in the normal mode, and the communication path of the shake data in the first driver integrated circuit is deactivated in response to the second driver integrated circuit operating in the low power mode.

2. The camera module according to claim 1, wherein, The communication path of the shake data in the first driver integrated circuit is formed between a first communication port of the first driver integrated circuit connected to the gyro sensor and a second communication port of the first driver integrated circuit connected to the second driver integrated circuit.

3. The camera module according to claim 2, wherein, When the communication path of the shake data in the first driver integrated circuit is enabled, power is supplied to the first communication port and the second communication port.

4. The camera module according to claim 2, wherein, When the communication path of the shake data in the first driver integrated circuit is deactivated, the power supply to the first communication port and the second communication port is cut off.

5. The camera module according to claim 2, wherein, The gyro sensor and the first driver integrated circuit perform serial peripheral interface bus communication.

6. The camera module according to claim 5, wherein, The first communication port of the first driver integrated circuit includes a master port in the serial peripheral interface bus communication.

7. The camera module according to claim 2, wherein, The first driver integrated circuit and the second driver integrated circuit perform serial peripheral interface bus communication.

8. The camera module according to claim 7, wherein, The second communication port of the first driver integrated circuit includes a slave port in the serial peripheral interface bus communication.

9. The camera module according to claim 1, wherein, The first driver integrated circuit includes a non-volatile memory that stores first firmware data and second firmware data, wherein the second driver integrated circuit includes a volatile memory that stores the second firmware data transmitted from the first driver integrated circuit, and wherein when the second driver integrated circuit operates in the low power mode, the volatile memory holds the stored second firmware data.

10. The camera module according to claim 9, wherein, The first driver integrated circuit generates a drive signal according to the first firmware data to move the first lens barrel to a target position, and wherein the second driver integrated circuit generates a drive signal according to the second firmware data to move the second lens barrel to a target position.

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