A high frequency relay

Abstract

The application discloses a high-frequency relay, which comprises an armature assembly, a moving spring assembly and upper and lower grounding shielding sheets; the upper and lower grounding shielding sheets are arranged in parallel, the armature assembly is arranged in a cantilever type structure and outside a space surrounded by the upper and lower grounding shielding sheets, and moving spring sheets in the moving spring assembly are arranged in parallel between the upper and lower grounding shielding sheets; at least one end of the armature assembly is provided with a compression spring and matched with the moving spring sheets, the moving spring sheets are provided with a rebound mechanism, and the moving spring sheets move in a straight mode between the upper and lower grounding shielding sheets when the armature assembly moves in a cantilever type mode, so that moving contacts arranged at two ends of the moving spring sheets are attracted to or separated from static contacts at corresponding positions. The application can reduce distortion and scattering in a high-frequency signal transmission process, realize excellent high-frequency characteristics, and simplify a product structure.

Description

Technical Field

[0001] This invention relates to the field of relay technology, and in particular to a high-frequency relay. Background Technology

[0002] A high-frequency relay is a type of relay used to switch high-frequency circuits. In traditional high-frequency relays, the contact system (moving and stationary contacts) typically employs a seesaw structure. One existing high-frequency relay includes a magnetic circuit, a base, and a moving spring. The base includes a base and a stationary spring integrated into the base via injection molding. The stationary spring includes a stationary spring plate and contact points for contacting the moving spring. The moving spring is usually mounted together with an armature to form a seesaw-like integrated component. The base also includes an upper grounding shield and a lower grounding shield, with the moving spring plate moving between the upper and lower grounding shields. In this existing seesaw-like structure, the moving spring plate tilts as it moves between the upper and lower grounding shields, leading to increased capacitance and decreased impedance, resulting in signal transmission distortion. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a high-frequency relay that enables the moving spring in the contact system to remain parallel to the upper and lower grounding shields during operation, thereby reducing distortion and scattering in the high-frequency signal transmission process, achieving excellent high-frequency characteristics, and simplifying the product structure.

[0004] The technical solution adopted by this invention to solve its technical problem is as follows: a high-frequency relay, including an armature assembly, a moving spring assembly for realizing high-frequency signal transmission, and upper and lower grounding shields for realizing signal shielding; the upper and lower grounding shields are arranged in parallel, the armature assembly is configured as a seesaw structure and is arranged outside the space enclosed by the upper and lower grounding shields, and the moving spring in the moving spring assembly is arranged in parallel between the upper and lower grounding shields; at least one end of the armature assembly is provided with a compression spring and cooperates with the moving spring, and the moving spring is provided with a return mechanism. Through the cooperation of the compression spring and the return mechanism, when the armature assembly is in a seesaw-like action, the moving spring moves in a linear manner between the upper and lower grounding shields, so that the moving contacts at both ends of the moving spring are attracted or separated from the corresponding stationary contacts.

[0005] The stationary contact protrudes from the lower grounding shield, the spring mechanism is always in contact with the lower grounding shield, and when the contact is disconnected, it pushes the moving spring against the upper grounding shield.

[0006] The spring-loaded mechanism is formed by bending the spring sheet.

[0007] The moving spring assembly includes a first plastic part, the moving spring sheet, the moving contact, and the rebound mechanism; the moving contact is connected to both ends of the moving spring sheet, and the first plastic part connects the moving spring sheet and the rebound mechanism into a single unit by injection molding.

[0008] The upper grounding shield is provided with a first through hole that allows the first plastic part of the moving spring assembly to protrude upward. The armature assembly cooperates with the moving spring assembly above the upper grounding shield. The first plastic part is also provided with a first protrusion for cooperating with the compression spring of the armature assembly.

[0009] The armature assembly includes an armature, a magnet, and a compression spring. The magnet is mounted on top of the armature, and the compression spring is fixed below the armature. A groove is provided on the top of the armature, and the magnet is embedded in the groove and fixed with glue.

[0010] The groove is further provided with at least one small groove for improving the bonding force with the magnet; a second protrusion is provided below the armature, and the armature is fixed to the compression spring by riveting through the second protrusion.

[0011] The armature has a first support portion on each side of its width, and the first support portion is located in the middle of the armature's length; the upper grounding shield has a second support portion that cooperates with the first support portion at a position corresponding to the first support portion of the armature; the second support portion has a groove structure.

[0012] The high-frequency relay also includes a base portion; the base portion includes a stationary spring assembly, a second plastic part, and the lower grounding shield; the second plastic part connects the stationary spring assembly and the lower grounding shield into a single unit by injection molding; the stationary spring assembly includes a stationary spring plate and a stationary contact; the lower grounding shield is connected to the upper surface of the second plastic part, and the upper surface of the second plastic part is also provided with a boss higher than the lower grounding shield, and the upper grounding shield is mounted on the boss.

[0013] The upper surface of the second plastic part is also provided with a wall surrounding the upper grounding shield and the lower grounding shield, and the height of the wall is higher than that of the upper grounding shield.

[0014] The high-frequency relay also includes a coil portion; the coil portion includes a coil frame, a yoke, and coil leads; the yoke is U-shaped and is fitted into the coil frame by injection molding, and the two ends of the armature assembly are respectively fitted into the two ends of the yoke; the second plastic part is provided with a slot, and the coil leads are inserted into the slot of the second plastic part.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] 1. This invention employs a parallel arrangement of the upper and lower grounding shields, with the armature assembly designed as a seesaw structure and positioned outside the space enclosed by the upper and lower grounding shields. The moving spring assembly has its moving spring plate parallel to the upper and lower grounding shields. At least one end of the armature assembly has a compression spring that cooperates with the moving spring plate. The moving spring plate has a return mechanism. Through the cooperation of the compression spring and the return mechanism, when the armature assembly moves in a seesaw-like manner, the moving spring plate moves linearly between the upper and lower grounding shields, causing the moving contacts at both ends of the moving spring plate to attract or separate from the stationary contacts. This structure allows the moving spring plate to move parallel between the upper and lower grounding shields when transmitting high-frequency signals (otherwise, tilting the moving spring plate in the space between the upper and lower grounding shields would increase capacitance and decrease impedance, causing signal distortion). This achieves precise impedance matching with the fixed upper and lower grounding shields, reducing distortion and scattering during high-frequency signal transmission, resulting in excellent high-frequency characteristics, while simplifying the product structure.

[0017] 2. This invention employs a groove on the top of the armature, into which the magnet is embedded and fixed with adhesive. This structure reduces the overall height of the armature after assembly, thereby reducing the overall height of the relay. Furthermore, after assembly, the magnet is essentially embedded in the armature, resulting in lower magnetic resistance and higher magnetic efficiency. It also effectively prevents adhesive from overflowing onto the armature's working surface. The magnet's position after assembly with the armature is limited, preventing movement of the magnet before the adhesive cures, which could render the armature component unusable.

[0018] 3. The present invention incorporates at least one small groove within the groove to enhance the adhesive bonding force between the armature and the magnet. This structure further improves the adhesive bonding force between the armature and the magnet.

[0019] 4. In this invention, the upper surface of the second plastic part is further provided with a boss that is higher than the lower grounding shield, and the upper grounding shield is mounted on the boss. This structure of the present invention is beneficial to improving the flatness of the upper grounding shield after assembly, ensuring the consistency of characteristic impedance, improving the high-frequency signal transmission performance, and at the same time, it is beneficial to the flatness of the armature part and the iron core in the horizontal direction after the coil part is assembled, ensuring the reliability of the relay operation.

[0020] 5. In this invention, the upper surface of the second plastic part is further surrounded by a wall that encircles the upper and lower grounding shields, and the height of the wall is higher than that of the upper grounding shield. This structure of the invention makes the base portion higher than the upper grounding shield, thereby improving the sealing performance of the relay.

[0021] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments; however, the high-frequency relay of the present invention is not limited to the embodiments. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural schematic diagram of Embodiment 1 of the present invention (excluding the outer shell);

[0023] Figure 2 yes Figure 1 Enlarged diagram of point A in the diagram;

[0024] Figure 3 This is a cross-sectional schematic diagram of Embodiment 1 of the present invention (excluding the outer casing);

[0025] Figure 4 This is an exploded three-dimensional structural diagram of Embodiment 1 of the present invention;

[0026] Figure 5 This is a front view (excluding the outer casing) of Embodiment 1 of the present invention;

[0027] Figure 6 yes Figure 5 Enlarged diagram of point B in the image;

[0028] Figure 7 This is a three-dimensional structural diagram of the base portion, the moving spring assembly, and the upper grounding shield in accordance with Embodiment 1 of the present invention.

[0029] Figure 8 This is the main intention of the base portion, the moving spring assembly, and the upper grounding shield in Embodiment 1 of the present invention;

[0030] Figure 9 It is along Figure 8 A cross-sectional view of the CC line in the diagram;

[0031] Figure 10 This is a three-dimensional structural diagram of the base portion and the moving spring assembly in accordance with Embodiment 1 of the present invention;

[0032] Figure 11 yes Figure 10 Enlarged diagram of point D in the diagram;

[0033] Figure 12 This is a three-dimensional structural diagram of the base portion according to Embodiment 1 of the present invention;

[0034] Figure 13 yes Figure 12 Enlarged diagram of point E in the diagram;

[0035] Figure 14 This is a three-dimensional structural diagram of the base portion, the moving spring assembly, and the upper grounding shield plate in accordance with Embodiment 1 of the present invention (excluding the second plastic part);

[0036] Figure 15 yes Figure 14 Enlarged diagram at point F in the diagram;

[0037] Figure 16 This is a three-dimensional structural diagram of the static spring assembly and the lower grounding shield in Embodiment 1 of the present invention.

[0038] Figure 17 This is a three-dimensional structural schematic diagram of the coil portion of Embodiment 1 of the present invention (excluding enameled wire);

[0039] Figure 18 yes Figure 17 Enlarged diagram of point G in the diagram;

[0040] Figure 19 This is a three-dimensional structural diagram of the coil portion and armature assembly in accordance with Embodiment 1 of the present invention;

[0041] Figure 20 This is a three-dimensional structural schematic diagram of the moving spring assembly according to Embodiment 2 of the present invention;

[0042] Figure 21 This is a three-dimensional structural schematic diagram of the moving spring assembly according to Embodiment 3 of the present invention. Detailed Implementation

[0043] Example 1

[0044] See Figures 1 to 19 As shown, a high-frequency relay of the present invention includes an armature assembly 1, a moving spring assembly 2 for realizing high-frequency signal transmission, and upper and lower grounding shields 4 and 32 for signal shielding. The upper grounding shield 4 and the lower grounding shield 32 are arranged in parallel. The armature assembly 1 is configured as a seesaw structure and is located outside the space enclosed by the upper grounding shield 4 and the lower grounding shield 32. The moving spring 21 in the moving spring assembly 2 is arranged in parallel between the upper grounding shield 4 and the lower grounding shield 32. At least one end of the armature assembly 1 is provided with a compression spring 11 and cooperates with the moving spring 21. The moving spring 21 is provided with a return mechanism 24. Through the cooperation of the compression spring 11 and the return mechanism 24, when the armature assembly 1 is in a seesaw-like action, the moving spring 21 moves in a linear manner between the upper grounding shield 4 and the lower grounding shield 32, so that the moving contacts 22 provided at both ends of the moving spring 21 are attracted or separated from the corresponding stationary contacts 312.

[0045] In this embodiment, the stationary contact 312 protrudes from the lower grounding shield 32, the spring mechanism 24 is always in contact with the lower grounding shield 32, and when the contact is disconnected, the moving spring 21 is pushed against the upper grounding shield 4.

[0046] In this embodiment, the spring mechanism 24 is formed by bending the spring sheet.

[0047] In this embodiment, the movable spring assembly 2 includes a first plastic part 23, movable spring plates 21, movable contacts 22, and a return mechanism 24. The movable contacts 22 are connected to both ends of the movable spring plates 21. The first plastic part 23 connects the movable spring plates 21 and the return mechanism 24 into a single integral part by injection molding. Specifically, the movable spring assembly 2 includes two movable spring plates 21 and one return mechanism 24. The return mechanism 24 is located between the two movable spring plates 21, and the movable spring plates 21 and the return mechanism 24 are exposed on both sides in the width direction of the first plastic part 23. The first plastic part 23 is approximately cuboid in shape. The long side of the first plastic part 23 is its length, the short side is its width, and the height is its thickness (vertical direction).

[0048] In this embodiment, the upper grounding shield 4 is provided with a first through hole 41 that allows the first plastic part 23 of the moving spring assembly 2 to protrude upward. The armature assembly 1 cooperates with the moving spring assembly 2 above the upper grounding shield 4. The first plastic part 23 is also provided with a first protrusion 231 for cooperating with the compression spring 11 of the armature assembly 1.

[0049] In this embodiment, the armature assembly 1 includes an armature 12, a magnet 13 and a compression spring 11. The magnet 13 is mounted on the top of the armature 12, and the compression spring 11 is fixed below the armature 12. The top of the armature 12 is provided with a groove 121, and the magnet 13 is embedded in the groove 121 and fixed with glue.

[0050] In this embodiment, the groove 121 is further provided with at least one small groove 1211 for improving the bonding force with the magnet 13. Specifically, the number of small grooves 1211 is two, but not limited to this. The armature 12 is provided with a second protrusion 122 below it, and the armature 12 is fixed to the compression spring 11 by riveting through the second protrusion 122.

[0051] In this embodiment, the armature 12 has a first support portion 123 on each side of its width, and the first support portion 123 is located in the middle of the length of the armature 12; the armature 12 is approximately cuboid in shape, the long side of the armature 12 is the length of the armature 12, the short side of the armature 12 is the width of the armature 12, and the height of the armature 12 is the thickness of the armature 12; the upper grounding shield 4 has a second support portion 42 at the position corresponding to the first support portion 123 of the armature 12, which cooperates with the first support portion 123; the second support portion 42 is a groove structure.

[0052] In this embodiment, the high-frequency relay further includes a base portion 3; the base portion 3 includes a stationary spring assembly 31, a second plastic part 33, and a lower grounding shield 32; the second plastic part 33 connects the stationary spring assembly 31 and the lower grounding shield 32 into a single integral part by injection molding; the stationary spring assembly 31 includes a stationary spring plate 311 and a stationary contact 312; the lower grounding shield 32 is connected to the upper surface of the second plastic part 33, ensuring that the rebound mechanism 24 is always in contact with the lower grounding shield 32, thus avoiding the influence of irregular shapes on high-frequency performance. The upper surface of the second plastic part 33 also has a boss 331 higher than the lower grounding shield 32, and the upper grounding shield 4 is mounted on the boss 331. The upper surface of the second plastic part 33 also exposes welding tabs 36 for welding the upper grounding shield 4 to the lower grounding shield 32. The base 3 is also provided with a glue storage tank 35 formed by a glue separator 34 and a boss 331 to prevent glue from flowing into the contact area. The upper grounding shield 4 rests on the top surface of the glue separator 34.

[0053] In this embodiment, the upper surface of the second plastic part 33 is also provided with a wall 332 surrounding the upper grounding shield 4 and the lower grounding shield 32, and the height of the wall 332 is higher than that of the upper grounding shield 4.

[0054] In this embodiment, the signal transmission part (NO terminal 3111, NC terminal 3112, COM terminal 3113) of the static spring assembly 31 is designed to be coplanar with the lower grounding shield 32. By designing the distance between the lower grounding shield 32 and the signal transmission part, impedance matching is achieved between the signal transmission part and the lower grounding shield 32, thereby achieving almost distortion-free transmission of high-frequency signals.

[0055] In this embodiment, the high-frequency relay further includes a coil portion 5; the coil portion 5 includes a coil frame 51, a yoke 52, and a coil lead 53; the yoke 52 is U-shaped and is fitted into the coil frame 51 by injection molding, and the two ends of the armature assembly 1 are respectively fitted into the two ends of the yoke 52; the coil portion 5 also includes enameled wire 55, which is directly wound around a part of the yoke 52 at the position of the iron core; the second plastic part 33 is provided with a slot 333, and the coil lead 53 is inserted into the slot 333 of the second plastic part 33. Specifically, the coil lead 53 is provided with a third protrusion 531, which is pre-positioned with the slot 333 of the second plastic part 33 by interference fit.

[0056] A high-frequency relay of the present invention employs an upper grounding shield 4 and a lower grounding shield 32 arranged in parallel. The armature assembly 1 is configured as a seesaw structure and is located outside the space enclosed by the upper grounding shield 4 and the lower grounding shield 32. The moving spring 21 in the moving spring assembly 2 is arranged in parallel between the upper grounding shield 4 and the lower grounding shield 32. At least one end of the armature assembly 1 is provided with a compression spring 11 that cooperates with the moving spring 21. The moving spring 21 is provided with a return mechanism 24. Through the cooperation of the compression spring 11 and the return mechanism 24, when the armature assembly 1 is in a seesaw-like action, the moving spring 21 moves in a linear manner between the upper grounding shield 4 and the lower grounding shield 32, so that the moving contacts 22 at both ends of the moving spring 21 are attracted or separated from the corresponding stationary contacts 312. This structure of the present invention enables the moving spring to move parallel between the upper and lower grounding shields when transmitting high-frequency signals (if the moving spring is tilted in the space between the upper and lower grounding shields, the capacitance will increase and the impedance will decrease, causing the signal transmission process to be distorted). It achieves precise matching of characteristic impedance with the fixed upper and lower grounding shields, reduces distortion and scattering in the high-frequency signal transmission process, achieves excellent high-frequency characteristics, and simplifies the product structure.

[0057] This invention discloses a high-frequency relay in which the armature 12 has a groove 121 on its surface, and the magnet 13 is embedded in the groove 121 and fixed with adhesive. This structure reduces the overall height of the armature portion after assembly, thereby reducing the overall height of the relay. Furthermore, after assembly, the magnet is essentially embedded in the armature, resulting in lower magnetic resistance and higher magnetic efficiency. It also effectively prevents the adhesive between the armature and the magnet from overflowing onto the armature's working surface. The magnet and armature are positioned within a certain range after assembly, preventing movement of the magnet before the adhesive cures, which could lead to the failure of the armature component.

[0058] A high-frequency relay of the present invention incorporates at least one small groove 1211 within the groove 121 to enhance the adhesive bonding force with the magnet 13. This structure of the present invention can further improve the adhesive bonding force between the armature and the magnet.

[0059] A high-frequency relay of the present invention incorporates a boss 331 on the upper surface of the second plastic part 33, which is higher than the lower grounding shield 32, and the upper grounding shield 4 is mounted on the boss 331. This structure of the present invention is beneficial for improving the flatness of the upper grounding shield after assembly, ensuring the consistency of characteristic impedance, improving the high-frequency signal transmission performance, and also beneficial for the flatness of the armature part and the iron core in the horizontal direction after the coil part is assembled, ensuring the reliability of the relay operation.

[0060] A high-frequency relay of the present invention incorporates a surrounding wall 332 around the upper surface of the second plastic part 33, which encircles the upper grounding shield 4 and the lower grounding shield 32. The height of the surrounding wall 332 is higher than that of the upper grounding shield 4. This structure of the present invention makes the perimeter of the base portion higher than the upper grounding shield, thereby improving the sealing performance of the relay.

[0061] Example 2

[0062] See Figure 20 As shown, the high-frequency relay of the present invention differs from that of Embodiment 1 in that the moving spring assembly 2 includes a moving spring 21 and two return mechanisms 24, the moving spring 21 is located between the two return mechanisms 24, and the moving spring 21 and the return mechanisms 24 are exposed to both sides in the width direction of the first plastic part 23.

[0063] Example 3

[0064] See Figure 21 As shown, the high-frequency relay of the present invention differs from that of Embodiment 1 in that the moving spring assembly 2 includes a moving spring 21 and a return mechanism 24. The moving spring 21 and the return mechanism 24 are arranged in a cross shape. The moving spring 21 is exposed on both sides in the width direction of the first plastic part 23, and the return mechanism 24 is exposed on both sides in the length direction of the first plastic part 23.

[0065] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the invention. Any person skilled in the art can make many possible variations and modifications to the technical solutions of the present invention, or modify them into equivalent embodiments, without departing from the scope of the present invention. Therefore, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention, without departing from the content of the present invention, should fall within the protection scope of the present invention.

Claims

1. A high-frequency relay, comprising an armature assembly, a moving spring assembly for transmitting high-frequency signals, and upper and lower grounding shields for signal shielding; characterized in that: The upper and lower grounding shields are arranged in parallel. The armature assembly is configured as a seesaw structure and is located outside the space enclosed by the upper and lower grounding shields. The moving spring in the moving spring assembly is arranged in parallel between the upper and lower grounding shields. At least one end of the armature assembly is provided with a compression spring that cooperates with the moving spring. The moving spring is provided with a return mechanism. Through the cooperation of the compression spring and the return mechanism, when the armature assembly is in a seesaw-like action, the moving spring moves between the upper and lower grounding shields in a linear manner, so that the moving contacts at both ends of the moving spring are attracted or separated from the corresponding stationary contacts. The rebound mechanism is always in contact with the lower grounding shield, and when the contact is broken, it pushes the moving spring against the upper grounding shield. It also includes a base portion, which includes a second plastic part; the lower grounding shield is connected to the upper surface of the second plastic part; the upper surface of the second plastic part is also provided with a boss higher than the lower grounding shield, and the upper grounding shield is mounted on the boss.

2. The high-frequency relay according to claim 1, characterized in that: The stationary contact protrudes from the lower grounding shield, and the spring mechanism is always in contact with the lower grounding shield. When the contact is disconnected, the moving spring is pushed against the upper grounding shield. The spring mechanism is formed by bending a spring.

3. The high-frequency relay according to claim 1 or 2, characterized in that: The moving spring assembly includes a first plastic part, the moving spring sheet, the moving contact, and the rebound mechanism; the moving contact is connected to both ends of the moving spring sheet, and the first plastic part connects the moving spring sheet and the rebound mechanism into a single unit by injection molding.

4. The high-frequency relay according to claim 3, characterized in that: The upper grounding shield is provided with a first through hole that allows the first plastic part of the moving spring assembly to protrude upward. The armature assembly cooperates with the moving spring assembly above the upper grounding shield. The first plastic part is also provided with a first protrusion for cooperating with the compression spring of the armature assembly.

5. The high-frequency relay according to claim 1, characterized in that: The armature assembly includes an armature, a magnet, and a compression spring. The magnet is mounted on top of the armature, and the compression spring is fixed below the armature. A groove is provided on the top of the armature, and the magnet is embedded in the groove and fixed with glue.

6. The high-frequency relay according to claim 5, characterized in that: The groove is further provided with at least one small groove for improving the bonding force with the magnet; a second protrusion is provided below the armature, and the armature is fixed to the compression spring by riveting through the second protrusion.

7. The high-frequency relay according to claim 6, characterized in that: The armature has a first support portion on each side of its width, and the first support portion is located in the middle of the armature's length; the upper grounding shield has a second support portion that cooperates with the first support portion at a position corresponding to the first support portion of the armature; the second support portion has a groove structure.

8. The high-frequency relay according to claim 1, characterized in that: The base portion also includes a stationary spring assembly; the second plastic part connects the stationary spring assembly and the lower grounding shield into a single unit by injection molding; the stationary spring assembly includes a stationary spring sheet and a stationary contact; the signal transmission portion of the stationary spring assembly is coplanar with the lower grounding shield.

9. The high-frequency relay according to claim 8, characterized in that: The upper surface of the second plastic part is also provided with a wall surrounding the upper grounding shield and the lower grounding shield, and the height of the wall is higher than that of the upper grounding shield.

10. The high-frequency relay according to claim 8, characterized in that: The high-frequency relay also includes a coil portion; the coil portion includes a coil frame, a yoke, and coil leads; the yoke is U-shaped and is fitted into the coil frame by injection molding, and the two ends of the armature assembly are respectively fitted into the two ends of the yoke; the second plastic part is provided with a slot, and the coil leads are inserted into the slot of the second plastic part.

Images