Antenna module and method for manufacturing an antenna module

Abstract

An antenna module and a method for manufacturing an antenna module are provided. The antenna module includes a first dielectric substrate, a first antenna, and a second antenna. The first dielectric substrate has a top surface, a bottom surface, and a first side surface between the top surface and the bottom surface. The first antenna is formed on the top surface of the first dielectric substrate. The second antenna is formed on the first side surface of the first dielectric substrate.

Description

Technical Field

[0001] This invention relates to antenna technology, and more particularly to an antenna module and its manufacturing method. Background Technology

[0002] With advancements in wireless communication technology, antenna performance has become increasingly important. For example, to enable 5G communication, antennas must support high-frequency signals, and are expected to support omnidirectional radio communication. To improve communication with high-end smartphone applications, an antenna module with wide coverage and a small size is needed. Summary of the Invention

[0003] The following summary is illustrative only and is not intended to be limiting in any way. That is, it provides an overview to introduce the concepts, key points, benefits, and advantages of the novel and non-obvious techniques described herein. Selected embodiments are further described in the detailed description below. Therefore, the following summary is neither intended to identify the essential features of the claimed subject matter nor to define the scope of the claimed subject matter.

[0004] This invention provides an antenna module including a first dielectric substrate, a first antenna, and a second antenna. The first dielectric substrate has a top surface, a bottom surface, and a first side surface between the top surface and the bottom surface. The first antenna is formed on the top surface of the first dielectric substrate, and the second antenna is formed on the first side surface of the first dielectric substrate.

[0005] In some embodiments, the antenna module further includes a ground layer located in the first dielectric substrate and below the antenna.

[0006] In some embodiments, the antenna module further includes a reflector structure embedded in the first dielectric substrate and electrically connected to the ground layer. The reflector structure extends parallel to the first side surface and is located between the top surface and the bottom surface. The reflector structure includes: through holes located on the ground layer and arranged in a row near the first side surface; and a first conductor covering and electrically connecting the through holes.

[0007] In some embodiments, the first antenna radiates a signal in a first direction, and the second antenna radiates a signal in a second direction different from the first direction.

[0008] In some embodiments, the second antenna operates in a first frequency band and a second frequency band different from the first frequency band, and the second antenna has a first dimension along a first direction and a second dimension along a second direction.

[0009] In some embodiments, the first dimension is equal to half the wavelength corresponding to the center frequency of the first frequency band, and the second dimension is equal to half the wavelength corresponding to the center frequency of the second frequency band.

[0010] In some embodiments, the antenna module further includes: a third antenna formed on the first side surface and located below the second antenna, wherein the second antenna operates in a first frequency band, and the third antenna operates in a second frequency band different from the first frequency band, wherein the second antenna has a first dimension along a first direction, and the third antenna has a second dimension along the first direction, the first dimension being different from the second dimension.

[0011] In some embodiments, the second antenna and the third antenna are arranged along a second direction perpendicular to the top surface.

[0012] In some embodiments, the second antenna and the third antenna are staggered along the first direction parallel to the top surface.

[0013] In some embodiments, the antenna module includes a pair of second antennas, and the antenna module further includes a passive element located in the dielectric substrate, the passive element being (selectively) electrically connected to the pair of second antennas, the passive element and the pair of second antennas forming a first composite antenna, wherein the second antennas operate in a first frequency band, and the first composite antenna operates in a second frequency band different from the first frequency band.

[0014] In some embodiments, the antenna module includes a pair of second antennas, and the antenna module further includes a feed line located within the dielectric substrate and (selectively) electrically connected to adjacent terminals of the pair of second antennas, wherein the feed line and the pair of second antennas together form a second composite antenna, the second antennas operating in a first frequency band, and the second composite antenna operating in a second frequency band different from the first frequency band.

[0015] In some embodiments, the second antenna includes: a pair of conductive structures; and a pair of wires located in the dielectric substrate and respectively close to the top surface and the bottom surface, wherein the pair of wires are (selectively) electrically connected to the conductive structures, and wherein the slots surrounding the pair of wires and the pair of conductive structures form the second antenna.

[0016] In some embodiments, the dielectric substrate further includes a second side surface adjacent to the first side surface, wherein the first side surface is not aligned with the second side surface.

[0017] In some embodiments, the antenna module further includes: a conductive sheet located on the bottom surface of the first dielectric substrate and extending in a direction perpendicular to the bottom surface of the first dielectric substrate, wherein the conductive sheet is electrically connected to the second antenna.

[0018] In some embodiments, the antenna module further includes an electronic component located on the bottom surface of the first dielectric substrate, wherein the electronic component is electrically connected to the first antenna and the second antenna.

[0019] In some embodiments, the antenna module further includes a connector located on the bottom surface of the first dielectric substrate and adjacent to the electronic component, wherein the connector is electrically connected to the electronic component.

[0020] In some embodiments, the antenna module further includes a molding compound that covers the electronic component but not the connector.

[0021] In some embodiments, the first dielectric substrate, the first antenna, the second antenna, the electronic component, the connector, and the molding compound together form an antenna package.

[0022] In some embodiments, the antenna module further includes a second dielectric substrate located between the bottom surface of the first dielectric substrate and the electronic component.

[0023] In some embodiments, the connector overlaps with the second dielectric substrate at different portions of the bottom surface of the first dielectric substrate.

[0024] In some embodiments, the second dielectric substrate is located between the bottom surface of the first dielectric substrate and the connector.

[0025] In some embodiments, the first dielectric substrate, the first antenna, and the second antenna together form an antenna package, and the electronic component, the molding compound, and the second dielectric substrate together form a semiconductor package, wherein the antenna package is mounted on the semiconductor package.

[0026] In some embodiments, the antenna module further includes electronic components embedded in the first dielectric substrate.

[0027] In some embodiments, the first dielectric substrate includes a first dielectric layer and a second dielectric layer located below the first dielectric layer, the first antenna is formed on the top surface of the first dielectric layer, and the electronic component is located between the first dielectric layer and the second dielectric layer.

[0028] In some embodiments, the first dielectric substrate includes a first dielectric layer and a second dielectric layer located below the first dielectric layer, the first antenna is formed on the top surface of the first dielectric layer, and the electronic component is embedded in the second dielectric layer.

[0029] The present invention also provides a method for manufacturing an antenna module, comprising: providing a dielectric substrate having a top surface, a bottom surface, and a side surface located between the top surface and the bottom surface; forming a first antenna on the top surface of the dielectric substrate; forming a conductive layer covering the entire side surface; and removing a portion of the conductive layer to form a second antenna on the side surface of the dielectric substrate.

[0030] In addition, embodiments of the present invention also provide a method for manufacturing an antenna module, comprising: providing a dielectric substrate having a top surface and a bottom surface; forming a first antenna on the top surface of the dielectric substrate; forming a conductive feature in the dielectric substrate extending from the top surface to the bottom surface; and cutting the dielectric substrate along the long axis of the conductive feature in a top view to form a second antenna on a side surface of the cut dielectric substrate, wherein the side surface is located between the top surface and the bottom surface of the cut dielectric substrate.

[0031] In some embodiments, the dielectric substrate has a hole penetrating the dielectric substrate, and forming the conductive feature in the dielectric substrate includes forming a conductive material covering the inner wall of the hole.

[0032] The present invention has been provided by way of example and is not intended to limit the invention. Other embodiments and advantages are described in the following detailed description. These and other objects of the invention will be readily understood by those skilled in the art after reading the following detailed description of the preferred embodiments shown in the accompanying drawings. A detailed description will be given in the following embodiments with reference to the accompanying drawings. Attached Figure Description

[0033] The accompanying drawings (in which the same numerals denote the same components) illustrate embodiments of the present invention. The included drawings are used to provide a further understanding of embodiments of the present disclosure, and are incorporated in and constitute a part of the present disclosure. The drawings illustrate implementations of embodiments of the present disclosure and, together with the description, serve to explain the principles of the embodiments of the present disclosure. It is understood that the drawings are not necessarily drawn to scale, as some components may be shown out of proportion to actual dimensions in order to clearly illustrate the concepts of the embodiments of the present disclosure.

[0034] Figure 1 This is a perspective view of an antenna module according to some embodiments of the present invention.

[0035] Figure 2 According to some embodiments of the present invention Figure 1 The top view of the antenna module shown.

[0036] Figure 3A and Figure 3B According to some embodiments of the present invention Figure 1 The image shows a side view of the antenna module.

[0037] Figures 4 to 10 This is a side view of an antenna module according to some embodiments of the present invention.

[0038] Figure 11 This is a side view of an antenna module according to some embodiments of the present invention.

[0039] Figure 12A , Figure 12B and Figure 12C According to some embodiments of the present invention Figure 11 The antenna module shown is a side view.

[0040] Figure 13 This is a side view of an antenna module according to some embodiments of the present invention.

[0041] Figure 14A , Figure 14B and Figure 14C According to some embodiments of the present invention Figure 13 The antenna module shown is a side view.

[0042] Figure 15A and Figure 15B This is a side view of an antenna module according to some embodiments of the present invention.

[0043] Figures 16 to 25 This is a side view of an antenna module according to some embodiments of the present invention.

[0044] Figure 26 This is a top view of an intermediate stage of a method for manufacturing an antenna module according to some embodiments of the present invention.

[0045] Figure 27 This is a top view of an intermediate stage of a method for manufacturing an antenna module according to some embodiments of the present invention.

[0046] Figure 28 This is a top view of an intermediate stage of a method for manufacturing an antenna module according to some embodiments of the present invention.

[0047] In the following detailed description, numerous specific details are set forth for illustrative purposes so that those skilled in the art can more thoroughly understand the embodiments of the invention. However, it will be apparent that one or more embodiments may be practiced without these specific details, and different embodiments may be combined as needed, and should not be limited to the embodiments illustrated in the accompanying drawings. Detailed Implementation

[0048] The following description illustrates preferred embodiments of the present invention and is intended only to exemplify the technical features of the invention, not to limit the scope of the invention. Throughout this specification and claims, certain terms are used to refer to specific elements. Those skilled in the art should understand that manufacturers may use different names for the same element. Therefore, this specification and claims do not distinguish elements by differences in name, but rather by differences in function. The terms "element," "system," and "device" used in this invention can refer to computer-related entities, where the computer can be hardware, software, or a combination of hardware and software. The terms "comprising" and "including" as used in the following description and claims are open-ended terms and should be interpreted as "comprising, but not limited to...". Furthermore, the term "coupled" refers to an indirect or direct electrical connection. Therefore, if a device is described as coupled to another device, it means that the device can be directly electrically connected to the other device, or indirectly electrically connected to the other device through other devices or connection means.

[0049] Unless otherwise indicated, the corresponding numbers and symbols in the various figures generally refer to the corresponding parts. The figures are drawn to clearly illustrate the relevant parts of the embodiments and are not necessarily drawn to scale.

[0050] The terms "basically" or "roughly" as used in this document mean that, within an acceptable range, a person skilled in the art can solve the technical problem to be solved and basically achieve the desired technical effect. For example, "roughly equal to" means a method that a person skilled in the art can accept with a certain margin of error from "exactly equal to" without affecting the correctness of the result.

[0051] This invention provides an antenna module that integrates a broadside antenna array and an edge-fire antenna array on both the top and side surfaces of the same antenna substrate. This reduces manufacturing costs and increases the antenna's coverage area. It should be noted that existing antenna module structures form the antenna on the top surface of the antenna substrate, rather than on adjacent surfaces of a single substrate. This invention provides a novel antenna module that forms antennas on both the top and adjacent side surfaces of the same antenna substrate.

[0052] Figure 1This is a perspective view of an antenna module 500 (including antenna modules 500A-500N, 500P-500U, and 500W shown in subsequent figures) according to some embodiments of the present invention. Figure 2 yes Figure 1 The image shows a top view of the antenna module 500. According to some embodiments of the present invention, Figure 3A and Figure 3B It is antenna module 500 (including antenna module 500A) along Figure 1 Side views of directions 100 and 110 are shown. To illustrate the reference directions indicated in the figures, direction 100 is defined as the length direction of the dielectric substrate 200, direction 110 is defined as the width direction of the dielectric substrate 200, and direction 120 is defined as the height direction of the dielectric substrate 200. Direction 100 is substantially perpendicular to directions 110 and 120. Direction 110 is substantially perpendicular to directions 100 and 120. Direction 120 is substantially perpendicular to directions 100 and 110.

[0053] like Figure 1 As shown, the antenna module 500 includes a dielectric substrate 200, at least one antenna 220, at least one antenna 230, a grounding layer 210, and a reflector wall structure 216. The antenna module 500 may optionally include an electronic module 250 and a connector 252.

[0054] The dielectric substrate 200 has a top surface 200T, a bottom surface 200B, and opposing side surfaces 200S adjacent to and located between the top surface 200T and the bottom surface 200B. The dielectric substrate 200 may be a single-layer or multi-layer structure. In some embodiments, the dielectric substrate 200 includes a stack of dielectric layers 202 formed of the same or different materials and having the same or different thicknesses. In some embodiments, the dielectric layers 202 are made of materials including FR4, FR5, BT, ceramic, glass, molding compound, or liquid crystal polymer. In some embodiments, the dielectric substrate 200 includes electrical routings (not shown) for electrical connections, which consist of conductive layers and vias (not shown) formed in the dielectric substrate 200.

[0055] Antenna 220 is formed on the top surface 200T of dielectric substrate 200, and can also be considered as top antennas 220. In some embodiments, antennas 220 are separated from each other and arranged in a row (or an array of 1×m, where m is an integer equal to or greater than 1) along direction 100 (the length direction 100 of dielectric substrate 200), but the invention is not limited thereto; for example, they can also be arranged in an array of L×m, where L and m are integers equal to or greater than 1, for example, L = 2. Antenna 220 covers a portion of the top surface 200T of dielectric substrate 200. Furthermore, antenna 220 is spaced apart from the edge 200TE of the top surface 200T of dielectric substrate 200. In some embodiments, antenna 220 are broadside antennas, including patch antennas, meaning that antenna 220 radiates signals along direction 120.

[0056] Antenna 230 is formed on the side surface 200S of dielectric substrate 200 and can also be considered as sidewall antennas 230. In some embodiments, antennas 230 are separated from each other along direction 100 and arranged in a row (or an array of 1×m, where m is an integer equal to or greater than 1), but the invention is not limited thereto. For example, they can also be arranged in an array of L×m, where L and m are integers equal to or greater than 1. Figure 9 In the illustrated embodiment, L = 2. Antenna 230 covers a portion of the side surface 200S of dielectric substrate 200. Antenna 230 extends from edge 200TE of top surface 200T to edge 200BE of bottom surface 200B, wherein edge 200BE is opposite to edge 200TE. In some embodiments, antenna 230 covers edges 200TE and 200BE. In some other embodiments, antenna 230 covers one or more edges 200TE and 200BE or does not cover edges 200TE and 200BE, and the embodiments of the present invention are not limited thereto. In some embodiments, such as in Figure 2 In the top view shown, the top surface 220T of antenna 220 is substantially parallel to the side surface 230S of antenna 230. In some embodiments, such as in Figure 3A and Figure 3B In the side view shown, the side surface 220S of antenna 220 is substantially parallel to the top surface 230T of antenna 230. In some embodiments, such as in Figure 2 The top view shown and Figure 3A and Figure 3BIn the side view shown, antenna 230 does not overlap with antenna 220. In some embodiments, antenna 230 is an edge-fire antenna, meaning that antenna 230 radiates a signal in direction 110 or the opposite direction of direction 110. Examples of edge-fire antennas include patch antennas, dipole antennas, and slot antennas (also described as "slotted antennas" or "hole antennas").

[0057] Ground layer 210 is disposed / formed (or may be described as "disposed on" or "formed on") in dielectric substrate 200 and below antenna 220. Ground layer 210 is formed between a plurality of dielectric layers 202 and is separate from antennas 220 and 230. Furthermore, ground layer 210 is formed inside dielectric substrate 200 and is not exposed from side surface 200S of dielectric substrate 200. In some embodiments, ground layer 210 is exposed from side surface 200S of dielectric substrate 200. In some embodiments, ground layer 210 is disposed on bottom surface 200B of dielectric substrate 200. In some embodiments, ground layer 210 is isolated from antennas 220 and 230. In some embodiments, ground layer 210 is connected to antennas 220 and / or antenna 230, depending on the type of antenna or antenna design requirements; for example, antenna 230 is a PIFA (Planar Inverted F-shaped) antenna.

[0058] A reflective wall structure 216 is formed by embedding it in the dielectric substrate 200 and is electrically connected to the ground layer 210. The reflective wall structure 216 is parallel to the side surface 200S and extends between the top surface 200T and the bottom surface 200B of the dielectric substrate 200. In other words, the reflective wall structure 216 extends along direction 100 (i.e., the length direction of the dielectric substrate 200) and direction 120 (i.e., the height direction of the dielectric substrate 200). Furthermore, the reflective wall structure 216 is isolated from antennas 220 and 230. The reflective wall structure 216 is used to reflect electromagnetic waves from antenna 230 and prevent interference between antennas 220 and 230. In some embodiments, the reflective wall structure 216 is connected to antennas 220 and 230, depending on the type of antenna or the antenna design requirements; for example, antenna 230 is a PIFA antenna. In some embodiments, the reflective wall structure includes a through-hole 212 and a conductive line 214. A via 212 is disposed on the ground layer 210 and penetrates one or more dielectric layers 202. Furthermore, the via 212 is arranged close to the side surface 200S (e.g., Figure 1As shown, an end-fire antenna 230 is provided on the side surface 200S and extends in a column along the direction 100. Conductors 214 are formed between multiple dielectric layers 202 and extend along the direction 100. Furthermore, conductors 214 cover and electrically connect to vias 212.

[0059] Electronic module 250 is disposed on the bottom surface 200B of dielectric substrate 200. Electronic module 250 covers a portion of bottom surface 200B. Furthermore, electronic module 250 is electrically connected to antenna 220 and antenna 230 via electrical routings. In some embodiments, electronic module 250 includes electronic components and / or circuits, such as radio frequency integrated circuit (RFIC), RLC circuit (a circuit structure consisting of resistor R, inductor L, and capacitor C), power management integrated circuit (PMIC), resistor, inductor, capacitor, or combinations thereof.

[0060] Connector 252 is disposed on the bottom surface 200B of dielectric substrate 200. Connector 252 is located near electronic module 250 and covers another portion of bottom surface 200B. Furthermore, connector 252 is electrically connected to electronic module 250 via electrical traces. Antenna module 500 is electrically connected to an external component (not shown) via connector 252, wherein the external component is, for example, a printed circuit board.

[0061] Figure 3A A side view of an antenna module 500A along direction 100, according to some embodiments of the present invention, is also shown, which is consistent with... Figure 1 and Figure 2 Similar or identical labels are used to identify identical or similar components. For example... Figure 3AAs shown, antenna module 500A includes antenna 230A located on side surface 200S and covering two edges 200TE and 200BE. In some embodiments, antenna 230A may be a dual-band antenna, operable in a first frequency band and a second frequency band different from the first frequency band. For example, the first frequency band has a first frequency range, and the second frequency band has a second frequency range higher than the first frequency range. For example, the first frequency band is a low-frequency band between 24.25-29.5 GHz, and the second frequency band is a high-frequency band between 37-43.5 GHz and / or between 47.2-48.2 GHz. Antenna 230A may have a dimension D1 along direction 100 and a dimension D2 along direction 120. In some embodiments, dimension D1 is equal to half wavelength corresponding to the center frequency of the first frequency band. Additionally, dimension D2 is equal to half wavelength corresponding to the center frequency of the second frequency band. In some embodiments, dimension D1 is different from dimension D2. For example, if the first frequency band is a low frequency band and the second frequency band is a high frequency band, then the size D1 is larger than the size D2.

[0062] Figure 4 This is a side view of an antenna module 500B along direction 100 according to some embodiments of the present invention, which is... Figure 1 , Figure 2 , Figure 3A , Figure 3B The same or similar labels in the text indicate the same or similar components. For example... Figure 4As shown, antenna module 500B differs from antenna module 500A in that antenna module 500B includes antennas 230LB1 and 230HB1, which cover two edges 200TE and 200BE. Antenna 230LB1 is formed beside and separate from antenna 230HB1. Furthermore, antennas 230LB1 and 230HB1 are alternately arranged along direction 100. In some embodiments, each antenna 230LB1 operates in a first frequency band, while each antenna 230HB1 operates in a second frequency band, which is different from the first frequency band. For example, the first frequency band is a low-frequency band, and the second frequency band is a high-frequency band higher than this low-frequency band. Antenna 230LB1 has a dimension D1 along direction 100, and antenna 230HB1 has a dimension D2 along direction 100. In some embodiments, dimension D1 is equal to half the wavelength corresponding to the center frequency of the first frequency band. Additionally, dimension D2 is equal to half the wavelength corresponding to the center frequency of the second frequency band. In some embodiments, dimension D1 is different from dimension D2. For example, if the first frequency band is a low frequency band and the second frequency band is a high frequency band, then dimension D1 is larger than dimension D2.

[0063] Figure 5 This is a side view of an antenna module 500C along direction 100 according to some embodiments of the present invention, which is... Figure 1 , Figure 2 , Figure 3A , Figure 3B and Figure 4 The same or similar reference numerals indicate the same or similar components. The difference between antenna module 500C and antenna module 500B is that antenna module 500C includes: having a thickness H1 greater than that of the dielectric substrate 200 (e.g., ...). Figure 4 The dielectric substrate 200C has a thickness H2 (as shown). Additionally, the antenna module 500C includes antennas 230LB2 and 230HB2 covering edges 200TE and 200BE. Antenna 230LB2 is formed next to and separate from antenna 230HB2. Furthermore, antennas 230LB2 and 230HB2 are arranged alternately along direction 100. In some embodiments, each antenna 230LB2 and each antenna 230HB2 are dual-polarization antennas. Antenna 230LB2 has a dimension D1 along directions 100 and 120 (dimension D1 is equal to the thickness H2, i.e., the dimension of antenna 230LB2 along direction 100 is equal to the dimension along direction 120). Antenna 230HB2 has a dimension D2 along direction 100 and a dimension D1 along direction 120.

[0064] Figure 6This is a side view of an antenna module 500D along direction 100 according to some embodiments of the present invention, which is... Figures 1 to 5 The same or similar reference numerals indicate the same or similar components. The difference between antenna module 500D and antenna module 500A is that antenna module 500D includes at least one pair of antennas 230HB1, which are formed on the side surface 200S of the dielectric substrate 200. That is to say, in Figure 6 In some embodiments, the antennas appear in pairs, for example, Figure 6 Four pairs of antennas are shown. Each antenna 230HB1 has a dimension D2 along a direction 100. Antenna 230HB1 can be a patch antenna. Antenna 230HB1 can be a single-polarized or dual-polarized antenna. Furthermore, antenna module 500D also includes at least one passive component 232 located within dielectric substrate 200. The passive component 232 is electrically connected (e.g., selectively electrically connected) to a pair of antennas 230HB1. For example, in some embodiments, the passive component 232 is an inductor or a filter, but the invention is not limited thereto. Figure 6 As shown, passive element 232 and a pair of antennas 230HB1 together form a composite antenna 230LB3. The composite antenna 230LB3 can be a patch-like antenna. The composite antenna 230LB3 can be a single-polarized antenna. In some embodiments, the composite antenna 230LB3 (e.g., a pair of antennas 230HB1 electrically connected together by passive element 232) has a dimension D1 along direction 100. In some embodiments, dimension D1 is larger than dimension D2; for example, dimension D1 is equal to the sum of the dimensions of the antenna pair 230HB1 and the gap between the antenna pair 230HB1 along direction 100. In some embodiments, antennas 230HB1 (with a relatively small dimension D2) operate in a first frequency band, while the composite antenna 230LB3 (with a relatively large dimension D1) operates in a second frequency band different from the first frequency band. For example, the first frequency band is a high-frequency band, and the second frequency band is a low-frequency band below that high-frequency band.

[0065] Figure 7 This is a side view of an antenna module 500E along direction 100 according to some embodiments of the present invention, which is... Figures 1 to 6The same or similar reference numerals indicate the same or similar components. Antenna module 500E differs from antenna module 500D in that antenna module 500E includes a feeding line 234 located within the dielectric substrate 200 and electrically connected (e.g., selectively electrically connected) to adjacent terminals 230HBE of a pair of antennas 230HB1. Furthermore, the same pair of antennas 230HB1 (e.g., having dimension D2) are arranged close to each other. Figure 6 As shown, feed line 234 and a pair of antennas 230HB1 together form composite antenna 230LB4 (similarly having a size D1 larger than size D2). Composite antenna 230LB4 can be a dipole antenna. In some embodiments, antenna 230HB1 operates in a first frequency band, while composite antenna 230LB4 operates in a second frequency band different from the first frequency band. For example, the first frequency band is a high-frequency band, and the second frequency band is a low-frequency band below that high-frequency band.

[0066] Figure 8 This is a side view of an antenna module 500F along direction 100 according to some embodiments of the present invention, which is... Figures 1 to 7 The same or similar reference numerals indicate the same or similar components. Antenna module 500F differs from antenna module 500A in that antenna module 500F includes at least one pair of conductive structures (e.g., conductive layers) 230F1 and at least one pair of wires 236. Understandably, the conductive structure 230F1 is part of the antenna (e.g., a slot antenna) 230F. The pair of wires 236 are disposed within the dielectric substrate 200 and are respectively disposed near the top surface 200T and the bottom surface 200B of the dielectric substrate 200. The pair of wires 236 are electrically connected to the pair of conductive structures 230F1. Figure 8 As shown, a pair of conductors 236, a pair of conductive structures 230F1, and a slot 231 or cavity region surrounded by the pair of conductors 236 and the pair of conductive structures 230F1 together form antenna 230F (e.g., a slot antenna). In embodiments of the invention, reflector structure 216 is optional. In some embodiments, antenna 230F is a slot antenna (also described as a "slotted antenna" or "gap antenna"). In some embodiments, antenna 230F is a dual-band antenna or a multi-band antenna.

[0067] Figure 9 This is a side view of an antenna module 500G along direction 100 according to some embodiments of the present invention, which is... Figures 1 to 8The same or similar reference numerals indicate the same or similar components. Antenna module 500G differs from antenna module 500B in that antenna module 500G includes antennas 230HB5 and 230LB5. In some embodiments, each of antennas 230HB5 and 230LB5 covers one of edges 200TE and 200BE. For example, antenna 230HB5 covers edge 230TE but not edge 230BE. Antenna 230LB5 covers edge 230BE but not edge 230TE. Figure 9 In the illustrated embodiment, the size of antenna 230HB5 is different from (e.g., smaller than) the size of antenna 230LB5 to reduce radio frequency interference. In some embodiments, each of antennas 230LB5 operates in a first frequency band, and each of antennas 230HB5 operates in a second frequency band higher than the first frequency band. In some embodiments, antennas 230HB5 and 230LB5 are arranged along a direction 120 perpendicular to the top surface 200T of dielectric substrate 200. Furthermore, antennas 230HB5 and 230LB5 are aligned with each other along direction 120, that is, the center positions of antennas 230HB5 and 230LB5 are aligned with each other along direction 120.

[0068] Figure 10 This is a side view of an antenna module 500H along direction 100 according to some embodiments of the present invention, which is... Figures 1 to 9 Identical or similar designations indicate identical or similar components. The difference between antenna module 500H and antenna module 500G is that antennas 230HB5 and 230LB5 in antenna module 500H are arranged in a staggered manner along a direction 100 parallel to the top surface 200T of the dielectric substrate 200. Figure 10 In the embodiment shown, antenna module 500G is able to suppress interference between antennas 230HB5 and 230LB5.

[0069] Figure 11 This is a side view of an antenna module 500I along direction 100 according to some embodiments of the present invention. Figure 12A , Figure 12B and Figure 12C This is a side view of an antenna module 500I along direction 110 according to some embodiments of the present invention. Figures 1 to 10 The same or similar reference numerals in the reference numerals denote the same or similar components. The difference between antenna module 500I and antenna module 500A is that antenna module 500I includes an antenna 230I (including...) formed on the side surface 200S of the dielectric substrate 200. Figure 12A , Figure 12B and Figure 12CAntennas 230I-1, 230I-2, and 230I-3 are shown. Each antenna 230I covers one of the edges 200TE and 200BE (e.g., Figure 11 (As shown in the diagram, it covers edge 200BE). For example, antenna 230I covers edge 230BE but not edge 230TE.

[0070] like Figure 12A As shown, the side surface 200S of the dielectric substrate 200 is planar. Furthermore, the antenna 230I-1 is formed on the side surface 200S near the bottom surface 200B.

[0071] like Figure 12B As shown, the dielectric substrate 200 has a side surface 200S1 adjacent to the top surface 200T and a side surface 200S2 adjacent to the bottom surface 200B and side surface 200S1. Side surface 200S1 is not aligned with side surface 200S2, i.e., the side surfaces are not coplanar. For example, in... Figure 12B In the side view shown, side surface 200S1 is located outside side surface 200S2. Furthermore, antenna 230I-2 is formed on side surface 200S2.

[0072] like Figure 12C As shown, the dielectric substrate 200 has a side surface 200S1 adjacent to the bottom surface 200B and a side surface 200S2 adjacent to the top surface 200T and the side surface 200S1. The side surface 200S1 is not aligned with the side surface 200S2, i.e., the side surfaces are not coplanar. For example, in... Figure 12C In the side view shown, side surface 200S1 is located outside side surface 200S2. Furthermore, antenna 230I-3 is formed on side surface 200S1.

[0073] Figure 13 This is a side view of an antenna module 500J along direction 100 according to some embodiments of the present invention. Figure 14A , Figure 14B and Figure 14C This is a side view of an antenna module 500J along direction 110 according to some embodiments of the present invention. Figures 1 to 12C The same or similar reference numerals in the reference numerals denote the same or similar components. The difference between antenna module 500J and antenna module 500I is that antenna module 500J includes an antenna 230J (including...) formed on the side surface 200S of the dielectric substrate 200. Figure 14A , Figure 14B and Figure 14C Antennas 230J-1, 230J-2, and 230J-3 are shown. Each antenna 230J does not cover the edges 200TE and 200BE.

[0074] like Figure 14A As shown, the side surface 200S of the dielectric substrate 200 is planar. Furthermore, the antenna 230J-1 is formed on the central portion of the side surface 200S.

[0075] like Figure 14B As shown, the dielectric substrate 200 has a side surface 200S1-1 adjacent to the top surface 200T, a side surface 200S1-2 adjacent to the bottom surface 200B, and a side surface 200S2 between and adjacent to the side surfaces 200S1-1 and 200S1-2. The side surfaces 200S1-1 and 200S1-2 are aligned with each other (i.e., side surfaces 200S1-1 and 200S1-2 are coplanar). Furthermore, the side surfaces 200S1-1 and 200S1-2 are not aligned with the side surface 200S2 (i.e., side surfaces 200S1-1 and 200S1-2 are not coplanar with the side surface 200S2). For example, in... Figure 14B In the side view shown, side surfaces 200S1-1 and 200S1-2 are located outside side surface 200S2. Furthermore, antenna 230J-2 is formed on side surface 200S2.

[0076] like Figure 14C As shown, the dielectric substrate 200 has a side surface 200S2-1 adjacent to the top surface 200T, a side surface 200S2-2 adjacent to the bottom surface 200B, and a side surface 200S1 located between and adjacent to the side surfaces 200S2-1 and 200S2-2. Side surfaces 200S2-1 and 200S2-2 are aligned with each other (i.e., side surfaces 200S1-1 and 200S1-2 are coplanar). Furthermore, side surface 200S1 is not aligned with side surfaces 200S2-1 and 200S2-2 (i.e., side surfaces 200S1-1 and 200S1-2 are not coplanar with side surface 200S2). For example, in... Figure 14C In the side view shown, side surface 200S1 is located outside side surfaces 200S2-1 and 200S2-2. Furthermore, antenna 230J-3 is formed on side surface 200S1.

[0077] Figure 15A This is a side view of an antenna module 500K along direction 100 according to some embodiments of the present invention. Figure 15B This is a side view of an antenna module 500K along direction 110 according to some embodiments of the present invention. Figures 1 to 14CThe same or similar reference numerals denote the same or similar components. Antenna module 500K differs from antenna module 500A in that antenna module 500K includes a conductive sheet 230K1 located on a pad 332 situated on the bottom surface 200B of dielectric substrate 200. Furthermore, conductive sheet 230K1 extends along a direction 120 perpendicular to the bottom surface 200B of dielectric substrate 200. Conductive sheet 230K1 is separate from electronic module 250 and connector 252. In some embodiments, conductive sheet 230K1 is electrically connected to antenna 230A via pad 332 and traces / wiring (not shown). In this embodiment, conductive sheet 230K1 and antenna 230A together constitute a larger antenna 230K.

[0078] Figure 16 This is a side view of an antenna module 500L along direction 100 according to some embodiments of the present invention. Figures 1 to 15B The same or similar reference numerals in the text indicate the same or similar components. For ease of illustration, the ground plane 210 and the reflector structure 216 are not shown in the text. Figure 16 As shown in the figure. The difference between antenna module 500L and antenna module 500A is that antenna module 500L includes dielectric substrate 200L and electronic module 250A.

[0079] In some embodiments, the dielectric substrate 200L is a multi-layered package substrate comprising stacked dielectric layers 202 made of the same or different materials. The dielectric substrate 200L includes electrical traces 246 for electrical connections, the electrical traces 246 consisting of conductive layers and vias (not shown) formed in the dielectric substrate 200L. In some embodiments, the electrical traces 246 are electrically connected to, for example, antennas 220 and 230, passive components (e.g., Figure 6 The passive element 232 shown), feeder (e.g.) Figure 7 The feed line 234 shown), conductive sheet (e.g.) Figure 15A and 15B The conductive sheet 230K1 shown) or other suitable electronic components. In some embodiments, the thickness H3 of the dielectric substrate 200L is equal to or greater than the thickness H1 of the dielectric substrate 200 (e.g., the conductive sheet 230K1 shown) or other suitable electronic components. Figure 4 (as shown), so as to arrange electrical wiring 246.

[0080] In this embodiment, the electronic module 250A includes electronic components 240 and 241, molding compound 244, and at least one conductive bump structure 245. Electronic components 240 and 241 are disposed on the bottom surface 200LB of the dielectric substrate 200L. Furthermore, electronic component 240 is electrically connected to antennas 220 and 230 via electrical traces 246. Figure 16 As shown, electronic component 240 is electrically connected to electrical trace 246 via conductive bump structure 245. In some embodiments, electronic components 240 and 241 are different electronic components. For example, electronic component 240 is an RFIC. The second electronic component 241 may be a passive component such as a resistor, inductor, or capacitor. In some embodiments, for example, conductive bump structure 245 includes solder balls, solder paste, or conductive pillars.

[0081] Connector 252 is mounted on the bottom surface 200LB of dielectric substrate 200L and adjacent to electronic module 250A. Furthermore, connector 252 is electrically connected to electronic module 250A via electrical trace 246. Antenna module 500L is electrically connected to external components (not shown) via connector 252.

[0082] A molding compound 244 is formed on and in contact with a portion of the bottom surface 200LB of the dielectric substrate 200L. The molding compound 244 covers and encapsulates electronic components 240 and 241 but does not cover connector 252. In some embodiments, the molding compound 244 is made of, for example, a novolac-based resin, an epoxy-based resin, a silicone-based resin, or other suitable encapsulant. The molding compound 244 may include suitable fillers, such as powdered SiO2. The molding compound 244 can be applied using any of a variety of molding techniques, such as compression molding, injection molding, or transfer molding.

[0083] 0 as Figure 16 As shown, the dielectric substrate 200L, antennas 220 and 230, electronic module 250A, and connector 252 together form an antenna package (i.e., antenna module 500L is an antenna package). Antennas 220 and 230 are formed on the top surface 200LT and the adjacent side surface 200LS of the dielectric substrate (package substrate) 200L, respectively.

[0084] Figure 17 This is a side view of an antenna module 500M along direction 100 according to some embodiments of the present invention.

[0085] and Figures 1 to 16The same or similar reference numerals indicate the same or similar components. The difference between antenna module 500M5 and antenna module 500A is that antenna module 500M is a stacked package-on-package (PoP) package assembly, which includes antenna package 280A and electronic module 250B.

[0086] In this embodiment, the antenna package 280A includes a dielectric substrate 200, antennas 220 and 230. Antennas 220 and 230 are respectively formed on the top surface 200T0 and the adjacent side surface 200S of the dielectric substrate (also described as a "package substrate") 200.

[0087] Electronic module 250B can be a semiconductor package, such as a surface-mount technology (SMT) package, which includes a dielectric substrate 248A, electronic components 240 and 241, molding compound 244, and conductive bump structure 245. Furthermore, electronic module 250B is connected via...

[0088] Electrical bump structure 262 is mounted on antenna package 280A. Additionally, connector 252 is mounted on antenna package 280A and located next to electronic module 250B.

[0089] The dielectric substrate 248A of the electronic module 250B is located between the bottom surface 200B of the dielectric substrate 200 and the electronic components 240 and 241. Furthermore, the dielectric substrate 248A and the connector 252 overlap different portions of the bottom surface 200B of the dielectric substrate 200. In some embodiments, the dielectric substrate 248A is a multilayer packaging substrate comprising stacked dielectric layers 302A made of the same or different materials. The dielectric substrate 248A includes electrical traces 346A consisting of conductive layers and vias (not shown) formed in the dielectric substrate 248A for electrical connections between the antennas 220 and 230 and the electronic components 240 and 241, and between the electronic components 240 and 241.

[0090] Electronic components 240 and 241 and conductive bump structure 262 of electronic module 250B are disposed on opposite surfaces 248AT and 248AB of dielectric substrate 248A.

[0091] The molding compound 244 of the electronic module 250B completely covers the surface 248AT of the dielectric substrate 248A. Furthermore, the side surface 244S of the molding compound 244 is aligned with the corresponding side surface 248AS of the dielectric substrate 248A.

[0092] Figure 18This is a side view of an antenna module 500N along direction 100 according to some embodiments of the present invention. Figures 1 to 17 The same or similar reference numerals in the text indicate the same or similar components. The difference between antenna module 500N and antenna module 500M is that antenna module 500N is a stacked package (PoP) type package structure, which includes antenna package 280A stacked on electronic module 250C.

[0093] In this embodiment, the electronic module 250C can be a semiconductor package, such as a surface mount technology (SMT) package, which includes a dielectric substrate 248B, electronic components 240 and 241, molding compound 244, and conductive bump structure 245. Furthermore, the antenna package 280A is mounted on the electronic module 250C via the conductive bump structure 262. Additionally, a connector 252 is mounted on the dielectric substrate 248B and located adjacent to the electronic components 240 and 241.

[0094] The dielectric substrate 248B of the electronic module 250C completely covers the bottom surface 200B of the dielectric substrate 200. Furthermore, the dielectric substrate 248B is disposed between the bottom surface 200B of the dielectric substrate 200 and the connector 252. In some embodiments, the dielectric substrate 248B is a multilayer packaging substrate, comprising stacked dielectric layers (i.e., multiple dielectric layers stacked together) 302B made of the same or different materials. The dielectric substrate 248B includes electrical traces 346B consisting of conductive layers and vias (not shown) formed in the dielectric substrate 248B for electrical connections between the antennas 220, 230 and the electronic component 240, and between the electronic components 240, 241 and the connector 252.

[0095] Electronic components 240 and 241 of electronic module 250C are disposed on surface 248BT of dielectric substrate 248B. Molding plastic 244 of electronic module 250C encapsulates electronic components 240 and 241 and partially covers surface 248BT of dielectric substrate 248B. In some embodiments, side surfaces 244S of molding plastic 244 are not aligned with corresponding side surfaces 248BS of dielectric substrate 248B, i.e., in... Figure 18 In the embodiment shown, the side surface 244S of the molding compound 244 is not coplanar with the corresponding side surface 248BS of the dielectric substrate 248B.

[0096] Figure 19 This is a side view of an antenna module 500P along direction 100 according to some embodiments of the present invention. Figures 1 to 18The same or similar reference numerals denote the same or similar components. The difference between antenna module 500P and antenna module 500N is that antenna module 500P is a stacked package (PoP, also described as a "layered package") structure, comprising multiple discrete antenna packages 280B arranged side-by-side and stacked on a dielectric substrate 248B of electronic module 250C. Electronic module 250C (e.g., SMT package) can individually control each antenna package 280B. In this embodiment, each antenna package 280B includes a dielectric substrate 200P, antennas 220 and 230, and conductive bump structure 262. In some embodiments, dielectric substrates 200P and 200 may include the same or similar materials and structures.

[0097] Figure 20 This is a side view of an antenna module 500Q along direction 100 according to some embodiments of the present invention. Figures 1 to 19 The same or similar reference numerals in the text indicate the same or similar components. The difference between antenna module 500Q and antenna module 500M is that antenna module 500Q does not have electronic components 240 and 241, nor connector 252 (such as...). Figure 1 The antenna module 500Q comprises an antenna package 280A including a dielectric substrate 200, antennas 220 and 230, and a conductive bump structure 262. In this embodiment, the antenna module 500Q is electrically connected to external components (e.g., a printed circuit board) without using... Figure 1 Connector 252 is shown.

[0098] Figure 21 This is a side view of an antenna module 500R along direction 100 according to some embodiments of the present invention. Figures 1 to 20 The same or similar reference numerals denote the same or similar components. Antenna module 500R differs from antenna module 500Q in that antenna module 500R includes an electronic component 240 mounted on antenna package 280A. The electronic component 240 is located on the bottom surface 200B of the dielectric substrate 200 of antenna package 280A. The electronic component 240 is electrically connected to antennas 220 and 230 via conductive bump structure 245. A conductive bump structure 262 is formed on the bottom surface 200B of the dielectric substrate 200 and surrounds the electronic component 240. In some embodiments, the size of the conductive bump structure 262 may be larger than the size of the conductive bump structure 245. In this embodiment, the electronic component 240 includes a radio frequency integrated circuit (RFIC), a power management integrated circuit (PMIC), or a passive component, such as a resistor, inductor, or capacitor.

[0099] Figure 22 This is a side view of an antenna module 500S along direction 100 according to some embodiments of the present invention. Figures 1 to 21 The same or similar reference numerals denote the same or similar components. The antenna module 500S differs from the antenna module 500Q in that the antenna module 500S further includes a dielectric substrate 248B, an electronic component 240, and at least one conductive bump structure 264. The electronic component 240 is mounted on a surface 248BT of the dielectric substrate 248B and electrically connected to an electrical trace 346B via the conductive bump structure 245. The conductive bump structure 264 is formed on the surface 248BT of the dielectric substrate 248B and electrically connected to the electrical trace 346B. Furthermore, the electronic component 240 is surrounded by the conductive bump structure 264. In some embodiments, the conductive bump structures 245, 262, and 264 may include the same or similar structures and materials. The size of the conductive bump structure 264 may be larger than the sizes of the conductive bump structures 245 and 262.

[0100] Figure 23 This is a side view of an antenna module 500T along direction 100 according to some embodiments of the present invention. Figures 1 to 22 The same or similar reference numerals denote the same or similar components. The difference between antenna module 500T and antenna module 500S is that antenna module 500T includes multiple discrete antenna packages 280B arranged side-by-side and stacked on dielectric substrate 248B. In this embodiment, electronic component 240 can individually control each antenna package 280B.

[0101] Figure 24 This is a side view of an antenna module 500U along direction 100 according to some embodiments of the present invention. Figures 1 to 23 The same or similar reference numerals denote the same or similar components. The difference between antenna module 500U and antenna module 500L is that antenna module 500U is a semiconductor package including dielectric substrate 200L, antennas 220 and 230, electronic component 240, and conductive bump structure 264. In this embodiment, electronic component 240 is embedded in dielectric substrate 200L. To illustrate the embedded electronic component 240, ground layer 210 and reflective wall structure 216 are not shown. Figure 24 As shown in the image.

[0102] In some embodiments, the dielectric substrate 200L is a multilayer packaging substrate comprising a plurality of stacked dielectric layers 202 made of the same or different materials and having the same or different thicknesses. The dielectric substrate 200L includes electrical traces 246 consisting of conductive layers and vias (not shown) formed in the dielectric substrate 200L for electrical connection. An antenna 220 is formed on the top surface (i.e., top surface 200LT) of the topmost dielectric layer 202. An electronic component 240 is disposed between the topmost dielectric layer 202 and the lower dielectric layers 202 and electrically connected to the electrical traces 246. Furthermore, conductive bump structures 264 are formed on the bottom surface 200LB of the dielectric substrate 200L and electrically connected to the electrical traces 246.

[0103] Figure 25 This is a side view of an antenna module 500W along direction 100 according to some embodiments of the present invention. Figures 1 to 24 The same or similar reference numerals denote the same or similar components. The difference between antenna module 500W and antenna module 500U is that antenna module 500W is a semiconductor package, which includes a dielectric substrate 200W, antennas 220 and 230, electronic components 240, and conductive bump structures 264. In this embodiment, electronic components 240 are embedded in the dielectric substrate 200W.

[0104] In some embodiments, the dielectric substrate 200W is a multilayer packaging substrate comprising a dielectric layer 202W1 and a dielectric layer 202W2 located below the dielectric layer 202W1. The dielectric layers 202W1 and 202W2 may be made of the same or different materials and have the same or different thicknesses. An antenna 220 is formed on the top surface 200WT of the dielectric layer 202W1. Furthermore, an electronic component 240 is embedded in the dielectric layer 202W2. In some other embodiments, the dielectric layer 202W2 comprises a molding compound. Figure 25 As shown, a conductive bump structure 264 is formed on the bottom surface 200WB of the dielectric substrate 200W and is electrically connected to the electrical trace 246.

[0105] Figure 26 This is a top view of an intermediate stage of a method for manufacturing an antenna module 500 according to some embodiments of the present invention. The method focuses on the process of forming the antenna 230 of the antenna module 500 (the antenna 230 is located on a side surface adjacent to the top surface of the substrate). Figure 26 As shown, a dielectric substrate 200 is provided. A ground layer 210 (as shown) Figure 3AAs shown, a reflector structure 216 is formed in the dielectric substrate 200. An antenna 220 is formed on the top surface 200T of the dielectric substrate 200. Next, using electroplating, sputtering, or spraying processes, an antenna is formed on the side surface 200S of the dielectric substrate 200 (as shown). Figure 1 A conductive layer 228 is formed on the dielectric substrate 200. Next, a removal process is performed to remove a portion 228R of the conductive layer 228, thereby forming an antenna 230 on the side surface 200S of the dielectric substrate 200. Figure 1 As shown), and antenna module 500 (as shown). Figure 1 (as shown). In some embodiments, the removal process includes laser polishing, drilling, or other suitable processes.

[0106] Figure 27 This is a top view of an intermediate stage of a method for manufacturing an antenna module 500 according to some embodiments of the present invention. The method focuses on alternative processes for forming the antenna 230 of the antenna module 500. For example... Figure 27 As shown, a dielectric substrate 200BL is provided. In some embodiments, the dielectric substrate 200BL is used to fabricate a plurality of antenna modules 500 and has a scribe line CL along direction 100 to define the area of ​​each antenna module 500. Furthermore, a ground layer 210 (e.g., ...) is provided for each antenna module 500. Figure 3A As shown, a reflective wall structure 216 is formed in the dielectric substrate 200BL. The reflective wall structure 216 is formed near the dicing line CL. Antennas 220 are formed on the top surface 200T of the dielectric substrate 200BL and arranged in an n×m array, where n is an integer greater than or equal to 1 (specifically, n is an integer greater than or equal to 2), and m is an integer greater than or equal to 1. In some embodiments, the dielectric substrate 200BL has a structure formed along the dicing line CL and extending from the top surface 200BT of the dielectric substrate 200BL through the dielectric substrate 200BL to the bottom surface of the dielectric substrate 200BL (in...). Figure 27 In the top view shown, it is a hole (also described as an "aperture") 229 on the surface opposite to and covered by the top surface 200BT. The hole 229 is arranged along the cut line CL and located between the reflector structures 216 to define the position of the antenna 230. Furthermore, in Figure 27 In the top view shown, the hole 229 has a major axis LX along direction 100, which overlaps with the corresponding cutting line CL. In some embodiments, the hole 229 is formed by a drilling process or other suitable removal process.

[0107] Next, a conductive material (not shown) is formed to cover the inner wall 229S of the hole 229 to form a conductive feature 230P in the dielectric substrate 200BL, and the conductive feature 230P extends from the top surface 200BT of the dielectric substrate 200BL to the bottom surface of the dielectric substrate 200BL. In some embodiments, the conductive feature 230P is conformally formed on the inner wall 229S of the hole 229 by utilizing an electroplating process or other suitable coating process. In some embodiments, the conductive feature 230P filling the hole 229 can be formed by inserting conductive coins or conductive pillars into the hole 229.

[0108] Next, along with Figure 27 The top view shown shows that the long axis LX of the hole 229 is cut along the cutting line CL to cut the dielectric substrate 200BL, so as to form the antenna 230 on the side surface 200S of the cut dielectric substrate (i.e., substrate 200). Figure 1 As shown), and antenna module 500 (as shown). Figure 1 (As shown)

[0109] Figure 28 This is a top view of an intermediate stage of a method for manufacturing an antenna module 500 according to some embodiments of the present invention. The method focuses on alternative processes for forming the antenna 230 of the antenna module 500. For example... Figure 28 As shown, a dielectric substrate 200CL is provided. In some embodiments, the dielectric substrate 200CL is provided for fabricating a plurality of antenna modules 500. The dielectric substrate 200CL includes a plurality of dielectric substrates 200. Furthermore, a ground layer 210 is ultimately formed for each antenna module 500. Figure 3A A reflector structure 216 is formed in each dielectric substrate 200. An antenna 220 is formed on the top surface 200T of each dielectric substrate 200. The dielectric substrates 200 are arranged side by side. The dielectric substrate 200CL also includes a conductive feature 330P, which is embedded in a portion of two adjacent dielectric substrates 200 (or described as "located between a portion of two adjacent dielectric substrates 200") and connected to the side surfaces 200S of the two adjacent dielectric substrates 200 (or described as "physically in contact with the side surfaces 200S"). The position of the conductive feature 330P corresponds to the position of the resulting antenna 230. In addition, the conductive feature 330P is electrically connected to the electrical traces of the respective dielectric substrates 200.

[0110] Next, the dielectric substrate 200CL is cut along the cutting line CL, which is the same as the long axis of the conductive feature 330P, in direction 100, so as to form the antenna 230 on the side surface 200S of the cut dielectric substrate 200. Figure 1 ), and antenna module 500 ( Figure 1 )form.

[0111] This invention provides an antenna module. The antenna module includes a first antenna (e.g., a vertical-firing antenna) and a second antenna (e.g., an end-firing antenna) formed respectively on the top and side surfaces of a dielectric substrate (i.e., an antenna substrate). Compared to a vertical-firing antenna module where the antenna is formed only on the top surface of the dielectric substrate, the antenna module provided by this invention provides radio waves from two different radiation directions of the antenna without increasing its size (volume of the antenna substrate). Compared to conventional dual-antenna modules (e.g., which include vertical-firing and end-firing antennas both formed on the same surface of different antenna substrates or on different portions of the same surface of a curved substrate), the antenna module provided by this invention reduces size. Therefore, manufacturing costs can be reduced. Furthermore, the second antenna (e.g., an end-firing antenna) can be formed on multiple opposing side surfaces of the dielectric substrate, thereby increasing the coverage area of ​​the antenna module. This invention improves the performance of the antenna module. Furthermore, the antenna module can be widely used in semiconductor bonding technology (SBT) and processes for manufacturing semiconductor packages.

[0112] The use of ordinal terms such as “first,” “second,” and “third” in the claims to modify claim elements does not in itself indicate any priority, precedence, or order of one claim element relative to another claim element, or the chronological order of the execution of method actions. Rather, it is merely used as a marker to distinguish one claim element with the same name from another element with the same name.

[0113] While the invention has been described by way of example and according to preferred embodiments, it should be understood that the invention is not limited to the disclosed embodiments. Rather, it is intended to cover various variations and similar structures (as will be apparent to those skilled in the art), such as combinations or substitutions of different features in different embodiments. Therefore, the scope of the appended claims should be given the broadest interpretation to cover all such variations and similar structures.

Claims

1. An antenna module, characterized in that, The antenna module includes: A first dielectric substrate has a top surface, a bottom surface, and a first side surface located between the top surface and the bottom surface; A first antenna is formed on the top surface of the first dielectric substrate; and, A pair of second antennas are formed on the first side surface of the first dielectric substrate; The antenna module also includes: A feed line is located within the dielectric substrate and electrically connected to adjacent terminals of the pair of second antennas, wherein the feed line and the pair of second antennas together form a second composite antenna, the second antennas operate in a first frequency band, and the second composite antenna operates in a second frequency band different from the first frequency band.

2. The antenna module as described in claim 1, characterized in that, The antenna module also includes: A grounding layer is located in the first dielectric substrate and below the first antenna.

3. The antenna module as described in claim 2, characterized in that, The antenna module also includes a reflector wall structure embedded in the first dielectric substrate and electrically connected to the ground layer. The reflector wall structure extends parallel to the first side surface and is located between the top surface and the bottom surface. The reflector wall structure includes: Through-holes, located on the ground layer and arranged in rows near the first side surface; and, The first conductor covers and electrically connects to the through hole.

4. The antenna module as described in claim 1, characterized in that, The first antenna radiates a signal in a first direction, and the second antenna radiates a signal in a second direction different from the first direction.

5. The antenna module as described in claim 1, characterized in that, The second antenna operates in a first frequency band and a second frequency band different from the first frequency band, and the second antenna has a first dimension along a first direction and a second dimension along a second direction.

6. The antenna module as described in claim 5, characterized in that, The first dimension is equal to half the wavelength corresponding to the center frequency of the first frequency band, and the second dimension is equal to half the wavelength corresponding to the center frequency of the second frequency band.

7. The antenna module as described in claim 1, characterized in that, The antenna module also includes: A third antenna is formed on the first side surface and located below the second antenna, wherein the second antenna operates in a first frequency band and the third antenna operates in a third frequency band different from the first frequency band, wherein the second antenna has a first dimension along a first direction and the third antenna has a second dimension along the first direction, the first dimension being different from the second dimension.

8. The antenna module as described in claim 7, characterized in that, The second antenna and the third antenna are arranged in a second direction perpendicular to the top surface.

9. The antenna module as described in claim 7, characterized in that, The second antenna and the third antenna are staggered along the first direction parallel to the top surface.

10. The antenna module as described in claim 1, characterized in that, The second line includes: A pair of conductive structures; and, A pair of wires are located in the dielectric substrate and are respectively close to the top surface and the bottom surface, wherein the pair of wires are electrically connected to the conductive structure, and wherein the slots surrounding the pair of wires and the pair of conductive structures form a second antenna.

11. The antenna module as described in claim 1, characterized in that, The dielectric substrate also includes a second side surface adjacent to the first side surface, and the first side surface is not aligned with the second side surface.

12. The antenna module as described in claim 1, characterized in that, The antenna module also includes: A conductive sheet is located on the bottom surface of the first dielectric substrate and extends in a direction perpendicular to the bottom surface of the first dielectric substrate, wherein the conductive sheet is electrically connected to the second antenna.

13. The antenna module as described in claim 1, characterized in that, The antenna module also includes: An electronic component is located on the bottom surface of the first dielectric substrate, wherein the electronic component is electrically connected to the first antenna and the second antenna.

14. The antenna module as described in claim 13, characterized in that, The antenna module also includes: A connector is located on the bottom surface of the first dielectric substrate and next to the electronic component, wherein the connector is electrically connected to the electronic component.

15. The antenna module as described in claim 14, characterized in that, The antenna module also includes: Molding compound that covers the electronic component but not the connector.

16. The antenna module as described in claim 15, characterized in that, The first dielectric substrate, the first antenna, the second antenna, the electronic component, the connector, and the molding compound together form an antenna package.

17. The antenna module as described in claim 15, characterized in that, The antenna module also includes: The second dielectric substrate is located between the bottom surface of the first dielectric substrate and the electronic component.

18. The antenna module as described in claim 17, characterized in that, The connector overlaps with the second dielectric substrate at different portions of the bottom surface of the first dielectric substrate.

19. The antenna module as described in claim 17, characterized in that, The second dielectric substrate is located between the bottom surface of the first dielectric substrate and the connector.

20. The antenna module as described in claim 17, characterized in that, The first dielectric substrate, the first antenna, and the second antenna together form an antenna package, and the electronic component, the molding compound, and the second dielectric substrate together form a semiconductor package, wherein the antenna package is mounted on the semiconductor package.

21. The antenna module as described in claim 1, characterized in that, The antenna module also includes: Electronic components embedded in the first dielectric substrate.

22. The antenna module as described in claim 21, characterized in that, The first dielectric substrate includes a first dielectric layer and a second dielectric layer located below the first dielectric layer, the first antenna is formed on the top surface of the first dielectric layer, and the electronic component is located between the first dielectric layer and the second dielectric layer.

23. The antenna module as described in claim 21, characterized in that, The first dielectric substrate includes a first dielectric layer and a second dielectric layer located below the first dielectric layer, the first antenna is formed on the top surface of the first dielectric layer, and the electronic component is embedded in the second dielectric layer.

24. An antenna module, characterized in that, The antenna module includes: A first dielectric substrate has a top surface, a bottom surface, and a first side surface located between the top surface and the bottom surface; A first antenna is formed on the top surface of the first dielectric substrate; and, A second antenna is formed on the first side surface of the first dielectric substrate; The second line includes: A pair of conductive structures; and, A pair of wires are located in the dielectric substrate and are respectively close to the top surface and the bottom surface, wherein the pair of wires are electrically connected to the conductive structure, and wherein the slots surrounding the pair of wires and the pair of conductive structures form a second antenna.

25. The antenna module as described in claim 24, characterized in that, The antenna module includes a pair of second antennas, and the antenna module also includes: A passive element is located in the dielectric substrate and is electrically connected to the pair of second antennas. The passive element and the pair of second antennas together form a first composite antenna, wherein the second antennas operate in a first frequency band and the first composite antenna operates in a second frequency band different from the first frequency band.

26. A method for manufacturing an antenna module, characterized in that, The method includes: A dielectric substrate is provided, the dielectric substrate having a top surface, a bottom surface, and a side surface located between the top surface and the bottom surface; A first antenna is formed on the top surface of the dielectric substrate; A conductive layer is formed covering the entire side surface; and, A portion of the conductive layer is removed to form a pair of second antennas on that side surface of the dielectric substrate; The antenna module also includes: A feed line is located within the dielectric substrate and electrically connected to adjacent terminals of the pair of second antennas, wherein the feed line and the pair of second antennas together form a second composite antenna, the second antennas operate in a first frequency band, and the second composite antenna operates in a second frequency band different from the first frequency band.

27. A method for manufacturing an antenna module, characterized in that, The method includes: A dielectric substrate is provided, the dielectric substrate having a top surface and a bottom surface; A first antenna is formed on the top surface of the dielectric substrate; Conductive features extending from the top surface to the bottom surface are formed in the dielectric substrate; and, The dielectric substrate is cut along the long axis of the conductive feature in a top view to form a second antenna on the side surface of the cut dielectric substrate, wherein the side surface is located between the top and bottom surfaces of the cut dielectric substrate. The second line includes: A pair of conductive structures; and, A pair of wires are located in the dielectric substrate and are respectively close to the top surface and the bottom surface, wherein the pair of wires are electrically connected to the conductive structure, and wherein the slots surrounding the pair of wires and the pair of conductive structures form a second antenna.

28. The method for manufacturing an antenna module as described in claim 27, characterized in that, The dielectric substrate has a hole penetrating the dielectric substrate, and forming the conductive feature in the dielectric substrate includes forming a conductive material covering the inner wall of the hole.

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