An apparatus and method for preparing a dielectric diaphragm
By processing porous diaphragms using vacuum and pressurization devices, the problems of poor density and electrical properties of porous diaphragms have been solved, enabling the fabrication of dielectric diaphragms with higher density and electrical properties, which are applicable to acoustic transducers, electronic devices, MEMS actuators, and sensors.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- INST OF ACOUSTICS CHINESE ACAD OF SCI
- Filing Date
- 2022-01-21
- Publication Date
- 2026-06-19
AI Technical Summary
Existing methods for preparing porous membranes result in poor compactness and electrical properties, and the porosity affects the electrical performance of the membranes in their application fields.
An apparatus and method for preparing a dielectric membrane are described, in which air is extracted from the pores of a porous membrane by a vacuum device, and a precursor is permeated into the pores by a pressurizing device to form a dense dielectric membrane.
It improves the compactness and electrical properties of porous membranes, has a simple structure, is easy to operate, has low cost, and good compatibility, making it suitable for a wide range of applications in porous membrane materials.
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Figure CN116506789B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of electronic material preparation, and in particular to an apparatus and method for preparing dielectric films. Background Technology
[0002] Porous diaphragm materials have wide applications in acoustic transducers, electronic devices, MEMS actuators, and sensors. Therefore, their electrical performance is crucial for these applications. Porous diaphragm materials can be prepared using methods such as screen printing, powder metallurgy, sol-gel methods, magnetron sputtering, 3D printing, or electroplating. Existing methods for preparing porous diaphragms often employ crystallization and heat treatment processes to improve their density. However, even after these processes, porous diaphragms still contain pores, and currently, there is no effective method to remove these pores. Since the pores in porous diaphragms affect their electrical performance, developing a more dense dielectric diaphragm with better electrical properties is of great significance in the application fields of porous diaphragm materials and is a pressing technical problem that needs to be solved. Summary of the Invention
[0003] The purpose of this invention is to provide an apparatus and method for preparing dielectric films, which can improve the compactness and electrical properties of dielectric films.
[0004] Therefore, according to a first aspect of the present invention, an apparatus for preparing a dielectric membrane is provided for preparing a porous membrane into a dielectric membrane, comprising: a housing having an opening, wherein a first sealing element is disposed on the inner surface of the housing; wherein the first sealing element is fixedly disposed around the opening; a top cover plate, one end of which is movably connected to the opening of the housing, and the other end of which is hermetically connected to a pressurizing device; a lifting platform passing through the housing opposite to the opening and corresponding to the opening; a second sealing element disposed where the lifting platform passes through the housing; wherein after the lifting platform is raised, the lifting platform is in close contact with the first sealing element; a vacuum device hermetically connected to the housing; wherein the housing, vacuum device, top cover plate, pressurizing device, lifting platform and second sealing element are connected to form a sealed space; wherein air is extracted from the pores of the porous membrane within the sealed space, and a precursor is high-pressure infiltrated into the pores to obtain a dielectric membrane.
[0005] Based on the above technical solution, the present invention can be further improved as follows.
[0006] Furthermore, the shell is a cylindrical shell with bosses on both the upper and lower surfaces; wherein the opening is located on the upper boss; a third sealing element is provided at the connection between the upper boss and the upper cover plate.
[0007] Furthermore, the upper cover plate is detachably connected to the housing; wherein, the upper cover plate has a recess corresponding to the upper boss; the third seal is provided on the outer edge of the upper boss and fits tightly with the end face of the recess.
[0008] Furthermore, it also includes: a lower cover plate having a groove corresponding to the lower boss of the housing, and fitted over the lower boss; wherein, both the lower cover plate and the lower boss are provided with holes, and the holes on the lower cover plate and the lower boss are the same size and their geometric center lines coincide.
[0009] Furthermore, the lifting platform includes: a platform; a lifting shaft, one end of which is connected to the platform to control the lifting or lowering of the platform; a handle wheel, located at the other end of the lifting shaft to control the lifting or lowering of the lifting shaft; and a bellows, sleeved on the outside of the lifting shaft, one end of which is connected to the platform and the other end of which is connected to the lower boss.
[0010] Furthermore, the precursor is identical to or has a similar chemical composition to the porous membrane material.
[0011] Furthermore, a vacuum valve is provided on the side wall of the housing, and the vacuum valve is connected to the vacuum device in a sealed manner.
[0012] According to a second aspect of the present invention, a method for preparing a dielectric film is provided, comprising the following steps:
[0013] Place the porous diaphragm on the platform and adjust the platform's height using the handle wheel to ensure the porous diaphragm is tightly attached to the first seal.
[0014] A precursor is dropped onto the upper surface of a porous membrane from an open end, wherein the precursor is uniformly distributed on the upper surface of the porous membrane.
[0015] The top cover is sealed to the housing.
[0016] The air inside the porous membrane is extracted using a vacuum device;
[0017] Pressure is applied to the precursor by a pressurizing device, causing it to permeate into the pores of the porous membrane to obtain a dielectric membrane.
[0018] According to a third aspect of the present invention, a method for preparing a dielectric film is provided, comprising the following steps:
[0019] Porous membranes with substrates are prepared by screen printing, powder metallurgy, sol-gel method, magnetron sputtering, 3D printing or electroplating.
[0020] Place the porous diaphragm with substrate on the platform, and adjust the height of the platform by using the handle wheel to make the porous diaphragm fit tightly against the first seal.
[0021] A precursor is dropped onto the upper surface of a porous membrane from an open end, wherein the precursor is uniformly distributed on the upper surface of the porous membrane.
[0022] The top cover is sealed to the housing.
[0023] The air inside the porous membrane is extracted using a vacuum device;
[0024] Pressure is applied to the precursor by a pressurizing device, causing it to permeate into the pores of the porous membrane to obtain a dielectric membrane.
[0025] Furthermore, the vacuum level after evacuation by the vacuum device is less than 100 Pa; the pressure range of the pressurizing device is greater than 2000 bar.
[0026] This invention provides an apparatus and method for preparing porous membranes. By using a vacuum device to remove air from the pores of the porous membrane from the side and applying high pressure to the upper surface of the porous membrane, a precursor is effectively infiltrated into the porous membrane. This improves the density and electrical properties of the porous membrane. The method is not only simple in design and easy to operate, but also reusable and highly compatible. Compared with traditional methods for preparing porous membrane materials, it is lower in cost, easier to operate, and can significantly improve the density and electrical properties of the porous membrane. It solves the technical problems of low density and poor electrical properties in existing porous membranes. Attached Figure Description
[0027] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0028] Figure 1 This is a schematic diagram of the structure of an apparatus for preparing a dielectric film according to an embodiment of the present invention;
[0029] Figure 2 A schematic diagram showing the positional relationship between the substrate, porous membrane, and precursor provided in an embodiment of the present invention;
[0030] Figure 3 This is a schematic flowchart of a method for preparing a dielectric membrane provided by the present invention;
[0031] Figure 4 This is a schematic flowchart of another method for preparing a dielectric membrane provided by the present invention.
[0032] The attached diagram lists the components represented by each number as follows:
[0033] 1-Housing, 2-Second seal, 3-Handle wheel, 4-Lifting shaft, 5-Lower cover plate, 6-Bellbell, 7-Platform, 8-Substrate, 9-Porous diaphragm, 10-Precursor, 11-First seal, 12-Third seal, 13-Bolt, 14-Vacuum valve, 15-Vacuum device, 16-Pressure device, 17-Opening. Detailed Implementation
[0034] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.
[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0036] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0037] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0038] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0039] Porous diaphragm materials have wide applications in acoustic transducers, electronic devices, MEMS actuators, and sensors, where high electrical performance is required. Existing methods for fabricating porous diaphragms often result in diaphragms with numerous pores. Since these pores affect the electrical performance of the diaphragm, developing a more compact dielectric diaphragm with improved electrical properties is of great significance in the fields where porous diaphragm materials are used. Porous diaphragms are also known as dielectric diaphragms.
[0040] Therefore, the present invention provides an apparatus for preparing dielectric films, such as... Figure 1-2 As shown, the device includes: a housing 1 with an opening 17, a first seal 11, a top cover, a pressurizing device 16, a lifting platform, a second seal 2, and a vacuum device 15. The first seal 11 is disposed on the inner surface of the housing 1; the first seal 11 is fixedly disposed around the opening 17; one end of the top cover is movably connected to the opening 17 of the housing 1, and the other end is sealed to the pressurizing device 16; the lifting platform passes through the housing 1 opposite to the opening 17 and corresponds to the opening 17; the second seal 2 is disposed where the lifting platform passes through the housing 1; after the lifting platform is raised, it is in close contact with the first seal 11; the vacuum device 15 is sealed to the housing 1; it should be noted that the housing 1, vacuum device 15, top cover, pressurizing device 16, lifting platform, and second seal 2 form a sealed space; within this sealed space, air is extracted from the pores of the porous membrane 9, and the precursor 10 is pressurized and infiltrated into the pores to obtain a high-performance dielectric membrane.
[0041] Compared with the prior art, this solution can effectively penetrate the precursor 10 into the porous membrane 9 by removing air from the pores of the porous membrane 9 from the side using the vacuum device 15 and applying high pressure to the upper surface of the porous membrane 9, thereby improving the compactness and electrical properties of the porous membrane 9. The precursor 10 is a gel or its solidified product that can penetrate into the porous membrane 9.
[0042] In a further preferred embodiment, the housing 1 may be a cylindrical housing 1 with bosses on both the upper and lower surfaces; wherein, the opening 17 is located on the upper boss; and a third sealing element 12 is provided at the connection between the upper boss and the upper cover plate.
[0043] It should be noted that in other preferred embodiments, the shell 1 may also be a shell 1 with a rectangular or other regular or irregular shape in cross section, and the shape of the opening 17 may also be set as a rectangle or other regular or irregular shape.
[0044] In a further preferred embodiment, the upper cover plate is detachably connected to the housing 1; wherein, the upper cover plate has a recess corresponding to the upper boss; specifically, the shape of the upper cover plate can correspond to the shape of the upper boss, and the interface between the upper cover plate and the upper boss is a recess. The connection with the boss is a detachable link, which can be connected by bolts 13 or by a quick-plug connection. After the precursor 10 is dripped into the opening 17, the upper cover plate is then connected to the housing 1. Preferably, a third sealing element 12 is provided on the outer edge of the upper boss. When the upper cover plate and the housing 1 are connected through the upper boss, the end face of the recess of the upper cover plate is tightly fitted with the third sealing element 12, thereby achieving a sealing effect.
[0045] In another optional embodiment, it may further include: a lower cover plate 5, wherein the lower cover plate 5 has a groove corresponding to the lower boss of the housing 1, and is fitted over the lower boss; both the lower cover plate 5 and the lower boss are provided with holes. In specific applications, the lifting platform passes through the holes provided in the lower cover plate 5 and the lower boss and is assembled with the housing 1. Preferably, the holes on the lower cover plate 5 and the lower boss are the same size and their geometric center lines coincide. It should be noted that the device for preparing the dielectric membrane provided in this application can be fixed on the operating plane by the lower cover plate 5, which plays a role in stabilizing the device. The operating plane plays a supporting or fixing role for the device. Preferably, the lower cover plate 5 is provided with bolt holes, and is movably connected to the operating plane by bolts.
[0046] The lifting platform includes a platform 7, a lifting shaft 4, a handle wheel 3, and a bellows 6. The platform 7 is used to hold the porous diaphragm 9. The lower surface of the platform 7 is fixedly connected to the lifting shaft 4, which has a lifting function, allowing the platform 7 to rise or fall. A handle wheel 3 is located at the other end of the lifting shaft 4, fitted onto the shaft. The inner surface of the handle wheel 3 and the outer surface of the lifting shaft 4 have corresponding threads. Rotating the handle wheel 3 in different directions controls the rise or fall of the lifting shaft 4. The bellows 6 is fitted onto the lifting shaft 4, with a certain gap between them. One end of the bellows 6 is fixedly connected to the lower surface of the platform 7, and the other end is fixedly connected to the inner wall of the lower boss. When the platform 7 rises or falls under the control of the handle wheel 3, the bellows 6 also rises or falls simultaneously with the platform 7.
[0047] In a preferred embodiment, a vacuum valve 14 is provided on the side wall of the housing 1, and the vacuum valve 14 is hermetically connected to the vacuum device 15. The vacuum device 15 can be controlled to create a vacuum within the housing 1 by opening or closing the vacuum valve 14, ensuring the vacuum level required for the operation of the device. Preferably, the vacuum level required for the operation of the device is less than 100 Pa, and the pressure range of the pressurizing device 16 should be greater than 2000 bar. It should be noted that when the applied pressure is sufficiently high, the precursor 10 permeates into the pores of the porous membrane 9. After the precursor 10 gels and solidifies, the pores within the porous membrane 9 are filled with the precursor 10, thereby obtaining a more compact dielectric membrane.
[0048] In another preferred embodiment, the precursor is identical to or similar in chemical composition to the porous membrane material.
[0049] This invention also provides a method for preparing a dielectric membrane, such as... Figure 3 As shown, it includes the following steps:
[0050] Step S101: Place the porous diaphragm on the platform and adjust the lifting of the platform by using the handle wheel to make the porous diaphragm fit tightly against the first seal.
[0051] Specifically, the porous diaphragm is placed directly on the surface of the platform. The lifting platform is raised by rotating the handle wheel until the porous diaphragm on the platform comes into close contact with the first sealing element, which is located on the inner surface of the housing and fixed around the opening, achieving a sealed state. At this point, rotating the handle wheel is stopped. It should be noted that the surface area of the porous diaphragm is larger than the area enclosed by the first sealing element.
[0052] Step S102: A precursor is dropped onto the upper surface of the porous membrane from the open end, wherein the precursor is uniformly distributed on the upper surface of the porous membrane.
[0053] In this step, a precursor is dropped onto the surface of the porous membrane through the opening of the shell. Preferably, the precursor dropped onto the surface of the porous membrane should be evenly distributed on the porous membrane.
[0054] Step S103: Seal the upper cover plate to the housing.
[0055] After completing steps 101 and 102, the upper cover plate is sealed to the housing. It should be noted that the upper cover plate and the housing can be sealed together by means of bolts 13 or pluggable connection; preferably, a third sealing element is provided at the connection between the upper cover plate and the housing to ensure the airtightness of the connection.
[0056] Step S104: The air inside the porous membrane is extracted using a vacuum device;
[0057] After completing step S103, the vacuum device can be turned on to evacuate the inside of the housing. At this time, due to the pressure change inside the housing, the air remaining in the pores of the porous membrane will be discharged from the inside of the porous membrane. Preferably, a vacuum valve is installed at the connection between the vacuum device and the housing to control the vacuum level inside the housing; more preferably, the vacuum level inside the housing is controlled below 100 Pa.
[0058] In step S105, pressure is applied to the precursor by a pressurizing device to make it permeate into the pores of the porous membrane, thereby obtaining a dielectric membrane.
[0059] After completing step S104, the pressurizing device can be activated to apply pressure to the precursor dripped onto the porous membrane. When the applied pressure is sufficiently high, the precursor permeates into the pores of the porous membrane. After the precursor gel solidifies, the pores within the porous membrane are filled with the precursor, thus obtaining a dielectric membrane with higher density. It should be noted that the pressurizing device provided in this scheme applies pressures greater than 2000 bar.
[0060] Optionally, in step S105, after applying pressure to the precursor using a pressurizing device to allow it to permeate into the pores of the porous membrane to obtain the dielectric membrane, the process further includes:
[0061] Step S106: Place the permeated dielectric membrane on a spin coater to remove excess precursor from its surface, and then perform heat treatment to obtain a dielectric membrane with excellent performance. It should be noted that the spin coater can be used to repeat the processing operation on the porous membrane multiple times to obtain a dielectric membrane with even better performance.
[0062] This invention also provides a method for preparing a dielectric membrane, such as... Figure 4 As shown, it includes the following steps:
[0063] Step S201: A porous membrane with a substrate is prepared by screen printing, powder metallurgy, sol-gel method, magnetron sputtering, 3D printing or electroplating.
[0064] Step S202: Place the porous membrane with substrate on the platform, and adjust the lifting of the platform by using the handle wheel to make the porous membrane fit tightly against the first seal.
[0065] Specifically, a porous diaphragm is placed on the upper surface of the substrate. The handle of the lifting platform is rotated to raise the platform until the porous diaphragm on the substrate comes into close contact with the first sealing element, which is located on the inner surface of the housing and fixed around the opening, achieving a sealed state. At this point, the rotation of the handle is stopped. It should be noted that the surface area of the porous diaphragm is larger than the area enclosed by the first sealing element.
[0066] Step S203: A precursor is dropped onto the upper surface of the porous membrane from the opening, wherein the precursor is uniformly distributed on the upper surface of the porous membrane.
[0067] In this step, a precursor is dropped onto the surface of the porous membrane through the opening of the shell. Preferably, the precursor dropped onto the surface of the porous membrane should be evenly distributed on the porous membrane.
[0068] Step S204: Seal the upper cover plate to the housing.
[0069] After completing steps 201 to 203, the upper cover plate is sealed to the housing. It should be noted that the upper cover plate and the housing can be sealed together by means of bolts 13 or pluggable connection; preferably, a third sealing element is provided at the connection between the upper cover plate and the housing to ensure the airtightness of the connection.
[0070] Step S205: The air inside the porous membrane is extracted using a vacuum device;
[0071] After completing step S204, the vacuum device can be turned on to evacuate the inside of the housing. At this time, due to the pressure change inside the housing, the air remaining in the pores of the porous membrane will be discharged from the inside of the porous membrane. Preferably, a vacuum valve is installed at the connection between the vacuum device and the housing to control the vacuum level inside the housing; more preferably, the vacuum level inside the housing is controlled below 100 Pa.
[0072] In step S206, pressure is applied to the precursor using a pressurizing device to allow it to permeate into the pores of the porous membrane, thereby obtaining a dielectric membrane.
[0073] After step S205, the pressurizing device can be activated to apply pressure to the precursor dripped onto the porous membrane. When the applied pressure is sufficiently high, the precursor permeates into the pores of the porous membrane. After the precursor gel solidifies, the pores within the porous membrane are filled with the precursor, thus obtaining a dielectric membrane with higher density. It should be noted that the pressurizing device provided in this scheme applies pressures greater than 2000 bar.
[0074] Optionally, in step S206, after applying pressure to the precursor using a pressurizing device to allow it to permeate into the pores of the porous membrane to obtain the dielectric membrane, the process further includes:
[0075] Step S207: Place the permeated dielectric membrane on a spin coater to remove excess precursor from its surface, and then perform heat treatment to obtain a dielectric membrane with excellent performance. It should be noted that the spin coater can be used to process the porous membrane multiple times to obtain a dielectric membrane with even better performance.
[0076] This invention provides an apparatus and method for preparing porous membranes. By using a vacuum device to remove air from the pores of the porous membrane from the side and applying high pressure to the upper surface of the membrane, a precursor is effectively infiltrated into the porous membrane. This improves the density and electrical properties of the porous membrane. The method is not only simple in design and easy to operate, but also reusable and highly compatible. Compared with traditional methods for preparing porous membrane materials, it is low-cost, easy to operate, and can significantly improve the density and electrical properties of porous membranes, thus possessing broad application prospects.
[0077] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.
Claims
1. An apparatus for preparing dielectric membranes, used to prepare porous membranes into dielectric membranes, characterized in that, include: A housing with an opening, wherein a first sealing element is provided on the inner surface of the housing; wherein the first sealing element is fixedly disposed around the opening; The top cover plate is movably connected at one end to the opening of the housing, and the other end is sealed to the pressurization device. A lifting platform passes through and corresponds to a housing opposite to the opening; a second seal is provided where the lifting platform passes through the housing; after the lifting platform is raised, the lifting platform comes into close contact with the first seal. The vacuum device is hermetically connected to the housing; The shell, top cover, first seal, lifting platform and second seal are connected to form a closed space; the air in the pores of the porous membrane is extracted in the closed space and the precursor is high pressure infiltrated into the pores to obtain the medium membrane. The shell is a cylindrical shell with bosses on both the upper and lower surfaces; The lower cover plate has a groove corresponding to the lower boss of the housing and is sleeved on the lower boss; The lifting platform includes: a platform; a lifting shaft, one end of which is connected to the platform to control the lifting or lowering of the platform; a handle wheel, located at the other end of the lifting shaft to control the lifting or lowering of the lifting shaft; and a bellows, sleeved on the outside of the lifting shaft, wherein one end is connected to the platform and the other end is connected to the lower boss of the housing.
2. The device according to claim 1, characterized in that, The opening is located on the upper protrusion; A third sealing element is provided at the connection between the upper boss and the upper cover plate.
3. The device according to claim 2, characterized in that, The upper cover plate is detachably connected to the housing; wherein, the upper cover plate has a recess corresponding to the upper boss; The third sealing element is disposed on the outer edge of the upper boss and fits tightly against the end face of the recess.
4. The device according to claim 2, characterized in that, Also includes: Both the lower cover plate and the lower boss are provided with holes, and the holes on the lower cover plate and the lower boss are the same size and their geometric center lines coincide.
5. The device according to claim 3, characterized in that, A vacuum valve is provided on the side wall of the housing, and the vacuum valve is connected to the vacuum device in a sealed manner.
6. The device according to claim 1, characterized in that, The precursor is identical to or has a similar chemical composition to the porous membrane material.
7. A method for preparing a dielectric membrane using the apparatus for preparing a dielectric membrane according to claim 1, characterized in that, Includes the following steps: The porous membrane is placed on the platform, and the platform is raised or lowered by adjusting the handle wheel so that the porous membrane is in close contact with the first sealing member; The precursor is dropped onto the upper surface of the porous membrane from an open end, wherein the precursor is uniformly distributed on the upper surface of the porous membrane; The upper cover plate is sealed to the housing. The air inside the porous membrane is extracted using the vacuum device. The precursor is pressurized by the pressurizing device, causing it to permeate into the pores of the porous membrane to obtain a dielectric membrane.
8. A method for preparing a dielectric membrane using the apparatus for preparing a dielectric membrane according to claim 1, characterized in that, Includes the following steps: The porous membrane and the substrate are prepared by screen printing, powder metallurgy, sol-gel method, magnetron sputtering, 3D printing or electroplating to obtain the porous membrane with the substrate. The porous membrane with the substrate is placed on the platform, and the lifting of the platform is adjusted by the handle wheel so that the porous membrane is in close contact with the first sealing member; The precursor is dropped onto the upper surface of the porous membrane from the opening, wherein the precursor is uniformly distributed on the upper surface of the porous membrane; The upper cover plate is sealed to the housing. The air inside the porous membrane is extracted using the vacuum device. The precursor is pressurized by the pressurizing device, causing it to permeate into the pores of the porous membrane to obtain a dielectric membrane.
9. The method according to any one of claims 7 to 8, characterized in that, The vacuum device evacuates to a vacuum level of less than 100 Pa. The pressure range of the pressurizing device is greater than 2000 bar.