A plating structure and a plating method

CN116516451BActive Publication Date: 2026-06-19CHONGQING JIMAT NEW MATERIAL TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
CHONGQING JIMAT NEW MATERIAL TECH CO LTD
Filing Date
2023-04-14
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

In existing technologies, the thin film has a large area exposed to air during the process of being transferred from one electroplating tank to another, which leads to oxidation and affects product quality.

Method used

An anti-oxidation plating tank is set between two adjacent electroplating tanks. The height of the anti-oxidation plating tank is higher than that of the electroplating tank. Upper and lower anode plates and conductive rollers are set in the anti-oxidation plating tank to form an electroplating circuit. The film is then electroplated in the anti-oxidation plating tank.

Benefits of technology

It reduces the surface area of ​​the film exposed to air, improves electroplating efficiency and product quality, avoids the risk of film oxidation and hole burning, increases coating thickness, and improves uniformity.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention provides an electroplating structure and an electroplating method. The electroplating structure includes a plurality of electroplating tanks arranged sequentially, and an anti-oxidation plating tank disposed between two adjacent electroplating tanks, wherein the anti-oxidation plating tank is installed at a higher height than the electroplating tanks. This embodiment of the invention, by providing an anti-oxidation plating tank between two adjacent electroplating tanks instead of traditional rollers or tension rollers, avoids the problem of a large surface area of ​​the film exposed to air during the process of moving from one electroplating tank to another, which could lead to film oxidation and reduced product quality.
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