Batch soldering tooling and method for a MEMS circulator

Abstract

The application is suitable for the technical field of MEMS circulator production, and provides a batched eutectic tooling and method for a MEMS circulator. The batched eutectic tooling comprises a stacking limiting structure, a magnetic force applying structure and a handheld structure. The stacking limiting structure is provided with recesses and positioning holes in an arrayed distribution. Each recess is used for containing a stacking structure. The magnetic force applying structure is located above the stacking limiting structure and is used for placing permanent magnets on the stacking structure. The magnetic force applying structure is provided with multiple groups of magnet positioning holes. Permanent magnets are placed in the multiple groups of magnet positioning holes. Each group of magnet positioning holes is opposite to the stacking structure. The magnetic force applying structure is aligned with the positioning holes of the stacking limiting structure through positioning pins. The handheld structure is located above the magnetic force applying structure and is used for applying pressure to the stacking structure. The batched eutectic tooling can reduce the operation difficulty of stacking and fixing the MEMS circulator and realize batch production of the MEMS circulator.

Description

Technical Field

[0001] This application belongs to the field of MEMS circulator manufacturing technology, and particularly relates to a tooling and method for batch eutectic bonding of MEMS circulators. Background Technology

[0002] The circulator is a core component at the front end of a radar transceiver assembly. Traditional miniaturized microstrip circulators suffer from high losses and low power capacity, significantly reducing the transmit power and detection accuracy of the transceiver assembly and severely impacting the overall performance of the radar system. MEMS circulators, with their outstanding advantages of wide bandwidth, high power, low loss, miniaturization, and high consistency, are of great significance to the future development of weapon systems and have broad application prospects.

[0003] To ensure effective heat dissipation under high power conditions, MEMS circulators typically employ high-temperature solder eutectic bonding of the chip and heat sink, with a structural form as follows: Figure 1 As shown. Before sintering, ferrite is pre-placed into the bottom cavity reserved on the chip, and solder and heat sink carrier are stacked below in sequence. After sintering, the chip surface, ferrite surface, and heat sink carrier surface must be parallel, and the solder must completely fill the space between the chip and the heat sink carrier. The eutectic sintering void ratio is low, and the chip is finally achieved with qualified eutectic bonding.

[0004] Currently, permanent magnets are used to achieve the stacking and fixation between chips, ferrite, solder, and heat sink carriers, such as... Figure 2 As shown, it provides extrusion pressure when the solder melts at high temperature to ensure welding height and solder wetting effect. However, placing permanent magnets on top of the stacked structure requires pre-fixing of the chip and other structures. After fixing, the combined structure needs to be placed in the sintering furnace. Existing methods are difficult to operate when stacking and fixing, and the production process can only be carried out manually one by one, which takes a long time and cannot meet the requirements of mass production. Summary of the Invention

[0005] To overcome the problems existing in related technologies, this application provides a tooling and method for batch eutectic bonding of MEMS circulators, which can reduce the operational difficulty of stacking and fixing MEMS circulators and realize the mass production of MEMS circulators.

[0006] This application is achieved through the following technical solution:

[0007] In a first aspect, embodiments of this application provide a batch eutectic method for MEMS circulators, including: a stacked limiting structure, a magnetic force application structure, and a handheld structure;

[0008] The stacking limiting structure is provided with grooves and positioning holes arranged in an array. Each groove is used to hold the stacking structure, which includes a heat sink carrier, solder, ferrite and chip filled in sequentially from top to bottom.

[0009] The magnetic force application structure is located above the stacking limiting structure and is used to place permanent magnets on the stacking structure. The magnetic force application structure is provided with multiple sets of magnet positioning holes. Permanent magnets are placed in the multiple sets of magnet positioning holes. Each set of magnet positioning holes is directly opposite the stacking structure. The permanent magnets are used to apply magnetic force to the stacking structure. The magnetic force application structure is aligned with the positioning holes of the stacking limiting structure through positioning pins.

[0010] The handheld structure is located above the magnetic force application structure and is used to apply pressure to the magnetic force application structure, which then transmits the pressure to the stacked structure.

[0011] In one possible implementation of the first aspect, the magnetic force application structure includes a connecting plate, an upper fixing plate, an intermediate fixing plate, and a lower limiting plate arranged sequentially from top to bottom;

[0012] The upper fixing plate is provided with multiple first through holes and multiple first threaded holes; the middle fixing plate is provided with multiple first through holes and multiple first threaded holes; the connecting plate is provided with multiple first through holes and multiple second threaded holes;

[0013] The upper fixing plate and the middle fixing plate are fixed together through the first threaded hole, and the connecting plate and the upper fixing plate are fixed together through the second threaded hole; multiple first connecting bolts pass through the first through holes of the connecting plate, the upper fixing plate and the middle fixing plate from top to bottom.

[0014] In one possible implementation of the first aspect, the handheld structure includes a handheld plate and a knob;

[0015] The knob is located above the handheld panel;

[0016] The two ends of the first connecting bolt are connected to the hand-held plate and the lower limiting plate, respectively. The connecting plate, the upper fixing plate and the middle fixing plate slide up and down along the first connecting bolt.

[0017] In one possible implementation of the first aspect, a second through hole is provided on the handheld plate;

[0018] The second connecting bolt passes through the second through hole, and its two ends are fixed to the knob and the connecting plate, respectively.

[0019] In one possible implementation of the first aspect, the intermediate fixing plate is provided with multiple third through holes, the lower limiting plate is provided with multiple magnet positioning holes, and a material plate is embedded between the upper fixing plate and the intermediate fixing plate;

[0020] The permanent magnet is fixed to the material plate through the third through hole and the magnet positioning hole.

[0021] In one possible implementation of the first aspect, the locating pin is disposed on the lower limiting plate, the size of which is not smaller than the size of the entire area where the stacked structure is placed.

[0022] In one possible implementation of the first aspect, the distance between the two grooves of the beam is greater than 10 mm.

[0023] Secondly, embodiments of this application provide a packaging method for a batch eutectic method of MEMS circulators, implemented using a batch eutectic tooling for MEMS circulators as described in the first aspect, including:

[0024] A stacked structure is filled into the groove of the stacking limiting structure. The stacked structure includes a heat sink carrier, solder, ferrite and chip, which are filled from top to bottom.

[0025] A permanent magnet is placed on a stacked structure using a magnetic force application structure, and the positioning pin is aligned with the positioning hole of the stacking limiting structure; the permanent magnet applies magnetic force to the stacked structure; the magnetic force application structure is provided with multiple sets of magnet positioning holes; permanent magnets are placed in the multiple sets of magnet positioning holes; each set of magnet positioning holes is directly opposite the stacked structure;

[0026] The handheld structure applies pressure to the magnetically applied structure, thereby compressing and stacking the structure.

[0027] A stacked limiting structure and a magnetic application structure containing multiple stacked structures are placed in a sintering furnace to perform eutectic crystallization of the stacked structures.

[0028] In one possible implementation of the second aspect, a permanent magnet is placed on a stacked structure using a magnetic force application structure, and a positioning pin is aligned with a positioning hole in the stacked limiting structure, including:

[0029] Turn the knob on the handheld structure to slide the upper fixed plate and the middle fixed plate upward along the first connecting bolt, so that the permanent magnet and the lower limiting plate are separated by a preset distance;

[0030] Press the lower limiting plate onto the stacked structure and align the positioning pins with the positioning holes of the stacked limiting structure;

[0031] The upper fixing plate and the middle fixing plate slide downward along the first connecting bolt, causing the permanent magnet to pass through the magnet positioning hole of the lower limiting plate and be placed on the stacked structure.

[0032] In one possible implementation of the second aspect, the batch eutectic method for MEMS circulators further includes: after the eutectic of the stacked structure is completed, rotating a knob on the handheld structure to separate the permanent magnet from the stacked structure;

[0033] Rotating the knob on the handheld structure separates the permanent magnet from the stacked structure, including:

[0034] Turn the knob on the handheld structure to slide the upper fixed plate and the middle fixed plate upward along the first connecting bolt, causing the permanent magnet to pass through the magnet positioning hole of the lower limiting plate, with the permanent magnet and the lower limiting plate separated by a preset distance;

[0035] Lift the lower limiting plate that is pressing on the stacked structure.

[0036] It is understandable that the beneficial effects of the second aspect mentioned above can be found in the relevant descriptions in the first aspect mentioned above, and will not be repeated here.

[0037] The beneficial effects of the embodiments in this application compared with the prior art are:

[0038] In this embodiment, the combination of a stacking limiting structure, a magnetic application structure, and a handheld structure enables the batch stacking of heat sink carriers, solder, ferrite, and chips in one go. By setting positioning structures such as positioning pins, positioning holes, and magnet positioning holes on the magnetic application structure and the stacking limiting structure, the stacking of raw materials before and after sintering can be ensured to be stable and will not shift horizontally during the transfer or production process, causing misalignment and skewness. This reduces the operational difficulty of stacking and fixing MEMS circulators and enables the mass production of MEMS circulators.

[0039] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this specification. Attached Figure Description

[0040] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0041] Figure 1 This is a schematic diagram of the structural form of a MEMS circulator provided in one embodiment of this application;

[0042] Figure 2 This is a schematic diagram of the stacking and fixing of permanent magnets and stacked structures according to an embodiment of this application;

[0043] Figure 3 This is a schematic diagram of the structure of a batch eutectic fixture for MEMS circulators provided in one embodiment of this application;

[0044] Figure 4 This is a schematic diagram of the magnetic force application structure provided in one embodiment of this application;

[0045] Figure 5This is a schematic flowchart of a batch eutectic method for MEMS circulators provided in an embodiment of this application. Detailed Implementation

[0046] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0047] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0048] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0049] As used in this application specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if detected [the described condition or event]" may be interpreted, depending on the context, as meaning "once determined," "in response to determination," "once detected [the described condition or event]," or "in response to detection [the described condition or event]."

[0050] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0051] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0052] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0053] Figure 3 This is a schematic diagram of the structure of a batch eutectic fixture for a MEMS circulator provided in one embodiment of this application. (Refer to...) Figure 3 The detailed description of the batch eutectic tooling for this MEMS circulator is as follows:

[0054] The batch eutectic fixture for the MEMS circulator includes: a stacking limiting structure 100, a magnetic application structure 200, and a handheld structure 300.

[0055] The stacking limiting structure 100 is provided with an array of grooves 101 and positioning holes 102. Each groove 101 is used to hold the stacking structure 400. The stacking structure 400 includes a heat sink carrier, solder, ferrite and chip, which are filled in sequentially from top to bottom.

[0056] The magnetic force application structure 200 is located above the stacking limiting structure 100, and is used to place permanent magnets on the stacking structure 400; the magnetic force application structure 200 is provided with multiple sets of magnet positioning holes 201, such as... Figure 4 As shown; permanent magnets are placed in multiple sets of magnet positioning holes 201; each set of magnet positioning holes 201 is directly opposite the stacking structure 400; the permanent magnets are used to apply magnetic force to the stacking structure 400; the magnetic force application structure 200 is aligned with the positioning hole 102 of the stacking limiting structure 100 through positioning pins 202.

[0057] The handheld structure 300 is located above the magnetic force application structure 200 and is used to apply pressure to the magnetic force application structure 200, and to transmit the pressure to the stacked structure 400 through the magnetic force application structure 200.

[0058] For example, the positioning holes 102 on the stacking limiting structure 100 correspond to the positioning pins 202 located at the bottom of the magnetic force application structure 200. Four positioning holes 102 can be provided, located at the edge of the upper surface of the stacking limiting structure 100. The positioning holes 102 ensure accurate alignment between the magnetic force application structure 200 and the stacking limiting structure 100, achieving the purpose of accurately placing the permanent magnet on the stacking structure 400.

[0059] By combining the stacking limiting structure 100, the magnetic application structure 200, and the handheld structure 300, heat sink carriers, solders, ferrites, and chips can be stacked in batches at once. By setting positioning structures such as positioning pins 202, positioning holes 102, and magnet positioning holes 201 on the magnetic application structure 200 and the stacking limiting structure 100, the stacking of raw materials before and after sintering can be ensured to be stable and will not shift horizontally during the transfer or production process, causing misalignment and skewness. This reduces the operational difficulty of stacking and fixing MEMS circulators and enables the mass production of MEMS circulators.

[0060] In one embodiment, the arrayed grooves 101 are sized to match the stacked structures 400 in multiple arrays, with each groove 101 having a single-side dimension 0-30 micrometers larger than the stacked structure 400. When placing the stacked structure 400, ensuring that each stacked structure 400 is close to the same side of its corresponding groove 101 prevents misalignment. Previously, manual alignment required manual correction under a microscope, which was difficult. Now, with batch eutectic fixtures, material is simply placed within the grooves 101, eliminating the need for correction.

[0061] For example, the spacing between two adjacent grooves 101 is greater than 10 mm, thereby ensuring that the spacing between chips in each stacked structure 400 is greater than 10 mm. In the existing manual operation of the stacked structure 400, the chips may shift and attract each other due to changes in the furnace atmosphere during the welding process. By setting the array of grooves 101 and the spacing between the grooves 101, the chip shifting or mutual attraction is prevented compared to the original manual operation.

[0062] In one embodiment, such as Figure 3 and Figure 4 As shown, the magnetic force application structure 200 includes a connecting plate 203, an upper fixing plate 204, a middle fixing plate 205 and a lower limiting plate 206 arranged sequentially from top to bottom.

[0063] For example, the upper fixing plate 204 is provided with a plurality of first through holes 2041 and a plurality of first threaded holes 2042, the middle fixing plate is provided with a plurality of first through holes 2041 and a plurality of first threaded holes 2042, and the connecting plate 203 is provided with a plurality of first through holes 2041 and a plurality of second threaded holes 2031. The upper fixing plate 204 and the middle fixing plate 205 are fixed together through the first threaded holes 2042, and the connecting plate 203 and the upper fixing plate 204 are fixed together through the second threaded holes 2031.

[0064] In one embodiment, the handheld structure 300 includes a handheld plate 301 and a knob 302; the knob 302 is disposed above the handheld plate 301.

[0065] For example, the knob 302 can be simply set as a bolt structure that can move up and down by rotation.

[0066] In one embodiment, a plurality of first connecting bolts 207 pass through the first through holes 2041 of the connecting plate 203, the upper fixing plate 204, and the middle fixing plate 205 from top to bottom. The two ends of the first connecting bolts 207 are connected to the hand-held plate 301 and the lower limiting plate 206, respectively. The connecting plate 203, the upper fixing plate 204, and the middle fixing plate 205 can slide up and down along the first connecting bolts 207 together.

[0067] The handheld plate 301 is provided with a second through hole 3011, and the second connecting bolt 208 passes through the second through hole 3011. The two ends of the second connecting bolt 208 are fixed to the knob 302 and the connecting plate 203 respectively. Thus, by rotating the knob 302, the distance between the connecting plate 203 and the handheld plate 301 can be adjusted. Then, the connecting plate 203 drives the upper fixing plate 204 and the middle fixing plate 205 to move up and down along the multiple first connecting bolts 207.

[0068] For example, the size of the connecting plate 203 is smaller than that of the upper fixing plate 204 and the middle fixing plate 205. Around the connecting plate 203, a plurality of first connecting bolts can pass through the first through holes of the upper fixing plate 204 and the middle fixing plate 205 sequentially from top to bottom to fix the upper fixing plate 204 and the middle fixing plate 205 together.

[0069] For example, the handheld plate 301 is also provided with a first through hole 2041, through which multiple first connecting bolts 207 can pass sequentially from top to bottom through the first through hole 2041 of the handheld plate 301, the connecting plate 203, the upper fixing plate 204, and the intermediate fixing plate 205. A gasket can also be provided between the connecting plate 203 and the upper fixing plate 204. One end of the first connecting bolt 207 passes through the handheld plate 301 and is fixed to the gasket, which can support the handheld plate 301.

[0070] In one embodiment, the intermediate fixing plate 205 is provided with multiple third through holes, and the lower limiting plate 206 is provided with multiple magnet positioning holes 201. The length of the lower limiting plate 206 is less than the length of the intermediate fixing plate 205. A material plate is embedded between the upper fixing plate 204 and the intermediate fixing plate 205. The material plate is used to fix the permanent magnet. The permanent magnet passes through the third through holes of the intermediate fixing plate 205 and the magnet positioning holes 201 of the lower limiting plate 206 and is fixed to the material plate.

[0071] For example, the size of the third through hole in the intermediate fixing plate 205 is adapted to the first connecting bolt 207, allowing the first connecting bolt 207 to pass through the third through hole and connect with the lower limiting plate 206. The material plate is a magnetic material, which can attract the permanent magnet passing through the third through hole of the intermediate fixing plate 205 and the magnet positioning hole 201 of the lower limiting plate 206 onto the magnetic material. By setting it as a magnetic material and fixing the permanent magnet by adsorption, it is easy to replace the permanent magnet.

[0072] Each set of magnet positioning holes 201 includes four magnet positioning holes 201. When the magnetic force application structure 200 is slowly lowered, the permanent magnet will move downwards along the magnet positioning holes 201. At this time, the permanent magnet will not be deflected due to the close proximity of the stacked structures 400.

[0073] For example, positioning pins 202 are disposed on the lower limiting plate 206, and are used to position the permanent magnet. The positioning pins 202 correspond to and engage with the positioning holes 102 on the stacking limiting structure 100. Four positioning pins 202 can be provided, located at the edge of the lower surface of the lower limiting plate 206. The positioning pins 202 ensure accurate alignment of the lower limiting plate 206 with the entire area where the stacked structure 400 is placed, and ensure that the lower limiting plate 206 completely covers the stacked structure 400. The positioning pins 202, combined with the magnet positioning holes 201, achieve the purpose of accurately placing the permanent magnet on the stacked structure 400.

[0074] In one embodiment, the size of the lower limiting plate 206 is not smaller than the size of the entire area where the stacked structure 400 is placed, ensuring that the lower limiting plate 206 can cover all the stacked structures 400. Before eutectic crystallization, the lower limiting plate 206 is used to press down the stacked structure 400. Rotating the knob 302 causes the upper fixing plate 204 and the middle fixing plate 205 to descend along the first connecting bolt 207, driving the permanent magnet down, preventing the stacked structure 400 from being attracted and rising by the magnet during the placement of the permanent magnet. After eutectic crystallization, the lower limiting plate 206 still presses down the stacked structure 400. Rotating the knob 302 causes the upper fixing plate 204 and the middle fixing plate 205 to rise along the first connecting bolt 207, driving the permanent magnet to rise slowly, separating the permanent magnet from the stacked structure 400, preventing the stacked structure 400 from being attracted and rising by the permanent magnet during the rising process.

[0075] In one embodiment, each groove 101 of the stacking limiting structure 100 corresponds to a set of permanent magnets. The set of permanent magnets includes four permanent magnets. The four permanent magnets generate a uniform magnetic force on the stacked structure 400 in the groove 101, ensuring that each ferrite is horizontal in the cavity. At the same time, each set of permanent magnets provides a force in the Z-axis direction to ensure that the solder fills the gaps, and finally achieves uniformity of welding height and sintering void ratio of the stacked structure 400, ensuring the stability of the MEMS circulator, the effect of planar parallelism, and the sintering void ratio.

[0076] In one embodiment, the connecting plate 203 and the upper fixing plate 204 are provided with a fourth through hole 209 to reduce the overall weight. Some devices have requirements on the total weight of the eutectic fixture. Too much weight will affect the number of chips. Therefore, the fourth through hole 209 is provided to reduce the overall weight of the eutectic fixture, which can, to a certain extent, increase the number of stacked structures 400 and improve the production efficiency of the circulator.

[0077] In one embodiment, a fixing screw 2061 is provided on the intermediate fixing plate 205. The fixing screw 2061 is located on both sides of the lower limiting plate 206 along its length and is provided at the four corners of the bottom surface of the main body of the magnetic force application structure 200. It is used to fix the magnetic force application structure 200 and the stacking limiting structure 100 together during sintering to prevent the magnetic force application structure 200 from separating from the stacking limiting structure 100. The fixing screw 2061 is removed after sintering is completed.

[0078] The fixing screw 2061 passes through the first threaded hole 2042 to fix the upper fixing plate 204 and the middle fixing plate 205 together. One end of the fixing screw 2061 protrudes from the bottom surface of the middle fixing plate 205 and is aligned with the limiting holes at the four corners of the stacking limiting structure 100, which also serves as a positioning function to ensure that the permanent magnet is accurately placed on the stacking structure 400.

[0079] As can be seen, the batch eutectic fixture for MEMS circulators in this embodiment achieves batch positioning of the chip, ferrite, solder, and permanent magnet structures through the stacking limiting structure 100. Simultaneously, the magnetic application structure 200 fixes the stacked structure 400, ensuring accurate and non-offset placement of the permanent magnets and enabling batch placement. Furthermore, it ensures that all permanent magnets are separated from the surface of the stacked structure 400 during disassembly. The positioning pins 202 ensure accurate alignment between the magnetic application structure 200 and the stacking limiting structure 100, further achieving accurate placement of the permanent magnets.

[0080] This batch eutectic fixture simplifies the placement of permanent magnets and enables batch placement. Simultaneously, it provides Z-axis force during welding to ensure welding quality, guaranteeing filler solder gaps and ultimately achieving uniform weld height and low sintering void ratio. This ensures the stability of the stacked structure 400, the effectiveness of planar parallelism, and low sintering void ratio.

[0081] This micro-batch eutectic fixture has advantages such as simple operation, batch processing of chips, and providing stable magnetic force at high temperatures.

[0082] Secondly, see Figure 5 This application provides a batch eutectic method for MEMS circulators, implemented using the batch eutectic tooling for MEMS circulators described above, including:

[0083] Step 501: Fill the groove of the stacking limiting structure with a stacking structure, the stacking structure including a heat sink carrier, solder, ferrite and chip filled in from top to bottom.

[0084] For example, manually stacking a single circulator is difficult, time-consuming, and prone to damaging the chip. The batch method of this application only requires placing the raw materials sequentially into the stacking limiting structure 100, saving multiple manual fixing operations and simplifying the process. Due to the presence of the stacking limiting structure 100, the stacking structure 400 will not be damaged due to displacement.

[0085] Step 502: Use the magnetic force application structure to place the permanent magnet on the stacked structure and align the positioning pin with the positioning hole of the stacked limiting structure; the permanent magnet applies magnetic force to the stacked structure; the magnetic force application structure is provided with multiple sets of magnet positioning holes; permanent magnets are placed in the multiple sets of magnet positioning holes; each set of magnet positioning holes is directly opposite the stacked structure.

[0086] Step 503: Apply pressure to the magnetic force application structure using the handheld structure, and squeeze the stacked structure through the magnetic force application structure.

[0087] Step 504: Place the stacked limiting structure and the magnetic application structure containing multiple stacked structures into the sintering furnace and perform eutectic treatment on the stacked structures.

[0088] For example, in step 502, the permanent magnet is placed on the stacked structure 400 using a magnetic force application structure, including: sliding the upper fixing plate 204 and the middle fixing plate 205 upward along the first connecting bolt 207, with the permanent magnet and the lower limiting plate 206 separated by a predetermined distance; pressing the lower limiting plate 206 onto the stacked structure 400 and aligning the positioning pin 202 with the positioning hole 102 of the stacked limiting structure 100; and sliding the upper fixing plate 204 and the middle fixing plate 205 downward along the first connecting bolt 207, causing the permanent magnet to pass through the magnet positioning hole 201 of the lower limiting plate 206 and be placed on the stacked structure 400.

[0089] For example, the attraction between the ferrite and the permanent magnet is less than the attraction between the magnetic force application structure 200 and the permanent magnet.

[0090] The magnetic attraction force exerted by structure 200 on the permanent magnet is expressed as follows:

[0091] F1=kB×2A (1)

[0092] Where k is the magnetic flux density, B is the magnetic flux density of the permanent magnet surface, and A is the effective area of ​​the ferrite relative to the magnetic structure.

[0093] The attractive force between the permanent magnet and the chip in the magnetic force application structure 200 is F2. However, the ferrite is separated from the surface of the permanent magnet by the thickness of the chip, so F2 > F1. At this time, the magnetic induction intensity B1 between the ferrite and the permanent magnet is less than the magnetic induction intensity B between the magnetic force application structure 200 and the permanent magnet.

[0094] Therefore, when the magnetic force application structure 200 is placed on the chip surface, the permanent magnet applies a fixed force F2 to the stacked structure 400.

[0095] When the attraction F2 between the chip and the permanent magnet is less than the attraction F between the magnetic force application structure 200 and the permanent magnet, the magnetic force application structure 200 needs to be separated from the stacking limiting structure 100 as the handheld structure 300 moves, thereby realizing the batch disassembly of the permanent magnet.

[0096] Therefore, the batch eutectic method for MEMS circulators also includes: after the eutectic of the stacked structure 400 is completed, rotating the knob 302 on the handheld structure 300 to separate the permanent magnet from the stacked structure 400.

[0097] Rotating the knob 302 on the handheld structure 300 to separate the permanent magnet from the stacked structure 400 includes: rotating the knob 302 on the handheld structure 300 to slide the upper fixing plate 204 and the middle fixing plate 205 upward along the first connecting bolt 207, causing the permanent magnet to pass through the magnet positioning hole 201 of the lower limiting plate 206, with the permanent magnet and the lower limiting plate 206 separated by a preset distance; and lifting the lower limiting plate 206 that is pressed on the stacked structure 400.

[0098] First, the lower limiting plate 206 is used to press down the stacked structure 400. With the lower limiting plate 206 stationary, the upper fixing plate and the middle fixing plate 205 are moved upward by rotating the knob 302 on the handheld structure 300. This causes the permanent magnet to move upward, separating the permanent magnet from the stacked structure 400 and preventing direct disassembly of the permanent magnet. The stacked structure 400 will be attracted away by the permanent magnet, thus realizing the batch disassembly of the permanent magnet.

[0099] In manual operation, only one chip can be placed and removed from its permanent magnet at a time, with a capacity of 300 chips per person per shift. However, using the batch eutectic method described in this application, permanent magnet placement and removal can be performed simultaneously in batches, with a capacity of 3000 chips per person per shift, reducing operation time, increasing capacity, and reducing costs.

[0100] The batch eutectic method for MEMS circulators provided in this embodiment is simple to operate and can be used in batches for placing permanent magnets. It effectively solves the problems of difficult batch fixing, disassembly, and long time consumption of stacked structures, ensuring a high yield of MEMS circulators while improving the production efficiency of MEMS circulators.

[0101] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0102] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A batch eutectic fixture for MEMS circulators, characterized in that, include: Stacked limiting structure, magnetic force application structure, and handheld structure; The stacking limiting structure is provided with an array of grooves and positioning holes. Each groove is used to hold the stacking structure, which includes a heat sink carrier, solder, ferrite and chip filled from bottom to top. The magnetic force application structure is located above the stacking limiting structure, and the magnetic force application structure is used to place the permanent magnet on the stacking structure; the magnetic force application structure is provided with multiple sets of magnet positioning holes; The permanent magnets are placed in multiple sets of magnet positioning holes; each set of magnet positioning holes is directly opposite the stacked structure; the permanent magnets are used to apply magnetic force to the stacked structure; the magnetic force application structure is aligned with the positioning holes of the stacking limiting structure via positioning pins; The handheld structure is located above the magnetic force application structure and is used to apply pressure to the magnetic force application structure, and to transmit the pressure to the stacked structure through the magnetic force application structure; The magnetic force application structure includes a connecting plate, an upper fixing plate, a middle fixing plate and a lower limiting plate arranged from top to bottom; The upper fixing plate is provided with a plurality of first through holes and a plurality of first threaded holes; the middle fixing plate is provided with the plurality of first through holes and the plurality of first threaded holes; the connecting plate is provided with a plurality of first through holes and a plurality of second threaded holes; The upper fixing plate and the middle fixing plate are fixed together through the first threaded hole, and the connecting plate and the upper fixing plate are fixed together through the second threaded hole; a plurality of first connecting bolts pass through the first through holes of the connecting plate, the upper fixing plate and the middle fixing plate from top to bottom; The intermediate fixing plate is provided with multiple third through holes, and the lower limiting plate is provided with multiple magnet positioning holes; a material plate is embedded between the upper fixing plate and the intermediate fixing plate; The permanent magnet is fixed to the material plate through the third through hole and the magnet positioning hole; The handheld structure includes a handheld panel and a knob; The knob is located above the handheld panel; The two ends of the first connecting bolt are respectively connected to the hand-held plate and the lower limiting plate, and the connecting plate, the upper fixing plate and the middle fixing plate slide up and down along the first connecting bolt.

2. The batch eutectic fixture for MEMS circulators as described in claim 1, characterized in that, The handheld plate is provided with a second through hole; The second connecting bolt passes through the second through hole, and both ends of the second connecting bolt are fixed to the knob and the connecting plate, respectively.

3. The batch eutectic fixture for MEMS circulators as described in claim 1, characterized in that, The positioning pin is disposed on the lower limiting plate, and the size of the lower limiting plate is not less than the size of the entire area where the stacked structure is placed.

4. The batch eutectic fixture for MEMS circulators as described in claim 1, characterized in that, The distance between two adjacent grooves is greater than 10 mm.

5. A batch eutectic method for MEMS circulators, characterized in that, The application of the batch eutectic fixture for MEMS circulators as described in any one of claims 1 to 4 includes: A stacked structure is filled into the groove of the stacking limiting structure, the stacked structure comprising a heat sink carrier, solder, ferrite and chip, which are filled from bottom to top; A permanent magnet is placed on the stacked structure using a magnetic force application structure, and a positioning pin is aligned with the positioning hole of the stacking limiting structure; the permanent magnet applies a magnetic force to the stacked structure; the magnetic force application structure is provided with multiple sets of magnet positioning holes; the permanent magnet is placed in the multiple sets of magnet positioning holes; each set of magnet positioning holes is directly opposite the stacked structure; The handheld structure applies pressure to the magnetically applied structure, thereby compressing and stacking the structure. The stacking limiting structure and the magnetic force application structure, which contain multiple stacked structures, are placed in a sintering furnace to perform eutectic crystallization on the stacked structures.

6. The batch eutectic method for MEMS circulators as described in claim 5, characterized in that, The method of placing a permanent magnet on the stacked structure using a magnetic force application structure and aligning the positioning pin with the positioning hole of the stacked limiting structure includes: Turn the knob on the handheld structure to slide the upper fixed plate and the middle fixed plate upward along the first connecting bolt, so that the permanent magnet and the lower limiting plate are separated by a preset distance; Press the lower limiting plate onto the stacked structure and align the positioning pin with the positioning hole of the stacked limiting structure; The upper fixing plate and the middle fixing plate slide downward along the first connecting bolt, causing the permanent magnet to pass through the magnet positioning hole of the lower limiting plate and be placed on the stacked structure.

7. The batch eutectic method for MEMS circulators as described in claim 6, characterized in that, Also includes: After the stacked structure is eutectic, rotate the knob on the handheld structure to separate the permanent magnet from the stacked structure; The method of rotating the knob on the handheld structure to separate the permanent magnet from the stacked structure includes: Rotate the knob on the handheld structure to slide the upper fixing plate and the middle fixing plate upward along the first connecting bolt, causing the permanent magnet to pass through the magnet positioning hole of the lower limiting plate, with the permanent magnet and the lower limiting plate separated by a preset distance; The lower limiting plate pressing on the stacked structure is lifted.

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