Heat dissipation device and projection device

Abstract

The embodiment of the present application provides a heat dissipation device and a projection device; wherein the heat dissipation device comprises a pipeline, a first heat sink and a second heat sink; the pipeline is filled with liquid metal; the first heat sink comprises a base and a plurality of vibrating ribs arranged on one side of the base, one side of the base away from the plurality of vibrating ribs is in contact with a target heat source, a flow channel is arranged in the base, the flow channel is connected with the pipeline to form a loop for the liquid metal to flow, and a position of the loop in contact with the base forms a hot end; the vibrating rib is a piezoelectric ceramic, under the electrified state, the vibrating rib generates vibration to dissipate heat for the target heat source; the second heat sink is arranged on the pipeline to form a cold end on the pipeline; the liquid metal flows in the loop to transport the heat absorbed from the hot end to the cold end to release. The heat dissipation device provided by the embodiment of the present application has excellent heat dissipation performance and can improve the display quality of the projection image.

Description

Technical Field

[0001] This application relates to the field of projection display technology, and more specifically, to a heat dissipation device and a projection device. Background Technology

[0002] With the increasing brightness of projectors, high-power LED projection optical engines are becoming more and more common. Currently, the luminous efficiency of LED light sources is only 10% to 30%, while 70% to 90% of the energy is converted into heat. As the power density and packaging density of LED products increase, this will cause a series of problems, such as wavelength shift due to internal chip heat, decreased light extraction efficiency, accelerated phosphor aging, and shortened lifespan. Therefore, it is essential to choose an effective heat dissipation solution when using high-power LED products.

[0003] Furthermore, the optical engine body also absorbs this heat and expands and deforms, causing the optical lenses inside the optical engine body to shift. This affects the deviation of the light path. When the optical lenses deviate significantly, the image projected by the projection optical engine will be blurry and unclear, resulting in thermal defocusing, which in turn affects the display quality of the projected image. In particular, it makes the display quality of the projection optical engine less than expected. Summary of the Invention

[0004] The purpose of this application is to provide a new technical solution for a heat dissipation device and a projection device.

[0005] Firstly, this application provides a heat dissipation device. The heat dissipation device includes:

[0006] Pipelines, the pipelines being filled with liquid metal;

[0007] The first heat sink includes a base and a plurality of vibrating ribs disposed on one side of the base. The side of the base away from the plurality of vibrating ribs is in contact with the target heat source. The base has a flow channel, which is connected to the pipeline to form a loop for the liquid metal to flow. The position where the loop contacts the base forms a hot end. The vibrating ribs are made of piezoelectric ceramic material. When energized, the vibrating ribs can vibrate to dissipate heat from the target heat source.

[0008] A second radiator is provided on the pipe to form a cold end on the pipe;

[0009] The liquid metal flows within the loop to transfer heat absorbed from the hot end to the cold end for release.

[0010] Optionally, the first heat sink is at least partially covered with a heat dissipation layer, which is made of metal; the thickness of the heat dissipation layer is ≤50μm.

[0011] Optionally, the base and the outer surface of each of the vibrating ribs are covered with a copper layer.

[0012] Optionally, a plurality of first radiators are provided, and the plurality of first radiators are spaced apart on the pipeline.

[0013] Optionally, an electromagnetic pump is provided on the pipeline to enable the liquid metal to circulate between the hot end and the cold end along the loop under the drive of Ampere force.

[0014] Optionally, the second heat sink includes a plurality of parallel and spaced-apart heat dissipation fins.

[0015] Optionally, the heat dissipation device further includes a centrifugal fan, and the air outlet direction of the centrifugal fan is parallel to the arrangement direction of the heat dissipation fins.

[0016] Optionally, the side of the base away from the vibrating rib is a support surface, which is used to support the target heat source.

[0017] Optionally, a thermally conductive layer is provided between the support surface and the target heat source, the thermally conductive layer being used to conduct the heat generated by the target heat source to the first heat sink.

[0018] Secondly, this application provides a projection device, the projection device comprising:

[0019] case;

[0020] A projection optical engine, comprising a target heat source, the target heat source comprising a light source or a chip; and

[0021] As described in the first aspect, the heat dissipation device is disposed within the housing, and the target heat source is in contact with the base of the first heat sink.

[0022] The beneficial effects of this application are as follows:

[0023] The heat dissipation device provided in this application embodiment can be applied to various types of projectors. Its hot end design uses vibrating fins on the first heat sink to accelerate the heat dissipation generated by the target heat source through vibration. At the same time, the vibration increases the convective heat transfer system, which achieves the first stage of cooling. Furthermore, the heat is transferred to the cold end by liquid metal and then released, which achieves the second stage of cooling. This enhances the heat exchange between the target heat source and the outside environment, making the entire heat dissipation device have better heat dissipation performance.

[0024] Other features and advantages of this specification will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0025] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of this specification and, together with their description, serve to explain the principles of this specification.

[0026] Figure 1 This is one of the structural schematic diagrams of the heat dissipation device provided in the embodiments of this application;

[0027] Figure 2 This is a second schematic diagram of the heat dissipation device provided in the embodiments of this application.

[0028] Explanation of reference numerals in the attached figures:

[0029] 1. Second radiator; 2. Electromagnetic pump; 21. Power supply positive and negative terminals; 3. Piping; 4. Centrifugal fan; 5. First radiator; 51. Base; 52. Vibrating fins; 53. Flow channel; 01. Target heat source. Detailed Implementation

[0030] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0031] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the scope of this application and its application or use.

[0032] Technologies and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such technologies and equipment should be considered part of the specification.

[0033] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0034] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0035] The heat dissipation device and projection device provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0036] According to one aspect of the embodiments of this application, a heat dissipation device is provided. The heat dissipation device is suitable for projection devices such as DLP digital projectors, and can effectively dissipate heat from various heat sources within the DLP digital projector, including but not limited to the light source and DLP chip.

[0037] This article will describe the heat dissipation device in a DLP digital projector as an example. However, it should be emphasized that the heat dissipation device provided in this application is not limited to DLP digital projectors, but can also be used in some electronic devices.

[0038] The heat dissipation device proposed in the embodiments of this application is described in [reference]. Figure 1 and Figure 2 The heat dissipation device includes: a pipe 3, a first radiator 5, and a second radiator 1. The pipe 3 is filled with liquid metal. The first radiator 5 includes a base 51 and multiple vibrating fins 52 disposed on one side of the base 51. The side of the base 51 facing away from the multiple vibrating fins 52 is in contact with the target heat source 01. A flow channel 53 is provided within the base 51, and the flow channel 53 is connected to the pipe 3 to form a loop for the liquid metal to flow through. The position where the loop contacts the base 51 forms a hot end. The vibrating fins 52 are made of piezoelectric ceramic material; when energized, the vibrating fins 52 can vibrate to dissipate heat from the target heat source 01. The second radiator 1 is disposed on the pipe 3 to form a cold end on the pipe 3. The liquid metal flows within the loop to transfer heat absorbed from the hot end to the cold end for release.

[0039] The heat dissipation device provided in the above embodiments of this application is applicable to various types of projectors, such as the aforementioned DLP digital projector. In the heat dissipation device's pipe 3, multiple vibrating fins 52 on the first heat sink 5 are designed for the hot end, using vibration to accelerate the heat dissipation generated by the target heat source 01. Simultaneously, vibration increases the convective heat transfer system, achieving the first stage of cooling. Furthermore, liquid metal carries away the heat from the hot end and transfers it to the cold end for release, thus achieving the second stage of cooling. This results in high heat dissipation efficiency and better heat dissipation effect of the heat dissipation device.

[0040] The heat dissipation device provided in the above embodiments of this application enhances the heat exchange between the target heat source 01 and the outside environment, resulting in superior heat dissipation performance for the entire heat dissipation device. The target heat source 01 is, for example, a component that generates a large amount of heat during operation and requires cooling, such as an LED light source or processing chip in a projection optical engine.

[0041] The first heat sink 5 is, for example, a piezoelectric heat sink, and the vibrating fins 52 on its base 51 are made of, for example, piezoelectric ceramic material. When the first heat sink 5 is energized, each of its vibrating fins 52 can vibrate at a certain frequency. Since the base 51 of the piezoelectric heat sink is installed outside the target heat source 01, the piezoelectric heat sink can not only conduct heat away through heat conduction, but also increase the convective heat transfer coefficient by vibrating to disrupt the thermal boundary layer, thereby enhancing the heat exchange between the target heat source 01 and the outside environment.

[0042] Piezoelectric ceramics are ceramic materials capable of converting mechanical energy into electrical energy and vice versa. The inverse piezoelectric effect refers to the phenomenon where, when an electric field is applied along the polarization direction of a dielectric material, the dielectric material undergoes mechanical deformation or stress in a specific direction, and these deformations or stresses disappear when the applied electric field is removed. When a high-frequency electrical signal is applied to a piezoelectric ceramic material, high-frequency mechanical vibrations are generated.

[0043] According to the above embodiments of this application, liquid metal is introduced into the loop of the heat dissipation device to achieve the heat dissipation effect. Compared with traditional non-metallic fluids such as water and air, the design using liquid metal can achieve superior heat dissipation performance. This is because the convective heat transfer coefficient of liquid metal is much higher than that of water; at the same time, liquid metal also has excellent stability, which can greatly expand the limit of heat flux density achievable by water cooling.

[0044] Since the luminous efficiency of LEDs in a projector is temperature-dependent, the overall brightness of the projector tends to decrease as the LED temperature rises, which affects the quality of the projected image. When the heat dissipation device provided in this embodiment is applied to a projector, the large amount of heat generated by the continuous illumination of the LEDs can be quickly dissipated, thus preventing the LEDs from operating at high temperatures. This helps extend the lifespan of the LEDs and also improves the quality of the projected image.

[0045] It should be emphasized that when filling the pipe 3 with liquid metal, the liquid metal should be filled to the maximum extent possible; otherwise, air entering the pipe 3 will reduce the heat dissipation efficiency.

[0046] Optionally, the liquid metal working medium in the pipeline 3 may be, for example, a gallium-based alloy. The gallium-based alloy has a melting point of 8°C, a curing temperature of -5°C, and a thermal conductivity of 30 W / (m·K), which is nearly 40 times that of water.

[0047] The base 51 of the first heat sink 5 is provided with a flow channel 53 for the flow of liquid metal, see [link to relevant documentation]. Figure 2The flow channel 53 and the pipe 3 can together form a loop for liquid metal flow. The position where this loop contacts the base 51 is the hot end, and the position where the loop contacts the second heat sink 1 is the cold end. See [link to relevant documentation]. Figure 1 The liquid metal can transfer the heat absorbed at the hot end to the cold end and release the heat at the cold end.

[0048] Optionally, the pipe 3 is connected to the base 51 of the first radiator 5 and the second radiator 1 by welding.

[0049] Optionally, the pipe 3 is made of metal.

[0050] According to some examples of this application, the first heat sink 5 is at least partially covered with a heat dissipation layer, which is made of metal. The thickness of the heat dissipation layer is ≤50μm.

[0051] The location where the base 51 of the first radiator 5 contacts the loop forms a hot end, for example, which can contact the target heat source 01. The technical solution provided in this application embodiment allows heat to be dissipated at the hot end using the vibration generated by the multiple vibrating fins 52 on the first radiator 5. According to the above example, by adding a heat dissipation layer to the outer surface of the first radiator 5, heat dissipation can be accelerated, which is advantageous for directly cooling the target heat source 01 at the hot end, thereby improving heat dissipation efficiency and effect.

[0052] Based on the above example, the thickness of the heat dissipation layer should be controlled within 50 μm. This is because the vibrating ribs are made of piezoelectric ceramic material, which will vibrate when energized. If the heat dissipation layer is designed to be too thick, for example, exceeding 50 μm, it will be detrimental to vibration.

[0053] Optionally, see Figure 2 For the first heat sink 5, the outer surface of the base 51 and each of the vibrating ribs 52 is covered with a copper layer.

[0054] Among them, copper has good thermal conductivity and low price, which can ensure that the first heat sink 5 has good heat dissipation performance without increasing production costs.

[0055] The thickness of the copper layer is no greater than 50 μm. This will not affect the vibration performance of the vibrating rib 52.

[0056] Based on some examples in this application, see Figure 1 The first radiator 5 is configured as a plurality of them, and the plurality of first radiators 5 are spaced apart on the pipe 3.

[0057] According to the heat dissipation device provided in the embodiments of this application, the first heat sink 5 is welded to the loop and is used to contact the target heat source 01, located at the hot end of the loop. In order to disperse the heat at the hot end and accelerate heat dissipation, a gap should be provided between the first heat sinks 5.

[0058] Based on some examples in this application, see Figure 1 An electromagnetic pump 2 is installed on the pipeline 3, which enables the liquid metal to circulate between the hot end and the cold end along the loop under the drive of Ampere force.

[0059] According to the example above in this application, the liquid metal in the pipe 3 is driven to flow by an electromagnetic pump 2. The liquid metal itself is conductive, allowing it to be driven by an electromagnetic drive with no moving parts, thus simplifying the structural design of the entire heat dissipation device.

[0060] For example, the electromagnetic pump 2 mainly consists of a magnet, electrodes, a fixed ring, a flow channel, and a housing. An electromagnetic pump is a pump capable of driving conductive fluids, characterized by its compact structure, high output pressure, leak-free operation, small size, and relatively low cost. In this application, the conductive fluid is liquid metal.

[0061] The electromagnetic pump contains no moving parts, is highly reliable, noiseless, and provides stable driving pressure.

[0062] In the embodiments of this application, the liquid metal flows through the interior of the electromagnetic pump 2, the liquid metal is placed in a magnetic field, and the two ends of the liquid metal are respectively connected to the positive and negative terminals 21 of the power supply. The liquid metal can start to flow under the action of Ampere force and absorb heat from the base 51 of the piezoelectric heat sink located at the hot end, and then release the heat at the cold end.

[0063] It should be noted that the location of the electromagnetic pump 2 on the pipeline 3 is related to the overall structural design of the machine.

[0064] In one example, see Figure 1 and Figure 2 The electromagnetic pump 2 can be located near the cold end. Of course, this is only an example and is not a limitation in this application.

[0065] See some examples in this application. Figure 1 The second heat sink 1 includes a plurality of heat dissipation fins that are parallel to each other and spaced apart.

[0066] The second heat sink 1 is located at the cold end of the loop and is used to release heat at the cold end to achieve heat dissipation. The heat dissipation fins therein can play a role in conducting heat.

[0067] See some examples in this application. Figure 1 The heat dissipation device also includes a centrifugal fan 4, and the air outlet direction of the centrifugal fan 4 is parallel to the arrangement direction of the heat dissipation fins.

[0068] The second radiator 1 includes, for example, multiple heat dissipation fins. The second radiator 1 is located at the cold end of the pipe 3. A centrifugal fan 4 is also introduced into the heat dissipation device. The centrifugal fan 4 can generate a large amount of cold air. The cold air generated by the centrifugal fan 4 is designed to blow directly towards the cold end where the second radiator 1 is located. This design enables the cold end to adopt a forced air cooling method, which is conducive to achieving more efficient heat dissipation.

[0069] In other words, a forced air cooling method is used at the cold end, where the airflow from the centrifugal fan 4 blows directly onto the heat dissipation fins, thereby increasing the airflow velocity on the surface of the heat dissipation fins to achieve efficient heat dissipation.

[0070] See some examples in this application. Figure 1 The side of the base 51 opposite to the vibrating rib 52 is a support surface, which is used to support the target heat source 01.

[0071] The target heat source 01 is a heat-generating device to be cooled, and its specific type is related to the application scenario of the heat dissipation device. When the heat dissipation device is used, for example, in a projector, the target heat source 01 is, for example, an LED substrate or a DLP chip.

[0072] In some examples of this application, a heat-conducting layer is provided between the support surface and the target heat source 01, and the heat-conducting layer is used to conduct the heat generated by the target heat source 01 to the first heat sink 5.

[0073] Based on the above example, the introduction of the thermally conductive layer can accelerate heat dissipation, thereby achieving a better heat dissipation effect. Optionally, the thermally conductive layer includes a thermally conductive pad or a thermally conductive gel.

[0074] The heat dissipation device provided in this application embodiment combines a piezoelectric heat sink and liquid metal to achieve efficient heat dissipation. The heat dissipation device integrates liquid metal, a centrifugal fan 4, an electromagnetic pump 2, and a piezoelectric heat sink, featuring low energy consumption, small size, and high reliability. This heat dissipation device can reduce the temperature of high-power LED lamps and the main optical engine in the projector, thereby extending the lifespan of the LED lamps and improving the display quality of the image.

[0075] According to another aspect of the embodiments of this application, a projection device is also provided.

[0076] The projection device includes a housing, a projection optical engine, and a heat dissipation device as described above. The projection optical engine includes a target heat source 01, which may include a light source or a chip. The heat dissipation device is disposed within the housing, and the target heat source 01 is in contact with the base 51 of the first heat sink 5.

[0077] The projection device provided in the embodiments of this application can be, for example, a DLP digital projector, or other projection devices. The embodiments of this application do not impose specific limitations on this.

[0078] The heat dissipation device provided in this application embodiment can also be applied in some electronic devices to achieve effective heat dissipation of heat-generating components within the electronic devices.

[0079] The specific implementation of the projection device in this application can refer to the above-described embodiments of the heat dissipation device. Therefore, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here.

[0080] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0081] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. A heat dissipation device, characterized in that, include: Pipeline (3), the pipeline (3) being filled with liquid metal; The first radiator (5) includes a base (51) and a plurality of vibrating ribs (52) disposed on one side of the base (51). The side of the base (51) away from the plurality of vibrating ribs (52) is in contact with the target heat source (01). The base (51) is provided with a flow channel (53). The flow channel (53) is connected to the pipe (3) to form a loop for the liquid metal to flow. The position where the loop contacts the base (51) forms a hot end. The vibrating ribs (52) are made of piezoelectric ceramic material. When energized, the vibrating ribs (52) can vibrate to dissipate heat from the target heat source (01). The first heat sink (5) is at least partially covered with a heat dissipation layer, which is made of metal and has a thickness of ≤50μm; The second radiator (1) is provided on the pipe (3) to form a cold end on the pipe (3); An electromagnetic pump (2) is installed on the pipeline (3). The electromagnetic pump (2) is used to enable the liquid metal to circulate between the hot end and the cold end along the loop under the drive of Ampere force. The liquid metal flows within the loop to transfer heat absorbed from the hot end to the cold end for release.

2. The heat dissipation device according to claim 1, characterized in that, The outer surfaces of the base (51) and each of the vibration ribs (52) are covered with a copper layer.

3. The heat dissipation device according to claim 1, characterized in that, The first radiator (5) is configured as a plurality of them, and the plurality of first radiators (5) are spaced apart on the pipe (3).

4. The heat dissipation device according to claim 1, characterized in that, The second heat sink (1) includes a plurality of heat dissipation fins that are parallel to each other and spaced apart.

5. The heat dissipation device according to claim 4, characterized in that, The heat dissipation device also includes a centrifugal fan (4), and the air outlet direction of the centrifugal fan (4) is parallel to the arrangement direction of the heat dissipation fins.

6. The heat dissipation device according to claim 1, characterized in that, The side of the base (51) away from the vibrating rib (52) is a support surface, which is used to support the target heat source (01).

7. The heat dissipation device according to claim 6, characterized in that, A heat-conducting layer is provided between the support surface and the target heat source (01), and the heat-conducting layer is used to conduct the heat generated by the target heat source (01) to the first heat sink (5).

8. A projection device, characterized in that, include: case; A projection optical engine, the projection optical engine including a target heat source (01), the target heat source (01) including a light source or a chip; and The heat dissipation device as described in any one of claims 1-7 is disposed within the housing, and the target heat source (01) is in contact with the base (51) of the first heat sink (5).

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