Intelligent power modules and electronic devices
By setting a bootstrap pad on the power supply voltage pin of the high-side drive chip of the intelligent power module and adjusting the setting of the high-side drive suspended power supply voltage pin, the chip layering problem caused by the setting of the boost diode in the prior art is solved, and the electrical connection stability and reliability are improved.
CN117673066BActive Publication Date: 2025-03-18HISENSE HOME APPLIANCES GRP CO LTD
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Patent Information
- Application Number
- CN202311644446.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-30
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2043-11-30
AI Technical Summary
Technical Problem
When setting up the boost diode, existing smart power modules can easily lead to layering of the chip and the bootstrap pad, affecting the robustness and reliability of the product, and poor stability of the lead settings.
Method used
Optimize the chip layout and enhance electrical connection stability by setting the bootstrap pad on the high-side drive chip supply voltage pin and adjusting the settings of the high-side drive suspended power supply voltage pin.
Benefits of technology
It improves the electrical connection stability and reliability of the smart power module, optimizes the chip layout, and improves the robustness of the product.
✦ Generated by Eureka AI based on patent content.
Abstract
The present invention discloses an intelligent power module and an electronic device, wherein the intelligent power module comprises: a driving pad, on which a high-voltage driving chip is arranged; a high-side driving chip power supply voltage pin, on which a bootstrap pad is arranged; a first high-side driving suspension power supply voltage pin, a second high-side driving suspension power supply voltage pin and a third high-side driving suspension power supply voltage pin, wherein the first high-side driving suspension power supply voltage pin and the second high-side driving suspension power supply voltage pin are both arranged at intervals with the bootstrap pad in the second direction, and the third high-side driving suspension power supply voltage pin is arranged at intervals on the side of the bootstrap pad in the first direction away from the low-voltage side driving pad. Thus, the chip layout of the intelligent power module can be optimized, which can not only improve the convenience of connecting the high-side driving suspension power supply voltage pin with the chip in the intelligent power module, but also help to improve the electrical connection stability in the intelligent power module.
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