Driving circuit unit, head unit, and liquid ejection device

Abstract

This invention relates to a drive circuit unit, a head unit, and a liquid ejection device. A drive circuit unit is provided that can suppress the increase in size in the transport direction. The drive circuit unit drives a head including an ejection section, which ejects liquid from a nozzle in a first direction according to a drive signal. The drive circuit unit includes: a fan; and a power supply board disposed at a position relative to the head on a second direction opposite to the first direction, supplying power to the drive circuit, and having a first surface for mounting the fan. The height of the highest first object mounted on the first surface in a direction orthogonal to the first surface is less than or equal to the length of the head in the transport direction. The first surface is either parallel to the first direction or oblique to the first direction.

Description

Technical Field

[0001] This invention relates to a drive circuit unit, a head unit, and a liquid ejection device. Background Technology

[0002] A liquid ejection device that sprays liquid onto a medium to form an image on the medium has been researched and developed.

[0003] In this regard, a liquid ejection device using piezoelectric elements such as pressure-sensitive elements is known (see Patent Document 1).

[0004] Patent Document 1: Japanese Patent Application Publication No. 2020-138356

[0005] Here, the liquid ejection device described in Patent Document 1 drives the piezoelectric element by supplying a drive signal to the piezoelectric element provided in the liquid ejection head, thereby ejecting a quantity of liquid corresponding to the drive of the piezoelectric element. Therefore, the liquid ejection device includes a drive circuit that generates the drive signal.

[0006] In such liquid ejection devices, the substrate on which the drive circuit is mounted is usually positioned directly above the head. This is because, by positioning the substrate directly above the head, the length of the transmission channel, which suppresses the transmission of signals that form the basis of image data, increases, thus preventing a decrease in ejection stability due to increased inductance in the transmission channel. Furthermore, to improve the versatility of the liquid ejection device, it is not uncommon for the device to have a row head composed of multiple heads. In this case, the direction of increasing the size of the substrate is limited by the spacing between the heads, and tends to be in the height direction. For these reasons, as described above, in liquid ejection devices, the substrate on which the drive circuit is mounted is usually positioned directly above the head.

[0007] However, when it is desired to position the substrate mounting the drive circuitry directly above the head of a liquid ejection device, it can sometimes lead to an increase in height. In particular, the higher the nozzle density of the head, the taller the substrate mounted directly above the head becomes. This contradicts the desire to miniaturize the liquid ejection device and is therefore undesirable. Summary of the Invention

[0008] One aspect of the drive circuit unit disclosed herein is a drive circuit unit that drives a head including a spray section, the spray section spraying liquid from a nozzle in a first direction according to a drive signal. The drive circuit unit includes: a fan; and a power board disposed at a position relative to the head in a second direction opposite to the first direction, supplying power to the drive circuit, and having a first surface for mounting the fan. The height of the highest first object mounted on the first surface in a direction orthogonal to the first surface is less than or equal to the length of the head in the conveying direction. The first surface is either a surface parallel to the first direction or a surface oblique to the first direction.

[0009] Additionally, one aspect of the head unit disclosed herein includes: a head, including an ejector portion that ejects liquid from a nozzle in a first direction according to a drive signal; and a drive circuit unit that drives the head, the drive circuit unit comprising: a fan; and a power board disposed at a position relative to the head on a second direction opposite to the first direction, supplying power to the drive circuit, and having a first surface on which the fan is mounted, wherein the height of the highest first object in a direction orthogonal to the first surface is less than or equal to the length of the head in the conveying direction, and the first surface is either a surface parallel to the first direction or a surface oblique to the first direction.

[0010] Additionally, one aspect of the liquid ejection device disclosed herein includes: a conveying unit for conveying a medium; a head including an ejection portion that ejects liquid from a nozzle in a first direction according to a drive signal; and a drive circuit unit for driving the head, the drive circuit unit including: a fan; and a power board disposed at a position relative to the head on a second direction opposite to the first direction, supplying power to the drive circuit, and having a first surface on which the fan is mounted, wherein the height of the highest first object in the direction orthogonal to the first surface among the objects mounted on the first surface is less than the length of the head in the conveying direction, and the first surface is a surface parallel to the first direction or a surface oblique to the first direction. Attached Figure Description

[0011] Figure 1 This is a diagram showing the general structure of a liquid ejection device.

[0012] Figure 2 This is a diagram showing the general structure of the ejection unit.

[0013] Figure 3 This is a diagram showing an example of the signal waveforms of the drive signals COMA, COMB, and COMC.

[0014] Figure 4 This is a diagram illustrating the functional structure of the drive signal selection circuit.

[0015] Figure 5 This is a diagram representing an example of the decoded content in the decoder.

[0016] Figure 6 This is a diagram illustrating an example of the configuration of a selection circuit.

[0017] Figure 7 This is a diagram used to illustrate the operation of the drive signal selection circuit.

[0018] Figure 8 This is a diagram showing the structure of the liquid ejection module.

[0019] Figure 9 This is a diagram illustrating an example of the structure of an ejection module.

[0020] Figure 10 Therefore Figure 9 The cross-sectional view shown is taken when the ejection module is cut along line Aa.

[0021] Figure 11 This is a perspective view showing an example of the structure of the head drive module 10.

[0022] Figure 12 Observing from another direction Figure 11 A three-dimensional view of the head drive module 10 shown.

[0023] Figure 13 Observing from bottom to top Figure 11 The top view of the head drive module 10 shown.

[0024] Figure 14 This is a diagram showing an example of the installation of the drive signal output circuit 50-1 on the third substrate B3 included in the drive circuit section DRV1.

[0025] Figure 15 This is a diagram illustrating an example of the positional relationship between the heat sink HS2, the drive signal output circuit 50-i, and the third substrate B3 in more detail.

[0026] Figure 16 This is a diagram comparing the length of the liquid ejection module 20 in the conveying direction with the height of the highest first object in the direction orthogonal to the first surface M1.

[0027] Figure 17 This is a diagram showing an example of the distribution flow path 37 when viewed in the second direction.

[0028] Figure 18 This is a diagram illustrating an example of the structure of a head drive module 10 equipped with a cooling mechanism CLR.

[0029] Figure 19 This is a diagram illustrating multiple head units HU configured as row heads in a liquid ejection device 1.

[0030] Explanation of reference numerals in the attached figures

[0031] 1…Liquid ejection device; 2…Control unit; 3…Liquid container; 4…Conveying unit; 5…Ejection unit; 10…Head drive module; 20…Liquid ejection module; 23…Ejection module; 23-1…Ejection module; 23-2…Ejection module; 23-3…Ejection module; 23-4…Ejection module; 23-5…Ejection module; 23-6…Ejection module; 23-j…Ejection module; 23-m…Ejection module; 30…Wiring component; 31…Housing; 33…Assembly base plate; 34…Flow path structure; 35…Head base plate; 37…Distribution flow path; 39…Fixing plate; 41…Conveyor motor; 42…Conveyor roller; 50-1…Drive signal output circuit; 50-2…Drive signal output circuit; 50-6…Drive signal Output circuit; 50-i… Drive signal output circuit; 50-j… Drive signal output circuit; 50-m… Drive signal output circuit; 52… Drive circuit; 52a… Drive circuit; 52a1… Drive circuit; 52aj… Drive circuit; 52b… Drive circuit; 52b1… Drive circuit; 52bj… Drive circuit; 52c… Drive circuit; 52c1… Drive circuit; 52cj… Drive circuit; 53… Reference voltage output circuit; 60… Piezoelectric element; 100… Control circuit; 120… Conversion circuit; 200… Drive signal selection circuit; 201… Integrated circuit; 210… Selection control circuit; 212… Shift register (S / R); 212… Shift register; 214… Latch circuit; 216 …decoder; 220…restore circuit; 230…selection circuit; 232a…inverter; 232b…inverter; 232c…inverter; 234a…transmission gate; 234b…transmission gate; 234c…transmission gate; 311…opening; 313…substrate insertion part; 315…holding member; 330…connection part; 341…inlet part; 343…through hole; 351…opening; 352…notch; 353…notch; 355…notch; 371…opening; 373…inlet part; 388…wiring member; 391…opening; 600…ejection part; 610…vibrating plate; 611…lead electrode; 620…plastic substrate; 621…sealing film; 622…fixed substrate; 623… …nozzle plate; 623a…liquid jet surface; 630…connecting plate; 641…protective substrate; 642…flow path forming substrate; 643…through hole; 644…protective space; 660…outer shell; 661…inlet channel; 662…connection port; 665…recess; Adp…trapezoidal waveform; B1…first substrate; B2…second substrate; B3…third substrate; Bdp…trapezoidal waveform; BSD…micro-vibration; CB…pressure chamber; CB1…pressure chamber; CB2…pressure chamber; Cdp…trapezoidal waveform; CLR…cooling mechanism; CMT…rectifier plate; CN1…first connector; CN2…second connector; CN3…third connector; CN4…fourth connector; CN5…fifth connector; CP…electrolytic capacitor;DRV…Driver circuit section; DRV1…Driver circuit section; DRV2…Driver circuit section; DRV3…Driver circuit section; DRV4…Driver circuit section; DRV5…Driver circuit section; DRV6…Driver circuit section; DRVi…Driver circuit section; FC…Wiring components; FET…Field effect transistor; FN…Fan; HD…Frame; HL…Inlet; HL1…Upper opening; HL2…Lower opening; HL3…Second upper opening; HL4…Second lower opening; HS1…Heat sink; HS2…Heat sink; HU…Head unit; HU11…Head unit; HU12…Head unit; HU13…Head unit; HU21…Head unit; HU22…Head unit; HU23…Head unit; HU31…Head unit; HU32…Head unit; HU33…Head unit; IC…Integrated circuit; IP…Image information signal; LD…Large point; Ln1…Nozzle array; Ln2…Nozzle array; M1…First face; M2…Second face; MN…Manifold; MN1…Manifold; MN2…Manifold; N…Nozzle; N1…Nozzle; N2…Nozzle; ND…Non-ejection; OL…Profile; P…Medium; RA…Supply connecting channel; RA1…Supply connecting channel; RA2…Supply connecting channel; RB…Supply connecting channel; RB1…Supply connecting channel; RB2…Supply connecting channel; RC…Coil; RK1…Pressure chamber connecting channel; RK2…Pressure chamber connecting channel; RR…Nozzle connecting channel; RR1…Nozzle connecting channel; RR2…Nozzle connecting channel; RX…Connecting connecting channel; RX1…Connecting connecting channel; RX2…Connecting connecting channel; SL…Slit; Su1…Flow path plate; Su2…Flow path plate; WR…Air guide; WR2…Second air guide. Detailed Implementation

[0032] The preferred embodiments of this disclosure will now be described using the accompanying drawings. The drawings are for ease of explanation. Furthermore, the embodiments described below do not unduly limit the scope of this disclosure as defined in the claims. Additionally, not all of the components described below are essential elements of this disclosure.

[0033] 1. First Implementation Method

[0034] 1.1 Composition of the liquid ejection device

[0035] Figure 1 This is a diagram showing the general configuration of the liquid ejection device 1. (See diagram for example.) Figure 1 As shown, the liquid ejection device 1 is a so-called line inkjet printer that forms a desired image on the medium P by ejecting ink, an example of a liquid, onto the medium P being transported through the transport unit 4 at a desired time. Here, in the following description, the direction in which the medium P is transported is sometimes referred to as the transport direction, and the width direction of the transported medium P is referred to as the main scanning direction.

[0036] like Figure 1 As shown, the liquid ejection device 1 includes a control unit 2, a liquid container 3, a conveying unit 4, and multiple ejection units 5.

[0037] The control unit 2 includes processing circuits such as a CPU (Central Processing Unit) and an FPGA (Field Programmable Gate Array), and storage circuits such as semiconductor memory. Based on image data supplied from an external device such as a host computer (not shown) located outside the liquid ejection device 1, the control unit 2 outputs signals controlling various elements of the liquid ejection device 1.

[0038] Liquid container 3 stores one or more liquids that are supplied to ejection unit 5. For example, liquid container 3 stores ink that is supplied to ejection unit 5. Specifically, liquid container 3 stores inks of various colors that are ejected to medium P, such as black, cyan, magenta, yellow, red, and gray inks. Of course, liquid container 3 may store only black ink, or it may store liquids other than ink.

[0039] The conveying unit 4 includes a conveying motor 41 and a conveying roller 42. The conveying unit 4 receives the conveying control signal Ctrl-T output by the control unit 2. Furthermore, the conveying motor 41 operates according to the input conveying control signal Ctrl-T, and the conveying roller 42 is driven to rotate as the conveying motor 41 operates, thereby conveying the medium P along the conveying direction.

[0040] Each of the multiple ejection units 5 has a head drive module 10 and a liquid ejection module 20. The ejection unit 5 is input with an image information signal IP output from the control unit 2 and is supplied with ink stored in the liquid container 3. Moreover, the head drive module 10 controls the operation of the liquid ejection module 20 according to the image information signal IP input from the control unit 2. With the control of the head drive module 10, the liquid ejection module 20 ejects the ink supplied from the liquid container 3 to the medium P.

[0041] Furthermore, the liquid ejection modules 20 of each of the multiple ejection units 5 are arranged side by side along the main scanning direction to be wider than or equal to the width of the medium P, so as to eject ink into the entire area in the width direction of the transported medium P. Thus, the liquid ejection device 1 constitutes a line inkjet printer. However, the liquid ejection device 1 is not limited to a line inkjet printer.

[0042] Next, the general structure of the ejection unit 5 will be explained. Figure 2 This is a diagram showing the approximate structure of the ejection unit 5. (See diagram for example.) Figure 2As shown, the ejection unit 5 includes a head drive module 10 and a liquid ejection module 20. Furthermore, in the ejection unit 5, the head drive module 10 and the liquid ejection module 20 are electrically connected via one or more wiring components 30.

[0043] The wiring component 30 is a flexible component, such as a flexible printed circuit (FPC), used to electrically connect the head drive module 10 and the liquid ejection module 20.

[0044] The head drive module 10 includes a control circuit 100, drive signal output circuits 50-1 to 50-m, and a conversion circuit 120.

[0045] The control circuit 100 includes a CPU, FPGA, etc. The image information signal IP is input to the control circuit 100 and output from the control unit 2. Based on the input image information signal IP, the control circuit 100 outputs signals to control various elements of the ejection unit 5.

[0046] The control circuit 100 generates a basic data signal dDATA for controlling the operation of the liquid ejection module 20 based on the image information signal IP, and outputs it to the conversion circuit 120. The conversion circuit 120 converts the basic data signal dDATA into a differential signal such as LVDS (Low Voltage Differential Signaling), and outputs it as the data signal DATA to the liquid ejection module 20. In addition, the conversion circuit 120 can also convert the basic data signal dDATA into a differential signal using a high-speed transmission method other than LVDS, such as LVPECL (Low Voltage Positive Emitter Coupled Logic) or CML (Current Mode Logic), and output it as the data signal DATA to the liquid ejection module 20. Alternatively, it can output part or all of the basic data signal dDATA as a single-ended data signal DATA to the liquid ejection module 20.

[0047] Additionally, the control circuit 100 outputs basic drive signals dA1, dB1, and dB1 to the drive signal output circuit 50-1. The drive signal output circuit 50-1 includes drive circuits 52a, 52b, and 52c. The basic drive signal dA1 is input to drive circuit 52a. Drive circuit 52a generates drive signal COMA1 by performing a digital-to-analog conversion and D-level amplification on the input basic drive signal dA1, and outputs it to the liquid ejection module 20. The basic drive signal dB1 is input to drive circuit 52b. Drive circuit 52b generates drive signal COMB1 by performing a digital-to-analog conversion and D-level amplification on the input basic drive signal dB1, and outputs it to the liquid ejection module 20. The basic drive signal dB1 is input to drive circuit 52c. Drive circuit 52c generates drive signal COMC1 by performing a digital-to-analog conversion and D-level amplification on the input basic drive signal dB1, and outputs it to the liquid ejection module 20.

[0048] Here, the driving circuits 52a, 52b, and 52c only need to be able to generate driving signals COMA1, COMB1, and COMC1 by amplifying the specified waveforms of the input basic driving signals dA1, dB1, and dC1, respectively. They can also replace the D-level amplifier circuit, or include A-level, B-level, or AB-level amplifier circuits in addition to the D-level amplifier circuit. Furthermore, the basic driving signals dA1, dB1, and dC1 only need to be able to define the waveforms of the corresponding driving signals COMA1, COMB1, and COMC1, and can also be analog signals.

[0049] Additionally, the drive signal output circuit 50-1 includes a reference voltage output circuit 53. The reference voltage output circuit 53 generates a constant potential reference voltage signal VBS1 and outputs it to the liquid ejection module 20. This reference voltage signal VBS1 represents the reference potential of the piezoelectric element 60 (described later) in the liquid ejection module 20. This reference voltage signal VBS1 can be, for example, ground potential, or a constant potential such as 5.5V or 6V. Here, a constant potential includes a potential that is considered approximately constant when considering variations caused by errors such as potential variations due to the operation of peripheral circuits, potential variations due to deviations in circuit components, and potential variations due to the temperature characteristics of circuit components.

[0050] The drive signal output circuits 50-2 to 50-m differ only in the input and output signals, and their configurations are identical to those of drive signal output circuit 50-1. Specifically, drive signal output circuit 50-j (where j is any one of 1 to m) includes circuits equivalent to drive circuits 52a, 52b, and 52c, and a circuit equivalent to reference voltage output circuit 53. It generates drive signals COMAj, COMBj, and COMCj and a reference voltage signal VBSj based on the basic drive signals dAj, dBj, and dCj input from control circuit 100, and outputs them to liquid ejection module 20.

[0051] In the following description, the drive circuits 52a, 52b, and 52c included in the drive signal output circuit 50-1 have the same configuration as the drive circuits 52a, 52b, and 52c included in the drive signal output circuit 50-j. When no distinction is needed, they are sometimes simply referred to as drive circuit 52. In this case, the description focuses on drive circuit 52 generating and outputting a drive signal COM based on the basic drive signal do. On the other hand, when distinguishing between the drive circuits 52a, 52b, and 52c included in the drive signal output circuit 50-1 and the drive circuits 52a, 52b, and 52c included in the drive signal output circuit 50-j, the drive circuits 52a, 52b, and 52c included in the drive signal output circuit 50-1 are sometimes referred to as drive circuits 52a1, 52b1, and 52c1, and the drive circuits 52a, 52b, and 52c included in the drive signal output circuit 50-j are sometimes referred to as drive circuits 52aj, 52bj, and 52cj.

[0052] The liquid ejection module 20 has a recovery circuit 220 and ejection modules 23-1 to 23-m.

[0053] The restoration circuit 220 restores the data signal DATA into a single-ended signal, separates it into signals corresponding to the ejection modules 23-1 to 23-m respectively, and outputs them to the corresponding ejection modules 23-1 to 23-m.

[0054] Specifically, the restoration circuit 220 restores and separates the data signal DATA to generate a clock signal SCK1, a printing data signal SI1, and a latch signal LAT1 corresponding to the ejection module 23-1, and outputs them to the ejection module 23-1. Additionally, the restoration circuit 220 restores and separates the data signal DATA to generate a clock signal SCKj, a printing data signal SIj, and a latch signal LATj corresponding to the ejection module 23-j, and outputs them to the ejection module 23-j.

[0055] As described above, the restoration circuit 220 restores the data signal DATA of the differential signal output by the head drive module 10, and separates the restored signal into signals corresponding to the ejection modules 23-1 to 23-m. Thus, the restoration circuit 220 generates clock signals SCK1 to SCKm, printing data signals SI1 to SIm, and latch signals LAT1 to LATm corresponding to the ejection modules 23-1 to 23-m, respectively, and outputs them to the corresponding ejection modules 23-1 to 23-m. Furthermore, any one of the clock signals SCK1 to SCKm, printing data signals SI1 to SIm, and latch signals LAT1 to LATm output by the restoration circuit 220 corresponding to the ejection modules 23-1 to 23-m can also be a signal shared by the ejection modules 23-1 to 23-m.

[0056] Here, since the data signal DATA is restored and separated by the restoration circuit 220 to generate clock signals SCK1~SCKm, printing data signals SI1~SIm, and latch signals LAT1~LATm, the data signal DATA output by the control circuit 100 is a differential signal corresponding to the clock signals SCK1~SCKm, printing data signals SI1~SIm, and latch signals LAT1~LATm. Furthermore, the basic data signal dDATA, which forms the basis of the data signal DATA, includes signals corresponding to the clock signals SCK1~SCKm, printing data signals SI1~SIm, and latch signals LAT1~LATm, respectively. That is, the basic data signal dDATA includes signals that control the operation of the ejection modules 23-1~23-m of the liquid ejection module 20.

[0057] The ejection module 23-1 has a drive signal selection circuit 200 and multiple ejection sections 600. In addition, each of the multiple ejection sections 600 includes a piezoelectric element 60.

[0058] The ejection module 23-1 receives input drive signals COMA1, COMB1, COMC1, a reference voltage signal VBS1, a clock signal SCK1, a printing data signal SI1, and a latch signal LAT1. These drive signals COMA1, COMB1, COMC1, SCK1, SI1, and LAT1 are input to the drive signal selection circuit 200 within the ejection module 23-1. The drive signal selection circuit 200 generates a drive signal VOUT by selecting or deselecting each of the drive signals COMA1, COMB1, and COMC1 based on the input clock signal SCK1, SI1, and LAT1, and supplies this drive signal VOUT to one end of the piezoelectric element 60 in the corresponding ejection section 600. At this time, the other end of the piezoelectric element 60 is supplied with the reference voltage signal VBS1. Furthermore, the piezoelectric element 60 is driven by the potential difference between the drive signal VOUT supplied to one end and the reference voltage signal VBSj supplied to the other end, thereby ejecting ink from the corresponding ejection section 600.

[0059] Similarly, the ejection module 23-j has a drive signal selection circuit 200 and multiple ejection sections 600. In addition, each of the multiple ejection sections 600 includes a piezoelectric element 60.

[0060] The ejection module 23-j receives input drive signals COMAj, COMBj, COMCj, a reference voltage signal VBSj, a clock signal SCKj, a printing data signal SIj, and a latch signal LATj. These drive signals COMAj, COMBj, COMCj, SCKj, SIj, and LATj are input to the drive signal selection circuit 200 of the ejection module 23-j. The drive signal selection circuit 200 generates a drive signal VOUT by selecting or deselecting each of the drive signals COMAj, COMBj, and COMCj based on the input clock signal SCKj, SIj, and LATj, and supplies this drive signal VOUT to one end of the piezoelectric element 60 in the corresponding ejection section 600. At this time, the other end of the piezoelectric element 60 is supplied with the reference voltage signal VBSj. Furthermore, the piezoelectric element 60 is driven by the potential difference between the drive signal VOUT supplied to one end and the reference voltage signal VBSj supplied to the other end, thereby ejecting ink from the corresponding ejection section 600.

[0061] In the liquid ejection device 1 of the first embodiment configured as described above, the control unit 2 controls the transport unit 4 to transport the medium P based on image data supplied by a host computer or the like (not shown), and controls the ejection of ink from the liquid ejection module 20 of the ejection unit 5. Thus, the liquid ejection device 1 can cause a desired amount of ink to land at a desired position on the medium P, thereby forming a desired image on the medium P.

[0062] Here, the liquid ejection module 20 has ejection modules 23-1 to 23-m that are identical in configuration only differing in the input signals. Therefore, in the following description, when it is not necessary to distinguish between ejection modules 23-1 to 23-m, they are sometimes simply referred to as ejection module 23. In addition, in this case, the drive signals COMA1 to COMAm input to the ejection module 23 are sometimes referred to as drive signals COMA, drive signals COMB1 to COMBm as drive signals COMB, drive signals COMC1 to COMCm as drive signals COMC, reference voltage signals VBS1 to VBSm as reference voltage signals VBS, clock signals SCK1 to SCKm as clock signals SCK, printing data signals SI1 to SIm as printing data signals SI, and latch signals LAT1 to LATm as latch signals LAT.

[0063] Specifically, the ejection module 23 is input with drive signals COMA, COMB, COMC, a reference voltage signal VBS, a clock signal SCK, a printing data signal SI, and a latch signal LAT. These drive signals COMA, COMB, COMC, SCK, SI, and LAT are input to the drive signal selection circuit 200 of the ejection module 23. The drive signal selection circuit 200 generates a drive signal VOUT by selecting or deselecting each of the drive signals COMA, COMB, and COMC based on the input clock signal SCK, SI, and LAT, and supplies this drive signal VOUT to one end of the piezoelectric element 60 in the corresponding ejection section 600. At this time, the other end of the piezoelectric element 60 is supplied with the reference voltage signal VBS. Furthermore, the piezoelectric element 60 is driven by the potential difference between the drive signal VOUT supplied to one end and the reference voltage signal VBS supplied to the other end, thereby ejecting ink from the corresponding ejection section 600.

[0064] As described above, the liquid ejection device 1 in this embodiment includes: a liquid ejection module 20, including an ejection module 23 that ejects ink according to the drive of a piezoelectric element 60; a head drive module 10, including drive signal output circuits 50-1 to 50-m that output drive signals COMA, COMB, and COMC; and a wiring component 30, one end of which is electrically connected to the head drive module 10 and the other end of which is electrically connected to the liquid ejection module 20. Here, the piezoelectric element 60 is an example of a drive element, the ejection module 23 that ejects ink according to the drive of the piezoelectric element 60 or the liquid ejection module 20 including the ejection module 23 is an example of an ejection head, and any one of the drive signal output circuits 50-1 to 50-m that output drive signals COMA, COMB, and COMC or the head drive module 10 including the drive signal output circuits 50-1 to 50-m is an example of a head drive circuit.

[0065] 1.2 Functional Composition of Drive Signal Selection Control Circuit

[0066] Next, the configuration and operation of the drive signal selection circuit 200 in the ejection module 23 will be explained. When explaining the configuration and operation of the drive signal selection circuit 200 in the ejection module 23, an example of the signal waveform contained in the drive signals COMA, COMB, and COMC input to the drive signal selection circuit 200 will be explained first.

[0067] Figure 3 This is a diagram illustrating an example of the signal waveforms for the drive signals COMA, COMB, and COMC. (Example...) Figure 3 As shown, the drive signal COMA includes a trapezoidal waveform Adp configured within a period T from the rise of the latch signal LAT to the next rise of the latch signal LAT. The trapezoidal waveform Adp is a signal waveform that, when supplied to one end of the piezoelectric element 60, ejects a predetermined amount of ink from the ejection section 600 corresponding to the piezoelectric element 60. The drive signal COMB includes a trapezoidal waveform Bdp configured within period T. This trapezoidal waveform Bdp is a signal waveform with a voltage amplitude smaller than that of the trapezoidal waveform Adp, and is a signal waveform that, when supplied to one end of the piezoelectric element 60, ejects a smaller than predetermined amount of ink from the ejection section 600 corresponding to the piezoelectric element 60. The drive signal COMC includes a trapezoidal waveform Cdp configured within period T. This trapezoidal waveform Cdp is a signal waveform with a voltage amplitude smaller than that of the trapezoidal waveforms Adp and Bdp, and is a signal waveform that, when supplied to one end of the piezoelectric element 60, causes the ink near the nozzle opening to vibrate to a degree that prevents ink from being ejected from the ejection section 600 corresponding to the piezoelectric element 60. The trapezoidal waveform Cdp is supplied to the piezoelectric element 60, thereby causing the ink near the nozzle opening of the ejection section 600, which includes the piezoelectric element 60, to vibrate. As a result, concerns about increased ink viscosity near the nozzle opening are reduced.

[0068] That is, the drive signal COMA is a signal that drives the piezoelectric element 60 by ejecting ink, the drive signal COMB is a signal that drives the piezoelectric element 60 by ejecting ink, and the drive signal COMC is a signal used to drive the piezoelectric element 60 without ejecting ink. The amount of ink ejected from the liquid ejection module 20 including the ejection module 23 is different when such a drive signal COMA is supplied to the piezoelectric element 60 compared to the amount of ink ejected from the liquid ejection module 20 including the ejection module 23 when the drive signal COMB is supplied to the piezoelectric element 60.

[0069] Furthermore, at the start and end times of each of the trapezoidal waveforms Adp, Bdp, and Cdp, the voltage values ​​of the trapezoidal waveforms Adp, Bdp, and Cdp are all the same: voltage Vc. That is, the trapezoidal waveforms Adp, Bdp, and Cdp are signal waveforms that begin and end with voltage Vc, respectively.

[0070] In the following description, the amount of ink ejected from the ejection section 600 corresponding to the piezoelectric element 60 when a trapezoidal waveform Adp is supplied to one end of the piezoelectric element 60 is sometimes referred to as a large amount, and the amount of ink ejected from the ejection section 600 corresponding to the piezoelectric element 60 when a trapezoidal waveform Bdp is supplied to one end of the piezoelectric element 60 is sometimes referred to as a small amount. Furthermore, the situation where the ink near the nozzle opening vibrates to the extent that it is not ejected from the ejection section 600 corresponding to the piezoelectric element 60 when a trapezoidal waveform Cdp is supplied to one end of the piezoelectric element 60 is sometimes referred to as micro-vibration.

[0071] also, Figure 3 The example illustrates the case where drive signals COMA, COMB, and COMC each contain a trapezoidal waveform within a period T. However, drive signals COMA, COMB, and COMC can also each contain two or more consecutive trapezoidal waveforms within a period T. In this case, a signal specifying the switching time of two or more trapezoidal waveforms is input to the drive signal selection circuit 200, and the ejection unit 600 ejects ink multiple times within a period T. Furthermore, by causing the ink ejected multiple times within a period T to land on and bind to the medium P, a dot is formed on the medium P. This increases the grayscale level of the dot formed on the medium P.

[0072] In contrast, in the liquid ejection device 1 shown in the first embodiment, the driving signals COMA, COMB, and COMC are described as signals containing a trapezoidal waveform within a period T. This shortens the period T for forming dots on the medium P, thereby increasing the image formation speed towards the medium P. Furthermore, by supplying the driving signals COMA, COMB, and COMC in parallel to the liquid ejection module 20, the grayscale level of the dots formed on the medium P is also increased. Here, the period T from the rise of the latch signal LAT to the next rise of the latch signal LAT is sometimes referred to as the dot formation period for forming dots of the desired size on the medium P.

[0073] Furthermore, the signal waveforms contained in the drive signals COMA, COMB, and COMC are not limited to... Figure 3 The illustrated signal waveforms can be varied depending on the type of ink ejected from the ejection section 600, the number of piezoelectric elements 60 driven by the drive signals COMA, COMB, and COMC, and the length of the wiring transmitting the drive signals COMA, COMB, and COMC. That is, Figure 2 The drive signals COMA1 to COMAm shown can each contain different signal waveforms. Similarly, the drive signals COMB1 to COMBm and the drive signals COMC1 to COMCm can each contain different signal waveforms.

[0074] Next, the configuration and operation of the drive signal selection circuit 200, which outputs the drive signal VOUT by selecting or not selecting each of the drive signals COMA, COMB, and COMC, will be explained. Figure 4 This is a diagram illustrating the functional configuration of the drive signal selection circuit 200. (Example) Figure 4 As shown, the drive signal selection circuit 200 includes a selection control circuit 210 and multiple selection circuits 230.

[0075] The selection control circuit 210 receives the input printing data signal SI, latch signal LAT, and clock signal SCK. Furthermore, the selection control circuit 210 has a group of shift registers (S / R) 212, latch circuits 214, and decoders 216 corresponding to each of the n ejector units 600. That is, the drive signal selection circuit 200 includes the same number of shift registers 212, latch circuits 214, and decoders 216 as the number of ejector units 600.

[0076] The printing data signal SI is a signal synchronized with the clock signal SCK and contains 2 bits of printing data [SIH, SIL]. This 2-bit printing data [SIH, SIL] is used to define the dot size formed by ink ejected from each of the n ejector sections 600, according to any one of the following specifications: "Large Dot LD", "Small Dot SD", "Non-ejection ND", and "Micro-vibration BSD". The printing data signal SI is held in the shift register 212 corresponding to the ejector section 600 for each 2 bits of printing data [SIH, SIL].

[0077] Specifically, n shift registers 212 corresponding to the ejector section 600 are cascaded together. The serially input printing data signal SI is sequentially transmitted to the next stage of the cascaded shift registers 212 according to the clock signal SCK. Furthermore, by stopping the supply of the clock signal SCK, two bits of printing data [SIH, SIL] corresponding to the ejector section 600 corresponding to that shift register 212 are maintained in each of the n shift registers 212. Figure 4 In order to distinguish the n cascaded shift registers 212, they are denoted as level 1, level 2, ..., level n from the upstream side of the input printed data signal SI to the downstream side.

[0078] n latching circuits 214 simultaneously latch the 2-bit printed data [SIH, SIL] held by the corresponding shift registers 212 at the rising edge of the latching signal LAT.

[0079] n decoders 216 decode the 2-bit printed data [SIH, SIL] latched by the corresponding latch circuit 214, and output selection signals S1, S2, and S3 corresponding to the logic level of the decoded content in each cycle T. Figure 5 This is a diagram illustrating an example of the decoded content in decoder 216. The output of decoder 216 consists of latched 2-bit printed data [SIH, SIL] and... Figure 5 The selected signals S1, S2, and S3 specify the logic levels of the decoded content. For example, in the first embodiment, when the 2-bit printed data [SIH, SIL] latched by the corresponding latch circuit 214 is [1, 0], the decoder 216 sets the logic levels of the selected signals S1, S2, and S3 to L, H, and L levels respectively during the period T.

[0080] The selection circuit 230 is provided corresponding to each of the n ejector sections 600. That is, the drive signal selection circuit 200 has n selection circuits 230. The selection circuit 230 is input with selection signals S1, S2, S3 and drive signals COMA, COMB, COMC output from the decoder 216 corresponding to the same ejector section 600. Moreover, the selection circuit 230 generates a drive signal VOUT by selecting or not selecting each of the drive signals COMA, COMB, COMC according to the selection signals S1, S2, S3 and the drive signals COMA, COMB, COMC, and outputs it to the corresponding ejector section 600.

[0081] Figure 6 This diagram illustrates an example of the configuration of a selection circuit 230 corresponding to an ejector section 600. For example... Figure 6 As shown, the selection circuit 230 has inverters 232a, 232b, 232c and transmission gates 234a, 234b, 234c.

[0082] The selection signal S1 is input to the positive control terminal (not marked with a circle) of transmission gate 234a. Conversely, it is logically inverted by inverter 232a and input to the negative control terminal (marked with a circle) of transmission gate 234a. Additionally, a drive signal COMA is supplied to the input terminal of transmission gate 234a. Transmission gate 234a conducts between its input and output terminals when the input selection signal S1 is at a high level (H), and de-conducts between its input and output terminals when the input selection signal S1 is at a low level (L). That is, transmission gate 234a outputs the drive signal COMA to the output terminal when the selection signal S1 is at a high level (H), and does not output the drive signal COMA to the output terminal when the selection signal S1 is at a low level (L).

[0083] The selection signal S2 is input to the positive control terminal (not marked with a circle) of transmission gate 234b. Conversely, it is logically inverted by inverter 232b and input to the negative control terminal (marked with a circle) of transmission gate 234b. Additionally, a drive signal COMB is supplied to the input terminal of transmission gate 234b. Transmission gate 234b conducts between its input and output terminals when the input selection signal S2 is at a high level (H), and de-conducts between its input and output terminals when the input selection signal S2 is at a low level (L). That is, transmission gate 234b outputs the drive signal COMB to the output terminal when the selection signal S2 is at a high level (H), and does not output the drive signal COMB to the output terminal when the selection signal S2 is at a low level (L).

[0084] The selection signal S3 is input to the positive control terminal (not marked with a circle) of transmission gate 234c. Conversely, it is logically inverted by inverter 232c and input to the negative control terminal (marked with a circle) of transmission gate 234c. Additionally, a drive signal COMC is supplied to the input terminal of transmission gate 234c. Transmission gate 234c conducts between its input and output terminals when the input selection signal S3 is at a high level (H), and de-conducts between its input and output terminals when the input selection signal S3 is at a low level (L). That is, transmission gate 234c outputs the drive signal COMC to the output terminal when the selection signal S3 is at a high level (H), and does not output the drive signal COMC to the output terminal when the selection signal S3 is at a low level (L).

[0085] The outputs of transmission gates 234a, 234b, and 234c are connected together. That is, the outputs of these commonly connected transmission gates are supplied with drive signals COMA, COMB, and COMC, which are selected or not selected according to selection signals S1, S2, and S3. The selection circuit 230 outputs the signal supplied to this commonly connected output as a drive signal VOUT to the corresponding ejector section 600.

[0086] The operation of the drive signal selection circuit 200 is explained. Figure 7 This diagram illustrates the operation of the drive signal selection circuit 200. The printing data signal SI is input serially in sync with the clock signal SCK and is sequentially transmitted in the shift register 212 corresponding to the ejector unit 600. Furthermore, by stopping the input of the clock signal SCK, the corresponding 2-bit printing data [SIH, SIL] for each ejector unit 600 is held in the corresponding shift register 212.

[0087] Then, when the latch signal LAT rises, the 2 bits of printed data [SIH, SIL] held in shift register 212 are simultaneously latched by latch circuit 214. Furthermore, in Figure 7 In the diagram, the 2-bit printed data [SIH, SIL] corresponding to the shift registers 212 of levels 1, 2, ..., n, latched by the latching circuit 214 are illustrated as LT1, LT2, ..., LTn.

[0088] Decoder 216 outputs logic level selection signals S1, S2, and S3 based on the dot size specified by the latched 2-bit printed data [SIH, SIL].

[0089] Specifically, when the printed data [SIH, SIL] is [1, 1], the decoder 216 sets the logic levels of selection signals S1, S2, and S3 to H, L, and L levels within period T and outputs them to the selection circuit 230. As a result, the selection circuit 230 selects the trapezoidal waveform Adp within period T and outputs the drive signal VOUT corresponding to "large dot LD". Conversely, when the printed data [SIH, SIL] is [1, 0], the decoder 216 sets the logic levels of selection signals S1, S2, and S3 to L, H, and L levels within period T and outputs them to the selection circuit 230. As a result, the selection circuit 230 selects the trapezoidal waveform Bdp within period T and outputs the drive signal VOUT corresponding to "small dot SD". Conversely, when the printed data [SIH, SIL] is [0, 1], the decoder 216 sets the logic levels of selection signals S1, S2, and S3 to L, L, and outputs them to the selection circuit 230 within period T. As a result, selection circuit 230 does not select any of the trapezoidal waveforms Adp, Bdp, or Cdp within period T, but outputs a constant voltage Vc driving signal VOUT corresponding to "No Ejection ND". Additionally, when the printed data [SIH, SIL] is [0, 0], decoder 216 sets the logic levels of selection signals S1, S2, and S3 to L, L, and H levels within period T and outputs them to selection circuit 230. As a result, selection circuit 230 selects trapezoidal waveform Cdp within period T and outputs the driving signal VOUT corresponding to "Micro-Vibration BSD".

[0090] Here, when the selection circuit 230 does not select any one of the trapezoidal waveforms Adp, Bdp, and Cdp, the voltage Vc previously supplied to the piezoelectric element 60 is maintained at one end of the corresponding piezoelectric element 60 through the capacitive component of the piezoelectric element 60. That is, the drive signal VOUT output by the selection circuit 230 at a constant voltage Vc includes the following cases: when the trapezoidal waveforms Adp, Bdp, and Cdp are not selected as the drive signal VOUT, the voltage Vc maintained at the previous time through the capacitive component of the piezoelectric element 60 is supplied to the piezoelectric element 60 as the drive signal VOUT.

[0091] As described above, the drive signal selection circuit 200 selects or deselects drive signals COMA, COMB, and COMC based on the printing data signal SI, the latch signal LAT, and the clock signal SCK, thereby generating a drive signal VOUT corresponding to each of the plurality of ejection units 600 and outputting it to the corresponding ejection unit 600. This allows for individual control of the amount of ink ejected from each of the plurality of ejection units 600.

[0092] 1.3 Composition of the liquid ejection module

[0093] Next, use Figures 8 to 10 The structure of the liquid ejection module 20 is described. Figure 8 This is a diagram showing the structure of the liquid ejection module 20. Here, when describing the structure of the liquid ejection module 20, Figures 8 to 10 The diagram illustrates arrows representing the mutually orthogonal X1, Y1, and Z1 directions. Additionally, in Figures 8 to 10 In the description, the starting side of the arrow representing the X1 direction is sometimes referred to as the -X1 side, and the front end side as the +X1 side; the starting side of the arrow representing the Y1 direction is sometimes referred to as the -Y1 side, and the front end side as the +Y1 side; and the starting side of the arrow representing the Z1 direction is sometimes referred to as the -Z1 side, and the front end side as the +Z1 side. Furthermore, in the following description, it is assumed that the liquid ejection module 20 of the liquid ejection device 1 in the first embodiment has six ejection modules 23. When distinguishing between the six ejection modules 23, they are sometimes referred to as ejection modules 23-1 to 23-6.

[0094] The liquid ejection module 20 includes a housing 31, a collection substrate 33, a flow path structure 34, a head substrate 35, a distribution flow path 37, a fixing plate 39, and ejection modules 23-1 to 23-6. In the liquid ejection module 20, the flow path structure 34, the head substrate 35, the distribution flow path 37, and the fixing plate 39 are stacked along the Z1 direction from the -Z1 side to the +Z1 side in the order of fixing plate 39, distribution flow path 37, head substrate 35, and flow path structure 34. The housing 31 is located around the flow path structure 34, head substrate 35, distribution flow path 37, and fixing plate 39 to support them. The collection substrate 33 is erected on the +Z1 side of the housing 31 and held in place by the housing 31. Six ejection modules 23 are located between the distribution flow path 37 and the fixing plate 39, with a portion of them protruding from the outside of the liquid ejection module 20.

[0095] When describing the structure of the liquid ejection module 20, the structure of the ejection module 23 of the liquid ejection module 20 will be described first. Figure 9 This is a diagram illustrating an example of the structure of the ejection module 23. Additionally, Figure 10 This is a diagram showing an example of a cross-section of the ejection module 23. Here, Figure 10 Therefore Figure 9 The section shown is cut along line Aa. Figure 9 The cross-sectional view shown is of the ejection module 23, and... Figure 10 The line Aa shown is a virtual line segment that passes through the inlet channel 661 of the ejection module 23 and through nozzles N1 and N2.

[0096] like Figure 9 and Figure 10As shown, the ejection module 23 has a plurality of nozzles N1 arranged side by side and a plurality of nozzles N2 arranged side by side. The total number of nozzles N1 and nozzles N2 in the ejection module 23 is n, the same number as the ejection section 600 in the ejection module 23. Furthermore, in the first embodiment, it will be described that the number of nozzles N1 and nozzles N2 in the ejection module 23 is the same. That is, it will be described that the ejection module 23 has n / 2 nozzles N1 and n / 2 nozzles N2. Here, in the following description, when it is not necessary to distinguish between nozzles N1 and nozzles N2, they will sometimes be simply referred to as nozzle N.

[0097] The ejection module 23 includes wiring components 388, housing 660, protective substrate 641, flow path forming substrate 642, connecting plate 630, plastic substrate 620, and nozzle plate 623.

[0098] On the flow path forming substrate 642, a pressure chamber CB1, divided by multiple partition walls by anisotropic etching from one side, is arranged side-by-side corresponding to nozzle N1, and a pressure chamber CB2, divided by multiple partition walls by anisotropic etching from one side, is arranged side-by-side corresponding to nozzle N2. In the following description, without needing to distinguish between pressure chamber CB1 and pressure chamber CB2, they will sometimes be simply referred to as pressure chamber CB.

[0099] The nozzle plate 623 is located on the -Z1 side of the flow path forming substrate 642. A nozzle array Ln1 formed by n / 2 nozzles N1 and a nozzle array Ln2 formed by n / 2 nozzles N2 are provided on the nozzle plate 623. Here, in the following description, the surface of the nozzle plate 623 with the nozzles N open is sometimes referred to as the liquid injection surface 623a.

[0100] The connecting plate 630 is located on the -Z1 side of the flow path forming substrate 642 and the +Z1 side of the nozzle plate 623. On the connecting plate 630, a nozzle connecting channel RR1 connecting the pressure chamber CB1 to the nozzle N1 and a nozzle connecting channel RR2 connecting the pressure chamber CB2 to the nozzle N2 are provided. Additionally, on the connecting plate 630, corresponding to the pressure chambers CB1 and CB2, a pressure chamber connecting channel RK1 connecting the end of the pressure chamber CB1 to the manifold MN1 and a pressure chamber connecting channel RK2 connecting the end of the pressure chamber CB2 to the manifold MN2 are independently provided.

[0101] Manifold MN1 includes a supply connection channel RA1 and a connecting connection channel RX1. The supply connection channel RA1 is configured to pass through the connecting plate 630 in the Z1 direction, while the connecting connection channel RX1 does not pass through the connecting plate 630 in the Z1 direction, but instead opens on the nozzle plate 623 side of the connecting plate 630 and is positioned midway in the Z1 direction. Similarly, manifold MN2 includes a supply connection channel RA2 and a connecting connection channel RX2. The supply connection channel RA2 is configured to pass through the connecting plate 630 in the Z1 direction, while the connecting connection channel RX2 does not pass through the connecting plate 630 in the Z1 direction, but instead opens on the nozzle plate 623 side of the connecting plate 630 and is positioned midway in the Z1 direction. Furthermore, the connecting connection channel RX1 in manifold MN1 is connected to the corresponding pressure chamber CB1 via the pressure chamber connection channel RK1, and the connecting connection channel RX2 in manifold MN2 is connected to the corresponding pressure chamber CB2 via the pressure chamber connection channel RK2.

[0102] In the following description, when it is not necessary to distinguish between nozzle connection channel RR1 and nozzle connection channel RR2, it may be referred to simply as nozzle connection channel RR; when it is not necessary to distinguish between manifold MN1 and manifold MN2, it may be referred to simply as manifold MN; when it is not necessary to distinguish between supply connection channel RA1 and supply connection channel RA2, it may be referred to simply as supply connection channel RA; and when it is not necessary to distinguish between connection channel RX1 and connection connection channel RX2, it may be referred to simply as connection connection channel RX.

[0103] The vibrating plate 610 is located on the +Z1 side of the flow path forming substrate 642. Furthermore, two rows of piezoelectric elements 60 are formed on the +Z1 side of the vibrating plate 610, corresponding to nozzles N1 and N2. One electrode and piezoelectric layer of each piezoelectric element 60 are formed separately for each pressure chamber CB, and the other electrode of the piezoelectric element 60 is configured as a common electrode shared by the pressure chambers CB. Moreover, a drive signal VOUT is supplied from the drive signal selection circuit 200 to one electrode of the piezoelectric element 60, and a reference voltage signal VBS is supplied to the other electrode of the piezoelectric element 60, i.e., the common electrode.

[0104] A protective substrate 641 is bonded to the +Z1 side surface of the flow path forming substrate 642. The protective substrate 641 forms a protective space 644 for protecting the piezoelectric element 60. Furthermore, a through hole 643 extending along the Z1 direction is provided on the protective substrate 641. The end of a lead electrode 611 extending from the electrode of the piezoelectric element 60 extends outwards, exposed inside the through hole 643. Moreover, the end of the lead electrode 611 exposed inside the through hole 643 is electrically connected to the wiring component 388.

[0105] Additionally, a housing 660, forming a portion of a manifold MN communicating with multiple pressure chambers CB, is fixed to the protective substrate 641 and the connecting plate 630. The housing 660 is joined to the protective substrate 641 and also to the connecting plate 630. Specifically, the housing 660 has a recess 665 on the -Z1 side surface for receiving the flow path forming substrate 642 and the protective substrate 641. The recess 665 has an opening area larger than the surface where the protective substrate 641 and the flow path forming substrate 642 are joined. Moreover, when the flow path forming substrate 642, etc., are received in the recess 665, the opening surface on the -Z1 side of the recess 665 is sealed by the connecting plate 630. Thus, the housing 660, the flow path forming substrate 642, and the protective substrate 641 divide the outer periphery of the flow path forming substrate 642 to form a supply communication channel RB1 and a supply communication channel RB2. Here, when it is not necessary to distinguish between the supply communication channel RB1 and the supply communication channel RB2, they are sometimes simply referred to as the supply communication channel RB.

[0106] Furthermore, a malleable substrate 620 is provided on the surfaces of the supply communication channel RA and the connection communication channel RX openings in the connecting plate 630. This malleable substrate 620 seals the openings of the supply communication channel RA and the connection communication channel RX. This malleable substrate 620 has a sealing film 621 and a fixing substrate 622. The sealing film 621 is formed of a flexible thin film or the like, and the fixing substrate 622 is formed of a hard material such as stainless steel.

[0107] The housing 660 is provided with an inlet channel 661 for supplying ink to the manifold MN. In addition, the housing 660 is provided with a connection port 662, which is an opening that communicates with the through hole 643 of the protective substrate 641 and extends along the Z1 direction, and the wiring component 388 is inserted into the connection port 662.

[0108] The wiring component 388 is a flexible component for electrically connecting the ejection module 23 to the head substrate 35, and an FPC can be used for example. Additionally, an integrated circuit 201 is mounted on the wiring component 388 via COF (Chip On Film). At least a portion of the aforementioned drive signal selection circuit 200 is mounted on this integrated circuit 201.

[0109] In the ejection module 23 configured as described above, the drive signal VOUT and the reference voltage signal VBS output by the drive signal selection circuit 200 are supplied to the piezoelectric element 60 via the wiring component 388. Furthermore, the piezoelectric element 60 is driven by the change in the potential difference between the drive signal VOUT and the reference voltage signal VBS. As the piezoelectric element 60 is driven, the vibrating plate 610 is displaced in the vertical direction, and the internal pressure of the pressure chamber CB changes. Moreover, the change in the internal pressure of the pressure chamber CB causes the ink stored inside the pressure chamber CB to be ejected from the corresponding nozzle N. Here, the ejection module 23, including the nozzle N, the nozzle communication channel RR, the pressure chamber CB, the piezoelectric element 60, and the vibrating plate 610, corresponds to the ejection section 600 described above.

[0110] return Figure 8 The fixing plate 39 is located on the -Z1 side of the ejection module 23. The fixing plate 39 fixes six ejection modules 23. Specifically, the fixing plate 39 has six openings 391 extending through the fixing plate 39 along the Z2 direction. The liquid injection surface 623a of the ejection module 23 is exposed from each of these six openings 391. That is, the six ejection modules 23 are fixed to the fixing plate 39 such that the liquid injection surface 623a is exposed from the corresponding opening 391.

[0111] The distribution flow path 37 is located on the +Z1 side of the ejection module 23. Four inlet portions 373 are provided on the +Z1 side surface of the distribution flow path 37. Each of the four inlet portions 373 is a flow path tube protruding from the +Z1 side surface of the distribution flow path 37 along the Z1 direction towards the +Z1 side, and communicates with a flow path hole (not shown) formed on the -Z1 side surface of the flow path structure 34. Additionally, the (not shown) flow path tube communicating with the four inlet portions 373 is located on the -Z1 side surface of the distribution flow path 37. This (not shown) flow path tube on the -Z1 side surface of the distribution flow path 37 communicates with the inlet channels 661 of each of the six ejection modules 23. Furthermore, the distribution flow path 37 has six openings 371 extending along the Z1 direction. Wiring components 388 of each of the six ejection modules 23 are inserted into these six openings 371.

[0112] The head substrate 35 is located on the +Z1 side of the distribution flow path 37. A wiring component FC, electrically connected to the assembly substrate 33 (described later), is mounted on the head substrate 35. Furthermore, four openings 351 and cutouts 352 and 353 are formed on the head substrate 35. Wiring components 388 of the ejection modules 23-2 to 23-5 are inserted through the four openings 351. Moreover, the wiring components 388 of each of the ejection modules 23-2 to 23-5 inserted through the four openings 351 are electrically connected to the head substrate 35 via solder or the like. Additionally, the wiring component 388 of the ejection module 23-1 passes through the cutout 352, and the wiring component 388 of the ejection module 23-6 passes through the cutout 353. Moreover, the wiring components 388 of each of the ejection modules 23-1 and 23-6 passing through the cutouts 352 and 353 are electrically connected to the head substrate 35 via solder or the like.

[0113] In addition, four cutouts 355 are formed at the four corners of the head substrate 35. The inlet portion 373 passes through the four cutouts 355. Moreover, the four inlet portions 373 after passing through the cutouts 355 are connected to the flow path structure 34 located on the +Z1 side of the head substrate 35.

[0114] The flow path structure 34 has a flow path plate Su1 and a flow path plate Su2. The flow path plate Su1 and the flow path plate Su2 are stacked along the Z1 direction with the flow path plate Su1 located on the +Z1 side and the flow path plate Su2 located on the -Z1 side, and are joined together by an adhesive or the like.

[0115] The flow path structure 34 has four inlet portions 341 protruding toward the +Z1 side along the Z1 direction on its +Z1 side surface. The four inlet portions 341 communicate with flow path holes (not shown) formed on the -Z1 side surface of the flow path structure 34 via ink flow paths formed inside the flow path structure 34. Furthermore, the flow path holes (not shown) formed on the -Z1 side surface of the flow path structure 34 communicate with the four inlet portions 373. Additionally, a through hole 343 extending along the Z1 direction is formed on the flow path structure 34. A wiring component FC, electrically connected to the head substrate 35, is inserted into the through hole 343. Furthermore, inside the flow path structure 34, in addition to the ink flow paths connecting the inlet portions 341 and the flow path holes (not shown) formed on the -Z1 side surface, a filter or similar device for capturing foreign matter contained in the ink flowing in these ink flow paths can also be provided.

[0116] The housing 31 is configured to cover and support the flow path structure 34, the head substrate 35, the distribution flow path 37, and the fixing plate 39. The housing 31 has four openings 311, a substrate insertion portion 313, and a holding member 315.

[0117] The flow path structure 34 has four inlet portions 341 that are respectively inserted into four opening portions 311. Moreover, ink is supplied from the liquid container 3 to the four inlet portions 341 that are inserted into the four opening portions 311 via a tube or the like (not shown).

[0118] The retaining member 315 holds the assembly substrate 33 in a state where a portion of the assembly substrate 33 is inserted into the assembly substrate insertion portion 313. A connecting portion 330 is provided on the assembly substrate 33. Various signals, such as data signals DATA, drive signals COMA, COMB, COMC, reference voltage signal VBS, and other power supply voltages, output from the head drive module 10 are input to the connecting portion 330 via the wiring member 30. Furthermore, the assembly substrate 33 is electrically connected to the wiring member FC of the head substrate 35. Thus, the assembly substrate 33 and the head substrate 35 are electrically connected. A semiconductor device including the aforementioned recovery circuit 220 may also be provided on the assembly substrate 33. In addition, Figure 8 The figure shows the case where the assembly substrate 33 has a connection portion 330. However, when the liquid ejection device 1 has multiple wiring components 30, and various signals such as data signal DATA, drive signal COMA, COMB, COMC, reference voltage signal VBS, and other power supply voltages output by the head drive module 10 are input to the assembly substrate 33 via the multiple wiring components 30, the assembly substrate 33 may also have multiple connection portions 330 corresponding to the multiple wiring components 30 respectively.

[0119] In the liquid ejection module 20 configured as described above, ink stored in the liquid container 3 is supplied via a pipe (not shown) connecting the liquid container 3 and the inlet 341. Furthermore, the ink supplied to the liquid ejection module 20 is guided through an ink flow path formed inside the flow path structure 34 to a flow path hole (not shown) formed on the -Z1 side surface of the flow path structure 34, and then supplied to four inlet sections 373 of the distribution flow path 37. The ink supplied to the distribution flow path 37 via the four inlet sections 373 is distributed to each of the six ejection modules 23 in the ink flow path (not shown) formed inside the distribution flow path 37, and then supplied to the inlet channel 661 of the corresponding ejection module 23. Moreover, the ink supplied to the ejection module 23 via the inlet channel 661 is stored in the pressure chamber CB included in the ejection section 600.

[0120] Furthermore, the head drive module 10 and the liquid ejection module 20 are electrically connected via one or more wiring components 30. Thus, various signals, including drive signals COMA, COMB, COMC, a reference voltage signal VBS, and a data signal DATA output from the head drive module 10, are supplied to the liquid ejection module 20. These various signals, including drive signals COMA, COMB, COMC, the reference voltage signal VBS, and the data signal DATA, are transmitted in the assembly substrate 33 and the head substrate 35. At this time, the recovery circuit 220 generates clock signals SCK1 to SCK6, printed data signals SI1 to SI6, and latch signals LAT1 to LAT6 corresponding to the ejection modules 23-1 to 23-6, respectively, based on the data signal DATA. Moreover, the integrated circuit 201, including the drive signal selection circuit 200 provided in the wiring component 388, generates drive signals VOUT corresponding to each of the n ejection sections 600 and supplies them to the piezoelectric elements 60 included in the corresponding ejection section 600. As a result, the piezoelectric element 60 is driven to eject the ink stored in the pressure chamber CB.

[0121] 1.4 Structure of the Head Driver Module

[0122] Next, refer to Figures 11 to 17 The structure of the head drive module 10 will be described here. Figures 11 to 17 The diagram illustrates arrows representing the mutually orthogonal X2, Y2, and Z2 directions, which are independent of the aforementioned X1, Y1, and Z1 directions. Furthermore, in... Figures 11 to 17 In the description, sometimes the starting side of an arrow representing the X2 direction is called the -X2 side, and the leading side is called the +X2 side; the starting side of an arrow representing the Y2 direction is called the -Y2 side, and the leading side is called the +Y2 side; the starting side of an arrow representing the Z2 direction is called the -Z2 side, and the leading side is called the +Z2 side. Additionally, in Figures 11 to 17 In the example below, we will explain the case where the Z2 direction is opposite to the direction of gravity, i.e., the upward direction. Additionally, in... Figures 11 to 17 In the example below, we will explain the case where the direction opposite to Z2 is the direction of gravity, i.e., the downward direction. Additionally, in... Figures 11 to 17 As an example, we will explain the case where the direction opposite to X2 is the conveying direction. Additionally, in... Figures 11 to 17In this embodiment, the case where the main scanning direction is parallel to the Y2 direction will be explained as an example. Additionally, the case where m=6 will be explained as an example below. Furthermore, in this embodiment, the head driving module 10 is an example of a driving circuit unit. Furthermore, in this embodiment, the liquid ejection module 20 is an example of a head. Furthermore, in this embodiment, the combination of the head driving module 10 and the liquid ejection module 20 is an example of a head unit. That is, in this embodiment, the head driving module 10 and the liquid ejection module 20 constitute a head unit. Furthermore, for ease of explanation, the direction in which liquid is ejected from the liquid ejection module 20 is referred to as the first direction, and the direction opposite to the first direction is referred to as the second direction. Furthermore, in this embodiment, the case where the first direction coincides with the downward direction will be explained as an example. Furthermore, in this embodiment, the case where the control circuit 100 and the conversion circuit 120 are included in a shared FPGA will be explained as an example. Furthermore, the conversion circuit 120 may also be configured not to be included in the FPGA.

[0123] Figure 11 This is a perspective view showing an example of the structure of the head drive module 10. Additionally, Figure 12 Observing from another direction Figure 11 A 3D view of the head drive module 10 shown. Additionally... Figure 13 Observing from bottom to top Figure 11 The top view of the head drive module 10 shown. Figures 11 to 13 As shown, the head drive module 10 includes a first substrate B1, a second substrate B2, a fan FN, a control circuit 100, a conversion circuit 120, a heat sink HS1, six drive circuit sections DRV, and a first connector CN1 to a fourth connector CN4. Alternatively, the head drive module 10 may be configured without the fan FN. In this case, the liquid discharge device 1, as a separate fan from the head drive module 10, includes, for example, one or more fans that cool the control circuit 100, the conversion circuit 120, the heat sink HS1, and the six drive circuit sections DRV.

[0124] The first substrate B1 is a power supply board that supplies power to the various components included in the head drive module 10. Additionally, the first substrate B1 is disposed in a position relative to the liquid ejection module 20 when the head drive module 10 is connected to it. Figure 11 The liquid ejection module 20 (not shown) is located on the substrate further to the second direction side. In addition, the first substrate B1 is a rectangular flat substrate, and the long side of each of the two surfaces of the first substrate B1, namely the first surface M1 and the second surface M2, extends in the Z2 direction, and the short side of each of the first surface M1 and the second surface M2 extends in the Y2 direction.

[0125] In this embodiment, the extension of a component's long side or short side toward a certain direction can refer to either the component extending along that direction or the component extending in a direction oblique to that direction. Hereinafter, as an example, for such... Figures 11 to 13 As shown, the first substrate B1 is a rectangular flat substrate in the form of a first surface M1 and a second surface M2, each extending its long side in the Z2 direction and its short side in the Y2 direction. In this case, as... Figures 11 to 13 As shown, the first surface M1 and the second surface M2 are both parallel to the first direction. Furthermore, when the length directions of the first surface M1 and the second surface M2 extend in a direction obliquely intersecting the Z2 direction, the first surface M1 and the second surface M2 are both obliquely intersecting the first direction.

[0126] Furthermore, the first substrate B1 can be configured to be connected to the liquid ejection module 20 via the wiring component 30, or it can be configured to be connected to the liquid ejection module 20 via a BtoB (board-to-board) connection without the wiring component 30.

[0127] On the first surface M1 of the first substrate B1, six drive circuit units DRVs and a second substrate B2 are mounted. For ease of explanation, these six drive circuit units DRVs will be referred to as drive circuit units DRV1 to DRV6. Furthermore, a first connector CN1 is provided at the -Z2 side of one of the ends of the first surface M1 of the first substrate B1. Additionally, a second connector CN2 and a third connector CN3 are provided at the +Z2 side of one of the ends of the second surface M2 of the first substrate B1. Thus, the first substrate B1 has a first connector CN1, a second connector CN2, and a third connector CN3.

[0128] The first connector CN1 is a connector for connecting a transmission cable that transmits drive signals output from drive circuits 52a, 52b, and 52c, respectively, included in the drive circuit section DRV (described later). The first connector CN1 is connected to the liquid ejection module 20, or to a wiring component 30 connected to the liquid ejection module 20. Therefore, the drive signal output from the drive circuit section DRV is output to the liquid discharge module 20 via the first connector CN1. Figures 11 to 13 In the example shown, the first connector CN1 is disposed on the first surface M1 of the two surfaces of the first substrate B1. Alternatively, the first connector CN1 may be disposed on the second surface M2 of the first substrate B1.

[0129] The second connector CN2 is a connector that connects to the power cable supplying power to the fan FN. The second connector CN2 is disposed on the second surface M2 of the first substrate B1. Alternatively, the second connector CN2 may be disposed on the first surface M1 of the first substrate B1.

[0130] The third connector CN3 is a connector that connects to a power cable that supplies power to the first substrate B1, which serves as a power supply board. The third connector CN3 is disposed on the second surface M2 of the first substrate B1. Alternatively, the third connector CN3 may also be disposed on the first surface M1 of the first substrate B1.

[0131] The i-th drive circuit section DRVi of the six drive circuit sections DRV is disposed on the first surface M1 of the first substrate B1. In other words, the drive circuit section DRVi is connected to the first surface M1 of the first substrate B1. The drive circuit section DRVi includes a drive signal output circuit 50-i. That is, the drive circuit section DRVi includes Figure 11 The circuit consists of three driving circuits (not shown in the diagram): driving circuit 52a, driving circuit 52b, and driving circuit 52c, and a reference voltage output circuit 53. Here, i is any integer from 1 to 6.

[0132] Additionally, the drive circuit section DRVi includes a third substrate B3 on which the drive signal output circuit 50-i is mounted and a heat sink HS2.

[0133] Here, as Figures 11 to 13 As shown, the third substrate B3 is connected to the first substrate B1 via a B-to-B connection and stands upright relative to the first substrate B1. Therefore, all connections of the third substrate B3 to other substrates are via B-to-B connections to the first substrate B1. Additionally, as... Figure 14 As shown, the third substrate B3 is a rectangular flat substrate with a drive signal output circuit 50-i mounted on it. Figure 14 This diagram shows a mounting example of the drive signal output circuit 50-1 on the third substrate B3 included in the drive circuit section DRV1. Furthermore, the mounting examples of drive signal output circuits 50-2 to 50-6 on the third substrate B3 are identical to the mounting example of drive signal output circuit 50-1 on the third substrate B3, and therefore descriptions are omitted. Figure 14In the example shown, on the third substrate B3 of the drive circuit section DRV1, three integrated circuits (ICs), three field-effect transistors (FETs), three coils (RCs), and one electrolytic capacitor (CP) constituting each of the drive circuits 52a, 52b, and 52c are mounted as Class D amplifier circuits. Furthermore, in this example, on the third substrate B3, the three ICs, three FETs, and three RCs are arranged in the order of three RCs, three FETs, and three ICs, facing the X2 direction. Additionally, in this example, the three ICs are arranged facing the Z2 direction. Also, in this example, the three FETs are arranged facing the Z2 direction. Furthermore, in this example, the three RCs are arranged facing the Z2 direction. Additionally, in this example, the electrolytic capacitor (CP) is located further towards the -X2 side than the three RCs. That is, in this example, the electrolytic capacitor (CP) is mounted on the third substrate B3 closer to the first substrate B1 than the drive circuits 52a, 52b, and 52c of the drive signal output circuit 50-1. Thus, in this example, for the third substrate B3, all electronic components that are taller than the drive circuits 52a, 52b, and 52c are mounted on a position closer to the first substrate B1 than the drive circuits 52a, 52b, and 52c. Furthermore, the third substrate B3 can also be configured to mount other types of capacitors instead of the electrolytic capacitor CP.

[0134] Furthermore, a fifth connector CN5 is provided at the -X2 side end of the third substrate B3 of the drive circuit section DRV1. The fifth connector CN5 is located closer to the +Y2 side than an electrolytic capacitor CP. The fifth connector CN5 is connected to a connector (not shown) provided on the first substrate B1. Thus, the drive circuit section DRV1 and the first substrate B1 are connected via a B-to-B connection. As a result, the drive circuit section DRV1 is connected to the first substrate B1 in a direction that intersects with the first substrate B1. Figures 11 to 13In the example shown, the drive circuit section DRV1 extends towards the first substrate B1 in a BtoB connection with the first substrate B1 in a direction orthogonal to the first substrate B1, i.e., the X2 direction. Furthermore, the fifth connector CN5 is a connector used to output drive signals from the drive circuits 52a, 52b, and 52c included in the drive circuit section DRV1 to the liquid discharge module 20 via the first substrate B1. Moreover, the fifth connector CN5 is a floating connector. Therefore, the head drive module 10 can suppress the transmission of vibrations generated by the rotation of the fan FN (described later) to the first substrate B1, and consequently, suppress the transmission of these vibrations to the drive circuits 52a, 52b, and 52c. Furthermore, in the head drive module 10, the fifth connector CN5 disposed on the third substrate B3 can be replaced, or, based on the fifth connector CN5 disposed on the third substrate B3, the connector in the first substrate B1 connected to the fifth connector CN5 can be a floating connector.

[0135] Here, as mentioned above, in Figure 14 In the example shown, on the third substrate B3, three integrated circuits (ICs), three field-effect transistors (FETs), and three coils (RCs) are arranged in the X2 direction in the order of three coils (RCs), three FETs, and three ICs. Therefore, the distance between the three coils (RCs) mounted on the third substrate B3 of the drive circuit section DRV1 and the fifth connector CN5 is shorter than the distance between the three integrated circuits (ICs) mounted on the third substrate B3 of the drive circuit section DRV1 and the fifth connector CN5. As a result, the head drive module 10 can shorten the wiring through which the drive signal output to the liquid ejection module 20 flows, thereby improving the stability of liquid ejection.

[0136] Heat sink HS2 is used to cool the drive signal output circuit 50-i. Heat sink HS2 is disposed on the third substrate B3 in such a way that it clamps the drive signal output circuit 50-i mounted on the third substrate B3 together with the third substrate B3. Figure 15 This is a diagram illustrating an example of the positional relationship between the heat sink HS2, the drive signal output circuit 50-i, and the third substrate B3 in more detail. Here, in Figures 11 to 13 , Figure 15In the example shown, the driving circuit section DRVi has a generally rectangular shape. This driving circuit section DRVi is composed of a third substrate B3 and a heat sink HS2 included in the driving circuit section DRVi. The heat sink HS2, located in the driving signal output circuit 50-i, comprises a first flat plate component HS21, a second flat plate component HS22, a first connecting component HS23 connecting the first flat plate component HS21 and the second flat plate component HS22, and multiple heat sinks Fns disposed on the first flat plate component HS21. The first flat plate component HS21 is a generally rectangular flat plate component that contacts the three integrated circuits IC and the three field-effect transistors FET on the third substrate B3. Figure 15 In the accompanying drawings, to simplify the illustrations, the three integrated circuits (ICs) on the third substrate B3 are shown as a single cuboid-shaped object. Additionally, in... Figure 15 To simplify the accompanying drawings, the three field-effect transistors (FETs) on the third substrate B3 are shown as a cuboid-shaped object. The second plate component HS22 is a generally rectangular plate-shaped component parallel to the first plate component HS21, and is located further from the third substrate B3 than the first plate component HS21. Furthermore, when viewing the heat sink HS2 in the Y2 direction, the +X2 side end of the second plate component HS22 overlaps with the -X2 side end of the first plate component HS21. The first connecting component HS23 is a generally rectangular plate-shaped component connecting these two ends, and is parallel to the YZ plane stretched by the Y2 and Z2 directions. Here, the three coils RC, electrolytic capacitor CP, etc., mounted on the third substrate B3 are located in the space between the second plate component HS22 and the third substrate B3. The multiple heat sinks Fns are rectangular plate-shaped heat sinks parallel to this YZ plane. Due to the configuration of the heat sink HS2, these multiple heat sinks Fns hardly obstruct airflow along the first or second direction. In addition, such as Figure 13 As shown, since the heat sink HS2 is configured not to include any rectangular flat plate-shaped components parallel to the XY plane stretched by the X2 and Y2 directions, the airflow flowing along the first or second direction is hardly obstructed by the heat sink HS2. As a result, the airflow flowing along the first or second direction can effectively dissipate heat from the drive circuit section DRVi.

[0137] like Figure 11 and Figure 12 As shown, the second substrate B2 is a rectangular flat substrate and serves as an interface board for mounting the control circuit 100 and the conversion circuit 120. More specifically, the second substrate B2 is mounted on the first surface M1 of the first substrate B1 at a position closer to the +Z2 side than the six drive circuit sections DRV. Furthermore, in Figure 11 and Figure 12 In the example shown, the second substrate B2 is connected to the first substrate B1 via a BtoB connection. Alternatively, the second substrate B2 may be configured to be connected to the first substrate B1 via a connection different from the BtoB connection. Furthermore, a fourth connector CN4 is provided at the +Z2 side of the ends of the second substrate B2. Therefore, in this example, in the head drive module 10, the first connector CN1, the six drive circuit units DRV, the fan FN, the conversion circuit 120, and the fourth connector CN4 are arranged in the following order: first connector CN1, six drive circuit units DRV, fan FN, conversion circuit 120, and fourth connector CN4.

[0138] The fourth connector CN4 is a connector that connects to the transmission cable that transmits signals such as image information signals IP input to the control circuit 100. Therefore, image information signals IP are input to the control circuit 100 via the fourth connector CN4. Additionally, the fourth connector CN4 is also a connector that receives control signals from the input conversion circuit 120. Therefore, control signals are input to the conversion circuit 120 via the fourth connector CN4. Here, as described above, the second substrate B2 and the first substrate B1 are connected B2B-to-B. Therefore, the conversion circuit 120 operates using power supplied from the first substrate B1 to the second substrate B2. On the other hand, the control signals are received by the fourth connector CN4 without passing through the first substrate B1. That is, the conversion circuit 120 receives control signals via the fourth connector CN4 without passing through the first substrate B1. Furthermore, the fourth connector CN4 is, for example, a right-angle connector, but it can be replaced by other types of connectors.

[0139] In addition, Figure 11 and Figure 12In the example shown, a fan FN is mounted on the second substrate B2. More specifically, in this example, the fan FN is mounted on the -Z2 side of the end portion of the second substrate B2. That is, the fan FN is mounted on the first substrate B1 via the second substrate B2. Therefore, compared to the case where the fan FN is directly mounted on the first substrate B1, the head drive module 10 can suppress the transmission of vibrations generated by the rotation of the fan FN to the first substrate B1. As a result, the transmission of these vibrations to the drive circuits 52a, 52b, and 52c can be suppressed. Furthermore, although the fan FN is mounted on the first substrate B1 via the second substrate B2, power is supplied to the fan FN from the first substrate B1 using a cable (not shown). That is, power supplied from the second connector CN2 is supplied to the fan FN via the first substrate B1 without going through the second substrate B2. In other words, the fan FN operates using power supplied from the first substrate B1. Alternatively, the fan FN can be mounted directly on the first substrate B1 instead of on the second substrate B2. Alternatively, the fan FN may not be mounted on either the first substrate B1 or the second substrate B2, but may be mounted by other methods such as fixing it to the frame HD with screws. In this example, the fan FN extends from the second substrate B2 toward the six drive circuit sections DRV side. Alternatively, the fan FN may not extend from the second substrate B2 toward the six drive circuit sections DRV side. Alternatively, the fan FN may be mounted on the second substrate B2 via a floating connector. In this case, the head drive module 10 can more reliably suppress the transmission of vibrations generated by the rotation of the fan FN to the first substrate B1. Furthermore, in this case, fixing the fan FN to the second substrate B2 only via the floating connector between the fan FN and the second substrate B2 can further reduce such vibrations transmitted to the first substrate B1.

[0140] The fan FN is an air supply device that generates airflow towards the respective drive circuits 52a, 52b, and 52c of drive signal output circuits 50-1 to 50-6. More specifically, the fan FN is an air supply device having blades that rotate about a predetermined rotation axis and supplying airflow in a direction parallel to that rotation axis. Furthermore, the fan FN is erected relative to the first substrate B1 via the second substrate B2. Moreover, in Figures 11 to 13In the example shown, the predetermined rotation axis is an axis parallel to the first direction and approximately parallel to the surface of the third substrate B3. Therefore, the fan FN can generate airflow parallel to the first direction and the surface of the third substrate B3 in a manner that reduces resistance to airflow. As a result, the fan FN can more reliably dissipate heat from the heat sink HS2 of the drive circuit section DRV and the heat sink HS1 (described later) through the airflow generated by the fan FN. That is, the head drive module 10 can effectively cool at least a portion of the drive circuits 52a, 52b, and 52c of each of the drive signal output circuits 50-1 to 50-6. Hereinafter, as an example, the case where the fan FN delivers airflow in a manner that generates airflow flowing in a second direction opposite to the first direction will be described. In addition, the fan FN can also be configured to deliver airflow in a manner that generates airflow flowing in the first direction. Furthermore, when directly mounted on the first substrate B1, the fan FN can also be configured to stand upright relative to the first substrate B1 without passing through the second substrate B2.

[0141] Additionally, a heat sink HS1 is provided on the FPGA (not shown) on the second substrate B2, which includes control circuitry 100 and conversion circuitry 120. The heat sink HS1 is used to cool the FPGA, etc. Figure 11 and Figure 12 In the example shown, the FPGA is mounted near the fan FN on the +Z2 side of the second substrate B2, between the heat sink HS2 and the second substrate B2. This allows the head drive module 10 to more reliably direct the airflow generated by the fan FN in a direction towards the first direction through the heat sink HS1. As a result, the head drive module 10 can improve the cooling efficiency of the FPGA. Here, the height of the heat sink HS1 is lower than the radius of the cylindrical area swept by the rotation of the blades rotating around the rotation axis of the fan FN. In other words, the height of the heat sink HS1 in the direction orthogonal to the second substrate B2 is lower than the radius of the cylindrical area swept by the rotation of the blades rotating around the rotation axis of the fan FN. In this example, the head drive module 10 can both suppress the reduction of the FPGA's cooling efficiency and prevent the heat sink HS1 from obstructing airflow. Furthermore, the fan FN may have eight blades, but is not limited to this; it may also have five, twelve, or other blades. Additionally, the rotational speed of the fan FN is set to a speed that does not resonate with surrounding components such as the second substrate B2.

[0142] Here, when the fan FN is mounted on the first substrate B1 via the second substrate B2 or without the second substrate, compared to the case where the fan FN is fixed to the first substrate B1 using clamps, components, etc., the head drive module 10 can reduce the size of the direction orthogonal to the first substrate B1, i.e., the conveying direction, by an amount corresponding to the clamps, components, etc. used to fix the fan FN. As a result, the liquid ejection device 1 can suppress the increase in size in the conveying direction. This is useful for miniaturizing the liquid ejection device 1.

[0143] In addition, Figures 11 to 13 In the example shown, such as Figure 16 As shown, the height of the first object, which is the highest among the objects mounted on the first surface M1 of the first substrate B1 in the direction orthogonal to the first surface M1, is less than or equal to the length of the liquid ejection module 20 in the conveying direction. Figure 16 This is a diagram comparing the length of the liquid ejection module 20 in the conveying direction with the height of the highest first object in the direction orthogonal to the first surface M1. Here, in Figures 11 to 13 , Figure 16 In the example shown, the first object is the drive circuit section DRV, but it could also be other components mounted on the first substrate B1, such as the fan FN, or a combination of two or more components mounted on the first substrate B1, such as both the drive circuit section DRV and the fan FN. In this case, the head drive module 10 can more reliably suppress the increase in the magnitude of the conveying direction. That is, by having a head drive module 10 configured in this way, the liquid ejection device 1 can more reliably suppress the increase in the magnitude of the conveying direction. Furthermore, as Figure 16 and Figure 17 As shown, the length of the liquid ejection module 20 in the conveying direction is represented, for example, by the length DS1 of the distribution flow path 37 in the conveying direction. Figure 17 This is a diagram illustrating an example of the distribution flow path 37 when viewed in the second direction. (See diagram below.) Figure 17 As shown, length DS1 is the length of the longest part in the conveying direction among the parts of the distribution flow path 37.

[0144] Furthermore, the head drive module 10 may also be configured such that the sum of the height of the first object in the direction orthogonal to the first surface M1 and the height of the second object in the direction orthogonal to the second surface M2 is less than or equal to the length of the head drive module 10 in the conveying direction. Here, the second object is the tallest object in the direction orthogonal to the second surface M2 among the two objects mounted on the second surface M2, which is opposite to the first surface M1. Examples of the second object include, for example, an electrolytic capacitor CP, a second connector CN2, a third connector CN3, etc., but it is not limited to these. In this case, the head drive module 10 can more reliably suppress the increase in the magnitude of the conveying direction. That is, by having a head drive module 10 with such a configuration, the liquid ejection device 1 can more reliably suppress the increase in the magnitude of the conveying direction.

[0145] In addition, Figures 11 to 13 In the example shown, as described above, the first object is the drive circuit section (DRV). In this case, when viewing the six drive circuit sections (DRV) in the first direction, as... Figure 13 As shown, the fan FN is contained within the outline OL of a virtual region that surrounds the six drive circuit sections DRV in a manner that minimizes the area. In other words, the six drive circuit sections DRV, namely the drive circuits 52a, 52b, and 52c of each of the drive signal output circuits 50-1 to 50-6, all converge within the range obtained by projecting the fan FN along the rotation axis direction of the fan FN. That is, in this example, the head drive module 10 uses a fan FN of such size that the fan FN is contained within the outline OL in this case. As a result, the head drive module 10 can suppress the length in the transport direction from increasing due to the size of the fan FN. In addition, in this example, the fan FN is used to the extent that it is contained within the outline of the first substrate B1 when viewed from a direction orthogonal to the first substrate B1. More specifically, in a direction orthogonal to the rotation axis of the fan FN and parallel to the first surface M1 of the first substrate B1, the length of the fan FN is more than 0.8 times and less than 1 times the length of the first substrate B1. As a result, the head drive module 10 can suppress the length in the main scanning direction from increasing due to the size of the fan FN.

[0146] In addition, Figures 11 to 13In the example shown, the drive circuit section DRV, the fan, and the control circuit 100 are arranged in the second direction in the order of drive circuit section DRV, fan FN, and control circuit 100. Therefore, in this example, the fan FN is positioned in the first direction between a connector (not shown) and the drive circuit section DRV, which is connected to a cable transmitting control signals from the second substrate B2 to the first substrate B1. Thus, the airflow generated by the fan FN can cool the drive circuit section DRV, the fan FN, and the control circuit 100 with minimal reduction in cooling efficiency. Alternatively, the drive circuit section DRV, the fan, and the control circuit 100 can be mounted on the first substrate B1 in the second direction in the order of drive circuit section DRV, control circuit 100, and fan FN. In this case, the fan FN is positioned in the first direction between the fourth connector CN4 and the control circuit 100. Even in this case, the airflow generated by the fan FN can cool the drive circuit section DRV, the fan FN, and the control circuit 100 with minimal reduction in cooling efficiency. Furthermore, the drive circuit section DRV does not obstruct the airflow generated by the fan FN. Therefore, the head drive module 10 can suppress the noise generated by the airflow generated by the fan FN.

[0147] In addition, Figures 11 to 13 In the example shown, the length of the longest third object in the main scanning direction among the objects mounted on the first surface M1 of the first substrate B1 is less than or equal to the length DS2 of the liquid ejection module 20 in the main scanning direction. Here, in this example, the third object is the second substrate B2, but it could also be other components mounted on the first substrate B1, such as a fan FN. In this case, the head drive module 10 can more reliably suppress the increase in size in the main scanning direction. That is, by having a head drive module 10 configured in this way, the liquid ejection device 1 can more reliably suppress the increase in size in the main scanning direction. Furthermore, as... Figure 17 As shown, the length DS2 is represented, for example, by the length of the distribution flow path 37 in the main scan direction. Figure 17 As shown, the length DS2 is the length of the longest part in the main scanning direction among the parts of the distribution flow path 37.

[0148] In addition, Figures 11 to 13In the example shown, in the head drive module 10, the first connector CN1, the six drive circuit units DRV, the fan FN, the conversion circuit 120, and the second connector CN2 are arranged in the second direction in the following order: first connector CN1, six drive circuit units DRV, fan FN, conversion circuit 120, and second connector CN2. Therefore, in the head drive module 10, the fan FN can simultaneously cool the six drive circuit units DRV and the conversion circuit 120. As a result, the head drive module 10 can improve the cooling efficiency of the six drive circuit units DRV and the conversion circuit 120.

[0149] like Figure 18 As shown, the head drive module 10 with the structure described above can also be configured to have a cooling mechanism CLR. Figure 18 This is a diagram illustrating an example of the structure of a head drive module 10 equipped with a cooling mechanism CLR.

[0150] The cooling mechanism CLR includes an air guide section WR, a second air guide section WR2, a rectifier plate CMT, and a frame HD.

[0151] The air guide section WR is a component that guides the airflow generated by the fan FN and covers the drive circuit section DRV on the first surface M1. Therefore, except for the upper opening HL1 and the lower opening HL2, the air guide section WR, together with the first substrate B1, surrounds the third substrate B3. The upper opening HL1 is an opening formed on the +Z2 side of the area surrounded by the air guide section WR and the first substrate B1. Therefore, the upper opening HL1 is formed by the +Z2 side end of the end of the air guide section WR and the first substrate B1. In addition, the lower opening HL2 is an opening formed on the -Z2 side of the area surrounded by the air guide section WR and the first substrate B1. Therefore, the lower opening HL2 is formed by the -Z2 side end of the end of the air guide section WR and the first substrate B1. The air guide section WR is configured, for example, to include a third plate component, a fourth plate component, and a fifth plate component. The third plate component is a rectangular plate-shaped component parallel to the first surface M1 of the first substrate B1, and is a component separate from the first substrate B1. The fourth plate component is a rectangular plate-shaped component orthogonal to the first surface M1 of the first substrate B1, and extends towards and abuts against the first substrate B1 from the end of the third plate component on the -Y2 side. The fifth plate component is a rectangular plate-shaped component orthogonal to the first surface M1 of the first substrate B1, and extends towards and abuts against the first substrate B1 from the end of the third plate component on the +Y2 side. Figure 18In the example shown, the third, fourth, and fifth plate components are integrally formed as the air guide WR. That is, in this example, each of the third, fourth, and fifth plate components is formed by bending a rectangular plate-shaped metal sheet. When the air guide WR is composed of the third, fourth, and fifth plate components, the upper opening HL1 is formed by the +Z2 side end of each of the third, fourth, and fifth plate components and the first substrate B1. In this case, the lower opening HL2 is formed by the -Z2 side end of each of the third, fourth, and fifth plate components and the first substrate B1. Alternatively, some or all of the third, fourth, and fifth plate components can be separately constructed. Furthermore, either or both of the fourth and fifth plate components can be fixed to the first substrate B1 in a manner that prevents relative movement using screws or other fixing components. In this example, the air guide WR is fixed to the frame HD (described later) in a manner that prevents relative movement. Additionally, the fourth plate component can also be separated from the first substrate B1. In this case, the gap between the fourth plate component and the first substrate B1 may be blocked by the frame HD, for example. Alternatively, the fifth plate component may also be detached from the first substrate B1. In this case, the gap between the fifth plate component and the first substrate B1 may be blocked by the frame HD, for example.

[0152] Here, in Figure 18 In the example shown, when the head drive module 10 is viewed in a direction opposite to the X2 direction, the third plate component completely covers the six drive circuit sections (DRV). Therefore, in Figure 18In this example, the six drive circuit sections DRV are not visible. Furthermore, the fan FN, upper opening HL1, six drive circuit sections DRV, lower opening HL2, and first connector CN1 are arranged in the order of fan FN, upper opening HL1, six drive circuit sections DRV, lower opening HL2, and first connector CN1, facing the first direction. In addition, in this case, the third plate component may be configured to cover a portion of the six drive circuit sections DRV, or to cover a portion or all of the six drive circuit sections DRV and fan FN, or to cover a portion or all of the six drive circuit sections DRV, fan FN, and control circuit 100, or to cover a portion or all of the objects mounted on the first substrate B1. In this example, the third plate component covers the six drive circuit sections DRV but not the fan FN. In this example, the fan FN is located at the air inlet / outlet on the +Z2 side of the air guide section WR. That is, in this example, the air guide section WR is fixed to the frame HD with six drive circuit sections DRV located within the space surrounded by the third plate member, the fourth plate member, the fifth plate member, and the first substrate B1, and the fan FN located at the inlet / outlet on the +Z2 side of this space. Alternatively, the fan FN can be configured to span both the inner side of the air guide section WR (i.e., the space) and the air inlet / outlet on the +Z2 side of the air guide section WR. Alternatively, the fan FN can be configured to be located at the -Z2 side of the air guide section WR.

[0153] The air guide section WR configured in this way does not include any components that obstruct the airflow generated by the fan FN in the second direction. Therefore, as described above, the air guide section WR guides the airflow generated by the fan FN. In this example, the fan FN delivers air in a manner that generates airflow flowing in the second direction. The airflow flowing in the second direction is from the lower opening HL2 towards the upper opening HL1. Moreover, in this case, the air guide section WR guides the airflow generated by the fan FN from the air inlet / outlet on the -Z2 side of the air guide section WR towards the air inlet / outlet on the +Z2 side of the air guide section WR. That is, in this case, the air guide section WR guides the airflow generated by the fan FN from the lower opening HL2 towards the upper opening HL1. Furthermore, when the fan FN delivers air in a manner that generates airflow flowing in the first direction, the air guide section WR guides the airflow generated by the fan FN from the air inlet / outlet on the +Z2 side of the air guide section WR towards the air inlet / outlet on the -Z2 side of the air guide section WR. The head drive module 10, by providing an air guide section WR, improves the cooling efficiency of the fan FN for each of the six drive circuit sections DRV by guiding the airflow. Furthermore, in this example where the fan FN generates airflow in the second direction, the lower opening HL2 is an example of a first opening. In this case, the upper opening HL1 is an example of a second opening. Conversely, in another example where the fan FN generates airflow in the first direction, the upper opening HL1 is an example of a first opening. In this case, the lower opening HL2 is an example of a second opening.

[0154] The second air guide WR2 adjusts the airflow between the end of the first substrate B1 opposite to the first connector CN1 and the fan FN. More specifically, the second air guide WR2 is a component that, together with the first substrate B1, covers the area between this end and the fan FN. Therefore, except for the second upper opening HL3 and the second lower opening HL4, the second air guide WR2, together with the first substrate B1, surrounds the area between this end and the fan FN. The second upper opening HL3 is an opening formed on the +Z2 side of the area surrounded by the second air guide WR2 and the first substrate B1. Therefore, the second upper opening HL3 is formed by the +Z2 side end of the second air guide WR2 and the first substrate B1. Similarly, the second lower opening HL4 is an opening formed on the -Z2 side of the area surrounded by the second air guide WR2 and the first substrate B1. Therefore, the second lower opening HL4 is formed by the -Z2 side end of the second air guide WR2 and the first substrate B1. The second air guide section WR2 is, for example, composed of a sixth plate component, a seventh plate component, and an eighth plate component. The sixth plate component is a rectangular plate component parallel to the first surface M1 of the first substrate B1, and is separate from the first substrate B1. The seventh plate component is a rectangular plate component orthogonal to the first surface M1 of the first substrate B1, and extends from the -Y2 side of the end of the sixth plate component toward the first substrate B1 and abuts against the first substrate B1. The eighth plate component is a rectangular plate component orthogonal to the first surface M1 of the first substrate B1, and extends from the +Y2 side of the end of the sixth plate component toward the first substrate B1 and abuts against the first substrate B1. Figure 18In the example shown, the sixth, seventh, and eighth plate components are integrally formed as the second air guide WR2. That is, in this example, each of the sixth, seventh, and eighth plate components is formed by bending a rectangular plate-shaped metal sheet. When the second air guide WR2 is composed of the sixth, seventh, and eighth plate components, the second upper opening HL3 is formed by the +Z2 side end of each of the sixth, seventh, and eighth plate components and the first substrate B1. In this case, the second lower opening HL4 is formed by the -Z2 side end of each of the sixth, seventh, and eighth plate components and the first substrate B1. Furthermore, some or all of the sixth, seventh, and eighth plate components can also be separately formed. Additionally, either or both of the seventh and eighth plate components can be fixed to the first substrate B1 in a manner that prevents relative movement using screws or other fixing components. In this example, the second air guide WR2 is integrally formed with the frame HD described later. Alternatively, the seventh plate component can also be separated from the first substrate B1. In this case, the gap between the seventh plate component and the first substrate B1 is blocked, for example, by the frame HD. Alternatively, the eighth plate component can also be separated from the first substrate B1. In this case, the gap between the eighth plate component and the first substrate B1 is blocked, for example, by the frame HD.

[0155] Here, in Figure 18 In the example shown, when viewing the head drive module 10 in a direction opposite to the X2 direction, the sixth plate component covers a portion of the second substrate B2. Therefore, in Figure 18 In this configuration, a portion of the second substrate B2 is not visible. Furthermore, in this case, the sixth plate member may also be configured to completely cover the second substrate B2. Additionally, the second air guide WR2 may be integrally formed with the air guide WR.

[0156] The second air guide WR2, configured in this way, does not include any components that obstruct the airflow generated by the fan FN in the second direction. Therefore, the second air guide WR2 guides the airflow generated by the fan FN. In this example, the fan FN delivers air in a manner that generates airflow flowing in the second direction. The airflow flowing in the second direction is from the second lower opening HL4 towards the second upper opening HL3. Furthermore, in this case, the second air guide WR2 guides the airflow generated by the fan FN from the air inlet / outlet on the -Z2 side of the second air guide WR2 towards the air inlet / outlet on the +Z2 side of the second air guide WR2. That is, the second air guide WR2 guides the airflow generated by the fan FN from the second lower opening HL4 towards the second upper opening HL3. Additionally, when the fan FN delivers air in a manner that generates airflow flowing in the first direction, the second air guide WR2 guides the airflow generated by the fan FN from the air inlet / outlet on the +Z2 side of the second air guide WR2 towards the air inlet / outlet on the -Z2 side of the second air guide WR2. That is, in this case, the second air guide WR2 guides the airflow generated by the fan FN from the second upper opening HL3 toward the second lower opening HL4. By having the second air guide WR2, the head drive module 10 can improve the cooling efficiency of the fan FN on the second substrate B2 as a result of guiding the airflow in this way.

[0157] Furthermore, when the fan FN, upper opening HL1, third substrate B3, lower opening HL2, and first connector CN1 are arranged in the order of upper opening HL1, third substrate B3, lower opening HL2, fan FN, and first connector CN1, as in the other example described above, the second air guide WR2 adjusts the airflow between the end of the first substrate B1 opposite to the first connector CN1 and the upper opening HL1. Additionally, the second air guide WR2 can also be referred to as a second rectifier mechanism.

[0158] The rectifier plate (CMT) is a plate-shaped component that intersects the first direction. The rectifier plate (CMT) can also be referred to as a first rectification mechanism. In this example, when the fan FN generates airflow flowing in the second direction, the rectifier plate (CMT) rectifies the airflow entering between the first surface M1 and the air guide WR from the air inlet / outlet on the -Z2 side of the air guide WR, directing it towards the second direction. In other words, in this case, the rectifier plate (CMT) rectifies the airflow entering in the direction intersecting the second direction towards the second direction. Furthermore, when the fan FN generates airflow flowing in the first direction, the rectifier plate (CMT) rectifies the airflow exiting between the first surface M1 and the air guide WR from the air inlet / outlet on the +Z2 side of the air guide WR, directing it towards the direction intersecting the first direction.

[0159] The surface of the rectifier board (CMT) can be flat, curved, or have an uneven surface. Figure 18In the example shown, the rectifier plate CMT is a rectangular flat plate. Furthermore, in this example, the air inlet / outlet of the rectifier plate CMT on the -Z2 side of the air guide section WR is fixed to the frame HD such that its -X2 side end abuts against the first substrate B1, and it is inclined in the Z2 direction from the +X2 side end towards the -X2 side end. In other words, the rectifier plate CMT is positioned between the liquid ejection module 20 and the six drive circuit sections DRV. Further, the rectifier plate CMT is positioned further towards the first direction than the six drive circuit sections DRV. In this case, the space between the air guide section WR and the rectifier plate CMT is open in the X2 direction. That is, an air intake HL is formed in the cooling mechanism CLR to supply air flowing in the order of the rectifier plate CMT and the air guide section WR. The intake port HL is composed of the +X2 side end of the rectifier plate CMT, the -Z2 side end of the third plate member constituting the air guide WR, and two plate-shaped members constituting the frame HD that hold the rectifier plate CMT and the air guide WR in a clamping manner from the -Y2 side and the +Y2 side. Therefore, the air guide WR is positioned between the fan FN and the intake port HL. By forming such an intake port HL in the cooling mechanism CLR, air guided to the air guide WR by the fan FN is supplied from the intake port HL in a direction opposite to the X2 direction to the inside of the head drive module 10, and is guided by the rectifier plate CMT into the space inside the air guide WR. As a result, compared to the case where air is supplied to the inside of the head drive module 10 from the -Z2 side end, the head drive module 10 can suppress the airflow generated by the fan FN from affecting the liquid ejection module 20 while maintaining the air cooling effect of the fan FN. In other words, compared to this situation, the head drive module 10 can maintain the cooling effect of each of the drive circuits 52a, 52b, and 52c, and suppress the displacement of the landing position of the liquid ejected from the liquid ejection module 20 due to the airflow generated by the fan FN. Furthermore, when the airflow flows in the second direction as in this example, the head drive module 10 can suppress short circuits caused by ink mist liquefaction. Moreover, these effects are particularly significant when the head drive module 10 is connected to the liquid ejection module 20 without the wiring component 30. Here, when the head drive module 10 is not connected to the liquid ejection module 20 without the wiring component 30, the head drive module 10 and the liquid ejection module 20 are connected via a B2B connection. More specifically, in this case, the head drive module 10 is connected via a B2B connection directly above the liquid ejection module 20. Furthermore, when the head drive module 10 is connected to the liquid ejection module 20 via the wiring component 30, the head drive module 10 is fixed in such a way that the rotation axis of the fan FN is approximately parallel to the first direction and does not move relative to the liquid ejection module 20. Such fixing of the head drive module 10 is performed, for example, by various clamps, fixing components, etc.However, even if the rotation axis of fan FN is tilted by a few degrees from the first direction, it is treated as if it were parallel to the first direction.

[0160] In this example, since the fan FN, upper opening HL1, third substrate B3, lower opening HL2, and first connector CN1 are arranged in the order of fan FN, upper opening HL1, third substrate B3, lower opening HL2, and first connector CN1 facing the first direction, and the fan FN generates airflow in the second direction, the rectifier board CMT changes the direction of the airflow from the direction closer to the first substrate B1 to the direction parallel to the first substrate B1 between the lower opening HL2 and the first connector CN1. Furthermore, when the fan FN, upper opening HL1, third substrate B3, lower opening HL2, and first connector CN1 are arranged in the order of upper opening HL1, third substrate B3, lower opening HL2, fan FN, and first connector CN1 facing the first direction, and the fan FN generates airflow in the second direction, the rectifier board CMT changes the direction of the airflow from the direction closer to the first substrate B1 to the direction parallel to the first substrate B1 between the fan FN and the first connector CN1. Furthermore, when the fan FN, upper opening HL1, third substrate B3, lower opening HL2, and first connector CN1 are arranged in the order of fan FN, upper opening HL1, third substrate B3, lower opening HL2, and first connector CN1 facing the first direction, and the fan FN generates airflow in the first direction, the rectifier board CMT changes the direction of the airflow between the lower opening HL2 and the first connector CN1 from a direction substantially parallel to the first substrate B1 to a direction away from the first substrate B1. Also, when the fan FN, upper opening HL1, third substrate B3, lower opening HL2, and first connector CN1 are arranged in the order of upper opening HL1, third substrate B3, lower opening HL2, fan FN, and first connector CN1 facing the first direction, and the fan FN generates airflow in the first direction, the rectifier board CMT changes the direction of the airflow between the fan FN and the first connector CN1 from a direction substantially parallel to the first substrate B1 to a direction away from the first substrate B1.

[0161] In addition, Figure 18In the example shown, a slit SL is provided at the air intake HL. The slit SL is composed of multiple rectangular plate-shaped components that connect two plate-shaped components that hold the rectifier plate CMT and the air guide WR between the -Y2 and +Y2 sides of the frame HD. In other words, the slit SL is formed as part of the frame HD. As a result, the head drive module 10 can suppress the reduction in strength of the frame HD caused by the formation of the air intake HL. In addition, the head drive module 10 can suppress ink mist from entering the interior of the head drive module 10. Furthermore, this effect is particularly significant when the head drive module 10 is connected to the liquid ejection module 20 without the wiring component 30.

[0162] like Figure 19 As shown, the liquid ejection module 20 connected to the head drive module 10 described above constitutes a head unit HU in the liquid ejection device 1. That is, the liquid ejection device 1 has multiple head units HU, with the liquid ejection module 20 connected to the head drive module 10 serving as a single head unit HU. Furthermore, in the liquid ejection device 1, these multiple head units HU constitute a row head. Figure 19 This is a diagram illustrating multiple head units HU configured as horizontal heads in a liquid ejection device 1. Furthermore, in Figure 19 In the example shown, the head drive module 10 of each head unit HU is connected to the liquid ejection module 20 via the wiring component 30. However, as described above, the head drive module 10 of each head unit HU can also be connected to the liquid ejection module 20 via a B2B connection without using the wiring component 30.

[0163] In addition, Figure 19 In the example shown, the header unit HU constitutes three line headers. Therefore, for ease of explanation, the three header units HU constituting the first line header will be referred to as header unit HU11, header unit HU12, and header unit HU13, respectively. Similarly, for ease of explanation, the three header units HU constituting the second line header will be referred to as header unit HU21, header unit HU22, and header unit HU23, respectively. Therefore, for ease of explanation, the three header units HU constituting the third line header will be referred to as header unit HU31, header unit HU32, and header unit HU33, respectively.

[0164] The first row head is, for example, a row head composed of head units HU11 to HU13 of a liquid ejection module 20 that ejects magenta liquid. The second row head is, for example, a row head composed of head units HU21 to HU23 of a liquid ejection module 20 that ejects cyan liquid. The third row head is, for example, a row head composed of head units HU31 to HU33 of a liquid ejection module 20 that ejects yellow liquid.

[0165] exist Figure 19 In the example shown, the head units HU11 to HU13 in the first row head are arranged in the order of head unit HU11, head unit HU12, and head unit HU13, facing the Y2 direction. Alternatively, the head units HU11 to HU13 in the first row head can be arranged in a direction different from the Y2 direction. In this case, the direction in which the head units HU11 to HU13 in the first row head are arranged is parallel to the rectifier plate CMT. In this case, the airflow passing through the intake ports HL of each of the head units HU11 to HU13 in the first row head has almost no impact on the flow of liquid ejected from adjacent head units HU. More specifically, the airflow passing through the intake port HL of head unit HU11 has almost no impact on the flow of liquid ejected from adjacent head unit HU12. Furthermore, the airflow passing through the intake port HL of head unit HU12 has almost no impact on the flow of liquid ejected from adjacent head units HU11 and HU13 respectively. Furthermore, the airflow through the intake port HL of head unit HU13 has almost no impact on the movement of the liquid ejected from the adjacent head unit HU12. That is, when the direction in which the head units HU in the row head are arranged is parallel to the rectifier plate CMT, the liquid ejection device 1 can more reliably suppress the deviation of the liquid's landing position caused by the airflow generated by the fan FN in the row head. The same applies to the second and third row heads. Therefore, the following explanation regarding the arrangement direction of the head units HU in the second and third row heads is omitted.

[0166] Alternatively, the head units HU11 to HU13 included in the first row head can be arranged in the order of head unit HU11, head unit HU12, and head unit HU13, oriented in a direction inclined from the Y2 direction. In this case, the head drive module 10 included in each of the head units HU11 to HU13 includes, for example, a rectifier plate CMT parallel to the direction in which the head units HU11, HU12, and HU13 are arranged. Thus, even in this case, the liquid ejection device 1 can more reliably suppress the displacement of the liquid landing position caused by the airflow generated by the fan FN in the row head.

[0167] As explained above, the drive circuit unit in this embodiment drives a head including a nozzle that ejects liquid from a nozzle in a first direction based on a received drive signal. It includes a power supply board that supplies power to the drive circuit and a fan mounted on the power supply board. This allows the drive circuit unit to suppress increases in size along the delivery direction. Furthermore, in the example described above, the head drive module 10 is an example of this drive circuit unit. Also, in the example described above, the nozzle opening of the ejection section 600 is an example of this nozzle. Also, in the example described above, the gravity direction is an example of this first direction. Also, in the example described above, the ejection section 600 is an example of this ejection section. Also, in the example described above, the liquid ejection module 20 is an example of this head. Also, in the example described above, each of the drive circuits 52a, 52b, and 52c is an example of this drive circuit. Also, in the example described above, the first substrate B1 is an example of this power supply board. Also, in the example described above, the fan FN is an example of this fan. Furthermore, in the example described above, the liquid ejection device 1 is one example of such a liquid ejection device. Additionally, the liquid ejection device 1 is not limited to ejecting liquid by driving a piezoelectric element; it can also be a liquid ejection device using other methods, such as a thermoelectric method. Moreover, the liquid ejection device 1 is a device that ejects liquid by moving the ejection unit 5 relative to the medium P, but it is also possible to move the ejection unit 5 without moving the medium P.

[0168] Furthermore, the drive circuit unit involved in the embodiment is a drive circuit unit that drives a head including a spray section that sprays liquid from a nozzle in a first direction according to a received drive signal. The drive circuit unit is connected to the head via a B2B connection. The drive circuit unit includes a drive circuit that generates a drive signal and a cooling mechanism that cools the drive circuit. The cooling mechanism includes an air guide and a rectifier plate. The air guide guides the airflow generated by the fan and covers the drive circuit. The rectifier plate intersects the first direction and is disposed between the head and the drive circuit. Thus, the drive circuit unit can maintain the cooling effect of the drive circuit and suppress the displacement of the liquid landing position caused by the airflow generated by the fan. In addition, in the example described above, the head drive module 10 is an example of this drive circuit unit. In addition, in the example described above, the nozzle opening of the spray section 600 is an example of this nozzle. In addition, in the example described above, the gravity direction is an example of the first direction. In addition, in the example described above, the spray section 600 is an example of this spray section. In addition, in the example described above, the liquid spray module 20 is an example of this head. Furthermore, in the examples described above, drive circuits 52a, 52b, and 52c are each an example of such a drive circuit. Additionally, in the examples described above, the cooling mechanism CLR is an example of such a cooling mechanism. Furthermore, in the examples described above, the fan FN is an example of such a fan. Furthermore, in the examples described above, the air guide WR is an example of such an air guide. Furthermore, in the examples described above, the rectifier plate CMT is an example of such a rectifier plate.

[0169] Furthermore, the drive circuit unit involved in the embodiment is a drive circuit unit connected to a head connector located on the opposite side of the nozzle of the head. It includes: a first substrate having a first connector connected to the head connector; a third substrate carrying a drive circuit for generating drive signals; and a fan that generates airflow. The drive signal is supplied from the third substrate to the first connector via the first substrate. The third substrate and the first substrate are connected via a B2B connection and are upright relative to the first substrate. The fan is also upright relative to the first substrate, and the fan's rotation axis is approximately parallel to the surface of the third substrate. Thus, the drive circuit unit can both suppress large size and effectively cool the drive circuit. In the example described above, the head drive module 10 is an example of this drive circuit unit. In the example described above, the liquid ejection module 20 is an example of a head. In the example described above, the nozzle opening of the ejection section 600 is an example of the nozzle. In the example described above, the connection section 330 is an example of the head connector. In the example described above, the first connector CN1 is an example of the first connector. Furthermore, in the examples described above, the first substrate B1 is an example of the first substrate. Additionally, in the examples described above, each of the drive circuits 52a, 52b, and 52c is an example of the drive circuit. Furthermore, in the examples described above, the third connector B3 is an example of the third substrate. Furthermore, in the examples described above, the fan FN is an example of the fan.

[0170] Furthermore, the drive circuit unit involved in the embodiment is a drive circuit unit that generates drive signals for the drive head, comprising: a first connector for connecting to the head; a drive circuit for generating drive signals; a fan for generating airflow toward the drive circuit; and a conversion circuit for converting control signals for the control head. The first connector, drive circuit, fan, and conversion circuit are arranged in the order of first connector, drive circuit, fan, and conversion circuit. Thus, the drive circuit unit can both suppress large size and effectively cool the drive circuit. In the example described above, the head drive module 10 is an example of this drive circuit unit. In the example described above, the liquid ejection module 20 is an example of a head. In the example described above, the first connector CN1 is an example of this first connector. In the example described above, each of the drive circuits 52a, 52b, and 52c is an example of this drive circuit. In the example described above, the fan FN is an example of this fan. In the example described above, the conversion circuit 120 is an example of this conversion circuit.

[0171] Furthermore, the driving circuit unit involved in the embodiment is a driving circuit unit that generates a driving signal for the driving head, and includes: a driving circuit for generating the driving signal; a first connector for connecting to the head; a first substrate for mounting the first connector; a fan for generating airflow toward the driving circuit; and a second substrate for mounting the fan. Thus, the driving circuit unit can suppress the transmission of vibrations generated by the rotation of the fan to the driving circuit. In the example described above, the head driving module 10 is an example of this driving circuit unit. In the example described above, the liquid ejection module 20 is an example of a head. In the example described above, each of the driving circuits 52a, 52b, and 52c is an example of this driving circuit. In the example described above, the first connector CN1 is an example of this first connector. In the example described above, the first substrate B1 is an example of this first substrate. In the example described above, the fan FN is an example of this fan. In the example described above, the second substrate B2 is an example of this second substrate.

[0172] Alternatively, the first connector CN1, the second connector CN2, the third connector CN3, and the fourth connector CN4 can also replace the right-angle connectors and be straight connectors. When the first connector CN1 is a straight connector, it can also be connected from the side to the portion of the liquid ejection module 20 that protrudes towards the Z2 side.

[0173] Furthermore, the items described above can be combined in any way.

[0174] <Appendix 1>

[0175] [1]. A drive circuit unit for driving a head including a jetting section, the jetting section ejecting liquid from a nozzle in a first direction according to a drive signal, the drive circuit unit comprising:

[0176] Fan; and

[0177] The power board, positioned relative to the head in a second direction opposite to the first direction, supplies power to the drive circuit that generates the drive signal, and has a first surface for mounting the fan.

[0178] The height of the tallest first object in the direction orthogonal to the first surface among the objects mounted on the first surface is less than the length of the head in the conveying direction.

[0179] The first surface is either parallel to the first direction or oblique to the first direction.

[0180] [2]. According to the driving circuit unit described in [1], wherein,

[0181] The first object is the fan.

[0182] [3]. The driving circuit unit according to [1] or [2], wherein,

[0183] The first object is a drive circuit section that includes the drive circuit.

[0184] [4]. The driving circuit unit according to any one of [1] to [3], wherein,

[0185] The sum of the height of the first object and the height of the tallest second object in the direction orthogonal to the second surface among the objects mounted on the second surface of the power board is less than the length of the head in the conveying direction.

[0186] [5]. The driving circuit unit according to any one of [1] to [4], wherein,

[0187] The fan delivers air in a manner that generates an airflow that flows in the second direction.

[0188] [6]. The driving circuit unit according to any one of [1] to [4], wherein,

[0189] The fan's rotation axis is parallel to the first direction.

[0190] [7]. The driving circuit unit according to any one of [1] to [6], wherein,

[0191] The drive circuit unit includes multiple drive circuit sections that contain the drive circuit.

[0192] The first surface is a surface parallel to the first direction.

[0193] When the drive circuit unit is viewed in the first direction, the fan is contained within the outline of a virtual region that surrounds the plurality of drive circuit units in a manner with minimal area.

[0194] [8]. The driving circuit unit according to any one of [1] to [7], wherein,

[0195] The drive circuit unit includes a control circuit for generating control signals.

[0196] The drive circuit generates the drive signal based on the control signal generated by the control circuit.

[0197] The drive circuit, the fan, and the control circuit are arranged in the second direction in either the order of the drive circuit, the fan, and the control circuit, or the order of the drive circuit, the control circuit, and the fan.

[0198] [9]. According to the driving circuit unit described in [8], wherein,

[0199] The drive circuit, the fan, and the control circuit are arranged in the second direction in the order of drive circuit, fan, and control circuit.

[0200] The fan is positioned in the first direction between the connector connected to the cable transmitting the control signal and the drive circuit.

[0201]

[10] . A header unit, comprising:

[0202] The head includes an ejection section that ejects liquid from a nozzle in a first direction according to a drive signal; and

[0203] The drive circuit unit drives the head.

[0204] The driving circuit unit includes:

[0205] Fan; and

[0206] The power board, positioned relative to the head in a second direction opposite to the first direction, supplies power to the drive circuit that generates the drive signal, and has a first surface for mounting the fan.

[0207] The first surface is either parallel to the first direction or oblique to the first direction.

[0208]

[11] . A liquid ejection device, comprising:

[0209] Conveying unit, conveying medium;

[0210] The head includes an ejection section that ejects liquid from a nozzle in a first direction according to a drive signal; and

[0211] The drive circuit unit drives the head.

[0212] The driving circuit unit includes:

[0213] Fan; and

[0214] The power board, positioned relative to the head in a second direction opposite to the first direction, supplies power to the drive circuit that generates the drive signal, and has a first surface for mounting the fan.

[0215] The first surface is either parallel to the first direction or oblique to the first direction.

[0216] <Appendix 2>

[0217] [1]. A drive circuit unit drives a head including a spray section, wherein the spray section sprays liquid from a nozzle in a first direction according to a drive signal.

[0218] The driving circuit unit includes:

[0219] The power board extends toward a second direction opposite to the first direction and is connected to the head via a B2B connection.

[0220] A driving circuit, mounted on the first surface of the power board, generates the driving signal; and

[0221] A cooling mechanism is used to cool the drive circuit.

[0222] The cooling mechanism includes:

[0223] An air guide section, which guides the airflow generated by the fan and covers the drive circuit on the first surface; and

[0224] The rectifier plate intersects the first direction and rectifies the airflow flowing in from the direction intersecting the second direction toward the second direction, or rectifies the airflow flowing out from between the first surface and the air guide in the direction intersecting the first direction.

[0225] The rectifier board is positioned closer to the first direction side than the drive circuit.

[0226] [2]. According to the driving circuit unit described in [1], wherein,

[0227] The cooling mechanism has an air intake for supplying air that flows in the order of the rectifier plate and the air guide.

[0228] [3]. According to the driving circuit unit described in [2], wherein,

[0229] A slit is provided at the air intake.

[0230] [4]. The driving circuit unit according to any one of [1] to [3], wherein,

[0231] The cooling mechanism includes the fan.

[0232] The fan is disposed between the first surface and the air guide section, and at least one of the air inlet and outlet of the air guide section.

[0233] [5]. According to the driving circuit unit described in [4], wherein,

[0234] The fan delivers air in a manner that generates an airflow that flows toward the first direction.

[0235] [6]. According to the driving circuit unit described in [4], wherein,

[0236] The fan delivers air in a manner that generates an airflow that flows in the second direction.

[0237] [7]. The driving circuit unit according to any one of [4] to [6], wherein,

[0238] The drive circuit unit includes a control circuit that generates control signals.

[0239] The drive circuit generates the drive signal based on the control signal generated by the control circuit.

[0240] The drive circuit, the fan, and the control circuit are arranged in the second direction in either the order of the drive circuit, the fan, and the control circuit, or the order of the drive circuit, the control circuit, and the fan.

[0241] [8]. The driving circuit unit according to [2] or [3], wherein,

[0242] The cooling mechanism includes the fan.

[0243] The air guide is positioned between the fan and the air intake.

[0244] [9]. According to the driving circuit unit described in [8], wherein,

[0245] The fan delivers air in a manner that generates an airflow that flows toward the first direction.

[0246]

[10] . According to the driving circuit unit described in [8], wherein,

[0247] The fan delivers air in a manner that generates an airflow that flows in the second direction.

[0248]

[11] . The driving circuit unit according to any one of [8] to

[10] , wherein,

[0249] The drive circuit unit includes a control circuit that generates control signals.

[0250] The drive circuit generates the drive signal based on the control signal generated by the control circuit.

[0251] The drive circuit, the fan, and the control circuit are arranged in the second direction in either the order of the drive circuit, the fan, and the control circuit, or the order of the drive circuit, the control circuit, and the fan.

[0252]

[12] . A header unit, comprising:

[0253] The head includes an ejection section that ejects liquid from a nozzle in a first direction according to a drive signal; and

[0254] The drive circuit unit drives the head.

[0255] The driving circuit unit includes:

[0256] The power board extends toward a second direction opposite to the first direction and is connected to the head via a B2B connection.

[0257] A driving circuit, mounted on the first surface of the power board, generates the driving signal; and

[0258] A cooling mechanism is used to cool the drive circuit.

[0259] The cooling mechanism includes:

[0260] An air guide section, which guides the airflow generated by the fan and covers the drive circuit on the first surface; and

[0261] The rectifier plate intersects the first direction and rectifies the airflow flowing in from the direction intersecting the second direction toward the second direction, or rectifies the airflow flowing out from between the first surface and the air guide in the direction intersecting the first direction.

[0262] The rectifier board is positioned closer to the first direction side than the drive circuit.

[0263]

[13] . A liquid ejection device, comprising:

[0264] Conveying unit, conveying medium;

[0265] The head includes an ejection section that ejects liquid from a nozzle in a first direction according to a drive signal; and

[0266] The drive circuit unit drives the head.

[0267] The driving circuit unit includes:

[0268] The power board extends toward a second direction opposite to the first direction and is connected to the head via a B2B connection.

[0269] A driving circuit, mounted on the first surface of the power board, generates the driving signal; and

[0270] A cooling mechanism is used to cool the drive circuit.

[0271] The cooling mechanism includes:

[0272] An air guide section, which guides the airflow generated by the fan and covers the drive circuit on the first surface; and

[0273] The rectifier plate intersects the first direction and rectifies the airflow flowing in from the direction intersecting the second direction toward the second direction, or rectifies the airflow flowing out from between the first surface and the air guide in the direction intersecting the first direction.

[0274] The rectifier board is positioned closer to the first direction side than the drive circuit.

[0275]

[14] . According to the liquid ejection device described in

[13] , wherein,

[0276] The head and the driving circuit unit constitute a head unit.

[0277] The liquid ejection device comprises at least two head units, each serving as a first head unit and a second head unit.

[0278] The first head unit and the second head unit are arranged facing a third direction.

[0279] The third direction is the direction parallel to the rectifier plate.

[0280] <Appendix 3>

[0281] [1]. A drive circuit unit connected to a head connector located on the opposite side of the nozzle of the head, the drive circuit unit comprising:

[0282] A first substrate having a first connector that is connected to the head connector;

[0283] The third substrate is equipped with a drive circuit that generates drive signals; and

[0284] Fan, produces wind.

[0285] The drive signal is supplied from the third substrate to the first connector via the first substrate.

[0286] The third substrate is connected to the first substrate via a B2B connection and stands upright relative to the first substrate.

[0287] The fan stands upright relative to the first substrate.

[0288] The fan's rotation axis is approximately parallel to the surface of the third substrate.

[0289] [2]. According to the driving circuit unit described in [1], wherein,

[0290] The drive circuit unit also includes a first cover.

[0291] In addition to the first and second openings, the first substrate and the first cover surround the third substrate.

[0292] The fan generates airflow from the first port toward the second port.

[0293] [3]. According to the driving circuit unit described in [2], wherein,

[0294] The fan, the first port, the third substrate, the second port, and the first connector are arranged in the order of the fan, the first port, the third substrate, the second port, and the first connector.

[0295] [4]. According to the driving circuit unit described in [3], wherein,

[0296] The drive circuit unit also includes a first rectification mechanism, which changes the direction of airflow between the second port and the first connector from a direction substantially parallel to the first substrate to a direction away from the first substrate.

[0297] [5]. According to the driving circuit unit described in [4], wherein,

[0298] The drive circuit unit also includes a second rectification mechanism, which adjusts the airflow between the fan and the end of the first substrate opposite to the first connector.

[0299] [6]. According to the driving circuit unit described in [2], wherein,

[0300] The fan, the first port, the third substrate, the second port, and the first connector are arranged in the order of the first port, the third substrate, the second port, the fan, and the first connector.

[0301] [7]. According to the driving circuit unit described in [6], wherein,

[0302] The drive circuit unit also includes a first rectification mechanism, which changes the direction of the airflow between the fan and the first connector from a direction substantially parallel to the first substrate to a direction away from the first substrate.

[0303] [8]. According to the driving circuit unit described in [7], wherein,

[0304] The drive circuit unit also includes a second rectification mechanism, which adjusts the airflow between the end opposite to the first connector on the end of the first substrate and the first port.

[0305] [9]. According to the driving circuit unit described in [2], wherein,

[0306] The fan, the first port, the third substrate, the second port, and the first connector are arranged in the order of the fan, the second port, the third substrate, the first port, and the first connector.

[0307]

[10] . According to the driving circuit unit described in [9], wherein,

[0308] The drive circuit unit also includes a first rectification mechanism, which changes the direction of airflow between the first port and the first connector from a direction close to the first substrate to a direction approximately parallel to the first substrate.

[0309]

[11] . The driving circuit unit according to

[10] , wherein,

[0310] The drive circuit unit also includes a second rectification mechanism, which adjusts the airflow between the fan and the end of the first substrate opposite to the first connector.

[0311]

[12] . According to the driving circuit unit described in [2], wherein,

[0312] The fan, the first port, the third substrate, the second port, and the first connector are arranged in the order of the second port, the third substrate, the first port, the fan, and the first connector.

[0313]

[13] . According to the driving circuit unit described in

[12] , wherein,

[0314] The drive circuit unit also includes a first rectification mechanism, which changes the direction of the airflow between the fan and the first connector from a direction close to the first substrate to a direction approximately parallel to the first substrate.

[0315]

[14] . The driving circuit unit according to

[13] , wherein,

[0316] The drive circuit unit also includes a second rectification mechanism, which adjusts the airflow between the end opposite to the first connector on the end of the first substrate and the second port.

[0317]

[15] . The driving circuit unit according to any one of [1] to

[14] , wherein,

[0318] The fan is contained within the outline of the first substrate when viewed from a direction orthogonal to the first substrate.

[0319]

[16] . According to the driving circuit unit described in

[15] , wherein,

[0320] In a direction orthogonal to the rotation axis of the fan and parallel to the surface of the first substrate, the length of the fan is more than 0.8 times and less than 1 times the length of the first substrate.

[0321]

[17] . The drive circuit unit according to

[15] or

[16] , wherein,

[0322] The driving circuit unit has multiple third substrates.

[0323] All the drive circuits of the third substrate converge to the range obtained by projecting the fan along the rotation axis of the fan.

[0324]

[18] . The driving circuit unit according to any one of [1] to

[17] , wherein,

[0325] The third substrate has a capacitor mounted on it at a position closer to the first substrate than the driving circuit.

[0326]

[19] . The driving circuit unit according to

[18] , wherein,

[0327] The third substrate mounts all electronic components that are taller than the driving circuit on a position closer to the first substrate than the driving circuit.

[0328]

[20] . The driving circuit unit according to any one of [1] to

[19] , wherein,

[0329] The connection between the third substrate and other substrates is entirely via a BtoB connection with the first substrate.

[0330]

[21] . A header unit, comprising:

[0331] A head, comprising an outlet and a head connector, the head connector being located on the opposite side of the outlet; and

[0332] The drive circuit unit is connected to the head connector.

[0333] The driving circuit unit includes:

[0334] A first substrate having a first connector that is connected to the head connector;

[0335] The third substrate is equipped with a drive circuit that generates drive signals; and

[0336] Fan, produces wind.

[0337] The drive signal is supplied from the third substrate to the first connector via the first substrate.

[0338] The third substrate is connected to the first substrate via a B2B connection and stands upright relative to the first substrate.

[0339] The fan stands upright relative to the first substrate.

[0340] The fan's rotation axis is approximately parallel to the surface of the third substrate.

[0341]

[22] . A liquid ejection device, comprising:

[0342] Conveying unit, conveying medium;

[0343] A head, comprising an outlet and a head connector, the head connector being located on the opposite side of the outlet; and

[0344] The drive circuit unit is connected to the head connector.

[0345] The driving circuit unit includes:

[0346] A first substrate having a first connector that is connected to the head connector;

[0347] The third substrate is equipped with a drive circuit that generates drive signals; and

[0348] Fan, produces wind.

[0349] The drive signal is supplied from the third substrate to the first connector via the first substrate.

[0350] The third substrate is connected to the first substrate via a B2B connection and stands upright relative to the first substrate.

[0351] The fan stands upright relative to the first substrate.

[0352] The fan's rotation axis is approximately parallel to the surface of the third substrate.

[0353] <Appendix 4>

[0354] [1]. A driving circuit unit for generating driving signals for a driving head, the driving circuit unit comprising:

[0355] A first connector is connected to the head;

[0356] The driving circuit generates the driving signal;

[0357] A fan that generates airflow directed toward the drive circuit; and

[0358] The conversion circuit converts the control signals controlling the head.

[0359] The first connector, the drive circuit, the fan, and the conversion circuit are arranged in the order of the first connector, the drive circuit, the fan, and the conversion circuit.

[0360] [2]. According to the driving circuit unit described in [1], wherein,

[0361] The drive circuit unit also includes a fourth connector, which receives the control signal input to the conversion circuit.

[0362] The first connector, the drive circuit, the fan, the conversion circuit, and the fourth connector are arranged in the order of the first connector, the drive circuit, the fan, the conversion circuit, and the fourth connector.

[0363] [3]. The driving circuit unit according to [1] or [2], wherein,

[0364] The driving circuit unit includes:

[0365] A first substrate, on which the first connector is mounted; and

[0366] The second substrate carries the conversion circuit.

[0367] The first substrate and the second substrate are connected via BtoB.

[0368] [4]. According to the driving circuit unit described in [3], wherein,

[0369] The second substrate is equipped with a fourth connector, which receives the control signal input to the conversion circuit.

[0370] The switching circuit operates using the power supplied from the first substrate to the second substrate.

[0371] The control signal is received by the fourth connector instead of via the first substrate.

[0372] [5]. According to the driving circuit unit described in [4], wherein,

[0373] The second substrate is equipped with the fan.

[0374] The fan operates using electricity supplied from the first substrate to the second substrate.

[0375] [6]. According to the driving circuit unit described in [5], wherein,

[0376] The fan has blades that rotate about the fan's axis of rotation.

[0377] The height of the heat sink of the conversion circuit is lower than the radius of the cylindrical area swept by the rotation of the blades.

[0378] [7]. A header unit, comprising:

[0379] head; and

[0380] The driving circuit unit generates a driving signal to drive the head.

[0381] The driving circuit unit includes:

[0382] A first connector is connected to the head;

[0383] The driving circuit generates the driving signal;

[0384] A fan that generates airflow directed toward the drive circuit; and

[0385] The conversion circuit converts the control signals controlling the head.

[0386] The first connector, the drive circuit, the fan, and the conversion circuit are arranged in the order of the first connector, the drive circuit, the fan, and the conversion circuit.

[0387] [8]. A liquid ejection device, comprising:

[0388] Conveying unit, conveying medium;

[0389] head; and

[0390] The driving circuit unit generates a driving signal to drive the head.

[0391] The driving circuit unit includes:

[0392] A first connector is connected to the head;

[0393] The driving circuit generates the driving signal;

[0394] A fan that generates airflow directed toward the drive circuit; and

[0395] The conversion circuit converts the control signals controlling the head.

[0396] The first connector, the drive circuit, the fan, and the conversion circuit are arranged in the order of the first connector, the drive circuit, the fan, and the conversion circuit.

[0397] <Appendix 5>

[0398] [1]. A driving circuit unit for generating driving signals for a driving head, the driving circuit unit comprising:

[0399] The driving circuit generates the driving signal;

[0400] A first connector is connected to the head;

[0401] A first substrate, on which the first connector is mounted;

[0402] A fan that generates airflow directed toward the drive circuit; and

[0403] The second substrate is equipped with the fan.

[0404] [2]. According to the driving circuit unit described in [1], wherein,

[0405] The fan extends from the second substrate toward the drive circuit side.

[0406] [3]. The driving circuit unit according to [1] or [2], wherein,

[0407] The fan operates using electricity supplied from the first substrate via a cable, without passing through the second substrate.

[0408] [4]. The driving circuit unit according to any one of [1] to [3], wherein,

[0409] The first substrate and the second substrate are connected via a floating connector in a B2B manner.

[0410] [5]. The driving circuit unit according to any one of [1] to [4], wherein,

[0411] The fan is mounted on the second substrate via a floating connector.

[0412] [6]. According to the driving circuit unit described in [5], wherein,

[0413] The fan is fixed to the second substrate only via a floating connector between the fan and the second substrate.

[0414] [7]. The driving circuit unit according to any one of [1] to [6], wherein,

[0415] The second substrate has a right-angle connector for connecting to a communication cable at the end opposite to the fan.

[0416] [8]. A header unit, comprising:

[0417] head; and

[0418] The driving circuit unit generates a driving signal to drive the head.

[0419] The driving circuit unit includes:

[0420] The driving circuit generates the driving signal;

[0421] A first connector is connected to the head;

[0422] A first substrate, on which the first connector is mounted;

[0423] A fan that generates airflow directed toward the drive circuit; and

[0424] The second substrate is equipped with the fan.

[0425] [9]. A liquid ejection device, comprising:

[0426] Conveying unit, conveying medium;

[0427] head; and

[0428] The driving circuit unit generates a driving signal to drive the head.

[0429] The driving circuit unit includes:

[0430] The driving circuit generates the driving signal;

[0431] A first connector is connected to the head;

[0432] A first substrate, on which the first connector is mounted;

[0433] A fan that generates airflow directed toward the drive circuit; and

[0434] The second substrate is equipped with the fan.

[0435] The embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, the specific configuration is not limited to this embodiment. As long as it does not depart from the spirit of this disclosure, changes, substitutions, deletions, etc., can be made.

Claims

1. A drive circuit unit, characterized by comprising: The drive includes a head with an ejector section that ejects liquid from a nozzle in a first direction according to a drive signal. The drive circuit unit includes: Fan; and The power board, positioned relative to the head in a second direction opposite to the first direction, supplies power to the drive circuit that generates the drive signal, and has a first surface for mounting the fan. The height of the tallest first object in the direction orthogonal to the first surface among the objects mounted on the first surface is less than the length of the head in the conveying direction. The first surface is either parallel to the first direction or oblique to the first direction. The sum of the height of the first object and the height of the tallest second object in the direction orthogonal to the second surface among the objects mounted on the second surface of the power board is less than the length of the head in the conveying direction. The second object is an electrolytic capacitor or a connector.

2. The driving circuit unit according to claim 1, characterized in that, The first object is the fan.

3. The driving circuit unit according to claim 1, characterized in that, The first object is a drive circuit section that includes the drive circuit.

4. The driving circuit unit according to claim 1, characterized in that, The fan delivers air in a manner that generates an airflow that flows in the second direction.

5. The driving circuit unit according to claim 1, characterized in that, The fan's rotation axis is parallel to the first direction.

6. The driving circuit unit according to claim 1, characterized in that, The drive circuit unit includes multiple drive circuit sections that contain the drive circuit. The first surface is a surface parallel to the first direction. When the drive circuit unit is viewed in the first direction, the fan is contained within the outline of a virtual region that surrounds the plurality of drive circuit units in a manner with minimal area.

7. The driving circuit unit according to claim 1, characterized in that, The drive circuit unit includes a control circuit for generating control signals. The drive circuit generates the drive signal based on the control signal generated by the control circuit. The drive circuit, the fan, and the control circuit are each arranged in the second direction in either the order of the drive circuit, the fan, and the control circuit or the order of the drive circuit, the control circuit, and the fan.

8. The driving circuit unit according to claim 7, characterized in that, The drive circuit, the fan, and the control circuit are arranged in the second direction in the order of drive circuit, fan, and control circuit. The fan is positioned in the first direction between the connector connected to the cable transmitting the control signal and the drive circuit.

9. A head unit characterized by comprising: include: The head includes an ejection section that ejects liquid from a nozzle in a first direction according to a drive signal; as well as The drive circuit unit drives the head. The driving circuit unit includes: fan; as well as The power board, positioned relative to the head in a second direction opposite to the first direction, supplies power to the drive circuit that generates the drive signal, and has a first surface for mounting the fan. The height of the tallest first object in the direction orthogonal to the first surface among the objects mounted on the first surface is less than the length of the head in the conveying direction. The first surface is either parallel to the first direction or oblique to the first direction. The sum of the height of the first object and the height of the tallest second object in the direction orthogonal to the second surface among the objects mounted on the second surface of the power board is less than the length of the head in the conveying direction. The second object is an electrolytic capacitor or a connector.

10. A liquid discharge apparatus characterized by comprising: include: Conveying unit, conveying medium; The head includes an ejection section that ejects liquid from a nozzle in a first direction according to a drive signal; as well as The drive circuit unit drives the head. The driving circuit unit includes: fan; as well as The power board, positioned relative to the head in a second direction opposite to the first direction, supplies power to the drive circuit that generates the drive signal, and has a first surface for mounting the fan. The height of the tallest first object in the direction orthogonal to the first surface among the objects mounted on the first surface is less than the length of the head in the conveying direction. The first surface is either parallel to the first direction or oblique to the first direction. The sum of the height of the first object and the height of the tallest second object in the direction orthogonal to the second surface among the objects mounted on the second surface of the power board is less than the length of the head in the conveying direction. The second object is an electrolytic capacitor or a connector.

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