A toy mold injection molding system

Abstract

This invention relates to the field of toy injection molding technology, and particularly to a toy mold injection molding system. The ejection mechanism is located between a moving platen and a fixed platen on the injection molding machine body. The ejection mechanism includes a material carrier plate slidably connected to the injection molding machine body, and a linkage mechanism connecting the material carrier plate and the moving platen. During mold closing, the moving platen, through the linkage mechanism, drives the material carrier plate to extend outside the injection molding machine body. During mold opening, the moving platen, through the linkage mechanism, drives the material carrier plate to slide into the space between the moving platen and the fixed platen of the injection molding machine body. A shock-absorbing component is provided on the surface of the material carrier plate. When using this invention, the product ejection does not require an additional power mechanism, and the opening and closing of the moving platen causes the material carrier plate to extend and retract within the injection molding machine body, enabling the product to be promptly delivered outside the injection molding machine body, preventing material accumulation and jamming under the mold.

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