A sensor chip positioning device

Abstract

This invention discloses a sensor chip positioning device, relating to the field of gas sensor chip welding technology. It includes a base fixedly mounted on a positioning platform. The base has a first sliding groove and a second sliding groove symmetrically arranged on it. A sensor positioning groove for embedding a sensor base is formed between the first and second sliding grooves. A chip carrier one is slidably arranged in the first sliding groove, and a chip carrier two is slidably arranged in the second sliding groove. A support plate is fixedly arranged at the end of chip carrier one facing chip carrier two, and a limiting plate is fixedly arranged at the end of chip carrier two facing chip carrier one. The support plate has symmetrically fixed limiting protrusions for engaging with two sets of parallel sides of the chip. A first locking plate is also fixedly arranged on the support plate, and a second locking plate is correspondingly arranged on the limiting plate. The first and second locking plates are used for engaging with the other two sets of parallel sides of the chip.

Description

Technical Field

[0001] This invention relates to the field of gas sensor chip welding technology, and more specifically to a sensor chip positioning device. Background Technology

[0002] A gas sensor chip is a silicon wafer or integrated circuit primarily used to detect and measure the composition of gases in the environment. The core components of such a chip include a sensor element, signal processing circuitry, and an output interface. The sensor element typically uses special materials, such as metal-oxide-semiconductor (MODS) or nanomaterials. When gas molecules come into contact with the sensor surface, chemical reactions or electrical changes occur, resulting in changes in parameters such as resistance, capacitance, or voltage. The signal processing circuitry then amplifies, filters, and converts these changes to provide a usable digital signal output.

[0003] Gas sensor chips can detect the concentration of various gases and convert it into an electrical signal output. Common gas sensor chips include oxygen sensor chips, carbon dioxide sensor chips, and toxic gas sensor chips. Compared with traditional gas detection instruments, gas sensor chips have advantages such as high sensitivity, fast response speed, and ease of use. These chips are widely used in industrial control, environmental monitoring, and indoor air quality detection.

[0004] In existing technologies, the chip and sensor pins need to be soldered using platinum-tungsten wire bonding. However, in practical applications, the sensor chip is extremely small, with a side length of about 1.5 to 2.0 mm and a thickness of less than 0.3 mm. This type of chip has four gold pads, and the pressure during soldering is close to 1 kg. The chip is prone to misalignment, the positional consistency requirement is very high, and the difficulty of mounting the chip is very high. Summary of the Invention

[0005] The purpose of this invention is to provide a sensor chip positioning device to solve the following technical problems:

[0006] Because sensor chips are extremely small, the soldering pressure is high; therefore, the chips are prone to misalignment; the consistency of their positions is very important; and the installation of the chips is very difficult.

[0007] The objective of this invention can be achieved through the following technical solutions:

[0008] A sensor chip positioning device includes a base fixedly arranged on a positioning platform. The base has a first sliding groove and a second sliding groove symmetrically formed thereon. A sensor positioning groove for embedding a sensor base is formed between the first sliding groove and the second sliding groove.

[0009] A chip carrier 1 is slidably arranged in the first chute, and a chip carrier 2 is slidably arranged in the second chute. A support plate is fixedly arranged at the end of the chip carrier 1 facing the chip carrier 2, and a limiting plate is fixedly arranged at the end of the chip carrier 2 facing the chip carrier 1.

[0010] The carrier plate is symmetrically and fixedly provided with limiting protrusions for engaging with two sets of parallel sides of the chip. A first locking plate is also fixedly provided on the carrier plate, and a second locking plate is correspondingly provided on the limiting plate. The first locking plate and the second locking plate are used to engage with the other two sets of parallel sides of the chip.

[0011] It also includes a driving component, which is used to synchronously drive the chip carrier one and the chip carrier two to move closer or further apart.

[0012] Preferably, the end of the first card plate that is close to the second card plate is set as an inclined end, and the inclined end is used to press against the side of the chip.

[0013] Preferably, a guide groove is provided at the end of the carrier plate away from the first chip carrier, and a guide seat that fits into the guide groove is fixedly provided at the end of the limiting plate away from the second chip carrier.

[0014] Preferably, a limiting frame 1 is fixedly arranged at the end of the chip carrier 1 away from the bearing plate, and a limiting frame 2 is fixedly arranged at the end of the chip carrier 2 away from the limiting plate.

[0015] Preferably, the driving component includes a magnet mechanism 1 respectively disposed on the first limiting frame and the second limiting frame, the magnet mechanism being disposed on the side of the first limiting frame and the second limiting frame facing the base;

[0016] The base is provided with magnet mechanisms two on both sides, which attract each other to magnet mechanism one.

[0017] Preferably, the sensor positioning groove is further provided with a cavity, and the driving component also includes a wedge block arranged in the cavity. Inclined surfaces are symmetrically arranged on both sides of the wedge block. Hollow slots communicating with the cavity are symmetrically opened on both sides of the base. Guide rods fixed to limit frame one and limit frame two are slidably arranged in the hollow slots on both sides respectively. Rollers that roll and abut against the inclined surfaces are rotatably arranged at the ends of the guide rods on both sides.

[0018] The wedge-shaped block is connected to the lifting part that drives its lifting and lowering.

[0019] Preferably, the lifting part includes a cylinder disposed at the bottom of the cavity, and a telescopic rod is slidably inserted on the cylinder, with the other end of the telescopic rod fixed to a wedge block;

[0020] The top of the cylinder is equipped with an electromagnet, and the bottom of the wedge-shaped block is equipped with a corresponding magnetic ring.

[0021] Preferably, a top rod is fixedly arranged on the wedge block, and a push plate is fixedly arranged at the end of the top rod.

[0022] Preferably, the sensor base is a circular base, and a protrusion is provided on one side of the sensor base;

[0023] The sensor positioning groove has symmetrical arc-shaped groove edges on both sides to correspond to the sensor base; one of the arc-shaped groove edges also has a reserved groove for embedding the protrusion.

[0024] Preferably, several sets of sensor pins are arranged in a circumferential array between the sensor bases for soldering to gold pads on the chip.

[0025] The sensor positioning slot also has several sets of through slots for inserting sensor pins.

[0026] The beneficial effects of this invention are:

[0027] (1) When positioning the chip, the present invention places the chip between two sets of limiting protrusions for initial positioning, and then uses the first card plate and the second card plate to position the chip in all directions. At this time, the gold pad on the chip surface is flush with the top of the sensor pin, and then the two are welded together by platinum tungsten wire bonding. During the welding process, the stability is higher and the chip will not shift.

[0028] (2) When the first and second clamping plates of the present invention position the side of the chip, due to the setting of the inclined end, the chip can also be pressed in the vertical direction during the horizontal clamping process, so that the chip will not vibrate up and down due to the welding pressure during the welding process, and the stability is higher. Attached Figure Description

[0029] The invention will now be further described with reference to the accompanying drawings.

[0030] Figure 1 This is a schematic diagram of the structure of a sensor chip positioning device according to the present invention;

[0031] Figure 2 This is an exploded structural diagram of a sensor chip positioning device according to the present invention;

[0032] Figure 3 This is the present invention. Figure 1 Schematic diagram of the enlarged section at point A in the middle;

[0033] Figure 4 This is a schematic diagram of the base in a sensor chip positioning device of the present invention;

[0034] Figure 5 This is a schematic diagram of the structure of the sensor chip in the sensor chip positioning device of the present invention;

[0035] Figure 6 This is a schematic diagram of the structure of the wedge block in a sensor chip positioning device of the present invention;

[0036] Figure 7 This is a schematic diagram of the structure of a chip carrier in a sensor chip positioning device according to the present invention;

[0037] Figure 8 This is a schematic diagram of the structure of the chip carrier two in the sensor chip positioning device of the present invention;

[0038] Figure 9 This is a schematic diagram of the card plate in a sensor chip positioning device of the present invention.

[0039] In the diagram: 1. Positioning stage; 2. Base; 3. Chip carrier one; 4. Chip; 5. Wedge block; 201. First slide groove; 202. Second slide groove; 203. Sensor positioning groove; 204. Arc-shaped groove edge; 205. Reserved groove; 206. Through groove; 207. Cavity; 208. Empty groove; 301. Chip carrier two; 302. Limiting frame one; 303. Limiting frame two; 304. Bearing plate; 305. Limiting plate; 306. First clamping plate; 3 07. Guide groove; 308. Limiting protrusion; 309. Guide seat; 310. Second clamping plate; 311. Inclined end; 401. Gold solder pad; 402. Sensor pin; 403. Sensor base; 404. Platinum-tungsten wire bonding wire; 405. Protrusion; 501. Inclined surface; 502. Cylinder; 503. Electromagnet; 504. Telescopic rod; 505. Magnetic ring; 506. Roller; 507. Guide rod; 508. Top rod; 509. Push plate. Detailed Implementation

[0040] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0041] Example 1

[0042] Please see Figures 1-4As shown, the present invention is a sensor chip positioning device, including a base 2 fixedly arranged on a positioning stage 1. A first sliding groove 201 and a second sliding groove 202 are symmetrically opened on the base 2. A sensor positioning groove 203 for embedding a sensor base 403 is opened between the first sliding groove 201 and the second sliding groove 202. In one embodiment of this invention, when the sensor and the chip are soldered, the sensor base 403 is positioned by the sensor positioning groove 203 to improve the stability during soldering.

[0043] In this embodiment, please refer to Figure 5 The sensor base 403 is a circular base, and a protrusion 405 is provided on one side of the sensor base 403. Correspondingly, arc-shaped groove edges 204 are symmetrically arranged on both sides of the sensor positioning groove 203 to correspond to the sensor base 403. Among them, a reserved groove 205 for embedding the protrusion 405 is also provided at one side of the arc-shaped groove edge 204. Specifically, when positioning the sensor, the protrusion 405 on one side of the sensor base 403 can be embedded in the reserved groove 205 to achieve the positioning of the sensor and improve the positioning efficiency.

[0044] In addition, several sets of sensor pins 402 are arranged in a circumferential array between the sensor bases 403 for soldering to the gold pads 401 on the chip 4; specifically, in this embodiment, four sets of sensor pins 402 and gold pads 401 are arranged, and the two are soldered one-to-one.

[0045] The sensor positioning slot 203 is also provided with several sets of through slots 206 for inserting sensor pins 402; when positioning the sensor, the sensor pins 402 are simultaneously inserted into the through slots 206.

[0046] A chip carrier 3 is slidably arranged in the first slide groove 201, and a chip carrier 301 is slidably arranged in the second slide groove 202. A bearing plate 304 is fixedly arranged at the end of the chip carrier 3 facing the chip carrier 301, and a limiting plate 305 is fixedly arranged at the end of the chip carrier 301 facing the chip carrier 3.

[0047] Please see Figures 6-8The carrier plate 304 is symmetrically and fixedly provided with limiting protrusions 308 for engaging with two sets of parallel sides of the chip 4. The carrier plate 304 is also fixedly provided with a first locking plate 306, and the limiting plate 305 is correspondingly provided with a second locking plate 310. The first locking plate 306 and the second locking plate 310 are used to engage with the other two sets of parallel sides of the chip 4. Specifically, in this embodiment, the two sets of limiting protrusions 308, the first locking plate 306, and the second locking plate 310 form a chip cavity for positioning the chip 4. When positioning the chip 4, the chip 4 is initially limited between the two sets of limiting protrusions 308, and then the chip 4 is omnidirectionally limited by the first locking plate 306 and the second locking plate 310. At this time, the gold pad 401 on the surface of the chip 4 is flush with the top of the sensor pin 402, and then the two are welded together by platinum tungsten wire bonding wire 404. During the welding process, the stability is higher, and the chip 4 will not shift.

[0048] It also includes a driving component, which is used to synchronously drive chip carrier 3 and chip carrier 301 to move closer or further apart. Specifically, when welding the sensor and chip 4, firstly, the driving component drives chip carrier 3 and chip carrier 301 to move further apart; then, the sensor base 403 is positioned in the sensor positioning groove 203; next, the chip 4 is placed between two sets of limiting protrusions 308 for initial limiting; finally, the driving component drives chip carrier 3 and chip carrier 301 to move closer together, so as to achieve the desired effect. The first card plate 306 and the second card plate 310 provide all-round positioning for the chip 4. The gold pad 401 and the sensor pin 402 are welded together by the platinum tungsten wire bonding wire 404. This embodiment can achieve precise positioning of the chip 4. At the same time, during the welding process, the limiting protrusion 308 works with the first card plate 306 and the second card plate 310 to provide all-round positioning for the chip 4. After the welding is completed, the driving component drives the chip carrier 1 3 and the chip carrier 2 301 away from each other to achieve disassembly, which is very convenient.

[0049] Example 2

[0050] Based on Example 1, please refer to Figure 9 The end of the first clamping plate 306 that is close to the second clamping plate 310 is set as an inclined end 311, which is used to press against the side of the chip 4. It can be explained that when the first clamping plate 306 and the second clamping plate 310 position the side of the chip 4, due to the setting of the inclined end 311, the chip 4 can also be pressed in the vertical direction during the horizontal clamping process, so that the chip 4 will not vibrate up and down due to the welding pressure during the welding process, and the stability is higher.

[0051] As a further solution in this embodiment, please refer to Figures 7-8The support plate 304 has a guide groove 307 at the end away from the chip carrier 3, and the limiting plate 305 is fixedly provided with a guide seat 309 that fits into the guide groove 307 at the end away from the chip carrier 301. It can be explained that when the driving component drives the chip carrier 3 and the chip carrier 301 to approach each other, the guide seat 309 is embedded in the guide groove 307 to achieve pre-positioning and avoid docking deviation.

[0052] Please see Figures 1-2 A limiting frame 302 is fixedly arranged at the end of the chip carrier 3 away from the support plate 304, and a limiting frame 303 is fixedly arranged at the end of the chip carrier 301 away from the limiting plate 305. In this embodiment, when the driving component drives the chip carrier 3 and the chip carrier 301 to approach each other, the contact between the limiting frame 302 and the side end of the base 2 indicates that the chip carrier 3 has moved into place, and the contact between the limiting frame 303 and the side end of the base 2 indicates that the chip carrier 301 has moved into place. The limiting frame 302 and the limiting frame 303 play the role of restricting the movement of the carriers on both sides, so as to avoid damage to the chip 4.

[0053] The driving component includes a first magnet mechanism disposed on the first limit frame 302 and the second limit frame 303 respectively. The magnet mechanism is disposed on the side of the first limit frame 302 and the second limit frame 303 facing the base 2. The second magnet mechanism is disposed on both sides of the base 2 respectively, and attracts the first magnet mechanism. Specifically, in this embodiment, the specific shape of the first magnet mechanism and the second magnet mechanism is not limited, and can be circular, square or irregular structure. Under the attraction of the second magnet mechanism on the first magnet mechanism, the first limit frame 302 and the second limit frame 303 are in a state of being in contact with the base 2 in their natural state.

[0054] Please see Figure 4 and Figure 6 The sensor positioning slot 203 also has a cavity 207. The driving component also includes a wedge-shaped block 5 disposed in the cavity 207. Inclined surfaces 501 are symmetrically arranged on both sides of the wedge-shaped block 5. Hollow slots 208 communicating with the cavity 207 are symmetrically opened on both sides of the base 2. Guide rods 507 fixed to the first limit frame 302 and the second limit frame 303 are slidably arranged in the hollow slots 208 on both sides. Rollers 506 that roll against the inclined surfaces 501 are rotatably arranged at the ends of the guide rods 507 on both sides. The wedge-shaped block 5 and the driving component are connected in a tandem. The lifting part is connected to the lifting mechanism; it can be explained that when both the first limit frame 302 and the second limit frame 303 are attracted to the base 2, the rollers 506 on both sides roll against the top of the inclined surface 501. After the chip and sensor are welded, the lifting part drives the wedge block 5 to move towards the top. During the movement, the wedge block 5 drives the guide rods 507 on both sides to move away from each other. The guide rods 507 then drive the first limit frame 302 and the second limit frame 303 away from each other, so that the chip sensor can be disassembled.

[0055] After disassembly, the wedge block 5 is driven to move towards the bottom by the lifting part. Under the attraction of the second magnet mechanism on the first magnet mechanism, the first limit frame 302 and the second limit frame 303 move towards the base 2, and synchronously drive the guide rods 507 on both sides to move closer to each other so that the roller 506 always keeps in contact with the inclined surface 501.

[0056] Please see Figure 6 The lifting unit includes a cylindrical body 502 located at the bottom of the cavity 207. A telescopic rod 504 is slidably inserted onto the cylindrical body 502, and the other end of the telescopic rod 504 is fixed to the wedge block 5. An electromagnet 503 is located at the top of the cylindrical body 502, and a magnetic ring 505 is correspondingly located at the bottom of the wedge block 5. Specifically, the electromagnet 503 is connected to the controller via a circuit and a power supply module. In this embodiment, when it is necessary to drive the wedge block 5 to move upward, the controller controls the power supply module to supply current to the electromagnet 503 to generate magnetic force. This magnetic force and the magnetic ring 505 are of the same polarity, and thus, under the action of repulsion, the wedge block 5 is pushed upward. When it is necessary to drive the wedge block 5 to move downward, the controller controls the power supply module to cut off the power, and the wedge block 5 descends and resets under the action of gravity.

[0057] It should be noted that the lifting unit is not limited to the electromagnetic drive mechanism in this embodiment. It can also use drive components such as cylinders or hydraulic cylinders. This embodiment does not limit this to any particular type of drive unit, as long as it can achieve the automatic lifting and lowering of the drive wedge block 5.

[0058] In this embodiment, to facilitate the removal of the welded chip sensor, a top rod 508 is fixedly arranged on the wedge block 5, and a push plate 509 is fixedly arranged at the end of the top rod 508. It can be explained that after the chip 4 and the sensor are welded, during the process of driving the wedge block 5 to rise, when the support plate 304 moves outward and separates from the sensor base 403, the push plate 509 just abuts against the bottom surface of the sensor base 403. As the wedge block 5 continues to move upward, the push plate 509 can lift the chip sensor to a distance beyond the sensor positioning groove 203, thereby facilitating the robot arm to remove the chip sensor and achieving the effect of automated unloading. When the wedge block 5 moves towards the bottom, the push plate 509 moves towards the bottom synchronously, without the need for manual adjustment.

[0059] A positioning method for a sensor chip positioning device includes the following steps:

[0060] The controller controls the power supply module to supply current to the electromagnet 503 to generate magnetic force. Under the action of repulsion, the wedge block 5 is pushed to rise. During the movement, the wedge block 5 drives the two guide rods 507 to move in opposite directions. The guide rods 507 drive the chip carrier 3 and the chip carrier 2 301 to move away from each other through the limit frame 1 302 and the limit frame 2 303.

[0061] The protrusion 405 on one side of the sensor base 403 is embedded in the reserved groove 205, and at the same time, the sensor pin 402 is inserted into the through groove 206 to position the sensor.

[0062] Chip 4 is initially positioned between the two sets of limiting protrusions 308;

[0063] The controller controls the power-on module to be de-energized, the wedge block 5 is reset, and under the attraction of the second magnet mechanism on the first magnet mechanism, the first limit frame 302 and the second limit frame 303 move toward the base 2, synchronously driving the first chip carrier 3 and the second chip carrier 301 to approach each other, and the first card plate 306 and the second card plate 310 limit the chip 4 in all directions.

[0064] The gold pad 401 and the sensor pin 402 are soldered using platinum tungsten wire bonding 404 and welding equipment.

[0065] After welding is completed, the wedge block 5 continues to move upward, and the push plate 509 lifts the chip sensor to a distance beyond the sensor positioning slot 203, and the robot moves the chip sensor out.

[0066] In the description of this invention, it should be understood that the terms "upper," "lower," "left," and "right," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or a specific orientational structure and operation. Therefore, they should not be construed as limitations on the invention. Furthermore, "first" and "second" are only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "multiple" means two or more.

[0067] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0068] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. A sensor chip positioning device comprising a base (2) fixedly arranged on a positioning table (1), characterized in that The base (2) has a first sliding groove (201) and a second sliding groove (202) symmetrically provided. A sensor positioning groove (203) for embedding a sensor base (403) is provided between the first sliding groove (201) and the second sliding groove (202). A chip carrier (3) is slidably arranged in the first slid groove (201), and a chip carrier (301) is slidably arranged in the second slid groove (202). A bearing plate (304) is fixedly arranged at the end of the chip carrier (3) facing the chip carrier (301), and a limiting plate (305) is fixedly arranged at the end of the chip carrier (301) facing the chip carrier (3). The carrier plate (304) is symmetrically fixedly provided with limiting protrusions (308) for engaging with two sets of parallel sides of the chip (4). The carrier plate (304) is also fixedly provided with a first locking plate (306), and the limiting plate (305) is correspondingly provided with a second locking plate (310). The first locking plate (306) and the second locking plate (310) are used to engage with the other two sets of parallel sides of the chip (4). It also includes a driving component, which is used to synchronously drive the chip carrier one (3) and the chip carrier two (301) to move closer or further away from each other; a limiting frame one (302) is fixedly arranged at the end of the chip carrier one (3) away from the support plate (304), and a limiting frame two (303) is fixedly arranged at the end of the chip carrier two (301) away from the limiting plate (305). The driving component includes a magnet mechanism 1 respectively disposed on a first limit frame (302) and a second limit frame (303). The magnet mechanism is disposed on the side of the first limit frame (302) and the second limit frame (303) facing the base (2). The second magnet mechanism is disposed on both sides of the base (2) and is attracted to the first magnet mechanism. The sensor positioning slot (203) also has a cavity (207), and the driving component also includes a wedge block (5) arranged in the cavity (207). Inclined surfaces (501) are symmetrically arranged on both sides of the wedge block (5). Hollow slots (208) communicating with the cavity (207) are symmetrically opened on both sides of the base (2). Guide rods (507) fixed to the first limit frame (302) and the second limit frame (303) are slidably arranged in the hollow slots (208) on both sides. Rollers (506) that roll against the inclined surfaces (501) are rotatably arranged at the ends of the guide rods (507) on both sides. The wedge block (5) is connected to the lifting part that drives its lifting. The lifting unit includes a cylinder (502) located at the bottom of the cavity (207), a telescopic rod (504) is slidably inserted on the cylinder (502), and the other end of the telescopic rod (504) is fixed to the wedge block (5); an electromagnet (503) is provided at the top of the cylinder (502), and a magnetic ring (505) is provided at the bottom of the wedge block (5); A top rod (508) is fixedly arranged on the wedge block (5), and a push plate (509) is fixedly arranged at the end of the top rod (508).

2. The sensor chip positioning device of claim 1, wherein The end of the first card plate (306) that is close to the second card plate (310) is set as an inclined end (311), which is used to press against the side of the chip (4).

3. The sensor chip positioning device of claim 1, wherein The carrier plate (304) has a guide groove (307) at one end away from the chip carrier (3), and the limiting plate (305) is fixedly provided with a guide seat (309) that fits into the guide groove (307) at one end away from the chip carrier (301).

4. The sensor chip positioning device of claim 1, wherein The sensor base (403) is a circular base, and a protrusion (405) is provided on one side of the sensor base (403). The sensor positioning groove (203) has symmetrical arc-shaped groove edges (204) on both sides to correspond to the sensor base (403); a reserved groove (205) for embedding the protrusion (405) is also provided on one side of the arc-shaped groove edge (204).

5. A sensor chip positioning device according to claim 4, characterized in that Several sets of sensor pins (402) are arranged in a circumferential array between the sensor bases (403) for soldering to the gold pads (401) on the chip (4); The sensor positioning slot (203) is also provided with several sets of through slots (206) for inserting sensor pins (402).

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