Oxygen sensor chip positioning mechanism and oxygen sensor assembling equipment

Abstract

The invention discloses an oxygen sensor chip positioning mechanism and oxygen sensor assembling equipment, the oxygen sensor chip positioning mechanism comprises a positioning base, a positioning base block, an abutting assembly and a driving assembly, the positioning base block is connected to the positioning base, the positioning base block is provided with a positioning surface, and the positioning surface is suitable for abutting against part of the surface of an oxygen sensor chip; the abutting assembly is connected to the positioning base and comprises an elastic piece and an abutting block, and the abutting block is suitable for abutting against the oxygen sensor chip under driving of the elastic piece; the driving assembly is connected to the positioning base and used for driving the abutting block to be separated from the oxygen sensor chip; wherein the elastic force of the elastic piece is smaller than the minimum destructive force which can be borne by the oxygen sensor chip. In the whole positioning process of the oxygen sensor chip, the maximum pressure borne by the oxygen sensor chip is only the elastic force of the elastic piece, and the oxygen sensor chip cannot be damaged; in addition, the driving assembly only acts on the compression stage of the elastic piece, namely, the driving assembly cannot cause any damage to the oxygen sensor chip.

Description

Technical Field

[0001] The present invention relates to the technical field of oxygen sensor production equipment, and in particular to an oxygen sensor chip positioning mechanism and oxygen sensor assembly equipment. Background Art

[0002] In the related art, during the manufacturing process of the oxygen sensor, the oxygen sensor chip needs to be transported and transferred between various processes. The long-term transportation operation will cause the transportation mechanism to accumulate movement errors, affecting the positioning effect of the oxygen sensor chip, resulting in transfer or assembly failure. Therefore, it is necessary to set up a positioning mechanism to eliminate or reduce the accumulated movement errors of the transportation mechanism. However, the conventional positioning mechanism cannot adapt well to the small size and thin thickness of the oxygen sensor chip, and there are problems such as poor positioning effect and easy damage to the oxygen sensor chip. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes an oxygen sensor chip positioning mechanism and an oxygen sensor assembly device, which can ensure that the maximum pressure on the oxygen sensor chip during the positioning process is only the elastic force of the elastic member, and will not damage the oxygen sensor chip; and the driving component only acts on the compression stage of the elastic member, that is, the driving component cannot cause any damage to the oxygen sensor chip.

[0004] On the one hand, an embodiment of the present invention provides an oxygen sensor chip positioning mechanism for positioning an oxygen sensor chip, comprising: Positioning base; A positioning base block connected to the positioning base, wherein the positioning base block is provided with a positioning surface, and the positioning surface is suitable for abutting against a part of the surface of the oxygen sensor chip; A pressing component connected to the positioning base, the pressing component comprising an elastic member and a pressing block, the pressing block being adapted to press the oxygen sensor chip under the drive of the elastic member; A driving component connected to the positioning base, the driving component is used to drive the pressing block to separate from the oxygen sensor chip; The elastic force of the elastic member is smaller than the minimum destructive force that the oxygen sensor chip can withstand.

[0005] According to some embodiments of the present invention, the pressing assembly includes a first pressing assembly and a second pressing assembly, wherein the first pressing assembly includes a first elastic member and a first pressing block; the second pressing assembly includes a second elastic member and a second pressing block; The moving direction of the first pressing block and the moving direction of the second pressing block are arranged at an angle.

[0006] According to some embodiments of the present invention, the oxygen sensor chip positioning mechanism further includes a linkage portion, and the first pressing block and the second pressing block are linked by the linkage portion, so that when one of the first pressing block and the second pressing block moves, the other one is driven to approach or move away from the oxygen sensor chip at the same time.

[0007] According to some embodiments of the present invention, the linkage part includes a linkage groove, a linkage bearing and a linkage rod, one of the first pressure block and the second pressure block is provided with the linkage groove, and the other is provided with the linkage rod, the free end of the linkage rod is rotatably connected to the linkage bearing, the linkage bearing is at least partially inserted in the linkage groove, and the extension direction of the linkage groove is set at an angle to the moving direction of the first pressure block and the moving direction of the second pressure block.

[0008] According to some embodiments of the present invention, the positioning base is provided with a guide portion, the pressing block is slidably connected to the guide portion, and the pressing block is suitable for moving along the extension direction of the guide portion under the drive of the elastic member.

[0009] According to some embodiments of the present invention, the pressing block includes a fine pressing block and a coarse pressing block, the positioning base block is provided with a fine positioning groove, the fine pressing block is movably connected in the fine positioning groove for pressing the oxygen sensor chip, and the coarse pressing block is connected to the guide portion.

[0010] According to some embodiments of the present invention, the positioning base block is provided with a positioning hole, and at least a portion of a side wall of the positioning hole forms the positioning surface; The opening of the positioning hole is provided with a guide surface, and along the extension direction of the positioning hole, the guide surface gradually extends from the opening of the positioning hole toward a direction away from the center of the positioning hole.

[0011] According to some embodiments of the present invention, the oxygen sensor chip positioning mechanism further includes a first detection member, and the first detection member is used to detect the oxygen sensor chip located in the positioning hole.

[0012] On the other hand, an embodiment of the present invention further provides an oxygen sensor assembly device for producing an oxygen sensor, wherein the oxygen sensor includes an oxygen sensor base and an oxygen sensor chip, and includes the oxygen sensor positioning mechanism as described above.

[0013] According to some embodiments of the present invention, the oxygen sensor assembly equipment also includes a first detection camera, a jig and a first conveying mechanism. The first detection camera is arranged upstream of the oxygen sensor chip positioning mechanism and is used to detect the oxygen sensor chip; the jig is suitable for carrying the oxygen sensor base, and the first conveying mechanism is connected to the first detection camera, the oxygen sensor chip positioning mechanism and the jig to realize the conveying and assembly of the oxygen sensor chip.

[0014] The embodiments of the present invention have at least the following beneficial effects: by arranging the elastic reset of the elastic member to drive the pressure block to push the oxygen sensor chip, during the entire positioning process of the oxygen sensor chip, the maximum pressure it receives is only the elastic force of the elastic member, and the elastic force of the elastic member is always smaller than the minimum destructive force of the oxygen sensor chip, and the pressure of the pressure block will not damage the oxygen sensor chip; and the driving component only acts on the compression stage of the elastic member, that is, the force of the driving component will never act on the oxygen sensor chip, and even if the driving component malfunctions and provides excessive power, it will not cause any damage to the oxygen sensor chip.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which: Figure 1 A top view of an oxygen sensor assembly device according to an embodiment of the present invention; Figure 2 It is an isometric view of an oxygen sensor assembly device according to an embodiment of the present invention; Figure 3 This is one of the structural schematic diagrams of the oxygen sensor chip positioning mechanism according to an embodiment of the present invention; Figure 4 This is a second structural schematic diagram of the oxygen sensor chip positioning mechanism according to an embodiment of the present invention; Figure 5 It is a structural schematic diagram of a positioning base block of an oxygen sensor chip positioning mechanism according to an embodiment of the present invention.

[0017] Reference numerals: 110, first transport mechanism; 120, oxygen sensor chip positioning mechanism; 121, positioning base; 1211, guide part; 122, positioning base block; 1222, fine positioning groove; 1223, positioning hole; 1224, guide surface; 123, pressing assembly; 1231, elastic member; 1232, pressing block; 12321, fine pressing block; 12322, rough pressing block; 124, driving assembly; 125, first pressing assembly; 1251, first elastic member; 1252, first pressing block; 126, second pressing assembly; 1261, second elastic member; 1262, second pressing block; 127, linkage part; 1271, linkage groove; 1272, linkage bearing; 1273, linkage rod; 128, first detection member; 140, first detection camera; 410. Jig. DETAILED DESCRIPTION

[0018] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0019] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0020] In the description of the present invention, "several" means one or more, "multiple" means more than two, greater than, less than, and exceeding are understood as not including the number itself, and "above", "below", and "within" are understood as including the number itself. If there is a description of "first", "second", etc., it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0021] In the description of the present invention, unless otherwise clearly defined, words such as “setting”, “installation” and “connection” should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above words in the present invention in combination with the specific content of the technical solution.

[0022] Please refer to Figure 3As shown, the present embodiment discloses an oxygen sensor chip positioning mechanism 120 for positioning the oxygen sensor chip. The oxygen sensor chip positioning mechanism 120 comprises a positioning base 121, a positioning base block 122, a pressing assembly 123 and a driving assembly 124. The positioning base block 122 is connected to the positioning base 121. The positioning base block 122 is provided with a positioning surface, and the positioning surface is suitable for abutting against a part of the surface of the oxygen sensor chip; the pressing assembly 123 is connected to the positioning base 121. The pressing assembly 123 comprises an elastic member 1231 and a pressing block 1232. The pressing block 1232 is suitable for pressing the oxygen sensor chip under the drive of the elastic member 1231; the driving assembly 124 is connected to the positioning base 121. The driving assembly 124 is used to drive the pressing block 1232 to separate from the oxygen sensor chip; wherein the elastic force of the elastic member 1231 is less than the minimum destructive force that the oxygen sensor chip can withstand.

[0023] It should be noted that in the manufacturing process of oxygen sensors, some processes require calibration of the position of oxygen sensor chips to eliminate the errors accumulated by the long-term movement of the transport mechanism and ensure that the oxygen sensor chips are accurately picked up and moved to a specific position. Oxygen sensor chips are small in size and thin in thickness, and conventional positioning mechanisms are prone to damage oxygen sensor chips.

[0024] According to the oxygen sensor positioning mechanism of the embodiment of the present invention, when there is a need to position the oxygen sensor chip, the driving component 124 first drives the pressing block 1232 away from the oxygen sensor chip (that is, away from the positioning surface on the positioning base block 122) and compresses the elastic member 1231, so that there is enough space between the positioning surface and the pressing block 1232 to place the oxygen sensor chip. When the oxygen sensor chip is placed between the positioning surface and the pressing block 1232, the driving component 124 releases the drive on the pressing block 1232. The pressing block 1232 moves toward the oxygen sensor chip under the elastic force of the elastic member 1231, and pushes the oxygen sensor chip to make it fit with the positioning surface, thereby achieving the positioning of the oxygen sensor chip.

[0025] According to the oxygen sensor positioning mechanism of the embodiment of the present invention, the elastic reset of the elastic member 1231 is set to drive the pressing block 1232 to push the oxygen sensor chip. During the entire positioning process of the oxygen sensor chip, the maximum pressure it is subjected to is only the elastic force of the elastic member 1231, and the elastic force of the elastic member 1231 is always set to be smaller than the minimum destructive force of the oxygen sensor chip, and the pressing of the pressing block 1232 will not damage the oxygen sensor chip; and the driving component 124 only acts on the compression stage of the elastic member 1231, that is, the force of the driving component 124 will never act on the oxygen sensor chip, even if the driving component 124 operates erroneously and provides excessive power, it will not cause any damage to the oxygen sensor chip.

[0026] In this embodiment, “the driving component 124 is used to drive the pressing block 1232 to separate from the oxygen sensor chip” can be understood as follows: Figure 3 As shown, the movable end of the driving component 124 can abut against the pressing block 1232 to directly drive the pressing block 1232 to move in the -Y direction as shown in the figure and compress the elastic member 1231; in other embodiments, the movable end of the driving component 124 can also be connected to the elastic member 1231, and the elastic member 1231 can be directly compressed by the driving component 124, and the pressing block 1232 is driven by the elastic member 1231 to move away from the oxygen sensor chip.

[0027] In this embodiment, the driving component 124 may be a cylinder. In other embodiments, it may also be a slide module, a screw module, etc.

[0028] In this embodiment, the elastic member 1231 is a linear spring. In other embodiments, it may also be an elastic silicone pad, a torsion spring or other component with elastic reset capability.

[0029] In some embodiments, in combination Figure 4 As shown, the pressing assembly 123 includes a first pressing assembly 125 and a second pressing assembly 126. The first pressing assembly 125 includes a first elastic member 1251 and a first pressing block 1252; the second pressing assembly 126 includes a second elastic member 1261 and a second pressing block 1262; the moving direction of the first pressing block 1252 and the moving direction of the second pressing block 1262 are set at an angle.

[0030] In this embodiment, the first pressing block 1252 of the first pressing assembly 125 moves along the Y direction as shown in the figure, and the second pressing block 1262 of the second pressing assembly 126 moves along the X direction as shown in the figure, so as to press the oxygen sensor chip from the X direction and the Y direction respectively, and combined with the support of the positioning base 121 on the bottom of the oxygen sensor chip, accurate positioning of the oxygen sensor chip in three-dimensional space is achieved.

[0031] In this embodiment, the first pressing component 125 and the second pressing component 126 can be in the form of a common driving component 124, and a linkage part 127 (which will be described in detail later) can be set between the first pressing component 125 and the second pressing component 126 to achieve synchronous movement of the first pressing component 125 and the second pressing component 126 through the linkage part 127; of course, it can also be in the form of separate driving, and separate driving components can be set for the first pressing component 125 and the second pressing component 126.

[0032] In other embodiments, the number of the pressing components 123 is not limited to two (the first pressing component 125 and the second pressing component 126 ). The number of the pressing components 123 can be adaptively adjusted based on the shape of the oxygen sensor chip.

[0033] In some embodiments, in combination Figure 4 As shown, the oxygen sensor chip positioning mechanism 120 also includes a linkage part 127, and the first pressing block 1252 and the second pressing block 1262 are linked through the linkage part 127, so that when one of the first pressing block 1252 and the second pressing block 1262 moves, the other one is driven to approach or move away from the oxygen sensor chip at the same time.

[0034] In this embodiment, the linkage part 127 is provided to realize the synchronous movement of the first pressing block 1252 and the second pressing block 1262, so as to ensure that while the first pressing block 1252 presses the oxygen sensor chip for positioning along the Y direction, the second pressing block 1262 synchronously realizes the positioning of the oxygen sensor chip in the X direction, so as to avoid the situation that one direction is positioned but the other is not positioned, resulting in the oxygen sensor chip moving and rubbing against the first pressing block 1252 or the second pressing block 1262; and, the oxygen sensor chip positioning mechanism 120 is provided with only one driving component 124 to realize the movement of the first pressing block 1252 and the second pressing block 1262, so as to simplify the structure and volume of the oxygen sensor chip positioning mechanism 120, improve the movement and positioning synchronization of the first pressing block 1252 and the second pressing block 1262, and improve the positioning accuracy.

[0035] In some embodiments, in combination Figure 4 As shown, the linkage part 127 includes a linkage groove 1271, a linkage bearing 1272 and a linkage rod 1273. One of the first pressure block 1252 and the second pressure block 1262 is provided with a linkage groove 1271, and the other is provided with a linkage rod 1273. The free end of the linkage rod 1273 is rotatably connected to the linkage bearing 1272. The linkage bearing 1272 is at least partially inserted in the linkage groove 1271. The extension direction of the linkage groove 1271 is set at an angle to the moving direction of the first pressure block 1252 and the moving direction of the second pressure block 1262.

[0036] In this embodiment, when the first pressure block 1252 moves along the Y direction as shown in the figure, the linkage rod 1273 drives the linkage bearing 1272 to move along the Y direction, the linkage bearing 1272 abuts against the groove wall of the linkage groove 1271 and moves along the linkage groove 1271, and the linkage groove 1271 synchronizes the Y-direction movement of the first pressure block 1252 with the movement of the second pressure block 1262 along the X direction; the rotation of the linkage bearing 1272 effectively reduces the friction between it and the groove wall of the linkage groove 1271, thereby increasing the service life of the linkage part 127.

[0037] In other embodiments, the linkage portion 127 may also be in the form of a multi-link combination or a gear set to synchronize the linear motion of the first pressing block 1252 with the linear motion of the second pressing block 1262 .

[0038] In some embodiments, in combination Figure 3As shown, the positioning base 121 is provided with a guide portion 1211 , and the pressing block 1232 is slidably connected to the guide portion 1211 . The pressing block 1232 is suitable for moving along the extension direction of the guide portion 1211 under the drive of the elastic member 1231 .

[0039] In this embodiment, the moving direction of the pressing block 1232 is limited by the guide portion 1211 to ensure that the pressing block 1232 always moves along the extension direction of the guide portion 1211 under the elastic reset of the elastic member 1231, thereby improving the movement accuracy and ensuring the positioning accuracy of the oxygen sensor chip.

[0040] In this embodiment, the guide portion 1211 can be a slide rail, and the positioning base block 122 is provided with a slide groove corresponding to the slide rail; of course, a slide groove can also be provided on the positioning base 121 as the guide portion 1211, and the positioning base block 122 is provided with a protrusion inserted into the slide groove corresponding to the slide groove.

[0041] In some embodiments, in combination Figure 3 and Figure 5 As shown, the pressing block 1232 includes a fine pressing block 12321 and a rough pressing block 12322. The positioning base block 122 is provided with a fine positioning groove 1222. The fine pressing block 12321 is movably connected to the fine positioning groove 1222 for pressing the oxygen sensor chip. The rough pressing block 12322 is connected to the guide portion 1211. On the basis of the guidance of the guide portion 1211, by setting the fine positioning groove 1222 and the fine pressing block 12321 to cooperate, the movement accuracy of the fine pressing block 12321 is greatly improved, and it is effectively ensured that the oxygen sensor chip pressed by the fine pressing block 12321 can accurately fit the positioning surface, and avoid the situation where the oxygen sensor cannot accurately fit the positioning surface due to the local tilt of the fine pressing block 12321, and effectively ensure the positioning accuracy of the oxygen sensor chip.

[0042] In some embodiments, in combination Figure 3 and Figure 5 As shown, the positioning base block 122 is provided with a positioning hole 1223, and at least part of the side wall of the positioning hole 1223 forms a positioning surface; the opening of the positioning hole 1223 is provided with a guide surface 1224, and along the extension direction of the positioning hole 1223, the guide surface 1224 gradually extends from the opening of the positioning hole 1223 toward the center direction away from the positioning hole 1223.

[0043] In this embodiment, the positioning hole 1223 extends along the Z direction as shown in the figure, and the inclined guide surface 1224 can guide the oxygen sensor chip to slide into the positioning hole 1223, thereby reducing the requirements for the transportation accuracy of the oxygen sensor chip. The positioning hole 1223 can limit the activity range of the oxygen sensor chip, reduce the positioning time, and reduce the moving distance of the pressure block 1232 during positioning to avoid accumulated movement errors, thereby effectively improving the positioning accuracy of the oxygen sensor chip.

[0044] In this embodiment, the shape of the positioning hole 1223 adapted to the oxygen sensor chip is a rectangle. Of course, the shape of the positioning hole 1223 can be adaptively adjusted based on other shapes of the oxygen sensor chip, such as a cylindrical positioning hole 1223.

[0045] In some embodiments, in combination Figure 3 As shown, the oxygen sensor chip positioning mechanism 120 further includes a first detection member 128 , and the first detection member 128 is used to detect the oxygen sensor chip located in the positioning hole 1223 .

[0046] In this embodiment, when the first detection member 128 detects the oxygen sensor chip, it indicates that the oxygen sensor chip has been moved and placed in or above the positioning hole 1223. At this time, the oxygen sensor chip can be inserted into the positioning hole 1223, and the elastic member 1231 drives the pressing block 1232 to press the oxygen sensor chip to complete the positioning.

[0047] In this embodiment, the first detection element 128 may be an image acquisition device, an infrared sensor or other device that can identify the position of the oxygen sensor chip.

[0048] On the other hand, combined Figure 1 and Figure 2 As shown, an embodiment of the present invention further provides an oxygen sensor assembly device for producing an oxygen sensor. The oxygen sensor includes an oxygen sensor base and an oxygen sensor chip. The oxygen sensor assembly device includes the oxygen sensor positioning mechanism as described in the above embodiment.

[0049] The oxygen sensor assembly equipment according to the embodiment of the present invention has the same beneficial effects as the oxygen sensor chip positioning mechanism of the embodiment of the first aspect of the present invention.

[0050] In some embodiments, in combination Figure 1 and Figure 2 As shown, the oxygen sensor assembly equipment also includes a first detection camera 140, a jig 410 and a first conveying mechanism 110. The first detection camera 140 is arranged upstream of the oxygen sensor chip positioning mechanism 120 and is used to detect the oxygen sensor chip; the jig 410 is suitable for carrying the oxygen sensor base, and the first conveying mechanism 110 is connected to the first detection camera 140, the oxygen sensor chip positioning mechanism 120 and the jig 410 to realize the conveying and assembly of the oxygen sensor chip.

[0051] In this embodiment, the first conveying mechanism 110 conveys the oxygen sensor chip from the loading tray to the inspection field of view of the first detection camera 140, and the first detection camera 140 detects the appearance of the oxygen sensor chip and determines the front and back sides of the oxygen sensor chip. Unqualified products are moved into the recovery tray, and before qualified products are placed in the oxygen sensor chip positioning mechanism 120, the first conveying mechanism 110 adjusts the front and back sides based on the inspection results of the first detection camera 140 to ensure that the surface of the oxygen sensor chip corresponds to the positioning surface; the repositioned oxygen sensor chip is then conveyed by the first conveying mechanism 110 to the top of the jig 410, and assembled with the oxygen sensor base carried by the jig 410.

[0052] In the present embodiment, by providing the oxygen sensor chip positioning mechanism 120 and the first detection camera 140, not only the appearance of the oxygen sensor chip is inspected, but also before the oxygen sensor chip is transported to the top of the fixture 410, the oxygen sensor chip is repositioned by the oxygen sensor chip positioning mechanism 120 to eliminate the accumulated errors caused by the long-term movement of the first transport mechanism 110, thereby ensuring that the oxygen sensor chip can be stably assembled with the oxygen sensor base.

[0053] The oxygen sensor positioning mechanism provided in this embodiment can effectively ensure the movement accuracy of the oxygen sensor chip by segmenting the transportation process and repositioning the oxygen sensor chip positioning mechanism 120 to eliminate the movement error as long as there is a transportation mechanism (such as the first transportation mechanism 110) running for a long time during the oxygen sensor chip loading process.

[0054] In this embodiment, the first transport mechanism 110 is a multi-axis robot arm; in other embodiments, the first transport mechanism 110 may also be a combination of multiple linear motion modules and a clamping claw.

[0055] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. An oxygen sensor chip positioning mechanism, used for positioning an oxygen sensor chip, characterized in that: include: Positioning base (121); A positioning base block (122) connected to the positioning base (121), the positioning base block (122) being provided with a positioning surface, the positioning surface being suitable for abutting against a portion of the surface of the oxygen sensor chip; A pressing component (123) connected to the positioning base (121), the pressing component (123) comprising an elastic member (1231) and a pressing block (1232), the pressing block (1232) being suitable for pressing the oxygen sensor chip under the drive of the elastic member (1231); A driving component (124) connected to the positioning base (121), the driving component (124) being used to drive the pressing block (1232) to separate from the oxygen sensor chip; The elastic force of the elastic member (1231) is smaller than the minimum destructive force that the oxygen sensor chip can withstand.

2. The oxygen sensor chip positioning mechanism according to claim 1, characterized in that: The pressing assembly (123) comprises a first pressing assembly (125) and a second pressing assembly (126); the first pressing assembly (125) comprises a first elastic member (1251) and a first pressing block (1252); the second pressing assembly (126) comprises a second elastic member (1261) and a second pressing block (1262); The moving direction of the first pressing block (1252) and the moving direction of the second pressing block (1262) are arranged at an angle.

3. The oxygen sensor chip positioning mechanism according to claim 2, characterized in that: The oxygen sensor chip positioning mechanism further comprises a linkage portion (127), and the first pressing block (1252) and the second pressing block (1262) are linked via the linkage portion (127), so that when one of the first pressing block (1252) and the second pressing block (1262) moves, the other is driven to simultaneously approach or simultaneously move away from the oxygen sensor chip.

4. The oxygen sensor chip positioning mechanism according to claim 3, characterized in that: The linkage part (127) comprises a linkage groove (1271), a linkage bearing (1272) and a linkage rod (1273); one of the first pressing block (1252) and the second pressing block (1262) is provided with the linkage groove (1271), and the other is provided with the linkage rod (1273); the free end of the linkage rod (1273) is rotatably connected to the linkage bearing (1272); the linkage bearing (1272) is at least partially inserted into the linkage groove (1271); and the extension direction of the linkage groove (1271) is set at an angle to the moving direction of the first pressing block (1252) and the moving direction of the second pressing block (1262).

5. The oxygen sensor chip positioning mechanism according to any one of claims 1 to 4, characterized in that: The positioning base (121) is provided with a guide portion (1211), the pressing block (1232) is slidably connected to the guide portion (1211), and the pressing block (1232) is suitable for moving along the extension direction of the guide portion (1211) under the drive of the elastic member (1231).

6. The oxygen sensor chip positioning mechanism according to claim 5, characterized in that: The pressing block (1232) comprises a fine pressing block (12321) and a coarse pressing block (12322); the positioning base block (122) is provided with a fine positioning groove (1222); the fine pressing block (12321) is movably connected in the fine positioning groove (1222) and is used to press the oxygen sensor chip; the coarse pressing block (12322) is connected to the guide portion (1211).

7. The oxygen sensor chip positioning mechanism according to any one of claims 1 to 4, characterized in that: The positioning base block (122) is provided with a positioning hole (1223), and at least a part of the side wall of the positioning hole (1223) forms the positioning surface; The opening of the positioning hole (1223) is provided with a guide surface (1224), and along the extension direction of the positioning hole (1223), the guide surface (1224) gradually extends from the opening of the positioning hole (1223) towards a direction away from the center of the positioning hole (1223).

8. The oxygen sensor chip positioning mechanism according to claim 7, characterized in that: The oxygen sensor chip positioning mechanism further comprises a first detection member (128), wherein the first detection member (128) is used to detect the oxygen sensor chip located in the positioning hole (1223).

9. An oxygen sensor assembly device for producing an oxygen sensor, wherein the oxygen sensor comprises an oxygen sensor base and an oxygen sensor chip, characterized in that: It comprises the oxygen sensor chip positioning mechanism (120) as claimed in any one of claims 1 to 8.

10. The oxygen sensor assembly equipment according to claim 9, characterized in that: The oxygen sensor assembly equipment further comprises a first detection camera (140), a fixture (410) and a first transport mechanism (110); the first detection camera (140) is arranged upstream of the oxygen sensor chip positioning mechanism (120) and is used to detect the oxygen sensor chip; the fixture (410) is suitable for carrying the oxygen sensor base; the first transport mechanism (110) is connected to the first detection camera (140), the oxygen sensor chip positioning mechanism (120) and the fixture (410) to realize the transport and assembly of the oxygen sensor chip.

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