Semiconductor temperature control device and temperature control method

Abstract

The application relates to the technical field of semiconductor production equipment, and provides a semiconductor temperature control device and a temperature control method. The semiconductor temperature control device comprises a refrigeration system, an internal circulation system, a coolant circulation pipeline system and a control system. The internal circulation system comprises a heat exchange component, a coolant storage component and a driving pump. The heat exchange component, the first inlet of the coolant storage component, the first outlet of the coolant storage component and the driving pump are sequentially connected in communication. The heat exchange component is connected with the refrigeration system and is adapted to exchange heat with the refrigeration system. The second outlet of the coolant storage component, the coolant circulation pipeline system and the second inlet of the coolant storage component are sequentially connected in communication. The refrigeration system and the driving pump are connected with the control system. According to the semiconductor temperature control device provided by the application, the refrigeration system intermittently works, the output ratio of the refrigeration system is reduced, and the energy-saving and consumption-reducing effect is achieved.

Description

Semiconductor temperature control device and temperature control method Technical Field

[0001] This application relates to the field of semiconductor manufacturing equipment technology, and in particular to semiconductor temperature control devices and methods. Background Technology

[0002] In the semiconductor manufacturing process, a dedicated temperature control device is usually used to obtain a constant-temperature coolant to remove the heat generated during the process and maintain the required temperature.

[0003] The temperature control device in the relevant technology mainly achieves temperature control by adjusting the opening of the electronic expansion valve of the refrigeration system, which causes the compressor of the refrigeration system to run under various load conditions, resulting in high energy consumption. Summary of the Invention

[0004] This application aims to solve at least one of the technical problems existing in the related art. To this end, this application proposes a semiconductor temperature control device that enables the intermittent operation of the refrigeration system, reduces the output ratio of the refrigeration system, and achieves the effect of energy saving and consumption reduction.

[0005] This application also proposes a temperature control method.

[0006] The semiconductor temperature control device according to the first aspect of this application includes:

[0007] Refrigeration system;

[0008] An internal circulation system includes a heat exchange component, a refrigerant storage unit, and a drive pump. The heat exchange component, the first inlet of the refrigerant storage unit, the first outlet of the refrigerant storage unit, and the drive pump are sequentially connected. The heat exchange component is connected to the refrigeration system and is adapted to exchange heat with the refrigeration system.

[0009] The refrigerant circulation piping system is provided, wherein the second outlet of the refrigerant storage device, the refrigerant circulation piping system, and the second inlet of the refrigerant storage device are connected in sequence;

[0010] The control system is connected to both the refrigeration system and the drive pump.

[0011] According to the semiconductor temperature control device of this application embodiment, when it starts working, the refrigeration system, the internal circulation system, and the refrigerant circulation pipeline system operate normally. The refrigeration system exchanges heat with the heat exchange components, and the drive pump drives the refrigerant in the refrigerant storage container to flow from the first outlet to the heat exchange components. After exchanging heat with the heat exchange components, the refrigerant flows back from the first inlet to the refrigerant storage container, forming an internal circulation path, thereby achieving temperature regulation of the refrigerant in the refrigerant storage container. At the same time, the refrigerant in the refrigerant storage container flows to the refrigerant circulation pipeline system through the second outlet, enabling the refrigerant circulation pipeline system to accurately control the temperature of the corresponding load using the refrigerant. Finally, the refrigerant in the refrigerant circulation pipeline system flows back to the refrigerant storage container, forming an external circulation path.

[0012] When the temperature of the refrigerant in the refrigerant storage unit is detected to be lower than the preset value, it indicates that the refrigerant storage unit has stored sufficient cooling capacity. The refrigeration system is then shut down, meaning the internal circulation path is closed. At this point, the refrigerant in the storage unit and the refrigerant circulation piping system are used to precisely control the load temperature. When the refrigerant level in the storage unit rises to the preset value, it indicates that the refrigerant in the storage unit alone is no longer sufficient to meet the temperature control requirements. The refrigeration system is then restarted, meaning the internal circulation path is opened, allowing the refrigeration system to cool the refrigerant in the storage unit. This cycle continues continuously. This achieves the purpose of intermittent operation of the refrigeration system, reducing the system's output ratio and achieving energy saving and consumption reduction.

[0013] According to one embodiment of this application, the semiconductor temperature control device includes a three-way valve, the refrigerant circulation pipeline system includes an outlet pipeline and a return pipeline, the inlet of the three-way valve is connected to the return pipeline, the first outlet of the three-way valve is connected to the second inlet of the refrigerant storage device, the first outlet of the three-way valve is connected to the outlet pipeline, and the second outlet of the refrigerant storage device is connected to the outlet pipeline.

[0014] According to one embodiment of this application, the refrigerant circulation pipeline system includes a heater and a third temperature sensor. The liquid outlet pipeline is sequentially connected to the second outlet of the refrigerant storage device, the heater, and the third temperature sensor. Both the heater and the third temperature sensor are connected to the control system. The control system is configured to control the output of the heater based on the detection data of the third temperature sensor.

[0015] According to one embodiment of this application, a pressure sensor and a flow meter are sequentially connected between the heater and the third temperature sensor, and both the pressure sensor and the flow meter are connected to the control system.

[0016] According to one embodiment of this application, the second outlet of the refrigerant storage device and the second outlet of the three-way valve are both connected to the heater via connecting pipes. A fourth temperature sensor is provided at the connecting pipe. The fourth temperature sensor and the three-way valve are both connected to the control system. The control system is configured to control and adjust the opening degree of the three-way valve based on the detection data of the fourth temperature sensor.

[0017] According to one embodiment of this application, the internal circulation system includes a first temperature sensor, and the control system is configured to: control the operation of the refrigeration system and the drive pump based on the detection data of the first temperature sensor, wherein...

[0018] The first temperature sensor is located between the first outlet of the refrigerant storage unit and the drive pump; and / or,

[0019] The first temperature sensor is located between the drive pump and the heat exchange component.

[0020] According to one embodiment of this application, the internal circulation system includes a second temperature sensor disposed between the heat exchange component and the first inlet of the refrigerant storage component, and the control system is configured to control and adjust the cooling output of the refrigeration system based on the detection data of the second temperature sensor.

[0021] According to one embodiment of this application, the refrigeration system includes a compressor, a plate heat exchanger, a dryer filter, and an electronic expansion valve connected in sequence, with the heat exchange components connected between the electronic expansion valve and the compressor.

[0022] According to one embodiment of this application, a sight glass is provided between the drying filter and the electronic expansion valve.

[0023] The temperature control method according to a second aspect of this application includes:

[0024] The refrigeration system, the internal circulation system, and the refrigerant circulation pipeline system are all kept in working condition.

[0025] The temperature of the refrigerant in the refrigerant storage container is determined to be less than or equal to a first preset temperature;

[0026] The refrigeration system is controlled to be in a non-operating state, and the outlet temperature of the refrigerant circulation pipeline system is controlled based on the internal circulation system.

[0027] The temperature of the refrigerant in the refrigerant storage container is determined to be greater than or equal to the second preset temperature;

[0028] The refrigeration system is controlled to be in working condition.

[0029] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 is a schematic diagram of the structure of the semiconductor temperature control device provided in the embodiment of this application.

[0032] Figure label:

[0033] 1. Refrigeration system; 2. Internal circulation system; 3. Refrigerant circulation piping system; 4. Three-way valve;

[0034] 5. Connecting pipelines; 11. Compressor; 12. Plate heat exchanger; 13. Dryer filter;

[0035] 14. Electronic expansion valve; 15. Sight glass; 21. Heat exchange components; 22. Refrigerant storage components;

[0036] 23. Drive pump; 24. First temperature sensor; 25. Second temperature sensor; 31. Discharge line;

[0037] 32. Return line; 33. Heater; 34. Third temperature sensor; 35. Pressure sensor;

[0038] 36. Flow meter; 51. Fourth temperature sensor. Detailed Implementation

[0039] The embodiments of this application will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this application, but should not be used to limit the scope of this application.

[0040] In the description of the embodiments of this application, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0041] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.

[0042] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0043] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0044] The semiconductor temperature control device and temperature control method of this application are described below with reference to Figure 1.

[0045] According to an embodiment of the first aspect of this application, as shown in FIG1, the semiconductor temperature control device includes:

[0046] Refrigeration system 1;

[0047] The internal circulation system 2 includes a heat exchange component 21, a refrigerant storage unit 22 and a drive pump 23. The heat exchange component 21, the first inlet of the refrigerant storage unit 22, the first outlet of the refrigerant storage unit 22 and the drive pump 23 are connected in sequence. The heat exchange component 21 is connected to the refrigeration system 1 and is adapted to exchange heat with the refrigeration system 1.

[0048] The refrigerant circulation piping system 3, the second outlet of the refrigerant storage device 22, the refrigerant circulation piping system 3 and the second inlet of the refrigerant storage device 22 are connected in sequence;

[0049] The control system, refrigeration system 1, and drive pump 23 are all connected to the control system.

[0050] According to the semiconductor temperature control device of this application embodiment, when it starts working, the refrigeration system 1, the internal circulation system 2, and the refrigerant circulation pipeline system 3 operate normally. The refrigeration system 1 exchanges heat with the heat exchange component 21, and the drive pump 23 drives the refrigerant in the refrigerant storage container 22 to flow from the first outlet to the heat exchange component 21. After exchanging heat with the heat exchange component 21, the refrigerant flows back from the first inlet to the refrigerant storage container 22, forming an internal circulation path, thereby achieving temperature regulation of the refrigerant in the refrigerant storage container 22. At the same time, the refrigerant in the refrigerant storage container 22 flows to the refrigerant circulation pipeline system 3 through the second outlet, so that the refrigerant circulation pipeline system 3 can use the refrigerant to accurately control the temperature of the corresponding load. Finally, the refrigerant in the refrigerant circulation pipeline system 3 will flow back to the refrigerant storage container 22, forming an external circulation path.

[0051] When the temperature of the refrigerant in the refrigerant storage unit 22 is detected to be lower than the preset value, it indicates that the refrigerant storage unit 22 has stored enough cooling capacity, and the refrigeration system 1 is shut down, i.e., the internal circulation path is closed. At this time, the refrigerant in the refrigerant storage unit 22 and the refrigerant circulation pipeline system 3 are used to precisely control the temperature of the load. When the refrigerant in the refrigerant storage unit 22 rises to the preset value, it indicates that the refrigerant in the refrigerant storage unit 22 alone is no longer sufficient to meet the temperature control requirements, and the refrigeration system 1 is restarted, i.e., the internal circulation pipeline is opened, so that the refrigeration system 1 cools the refrigerant in the refrigerant storage unit 22, and this cycle continues. This achieves the purpose of intermittent operation of the refrigeration system 1, reduces the output ratio of the refrigeration system 1, and achieves the effect of energy saving and consumption reduction.

[0052] It is understandable that the refrigerant storage unit 22 is, for example, a water tank.

[0053] According to one embodiment of this application, as shown in FIG1, the semiconductor temperature control device includes a three-way valve 4, and the refrigerant circulation pipeline system 3 includes an outlet pipeline 31 and a return pipeline 32. The inlet of the three-way valve 4 is connected to the return pipeline 32, the first outlet of the three-way valve 4 is connected to the second inlet of the refrigerant storage device 22, the first outlet of the three-way valve 4 is connected to the outlet pipeline 31, and the second outlet of the refrigerant storage device 22 is connected to the outlet pipeline 31.

[0054] Understandably, the refrigerant in the refrigerant storage unit 22 flows to the liquid outlet line 31 through the second outlet, and then flows back to the liquid return line 32. Since the liquid return line 32 is connected to the inlet of the three-way valve 4, and the two outlets of the three-way valve 4 are respectively connected to the second inlet of the refrigerant storage unit 22 and the liquid outlet line 31, the refrigerant in the liquid return line 32 can flow to either the refrigerant storage unit 22 or the liquid outlet line 31. By adjusting the opening of the three-way valve 4, the amount of refrigerant flowing from the liquid return line 32 to the refrigerant storage unit 22 can be controlled, thereby adjusting the amount of refrigerant flowing from the refrigerant storage unit 22 to the liquid outlet line 31, and thus achieving temperature control and regulation of the refrigerant in the liquid outlet line 31.

[0055] According to one embodiment of this application, as shown in FIG1, the refrigerant circulation pipeline system 3 includes a heater 33 and a third temperature sensor 34. The liquid outlet pipeline 31 is sequentially connected to the second outlet of the refrigerant storage device 22, the heater 33 and the third temperature sensor 34. Both the heater 33 and the third temperature sensor 34 are connected to the control system. The control system is configured to control the output of the heater 33 based on the detection data of the third temperature sensor 34.

[0056] It is understandable that the third temperature sensor 34 can detect the temperature of the refrigerant at the liquid line 31, that is, the third temperature sensor 34 can detect the real-time outlet temperature of the semiconductor temperature control device, compare the real-time outlet temperature with the set temperature value, and then adjust the output of the heater 33 so that the real-time outlet temperature of the semiconductor is the same as the set temperature value, thereby achieving precise temperature control of the load.

[0057] In one embodiment of this application, as shown in FIG1, a pressure sensor 35 and a flow meter 36 are sequentially connected between the heater 33 and the third temperature sensor 34, and both the pressure sensor 35 and the flow meter 36 are connected to the control system.

[0058] It is understandable that the pressure sensor 35 can detect the real-time outlet pressure at the liquid line 31, and the flow meter 36 can detect the real-time liquid flow at the liquid line 31. The real-time outlet pressure and real-time liquid flow can be used to determine whether the outlet parameters of the temperature control device meet the requirements, so that the temperature control device can accurately control the temperature of the load.

[0059] In one embodiment of this application, as shown in FIG1, the second outlet of the refrigerant storage device 22 and the second outlet of the three-way valve 4 are both connected to the heater 33 through the connecting pipe 5. A fourth temperature sensor 51 is provided at the connecting pipe 5. The fourth temperature sensor 51 and the three-way valve 4 are both connected to the control system. The control system is configured to control and adjust the opening degree of the three-way valve 4 based on the detection data of the fourth temperature sensor 51.

[0060] Understandably, the refrigerant flowing out of the second outlet of the refrigerant storage device 22 and the refrigerant flowing out of the second outlet of the three-way valve 4 mix and flow to the connecting pipe 5, and then flow to the heater 33 through the connecting pipe 5. That is to say, the fourth temperature sensor 51 detects the temperature of the refrigerant delivered to the outlet pipe 31. The real-time temperature detected by the fourth temperature sensor 51 is compared with the set temperature, and the opening of the three-way valve 4 is adjusted according to the comparison result so that the temperature of the refrigerant delivered to the outlet pipe 31 is consistent with the set temperature, so that the heater 33 can keep the outlet temperature of the temperature control device stable.

[0061] In one embodiment of this application, as shown in FIG1, the internal circulation system 2 includes a first temperature sensor 24, and the control system is configured to control the operation of the refrigeration system 1 and the drive pump 23 based on the detection data of the first temperature sensor 24, wherein...

[0062] The first temperature sensor 24 is located between the first outlet of the refrigerant storage unit 22 and the drive pump 23; and / or,

[0063] The first temperature sensor 24 is located between the drive pump 23 and the heat exchange component 21.

[0064] It is understandable that the refrigerant in the refrigerant storage unit 22 flows to the drive pump 23 and the heat exchange component 21 through the first outlet. Therefore, the temperature of the refrigerant between the heat exchange component 21 and the first outlet is essentially the same as the temperature of the refrigerant in the refrigerant storage unit 22. Thus, whether the first temperature sensor 24 is located between the first outlet and the drive pump 23 or between the drive pump 23 and the heat exchange component 21, it can detect the temperature of the refrigerant in the refrigerant storage unit 22. When the temperature of the refrigerant in the refrigerant storage unit 22 is detected to be lower than the set temperature, it indicates that the refrigerant storage unit 22 has completed its cold storage and can be used solely for circulating temperature control. In this case, the control system will control the refrigeration system 1 and the drive pump 23 to stop working, reducing the energy consumption of the refrigeration system 1.

[0065] It is understandable that the set temperature of the first temperature sensor 24 is lower than the set temperature of the outlet temperature of the semiconductor temperature control device, so as to ensure that the refrigerant in the refrigerant storage unit 22 can be used to control the outlet temperature of the semiconductor temperature control device to be at the set temperature.

[0066] In one embodiment of this application, as shown in FIG1, the internal circulation system 2 includes a second temperature sensor 25, which is disposed between the heat exchange component 21 and the first inlet of the refrigerant storage component 22. The control system is configured to control and adjust the cooling output of the refrigeration system 1 based on the detection data of the second temperature sensor 25.

[0067] Understandably, the refrigerant in the refrigerant storage unit 22 flows from the first outlet to the heat exchange component 21, which exchanges heat with the refrigeration system 1. This means the refrigeration system 1 can control the temperature of the refrigerant passing through the heat exchange component 21. The refrigerant after passing through the heat exchange component 21 flows to the first inlet of the refrigerant storage unit 22. The second temperature sensor 25 can detect the temperature of the refrigerant after heat exchange through the heat exchange component 21. When the temperature detected by the second temperature sensor 25 is higher than the set value, it indicates that the refrigeration system 1 has not lowered the temperature of the refrigerant flowing through the heat exchange component 21 to the set temperature. The control system then controls the refrigeration system 1 to increase the cooling output to ensure that the temperature of the refrigerant in the refrigerant storage unit 22 is lowered to the set temperature, allowing the refrigerant storage unit 22 to be independently circulated and temperature-controlled.

[0068] In one embodiment of this application, as shown in FIG1, the refrigeration system 1 includes a compressor 11, a plate heat exchanger 12, a dryer filter 13 and an electronic expansion valve 14 connected in sequence, and a heat exchange component 21 is connected between the electronic expansion valve 14 and the compressor 11.

[0069] It is understandable that the refrigerant flows sequentially along the compressor 11, plate heat exchanger 12, dryer filter 13, electronic expansion valve 14 and heat exchange component 21. By controlling the opening of the electronic expansion valve 14, the cooling capacity flowing through the heat exchange component 21 can be controlled, thereby achieving temperature regulation of the refrigerant in the refrigerant storage component 22.

[0070] In one embodiment of this application, as shown in FIG1, a sight glass 15 is provided between the dryer filter 13 and the electronic expansion valve 14.

[0071] Understandably, the flow of refrigerant in the refrigeration system 1 can be observed through the sight glass 15 in order to make real-time adjustments.

[0072] According to an embodiment of the second aspect of this application, the temperature control method includes:

[0073] The refrigeration system 1, the internal circulation system 2, and the refrigerant circulation piping system 3 are all in operation.

[0074] The temperature of the refrigerant in the refrigerant storage unit 22 is determined to be less than or equal to a first preset temperature;

[0075] The refrigeration system 1 is kept in a non-working state, and the outlet temperature of the refrigerant circulation pipeline system 3 is controlled based on the internal circulation system 2.

[0076] The temperature of the refrigerant in the refrigerant storage unit 22 is determined to be greater than or equal to the second preset temperature;

[0077] Control the refrigeration system 1 to be in working condition.

[0078] According to the temperature control method of this application embodiment, when the equipment starts working, the refrigeration system 1, the internal circulation system 2, and the refrigerant circulation pipeline system 3 are all controlled to be in working state. At this time, the refrigeration system 1 cools the refrigerant in the internal circulation system 2 and the refrigerant circulation pipeline system 3, thereby achieving precise temperature control of the load. During this period, the temperature of the refrigerant in the refrigerant storage container 22 is continuously acquired. When it is determined that the temperature of the refrigerant in the refrigerant storage container 22 is less than or equal to a first preset temperature, it indicates that the refrigerant storage container 22 alone can achieve circulating temperature control. Therefore, the refrigeration system 1 is controlled to be in a non-working state, and the outlet temperature of the refrigerant circulation pipeline system 3 is controlled by the internal circulation system 2, so that the temperature control of the load can still be guaranteed when the refrigeration system 1 is shut down. As the internal circulation system 2 is used independently, the temperature of the refrigerant in the refrigerant storage unit 22 gradually rises. When the temperature in the refrigerant storage unit 22 rises to a level greater than or equal to the second preset temperature, it indicates that the refrigerant storage unit 22 is unable to independently control the outlet temperature of the refrigerant circulation pipeline system 3. Therefore, the refrigeration system 1 is kept in operation, and this process repeats continuously. This achieves the purpose of intermittent operation of the refrigeration system 1, reduces the output ratio of the refrigeration system 1, and achieves energy saving and consumption reduction.

[0079] In one embodiment of this application, when the refrigeration system 1, the internal circulation system 2, and the refrigerant circulation pipeline system 3 are all in operation, the opening of the three-way valve 4 is at its minimum value. When the refrigeration system 1 is not in operation, the opening of the three-way valve 4 is gradually increased. When the opening of the three-way valve 4 reaches a preset value, it indicates that the refrigerant storage unit 22 has completed the circulating temperature control operation. At this point, the refrigerant storage unit 22 can hardly maintain stable control of the outlet temperature of the refrigerant circulation pipeline system 3. Therefore, the refrigeration system 1, the internal circulation system 2, and the refrigerant circulation pipeline system 3 are all kept in operation to ensure stable control of the outlet temperature of the refrigerant circulation pipeline system 3. This causes the temperature of the refrigerant in the refrigerant storage unit 22 to gradually decrease, while the opening of the three-way valve 4 is gradually reduced to its minimum value. This continuous cycle ensures that the refrigeration system 1 has an optimal on / off ratio, effectively reducing the energy consumption of the refrigeration system 1.

[0080] Finally, it should be noted that the above embodiments are only used to illustrate this application and are not intended to limit this application. Although this application has been described in detail with reference to the embodiments, those skilled in the art should understand that various combinations, modifications, or equivalent substitutions of the technical solutions of this application do not depart from the spirit and scope of the technical solutions of this application and should be covered within the scope of the claims of this application.

Claims

1. A semiconductor temperature control device, characterized in that, include: Refrigeration system; An internal circulation system includes a heat exchange component, a refrigerant storage unit, and a drive pump. The heat exchange component, the first inlet of the refrigerant storage unit, the first outlet of the refrigerant storage unit, and the drive pump are sequentially connected. The heat exchange component is connected to the refrigeration system and is adapted to exchange heat with the refrigeration system. A refrigerant circulation piping system is provided, wherein the second outlet of the refrigerant storage device, the refrigerant circulation piping system, and the second inlet of the refrigerant storage device are sequentially connected; a control system is provided, wherein the refrigeration system and the drive pump are both connected to the control system; a three-way valve is provided, wherein the refrigerant circulation piping system includes an outlet pipe and a return pipe, the inlet of the three-way valve is connected to the return pipe, the first outlet of the three-way valve is connected to the second inlet of the refrigerant storage device, the first outlet of the three-way valve is connected to the outlet pipe, and the second outlet of the refrigerant storage device is connected to the outlet pipe; when the refrigeration system, the internal circulation system, and the refrigerant circulation piping system are all in working condition, the opening degree of the three-way valve is at its minimum value; when the refrigeration system is in a non-working state, the opening degree of the three-way valve is gradually increased; when it is determined that the opening degree of the three-way valve has increased to a preset opening value, the refrigeration system, the internal circulation system, and the refrigerant circulation piping system are all in working condition, and the opening degree of the three-way valve is gradually decreased to its minimum value.

2. The semiconductor temperature control device according to claim 1, characterized in that, The refrigerant circulation pipeline system includes a heater and a third temperature sensor. The liquid outlet pipeline is sequentially connected to the second outlet of the refrigerant storage device, the heater, and the third temperature sensor. Both the heater and the third temperature sensor are connected to the control system. The control system is configured to control the output of the heater based on the detection data of the third temperature sensor.

3. The semiconductor temperature control device according to claim 2, characterized in that, A pressure sensor and a flow meter are connected in sequence between the heater and the third temperature sensor, and both the pressure sensor and the flow meter are connected to the control system.

4. The semiconductor temperature control device according to claim 2 or 3, characterized in that, The second outlet of the refrigerant storage device and the second outlet of the three-way valve are both connected to the heater through connecting pipes. A fourth temperature sensor is provided at the connecting pipe. The fourth temperature sensor and the three-way valve are both connected to the control system. The control system is configured to control and adjust the opening degree of the three-way valve based on the detection data of the fourth temperature sensor.

5. The semiconductor temperature control device according to any one of claims 1 to 3, characterized in that, The internal circulation system includes a first temperature sensor, and the control system is configured to: control the operation of the refrigeration system and the drive pump based on the detection data of the first temperature sensor, wherein the first temperature sensor is located between the first outlet of the refrigerant storage device and the drive pump; and / or, the first temperature sensor is located between the drive pump and the heat exchange component.

6. The semiconductor temperature control device according to any one of claims 1 to 3, characterized in that, The internal circulation system includes a second temperature sensor located between the heat exchange component and the first inlet of the refrigerant storage component. The control system is configured to control and adjust the cooling output of the refrigeration system based on the detection data from the second temperature sensor.

7. The semiconductor temperature control device according to any one of claims 1 to 3, characterized in that, The refrigeration system includes a compressor, a plate heat exchanger, a dryer filter, and an electronic expansion valve connected in sequence, with the heat exchange components connected between the electronic expansion valve and the compressor.

8. The semiconductor temperature control device according to claim 7, characterized in that, A sight glass is provided between the dryer filter and the electronic expansion valve.

9. A temperature control method based on the semiconductor temperature control device as described in any one of claims 1 to 8, characterized in that, include: The refrigeration system, the internal circulation system, and the refrigerant circulation pipeline system are all in operation, and the opening of the three-way valve is at its minimum value. The temperature of the refrigerant in the refrigerant storage container is determined to be less than or equal to a first preset temperature; the refrigeration system is controlled to be in a non-operating state, and the outlet temperature of the refrigerant circulation pipeline system is controlled based on the internal circulation system; the opening of the three-way valve is controlled to gradually increase; when the opening of the three-way valve is determined to increase to a preset opening value, the refrigeration system, the internal circulation system, and the refrigerant circulation pipeline system are all controlled to be in an operating state, while the opening of the three-way valve is controlled to gradually decrease to a minimum value. Determine that the temperature of the refrigerant in the refrigerant storage device is greater than or equal to a second preset temperature; control the refrigeration system to be in working condition.

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