A support member and a manufacturing method thereof, a backlight module and a display device

Abstract

The present invention discloses a support member and a preparation method thereof, a backlight module and a display device, which are used in a direct-type LED display module. The support member includes a support column and a buffer structure, wherein the buffer structure is arranged at the top end of the support column; wherein the buffer structure includes a plurality of buffer layers stacked together, wherein the plurality of buffer layers are stacked along the length direction of the support column to form the support portion, wherein the support portion is used to support a diffusion plate, and can play a buffering role and reduce contact friction, and at least a luminescent material is added to the main body material of the support portion, and the luminescent material forms photoluminescence after being excited by a short-wave light source, so that the entire support portion has a self-luminescent property, and therefore, no shadow exists at the contact portion between the support portion and the diffusion plate, thereby solving the problem of shadow caused by the contact between the support column and the diffusion plate.

Description

Technical Field

[0001] The present invention relates to the technical field of LEDs, and in particular to a support member and a preparation method thereof, a backlight module and a display device. Background Art

[0002] With the rapid development of sub-millimeter light-emitting diode (Mini-LED) light sources, major TV manufacturers have successively launched products with Mini-LED backlight technology. Compared with traditional LCDs, Mini-LED products have many advantages such as ultra-high brightness, lifespan, high contrast, HDR wide dynamic display range, and energy saving. High-end Mini-LED display images are comparable to OLED, and there are no hidden dangers such as OLED lifespan and afterimage.

[0003] Since miniLED products are relatively thin, the OD (full name optical distance) is small. OD generally refers to the distance from the PCB surface to the bottom surface of the diffusion plate. The LED spacing is small, that is, the LED Pitch is small. Pitch mainly refers to the spacing between adjacent LEDs, which can be divided into horizontal and vertical. In miniLED products, in order to ensure the light mixing effect between the dense miniLEDs and the upper diffusion plate, it is necessary to ensure that the spacing between the two remains unchanged. Generally, a support structure is set inside the module cavity, commonly known as a support column.

[0004] At present, the OD of high-end models is generally 3~10mm. Generally, the smaller the OD, the more support columns there are. And because the support column materials are mostly polymer plastics, such as polycarbonate (PC) or polymethyl methacrylate (PMMA), the transmittance is too low, resulting in support column shadows. In actual production applications, the light emitted by the light source will be partially blocked above the support column due to the transmittance problem of the support column, forming a shadow, commonly known as the support column shadow. In traditional LCD modules, due to the large OD, the number of LEDs and the number of support columns are small, this problem is not obvious. When applied to miniLED products, the shadow problem becomes prominent due to the sudden increase in the number of support columns used. Summary of the invention

[0005] The main purpose of the present invention is to provide a support member and a preparation method thereof, a backlight module and a display device, aiming to solve the shadow problem caused by the low light transmittance of the support member material itself.

[0006] To achieve the above object, the present invention provides a support member for use in a direct-type LED display module, the support member comprising:

[0007] support columns; and,

[0008] A buffer structure, arranged at the top of the support column;

[0009] The buffer structure includes a plurality of buffer layers stacked together, and the plurality of buffer layers are stacked along the length direction of the support column to form a support portion, and the support portion is used to support a diffusion plate, and at least a luminescent material is added to a main body material of the support portion.

[0010] In one embodiment, the plurality of buffer layers are three buffer layers; and / or,

[0011] The luminescent material comprises at least one of a fluorescent material and a quantum dot material; and / or,

[0012] The support column is integrally provided with the support portion; and / or,

[0013] The buffer structure is provided with a mounting portion, and the mounting portion is fixed to the top of the support column; and / or,

[0014] The buffer structure is configured as an annular ring structure, one end of which in the axial direction is connected to the support column, and the other end is used to support the diffusion plate.

[0015] In one embodiment, the buffer structure is configured as an annular ring structure, and the annular ring structure includes:

[0016] A support ring, one end of which in the axial direction is used to support the diffuser plate;

[0017] A connecting ring, one end of which in the axial direction is connected to the other end of the supporting ring, and the other end of which is connected to the supporting column, and the supporting ring is arranged beyond the connecting ring in all directions; and

[0018] A buffer ring, through which the support ring and the connecting ring are directly connected;

[0019] Wherein, the outer diameter of the support ring is larger than the outer diameter of the buffer ring, and the outer diameter of the buffer ring is smaller than the outer diameter of the connecting ring.

[0020] In one embodiment, a luminescent material is added to the main material of the support column; and / or,

[0021] The main material of the support part is a soft material; and / or,

[0022] The main body material of the support column is a hard material.

[0023] In one embodiment, the main material of the support portion is a soft material, and the soft material includes silica gel; and / or,

[0024] The main material of the support portion includes silica gel, and the main material of the support portion also includes a diffusing agent; and / or,

[0025] The main material of the support column is a hard material, and the hard material includes a polymer resin; and / or,

[0026] The main material of the support column includes a polymer resin, and the material of the support column also includes short glass fibers, an antioxidant, a diffusant and the luminescent material.

[0027] In one embodiment, a boss is provided at the bottom of the support column.

[0028] The present invention also provides a method for preparing a support member, comprising the following steps:

[0029] The support part is formed by a molding process, and a luminescent material is added to a main material of the support part.

[0030] In one embodiment, the method for preparing the support member comprises the following steps:

[0031] Providing a main body material of the support column, and adding a luminescent material to the main body material of the support column;

[0032] Providing a main body material of the support portion, and adding a luminescent material to the main body material of the support portion;

[0033] The main body material of the support column with the luminescent material added thereto and the main body material of the support part with the luminescent material added thereto are respectively injected into a two-color molding mold to form the support member through a two-color injection molding process.

[0034] The present invention further provides a backlight module, which includes the support member described in any one of the above, or a support member prepared by the support member preparation method described in the above.

[0035] The present invention also provides a display device, comprising the backlight module as described above.

[0036] In the technical solution provided by the present invention, the support member includes a support column and a buffer structure, and the buffer structure is arranged at the top of the support column, wherein the buffer structure includes a plurality of stacked buffer layers, and the plurality of buffer layers are stacked along the length direction of the support column to form the support portion, and the support portion is used to support a diffusion plate, and at least a luminescent material is added to the main material of the support portion, and the buffer structure is provided with a plurality of buffer layers to form the support portion, which can support the diffusion plate and also play a buffering role, and the luminescent material is added to the main material of the support portion to form the support portion, and the luminescent material is excited by a short-wave light source to form photoluminescence, so that the entire support portion will have its own luminescent properties, therefore, there will be no shadow in the contact portion between the support portion and the diffusion plate, and the problem of shadow caused by the contact between the support column and the diffusion plate can be solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0038] Figure 1 A front view of an embodiment of a support member provided by the present invention;

[0039] Figure 2 for Figure 1 A three-dimensional schematic diagram of

[0040] Figure 3 for Figure 1 Schematic diagram of the light emitting principle;

[0041] Figure 4 The figure is a schematic flow chart of an embodiment of a method for preparing a support member of the present invention.

[0042] Description of Figure Numbers:

[0043] 100. Support member; 1. Support column; 2. Buffer structure; 21. Support ring; 22. Buffer ring; 23. Connecting ring; 3. Boss.

[0044] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0047] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0048] Since the thickness of sub-millimeter light-emitting diode (Mini-LED) products is relatively thin, that is, the OD (full name optical distance) is small. OD generally refers to the distance from the PCB surface to the lower surface of the diffusion plate. The LED spacing is small, that is, the LED Pitch is small. Pitch mainly refers to the spacing between adjacent LEDs, which can be divided into horizontal and vertical. In miniLED products, in order to ensure the light mixing effect between the dense miniLEDs and the upper diffusion plate, it is necessary to ensure that the spacing between the two remains unchanged. Generally, a support structure is set inside the module cavity, commonly known as a support column.

[0049] At present, the OD of high-end models is generally 3~10mm. Generally, the smaller the OD, the more support columns are used. For example, taking the 75-inch Skyworth Q72 OD5mm as an example, a total of 155 support columns are used. Since the support column materials are mostly polymer plastics, such as PC or PMMA, the transmittance is too low, resulting in support column shadows. In actual production applications, the light emitted by the light source will be partially blocked above the support column due to the transmittance problem of the support column, forming a shadow, commonly known as the support column shadow. For traditional LCD modules, due to the large OD, the number of LEDs and the number of support columns are small, this problem is not obvious. When applied to miniLED products, the shadow problem becomes prominent due to the sudden increase in the number of support columns used. Therefore, it is urgent to solve the shadow problem of the support column.

[0050] In order to solve this technical problem, the present invention provides a support member, which aims to solve the shadow problem caused by the low light transmittance of the existing support column. In view of this, please refer to Figure 1~Figure 2The present invention proposes a support member 100, which includes a support column 1 and a buffer structure 2, wherein the buffer structure 2 is arranged at the top of the support column 1, wherein the buffer structure 2 includes a plurality of buffer layers stacked, and the plurality of buffer layers are stacked along the length direction of the support column 1 to form the support portion, and the support portion is used to support a diffusion plate, and at least a luminescent material is added to the main material of the support portion, and the buffer structure 2 is provided with a plurality of buffer layers to form the support portion, which can support the diffusion plate and also play a buffering role, and the luminescent material is added to the main material of the support portion to form the support portion, and the luminescent material is excited by a short-wave light source to form photoluminescence, so that the entire support portion will have a self-luminescent property, therefore, there is no shadow in the contact portion between the support portion and the diffusion plate, and the problem of shadow caused by the contact between the support column 1 and the diffusion plate can be solved.

[0051] When the support member 100 is applied to the miniLED product, a larger number of support columns 1 are required. Therefore, during transportation, the material of the traditional support column 1 and the contact surface of the diffusion plate will rub against each other, which may easily cause scratches on the diffusion plate, thereby causing visual defects. In some embodiments of the present invention, the support member 100 includes a buffer structure 2. The buffer structure 2 is provided on the top of the support column 1 to form a support portion that can be used to support the diffusion plate. The top of the support column 1 generally has a smaller outer diameter and is sharp. If it directly contacts the diffusion plate, it may easily scratch the diffusion plate. Therefore, the buffer structure 2 can play a buffering role during the friction between the diffusion plate and the support column 1, thereby avoiding the problem of scratches on the diffusion plate and affecting the visual effect.

[0052] It should be noted that the buffer structure 2 includes multiple stacked buffer layers, wherein the multiple buffer layers are stacked along the length direction of the support column 1. This arrangement is because the multi-layer buffer layer is more elastic than the single-layer buffer layer, and can further reduce the friction between the support column 1 and the diffuser plate.

[0053] In some embodiments of the present invention, Figure 1 As shown, the multiple buffer layers are three-layer buffer layers. Preferably, they gradually approach the main body of the support column 1 toward the bottom direction of the support column 1, so that the cross-sectional size of the buffer layer in contact with the diffusion plate is larger than that of the buffer layer far away from the diffusion plate. The larger the contact area, the better the buffer effect, and the buffer layer far away from the diffusion plate only needs to be adapted to the size of the top of the support column 1. More preferably, the middle buffer layer can be thinner during the preparation process, and the size of the middle layer is the smallest, so that deformation occurs first during transportation, which has a better buffer effect.

[0054] In some embodiments of the present invention, the luminescent material includes at least one of a phosphor material and a quantum dot material. That is to say, the main purpose of the luminescent material is to emit light when stimulated by a light source. Therefore, it can be a quantum dot, a phosphor, or a mixture of the two, which is not limited here.

[0055] In order to achieve high color gamut, quantum dots are usually considered first. This is because quantum dots have a wide excitation spectrum and an adjustable luminescence spectrum. Quantum dots are a nanometer-level semiconductor material with special optoelectronic properties. They are usually composed of tens to hundreds of atoms and are approximately 2 to 10 nanometers in size. Since their size is close to the electron wavelength, quantum dots exhibit quantum mechanical effects, such as quantum size effect and quantum confinement effect, which have a significant improvement in color gamut. In some embodiments, different colors of display light can be achieved by selecting different quantum dot materials, which can be selected according to actual conditions.

[0056] In some embodiments, fluorescent powder may also be selected. It should be noted that fluorescent powder is a powder that can emit fluorescence in a dark environment. It is usually made by special treatment of fluorescent substances. After being irradiated by light, this powder absorbs energy and releases bright fluorescence in the dark. Here, the fluorescent effect of fluorescent powder is mainly used to solve the problem of dark shadows in a dark environment.

[0057] In some embodiments of the present invention, the support column 1 and the support portion may also be integrally arranged. The integral arrangement makes the connection between the support column 1 and the support portion more stable, prevents shaking during transportation, and is more secure.

[0058] Of course, this is not limited to the installation method. The support column 1 and the support part can also be set separately. When set separately, in some embodiments, the buffer structure 2 is provided with a mounting part, and the mounting part is fixed to the top of the support column 1. The mounting part is used to install the buffer structure 2 on the top of the support column 1. By setting the mounting part, the buffer structure 2 can be detachably installed on the support column 1. The buffer structure 2 can be replaced according to actual needs to meet the needs of different light sources. At the same time, when the support column 1 or the buffer structure 2 is damaged, the replacement cost can also be reduced.

[0059] Furthermore, in order to allow the buffer structure 2 to fit with the support column 1, in some embodiments, the mounting portion can be set as a mounting hole, and the mounting hole can just accommodate the top of the support column 1, which is also convenient for subsequent disassembly and replacement.

[0060] In other embodiments, the mounting portion may further include a card slot and a buckle for adapting to the top of the support column 1, wherein the notch of the card slot is arranged toward the top of the support column 1 for positioning and connecting with the buckle to achieve a detachable connection between the buffer structure 2 and the support column 1.

[0061] In some embodiments, the buffer structure 2 is configured as an annular ring structure, one axial end of which is connected to the support column 1 and the other end is used to support the diffusion plate, which saves costs and achieves a better buffer effect.

[0062] Specifically, the annular ring structure is as follows Figure 1 As shown, the annular ring structure includes a support ring 21, a connecting ring 23 and a buffer ring 22 connecting the support ring 21 and the connecting ring 23, wherein one axial end of the support ring 21 is used to support a diffusion plate; one axial end of the connecting ring 23 is connected to the other end of the support ring 21, and the other end is connected to the support column 1, wherein the outer diameter of the support ring 21 is greater than the outer diameter of the buffer ring 22, and the outer diameter of the buffer ring 22 is smaller than the outer diameter of the connecting ring 23, presenting the structural characteristics of a double-step lifebuoy. In this arrangement, since the outer diameter of the support ring 21 is larger, the contact area with the diffusion plate can be increased, and the buffer effect is better. The outer diameter of the buffer ring 22 is the smallest, in order to adapt to the size of the top end of the support column 1, and also to save costs. Specifically, the supporting force of the buffer structure 2 can be set to be greater than 50g / m 2 The specific advantages are as follows: when applied to a high-power miniLED backlight system, the temperature in the cavity rises during use, and the diffusion plate is heated. The buffer structure 2 of the new support column 1 will start to soften due to the heat, reducing the risk of the diffusion plate deforming upward and damaging the O / C (liquid crystal glass) or abnormal quality problems. During transportation, it can well release the pressure caused by the vibration of the diffusion plate and the optical diaphragm, reducing the risk of the diffusion plate deforming upward and damaging the O / C (liquid crystal glass) or abnormal quality problems.

[0063] Obviously, the buffer structure 2 is not limited to the above structure. In another embodiment of the present invention, it can also be set to other structures. In some implementations, the buffer structure 2 can be gyro-shaped or triangular, as long as it can reduce the friction problem caused by the direct contact between the support column 1 and the diffuser plate.

[0064] In some embodiments, luminescent materials are added to the main material of the support column 1, and the luminescent materials can also emit light when stimulated by a light source, thereby enhancing the luminescent effect and further solving the problem of shadows.

[0065] The main body material of the support part is a soft material, which is also to reduce the friction between the support part and the diffuser plate to avoid scratching the diffuser plate.

[0066] The main material of the support column 1 is a hard material, and this configuration is to improve the supporting effect.

[0067] In some embodiments, the main material of the support part is a soft material, and the soft material includes silicone; wherein silicone has good chemical stability, mechanical properties and weather resistance, and is easy to process, and can play a supporting role as well as a buffering role, reducing friction and reducing its production cost. Of course, according to actual application requirements and conditions, the material of the buffer structure 2 can also be a resin with elasticity, and the hardness of the material can be less than that of the support part, for example, it can be Poron material, which is a high-performance high-density polyurethane foam.

[0068] The main material of the support part includes silica gel, and the main material of the support part also includes a diffusant, wherein the diffusant can be silicone oil, and an antioxidant can also be added. The antioxidant can be antioxidant 618, that is, dioctadecyl pentaerythritol diphosphite, which is used for high-temperature processing of polymer materials and compounded with polymer resins to play a role of hard support.

[0069] The main material of the support column 1 is a hard material, and the hard material includes a polymer resin.

[0070] It should be noted that polymer resin refers to a macromolecular compound formed by repeating monomers connected by chemical bonds. Common polymer resins include polystyrene resin and polycarbonate. Polystyrene resin is a common plastic with good transparency, mechanical strength and chemical stability. It is widely used in packaging, building materials, electronic products and other fields. It is often used to manufacture auto parts, eyeglass lenses, optical discs, etc.

[0071] The main material of the support column 1 includes a polymer resin, and the material of the support column 1 also includes short glass fibers, an antioxidant, a diffusant, and the luminescent material, wherein the short glass fibers in the material of the support column 1 generally refer to glass fibers with a length between several millimeters and several centimeters. They are generally used to enhance the strength and durability of materials such as plastics, rubber, and concrete. Short glass fibers can form a network structure in these materials to increase their mechanical properties, such as tensile strength, bending strength, and impact strength. Short glass fibers have high heat resistance and reduce thermal bending characteristics. Adding short-wave fibers to the material of the support column 1 can increase the thermal deformation temperature (Vicat temperature) of the support column 1, wherein the amount of short glass fibers added to the material of the support column 1 is added according to actual needs.

[0072] Furthermore, the main material of the support column 1 is added with luminescent material. In the main material of the support column 1 , combined with the luminescent material of the support part, the luminescent effect is better, and after the support member 100 is formed, the problem of shadow is further solved.

[0073] In some embodiments, the polymer resin includes at least one of polystyrene resin, polycarbonate and polymethyl methacrylate. Since the polymer resin includes at least one of polystyrene resin, polycarbonate and polymethyl methacrylate, the material of the support column 1 can be polystyrene resin, polycarbonate or polymethyl methacrylate, or a mixture of the two or three, which is not limited here. The above-mentioned polymer resin with high light transmittance is used, and the thermoplastic plastic has high density, good strength resistance, good chemical stability, convenient processing and easy operation, which can not only play a supporting role but also reduce costs. When the polymer resin material includes polymethyl methacrylate (PMMA), PMMA has very high transparency, and its light transmittance can reach more than 92%, and it has high anti-aging performance. After accelerated aging for 240 hours, its light transmittance can still reach 92%, and it can reach 88% after 10 years of use in a natural environment.

[0074] In some embodiments of the present invention, due to the dense number of miniLEDs, it is necessary to use double-sided tape to fix the reflective sheet on the back plate between the light sources during production to prevent the reflective sheet from bulging and affecting the normal emission of light from the light source. The process of pasting double-sided tape between the traditional reflective sheet and the back plate is cumbersome. Therefore, the support member 100 of the present invention includes a support column 1, the support portion is arranged on the top of the support column 1, and a boss 3 is arranged on the bottom of the support column 1, such as Figure 2 As shown, the boss 3 can be used to fix the reflector, and the size of the boss 3 structure is adapted to the reflector, so it can be positioned and installed. During assembly, the bottom of the support 100 is glued, such as 3M VHB. In the actual process, the reflector is assembled first, and then the support column 1 with the glue is pasted on the back panel or the light bar PCB. The boss 3 at the bottom of the support 100 is used to complete the pasting on the back panel, while pressing the reflector on the four sides to further fix the reflector, thereby simplifying the traditional reflector fixing process.

[0075] In some embodiments, the material of the boss 3 can be silicone. Silicone is chosen because it has a certain elasticity and can reduce the friction caused by the vibration of the diffusion plate. Silicone also has a certain light transmittance and has a light-transmitting effect. If non-light-transmitting is selected, a dark spot will be formed directly above the display.

[0076] The present invention also provides a method for preparing a support member 100, comprising the following steps:

[0077] The support part is formed by a molding process, and a luminescent material is added to a main material of the support part.

[0078] It should be noted that in the process of forming the support part through the molding process, it is necessary to at least add luminescent material to the main material of the support part. Preferably, luminescent material can also be added to the main material of the support column 1, so that the luminescent effect is better and the shadow problem of the support column 1 is better solved.

[0079] In some embodiments of the present invention, the method for preparing the support member 100 comprises the following steps:

[0080] S101, providing a main body material of the support column 1, and adding a luminescent material to the main body material of the support column 1;

[0081] S102, providing a main body material of the support part, and adding a luminescent material to the main body material of the support part;

[0082] S103 , injecting the main material of the support column 1 with the luminescent material added thereto and the main material of the support part with the luminescent material added thereto into a two-color molding mold respectively, and forming the support member 100 through a two-color injection molding process.

[0083] It should be noted that the two-color injection molding process refers to the process of injecting two different materials into the same mold to achieve a molding process of injecting a product formed of two materials. Among them, some of the two materials are different in color, and some are different in hardness and softness, which is used to improve the appearance and assembly performance of the product. It is not limited here. The specific process steps are as follows Figure 4 As shown, materials are provided separately, and a mold for preparing the buffer structure 2 is prepared in a corresponding shape according to actual production needs, as long as it is adapted to the support column 1 to form a stable support member 100 .

[0084] It should be noted that by adopting the materials of the above-mentioned support column 1 and the materials of the buffer structure 2 to prepare the support column 1 and the buffer structure 2 according to actual needs, and then installing the two, the support member 100 of the present invention can be obtained, and through cooling and cutting, the buffer structure 2 can be fixed on the top of the support column 1, thereby improving the stability of the support member 100, and the process operation steps are simple and easy to implement.

[0085] The main production process is described as follows:

[0086] Specifically, the operation steps of S101, taking PC in the polymer resin as an example, include: using short glass fibers, quantum dots, antioxidants and diffusants as adjustment materials, and then mixing them with polystyrene resin in the polymer resin, which can also be polycarbonate (PC) or polymethyl methacrylate, as the material of the support column 1; mixing the configured material of the support column 1 through a feeding barrel, stirring it evenly at high speed, heating it to 250°C in a hot runner, the whole being in a molten state, and the injection temperature being 220~235°C, to form a support column 1 of polystyrene that is resistant to high temperature discoloration.

[0087] Further, it is explained that the addition amount of short glass fiber has a great influence on the thermal deformation rate. In order to select a better finished support member 100, the mass percentage of short glass fiber in the material of the support column 1 is set to 0%, 15%, and 30% as a test example, without limiting the use environment, and then mixed with polystyrene resin. Silicone oil can be added as a diffusing agent for pre-mixing work. The deformation rate of the test embodiment can be seen from the following Table 1: the initial length of the support column 1 is 10mm. After adding short glass fiber, the support column 1 is deformed, and the obtained length of the support column 1 is 8.2mm, 9.4mm or 9.9mm, respectively. The deformation rate is shown in the following table. It can be seen that the more short glass fiber is added, the smaller the thermal deformation rate of the support column 1. Therefore, the addition amount of short glass fiber can be adjusted according to the actual needs of the support member 100. Among them, the support column 1 bears the weight per unit area, which generally refers to the weight of the LCD+optical film and the diffuser.

[0088] Table 1

[0089]

[0090] Specifically, the operation steps of S102 include: mixing the silica gel, quantum dots and diffusing agent in the material of the buffer structure 2 according to a preset ratio, mixing them into the vulcanizing agent at 0%, 5% and 10% respectively, mixing and stirring them evenly, mixing them with liquid silica gel and diffusing agent (TiO2&SiO2) at a weight ratio of about less than 30%, and then entering the mold from the second feed port to complete the buffer structure 2 part of the support member 100. In addition, during production, the outer diameter of the multi-layer buffer layer of the buffer structure 2, the buffer layer close to the top of the support column 1, is set to 5~8mm, and since the heat resistance temperature of silica gel is 175~195℃, the heat resistance of the quantum dots and silica gel after mixing can meet the requirements of heat resistance at 230℃ for at least 30min.

[0091] It should be noted that the preset ratio of quantum dots added and the visual effect taste restoration method are based on the principle of complementary colors of light, and the wavelength is shifted and the color coordinates are adjusted by the concentration of quantum dots to achieve visual consistency. The principle is as follows Figure 3 As shown, a blue LED is used as an excitation light source to excite the luminescent material, wherein the luminescent material is generally a quantum dot or a phosphor. As long as the concentration of the luminescent material is controlled, the desired white light can be obtained after mixing. Therefore, by adjusting the ratio of quantum dots of various colors, white light illumination and high color gamut white light display in different color temperature demand scenes can be achieved. In other words, the LED can be a blue LED, a purple LED, or a dual-core dual-color LED. If white light is required, the LED color and the quantum dot concentration can be matched according to the principle that the three primary colors of red, green, and blue form white light. For example: blue LED+, etc.

[0092] Furthermore, the diffusing agents are TiO2&SiO2. There is no definite ratio between the two. The refractive indexes of the two are different. The refractive index of TiO2 is larger than that of SiO2, and the optical deflection ability is greater. The ratio can be adjusted according to the visual effect needs.

[0093] Specifically, in some embodiments of the present invention, the buffer structure 2 is used as the main object of light mixing. Under the experimental blue light module scheme, when a luminescent material such as quantum dots is added and the polymer resin material is a polystyrene resin, the diffusing agent is a mixture of TiO2 and SiO2, wherein the mass ratio between TiO2 and SiO2 is 1:3, wherein the data corresponding to the x and y axes are obtained from the color coordinates. It should be noted that the color coordinates (chromaticity coordinate) are the coordinates of the color, also called the color system, the commonly used color coordinates, the horizontal axis is x, the vertical axis is y, with the color coordinates, a point can be determined on the chromaticity diagram, and this point accurately represents the luminescent color. That is: the color coordinates accurately represent the color.

[0094] Only the mass percentage of the quantum dot concentration and the polystyrene resin in the material of the buffer structure 2 is changed to 0%, 5%, 10% and 15% respectively, wherein the ratio between the quantum dot concentration and the polystyrene resin is adjusted according to the actual production needs to match the product requirements. The quantum dot concentration and the diffusing agent concentration in Table 2 correspond to Examples 1 to 4, and the mixed light effect can be achieved. By testing the light spot of the diffuser plate, and performing wavelength shift and color coordinate adjustment, it is concluded through a number of experimental results, as shown in Table 2, that when the mass ratio of the quantum dot concentration to the polystyrene resin accounts for 10% of the material of the buffer structure 2, and the diffusing agent concentration TiO2 is 0.1% and SiO2 is 0.3%, the effect above the support column 1 is the best, the diffuser plate is white light, there is no problem of bright and dark spots, and there is no problem of dark shadows on the support column 1.

[0095] Table 2

[0096]

[0097] The present invention also provides a backlight module, which includes the support member 100 described in any one of the above, or the support member 100 prepared by the preparation method of the support member 100 described in the above. The backlight module has all the technical solutions of the support member 100, and thus also has all the beneficial effects of the support member 100, which will not be described one by one in this application.

[0098] The present invention also provides a display device, including the backlight module as described above, the display device has all the technical solutions of the support member 100, and thus also has all the beneficial effects of the support member 100, the display device may include a display screen of a mobile device, such as a mobile phone display screen, a TV display screen, a laptop display screen, etc.

[0099] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A support member used in a direct-type LED display module, characterized in that: The support member comprises: support columns; and, A buffer structure, disposed at the top of the support column; Wherein, the buffer structure comprises a plurality of buffer layers stacked together, and the plurality of buffer layers are stacked along the length direction of the support column to form a support portion, and the support portion is used to support the diffusion plate, and at least a luminescent material is added to the main body material of the support portion; The method for preparing the support member comprises the following steps: Providing a main body material of the support column, and adding a luminescent material to the main body material of the support column; Providing a main body material of the support portion, and adding a luminescent material to the main body material of the support portion; Injecting the main material of the support column with the luminescent material added thereto and the main material of the support part with the luminescent material added thereto into a two-color molding mold respectively, and forming the support member by a two-color injection molding process; Wherein, the material of the support column includes short glass fiber, polystyrene resin and quantum dots; The buffer structure is configured as an annular ring structure, one end of which in the axial direction is connected to the support column, and the other end is used to support the diffusion plate. The annular ring structure includes: A support ring, one end of which in the axial direction is used to support the diffuser plate; A connecting ring, one end of which in the axial direction is connected to the other end of the supporting ring, and the other end of which is connected to the supporting column; and A buffer ring, through which the support ring and the connecting ring are directly connected; Among them, the outer diameter of the support ring is larger than the outer diameter of the buffer ring, and the outer diameter of the buffer ring is smaller than the outer diameter of the connecting ring, presenting the structural characteristics of a double-step lifebuoy.

2. The support member according to claim 1, characterized in that The main material of the support part is a soft material; and / or, The main body material of the support column is a hard material.

3. The support member according to claim 2, characterized in that The main material of the support part is a soft material, and the soft material includes silica gel; and / or, The main material of the support part includes silica gel, and the main material of the support part also includes a diffusant and a polymer resin; and / or, The main material of the support column is a hard material, and the hard material includes a polymer resin; and / or, The main material of the support column includes a polymer resin, and the material of the support column also includes an antioxidant and a diffusant.

4. The support member according to claim 1, characterized in that The support member comprises a support column, the support portion is arranged on the top of the support column, and a boss is arranged on the bottom of the support column.

5. A method for preparing a support member according to any one of claims 1 to 4, characterized in that: The support part is formed by a molding process, and a luminescent material is added to a main material of the support part.

6. A backlight module, characterized in that: The backlight module comprises the support member as described in any one of claims 1 to 4, or a support member prepared by the method for preparing a support member as described in claim 5.

7. A display device, characterized in that: Comprising the backlight module as claimed in claim 6.

Images