Silicon Slicer

Abstract

The present invention discloses a cutting spindle structure, which belongs to the field of semiconductor technology. It mainly includes a frame, a support roller and a distance adjustment component. There are two support rollers. The distance adjustment component includes a main slide, a connecting piece, an eccentric block, a rotating frame and a sliding frame. The eccentric block is connected to the connecting piece. The outer side of the eccentric block rotates and fits on the eccentric position of the rotating frame. The rotating frame rotates and fits on the sliding frame. The sliding frame slides and fits on the main slide. The main slide slides and fits on the frame. The support roller rotates and fits on the main slide. The rotation axis of the support roller coincides with the axis of the support roller, and the axis of the support roller deviates from the center of the eccentric block. The main slide can slide linearly relative to the frame along the axis line of the two support rollers. The cutting spindle structure of the present invention can solve the problem in the prior art that the diamond wire will be deviated up and down when adjusting the center distance between the support rollers.

Description

Technical Field

[0001] The invention relates to the field of semiconductor technology, and in particular to a crystalline silicon slicer. Background Art

[0002] Crystalline silicon slicers are mainly used in the fields of solar silicon wafer production, semiconductor material processing, etc. They are ideal equipment for efficient and precise slicing processing.

[0003] The actual cutting capacity of the crystalline silicon slicer is mainly related to the wire mesh width of the cutting area. The smaller the wire mesh width, the smaller the size of the hard and brittle material that can be cut; the larger the wire mesh width, the larger the size of the hard and brittle material that can be cut. However, when the size of the hard and brittle material is small, the smaller the wire mesh width is under the cutting conditions, the better the cutting yield will be. As the wire mesh width increases, the yield will decrease accordingly. Therefore, hard and brittle materials of different sizes require wire meshes of corresponding widths to cooperate in cutting to achieve the best yield. In the cutting spindle structure of the existing crystalline silicon slicer, in order to achieve the adjustable center distance between the support rollers, the support rollers are usually eccentrically rotatably installed on the frame. Therefore, when the support roller rotates around the eccentric axis, the axis of the support roller rotates around the eccentric axis. When the axis of the support roller rotates in a circle, the distance between the axes of the two support rollers, that is, the center distance between the two support rollers, will change, so that the center distance between the support rollers can be adjusted. However, since the axis of the support roller rotates eccentrically when the support roller rotates eccentrically, the axis of the support roller rotates, which will cause the support roller to deviate up and down, causing the diamond wire on the support roller to deviate up and down. Therefore, after the center distance between the support rollers is adjusted, when the workpiece above the cutting area is fed downward to the diamond wire close to the cutting area, it is also necessary to adjust the idle distance of the workpiece when feeding into the cutting area, which is more cumbersome.

[0004] Therefore, it is necessary to provide a new silicon wafer slicer. Summary of the invention

[0005] Based on the above problems existing in the prior art, an object of an embodiment of the present invention is to provide a silicon wafer slicer capable of solving the problem in the prior art that when adjusting the center distance between the support rollers, the diamond wire may be deviated up and down.

[0006] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: to provide a silicon wafer slicer, including a frame, a support roller and a distance adjustment component, the support roller has two, the distance adjustment component includes a main slide, a connecting piece, an eccentric block, a rotating frame and a sliding frame, the eccentric block is connected to the connecting piece, the outer side of the eccentric block is rotatably matched with the eccentric position of the rotating frame, the rotating frame is rotatably matched with the sliding frame, the sliding frame is slidably matched with the main slide, the main slide is slidably matched with the frame, at least one distance adjustment component is provided, the connecting piece in the distance adjustment component is correspondingly connected to one end of one of the support rollers, the support roller is rotatably matched with the main slide, the rotation axis of the support roller coincides with the support roller axis of the support roller, and the support roller axis of the support roller deviates from the center of the eccentric block, the main slide can slide linearly relative to the frame along the axis line connecting the two support rollers, the sliding frame can be locked on the frame, and the main slide can be locked on the frame.

[0007] Furthermore, the support roller includes axle box 1, axle box 2 and a main shaft. Axle box 1 and axle box 2 are coaxially arranged, and the main shaft is installed between axle box 1 and axle box 2. The support roller is rotatably engaged with the main slide through axle box 1, and the connecting piece is correspondingly connected to the outer end position of axle box 1, and axle box 2 can slide relative to the frame.

[0008] Furthermore, a linear sliding path of the sliding frame relative to the main sliding table is parallel to a linear sliding path of the main sliding table relative to the frame.

[0009] Furthermore, two distance adjusting assemblies are provided, and the connecting members in the two distance adjusting assemblies are respectively connected to the two supporting rollers.

[0010] Furthermore, a positioning block is installed on the frame and between the two supporting rollers, and a locking rod is provided on a side of the sliding frame away from the positioning block, and the locking rod is threadably matched with the frame.

[0011] Furthermore, a locking slider is provided between the main slide and the frame.

[0012] Furthermore, the support roller can be locked on the main slide.

[0013] Furthermore, two guide rods are arranged on the outer side of the sliding frame, and the sliding frame is slidably mounted on the main sliding platform through the guide rods.

[0014] Furthermore, the two distance adjustment components are arranged in a centrally symmetrical manner.

[0015] Furthermore, a handle is installed on the outer side of the connecting member, and the handle extends along the radial direction of the supporting roller.

[0016] The beneficial effects of the present invention are as follows: the silicon wafer slicer provided by the present invention comprises a frame, a supporting roller and a distance adjustment component, the supporting roller has two, the distance adjustment component comprises a main slide, a connecting piece, an eccentric block, a rotating frame and a sliding frame, the eccentric block is connected to the connecting piece, the outer side of the eccentric block is rotatably matched with the eccentric position of the rotating frame, the rotating frame is rotatably matched with the sliding frame, the sliding frame is slidably matched with the main slide, the main slide is slidably matched with the frame, at least one distance adjustment component is provided, and the connecting piece in the distance adjustment component is correspondingly connected to one end of one of the supporting rollers The support roller rotates and cooperates with the main slide, and the rotation axis of the support roller coincides with the support roller axis of the support roller, so that the support roller can rotate around its own support roller axis, and the support roller axis of the support roller deviates from the center of the eccentric block. In this way, when the support roller rotates around its own support roller axis, the eccentric block will swing eccentrically around the rotation center of the support roller. Since the distance between the support roller axis and the axis of the rotating frame is constantly changing, the rotating frame is driven to rotate relative to the sliding frame to adapt to the change in the distance between the support roller axis and the axis of the rotating frame. At the same time, When the support roller and the eccentric block rotate until the distance between the axis of the support roller and the axis of the rotating frame changes, the eccentric block will push the rotating frame and the sliding frame to translate relative to the main slide, and the main slide can slide linearly relative to the frame along the axis of the two support rollers. In this way, when the support roller is rotated, the eccentric block is driven to push the rotating frame and the sliding frame to translate relative to the main slide, and the axis of the support roller will follow the main slide to slide linearly, so that the axis of the support roller always remains on the axis of the two support rollers. Therefore, no matter how the support roller rotates, the axis of the two support rollers is always located The two support rollers are in the same plane, so that the diamond wire wound on the two support rollers will not deviate up and down with the change of the center distance, which can solve the problem that the diamond wire will deviate up and down when the center distance between the support rollers is adjusted in the existing slicer. The sliding frame can be locked on the frame, so when the sliding frame is locked on the frame, it will push the main slide and the axis of the support roller to slide linearly relative to the frame, thereby playing a role in adjusting the center distance of the two support rollers. The main slide can be locked on the frame, and the center distance of the two support rollers can be locked by locking the main slide. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0018] Figure 1 A schematic diagram of the three-dimensional structure of a crystalline silicon slicer provided in an embodiment of the present invention.

[0019] Figure 2 A schematic diagram of the three-dimensional structure of a distance adjustment assembly provided in an embodiment of the present invention.

[0020] Figure 3 A front view of a distance adjustment assembly provided in an embodiment of the present invention.

[0021] Figure 4An exploded view of a distance adjustment assembly provided in an embodiment of the present invention.

[0022] Figure 5 A schematic diagram of a first working state of a crystalline silicon slicer provided in an embodiment of the present invention.

[0023] Figure 6 A schematic diagram of a second working state of a crystalline silicon slicer provided in an embodiment of the present invention.

[0024] Figure 7 A schematic diagram of a third working state of a crystalline silicon slicer provided in an embodiment of the present invention.

[0025] Among them, the reference numerals in the figure are: 1, frame; 2, support roller; 21, axle box 1; 22, axle box 2; 23, main shaft; 3, distance adjustment assembly; 31, main slide; 311, bearing hole; 32, connecting piece; 33, eccentric block; 34, handle; 35, rotating frame; 351, eccentric hole; 36, sliding frame; 361, guide rod; 4, locking rod; 5, positioning block; G1, support roller axis. DETAILED DESCRIPTION

[0026] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0027] It should be noted that when an element is referred to as being "connected to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0028] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0030] Reference throughout the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, when the phrases "in one embodiment," "in some embodiments," or "in some of these embodiments" appear in various places throughout the specification, not all references are to the same embodiment. Furthermore, in one or more embodiments, the particular features, structures, or characteristics may be combined in any suitable manner.

[0031] Please refer to Figures 1 to 7 As shown, a crystalline silicon slicer provided by the present invention is now described, the crystalline silicon slicer includes a frame 1, a support roller 2 and a distance adjustment component 3, the support roller 2 has two, the distance adjustment component 3 includes a main slide 31, a connecting member 32, an eccentric block 33, a rotating frame 35 and a sliding frame 36, the eccentric block 33 is connected to the connecting member 32, the outer side of the eccentric block 33 is rotatably matched to the eccentric position of the rotating frame 35, the rotating frame 35 is rotatably matched to the sliding frame 36, the sliding frame 36 is slidably matched to the main slide 31, the main slide 31 is slidably matched to the frame 1, at least one distance adjustment component 3 is provided, the connecting member 32 in the distance adjustment component 3 is correspondingly connected to one end of one of the support rollers 2, the support roller 2 is rotatably matched to the main slide 31, the rotation axis of the support roller 2 coincides with the support roller axis G1 of the support roller 2, so that the support roller 2 can rotate around its own support roller axis G1; Figure 3As shown, the support roller axis G1 of the support roller 2 deviates from the center of the eccentric block 33, so that when the support roller 2 rotates around its own support roller axis G1, the eccentric block 33 will swing eccentrically around the rotation center of the support roller 2. Since the distance between the support roller axis G1 and the axis of the rotating frame 35 is constantly changing, the rotating frame 35 is pushed to rotate relative to the sliding frame 36 to adapt to the change in the distance between the support roller axis G1 and the axis of the rotating frame 35. At the same time, when the support roller 2 and the eccentric block 33 rotate to the distance between the support roller axis G1 and the axis of the rotating frame 35, the rotating frame 35 and the sliding frame 36 are pushed to translate relative to the main slide 31 through the eccentric block 33; the main slide 31 can slide linearly relative to the frame 1 along the axis line of the two support rollers 2. In this way, when the support roller 2 is rotated, the eccentric block 33 is driven to push the rotating frame 35 and the sliding frame 36 relative to each other. When the main slide 31 translates, the support roller axis G1 will slide linearly with the main slide 31, so that the support roller axis G1 always remains on the axis connecting the two support rollers 2, and no matter how the support roller 2 rotates, the axis connecting the two support rollers 2 is always in the same plane, so that the diamond wire wrapped around the two support rollers 2 will not shift up and down with the change of the center distance, which can solve the problem that the diamond wire will shift up and down when the center distance between the support rollers 2 is adjusted in the existing slicer; the sliding frame 36 can be locked on the frame 1, so that when the sliding frame 36 is locked on the frame 1, it will push the main slide 31 and the support roller axis G1 to slide linearly relative to the frame 1, thereby playing a role in adjusting the center distance of the two support rollers 2; the main slide 31 can be locked on the frame 1, and the center distance of the two support rollers 2 can be locked by locking the main slide 31.

[0032] like Figure 2 As shown, in some embodiments, the support roller 2 includes an axle box 1 21, an axle box 22 and a main shaft 23. The axle box 1 21 and the axle box 22 are coaxially arranged, and the main shaft 23 is installed between the axle box 1 21 and the axle box 22. The support roller 2 is rotatably matched with the main slide 31 through the axle box 1 21. The connecting member 32 is correspondingly connected to the outer end position of the axle box 1 21. The axle box 22 can slide relative to the frame 1 to adapt to the movement of the support roller 2 relative to the frame 1. In this embodiment, an auxiliary slide (not shown) is installed on the axle box 22, and the auxiliary slide is slidably matched with the frame 1, and the auxiliary slide is stationary relative to the main slide 31.

[0033] like Figure 5 and Figure 6 As shown, in some embodiments, the linear sliding path of the sliding frame 36 relative to the main slide 31 is parallel to the linear sliding path of the main slide 31 relative to the frame 1, so that when the sliding frame 36 slides a certain distance relative to the main slide 31, if the sliding frame 36 is locked on the frame 1 and cannot move relative to the frame 1, it will push the main slide 31 to slide the same distance relative to the frame 1.

[0034] like Figure 2 As shown, in some embodiments, two distance adjusting components 3 are provided, and the connecting members 32 in the two distance adjusting components 3 are respectively connected to the two support rollers 2, so that the two support rollers 2 can be driven by the two distance adjusting components 3 to simultaneously adjust the position of the support roller axis G1 relative to the frame 1, thereby increasing the distance adjustment range of the two support roller axes G1.

[0035] like Figure 6 As shown, in some embodiments, the two distance adjustment components 3 are arranged in a centrally symmetrical manner.

[0036] like Figure 5 As shown, in some of the embodiments, in order to enable the sliding frame 36 to be locked on the frame 1, a positioning block 5 is installed on the frame 1 and between the two support rollers 2, and a locking rod 4 is provided on the side of the sliding frame 36 away from the positioning block 5. The locking rod 4 is threadedly engaged with the frame 1, so that by rotating the locking rod 4, the locking rod 4 can be driven to approach or move away from the sliding frame 36. Moving the locking rod 4 close to the sliding frame 36 can lock the sliding frame 36 between the positioning block 5 and the locking rod 4, so that the sliding frame 36 is locked on the frame 1 and cannot move.

[0037] In some of the embodiments, in order to enable the main slide 31 to be locked on the frame 1, a locking slider (not shown) is provided between the main slide 31 and the frame 1 to achieve free locking between the main slide 31 and the frame 1.

[0038] In some of the embodiments, the support roller 2 can be locked on the main slide 31 to further stably lock the support roller 2 on the main slide 31. Specifically, a fastening structure (not shown) for locking the axle box 21 on the main slide 31 is provided between the axle box 21 of the support roller 2 and the main slide 31. The fastening structure may be, but is not limited to, a bolt-type fastening structure.

[0039] like Figure 2 , Figure 3 and Figure 4 As shown, in some embodiments, two guide rods 361 are provided on the outer side of the sliding frame 36, and the sliding frame 36 is slidably installed on the main sliding platform 31 through the guide rods 361. Specifically, the positioning block 5 and the locking rod 4 are respectively arranged opposite to the two guide rods 361 on the sliding frame 36, and the outer ends of the guide rods 361 are supported by the positioning block 5 and the locking rod 4, thereby limiting the position of the sliding frame 36.

[0040] like Figure 2 and Figure 3 As shown, in some embodiments, a handle 34 is installed on the outer side of the connecting member 32, and the handle 34 extends along the radial direction of the support roller 2, so that when the support roller 2 is driven to rotate, the power arm is extended by the handle 34 to save effort.

[0041] like Figure 4 As shown, in some of the embodiments, a bearing hole 311 is provided on the main slide 31 , and the axle box 21 of the support roller 2 is rotatably installed in the bearing hole 311 .

[0042] like Figure 4 As shown, in some embodiments, the rotating frame 35 is of a rotary structure, and an eccentric hole 351 is provided on the rotating frame 35 at a position deviating from the axis of the rotating frame 35. The eccentric block 33 is rotatably fitted in the eccentric hole 351 of the rotating frame 35, so that the eccentric block 33 can rotate relative to the rotating frame 35 in the eccentric hole 351.

[0043] like Figure 5 and Figure 6 As shown, in some of the embodiments, preferably, when it is necessary to adjust the spacing of the support roller axis G1 of the support roller 2, the sliding frame 36 can be first locked on the frame 1 by the locking rod 4 and the positioning block 5, and the main slide 31 can be kept in a freely sliding state, and then the support roller 2 can be rotated by the handle 34, so that the main slide 31 can be driven to drive the support roller axis G1 to translate closer to or away from the support roller axis G1 of the other support roller 2, and finally the axle box 21 of the support roller 2 is locked with the main slide 31. Because in this embodiment, the translation of the main slide 31 is driven by the rotation of the handle 34, the long lever arm of the handle 34 can be rotated to save effort, which is more labor-saving and easy to control than directly pushing the main slide 31. Therefore, this embodiment is preferred.

[0044] like Figure 7 As shown, in some other embodiments, when it is necessary to adjust the spacing between the support roller axes G1 of the support roller 2, the locking rod 4 can be firstly withdrawn from the sliding frame 36, and then the main slide 31 can be slid to drive the sliding frame 36 between the positioning block 5 and the locking rod 4 and maintained, and then the handle 34 is turned to rotate the support roller 2, and the sliding frame 36 will translate left and right relative to the main slide 31. After the position of the sliding frame 36 is adjusted, the sliding frame 36 is locked to the frame 1 through the locking rod 4 and the positioning block 5, and finally the axle box 21 of the support roller 2 is locked with the main slide 31. Since the main slide 31 needs to slide in this embodiment, compared with Figure 5 and Figure 6 The illustrated direct rotation handle 34 is relatively labor intensive to operate.

[0045] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A crystalline silicon slicer, characterized in that: The invention comprises a frame, a supporting roller and a distance-adjusting assembly, wherein the supporting roller has two, and the distance-adjusting assembly comprises a main slide, a connecting piece, an eccentric block, a rotating frame and a sliding frame, wherein the eccentric block is connected to the connecting piece, and the outer side of the eccentric block is rotatably matched with the eccentric position of the rotating frame, the rotating frame is rotatably matched with the sliding frame, the sliding frame is slidably matched with the main slide, and the main slide is slidably matched with the frame, and at least one distance-adjusting assembly is provided, and the connecting piece in the distance-adjusting assembly is correspondingly connected to one end of one of the supporting rollers, the supporting roller is rotatably matched with the main slide, the rotating axis of the supporting roller coincides with the supporting roller axis of the supporting roller, and the supporting roller axis of the supporting roller deviates from the center of the eccentric block, so that when the supporting roller rotates around itself When the axis of the support roller of the main body rotates, the eccentric block will swing eccentrically around the rotation center of the support roller. Since the distance between the axis of the support roller and the axis of the rotating frame is constantly changing, the rotating frame is pushed to rotate relative to the sliding frame to adapt to the change of the distance between the axis of the support roller and the axis of the rotating frame. When the support roller and the eccentric block rotate to drive the distance between the axis of the support roller and the axis of the rotating frame to change, the eccentric block will push the rotating frame and the sliding frame to translate relative to the main slide. The main slide can slide linearly relative to the frame along the axis line connecting the two support rollers. The sliding frame can be locked on the frame. A positioning block located between the two support rollers is installed on the frame. A locking rod is provided on the side of the sliding frame away from the positioning block, and the locking rod cooperates with the frame thread.

2. The crystalline silicon slicer according to claim 1, characterized in that: The support roller includes axle box one, axle box two and a main shaft. Axle box one and axle box two are coaxially arranged, and the main shaft is installed between axle box one and axle box two. The support roller is rotatably engaged with the main slide through axle box one, and the connecting piece is correspondingly connected to the outer end position of axle box one, and axle box two can slide relative to the frame.

3. The crystalline silicon slicer according to claim 1, characterized in that: The linear sliding path of the sliding frame relative to the main sliding table is parallel to the linear sliding path of the main sliding table relative to the frame.

4. The crystalline silicon slicer according to claim 1, characterized in that: Two distance adjusting assemblies are provided, and the connecting pieces in the two distance adjusting assemblies are respectively connected to the two supporting rollers.

5. The silicon wafer slicer according to claim 1, characterized in that: A locking slider is arranged between the main slide and the frame.

6. The silicon wafer slicer according to claim 1, characterized in that: The support rollers can be locked to the main slide.

7. The crystalline silicon slicer according to claim 1, characterized in that: Two guide rods are arranged on the outer side of the sliding frame, and the sliding frame is slidably mounted on the main sliding platform through the guide rods.

8. The silicon crystal slicer according to claim 4, characterized in that: The two distance adjustment components are arranged in a centrally symmetrical manner.

9. The silicon wafer slicer according to claim 1, characterized in that: A handle is installed on the outer side of the connecting piece, and the handle extends along the radial direction of the supporting roller.

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