Injection molding quality control method and system for wafer carrier plastic parts

By obtaining and analyzing the production task information and historical quality records of wafer carrier plastic parts, and dynamically adjusting the quality inspection plan, the problem of low reliability of injection molding quality control in mass production is solved, and more efficient and accurate quality control is achieved.

CN119189234BActive Publication Date: 2025-03-18DACHUAN PLASTIC IND (KUNSHAN) CO LTD
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Patent Information

Application Number
CN202411304279.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-09-19
Publication Date
2025-03-18
Estimated Expiration
2044-09-19

AI Technical Summary

Technical Problem

In the mass production of wafer carrier plastic parts, the quality control of injection molding is low, and traditional methods cannot dynamically adjust the actual situation of different batches of products, affecting the accuracy and production efficiency of control.

Method used

By obtaining the production task information of the target wafer vehicle plastic parts, molding quality recording and mining is carried out based on the vehicle type and application scenario information, analyzing historical records to determine the quality control points, dynamically adjusting the detection plan, including determining the number of quality detection control points and the change cycle, to generate an adaptive quality detection plan.

Benefits of technology

The efficiency and quality of injection molding quality control is improved. Through dynamic adjustment of the inspection plan, the quality changes in the production process can be more accurately reflected, and the reliability of the production line is enhanced.

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Abstract

The present invention discloses a method and system for quality control of injection molding of wafer carrier plastic parts, and relates to the field of injection molding technology, the method comprising: obtaining production task information of target wafer carrier plastic parts; obtaining multiple historical carrier molding quality records; obtaining multiple carrier molding quality control points; performing quality dynamic detection scheme analysis based on the number of production pieces and multiple carrier molding quality control points, and obtaining a target quality detection scheme configuration strategy; obtaining a first molding quality detection result, wherein the first quality detection scheme includes a first detection control point set; and performing injection molding quality control of an injection molding production line based on the first molding quality detection result. The present invention solves the technical problem of low reliability of injection molding quality control during mass production of wafer carrier plastic parts in the prior art, and achieves the technical effect of improving the accuracy and efficiency of injection molding quality control of wafer carrier plastic parts.
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