A slice scooping machine
By designing a slicer for silicon wafer processing, the automatic separation and loading of silicon wafers is achieved, solving the problems of time-consuming, labor-consuming and easy damage in traditional methods, and improving production efficiency and product quality.
CN119208220BActive Publication Date: 2025-03-28SHANGHAI YOUDIAN LVNENG AUTOMATION CO LTD
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Patent Information
- Application Number
- CN202411202011.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-29
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2044-08-29
AI Technical Summary
Technical Problem
Traditional silicon wafer processing methods have problems such as time-consuming and labor-consuming in the degumming and inserting steps, which can easily cause silicon wafer damage, which affects production efficiency and product quality.
Method used
A stripping machine is designed, including an integral bracket, degumming rack, stripping sink assembly, conveying mechanism, degumming rack cutting robot, stripping assembly and discharge water tank, and automatic and mechanized means to achieve automatic separation and loading of silicon wafers.
Benefits of technology
The automated processing of silicon wafers is realized, which avoids the instability of manual operation, improves production efficiency and product quality, and reduces the risk of silicon wafer damage.
✦ Generated by Eureka AI based on patent content.
Abstract
The present invention is applicable to the field of silicon wafer processing technology, and provides a wafer catching machine, including a degumming rack, a wafer catching water tank assembly, a conveying mechanism, a degumming rack unloading manipulator, a wafer catching assembly and a discharge water tank; one end of the degumming rack is provided with an end plate, and the other end is open, a flexible roller is installed on the degumming rack, and a self-locking swing device is provided on the end plate; the conveying mechanism is used to convey the degumming rack; the degumming rack unloading manipulator is used to pre-treat the degumming rack; the wafer catching assembly includes a water spraying and pressing mechanism, a wafer catching fixture, a six-axis robot, a circulating water spraying system and a pressing and clamping rod mechanism. The discharge water tank is used to receive the silicon wafers placed from the wafer catching fixture. The present invention can automatically separate silicon wafers and automatically load them into the silicon wafer clip, realizing unmanned operation from degumming to inserting. In addition, the flexible separation of silicon wafers can be realized, the quality of the product can be guaranteed, and the silicon wafers can be accurately placed in the silicon wafer clip, which greatly improves the production efficiency.
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