Display panel, display equipment and preparation method of display panel

Abstract

The invention provides a display panel, a display device and a preparation method of the display panel, the display panel comprises a substrate, a protective layer and at least one light emitting unit, and the light emitting unit is arranged on one side of the substrate; the protection layer is arranged on the side, away from the substrate, of the light emitting unit, and the orthographic projection of the protection layer on the substrate covers at least part of the area of the orthographic projection of at least one light emitting unit on the substrate; and the material of the protective layer comprises a metal material. In the manufacturing process of the display panel, the protective layer can resist etching, and the effect of protecting the light-emitting unit is achieved.

Description

Technical Field

[0001] Embodiments of the present application relate to the field of display technology, and in particular, to a display panel, a display device, and a method for manufacturing a display panel. Background Art

[0002] Organic Light Emitting Display (OLED) and flat-panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the invention

[0004] In order to solve the above problems, embodiments of the present application provide a display panel, a display device and a method for manufacturing a display panel, so as to at least partially solve the above problems.

[0005] According to a first aspect of an embodiment of the present application, the present application provides a display panel, comprising:

[0006] substrate;

[0007] At least one light-emitting unit is disposed on one side of the substrate;

[0008] A protective layer is arranged on a side of the light-emitting unit away from the substrate, and the protective layer covers at least a partial area of ​​the orthographic projection of at least one of the light-emitting units on the substrate; the material of the protective layer includes a metal material.

[0009] Optionally, a packaging layer is further provided on one side of the substrate, and the packaging layer is located between the light-emitting unit and the protective layer; preferably, the material of the packaging layer includes an inorganic material.

[0010] Optionally, along a direction away from the substrate, the light-emitting unit includes a first electrode, a light-emitting functional layer and a second electrode which are stacked in sequence, and the encapsulation layer is located between the second electrode and the protective layer.

[0011] Optionally, a packaging layer is further provided on one side of the substrate, and the protective layer is located between the light-emitting unit and the packaging layer; preferably, the material of the packaging layer includes an inorganic material.

[0012] Optionally, along the direction away from the substrate, the light-emitting unit includes a first electrode, a light-emitting functional layer and a second electrode in sequence, and the protective layer is located between the second electrode and the encapsulation layer; preferably, the display panel also includes a light extraction layer, and the light extraction layer is located between the second electrode and the protective layer.

[0013] Optionally, the light-emitting unit includes a first light-emitting unit and a second light-emitting unit, the protective layer arranged on the side of the first light-emitting unit away from the substrate is a first protective layer, the protective layer arranged on the side of the second light-emitting unit away from the substrate is a second protective layer, and the first protective layer and the second protective layer are arranged at intervals; preferably, the metal material of the first protective layer is different from the metal material of the second protective layer; preferably, the protective layer (50) is a transparent metal layer or a semi-transparent metal layer; preferably, the light-emitting color of the first light-emitting unit is different from the light-emitting color of the second light-emitting unit; preferably, the first light-emitting unit is adjacent to the second light-emitting unit.

[0014] Optionally, the display panel also includes an isolation structure and a pixel defining layer, the isolation structure is arranged on a side of the substrate facing the light-emitting unit, the pixel defining layer is arranged between the substrate and the isolation structure, the isolation structure is surrounded by an isolation opening, the pixel defining layer has a pixel opening, and the orthographic projection of the pixel opening on the substrate falls within the orthographic projection range of the isolation opening on the substrate; the pixel opening includes a first pixel opening and a second pixel opening, the isolation opening includes adjacent first isolation openings and second isolation openings, the first light-emitting unit is arranged in the first isolation opening and the first pixel opening, and the second light-emitting unit is arranged in the second isolation opening and the second pixel opening.

[0015] Optionally, the display panel also includes an encapsulation layer, the protective layer is located between the light-emitting unit and the encapsulation layer, or the encapsulation layer is located between the light-emitting unit and the protective layer; the encapsulation layer arranged on the side of the first light-emitting unit away from the substrate is a first encapsulation layer, and the encapsulation layer arranged on the side of the second light-emitting unit away from the substrate is a second encapsulation layer; the first encapsulation layer is arranged in the first isolation opening and overlaps the isolation structure, and the second encapsulation layer is arranged in the second isolation opening and overlaps the isolation structure; preferably, the first encapsulation layer and the second encapsulation layer are spaced apart.

[0016] Optionally, the light-emitting unit also includes a third light-emitting unit and a third encapsulation layer arranged on a side of the third light-emitting unit away from the substrate, the isolation opening includes a third isolation opening, the pixel opening includes a third pixel opening, the third light-emitting unit is arranged in the third isolation opening and the third pixel opening, and the third encapsulation layer is arranged in the third isolation opening and overlaps the isolation structure; preferably, the light-emitting color of the third light-emitting unit is different from the light-emitting colors of the first light-emitting unit and the second light-emitting unit.

[0017] According to a second aspect of the embodiments of the present application, the present application provides a display panel, characterized in that it includes:

[0018] substrate;

[0019] A plurality of light-emitting units are arranged on one side of the substrate;

[0020] The stacked encapsulation layer and the protective layer are arranged on the side of the light-emitting unit away from the substrate, and the orthographic projection of the protective layer on the substrate covers at least a partial area of ​​the orthographic projection of the light-emitting unit on the substrate; wherein the two protective layers on the side of two adjacent light-emitting units away from the substrate are spaced apart.

[0021] Optionally, two adjacent light-emitting units are spaced apart from the two protective layers on one side of the substrate.

[0022] Optionally, the encapsulation layer is located between the light-emitting unit and the protective layer; or, the protective layer is located between the light-emitting unit and the encapsulation layer.

[0023] Optionally, two adjacent light-emitting units are spaced apart from the two encapsulation layers on one side of the substrate; preferably, the material of the encapsulation layer includes an inorganic material; preferably, the material of the protective layer includes a metal material; preferably, the protective layer is a transparent metal layer or a semi-transparent metal layer.

[0024] Optionally, the display panel further comprises an isolation structure and a pixel defining layer, the isolation structure being arranged on a side of the substrate facing the light-emitting unit, the pixel defining layer being arranged between the substrate and the isolation structure, the isolation structure surrounding an isolation opening, the pixel defining layer having a pixel opening, the orthographic projection of the pixel opening on the substrate falling within the orthographic projection range of the isolation opening on the substrate; the pixel opening comprises a first pixel opening and a second pixel opening, the isolation opening comprises adjacent first isolation openings and second isolation openings, the light-emitting unit comprises a first light-emitting unit in the first isolation opening and the first pixel opening, and a second light-emitting unit arranged in the second isolation opening and the second pixel opening; the light-emitting unit is arranged in the first light-emitting unit. The protective layer on the side of the unit away from the substrate is a first protective layer, the protective layer arranged on the side of the second light-emitting unit away from the substrate is a second protective layer, the encapsulation layer arranged on the side of the first light-emitting unit away from the substrate is a first encapsulation layer, and the encapsulation layer arranged on the side of the second light-emitting unit away from the substrate is a second encapsulation layer; preferably, the light-emitting color of the first light-emitting unit is different from the light-emitting color of the second light-emitting unit; preferably, the first encapsulation layer is arranged in the first isolation opening and overlaps with the isolation structure, and the second encapsulation layer is arranged in the second isolation opening and overlaps with the isolation structure; preferably, the display panel also includes a light extraction layer, which is located between the light-emitting unit and the protective layer.

[0025] Optionally, the light-emitting unit also includes a third light-emitting unit and a third encapsulation layer arranged on a side of the third light-emitting unit away from the substrate, the isolation opening includes a third isolation opening, the pixel opening includes a third pixel opening, the third light-emitting unit is arranged in the third isolation opening and the third pixel opening, and the third encapsulation layer is arranged in the third isolation opening and overlaps the isolation structure; preferably, the light-emitting color of the third light-emitting unit is different from the light-emitting colors of the first light-emitting unit and the second light-emitting unit.

[0026] According to a third aspect of an embodiment of the present application, a method for preparing a display panel is provided, the method comprising:

[0027] providing a substrate;

[0028] Prepare at least one light-emitting unit on one side of the substrate;

[0029] Preparing a protective layer on a side of at least one of the light-emitting units away from the substrate;

[0030] The protective layer covers at least a partial area of ​​the orthographic projection of at least one of the light-emitting units on the substrate, and the material of the protective layer includes a metal material.

[0031] Optionally, the preparation method further comprises: preparing a packaging layer on a side of the protective layer away from the substrate.

[0032] Optionally, the step of preparing a protective layer on a side of at least one of the light-emitting units away from the substrate comprises: preparing an encapsulation layer on a side of the light-emitting unit away from the substrate,

[0033] A protection layer is prepared on a side of the packaging layer away from the substrate.

[0034] According to a fourth aspect of the embodiments of the present application, the present application provides a method for preparing a display panel, the method comprising:

[0035] providing a substrate;

[0036] Prepare a plurality of light-emitting units on one side of the substrate;

[0037] An encapsulation layer and a protective layer are prepared on a side of the light-emitting unit away from the substrate, the encapsulation layer and the protective layer are stacked, and the orthographic projection of the protective layer on the substrate covers at least a partial area of ​​the orthographic projection of the light-emitting unit on the substrate; wherein the two protective layers of two adjacent light-emitting units away from the side of the substrate are spaced apart.

[0038] Optionally, preparing an encapsulation layer and a protective layer on a side of the light-emitting unit away from the substrate includes:

[0039] preparing an encapsulation layer on a side of the light-emitting unit away from the substrate,

[0040] A protection layer is prepared on a side of the packaging layer away from the substrate.

[0041] In one possibility, the step of preparing an encapsulation layer and a protective layer on a side of the light-emitting unit away from the substrate includes:

[0042] A protective layer is prepared on a side of the light-emitting unit away from the substrate,

[0043] A packaging layer is prepared on a side of the protection layer away from the substrate.

[0044] According to a fifth aspect of the embodiments of the present application, the present application provides a display device, which includes the above-mentioned display panel.

[0045] Based on the above-mentioned display panel and display panel manufacturing method provided in the present application, in the process of manufacturing the display panel, the protective layer can resist etching, protect the light-emitting unit, reduce the risk of the light-emitting unit being etched, and achieve the effect of protecting the light-emitting unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The following drawings are intended only to illustrate and explain the present application, and do not limit the scope of the present application.

[0047] Figure 1a It is a structural schematic diagram of a state of a display panel during the manufacturing process in the related art;

[0048] Figure 1b It is a structural schematic diagram of another state of a display panel during the manufacturing process in the related art;

[0049] Figure 1c It is a structural schematic diagram of another state of a display panel during the manufacturing process in the related art;

[0050] Figure 1d It is a structural schematic diagram of another state of a display panel during the manufacturing process in the related art;

[0051] Figure 1e It is a structural schematic diagram of another state of a display panel during the manufacturing process in the related art;

[0052] Figure 2 is a partial structural schematic diagram of a display panel provided by an exemplary embodiment of the present application;

[0053] Figure 3 is a partial structural schematic diagram of a display panel provided by an exemplary embodiment of the present application;

[0054] Figure 4 is a partial structural schematic diagram of a display panel provided by an exemplary embodiment of the present application;

[0055] Figure 5 is a partial structural schematic diagram of a display panel provided by an exemplary embodiment of the present application;

[0056] Figure 6 is a partial structural schematic diagram of a display panel provided by an exemplary embodiment of the present application;

[0057] Figure 7 is a partial structural schematic diagram of a display panel provided by an exemplary embodiment of the present application;

[0058] Figure 8 is a partial structural schematic diagram of a display panel provided by an exemplary embodiment of the present application;

[0059] Fig. 9 is a partial structural schematic diagram of a display panel provided by an exemplary embodiment of the present application;

[0060] Fig.10 is a partial structural schematic diagram of a display panel provided by an exemplary embodiment of the present application;

[0061] Fig.11 is a partial structural schematic diagram of a display panel provided by an exemplary embodiment of the present application;

[0062] Fig.12 is a partial structural schematic diagram of a display panel provided by an exemplary embodiment of the present application;

[0063] Fig.13 is a partial structural schematic diagram of a display panel provided by an exemplary embodiment of the present application;

[0064] Fig.14 is a partial structural schematic diagram of a display panel provided by an exemplary embodiment of the present application;

[0065] Fig.15 is a partial structural schematic diagram of a display panel provided by an exemplary embodiment of the present application;

[0066] Fig.16 is a partial structural schematic diagram of a display panel provided by an exemplary embodiment of the present application;

[0067] Fig.17 is a flow chart of a method for preparing a display panel provided in the present application;

[0068] Fig.18a This is a structural schematic diagram of a display panel provided by the present application in a state during the manufacturing process;

[0069] Fig.18b This is a structural schematic diagram of a display panel provided by the present application in a state during the manufacturing process;

[0070] Fig.18c This is a structural schematic diagram of a display panel provided by the present application in a state during the manufacturing process;

[0071] Fig.19a This is a structural schematic diagram of another display panel provided by the present application in a state during the manufacturing process;

[0072] Fig.19b This is a structural schematic diagram of another display panel provided by the present application in a state during the manufacturing process;

[0073] Fig.19c This is a structural schematic diagram of another display panel provided by the present application in a state during the manufacturing process;

[0074] Fig.19d This is a structural schematic diagram of another display panel provided by the present application in a state during the manufacturing process;

[0075] Fig.19e This is a structural schematic diagram of another display panel provided by the present application in a state during the manufacturing process;

[0076] Fig.20a This is a structural schematic diagram of a display panel provided by the present application in a state during the manufacturing process;

[0077] Fig.20b This is a structural schematic diagram of a display panel provided by the present application in a state during the manufacturing process;

[0078] Fig.21a This is a structural schematic diagram of another display panel provided by the present application in a state during the manufacturing process;

[0079] Figure 21b This is a structural schematic diagram of another display panel provided by the present application in a state during the manufacturing process;

[0080] Fig.21c This is a structural schematic diagram of another display panel provided by the present application in a state during the manufacturing process;

[0081] Fig.21d This is a structural schematic diagram of a display panel provided by the present application in a state during the manufacturing process;

[0082] Fig.21e This is a structural schematic diagram of a display panel provided by the present application in a state during the manufacturing process;

[0083] Fig.21f This is a structural schematic diagram of a display panel provided by the present application in a state during the manufacturing process;

[0084] Figure 21g This is a structural schematic diagram of a display panel provided by the present application in a state during the manufacturing process;

[0085] Figure 21h This is a structural schematic diagram of a display panel provided by the present application in a state during the manufacturing process;

[0086] Fig. 22 It is a flow chart of another method for preparing a display panel provided in the present application.

[0087] Description of reference numerals:

[0088] 11-first sub-pixel, 12-second sub-pixel, 13-third sub-pixel,

[0089] 14-substrate, 15-pixel defining layer, 16-isolation structure;

[0090] 171 - first encapsulation layer, 172 - second encapsulation layer, 173 - third encapsulation layer;

[0091] 21-substrate, 22-pixel defining layer, 23-isolation structure, 231-conductive layer, 232-insulating layer;

[0092] 30-light-emitting unit, 301-first electrode, 302-light-emitting functional layer, 303-second electrode, 31-first light-emitting unit, 32-second light-emitting unit, 33-third light-emitting unit,

[0093] 40-encapsulation layer, 41-first encapsulation layer, 42-second encapsulation layer, 43-third encapsulation layer,

[0094] 50-protective layer, 51-first protective layer, 52-second protective layer.

[0095] 60-Encapsulation layer. DETAILED DESCRIPTION

[0096] In order to have a clearer understanding of the technical features, purposes and effects of the embodiments of the present application, the specific implementation methods of the embodiments of the present application are now described with reference to the accompanying drawings.

[0097] In this document, “exemplary” means “serving as an example, instance or illustration”, and any diagram or implementation described in this document as “exemplary” should not be interpreted as a more preferred or more advantageous technical solution.

[0098] In order to simplify the drawings, only the parts related to the present application are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, in order to simplify the drawings and facilitate understanding, in some figures, only one or more of the parts with the same structure or function are schematically drawn or only one or more of them are marked.

[0099] The corresponding structural parts mentioned below, such as the contents of the isolation structure, are described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217. PCT / CN2024 / 099419, PCT / CN2024 / 099072 , CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500302A are further described for reference.

[0100] refer to Figures 1a to 1e The display panel includes a substrate 14, a pixel defining layer 15, an isolation structure 16 and sub-pixels. The sub-pixels are arranged in a specific form in the pixel opening of the pixel defining layer 15 and are surrounded by the isolation structure 16. Different sub-pixels can emit red, blue or green light. In the related technology of manufacturing a display panel, after the isolation structure 16 is arranged on the pixel defining layer 15, the first step is as follows. Figure 1a As shown, the light-emitting layer and cathode layer of the first sub-pixel 11 are obtained by full-surface evaporation, and then the first encapsulation layer is obtained by chemical vapor deposition. At this time, each pixel opening and the isolation structure 16 are covered with the first sub-pixel 11 and the first encapsulation layer. Figure 1b As shown, the unnecessary first sub-pixel 11 and the first encapsulation layer are removed by pattern etching, and only the first encapsulation layer and the first sub-pixel 11 corresponding to the first pixel opening are retained. Figure 1c As shown, the light-emitting layer and cathode layer of the second sub-pixel 12 are obtained by full-surface evaporation, and then the second encapsulation layer is obtained by chemical vapor deposition. At this time, each pixel opening and the isolation structure 16 are covered with the second sub-pixel 12 and the second encapsulation layer. Figure 1d As shown, the unnecessary second sub-pixel 12 and the second encapsulation layer are removed by patterned etching, and only the second encapsulation layer and the second sub-pixel 12 corresponding to the second pixel opening are retained. Similarly, the light-emitting layer and the cathode layer of the third sub-pixel 13 can be obtained by whole-surface evaporation, and then the third encapsulation layer is obtained by chemical vapor deposition. Then, the unnecessary third sub-pixel 13 and the third encapsulation layer are removed by patterned etching, and only the third encapsulation layer and the third sub-pixel 13 corresponding to the third pixel opening are retained.

[0101] Since the isolation structure 16 is T-shaped, it is easy to cause an empty groove area at the corner of the first encapsulation layer and an empty groove area at the corner of the second encapsulation layer when the first encapsulation layer and the second encapsulation layer are formed by deposition. Since the thickness of the first encapsulation layer and the corresponding part of the empty groove area is relatively thin, when the unnecessary second sub-pixel 12 and the second encapsulation layer are removed by pattern etching, Figure 1e The middle arrow indicates that the first encapsulation layer is easily etched through in the empty slot area, which leads to the etching of the first sub-pixel 11. Similarly, the second encapsulation layer is thinner in the portion corresponding to the empty slot area. When the unnecessary third sub-pixel 13 and the third encapsulation layer are removed by patterned etching, the first encapsulation layer and the second encapsulation layer are easily etched through, which leads to the etching of the first sub-pixel 11 and the second sub-pixel 12. Etching of sub-pixels can cause dark spot problems.

[0102] In order to solve this problem, the present application provides a display panel such as Figure 2 As shown, it includes a substrate 21, a protective layer 50 and at least one light-emitting unit 30, the light-emitting unit 30 is arranged on one side of the substrate 21, the protective layer 50 is arranged on the side of the light-emitting unit away from the substrate 21, and the orthographic projection of the protective layer 50 on the substrate 21 covers at least a partial area of ​​the orthographic projection of at least one light-emitting unit 30 on the substrate 21; the material of the protective layer includes metal material.

[0103] Based on the above technical solution, it can be known that at least one light-emitting unit is covered by the protective layer, and at least a partial area is covered. Then, in the subsequent production process of the display panel, especially the etching process, the protective layer can play a role in resisting etching, thereby protecting the light-emitting unit and reducing the risk of the light-emitting unit being etched, thereby improving the dark spot situation.

[0104] In one possible embodiment, reference Figure 3 , an encapsulation layer 40 is also provided on one side of the substrate 21, and the encapsulation layer 40 is located between the light-emitting unit 30 and the protective layer 40. In this way, the encapsulation layer can be used to isolate water and oxygen and protect the light-emitting unit 30. The protective layer can resist etching and prevent the encapsulation layer 40 and the light-emitting unit 30 from being etched. Preferably, the material of the encapsulation layer 40 may include an inorganic material.

[0105] For further reference, Figure 4 , along the direction away from the substrate 21, the light-emitting unit 30 includes a first electrode 301, a light-emitting functional layer 302, and a second electrode 303 in a stacked manner, and the encapsulation layer 40 is located between the second electrode 303 and the protective layer 50. In this way, the encapsulation layer can protect the second electrode and prevent the second electrode from being oxidized. The first electrode can be an anode, and the second electrode can be a cathode.

[0106] In one possible embodiment, reference Figure 5, a packaging layer 40 is also provided on one side of the substrate 21, and a protective layer 50 is located between the light-emitting unit 30 and the packaging layer 40; preferably, the material of the packaging layer includes an inorganic material. In this way, the packaging layer can be used to isolate water and oxygen, and the packaging layer and the protective layer can jointly protect the light-emitting unit. When the packaging layer is etched, the protective layer can resist etching, protect the light-emitting unit, and reduce the risk of etching the light-emitting unit.

[0107] For further reference, Figure 5 , along the direction away from the substrate 21, the light-emitting unit 30 includes a first electrode 301, a light-emitting functional layer 302, and a second electrode 303 in a stacked manner, and the protective layer 50 is located between the second electrode 303 and the encapsulation layer 40. In this way, the protective layer 50 can resist etching and protect the second electrode 303. Among them, the first electrode 301 can be an anode, and the second electrode 303 can be a cathode.

[0108] Preferably, reference Figure 5 The display panel further includes a light extraction layer 70 , and the light extraction layer 70 is located between the second electrode 303 and the protective layer 50 .

[0109] In one possible embodiment, reference Figure 6 The light-emitting unit 30 includes a first light-emitting unit 31 and a second light-emitting unit 32. The protective layer arranged on the side of the first light-emitting unit 31 away from the substrate 21 is a first protective layer 51, and the protective layer arranged on the side of the second light-emitting unit away from the substrate 21 is a second protective layer 52. The first protective layer 51 and the second protective layer 52 are arranged at intervals.

[0110] Preferably, the metal material of the first protective layer 51 is different from the metal material of the second protective layer 52. In the process of preparing the display panel, when the second protective layer 52 is formed by etching, if the material of the first protective layer 51 is the same as the material of the second protective layer 52, there is a risk of etching the first protective layer 51. Therefore, making the material of the first protective layer 51 different from the material of the second protective layer 52 can prevent the first protective layer 51 from being etched.

[0111] Among them, the protective layer 50 can be a transparent metal layer or a translucent metal layer. Compared with translucent metal materials, the use of transparent metal materials can reduce the impact on the light emission of the light-emitting unit. When using translucent metal materials, the thickness of the protective layer 50 can be made smaller to reduce the impact on the light emission of the light-emitting unit. Among them, the transparent metal material can be, for example, an N-type oxide semiconductor-indium tin oxide (indium tin oxides, ITO) or silver nanowires. The translucent metal material can be aluminum (Ag), magnesium (Mg), ytterbium (Ytterbium, Yb) or lithium fluoride (Lithium fluoride, LiF).

[0112] Preferably, the luminescent color of the first luminescent unit is different from the luminescent color of the second luminescent unit. Wherein, the luminescent functional layer may include: one or more of: HIL (Hole Injection Layer), HTL (Hole Transfer Layer), EML (Emitting Layer) and ETL (Electron Transfer Layer). Wherein, the organic luminescent material in the luminescent functional layer is generally divided into: high molecular polymer, small molecule organic matter and complex luminescent material; high molecular polymer is usually a conductive conjugated polymer or a semiconductor conjugated polymer, which can be formed into a film by spin coating, is simple to make and has low cost, but its purity is not easy to improve, and is inferior to small molecule organic compounds in durability, brightness and color. Organic small molecule luminescent materials are mainly organic dyes, which have the advantages of strong chemical modification, wide selection range, easy purification, high quantum efficiency, and can produce various color emission peaks such as red, green, blue, and yellow, but most of them have problems such as concentration quenching in the solid state. Complex luminescent materials are between organic and inorganic substances. They have both the high fluorescence quantum efficiency of organic substances and the high stability of inorganic substances. They are considered to be a type of luminescent material with great application prospects.

[0113] Preferably, the first light emitting unit 31 is adjacent to the second light emitting unit 32 .

[0114] In a specific embodiment, reference Figure 7 The display panel further includes an isolation structure 23 and a pixel defining layer 22. The isolation structure 23 is arranged on the side of the substrate 21 facing the light-emitting unit 30. The pixel defining layer 22 is arranged between the substrate 21 and the isolation structure 23. The isolation structure 23 surrounds and forms an isolation opening. The pixel defining layer 22 has a pixel opening. The positive projection of the pixel opening on the substrate 21 falls within the positive projection range of the isolation opening on the substrate 21. The pixel opening includes a first pixel opening and a second pixel opening. The isolation opening includes adjacent first isolation openings and second isolation openings. The first light-emitting unit 31 is arranged in the first isolation opening and the first pixel opening, and the second light-emitting unit 32 is arranged in the second isolation opening and the second pixel opening. In this way, the adjacent light-emitting units 30 are separated by the isolation structure 23 and the pixel defining layer 22. Among them, the first light-emitting unit 31 may include a first electrode 301, a light-emitting functional layer 302, and a second electrode 303 arranged in layers. The second light-emitting unit 32 may include a first electrode 301, a light-emitting functional layer 302, and a second electrode 303 arranged in layers. The light-emitting functional layer 302 of the first light-emitting unit 31 and the light-emitting functional layer 302 of the second light-emitting unit 32 may be used to emit light of different colors.

[0115] In some embodiments, reference Figure 8The isolation structure 23 may further include a conductive layer 231 and an insulating layer 232, wherein the insulating layer 232 is located on the side of the conductive layer 231 away from the substrate 21. The second electrode 303 of the light-emitting unit may overlap and conduct with the side wall of the conductive layer 231 of the isolation structure 23, thereby realizing mutual electrical connection between the second electrodes 303. In this way, through the isolation structure 23 disposed around the pixel opening, the second electrodes 303 of the light-emitting units 30 are connected in a mesh shape, which is beneficial to the uniformity of the second electrodes.

[0116] Among them, the cross-section of the side wall of the conductive layer 231 in the plane direction perpendicular to the pixel defining layer 22 is a trapezoid, and the angle between the side wall of the conductive layer 231 and the upper surface of the pixel defining layer 22 covered by the corresponding conductive layer 231 is less than 90 degrees. In this way, the adverse effect on the light output efficiency of the light-emitting unit can be reduced. It can also facilitate the overlap of the second electrode with the side wall of the conductive layer 231 respectively. The material of the conductive layer 231 can include but is not limited to: aluminum (Al), magnesium (Mg), copper (Cu), silver (Ag), indium tin oxide (ITO), indium zinc oxide (IGZ0) and other conductive metals or other metal oxides or their combinations, that is, it can meet the use conditions of the implementation scheme, and no specific limitation is made here; the material of the insulating layer 232 can include but is not limited to silicon monoxide (SiO), silicon dioxide (SiO2), silicon nitride (SiNx), silicon oxynitride (SiNO) and other materials.

[0117] Further, in one example, reference Fig. 9 and Fig.10 The display panel further includes an encapsulation layer 40, and the protective layer 50 is located between the light-emitting unit 39 and the encapsulation layer 40, or the encapsulation layer 40 is located between the light-emitting unit 39 and the protective layer 40. Among them, the encapsulation layer arranged on the side of the first light-emitting unit 31 away from the substrate 21 is the first encapsulation layer 41, and the encapsulation layer arranged on the side of the second light-emitting unit 32 away from the substrate 21 is the second encapsulation layer 42. The first encapsulation layer 41 and the second encapsulation layer 42 are arranged at intervals, the first encapsulation layer 41 is arranged in the first isolation opening and overlaps the isolation structure 23, and the second encapsulation layer 42 is arranged in the second isolation opening and overlaps the isolation structure 23. In this way, by overlapping the encapsulation layer 40 with the isolation structure 23, the light-emitting unit can be better protected. Preferably, the first encapsulation layer 41 and the second encapsulation layer 42 are arranged at intervals.

[0118] In one example, reference Fig.11 and Fig.12, the light-emitting unit 30 further includes a third light-emitting unit 33 and a third encapsulation layer 43 disposed on a side of the third light-emitting unit away from the substrate 21, the isolation opening includes a third isolation opening, the pixel opening includes a third pixel opening, the third light-emitting unit 33 is disposed in the third isolation opening and in the third pixel opening, and the third encapsulation layer 43 is disposed in the third isolation opening and overlaps the isolation structure 23. In this way, the third light-emitting unit 33 and the second light-emitting unit 32 are separated, and similarly, the third light-emitting unit 33 and the first light-emitting unit 31 are separated. The third encapsulation layer 43 is spaced apart from the first encapsulation layer 41, and the third encapsulation layer 43 is spaced apart from the second encapsulation layer 42. The third encapsulation layer 43 can isolate water and oxygen and protect the third light-emitting unit 33.

[0119] Preferably, the light emitting color of the third light emitting unit is different from the light emitting colors of the first light emitting unit and the second light emitting unit. In this way, the display panel includes three light emitting units capable of emitting light of different colors.

[0120] In a second aspect, the present application provides a display panel, referring to Fig.13 and Fig.14 The display panel includes a substrate 21, an encapsulation layer 40, a protective layer 50 and a plurality of light-emitting units 30; the light-emitting unit 30 is arranged on one side of the substrate 21; the encapsulation layer 40 and the protective layer 50 are stacked and arranged on the side of the light-emitting unit 30 away from the substrate 21, and the orthographic projection of the protective layer 50 on the substrate 21 covers at least a partial area of ​​the orthographic projection of the light-emitting unit 30 on the substrate 21; wherein, the two protective layers 50 on the side of two light-emitting units 30 away from the substrate 21 are spaced apart.

[0121] Based on the above technical solution, it can be known that the light-emitting unit is covered by the corresponding protective layer, and at least a partial area is covered. Therefore, in the subsequent production process of the display panel, especially the etching process, the protective layer can play a role in resisting etching, thereby protecting the light-emitting unit and reducing the risk of the light-emitting unit being etched, thereby improving the dark spot situation.

[0122] In one example, two adjacent light emitting units 30 are spaced apart from the two protective layers 50 on one side of the substrate 21 .

[0123] Among them, reference Fig.13 , the encapsulation layer 40 is located between the light emitting unit 30 and the protective layer 15. Fig.14 , the protection layer 50 is located between the encapsulation layer 40 and the light emitting unit 30 .

[0124] In a possible embodiment, two adjacent light-emitting units 30 are spaced apart from the two encapsulation layers on the side away from the substrate 21. In this way, the light-emitting units correspond to the encapsulation layers one by one, and the encapsulation layers correspond to the protective layers one by one.

[0125] Preferably, the material of the encapsulation layer includes inorganic material.

[0126] Preferably, the material of the protective layer includes a metal material. Among them, the protective layer can be a transparent metal layer or a translucent metal layer. Compared with translucent metal materials, the use of transparent metal materials can reduce the impact on the light emission of the light-emitting unit. When using translucent metal materials, the thickness of the protective layer can be made smaller to reduce the impact on the light emission of the light-emitting unit. Among them, the transparent metal material can be, for example, an N-type oxide semiconductor-indium tin oxide (indium tin oxides, ITO) or silver nanowires. The translucent metal material can be aluminum (Ag), magnesium (Mg), ytterbium (Ytterbium, Yb) or lithium fluoride (Lithiumfluoride, LiF).

[0127] In one example, reference Fig. 9 and Fig.10 The display panel further includes an isolation structure 23 and a pixel defining layer 22. The isolation structure 23 is arranged on the side of the substrate 21 facing the light-emitting unit. The pixel defining layer 22 is arranged between the substrate 21 and the isolation structure 23. The isolation structure 23 surrounds and forms an isolation opening. The pixel defining layer 22 has a pixel opening. The positive projection of the pixel opening on the substrate 21 falls within the positive projection range of the isolation opening on the substrate 21. The pixel opening includes a first pixel opening and a second pixel opening. The isolation opening includes adjacent first isolation openings and second isolation openings. The first light-emitting unit is arranged in the first isolation opening and the first pixel opening, and the second light-emitting unit is arranged in the second isolation opening and the second pixel opening. The light-emitting unit includes a first light-emitting unit in the first isolation opening and a second light-emitting unit in the second isolation opening. The protective layer arranged on the side of the first light-emitting unit away from the substrate 21 is the first protective layer, and the protective layer arranged on the side of the second light-emitting unit away from the substrate 21 is the second protective layer. The encapsulation layer arranged on the side of the first light-emitting unit away from the substrate 21 is the first encapsulation layer, and the encapsulation layer arranged on the side of the second light-emitting unit away from the substrate 21 is the second encapsulation layer. In this way, the adjacent light-emitting units are separated by the isolation structure 23 and the pixel defining layer 22, the adjacent protective layers can be separated, and the adjacent encapsulation layers can also be separated. Among them, the first light-emitting unit 31 may include a first electrode 301, a light-emitting functional layer 302, and a second electrode 303 arranged in a stacked manner. The second light-emitting unit 32 may include a first electrode 301, a light-emitting functional layer 302, and a second electrode 303 arranged in a stacked manner. The light-emitting functional layer of the first light-emitting unit and the light-emitting functional layer of the second light-emitting unit can be used to emit light of different colors.

[0128] Preferably, the light emitting color of the first light emitting unit is different from the light emitting color of the second light emitting unit.

[0129] Preferably, the first encapsulation layer is arranged in the first isolation opening and overlaps the isolation structure 23, and the second encapsulation layer is arranged in the second isolation opening and overlaps the isolation structure 23. Thus, by overlapping the encapsulation layer and the isolation structure 23, the light-emitting unit can be better protected.

[0130] Preferably, reference Fig.15 The display panel further includes a light extraction layer 70, which is located between the light emitting unit and the protective layer.

[0131] refer to Fig.11 The light-emitting unit further includes a third light-emitting unit and a third encapsulation layer disposed on a side of the third light-emitting unit away from the substrate 21, the isolation opening includes a third isolation opening, the pixel opening includes a third pixel opening, the third light-emitting unit is disposed in the third isolation opening and the third pixel opening, and the third encapsulation layer is disposed in the third isolation opening and overlaps the isolation structure 23. In this way, the third light-emitting unit is separated from the second light-emitting unit, and similarly, the third light-emitting unit is separated from the first light-emitting unit. The third encapsulation layer can isolate water and oxygen and protect the third light-emitting unit.

[0132] Preferably, the light color of the third light emitting unit is different from the light colors of the first light emitting unit and the second light emitting unit. In this way, the display panel includes three light emitting units capable of emitting light of different colors.

[0133] In some embodiments, reference Fig.16 The display panel further includes an encapsulation layer 60, which covers the isolation structure 23, the encapsulation layer and the protective layer, and a surface of the encapsulation layer 60 close to the substrate 21 is in contact with a surface of the isolation structure 23 away from the substrate 21. A surface of the encapsulation layer 60 close to the substrate 21 is also in contact with a surface of the encapsulation layer away from the substrate 21. The material and height of the encapsulation layer 60 are not limited here, and are selected according to actual needs. The encapsulation layer 60 is generally an organic material.

[0134] In addition, a driving circuit may be disposed on the substrate 21 , and the driving circuit is used to drive the light-emitting unit to emit light.

[0135] It can be understood that the substrate 21 plays a role in supporting the entire panel in the display panel. The substrate 21 is generally divided into two types: a hard substrate 21 and a soft substrate 21. The hard substrate 21 is usually made of rigid materials such as glass or plastic, and has good stability and durability, and is suitable for large-size display screens and professional displays; while the soft substrate 21 is usually made of soft plastic or metal foil and other materials, and is suitable for flexible displays and wearable devices.

[0136] refer to Fig.17 , and references Fig.18a and Fig.18bThe present application also provides a method for preparing a display panel, the method comprising:

[0137] Step S81, providing a substrate 21;

[0138] Step S82, preparing at least one light-emitting unit on one side of the substrate 21;

[0139] Step S83, preparing a protective layer on a side of at least one light-emitting unit away from the substrate 21;

[0140] The orthographic projection of the protective layer on the substrate 21 covers at least a partial area of ​​the orthographic projection of at least one light-emitting unit on the substrate 21 , and the material of the protective layer includes a metal material.

[0141] Based on the above preparation method, the protective layer covers the side of the light-emitting unit away from the substrate 21. The protective layer can resist etching, thereby protecting the light-emitting unit and reducing the risk of the light-emitting unit being etched in subsequent preparation steps, thereby improving the dark spot situation.

[0142] In one possible embodiment, reference Fig.18c The preparation method further includes: preparing an encapsulation layer 40 on the side of the protective layer 50 away from the substrate 21. The encapsulation layer is provided to isolate water and oxygen and protect the light-emitting unit.

[0143] Specifically, the light-emitting unit 30 includes a first light-emitting unit 31, a second light-emitting unit 32 and a third light-emitting unit 33, and the light-emitting colors of the first light-emitting unit 31, the second light-emitting unit 32 and the third light-emitting unit 33 are different. An isolation structure 23 and a pixel defining layer 22 are also provided on the substrate 21 on which the light-emitting unit 30 is prepared. The isolation structure 23 is provided on the side of the substrate 21 facing the light-emitting unit, and the pixel defining layer 22 is provided between the substrate 21 and the isolation structure 23. The isolation structure 23 surrounds and forms an isolation opening. The pixel defining layer 22 has a pixel opening, and the positive projection of the pixel opening on the substrate 21 falls within the positive projection range of the isolation opening on the substrate 21; the pixel opening includes a first pixel opening, a second pixel opening and a third pixel opening, and the isolation opening includes adjacent first isolation openings, second isolation openings and third isolation openings. The first light-emitting unit 31 is provided in the first isolation opening and the first pixel opening, the second light-emitting unit 32 is provided in the second isolation opening and the second pixel opening, and the second light-emitting unit 33 is provided in the third isolation opening and the third pixel opening. The light emitting unit 30 includes a first electrode 301, a light emitting functional layer 302, and a second electrode 303. Figures 19a to 19e , the preparation method specifically comprises:

[0144] In the first step, a first electrode 301 of the light emitting unit, a pixel defining layer 22 and an isolation structure 23 are sequentially formed on the substrate 21 .

[0145] Step 2: Reference Fig.19a , the light-emitting functional layer 302 and the second electrode 303 of the first light-emitting unit 31, as well as the first protective layer 51 and the first encapsulation layer 41 are sequentially formed on the first electrode 301 and the pixel defining layer 22. Through this step, the light-emitting functional layer 302, the second electrode 303, the first protective layer 51, and the first encapsulation layer 41 not only occupy the space corresponding to the first pixel opening, but also occupy the space corresponding to the second pixel opening and the space corresponding to the third pixel opening.

[0146] Step 3: Reference Fig.19b , the light-emitting functional layer 302, the second electrode 303, the first encapsulation layer 41 and the first protective layer 51 except the light-emitting functional layer 302, the second electrode 303, the first encapsulation layer 41 and the first protective layer 51 corresponding to the first pixel opening are etched away. Through this step, after the light-emitting functional layer 302, the second electrode 303, the first protective layer 51 and the first encapsulation layer 41 in the space corresponding to the second pixel opening and the space corresponding to the third pixel opening are etched away, only the light-emitting functional layer 302, the second electrode 303, the first protective layer 51 and the first encapsulation layer 41 in the space corresponding to the first pixel opening are retained.

[0147] Step 4: Reference Fig.19c , the light-emitting functional layer 302 and the second electrode 303 of the second light-emitting unit 32, as well as the second protective layer 52 and the second encapsulation layer 42 are sequentially formed on the first encapsulation layer 41, the first electrode 301 and the pixel defining layer 22. Through this step, the light-emitting functional layer 302, the second electrode 303, the second protective layer 52 and the second encapsulation layer 42 not only occupy the space corresponding to the second pixel opening, but also occupy the space corresponding to the first pixel opening and the space corresponding to the third pixel opening.

[0148] Step 5, Reference Fig.19d , the light-emitting functional layer 302, the second electrode 303, the second protective layer 52, and the second encapsulation layer 42 except the light-emitting functional layer 302, the second electrode 303, and the second encapsulation layer 42 corresponding to the second pixel opening are etched away. Through this step, the light-emitting functional layer 302, the second electrode 303, and the second encapsulation layer 42 in the space corresponding to the second pixel opening are retained, and the redundant first protective layer 51, the light-emitting functional layer 302, the second electrode 303, and the second encapsulation layer 42 are etched away.

[0149] It can be seen that in the process of etching and removing the light-emitting functional layer 302, the second electrode 303 and the second encapsulation layer 42 except the light-emitting functional layer 302, the second electrode 303 and the second encapsulation layer 42 corresponding to the second pixel opening, the first protective layer 51 can protect the first light-emitting unit 31 and prevent the first light-emitting unit 31 from being etched.

[0150] refer to Fig.19e , the preparation method provided in the present application may also include: forming the light-emitting functional layer 302, the second electrode 303, and the third encapsulation layer 43 of the third light-emitting unit 33 in sequence on the side of the first encapsulation layer 41, the second encapsulation layer 42, the first electrode 301, and the pixel defining layer 22 away from the substrate 21; and etching and removing the light-emitting functional layer 302, the second electrode 303, and the third encapsulation layer 43 except the light-emitting functional layer 302, the second electrode 303, and the third encapsulation layer 43 corresponding to the third pixel opening. Through this step, the light-emitting functional layer 302, the second electrode 303, and the third encapsulation layer 43 corresponding to the third pixel opening are retained, and the third light-emitting unit 33 is obtained, and the third encapsulation layer 43 used to isolate water and oxygen and protect the third light-emitting unit 33 is obtained.

[0151] The light-emitting functional layer 302 and the second electrode 303 can be obtained by whole-surface evaporation, the first encapsulation layer 41 can be obtained by chemical vapor deposition, and the first protective layer 51 can be obtained by chemical vapor deposition. In the process of removing the redundant first protective layer 51, the first encapsulation layer 41, the second electrode 303 and the light-emitting functional layer 302, the method of removing each layer can be selected according to the different materials of each layer, and the etching method can be dry etching or wet etching.

[0152] Similarly, the light-emitting functional layer 302 and the second electrode 303 can be obtained by whole-surface evaporation, and the light-emitting functional layer 302 and the second electrode 303 can be obtained by whole-surface evaporation; the second encapsulation layer 42 and the third encapsulation layer 43 can be obtained by chemical vapor deposition, and the second protective layer 52 can be obtained by chemical vapor deposition. In the process of removing the excess second protective layer 52, the second encapsulation layer 42, the second electrode 303 and the light-emitting functional layer 302, the method of removing each layer can be selected according to the different materials of each layer, and the etching method can be dry etching or wet etching. In the process of removing the excess third encapsulation layer 43, the second electrode 303 and the light-emitting functional layer 302, the method of removing each layer can be selected according to the different materials of each layer, and the etching method can be dry etching or wet etching.

[0153] In another embodiment of the preparation method, reference Figure 20a to Figure 20b , preparing a protective layer on a side of at least one light-emitting unit away from the substrate 21 , including: preparing an encapsulation layer on a side of the light-emitting unit away from the substrate 21 , and preparing a protective layer on a side of the encapsulation layer away from the substrate 21 .

[0154] Specifically, the light-emitting unit 30 includes a first light-emitting unit 31, a second light-emitting unit 32 and a third light-emitting unit 33, and the light-emitting colors of the first light-emitting unit 31, the second light-emitting unit 32 and the third light-emitting unit 33 are different. An isolation structure 23 and a pixel defining layer 22 are also provided on the substrate 21 on which the light-emitting unit 30 is prepared. The isolation structure 23 is provided on the side of the substrate 21 facing the light-emitting unit, and the pixel defining layer 22 is provided between the substrate 21 and the isolation structure 23. The isolation structure 23 surrounds and forms an isolation opening. The pixel defining layer 22 has a pixel opening, and the positive projection of the pixel opening on the substrate 21 falls within the positive projection range of the isolation opening on the substrate 21; the pixel opening includes a first pixel opening, a second pixel opening and a third pixel opening, and the isolation opening includes adjacent first isolation openings, second isolation openings and third isolation openings. The first light-emitting unit 31 is provided in the first isolation opening and the first pixel opening, the second light-emitting unit 32 is provided in the second isolation opening and the second pixel opening, and the second light-emitting unit 33 is provided in the third isolation opening and the third pixel opening. The light emitting unit 30 includes a first electrode 301, a light emitting functional layer 302, and a second electrode 303. Figures 21a to 21g , the preparation method specifically comprises:

[0155] In the first step, a first electrode 301 of the light-emitting unit, a pixel defining layer 22 and an isolation structure 23 are sequentially formed on the substrate 21;

[0156] Step 2: Reference Fig.21a and Figure 21b , the light-emitting functional layer 302 and the second electrode 303 of the first light-emitting unit 31, the first encapsulation layer 41 and the first protective layer 51 are sequentially formed on the first electrode 301 and the pixel defining layer 22. Through this step, the light-emitting functional layer 302, the second electrode 303, the first encapsulation layer 41 and the first protective layer 51 not only occupy the space corresponding to the first pixel opening, but also occupy the space corresponding to the second pixel opening and the space corresponding to the third pixel opening.

[0157] Step 3: Reference Fig.21c , the light-emitting functional layer 302, the second electrode 303, the first encapsulation layer 41 and the first protective layer 51 except the light-emitting functional layer 302, the second electrode 303, the first encapsulation layer 41 and the first protective layer 51 corresponding to the first pixel opening are etched away. Through this step, after the light-emitting functional layer 302, the second electrode 303, the first encapsulation layer 41 and the first protective layer 51 in the space corresponding to the second pixel opening and the space corresponding to the third pixel opening are etched away, only the light-emitting functional layer 302, the second electrode 303, the first encapsulation layer 41 and the first protective layer 51 in the space corresponding to the first pixel opening are retained.

[0158] Step 4: Reference Fig.21d and 21e, the light-emitting functional layer 302 and the second electrode 303 of the second light-emitting unit 32, the second encapsulation layer 42 and the second protective layer 52 are sequentially formed on the first protective layer 51, the first electrode and the pixel defining layer 22. Through this step, the light-emitting functional layer 302, the second electrode 303 and the second encapsulation layer 42 not only occupy the space corresponding to the second pixel opening, but also occupy the space corresponding to the first pixel opening and the space corresponding to the third pixel opening.

[0159] Step 5, Reference Fig.21f , the light-emitting functional layer 302, the second electrode 303, the second encapsulation layer 42, and the second protective layer 52 except the light-emitting functional layer 302, the second electrode 303, and the second encapsulation layer 42 corresponding to the second pixel opening are etched away. Through this step, only the light-emitting functional layer 302, the second electrode 303, and the second encapsulation layer 42 in the space corresponding to the second pixel opening are retained, and the redundant first protective layer 51, the light-emitting functional layer 302, the second electrode 303, and the second encapsulation layer 42 are etched away.

[0160] It can be seen that in the process of etching and removing the light-emitting functional layer 302, the second electrode 303 and the second encapsulation layer 42 except the light-emitting functional layer 302, the second electrode 303 and the second encapsulation layer 42 corresponding to the second pixel opening, the first protective layer 51 can protect the first encapsulation layer 41 and the first light-emitting unit 31 to prevent the first encapsulation layer 41 and the first light-emitting unit 31 from being etched.

[0161] refer to Figure 21h and Figure 21g , the preparation method provided in the present application also includes: forming the light-emitting functional layer 302, the second electrode 303, and the third encapsulation layer 43 of the third light-emitting unit 33 in sequence on the side of the first protective layer 51, the second encapsulation layer 42, the first electrode, and the pixel defining layer 22 away from the substrate 21; etching and removing the light-emitting functional layer 302, the second electrode 303, and the third encapsulation layer 43 except the light-emitting functional layer 302, the second electrode 303, and the third encapsulation layer 43 corresponding to the third pixel opening. Through this step, only the light-emitting functional layer 302, the second electrode 303, and the third encapsulation layer 43 corresponding to the third pixel opening are retained, and the third light-emitting unit 33 and the third encapsulation layer 43 used to isolate water and oxygen and protect the third light-emitting unit 33 are obtained.

[0162] refer to Fig. 22 , and references Fig.18c and 20b The present application also provides another method for preparing a display panel, the method comprising:

[0163] Step S91, providing a substrate 21;

[0164] Step S92, preparing a plurality of light-emitting units on one side of the substrate 21;

[0165] Step S93, preparing an encapsulation layer and a protective layer on the side of the light-emitting unit away from the substrate 21, the encapsulation layer and the protective layer are stacked, and the orthographic projection of the protective layer on the substrate 21 covers at least part of the orthographic projection of the light-emitting unit on the substrate 21; wherein, Fig.18c A schematic diagram of the structure in which the protective layer is located between the light-emitting unit and the encapsulation layer is shown. Fig.20b A schematic diagram of the structure in which the encapsulation layer is located between the light-emitting unit and the protective layer is shown.

[0166] Among them, two adjacent light-emitting units are spaced apart from the two protective layers on the side away from the substrate 21 .

[0167] Based on the above preparation method, the protective layer covers the side of the light-emitting unit away from the substrate 21. The protective layer can resist etching, thereby protecting the light-emitting unit and reducing the risk of the light-emitting unit being etched in subsequent preparation steps, thereby improving the dark spot situation.

[0168] In a possible embodiment, an encapsulation layer may be first prepared on a side of the light emitting unit away from the substrate 21, and then a protective layer may be prepared on a side of the encapsulation layer away from the substrate 21. Figures 21a to 21g The light-emitting unit 30 includes a first light-emitting unit 31, a second light-emitting unit 32 and a third light-emitting unit 33, and the light-emitting colors of the first light-emitting unit 31, the second light-emitting unit 32 and the third light-emitting unit 33 are different. An isolation structure 23 and a pixel defining layer 22 are also arranged on the substrate 21 on which the light-emitting unit 30 is prepared. The isolation structure 23 is arranged on the side of the substrate 21 facing the light-emitting unit, and the pixel defining layer 22 is arranged between the substrate 21 and the isolation structure 23. The isolation structure 23 surrounds and forms an isolation opening. The pixel defining layer 22 has a pixel opening, and the positive projection of the pixel opening on the substrate 21 falls within the positive projection range of the isolation opening on the substrate 21; the pixel opening includes a first pixel opening, a second pixel opening and a third pixel opening, and the isolation opening includes adjacent first isolation openings, second isolation openings and third isolation openings. The first light-emitting unit 31 is arranged in the first isolation opening and the first pixel opening, the second light-emitting unit 32 is arranged in the second isolation opening and the second pixel opening, and the second light-emitting unit 33 is arranged in the third isolation opening and the third pixel opening. The light-emitting unit 30 includes a first electrode 301, a light-emitting functional layer 302 and a second electrode 303. Based on this, the preparation method specifically includes:

[0169] In the first step, a first electrode 301 of the light-emitting unit, a pixel defining layer 22 and an isolation structure 23 are sequentially formed on the substrate 21;

[0170] Step 2: Reference Fig.21a and Figure 21b, the light-emitting functional layer 302 and the second electrode 303 of the first light-emitting unit 31, the first encapsulation layer 41 and the first protective layer 51 are sequentially formed on the first electrode 301 and the pixel defining layer 22. Through this step, the light-emitting functional layer 302, the second electrode 303, the first encapsulation layer 41 and the first protective layer 51 not only occupy the space corresponding to the first pixel opening, but also occupy the space corresponding to the second pixel opening and the space corresponding to the third pixel opening.

[0171] Step 3: Reference Fig.21c , the light-emitting functional layer 302, the second electrode 303, the first encapsulation layer 41 and the first protective layer 51 except the light-emitting functional layer 302, the second electrode 303, the first encapsulation layer 41 and the first protective layer 51 corresponding to the first pixel opening are etched away. Through this step, after the light-emitting functional layer 302, the second electrode 303, the first encapsulation layer 41 and the first protective layer 51 in the space corresponding to the second pixel opening and the space corresponding to the third pixel opening are etched away, only the light-emitting functional layer 302, the second electrode 303, the first encapsulation layer 41 and the first protective layer 51 in the space corresponding to the first pixel opening are retained.

[0172] Step 4: Reference Fig.21d and 21e , the light-emitting functional layer 302 and the second electrode 303 of the second light-emitting unit 32, the second encapsulation layer 42 and the second protective layer 52 are sequentially formed on the first protective layer 51, the first electrode and the pixel defining layer 22. Through this step, the light-emitting functional layer 302, the second electrode 303 and the second encapsulation layer 42 not only occupy the space corresponding to the second pixel opening, but also occupy the space corresponding to the first pixel opening and the space corresponding to the third pixel opening.

[0173] Step 5, Reference Fig.21f , the light-emitting functional layer 302, the second electrode 303, the second encapsulation layer 42, and the second protective layer 52 except the light-emitting functional layer 302, the second electrode 303, and the second encapsulation layer 42 corresponding to the second pixel opening are etched away. Through this step, only the light-emitting functional layer 302, the second electrode 303, and the second encapsulation layer 42 in the space corresponding to the second pixel opening are retained, and the redundant first protective layer 51, the light-emitting functional layer 302, the second electrode 303, and the second encapsulation layer 42 are etched away.

[0174] It can be seen that in the process of etching and removing the light-emitting functional layer 302, the second electrode 303 and the second encapsulation layer 42 except the light-emitting functional layer 302, the second electrode 303 and the second encapsulation layer 42 corresponding to the second pixel opening, the first protective layer 51 can protect the first encapsulation layer 41 and the first light-emitting unit 31 to prevent the first encapsulation layer 41 and the first light-emitting unit 31 from being etched.

[0175] refer to Figure 21h and Figure 21g , the preparation method provided in the present application also includes: forming the light-emitting functional layer 302, the second electrode 303, and the third encapsulation layer 43 of the third light-emitting unit 33 in sequence on the side of the first protective layer 51, the second encapsulation layer 42, the first electrode, and the pixel defining layer 22 away from the substrate 21; etching and removing the light-emitting functional layer 302, the second electrode 303, and the third encapsulation layer 43 except the light-emitting functional layer 302, the second electrode 303, and the third encapsulation layer 43 corresponding to the third pixel opening. Through this step, only the light-emitting functional layer 302, the second electrode 303, and the third encapsulation layer 43 corresponding to the third pixel opening are retained, and the third light-emitting unit 33 and the third encapsulation layer 43 used to isolate water and oxygen and protect the third light-emitting unit 33 are obtained.

[0176] In another possible embodiment, a protective layer may be first prepared on the side of the light emitting unit away from the substrate 21, and then an encapsulation layer may be prepared on the side of the protective layer away from the substrate 21. Figures 19a to 19e , the light-emitting unit includes a first light-emitting unit and a second light-emitting unit, and the light-emitting colors of the first light-emitting unit and the second light-emitting unit are different. An isolation structure 23 and a pixel defining layer 22 are also provided on the substrate 21 on which the light-emitting unit is prepared. The isolation structure 23 is arranged on the side of the substrate 21 facing the light-emitting unit, and the pixel defining layer 22 is arranged between the substrate 21 and the isolation structure 23. The isolation structure 23 surrounds the isolation opening, and the pixel defining layer 22 has a pixel opening. The positive projection of the pixel opening on the substrate 21 falls within the positive projection range of the isolation opening on the substrate 21; the pixel opening includes a first pixel opening and a second pixel opening, and the isolation opening includes adjacent first isolation openings and second isolation openings. The first light-emitting unit is arranged in the first isolation opening and the first pixel opening, and the second light-emitting unit is arranged in the second isolation opening and the second pixel opening. The light-emitting unit includes a first electrode, a light-emitting functional layer, and a second electrode. Based on this, the preparation method specifically includes:

[0177] In the first step, a first electrode of the light emitting unit, a pixel defining layer 22 and an isolation structure 23 are sequentially formed on a substrate 21 .

[0178] Step 2: Reference Fig.19a , the light-emitting functional layer 302 and the second electrode 303 of the first light-emitting unit 31, as well as the first protective layer 51 and the first encapsulation layer 41 are sequentially formed on the first electrode and the pixel defining layer 22. Through this step, the light-emitting functional layer 302, the second electrode 303, the first protective layer 51, and the first encapsulation layer 41 not only occupy the space corresponding to the first pixel opening, but also occupy the space corresponding to the second pixel opening and the space corresponding to the third pixel opening.

[0179] Step 3: Reference Fig.19b, the light-emitting functional layer 302, the second electrode 303, the first encapsulation layer 41 and the first protective layer 51 except the light-emitting functional layer 302, the second electrode 303, the first encapsulation layer 41 and the first protective layer 51 corresponding to the first pixel opening are etched away. Through this step, after the light-emitting functional layer 302, the second electrode 303, the first protective layer 51 and the first encapsulation layer 41 in the space corresponding to the second pixel opening and the space corresponding to the third pixel opening are etched away, only the light-emitting functional layer 302, the second electrode 303, the first protective layer 51 and the first encapsulation layer 41 in the space corresponding to the first pixel opening are retained.

[0180] Step 4: Reference Fig.19c , the light-emitting functional layer 302 and the second electrode 303 of the second light-emitting unit 32, as well as the second protective layer 52 and the second encapsulation layer 42 are sequentially formed on the first encapsulation layer 41, the first electrode and the pixel defining layer 22. Through this step, the light-emitting functional layer 302, the second electrode 303, the second protective layer 52 and the second encapsulation layer 42 not only occupy the space corresponding to the second pixel opening, but also occupy the space corresponding to the first pixel opening and the space corresponding to the third pixel opening.

[0181] Step 5, Reference Fig.19d , the light-emitting functional layer 302, the second electrode 303, the second protective layer 52, and the second encapsulation layer 42 except the light-emitting functional layer 302, the second electrode 303, and the second encapsulation layer 42 corresponding to the second pixel opening are etched away. Through this step, only the light-emitting functional layer 302, the second electrode 303, and the second encapsulation layer 42 in the space corresponding to the second pixel opening are retained, and the redundant first protective layer 51, the light-emitting functional layer 302, the second electrode 303, and the second encapsulation layer 42 are etched away.

[0182] It can be seen that in the process of etching and removing the light-emitting functional layer 302, the second electrode 303 and the second encapsulation layer 42 except the light-emitting functional layer 302, the second electrode 303 and the second encapsulation layer 42 corresponding to the second pixel opening, the first protective layer 51 can protect the first light-emitting unit 31 and prevent the first light-emitting unit 31 from being etched.

[0183] refer to Fig.19e, the preparation method provided in the present application may also include: forming the light-emitting functional layer 302, the second electrode 303, and the third encapsulation layer 43 of the third light-emitting unit 33 in sequence on the side of the first encapsulation layer 41, the second encapsulation layer 42, the first electrode, and the pixel defining layer 22 away from the substrate 21; and etching and removing the light-emitting functional layer 302, the second electrode 303, and the third encapsulation layer 43 except for the light-emitting functional layer 302, the second electrode 303, and the third encapsulation layer 43 corresponding to the third pixel opening. Through this step, only the light-emitting functional layer 302, the second electrode 303, and the third encapsulation layer 43 corresponding to the third pixel opening are retained, and the third light-emitting unit 33 is obtained, and the third encapsulation layer 43 used to isolate water and oxygen and protect the third light-emitting unit 33 is obtained.

[0184] The light-emitting functional layer 302 and the second electrode 303 can be obtained by whole-surface evaporation, the first encapsulation layer 41 can be obtained by chemical vapor deposition, and the first protective layer 51 can be obtained by chemical vapor deposition. In the process of removing the redundant first protective layer 51, the first encapsulation layer 41, the second electrode 303 and the light-emitting functional layer 302, the method of removing each layer can be selected according to the different materials of each layer, and the etching method can be dry etching or wet etching.

[0185] Similarly, the light-emitting functional layer 302 and the second electrode 303 can be obtained by whole-surface evaporation, and the light-emitting functional layer 302 and the second electrode 303 can be obtained by whole-surface evaporation; the second encapsulation layer 42 and the third encapsulation layer 43 can be obtained by chemical vapor deposition, and the second protective layer 52 can be obtained by chemical vapor deposition. In the process of removing the excess second protective layer 52, the second encapsulation layer 42, the second electrode 303 and the light-emitting functional layer 302, the method of removing each layer can be selected according to the different materials of each layer, and the etching method can be dry etching or wet etching. In the process of removing the excess third encapsulation layer 43, the second electrode 303 and the light-emitting functional layer 302, the method of removing each layer can be selected according to the different materials of each layer, and the etching method can be dry etching or wet etching.

[0186] The present application also provides a display device, the display device comprising the above-mentioned display panel. Based on the beneficial effects of the above-mentioned display panel, the display device provided by the present application has the advantages of good performance and low probability of dark spots.

[0187] It should be noted that, unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present application. The terms used herein in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0188] It should be understood that although the specific embodiments of the present application are described in detail in conjunction with the accompanying drawings, it should not be understood as limiting the scope of protection of the present application. Within the scope described in the claims, various modifications and variations that can be made by those skilled in the art without creative work still fall within the scope of protection of the present application. Although this specification is described according to various embodiments, not every embodiment contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0189] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel, characterized in that: include: substrate(21); At least one light-emitting unit (30) is arranged on one side of the substrate (21); A protective layer (50) is arranged on a side of the light-emitting unit (30) away from the substrate (21), wherein an orthographic projection of the protective layer (50) on the substrate (21) covers at least a partial area of ​​an orthographic projection of at least one of the light-emitting units on the substrate (21); The material of the protective layer (50) includes metal material.

2. The display panel according to claim 1, characterized in that: A packaging layer (40) is also provided on one side of the substrate (21), and the packaging layer (40) is located between the light-emitting unit and the protective layer (50); Preferably, the material of the encapsulation layer (40) includes inorganic material.

3. The display panel according to claim 2, characterized in that: Along a direction away from the substrate (21), the light-emitting unit comprises in sequence a first electrode, a light-emitting functional layer and a second electrode which are stacked, and the encapsulation layer (40) is located between the second electrode and the protective layer (50).

4. The display panel according to claim 1, characterized in that: A packaging layer (40) is also provided on one side of the substrate (21), and the protective layer (50) is located between the light-emitting unit and the packaging layer (40); Preferably, the material of the encapsulation layer (40) includes inorganic material.

5. The display panel according to claim 4, characterized in that: Along a direction away from the substrate (21), the light-emitting unit comprises a first electrode, a light-emitting functional layer, and a second electrode which are stacked in sequence, and the protective layer (50) is located between the second electrode and the encapsulation layer (40); Preferably, the display panel further comprises a light extraction layer (70), and the light extraction layer (70) is located between the second electrode and the protective layer.

6. The display panel according to claim 1, characterized in that: The light-emitting unit comprises a first light-emitting unit (31) and a second light-emitting unit (32); the protective layer arranged on a side of the first light-emitting unit (31) away from the substrate (21) is a first protective layer (51); the protective layer (50) arranged on a side of the second light-emitting unit (32) away from the substrate (21) is a second protective layer (52); and the first protective layer (51) and the second protective layer (52) are arranged at intervals; Preferably, the metal material of the first protective layer (51) is different from the metal material of the second protective layer (52); Preferably, the protective layer (50) is a transparent metal layer or a semi-transparent metal layer; Preferably, the light emitting color of the first light emitting unit (31) is different from the light emitting color of the second light emitting unit (32); Preferably, the first light-emitting unit (31) is adjacent to the second light-emitting unit (32).

7. The display panel according to claim 6, characterized in that: The display panel further comprises an isolation structure (23) and a pixel defining layer (22), wherein the isolation structure (23) is arranged on a side of the substrate (21) facing the light-emitting unit, and the pixel defining layer (22) is arranged between the substrate (21) and the isolation structure (23), wherein the isolation structure (23) surrounds and forms an isolation opening, and the pixel defining layer (22) has a pixel opening, and an orthographic projection of the pixel opening on the substrate (21) falls within the orthographic projection range of the isolation opening on the substrate (21); The pixel opening comprises a first pixel opening and a second pixel opening, the isolation opening comprises adjacent first isolation opening and second isolation opening, the first light emitting unit (31) is arranged in the first isolation opening and the first pixel opening, and the second light emitting unit (32) is arranged in the second isolation opening and the second pixel opening.

8. The display panel according to claim 7, characterized in that: The display panel further comprises an encapsulation layer (40); the protective layer (50) is located between the light-emitting unit and the encapsulation layer (40), or the encapsulation layer (40) is located between the light-emitting unit and the protective layer (50); the encapsulation layer (40) arranged on a side of the first light-emitting unit (31) away from the substrate (21) is a first encapsulation layer (41), and the encapsulation layer (40) arranged on a side of the second light-emitting unit (32) away from the substrate (21) is a second encapsulation layer (42); The first encapsulation layer (41) is arranged in the first isolation opening and overlaps with the isolation structure (23), and the second encapsulation layer (42) is arranged in the second isolation opening and overlaps with the isolation structure (23); Preferably, the first encapsulation layer (41) and the second encapsulation layer (42) are arranged at intervals.

9. The display panel according to claim 8, characterized in that: The light-emitting unit further comprises a third light-emitting unit (33) and a third encapsulation layer (43) arranged on a side of the third light-emitting unit (33) away from the substrate (21); the isolation opening comprises a third isolation opening; the pixel opening comprises a third pixel opening; the third light-emitting unit (33) is arranged in the third isolation opening and the third pixel opening; and the third encapsulation layer (43) is arranged in the third isolation opening and overlaps the isolation structure (23); Preferably, the light emitting color of the third light emitting unit (33) is different from the light emitting colors of the first light emitting unit (31) and the second light emitting unit (32).

10. A display panel, characterized in that: include: substrate(21); A plurality of light-emitting units (30) are arranged on one side of the substrate (21); The encapsulation layer (40) and the protective layer (50) are stacked and arranged on a side of the light-emitting unit (30) away from the substrate (21), wherein the orthographic projection of the protective layer (50) on the substrate (21) covers at least a partial area of ​​the orthographic projection of the light-emitting unit on the substrate (21); Wherein, the two light-emitting units are spaced apart from the two protective layers (50) on one side of the substrate (21).

11. The display panel according to claim 10, characterized in that: The two protective layers (50) on the side of two adjacent light-emitting units away from the substrate (21) are arranged at intervals.

12. The display panel according to claim 10, characterized in that: The encapsulation layer (40) is located between the light-emitting unit and the protective layer (50); or, the protective layer (50) is located between the light-emitting unit and the encapsulation layer (40).

13. The display panel according to claim 10, characterized in that: The two packaging layers (40) of two adjacent light-emitting units away from the side of the substrate (21) are arranged at intervals; Preferably, the material of the encapsulation layer (40) includes an inorganic material; Preferably, the material of the protective layer (50) includes a metal material; Preferably, the protective layer (50) is a transparent metal layer or a semi-transparent metal layer.

14. The display panel according to claim 11, characterized in that: The display panel further comprises an isolation structure (23) and a pixel defining layer (22), wherein the isolation structure (23) is arranged on a side of the substrate (21) facing the light-emitting unit, and the pixel defining layer (22) is arranged between the substrate (21) and the isolation structure (23), wherein the isolation structure (23) surrounds and forms an isolation opening, and the pixel defining layer (22) has a pixel opening, and an orthographic projection of the pixel opening on the substrate (21) falls within the orthographic projection range of the isolation opening on the substrate (21); The pixel opening comprises a first pixel opening and a second pixel opening, the isolation opening comprises a first isolation opening and a second isolation opening adjacent to each other, the light emitting unit comprises a first light emitting unit (31) disposed in the first isolation opening and the first pixel opening, and a second light emitting unit (32) disposed in the second isolation opening and the second pixel opening; The protective layer (50) arranged on a side of the first light-emitting unit (31) away from the substrate (21) is a first protective layer (51), the protective layer (50) arranged on a side of the second light-emitting unit (32) away from the substrate (21) is a second protective layer (52), the encapsulation layer (40) arranged on a side of the first light-emitting unit (31) away from the substrate (21) is a first encapsulation layer (41), and the encapsulation layer (40) arranged on a side of the second light-emitting unit (32) away from the substrate (21) is a second encapsulation layer (42); Preferably, the light emitting color of the first light emitting unit (31) is different from the light emitting color of the second light emitting unit (32); Preferably, the first encapsulation layer (41) (40) is arranged in the first isolation opening and overlaps with the isolation structure (23), and the second encapsulation layer (42) (40) is arranged in the second isolation opening and overlaps with the isolation structure (23); Preferably, the display panel further comprises a light extraction layer (70), wherein the light extraction layer is located between the light emitting unit and the protective layer.

15. The display panel according to claim 14, characterized in that: The light-emitting unit further comprises a third light-emitting unit (33) and a third encapsulation layer (43) arranged on a side of the third light-emitting unit (33) away from the substrate (21); the isolation opening comprises a third isolation opening; the pixel opening comprises a third pixel opening; the third light-emitting unit (33) is arranged in the third isolation opening and the third pixel opening; and the third encapsulation layer (43) is arranged in the third isolation opening and overlaps the isolation structure (23); Preferably, the light emitting color of the third light emitting unit (33) is different from the light emitting colors of the first light emitting unit (31) and the second light emitting unit (32).

16. A method for preparing a display panel, characterized in that: The preparation method comprises: Providing a substrate (21); At least one light-emitting unit (30) is prepared on one side of the substrate (21); Preparing a protective layer (50) on a side of at least one of the light-emitting units away from the substrate (21); The orthographic projection of the protective layer (50) on the substrate (21) covers at least a partial area of ​​the orthographic projection of at least one of the light-emitting units on the substrate (21), and the material of the protective layer (50) includes a metal material.

17. The method for manufacturing a display panel according to claim 16, characterized in that: The preparation method further comprises: A packaging layer (40) is prepared on a side of the protective layer (50) away from the substrate (21); or, The step of preparing a protective layer (50) on a side of at least one of the light-emitting units away from the substrate (21) comprises: A packaging layer (40) is prepared on a side of the light-emitting unit away from the substrate (21), A protective layer (50) is prepared on a side of the encapsulation layer (40) away from the substrate (21).

18. A method for preparing a display panel, characterized in that: The preparation method comprises: Providing a substrate (21); A plurality of light-emitting units (30) are prepared on one side of the substrate (21); An encapsulation layer (40) and a protective layer (50) are prepared on a side of the light-emitting unit away from the substrate (21); the encapsulation layer (40) and the protective layer (50) are stacked, and the orthographic projection of the protective layer (50) on the substrate (21) covers at least a partial area of ​​the orthographic projection of the light-emitting unit on the substrate (21); Wherein, the two protective layers (50) on the side of two adjacent light-emitting units away from the substrate (21) are arranged at intervals.

19. The method for preparing a display panel according to claim 18, characterized in that: The step of preparing an encapsulation layer (40) and a protective layer (50) on a side of the light-emitting unit away from the substrate (21) comprises: A packaging layer (40) is prepared on a side of the light-emitting unit away from the substrate (21), Preparing a protective layer (50) on a side of the encapsulation layer (40) away from the substrate (21); Alternatively, the step of preparing the encapsulation layer (40) and the protective layer (50) on a side of the light-emitting unit away from the substrate (21) comprises: A protective layer (50) is prepared on a side of the light-emitting unit away from the substrate (21), A packaging layer (40) is prepared on a side of the protective layer (50) away from the substrate (21).

20. A display device, characterized in that: The display device comprises the display panel according to any one of claims 1 to 15.

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