Hole processing method and hole processing device of printed circuit board

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By using pad plates and press plates to fix them during the hole processing of printed circuit boards, and blowing air to remove powder chips during the processing process, the problem of bending the edges in the hole processing of printed circuit boards is solved, and the quality and electrical performance of the product are improved.

CN119319595BActive Publication Date: 2025-03-28SICHUAN HUASON ELECTRONICS TECH

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Patent Information

Application Number: CN202411864367.8
Authority / Receiving Office: CN · China
Patent Type: Patents(China)
Current Assignee / Owner
Filing Date: 2024-12-18
Publication Date: 2025-03-28
Estimated Expiration: 2044-12-18

Application Information

Patent Timeline

18 Dec 2024

Application

CN202411864367.8

28 Mar 2025

Publication

CN119319595B

IPC: B26F1/16; B26D7/02; B26D7/18

CPC: B26F1/16; B26D7/025; B26D7/1854

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Application Domain

Metal working apparatus

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AI Technical Summary

Technical Problem

During the hole processing of printed circuit boards, a squid is likely to occur, which affects the conductivity of subsequent copper plating.

Method used

By laying the pads below the printed circuit board, laying the pressing plates above and fixing them, and then using a tool to perform hole processing. At the same time, blow air into the blind hole or through hole during the hole processing to remove powder to reduce the edges.

Benefits of technology

It effectively reduces the occurrence of edges during the hole processing of printed circuit boards, improves the smoothness and conduction performance of the hole wall, and improves product quality and electrical performance.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention provides a hole processing method and a hole processing device for a printed circuit board, and relates to the technical field of printed circuit boards. The purpose is to solve the technical problem that a lot of flash is generated when the prior art performs hole processing on a printed circuit board. The adopted technical scheme is: the hole processing method for a printed circuit board comprises the following steps: fixing a pad on the table top of a workbench; laying the printed circuit board to be processed on the upper surface of the pad; laying a pressing plate on the upper surface of the printed circuit board; preliminarily fixing the pressing plate and the printed circuit board on the upper surface of the pad by paper tape; allowing the tool to penetrate the pressing plate to perform hole processing on the printed circuit board. The hole processing method first lays a pad under the printed circuit board and a pressing plate above the printed circuit board; and then performs hole processing on the printed circuit board, which can reduce the flash generated by the printed circuit board during the hole processing process. In addition, the present invention also provides a hole processing device for a printed circuit board used in conjunction with the aforementioned hole processing method.

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